® TOP221-227 ® TOPSwitch-II Family Three-terminal Off-line PWM Switch Product Highlights • • • • • • • • • • Lowest cost, lowest component count switcher solution Cost competitive with linears above 5W Very low AC/DC losses – up to 90% efficiency Built-in Auto-restart and Current limiting Latching Thermal shutdown for system level protection Implements Flyback, Forward, Boost or Buck topology Works with primary or opto feedback Stable in discontinuous or continuous conduction mode Source connected tab for low EMI Circuit simplicity and Design Tools reduce time to market AC IN D CONTROL TOPSwitch C S PI-1951-091996 Description Figure 1. Typical Flyback Application. The second generation TOPSwitch-II family is more cost effective and provides several enhancements over the first generation TOPSwitch family. The TOPSwitch-II family extends the power range from 100W to 150W for 100/115/230 VAC input and from 50W to 90W for 85-265 VAC universal input. This brings TOPSwitch technology advantages to many new applications, i.e. TV, Monitor, Audio amplifiers, etc. Many significant circuit enhancements that reduce the sensitivity to board layout and line transients now make the design even easier. The standard 8L PDIP package option reduces cost in lower power, high efficiency applications. The internal lead frame of this package uses six of its pins to transfer heat from the chip directly to the board, eliminating the cost of a heat sink. TOPSwitch incorporates all functions necessary for a switched mode control system into a three terminal monolithic IC: power MOSFET, PWM controller, high voltage start up circuit, loop compensation and fault protection circuitry. OUTPUT POWER TABLE TO-220 (Y) Package1 Input 3 Single Voltage PART 100/115/230 VAC ±15% ORDER 4,6 P NUMBER MAX PMAX4,6 8L PDIP (P) or 8L SMD (G) Package2 Single Voltage. Input 3 Wide Range Input PART 100/115/230 VAC ±15% 85 to 265 VAC ORDER 5,6 PMAX5,6 P NUMBER MAX Wide Range Input 85 to 265 VAC TOP221Y 12 W 7W TOP221P or TOP221G 9W 6W TOP222Y 25 W 15 W TOP222P or TOP222G 15 W 10 W TOP223Y 50 W 30 W TOP223P or TOP223G 25 W 15 W TOP224Y 75 W 45 W TOP224P or TOP224G 30 W 20 W TOP225Y 100 W 60 W TOP226Y 125 W 75 W TOP227Y 150 W 90 W Notes: 1. Package outline: Y03A 2. Package Outline: P08A or G08A 3. 100/115 VAC with doubler input 4. Assumes appropriate heat sinking to keep the maximum TOPSwitch junction temperature below 100˚ C. 5. Soldered to 1 sq. in.( 6.45 cm2), 2 oz. copper clad (610 gm/m2) 6. PMAX is the maximum practical continuous power output level for conditions shown. The continuous power capability in a given application depends on thermal environment, transformer design, efficiency required, minimum specified input voltage, input storage capacitance, etc. 7. Refer to key application considerations section when using TOPSwitch-II in an existing TOPSwitch design. December 1997 TOP221-227 VC 0 CONTROL DRAIN ZC SHUTDOWN/ AUTO-RESTART SHUNT REGULATOR/ ERROR AMPLIFIER + + 1 5.7 V 4.7 V INTERNAL SUPPLY ÷8 - 5.7 V + IFB THERMAL SHUTDOWN POWER-UP RESET S Q R Q VI LIMIT CONTROLLED TURN-ON GATE DRIVER OSCILLATOR DMAX CLOCK SAW - S Q + R Q LEADING EDGE BLANKING PWM COMPARATOR MINIMUM ON-TIME DELAY RE SOURCE PI-1935-091696 Figure 2. Functional Block Diagram. Pin Functional Description DRAIN Pin: Output MOSFET drain connection. Provides internal bias current during start-up operation via an internal switched highvoltage current source. Internal current sense point. Tab Internally Connected to Source Pin DRAIN SOURCE CONTROL Pin: Error amplifier and feedback current input pin for duty cycle control. Internal shunt regulator connection to provide internal bias current during normal operation. It is also used as the connection point for the supply bypass and auto-restart/ compensation capacitor. SOURCE Pin: Y package – Output MOSFET source connection for high voltage power return. Primary side circuit common and reference point. P and G package – Primary side control circuit common and reference point. SOURCE (HV RTN) Pin: (P and G package only) Output MOSFET source connection for high voltage power return. 2 C 12/97 CONTROL TO-220 (YO3A) SOURCE 1 8 SOURCE (HV RTN) SOURCE 2 7 SOURCE (HV RTN) SOURCE 3 6 SOURCE (HV RTN) CONTROL 4 5 DRAIN DIP-8 (P08A) SMD-8 (G08A) Figure 3. Pin Configuration. PI-2084-052198 TOP221-227 TOPSwitch Family Functional Description TOPSwitch is a self biased and protected linear control currentto-duty cycle converter with an open drain output. High efficiency is achieved through the use of CMOS and integration of the maximum number of functions possible. CMOS process significantly reduces bias currents as compared to bipolar or discrete solutions. Integration eliminates external power resistors used for current sensing and/or supplying initial startup bias current. Auto-restart Duty Cycle (%) Slope = PWM Gain During normal operation, the duty cycle of the internal output MOSFET decreases linearly with increasing