INFINEON V23818-H308-L57

Fiber Optics
Small Form Factor
Multimode 850 nm 622 Mbit/s OC-12 Transceiver
with LC™ Connector
V23818-H308-L57
Features
• Small Form Factor transceiver
• Excellent EMI performance
• RJ-45 style LC™ connector system
• Half the size of SC Duplex 1x9 transceiver
• Single power supply (3.3 V)
• Extremely low power consumption of
445 mW typical
• PECL and LVPECL differential inputs and outputs
• System optimized for 62.5/50 µm
graded index fiber
• Multisource 2x5 footprint
• Small size for high port density
• UL-94 V-0 certified
• ESD Class 1 per MIL-STD 883D Method 3015.7
• Compliant with FCC (Class B) and EN 55022
• For distances of up to 550 m
• Class 1 FDA and IEC laser safety compliant
• AC/AC coupling in accordance to SFF MSA
V23
818
-H3
08-L
57
LC™ is a trademark of Lucent
Part Number
Voltage
Signal Detect
Input
Output
V23818-H308-L57
3.3 V
TTL
AC
AC
Data Sheet
1
2002-03-21
V23818-H308-L57
Pin Configuration
Pin Configuration
Tx
MS2
HL3
HL4
10 9 8 7 6
10-PIN MODULE - TOP VIEW
Rx
MS1
1 2 3 4 5
HL1
HL2
Figure 1
Data Sheet
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V23818-H308-L57
Pin Configuration
Pin Description
Pin
No.
Symbol Level/Logic Function
1
N/A
Receiver Signal Ground
2
VEEr
VCCr
N/A
Receiver Power Supply
3
SD
TTL
Signal Detect
4
RD–
PECL
Received Data Out Not
5
RD+
PECL
Received Data Out
6
N/A
Transmitter Power Supply
7
VCCt
VEEt
N/A
Transmitter Signal Ground
8
TxDis
TTL-Input
Transmitter Disable/
Enable
A low signal switches the
laser on.
A high signal switches the
laser off.
9
TD+
PECL
Transmit Data
Transmitter Data In
10
TD–
PECL
Transmit Data Not
Transmitter Data In
MS1
MS2
MS
N/A
Mounting Studs
Mounting Studs are
provided for transceiver
mechanical attachment to
the circuit board. They also
provide an optional
connection of the
transceiver to the
equipment chassis ground.
HL1
HL2
HL3
HL4
HL
N/A
Housing Leads
The transceiver Housing
Leads are provided for
additional signal grounding.
The holes in the circuit
board must be included and
be tied to signal ground.
(see “Application Notes”
on Page 10).
Data Sheet
Description
3
Normal Operation: Logic “1”
Output, represents that light
is present at receiver input
Fault Condition: Logic “0”
Output
2002-03-21
V23818-H308-L57
Description
Description
The Infineon V23818-H308-L57 OC-12 transceiver – part of Infineon Small Form Factor
transceiver family – is based on the Physical Medium Depend (PMD) sublayer and
baseband medium.
The appropriate fiber optic cable is 62.5 µm or 50 µm multimode fiber with LC™
connector.
Operating Range over each Optical Fiber Type
Fiber Type
Limit Values
min.
typ.
max.
62.5 micron MMF
0.5
2 to 300
400
50.0 micron MMF
0.5
2 to 550
700
Unit
meters
The Infineon V23818-H308-L57 OC-12 transceiver is a single unit comprised of a
transmitter, a receiver, and an LC™ receptacle. This design frees the customer from
many alignment and PC board layout concerns.
This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45
style backpanels for high end Data Com and Telecom applications while providing the
advantages of fiber optic technology.
The module is designed for low cost SAN, LAN, WAN, Fibre Channel and Gigabit
Ethernet applications. It can be used as the network end device interface in mainframes,
workstations, servers, and storage devices, and in a broad range of network devices
such as bridges, routers, hubs, and local and wide area switches.
