Fiber Optics V23838-M305-M56 SFP - Small Form-factor Pluggable 1.25 Gigabit Ethernet (1000 Base-SX) 2.125/1.0625 Gbit/s Fibre Channel (200-M5/M6-SN-I / 100-M5/M6-SN-I) Multimode 850 nm Transceiver with LC™ Connector Features • Small Form-factor Pluggable (SFP) MSA compatible transceiver1) • Advanced release mechanism • Easy access, even in belly to belly applications • Wire handle release for simplicity • Color coded black tab (multimode) • PCI height compatible File: 1130 • Excellent EMI performance • Common ground concept • RJ-45 style LC™ connector system • Single power supply (3.3 V) • Extremely low power consumption of 530 mW typical • Small size for high channel density • UL-94 V-0 certified • ESD Class 1C per JESD22-A114-B (MIL-STD 883D Method 3015.7) • According to FCC (Class B) and EN 55022 File: 1131 • For distances of up to 860 m (50 µm fiber) • Laser safety according to Class 1 FDA and IEC • AC/AC Coupling according to MSA • Extended operating temperature range of –20°C to 85°C • SFP evaluation kit V23848-S5-V4 available upon request • A press fit cage and cage plugs are available as accessory products from Infineon (see SFP Accessories) 1) MSA documentation can be found at www.infineon.com/fiberoptics under Transceivers, SFP Transceivers. LC™ is a trademark of Lucent Data Sheet 1 2004-06-23 V23838-M305-M56 Pin Configuration Pin Configuration 20 VEET 1 VEET 19 TD− 2 Tx Fault 18 TD+ 3 Tx Disable 17 VEET 4 MOD-DEF(2) 16 VCCT 5 MOD-DEF(1) 15 VCCR 6 MOD-DEF(0) 14 VEER 7 Rate Select 13 RD+ 8 LOS 12 RD− 9 VEER 11 VEER 10 VEER Bottom of transceiver (as viewed through top of transceiver) Top of transceiver Figure 1 Data Sheet File: 1306 SFP Transceiver Electrical Pad Layout 2 2004-06-23 V23838-M305-M56 Pin Configuration Pin Description Pin No. Name Logic Level Function 1 VEET N/A Transmitter Ground1) 2 Tx Fault LVTTL Transmitter Fault Indication2) 8) 3 Tx Disable LVTTL Transmitter Disable3) 4 MOD-DEF(2) LVTTL Module Definition 24) 8) 5 MOD-DEF(1) LVTTL Module Definition 15) 8) 6 MOD-DEF(0) N/A Module Definition 06) 8) 7 Rate Select N/A Not connected 8 LOS LVTTL Loss Of Signal7) 8) 9 N/A Receiver Ground1) N/A Receiver Ground1) 11 VEER VEER VEER N/A Receiver Ground1) 12 RD– LVPECL Inv. Received Data Out9) 13 RD+ LVPECL Received Data Out9) 14 N/A Receiver Ground1) N/A Receiver Power N/A Transmitter Power 17 VEER VCCR VCCT VEET N/A Transmitter Ground1) 18 TD+ LVPECL Transmit Data In10) 19 TD– LVPECL Inv. Transmit Data In10) 20 VEET N/A Transmitter Ground1) 10 15 16 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) Common transmitter and receiver ground within the module. A high signal indicates a laser fault of some kind and that laser is switched off. A low signal switches the transmitter on. A high signal or when not connected switches the transmitter off. MOD-DEF(2) is the data line of two wire serial interface for serial ID. MOD-DEF(1) is the clock line of two wire serial interface for serial ID. MOD-DEF(0) is grounded by the module to indicate that the module is present. A low signal indicates normal operation, light is present at receiver input. A high signal indicates the received optical power is below the worst case receiver sensitivity. Should be pulled up on host board to VCC by 4.7 - 10 kΩ. AC coupled inside the transceiver. Must be terminated with 100 Ω differential at the user SERDES. AC coupled and 100 Ω differential termination inside the transceiver. Data Sheet 3 2004-06-23 V23838-M305-M56 Description Description The Infineon Fibre Channel / Gigabit Ethernet multimode transceiver – part of Infineon SFP family – is compatible to the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000 Base-SX (short wavelength) as specified in IEEE Std 802.3 and