CONTROL pin current as shown in Figure 4. To implement all the required control, bias, and protection functions, the DRAIN and CONTROL pins each perform several functions as described below. Refer to Figure 2 for a block diagram and to Figure 6 for timing and voltage waveforms of the TOPSwitch integrated circuit. VC 5.7 V 4.7 V IB DMAX DMIN ICD1 2.0 6.0 IC (mA) PI-2040-050197 Figure 4. Relationship of Duty Cycle to CONTROL Pin Current. IC Charging CT 0 DRAIN VIN Off 0 Switching (a) IC Charging CT VC ICD2 Discharging CT ICD1 Discharging CT 5.7 V 4.7 V 8 Cycles 0 95% DRAIN VIN Off 5% Off Off 0 Switching Switching (b) CT is the total external capacitance connected to the CONTROL pin PI-1956-092496 Figure 5. Start-up Waveforms for (a) Normal Operation and (b) Auto-restart. C 12/97 3 TOP221-227 TOPSwitch Family Functional Description (cont.) Control Voltage Supply CONTROL pin voltage VC is the supply or bias voltage for the controller and driver circuitry. An external bypass capacitor closely connected between the CONTROL and SOURCE pins is required to supply the gate drive current. The total amount of capacitance connected to this pin (CT) also sets the autorestart timing as well as control loop compensation. VC is regulated in either of two modes of operation. Hysteretic regulation is used for initial start-up and overload operation. Shunt regulation is used to separate the duty cycle error signal from the control circuit supply current. During start-up, CONTROL pin current is supplied from a high-voltage switched current source connected internally between the DRAIN and CONTROL pins. The current source provides sufficient current to supply the control circuitry as well as charge the total external capacitance (CT). The first time VC reaches the upper threshold, the high-voltage current source is turned off and the PWM modulator and output transistor are activated, as shown in Figure 5(a). During normal operation (when the output voltage is regulated) feedback control current supplies the VC supply current. The shunt regulator keeps VC at typically 5.7 V by shunting CONTROL pin feedback current exceeding the required DC supply current through the PWM error signal sense resistor RE. The low dynamic impedance of this pin (ZC) sets the gain of the error amplifier when used in a primary feedback configuration. The dynamic impedance of the CONTROL pin together with the external resistance and capacitance determines the control loop compensation of the power system. If the CONTROL pin external capacitance (CT) should discharge to the lower threshold, then the output MOSFET is turned off and the control circuit is placed in a low-current standby mode. The high-voltage current source turns on and charges the external capacitance again. Charging current is shown with a negative polarity and discharging current is shown with a positive polarity in Figure 6. The hysteretic auto-restart comparator keeps VC within a window of typically 4.7 to 5.7 V by turning the high-voltage current source on and off as shown in Figure 5(b). The auto-restart circuit has a divide-by-8 counter which prevents the output MOSFET from turning on again until eight discharge-charge cycles have elapsed. The counter effectively limits TOPSwitch power dissipation by reducing the auto-restart duty cycle to typically 5%. Autorestart continues to cycle until output voltage regulation is again achieved. Bandgap Reference All critical TOPSwitch internal voltages are derived from a temperature-compensated bandgap reference. This reference is also used to generate a temperature-compensated current source which is trimmed to accurately set the oscillator frequency 4 C 12/97 and MOSFET gate drive current. Oscillator The internal oscillator linearly charges and discharges the internal capacitance between two voltage levels to create a sawtooth waveform for the pulse width modulator. The oscillator sets the pulse width modulator/current limit latch at the beginning of each cycle. The nominal frequency of 100 kHz was chosen to minimize EMI and maximize efficiency in power supply applications. Trimming of the current reference improves oscillator frequency accuracy. Pulse Width Modulator The pulse width modulator implements a voltage-mode control loop by driving the output MOSFET with a duty cycle inversely proportional to the current into the CONTROL pin which generates a voltage error signal across RE. The error signal across RE is filtered by an RC network with a typical corner frequency of 7 kHz to reduce the effect of switching noise. The filtered error signal is compared with the internal oscillator sawtooth waveform to generate the duty cycle waveform. As the control current increases, the duty cycle decreases. A clock signal from the oscillator sets a latch which turns on the output MOSFET. The pulse width modulator resets the latch, turning off the output MOSFET. The maximum duty cycle is set by the symmetry of the internal