This transceiver operates at OC-12 ATM from a single power supply (+3.3 V). The full
differential data inputs and outputs are PECL and LVPECL compatible.
Data Sheet
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V23818-H308-L57
Description
Functional Description of 2x5 Pin Row Transceiver
This transceiver is designed to transmit serial data via multimode cable.
Automatic
Shut-Down
TxDis
LEN
TD−
TD+
Laser
Coupling Unit
Laser
Driver
e/o
Laser
Power
Control
o/e
Multimode Fiber
Monitor
RD−
RD+
SD
Figure 2
Rx Coupling Unit
o/e
Receiver
Functional Diagram
The receiver component converts the optical serial data into PECL compatible electrical
data (RD+ and RD–). The Signal Detect (SD, active high) shows whether an optical
signal is present.
The transmitter converts PECL compatible electrical serial data (TD+ and TD–) into
optical serial data. Data lines are differentially 100 Ω terminated.
The transmitter contains a laser driver circuit that drives the modulation and bias current
of the laser diode. The currents are controlled by a power control circuit to guarantee
constant output power of the laser over temperature and aging.
The power control uses the output of the monitor PIN diode (mechanically built into the
laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the
operating limits.
Single fault condition is ensured by means of an integrated automatic shutdown circuit
that disables the laser when it detects laser fault to guarantee the laser Eye Safety.
The transceiver contains a supervisory circuit to control the power supply. This circuit
makes an internal reset signal whenever the supply voltage drops below the reset
threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage
has risen above the reset threshold. During this time the laser is inactive.
A low signal on TxDis enables transmitter. If TxDis is high the transmitter is disabled.
Data Sheet
5
2002-03-21
V23818-H308-L57
Description
Regulatory Compliance
Feature
Standard
Comments
ESD:
Electrostatic Discharge
to the Electrical Pins
EIA/JESD22-A114-A
(MIL-STD 883D
Method 3015.7)
Class 1 (>1000 V)
Immunity:
Against Electrostatic
Discharge (ESD) to the
Duplex LC Receptacle
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from
±2 kV to ±15 kV on the receptacle
cause no damage to transceiver
(under recommended conditions).
Immunity:
Against Radio
Frequency
Electromagnetic Field
EN 61000-4-3
IEC 61000-4-3
With a field strength of 3 V/m rms,
noise frequency ranges from
10 MHz to 2 GHz. No effect on
transceiver performance between
the specification limits.
Emission:
Electromagnetic
Interference (EMI)
FCC 47 CFR Part 15,
Class B
EN 55022 Class B
CISPR 22
Noise frequency range:
30 MHz to 18 GHz
Data Sheet
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V23818-H308-L57
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
min.
Unit
max.
Package Power Dissipation
0.5
W
Data Input Levels (PECL)
VCC+0.5
V
Differential Data Input Voltage
2.5
Operating Ambient Temperature
0
70
Storage Ambient Temperature
–40
85
°C
Soldering Conditions, Temp/Time
(MIL-STD 883C, Method 2003)
250/5.5
°C/s
VCC max.
5.5
V
ECL-Output current SD
30
mA
ECL-Output current data
50
Exceeding any one of these values may destroy the device immediately.
Recommended Operating Conditions
Parameter
Symbol
Limit Values
min.
Ambient Temperature
Power Supply Voltage
TAMB
VCC–VEE
0
VDIFF
λC
typ.
Unit
max.
70
°C
3.5
V
250
2400
mV
770
860
nm
3.1
3.3
Transmitter
Data Input Differential Voltage
Receiver
Input Center Wavelength
The electro-optical characteristics described in the following tables are valid only for use
under the recommended operating conditions.
Data Sheet
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V23818-H308-L57
Technical Data
Transmitter Electro-Optical Characteristics
Parameter
Symbol
Limit Values
Unit
min.
typ.
max.