Fibre Channel FC-PI-2 (Rev. 5.0) 200-M5-SN-I, 200-M6-SN-I for 2.125 Gbit/s, and FC-PI-2 (Rev. 5.0) 100-M5-SN-I, 100-M6-SN-I for 1.0625 Gbit/s. The appropriate fiber optic cable is 62.5 µm or 50 µm multimode fiber with LC™ connector. Link Length as Defined by IEEE and Fibre Channel Standards Fiber Type Reach min.1) max.2) 50 µm, 2000 MHz*km 2 860 50 µm, 500 MHz*km 2 500 50 µm, 400 MHz*km 2 450 62.5 µm, 200 MHz*km 2 300 62.5 µm, 160 MHz*km 2 250 50 µm, 500 MHz*km 2 550 50 µm, 400 MHz*km 2 500 62.5 µm, 200 MHz*km 2 275 62.5 µm, 160 MHz*km 2 220 50 µm, 2000 MHz*km 2 500 50 µm, 500 MHz*km 2 300 50 µm, 400 MHz*km 2 260 62.5 µm, 200 MHz*km 2 150 62.5 µm, 160 MHz*km 2 120 Unit at 1.0625 Gbit/s meters at 1.25 Gbit/s meters at 2.125 Gbit/s 1) 2) meters Minimum reach as defined by IEEE and Fibre Channel Standards. A 0 m link length (loop-back connector) is supported. Maximum reach as defined by IEEE and Fibre Channel Standards. Longer reach possible depending upon link implementation. Data Sheet 4 2004-06-23 V23838-M305-M56 Description The Infineon SFP multimode transceiver is a single unit comprised of a transmitter, a receiver, and an LC™ receptacle. This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45 style backpanels for high end datacom and telecom applications while providing the advantages of fiber optic technology. The module is designed for low cost SAN, LAN, Fibre Channel and Gigabit Ethernet applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 1.0625 Gbit/s / 1.25 Gbit/s / 2.125 Gbit/s from a single power supply (+3.3 V). The 100 Ω differential data inputs and outputs are LVPECL and CML compatible. Functional Description of SFP Transceiver This transceiver is designed to transmit serial data via multimode cable. Tx Fault Automatic Shut-Down Tx Disable Tx Coupling Unit TD+ TD− Laser Driver e/o Laser Power Control o/e Multimode Fiber Monitor Rx Coupling Unit RD+ RD− Limiting Amp TIA o/e LOS MOD-DEF(2) MOD-DEF(1) EEPROM File: 1361 Figure 2 Data Sheet Functional Diagram 5 2004-06-23 V23838-M305-M56 Description The receiver component converts the optical serial data into CML compatible electrical data (RD+ and RD–). The Loss Of Signal (LOS) shows whether an optical signal is present. The transmitter converts CML compatible electrical serial data (TD+ and TD–) into optical serial data. Data lines are differentially 100 Ω terminated. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser Eye Safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage drops below the reset threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. A low signal on TxDis enables transmitter. If TxDis is high or not connected the transmitter is disabled. The serial ID interface defines a 256 byte memory map in EEPROM, accessible over a 2 wire, serial interface at the 8 bit address 1010000X (A0h). Data Sheet 6 2004-06-23 V23838-M305-M56 Description Regulatory Compliance (EMI) Feature Standard Comments ESD: Electrostatic Discharge to the Electrical Pins EIA/JESD22-A114-B (MIL-STD 883D method 3015.7) Class 1C Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle EN 61000-4-2 IEC 61000-4-2 Discharges ranging from ±2 kV to ±15 kV on the receptacle cause no damage to transceiver (under recommended conditions). Immunity: Against Radio Frequency Electromagnetic Field EN 61000-4-3 IEC 61000-4-3 With a field strength of 10 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Emission: FCC 47 CFR Part 15, Radiated Field Strength Class B CISPR 22 EN 55022 Class B Compliant with 89/336/EEC Noise frequency range: 30 MHz to 18 GHz EN 55022 EN 55024 File: 1400 SFP This device complies with part 15 of the FCC Rules1). Operation is subject to the following two conditions: 1 This device may not cause harmful interference. 