oscillator. The modulator has a minimum ON-time to keep the current consumption of the TOPSwitch independent of the error signal. Note that a minimum current must be driven into the CONTROL pin before the duty cycle begins to change. Gate Driver The gate driver is designed to turn the output MOSFET on at a controlled rate to minimize common-mode EMI. The gate drive current is trimmed for improved accuracy. Error Amplifier The shunt regulator can also perform the function of an error amplifier in primary feedback applications. The shunt regulator voltage is accurately derived from the temperature compensated bandgap reference. The gain of the error amplifier is set by the CONTROL pin dynamic impedance. The CONTROL pin clamps external circuit signals to the VC voltage level. The CONTROL pin current in excess of the supply current is separated by the shunt regulator and flows through RE as a voltage error signal. Cycle-By-Cycle Current Limit The cycle by cycle peak drain current limit circuit uses the output MOSFET ON-resistance as a sense resistor. A current limit comparator compares the output MOSFET ON-state drainsource voltage, VDS(ON) with a threshold voltage. High drain current causes VDS(ON) to exceed the threshold voltage and turns TOP221-227 VIN VIN DRAIN 0 VOUT 0 IOUT 0 1 8 2 1 2 ••• VC 8 1 ••• VC(reset) 0 1 IC 2 8 1 2 ••• 0 1 8 1 ••• 2 1 3 1 PI-2030-042397 Figure 6. Typical Waveforms for (1) Normal Operation, (2) Auto-restart, and (3) Power Down Reset. the output MOSFET off until the start of the next clock cycle. The current limit comparator threshold voltage is temperature compensated to minimize variation of the effective peak current limit due to temperature related changes in output MOSFET RDS(ON). The leading edge blanking circuit inhibits the current limit comparator for a short time after the output MOSFET is turned on. The leading edge blanking time has been set so that current spikes caused by primary-side capacitances and secondary-side rectifier reverse recovery time will not cause premature termination of the switching pulse. The current limit can be lower for a short period after the leading edge blanking time as shown in Figure 12. This is due to dynamic characteristics of the MOSFET. To avoid triggering the current limit in normal operation, the drain current waveform should stay within the envelope shown. Shutdown/Auto-restart To minimize TOPSwitch power dissipation, the shutdown/ auto-restart circuit turns the power supply on and off at an autorestart duty cycle of typically 5% if an out of regulation condition persists. Loss of regulation interrupts the external current into the CONTROL pin. VC regulation changes from shunt mode to the hysteretic auto-restart mode described above. When the fault condition is removed, the power supply output becomes regulated, VC regulation returns to shunt mode, and normal operation of the power supply resumes. Overtemperature Protection Temperature protection is provided by a precision analog circuit that turns the output MOSFET off when the junction temperature exceeds the thermal shutdown temperature (typically 135 °C). Activating the power-up reset circuit by removing and restoring input power or momentarily pulling the CONTROL pin below the power-up reset threshold resets the latch and allows TOPSwitch to resume normal power supply operation. VC is regulated in hysteretic mode and a 4.7 V to 5.7 V (typical) sawtooth waveform is present on the CONTROL pin when the power supply is latched off. High-voltage Bias Current Source This current source biases TOPSwitch from the DRAIN pin and charges the CONTROL pin external capacitance (CT) during start-up or hysteretic operation. Hysteretic operation occurs during auto-restart and overtemperature latched shutdown. The current source is switched on and off with an effective duty cycle of approximately 35%. This duty cycle is determined by the ratio of CONTROL pin charge (IC) and discharge currents (ICD1 and ICD2). This current source is turned off during normal operation when the output MOSFET is switching. C 12/97 5 TOP221-227 L1 3.3µH D2 UF5401 +5V + R3 47K C2 330 µF 10V C1 2.2 nF 1KV VR1 RTN D1 UF4005 R2 100 Ω D3 IN4148 Wide-Range DC Input T1 D C3 100 µF 10V U1 TOP221P CONTROL TOPSwitch-II - + C4 100 µF 16V C S R1 10 Ω C5 47 µF 10V U2 PC817A 12V Non-Isolated PI-2115-111797 Figure 7. Schematic Diagram of a 4W TOPSwitch-II Stand-by Power Supply using an 8 lead PDIP. Application Examples Following are just two of the many possible TOPSwitch implementations. Refer to the Data Book and Design Guide for additional examples. vary from 100V to 380V DC which corresponds to the full universal AC input range. The TOP221 is packaged in a 8 pin power dip package. 