Launched Power (Average)1)
PO
–9.5
–6
–4
dBm
Center Wavelength
λC
830
850
860
nm
Spectral Width (RMS)
σl
0.85
Relative Intensity Noise
RIN
–117
Extinction Ratio (Dynamic)
ER
9
13
Reset Threshold2)
VTH
tRES
tR
2.2
2.7
2.99
V
140
240
560
ms
260
ps
75
mA
2)
Reset Time Out
Rise Time, 20%–80%
Supply Current
1)
2)
65
dB/Hz
dB
Into multimode fiber, 62.5 µm or 50 µm diameter.
Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES.
Receiver Electro-Optical Characteristics
Parameter
Symbol
Limit Values
min.
PIN
Saturation (Average Power)
PSAT
2)
PSDA
Signal Detect Assert Level
Signal Detect Deassert Level3)
PSDD
PSDA-PSDD
Signal Detect Hysteresis
Signal Detect Assert Time
tASS
Signal Detect Deassert Time
tDAS
Data Output Differential Voltage4) VDIFF
Return Loss of Receiver
ARL
tR-RX, tF-RX
Output Data Rise/Fall Time
Supply current5)
ICCRX
Sensitivity (Average Power)1)
1)
2)
3)
4)
5)
typ.
max.
–20
–17
–24
–18
Unit
dBm
0
–30
–27
3
dB
100
µs
350
0.5
0.7
1.23
12
V
dB
75
260
ps
90
mA
Average optical power at which the BER is 1x10–12. Measured with a 223–1 NRZ PRBS and ER = 9 dB.
An increase in optical power above the specified level will cause the SIGNAL DETECT output to switch from
a Low state to a High state.
A decrease in optical power below the specified level will cause the SIGNAL DETECT to change from a High
state to a Low state.
AC/AC for data. Load 50 Ω to GND or 100 Ω differential. For dynamic measurement a tolerance of 50 mV
should be added.
Supply current excluding Rx output load.
Data Sheet
8
2002-03-21
V23818-H308-L57
Eye Safety
Eye Safety
This laser based multimode transceiver is a Class 1 product.
It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11.
To meet laser safety requirements the transceiver shall be operated within the maximum
operating limits.
Attention: All adjustments have been made at the factory prior to shipment of the
devices. No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result
in voided product warranty.
Note: Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Data
Wavelength
850 nm
Total output power
(as defined by IEC: 7 mm aperture at 1.4 cm distance)
<675 µW
Total output power
(as defined by FDA: 7 mm aperture at 20 cm distance)
<70 µW
Beam divergence
12°
Figure 3
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1 Laser Product
Required Labels
Indication of
laser aperture
and beam
10 9 8 7 6
Tx
Rx
Figure 4
Data Sheet
1 2 3 4 5
Laser Emission
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V23818-H308-L57
Application Notes
Application Notes
Small Form Factor Pinning Comparison
The drawing below gives you a comparison between the different pinnings 2x5, 2x6,
2x10. Dimension for diameter and distance of additional pins is similar to the existing
dimensions of the other pins.
TOP VIEW
RX VEE 1
RX VCC 2
SD 3
RXD - 4
RXD + 5
RS 1
RX VEE 2
RX VCC 3
SD 4
RXD - 5
RXD + 6
VCC PIN 1
RX VEE 2
RX VEE 3
RX CLK - 4
RX CLK + 5
RX VEE 6
RX VCC 7
SD 8
RXD - 9
RXD + 10
RX
TX
20 P MON +
19 P MON 18 BIAS MON +
17 BIAS MON 16 TX VEE
15 TXD 14 TXD +
13 TX DIS
12 TX VEE
11 TX VCC
12 LASER FAULT
11 TXD 10 TXD +
9 TX DIS
8 TX VEE
7 TX VCC
10 TXD 9 TXD +
8 TX DIS
7 TX VEE
6 TX VCC
2 x 10
2x6
2x5
Figure 5
Pin Description
RS pin - The RS Rate Select: is not connected.
LF pin - The LF pin (Laser Fault) is a TTL output of the Laser Driver Supervisor Circuit.
A Logic “1” level can be measured in case of a laser fault. It will not show a fault
if the laser is being disabled using the TxDis input, since this is not a fault
condition.