2 This device must accept any interference received, including interference that may cause undesired operation. V23838-M305-M56 Tested To Comply With FCC Standards FOR HOME OR OFFICE USE File: 1406 1) Any kind of modification not expressly approved by Infineon Technologies may affect the regulatory compliance of the concerned product. As a consequence thereof this could void the user’s authority to operate the equipment. Data Sheet 7 2004-06-23 V23838-M305-M56 Technical Data Technical Data Absolute Maximum Ratings Parameter Symbol Limit Values min. Unit max. Operating Case Temperature1) VID max VIDpk-pk TS TC Storage Relative Humidity RHs 5 95 % Operating Relative Humidity RHo 5 85 % Supply Voltage 4 V Data Output Current VCC max Idata 50 mA Receiver Optical Input Power RxP max 3 dBm Data Input Voltage Differential Data Input Voltage Swing Storage Ambient Temperature 1) VCC+0.5 V 5 V –40 85 °C –20 85 °C Operating case temperature measured at transceiver reference point (in cage through 2nd centre hole from rear, see Figure 9). Exceeding any one of these values may permanently destroy the device. Data Sheet 8 2004-06-23 V23838-M305-M56 Technical Data Electrical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C) Parameter Symbol Values Unit min. typ. max. 2.97 3.3 3.63 V In-rush Current VCC–VEE IIR max 30 mA Power Dissipation P 400 700 mW Differential Data Input Voltage Swing2) VIDpk-pk 500 3200 mV Tx Disable Voltage TxDis 2 VCC V Tx Enable Voltage TxEn VEE 0.8 V Tx Fault High Voltage TxFH 2.4 VCC V Tx Fault Low Voltage TxFL VEE 0.5 V Supply Current3) ITx 150 mA Differential Data Output Voltage VODpk-pk 500 Swing 4) 1000 mV LOS Active LOSA 2.4 VCC V LOS Normal LOSN VEE 0.5 V Receiver 3 dB Cut-off Frequency5) 1.5 GHz Receiver 10 dB Cut-off Frequency5) 3 GHz Common Supply Voltage 1) Transmitter 100 Receiver tR-Rx tF-Rx Rise Time6) Fall Time6) 125 ps 170 ps Contributed Deterministic Jitter7) DJRx 47 ps Contributed Total Jitter8) TJRx 124 ps Jitter (pk-pk)9) JRx Power Supply Noise Rejection10) PSNR Supply Current 3) 1) 2) 3) 11) IRx 60 ps 100 mVpp 80 90 mA Measured with MSA recommended supply filter network (Figure 7). Maximum value above that of the steady state value. Internally AC coupled. Typical 100 Ω differential input impedance. MSA defines maximum current at 300 mA. Data Sheet 9 2004-06-23 V23838-M305-M56 Technical Data 4) 5) 6) 7) 8) 9) 10) 11) Internally AC coupled. Load 50 Ω to GND or 100 Ω differential. For dynamic measurement a tolerance of 50 mV should be added. Fibre Channel PI Standard. Measured values are 20% - 80%. Deterministic Jitter is that jitter measured by a bathtub scan, using a 27–1 NRZ PRBS, and extrapolating to 1 BER. Total Jitter is that jitter measured by a bathtub scan, using a 27–1 NRZ PRBS, and extrapolating to 1x10–12 BER. Jitter (pk-pk) is measured using a 27–1 NRZ PRBS and a Digital Communications Analyzer. Measured using a 20 Hz to 1 MHz sinusoidal modulation with the MSA recommended power supply filter network (Figure 7) in place. A change in sensitivity of less than 1 dB can be typically expected. Supply current excluding Rx output load. Data Sheet 10 2004-06-23 V23838-M305-M56 Technical Data Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C) Parameter Symbol Values min. typ. 196 156 450 450 Unit max. Transmitter Optical Modulation Amplitude 1) @ 2.125 Gbit/s @ 1.0625 Gbit/s OMA Launched Power (Average)2) PO –8.5 –6 Extinction Ratio (Dynamic) ER 9 14.5 Center Wavelength λC 830 850 860 nm Spectral Width (rms) σI 0.15 0.85 nm Relative Intensity Noise RIN –117 dB/Hz Tx Disable Laser Output Power PO-TxDis –50 dBm Deterministic Jitter3) DJTx 56 ps Total Jitter4) TJTx 120 ps Jitter (pk-pk)5) JTx 35 85 ps Rise Time6) tR-Tx