4W Stand-by Supply using 8 Lead PDIP The output voltage (5V) is directly sensed by the zener diode (VR1) and the optocoupler (U2). The output voltage is determined by the sum of the zener voltage and the voltage drop across the LED of the optocoupler (the voltage drop across R1 is negligible). The output transistor of the optocoupler drives the CONTROL pin of the TOP221. C5 bypasses the CONTROL pin and provides control loop compensation and sets the auto-restart frequency. Figure 7 shows a 4W stand-by supply. This supply is used in appliances where certain stand-by functions (e.g. real time clock, remote control port) must be kept active even while the main power supply is turned off. The 5V secondary is used to supply the stand-by function and the 12V non-isolated output is used to supply power for the PWM controller of the main power supply and other primary side functions. For this application the input rectifiers and input filter are sized for the main supply and are not shown. The input DC rail may 6 C 12/97 The transformer’s leakage inductance voltage spikes are snubbed by R3 and C1 through diode D1. The bias winding is rectified and filtered by D3 and C4 providing a non-isolated 12V output which is also used to bias the collector of the optocoupler’s output transistor. The isolated 5V output winding is rectified by D2 and filtered by C2, L1 and C3. TOP221-227 D2 MUR420 L1 3.3 µH +12V C2 330 µF 35 V VR1 P6KE200 C3 220 µF 35 V RTN L2 22 mH D1 BYV26C BR1 400 V C1 47 µF 400 V C6 0.1 µF 250 VAC J1 TOPSwitch-II R2 220 Ω T1 C U2 PC817A R3 6.8 Ω S L R1 100 Ω C4 0.1 µF U1 D TOP224P CONTROL F1 3.15 A D3 1N4148 C7 1 nF 250 VAC Y1 C5 47 µF VR2 1N5241B 11 V N PI-2019-033197 Figure 8. Schematic Diagram of a 20W Universal Input TOPSwitch-II Power Supply using an 8 lead PDIP. 20W Universal Supply using 8 Lead PDIP Figure 8 shows a 12V, 20 W secondary regulated flyback power supply using the TOP224P in an eight lead PDIP package and operating from universal 85 to 265 VAC input voltage. This example demonstrates the advantage of the higher power 8 pin leadframe used with the TOPSwitch-II family. This low cost package transfers heat directly to the board through six source pins, eliminating the heatsink and the associated cost. Efficiency is typically 80% at low line input. Output voltage is directly sensed by optocoupler U2 and Zener diode VR2. The output voltage is determined by the Zener diode (VR2) voltage and the voltage drops across the optocoupler (U2) LED and resistor R1. Other output voltages are possible by adjusting the transformer turns ratio and value of Zener diode VR2. AC power is rectified and filtered by BR1 and C1 to create the high voltage DC bus applied to the primary winding of T1. The other side of the transformer primary is driven by the integrated TOPSwitch-II high-voltage MOSFET. D1 and VR1 clamp leading-edge voltage spikes caused by transformer leakage inductance. The power secondary winding is rectified and filtered by D2, C2, L1, and C3 to create the 12V output voltage. R2 and VR2 provide a slight pre-load on the 12V output to improve load regulation at light loads. The bias winding is rectified and filtered by D3 and C4 to create a TOPSwitch bias voltage. L2 and Y1-safety capacitor C7 attenuate common mode emission currents caused by high voltage switching waveforms on the DRAIN side of the primary winding and the primary to secondary capacitance. Leakage inductance of L2 with C1 and C6 attenuates differential-mode emission currents caused by the fundamental and harmonics of the trapezoidal or triangular primary current waveform. C5 filters internal MOSFET gate drive charge current spikes on the CONTROL pin, determines the auto-restart frequency, and together with R1 and R3, compensates the control loop. C 12/97 7 TOP221-227 Key Application Considerations General Guidelines • Keep the SOURCE pin length very short. Use a Kelvin connection to the SOURCE pin for the CONTROL pin bypass capacitor. Use single point grounding techniques at the SOURCE pin as shown in Figure 9. • Minimize peak voltage and ringing on the DRAIN voltage at turn-off. Use a Zener or TVS Zener diode to clamp the DRAIN voltage below the breakdown voltage rating of TOPSwitch under all conditions, including start-up and overload. The maximum recommended clamp Zener voltage for the TOP2XX series is 200V and the corresponding maximum reflected output voltage on the primary is 135V. Please see Step 4: AN-16 in the Data Book and Design Guide. • The transformer should be designed such that the rate of change of drain current due to transformer saturation is within the absolute maximum specification (∆ID in 100ns before turn off as shown in Figure 13). As a guideline, for most common transformer cores, this can be achieved by maintaining the Peak Flux Density (at maximum Ilimit current) below 4200 Gauss (420mT). The transformer spreadsheets Rev. 2.1 (or later) for continuous and Rev.1.0 (or later) for discontinuous conduction mode provide the necessary information. • Short interruptions of AC power may cause TOPSwitch to enter the 8-count auto-restart cycle before starting again. This is because the input energy