EMI-Recommendation
To avoid electromagnetic radiation exceeding the required limits please take note of the
following recommendations.
When Gigabit switching components are found on a PCB (multiplexers, clock recoveries
etc.) any opening of the chassis may produce radiation also at chassis slots other than
that of the device itself. Thus every mechanical opening or aperture should be as small
as possible.
On the board itself every data connection should be an impedance matched line (e.g.
strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should
be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched
Data Sheet
10
2002-03-21
V23818-H308-L57
Application Notes
line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In
DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows:
For 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data
and Datanot. Please consider whether there is an internal termination inside an IC or a
transceiver.
In certain cases signal GND is the most harmful source of radiation. Connecting chassis
GND and signal GND at the plate/ bezel/ chassis rear e.g. by means of a fiber optic
transceiver may result in a large amount of radiation. Even a capacitive coupling
between signal GND and chassis may be harmful if it is too close to an opening or an
aperture.
If a separation of signal GND and chassis GND is not possible, it is strongly
recommended to provide a proper contact between signal GND and chassis GND at
every location where possible. This concept is designed to avoid hotspots. Hotspots are
places of highest radiation which could be generated if only a few connections between
signal and chassis GND exist. Compensation currents would concentrate at these
connections, causing radiation.
By use of Gigabit switching components in a design, the return path of the RF current
must also be considered. Thus a split GND plane of Tx and Rx portion may result in
severe EMI problems.
A recommendation is to connect the housing leads to signal GND. However, in certain
applications it may improve EMI performance by connecting them to chassis GND.
The cutout should be sized so that all contact springs make good contact with the face
plate.
Please consider that the PCB may behave like a waveguide. With an εr of 4, the
wavelength of the harmonics inside the PCB will be half of that in free space. In this
scenario even the smallest PCBs may have unexpected resonances.
(13.97) *)
.550
Dimensions in (mm) inches
Figure 6
Data Sheet
*) min. pitch between SFF transceiver according to MSA.
Transceiver Pitch
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V23818-H308-L57
Application Notes
Multimode 850 nm 2x5 Transceiver, AC/AC
7
TD+
9
VCC
Tx+
ECL/PECL
Driver
100 Ω
Infineon Transceiver
V23818-H308-L57
10
TxDis
8
VCCt
6
VCCr
2
Tx−
L1
VCC
3.3 V
L2
C3
Gigabit
Transceiver
Chip
C2
3 TTL level
SD to upper level
RD−
R2
SD
R1
Limiting
Amplifier
Serializer/
Deserializer
C1
Signal
Detect
PreAmp
R8
TD−
R7
VCSEL
Driver
VEEt
VCC SerDes
3.3 V
4
RD−
Receiver
PLL etc.
RD+
5
C1/2/3
L1/2
R1/2
R3/4
1
R3
VEEr
= 4.7 µF
= 1 µH
= Depends on SerDes chip used
= Depends on SerDes chip used
R4
RD+
R7/8 = Biasing (depends on SerDes chip)
Place R1/2/3/4/7/8 close to SerDes chip
Place R5/6 close to Infineon transceiver
Figure 7
Values of R1/2/3/4 may vary as long as proper 50 Ω termination to VEE or 100 Ω
differential is provided. The power supply filtering is required for good EMI performance.
Use short tracks from the inductor L1/L2 to the module VCCRx/VCCTx.
Data Sheet
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V23818-H308-L57
Package Outlines
Package Outlines
a) recommended bezel position
Drawing shown is with collar
Dimensions in mm [inches]
Figure 8
Data Sheet
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V23818-H308-L57
Revision History:
2002-03-21
DS0
Previous Version:
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Subjects (major changes since last revision)
Document’s layout has been changed: 2002-Aug.
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
Representatives worldwide: see our webpage at http://www.infineon.com.
Edition 2002-03-21
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München, Germany
© Infineon Technologies AG 2002.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
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Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
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approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support
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