tF-Tx 85 150 ps 135 150 ps Fall Time6) µW 20 –4 dBm dB Receiver7) Min. Optical Modulation Amplitude 8) @ 2.125 Gbit/s @ 1.0625 Gbit/s OMA Sensitivity (Average Power)9) @ 2.125 Gbit/s @ 1.25 Gbit/s @ 1.0625 Gbit/s PIN Stressed Receiver Sensitivity 50 µm Fiber10) @ 2.125 Gbit/s @ 1.0625 Gbit/s SPIN Stressed Receiver Sensitivity 62.5 µm Fiber10) @ 2.125 Gbit/s @ 1.0625 Gbit/s SPIN LOS Assert Level 11) PLOSA Data Sheet µW 24 19 49 31 –22 –19 –19 –19 dBm µW 50 µm 29 24 96 55 µW 62.5 µm 34 32 –30 11 –28 109 67 dBm 2004-06-23 V23838-M305-M56 Technical Data Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C) (cont’d) Parameter Symbol Values min. typ. max. –25 –20 LOS Hysteresis11) PLOSD PLOSA –PLOSD 1 2 Input Center Wavelength λC 770 850 Optical Return Loss ORL 12 LOS Deassert Level 11) 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) Unit dBm dB 860 nm dB Fibre Channel PI Standard. Typical OMA values based on –6 dBm launched power (average) and 15 dB extinction ratio. Into multimode fiber, 62.5 µm or 50 µm diameter. Deterministic Jitter is that jitter measured by a bathtub scan, using a 27–1 NRZ PRBS, and extrapolating to 1 BER. Total Jitter is that jitter measured by a bathtub scan, using a 27–1 NRZ PRBS, and extrapolating to 1x10–12 BER. Jitter (pk-pk) is measured using a 27–1 NRZ PRBS and a Digital Communications Analyzer. Values are 20% - 80%. Measured at nominal data rate, unfiltered, using an O/E plug-in with a bandwidth of 2.85 GHz or higher. Complies with FC 1x, FC 2x and Gigabit Ethernet eye mask when filtered. Receiver characteristics are measured with a worst case reference laser. Fibre Channel PI Standard. Average optical power at which the BER is 1x10–12. Measured with a 27–1 NRZ PRBS and ER = 9 dB. Measured at the given Stressed Receiver Eye Closure Penalty and DCD component given in Fibre Channel PI Standard (2.03/2.18 dB & 40/80 ps). See Figure 3. 1 LOS Level 0 LOS Deassert (Maximum) LOS deassertion range Hysteresis (Minimum) LOS persistence LOS assertion range LOS Assert (Minimum) Received Optical Power Level [dBm] LOS / Hysteresis (Typical) File: 1522 Figure 3 Data Sheet 12 2004-06-23 V23838-M305-M56 Technical Data Timing of Control and Status I/O Parameter Symbol Values min. Unit Condition max. Tx Disable Assert Time t_off 10 µs Time from rising edge of Tx Disable to when the optical output falls below 10% of nominal Tx Disable Negate Time t_on 1 ms Time from falling edge of Tx Disable to when the modulated optical output rises above 90% of nominal Time to Initialize, t_init Including Reset of Tx Fault 300 ms From power on or negation of Tx Fault using Tx Disable Tx Fault Assert Time t_fault 100 µs Time from fault to Tx Fault on Tx Disable to Reset t_reset µs Time Tx Disable must be held high to reset Tx Fault 10 LOS Assert Time t_loss_on 100 µs Time from LOS state to Rx LOS assert LOS Deassert Time t_loss_off 100 µs Time from non-LOS state to Rx LOS deassert I2C Bus Clock Rate f_i2cbus_ clock 100 kHz Data Sheet 13 2004-06-23 V23838-M305-M56 Eye Safety Eye Safety This laser based multimode transceiver is a Class 1 product. It complies with IEC 60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10 and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001. CLASS 1 LASER PRODUCT To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Note: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Emission Data Wavelength 850 nm Maximum total output power (as defined by IEC: 7 mm aperture at 14 mm distance) 709 µW / –1.5 dBm Beam divergence (full angle) / NA (half angle) 20° / 0.18 rad FDA IEC Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product File: 1401 Figure 4 Required Labels Laser Emission Tx Top view Rx File: 1333 Figure 5 Data Sheet Laser