storage capacitors are not completely discharged and the CONTROL pin capacitance has not discharged below the internal power-up reset voltage. • In some cases, minimum loading may be necessary to keep a lightly loaded or unloaded output voltage within the desired range due to the minimum ON-time. ReplacingTOPSwitch with TOPSwitch-II There is no external latching shutdown function in TOPSwitchII. Otherwise, the functionality of the TOPSwitch-II devices is same as that of the TOPSwitch family. However, before considering TOPSwitch-II as a 'drop in' replacement in an existing TOPSwitch design, the design should be verified as described below. The new TOPSwitch-II family offers more power capability than the original TOPSwitch family for the same MOSFET RDS(ON). Therefore, the original TOPSwitch design must be reviewed to make sure that the selected TOPSwitch-II replacement device and other primary components are not over stressed under abnormal conditions. The following verification steps are recommended: • Do not plug TOPSwitch into a “hot” IC socket during test. External CONTROL pin capacitance may be charged to excessive voltage and cause TOPSwitch damage. • While performing TOPSwitch device tests, do not exceed maximum CONTROL pin voltage of 9 V or maximum CONTROL pin current of 100 mA. • Under some conditions, externally provided bias or supply current driven into the CONTROL pin can hold the TOPSwitch in one of the 8 auto-restart cycles indefinitely and prevent starting. To avoid this problem when doing bench evaluations, it is recommended that the VC power supply be turned on before the DRAIN voltage is applied. TOPSwitch can also be reset by shorting the CONTROL pin to the SOURCE pin momentarily. • CONTROL pin currents during auto-restart operation are much lower at low input voltages (< 36 V) which increases the auto-restart cycle time (see the IC vs. DRAIN Voltage Characteristic curve). 8 C 12/97 • Check the transformer design to make sure that it meets the ∆ID specification as outlined in the General Guidelines section above. • Thermal: Higher power capability of the TOPSwitch-II would in many instances allow use of a smaller MOSFET device (higher RDS(ON)) for reduced cost. This may affect TOPSwitch power dissipation and power supply efficiency. Therefore thermal performance of the power supply must be verified with the selected TOPSwitch-II device. • Clamp Voltage: Reflected and Clamp voltages should be verified not to exceed recommended maximums for the TOP2XX Series: 135V Reflected/200V Clamp. Please see Step 4: AN-16 in the Data Book and Design Guide and readme.txt file attached to the transformer design spreadsheets. • Agency Approval: Migrating to TOPSwitch-II may require agency re-approval. TOP221-227 TO-220 PACKAGE Bias/Feedback Return C High Voltage Return S Kelvin-connected auto-restart/bypass capacitor C5 and/or compensation network D DRAIN C5 SOURCE Bias/Feedback Input CONTROL C5 PC Board Do not bend SOURCE pin. Keep it short. Kelvin-connected auto-restart/bypass capacitor C5 Bias/Feedback Input and/or compensation network Bias/Feedback Return Bend DRAIN pin forward if needed for creepage. High-voltage Return TOP VIEW DIP-8/SMD-8 PACKAGE Bias/Feedback Return SOURCE SOURCE High Voltage Return C5 CONTROL DRAIN Kelvin-connected Bias/Feedback auto-restart/bypass capacitor C5 Input and/or compensation network TOP VIEW PI-2021-041798 Figure 9. Recommended TOPSwitch Layout. Design Tools The following tools available from Power Integrations greatly simplify TOPSwitch based power supply design. • Data Book and Design Guide includes extensive application information All data sheets, application literature and up-to-date versions of the Transformer Design Spreadsheets can be down loaded from our web site at www.powerint.com. A diskette of the Transformer Design Spreadsheets may also be obtained by sending in the completed form provided at the end of this data sheet. • Excel Spreadsheets for Transformer Design - Use of this tool is strongly recommended for all TOPSwitch designs. • Reference design boards – Production viable designs that are assembled and tested. C 12/97 9 TOP221-227 ABSOLUTE MAXIMUM RATINGS1 DRAIN Voltage ............................................ -0.3 to 700 V DRAIN Current Increase (∆ID) in 100 ns except during blanking time ......................................... 0.1 x ILIMIT(MAX)(2) CONTROL Voltage ..................................... - 0.3 V to 9 V CONTROL Current ...............................................100 mA Storage Temperature ..................................... -65 to 125 °C Notes: 1. All voltages referenced to SOURCE, TA = 25 °C. 2. Related to transformer saturation – see Figure 13. 3. Normally limited by internal circuitry. 4. 1/16" from case for 5 seconds. Operating Junction Temperature(3) ................ -40 to 150 °C Lead Temperature(4) ................................................ 260 °C Thermal Impedance: Y Package (θJA)(5) .................70 °C/W (θJC)(6) ...................2 °C/W P/G Package: (θJA) .........45 °C/W(7); 35 °C/W(8) (θJC)(6)...............................5 °C/W 5. Free standing with no heatsink. 6. Measured at tab closest to plastic interface or source pin. 7. Soldered to 0.36 sq. inch (232 mm2), 2 oz. (610 gm/m2) copper clad. 8. Soldered to 1 sq. inch (645 mm2), 2 oz. (610 gm/m2) copper clad. Conditions Parameter Symbol (Unless Otherwise Specified) See Figure 14 SOURCE = 0 V; Tj = -40 to 125 °C Min Typ Max Units CONTROL FUNCTIONS Output Frequency fOSC IC = 4 mA, Tj = 25 ˚C 90 100 110 kHz Maximum Duty Cycle DMAX IC = ICD1 + 0.4 mA, See Figure 10 64 67 70 % Minimum Duty Cycle DMIN IC = 10 mA, See Figure 10 0.7 1.7 2.7 % -21 -16 -11 %/mA IC = 4 mA, Tj = 25 ˚C PWM Gain See Figure 4 PWM Gain Temperature Drift See Note A External Bias Current IB Dynamic Impedance ZC %/mA/˚C -0.05 See Figure 4 IC = 4 mA, Tj = 25 ˚C See Figure 11 0.8 2.0 3.3 mA 10 15 22 Ω Dynamic Impedance %/˚C 0.18 Temperature Drift SHUTDOWN/AUTO-RESTART CONTROL Pin Charging Current Charging Current Temperature Drift 10 C 12/97 IC Tj = 25 ˚C See Note A VC = 0 V -2.4 -1.9 -1.2 VC = 5 V -2 -1.5 -0.8 0.4 mA %/˚C TOP221-227 Conditions Parameter Symbol (Unless Otherwise Specified) See Figure 14 SOURCE = 0 V; Tj = -40 to 125°C Min Typ Max Units SHUTDOWN/AUTO-RESTART (cont.) Auto-restart Threshold Voltage VC(AR) S1 open V 5.7 UV Lockout Threshold Voltage S1 open 4.4 4.7 Auto-restart Hysteresis Voltage S1 open 0.6 1.0 TOP221-222 2 5 9 TOP223-227 2 5 8 Auto-restart Duty Cycle S1 open Auto-restart Frequency 5.0 V 1.2 S1 open V % Hz CIRCUIT PROTECTION Self-protection Current Limit ILIMIT di/dt = 40 mA/µs, TOP221Y Tj = 25°C TOP221P di/dt = 80 mA/µs, TOP222Y Tj = 25°C TOP222P di/dt = 160 mA/µs, TOP223Y Tj = 25°C TOP223P di/dt = 240 mA/µs, TOP224Y Tj = 25°C TOP224P di/dt = 320 mA/µs, TOP225Y 0.23 0.25 0.28 0.45 0.50 0.55 0.90 1.00 1.10 1.35 1.50 1.65 1.80 2.00 2.20 2.25 2.50 2.75 2.70 3.00 3.30 A Tj = 25°C di/dt = 400 mA/µs, TOP226Y Tj = 25°C di/dt = 480 mA/µs, TOP227Y Tj = 25°C Initial Current Limit Leading Edge Blanking Time IINIT tLEB See Figure 12 Tj = 25˚C 0.75 x ≤ 85 VAC (Rectified Line Input) ILIMIT(MIN) 265 VAC (Rectified Line Input) IC = 4 mA, Tj = 25˚C A 0.6 x ILIMIT(MIN) 180 ns C 12/97 11 TOP221-227 Conditions Parameter Symbol (Unless Otherwise Specified) See Figure 14 SOURCE = 0 V; Tj = -40 to 125 °C Min Typ Max Units CIRCUIT PROTECTION (cont.) Current Limit Delay tILD Thermal Shutdown Temperature Power-up Reset Threshold Voltage VC(RESET) IC = 4 mA 100 ns °C IC = 4 mA 125 135 S2 open 2.0 3.3 4.3 V OUTPUT ON-State Resistance RDS(ON) OFF-State Current IDSS Breakdown Voltage BVDSS Rise Time tr Fall Time tf 12 TOP221 Tj = 25 °C 31.2 36.0 ID = 25 mA Tj = 100 °C 51.4 60.0 TOP222 Tj = 25 °C 15.6 18.0 ID = 50 mA Tj = 100 °C 25.7 30.0 TOP223 Tj = 25 °C 7.8 9.0 ID = 100 mA Tj = 100 °C 12.9 15.0 TOP224 Tj = 25 °C 5.2 6.0 ID = 150 mA Tj = 100 °C 8.6 10.0 TOP225 Tj = 25 °C 3.9 4.5 ID = 200 mA Tj = 100 °C 6.4 7.5 TOP226 Tj = 25 °C 3.1 3.6 ID = 250 mA Tj = 100 °C 5.2 6.0 TOP227 Tj = 25 °C 2.6 3.0 ID = 300 mA Tj = 100 °C 4.3 5.0 See Note B 250 VDS = 560 V, TA = 125 °C See Note B ID = 100 µA, TA = 25 °C Ω µA V 700 100 ns 50 ns Measured in a Typical Flyback C 12/97 Converter Application. TOP221-227 Conditions Parameter Symbol (Unless Otherwise Specified) See Figure 14 SOURCE = 0 V; Tj = -40 to 125 °C Min Typ Max Units OUTPUT (cont.) DRAIN Supply Voltage Shunt Regulator Voltage VC(SHUNT) See Note C 36 IC = 4 mA 5.5 Shunt Regulator Temperature Drift CONTROL Supply/ Discharge Current V 5.7 6.0 ±50 ICD1 ICD2 Output MOSFET Enabled ppm/˚C TOP221-224 0.6 1.2 1.6 TOP225-227 0.7 1.4 1.8 0.5 0.8 1.1 Output MOSFET Disabled V mA NOTES: A. For specifications with negative values, a negative temperature coefficient corresponds to an increase in magnitude with increasing temperature, and a positive temperature coefficient corresponds to a decrease in magnitude with increasing temperature. B. The breakdown voltage and leakage current measurements can be accomplished as shown in Figure 15 by using the following sequence: i. The curve tracer should initially be set at 0 V. The base output should be adjusted through a voltage sequence of 0 V, 6.5 V, 4.3 V, and 6.5 V, as shown. The base current from the curve tracer should not exceed 100 mA. This CONTROL pin sequence interrupts the Auto-restart sequence and locks the TOPSwitch internal MOSFET in the OFF State. ii. The breakdown and the leakage measurements can now be taken with the curve tracer. The maximum voltage from the curve tracer must be limited to 700 V under all conditions. C. It is possible to start up and operate TOPSwitch at DRAIN voltages well below 36 V. However, the CONTROL pin charging current is reduced, which affects start-up time, auto-restart frequency, and auto-restart duty cycle. Refer to the characteristic graph on CONTROL pin charge current (IC) vs. DRAIN voltage for low voltage operation characteristics. C 12/97 13 TOP221-227 t2 t1 HV 90% 90% DRAIN VOLTAGE t D= 1 t2 PI-1939-091996 CONTROL Pin Current (mA) 120 100 10% 80 60 40 Dynamic 1 = Impedance Slope 20 0 0V 0 10 PI-2022-040397 DRAIN Current (normalized) IINIT(MIN) @ 85VAC tLEB IINIT(MIN) @ 265VAC 1 2 3 4 5 ∆ID DRAIN CURRENT ILIMIT(MAX) @ 25 ˚C ILIMIT(MIN) @ 25 ˚C 0 6 7 8 Time (us) Figure 12. Self-protection Current Limit Envelope. C 12/97 8 100 nS 0 14 6 Figure 11. TOPSwitch CONTROL Pin I-V Characteristic. tLEB (Blanking Time) 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 4 CONTROL Pin Voltage (V) PI-2039-043097 Figure 10. TOPSwitch Duty Cycle Measurement. 