Emission 14 2004-06-23 V23838-M305-M56 Application Notes Application Notes EMI Recommendations To avoid electromagnetic radiation exceeding the required limits set by the standards, please take note of the following recommendations. When Gigabit switching components are found on a PCB (e.g. multiplexer, serializer-deserializer, clock data recovery, etc.), any opening of the chassis may leak radiation; this may also occur at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as feasible and its length carefully considered. On the board itself, every data connection should be an impedance matched line (e.g. strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed symmetrically. Vias should be avoided. Where internal termination inside an IC or a transceiver is not present, a line terminating resistor must be provided. The decision of how best to establish a ground depends on many boundary conditions. This decision may turn out to be critical for achieving lowest EMI performance. At RF frequencies the ground plane will always carry some amount of RF noise. Thus the ground and VCC planes are often major radiators inside an enclosure. As a general rule, for small systems such as PCI cards placed inside poorly shielded enclosures, the common ground scheme has often proven to be most effective in reducing RF emissions. In a common ground scheme, the PCI card becomes more equipotential with the chassis ground. As a result, the overall radiation will decrease. In a common ground scheme, it is strongly recommended to provide a proper contact between signal ground and chassis ground at every location where possible. This concept is designed to avoid hotspots which are places of highest radiation, caused when only a few connections between chassis and signal grounds exist. Compensation currents would concentrate at these connections, causing radiation. However, as signal ground may be the main cause for parasitic radiation, connecting chassis ground and signal ground at the wrong place may result in enhanced RF emissions. For example, connecting chassis ground and signal ground at a front panel/bezel/chassis by means of a fiber optic transceiver/cage may result in a large amount of radiation especially where combined with an inadequate number of grounding points between signal ground and chassis ground. Thus the transceiver becomes a single contact point increasing radiation emissions. Even a capacitive coupling between signal ground and chassis ground may be harmful if it is too close to an opening or an aperture. For a number of systems, enforcing a strict separation of signal ground from chassis ground may be advantageous, providing the housing does not present any slots or other discontinuities. This separate ground concept seems to be more suitable in large systems where appropriate shielding measures have also been implemented. The return path of RF current must also be considered. Thus a split ground plane between Tx and Rx paths may result in severe EMI problems. Data Sheet 15 2004-06-23 V23838-M305-M56 Application Notes The bezel opening for a transceiver should be sized so that all contact springs of the transceiver cage make good electrical contact with the face plate. Please consider that the PCB may behave like a dielectric waveguide. With a dielectric constant of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. Thus even the smallest PCBs may have unexpected resonances. Large systems can have many openings in the front panel for SFP transceivers. In typical applications, not all of these ports will hold transceivers; some may be intentionally left empty. These empty slots may emit significant amounts of radiation. Thus it is recommended that empty ports be plugged