2 0A PI-2031-042397 Figure 13. Example of ∆ID on Drain Current Waveform with Saturated Transformer. TOP221-227 470 Ω 5W S2 D CONTROL 470 Ω C TOPSwitch S1 S 0.1 µF 40 V 47 µF 0-50 V NOTES: 1. This test circuit is not applicable for current limit or output characteristic measurements. 2. For P package, short all SOURCE and SOURCE (HV RTN) pins together. PI-1964-110696 Figure 14. TOPSwitch General Test Circuit. Curve Tracer C B E D CONTROL TOPSwitch C S 6.5V 4.3V NOTE: This CONTROL pin sequence interrupts the Auto-restart sequence and locks the TOPSwitch internal MOSFET in the OFF State. PI-2109-092397 Figure 15. Breakdown Voltage and Leakage Current Measurement Test Circuit. C 12/97 15 TOP221-227 BENCH TEST PRECAUTIONS FOR EVALUATION OF ELECTRICAL CHARACTERISTICS The following precautions should be followed when testing TOPSwitch by itself outside of a power supply. The schematic shown in Figure 14 is suggested for laboratory testing of TOPSwitch. When the DRAIN supply is turned on, the part will be in the Auto-restart mode. The CONTROL pin voltage will be oscillating at a low frequency from 4.7 to 5.7 V and the DRAIN is turned on every eighth cycle of the CONTROL pin oscillation. If the CONTROL pin power supply is turned on while in this Auto-restart mode, there is only a 12.5% chance that the control pin oscillation will be in the correct state (DRAIN active state) so that the continuous DRAIN voltage waveform may be observed. It is recommended that the VC power supply be turned on first and the DRAIN power supply second if continuous drain voltage waveforms are to be observed. The 12.5% chance of being in the correct state is due to the 8:1 counter. Temporarily shorting the CONTROL pin to the SOURCE pin will reset TOPSwitch, which then will come up in the correct state. Typical Performance Characteristics BREAKDOWN vs. TEMPERATURE 1.0 PI-1123A-060794 1.2 Output Frequency (Normalized to 25°C) PI-176B-051391 1.0 0.8 0.6 0.4 0.2 0.9 0 -50 -25 0 25 50 75 100 125 150 -50 -25 Junction Temperature (°C) CURRENT LIMIT vs. TEMPERATURE 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 Junction Temperature (°C) C 12/97 50 75 100 125 150 2 VC = 5 V 1.6 1.2 0.8 0.4 0 -50 -25 16 25 IC vs. DRAIN VOLTAGE CONTROL Pin Charging Current (mA) PI-1125-041494 Current Limit (Normalized to 25°C) 1.2 0 Junction Temperature (°C) PI-1145-103194 Breakdown Voltage (V) (Normalized to 25°C) 1.1 FREQUENCY vs. TEMPERATURE 0 20 40 60 DRAIN Voltage (V) 80 100 TOP221-227 Typical Performance Characteristics (cont.) OUTPUT CHARACTERISTICS PI-1940-0900396 Scaling Factors: DRAIN Capacitance (pF) TCASE=25˚C TCASE=100˚C 2 Scaling Factors: TOP227 TOP226 TOP225 TOP224 TOP223 TOP222 TOP221 1 1.00 0.83 0.67 0.50 0.33 0.17 0.09 0 TOP227 TOP226 TOP225 TOP224 TOP223 TOP222 TOP221 100 1.00 0.83 0.67 0.50 0.33 0.17 0.09 10 2 4 6 8 10 0 200 DRAIN Voltage (V) 400 600 DRAIN Voltage (V) DRAIN CAPACITANCE POWER 500 PI-1942-090396 0 Scaling Factors: TOP227 TOP226 TOP225 TOP224 TOP223 TOP222 TOP221 400 Power (mW) DRAIN Current (A) 1000 PI-1941-090396 COSS vs. DRAIN VOLTAGE 3 300 1.00 0.83 0.67 0.50 0.33 0.17 0.09 200 100 0 0 200 400 600 DRAIN Voltage (V) C 12/97 17 TOP221-227 Free TOPSwitch Flyback Transformer Design Spreadsheets To receive your free copy of the latest version of the spreadsheets on a 3 1/2" IBM compatible floppy (Excel 4.0 format), please visit our Website at www.powerint.com or fill out this form completely and mail/fax it to us at the address/phone number noted below. Name:__________________________________________________________________________________________________ Position/Title:____________________________________________________________________________________________ Company:________________________________________________________________________________________________ Address:________________________________________________________________________________________________ City:________________________________________ State: ________________________ Zip/Postal Code:__________________ Country:_________________________________________________________________________________________________ Phone:_______________________________________________ Fax:_______________________________________________ E-mail:__________________________________________________________________________________________________ End Application:____________________________________________________________________________________________ Power Requirement:_________________________________________________________________________________________ Input Voltage:____________________________________________________________________________________________ Estimated Design Completion Date:___________________________________________________________________________ Power supply that I am designing is ❏ the end product of my company ❏ is incorporated as part of an end product. If so, please specify the end product_____________________________________ To qualify for this free offer, this form must be filled out completely. Fax or mail this request to: Free Flyback Transformer Design Spreadsheet Program Offer Power Integrations, Inc. 477 N. Mathilda Avenue Sunnyvale, CA 94086 Attn: Customer Service Fax: 408-523-9365 18 C 12/97 TOP221-227 P08A DIM Plastic DIP-8 inches D S .004 (.10) mm 8 A 0.370-0.385 9.40-9.78 B 0.245-0.255 6.22-6.48 C 0.125-0.135 3.18-3.43 G H 0.015-0.040 0.120-0.135 0.38-1.02 3.05-3.43 J1 0.060 (NOM) 1.52 (NOM) J2 K 0.014-0.022 0.010-0.012 0.36-0.56 0.25-0.30 L 0.090-0.110 2.29-2.79 M N 0.030 (MIN) 0.300-0.320 0.76 (MIN) 7.62-8.13 P 0.300-0.390 7.62-9.91 Q 0.300 BSC 7.62 BSC 5 -E- B 1 4 -D- A M Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB for standard dual in-line (DIP) package .300 inch row spacing (PLASTIC) 8 leads (issue B, 7/85).. 2. Controlling dimensions are inches. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. D, E and F are reference datums on the molded body. J1 N C -FH G K Q J2 L P PI-2076-031197 G08A Plastic SMD-8 DIM inches mm A B C G H J1 J2 J3 J4 K L M P α 0.370-0.385 0.245-0.255 0.125-0.135 0.004-0.012 0.036-0.044 0.060 (NOM) 0.048-0.053 0.032-0.037 0.007-0.011 0.010-0.012 0.100 BSC 0.030 (MIN) 0.372-0.388 0-8˚ 9.40-9.78 6.22-6.48 3.18-3.43 0.10-0.30 0.91-1.12 1.52 (NOM) 1.22-1.35 0.81-0.94 0.18-0.28 0.25-0.30 2.54 BSC 0.76 (MIN) 9.45-9.86 0-8˚ Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB (issue B, 7/85) except for lead shape and size. 2. Controlling dimensions are inches. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. D, E and F are reference datums on the molded body. D S .004 (.10) -E- 8 5 P B 1 E S .010 (.25) 4 L -D- A M J1 C K -F.004 (.10) J3 J4 J2 .010 (.25) M A S α G H PI-2077-071597 C 12/97 19 TOP221-227 Y03A Plastic TO-220/3 DIM inches mm A B C D E F G H J K L M N O P .460-.480 .400-.415 .236-.260 .240 - REF. .520-.560 .028-.038 .045-.055 .090-.110 .165-.185 .045-.055 .095-.115 .015-.020 .705-.715 .146-.156 .103-.113 11.68-12.19 10.16-10.54 5.99-6.60 6.10 - REF. 13.21-14.22 .71-.97 1.14-1.40 2.29-2.79 4.19-4.70 1.14-1.40 2.41-2.92 .38-.51 17.91-18.16 3.71-3.96 2.62-2.87 J B K P C O A N L D E F Notes: 1. Package dimensions conform to JEDEC specification TO-220 AB for standard flange mounted, peripheral lead package; .100 inch lead spacing (Plastic) 3 leads (issue J, March 1987) 2. Controlling dimensions are inches. 3. Pin numbers start with Pin 1, and continue from left to right when viewed from the top. 4. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15 mm) on any side. 5. Position of terminals to be measured at a position .25 (6.35 mm) from the body. 6. All terminals are solder plated. M G H PI-1848-050696 Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein, nor does it convey any license under its patent rights or the rights of others. PI Logo and TOPSwitch are registered trademarks of Power Integrations, Inc. ©Copyright 1998, Power Integrations, Inc. 477 N. Mathilda Avenue, Sunnyvale, CA 94086 http://www.powerint.com WORLD HEADQUARTERS NORTH AMERICA - WEST Power Integrations, Inc. 477 N. Mathilda Avenue Sunnyvale, CA 94086 USA Main: +1•408•523•9200 Customer Service: Phone: +1•408•523•9265 Fax: +1•408•523•9365 NORTH AMERICA - EAST & SOUTH AMERICA Power Integrations, Inc. Eastern Area Sales Office 1343 Canton Road, Suite C1 Marietta, GA 30066 USA Phone: +1•770•424•5152 Fax: +1•770•424•6567 EUROPE & AFRICA Power Integrations (Europe) Ltd. Mountbatten House Fair Acres Windsor Berkshire SL4 4LE, United Kingdom Phone: +44•(0)•1753•622•208 Fax: +44•(0)•1753•622•209 TAIWAN Power Integrations International Holdings, Inc. 2F, #508, Chung Hsiao E. Rd., Sec. 5, Taipei 105, Taiwan Phone: +886•2•2727•1221 Fax: +886•2•2727•1223 KOREA Power Integrations International Holdings, Inc. Rm# 402, Handuk Building, 649-4 Yeoksam-Dong, Kangnam-Gu, Seoul, Korea Phone: +82•2•568•7520 Fax: +82•2•568•7474 JAPAN Power Integrations, K.K. Keihin-Tatemono 1st Bldg. 12-20 Shin-Yokohama 2-Chome, Kohoku-ku, Yokohama-shi, Kanagawa 222, Japan Phone: +81•(0)•45•471•1021 Fax: +81•(0)•45•471•3717 INDIA (Technical Support) Innovatech #1, 8th Main Road Vasanthnagar Bangalore 560052, India Phone: +91•80•226•6023 Fax: +91•80•228•2191 APPLICATIONS HOTLINE World Wide +1•408•523•9260 20 C 12/97 APPLICATIONS FAX World Wide +1•408•523•9361