with an EMI plug as shown in Figure 6. Infineon offers an EMI/dust plug, P/N V23818-S5-B1. SFP Accessories Cage: Infineon Technologies Part Number: V23838-S5-N1/V23838-S5-N1-BB Host Board Connector: Tyco Electronics Part Number: 1367073-1 Cage EMI/Dust Plug: Infineon Technologies Part Number: V23818-S5-B1 Cage Dust Plug: Infineon Technologies Part Number: V23818-S5-B2 CAGE HOST BOARD CONNECTOR CAGE EMI/DUST PLUG iSFP™ HOST BOARD DUST PLUG File: 1521 Figure 6 Data Sheet 16 2004-06-23 V23838-M305-M56 Application Notes EEPROM Serial ID Memory Contents (A0h) Addr. Hex ASCII Name/Description 0 03 Identifier 1 04 Extended identifier 2 07 Connector 34 62 b 3 4 00 00 35 36 48 00 H 5 6 00 01 37 38 00 03 7 8 9 10 11 40 40 0C 05 01 Encoding 39 40 41 42 43 19 56 32 33 38 V 2 3 8 12 15 BR, nominal 44 33 3 13 00 Reserved 45 38 8 14 00 Length (9 µm) - km 46 2D - 15 00 Length (9 µm) 47 4D M 16 1E Length (50 µm) 48 33 3 17 0F Length (62.5 µm) 49 30 0 18 00 Length (copper) 50 35 5 19 00 Reserved 51 2D - 20 21 22 23 24 25 49 6E 66 69 6E 65 I n f i n e Vendor name 52 53 54 55 56 57 4D 35 36 20 41 34 M 5 6 26 27 6F 6E o n 58 59 41 39 A 9 28 29 20 46 03 52 Wavelength F 60 61 30 4F O 62 00 Reserved 31 20 63 21 Check sum of bytes 0 - 62 Data Sheet Addr. Hex ASCII Name/Description 32 47 G Vendor name 33 6D m Transceiver optical compatibility 17 Reserved Vendor OUI A 4 Vendor part number Vendor revision, product status dependent 2004-06-23 V23838-M305-M56 Application Notes EEPROM Serial ID Memory Contents (A0h) (cont’d) Addr. 64 65 66 Addr. 96 97 98 Hex ASCII Name/Description 20 Vendor specific EEPROM 20 20 99 20 100 101 102 103 104 20 20 20 20 20 73 74 105 106 20 20 75 76 20 107 108 20 20 77 20 109 20 78 20 110 20 79 20 111 20 80 20 112 20 81 20 113 20 82 20 114 20 83 20 115 20 116 117 20 20 20 20 20 20 20 67 Hex ASCII Name/Description 00 Transceiver signal options 1A 00 BR, maximum 32 BR, minimum 68 69 70 71 72 Vendor serial number 84 85 Vendor manufacturing date code 86 87 88 89 90 20 118 119 120 121 122 91 20 123 20 92 00 Diagnostic monitoring type 124 20 93 00 Enhanced options 125 20 94 00 SFF-8472 compliance 126 20 Low order 8 bits of the sum of the contents of all the bytes from byte 64 to byte 94, inclusive 127 128 255 20 00 95 Data Sheet 18 Vendor specific. Reserved for future use 2004-06-23 V23838-M305-M56 Application Notes Multimode 850 nm SFP Transceiver, AC/AC TTL Host Board Infineon SFP Transceiver 3.3 V 1 µH Protocol VCC 10 µF VCCT 1 µH 0.1 µF 0.1 µF Protocol VCC 16 xx 1) VEET 4.7 to 10 kΩ 1/17/20 4.7 to 10 kΩ Tx Disable Tx Fault Tx Disable 3 Tx Fault 2 TD– 19 0.1 µF Laser Driver 100 Ω TD+ 18 VCCR 15 0.1 µF Protocol IC ASIC IC 4.7 to 10 kΩ 10 µF 0.1 µF xx 1) VEER 9/10/11/14 RD+ 13 0.1 µF RD– 12 0.1 µF LOS 8 Rate Select 2) 7 Pre-Amp./ Post Amp. 100 Ω LOS Rate Select 2) Diagnostic IC / EEPROM 3.3 V PLD / PAL 4.7 to 10 kΩ 4.7 to 10 kΩ 4.7 to 10 kΩ 6 5 4 MOD-DEF(0) MOD-DEF(1) MOD-DEF(2) 1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory. 2) Not implemented. File: 1320 Figure 7 Data Sheet Example SFP Host Board Schematic and Recommended Host Board Supply Filtering Network 19 2004-06-23 V23838-M305-M56 Package Outlines 13.4 13.7 Package Outlines 56.5 6.25 8.5 1.3 13.7 10.3 11.6 47.5 Dimensions in mm File: 1215 Figure 8 TRANSCEIVER TEMPERATURE REFERENCE POINT 29.80 Dimensions in mm File: 1224 Figure 9 Data Sheet 20 2004-06-23 V23838-M305-M56 Revision History: 2004-06-23 Previous Version: 2004-01-09 Page Subjects (major changes since last revision) 1 Features changed 4 Description changed 9, 17 Tables changed 19 Figure 7 Host Board Schematic changed DS3 Edition 2004-06-23 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2004. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.