PHILIPS PDIUSBD11D

INTEGRATED CIRCUITS
PDIUSBD11
USB device with serial interface
Product specification
Supersedes data of 1999 Nov 19
1999 Jul 22
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
FEATURES
DESCRIPTION
• Complies with the Universal Serial Bus specification Rev. 1.1
• Complies with the ACPI, OnNOW, and USB power management
The Universal Serial Bus hub PDIUSBD11 is a cost and
feature-optimized USB interface device. It is used in
microcontroller-based systems and communicates with the system
microcontroller over the high speed I2C serial bus. This modular
approach to implementing USB functions allows the designer to
choose the optimum system microcontroller from the available wide
variety. This flexibility cuts down the development time, risks, and
costs by allowing the use of the existing architecture and the
firmware investments. This results in the fastest way to develop the
most cost-effective USB peripheral solutions. The PDIUSBD11 is
ideally suited for computer monitors, docking stations, keyboards,
and many other applications that use the I2C or the SMBus-based
architecture.
requirements
• Compliant with USB Human Interface Devices and Monitor
Control Class
• Compliant with System Management Bus Specification Rev. 1.0
• Integrated SIE (Serial Interface Engine), FIFO memory and
transceivers
• Automatic USB protocol handling
• High speed I2C Interface (up to 1 Mbit/s)
• Compatible with the PDIUSBH11 software
• Software controllable connection to USB bus (SoftConnect)
• Low frequency 12 MHz crystal oscillator eases EMI design issues
• Programmable output clock frequency
• Bus powered capability with very low suspend current
• Controllable LazyClock output during suspend
• Single 3.3 V supply with 5 V tolerant I/O
• Available in 16-pin DIP and SO packages
• Full-scan design with high fault coverage (>99%) insures high
The PDIUSBD11 conforms to the USB specification Rev. 1.1, I2C
serial interface and the SMBus specifications. It is fully compliant
with the Human Interface Device Class and Monitor Control Class
specifications. Its low suspend power consumption along with the
programmable LazyClock output allows for easy implementation of
equipment that is compliant to the ACPI, OnNOW, and USB power
management requirements. The low operating power allows the
implementation of bus-powered function.
The PDIUSBD11 is fully backward compatible to the
PDIUSBH11/PDIUSBH11A software. In addition, it also incorporates
the feature enhancements like SoftConnect, LazyClock,
programmable clock output, lower frequency crystal oscillator,
multiple function endpoints and integration of termination resistors.
All of these feature enhancements contribute to significant cost
savings in the system implementation and at the same time ease the
implementation of advanced USB functionality into the peripherals.
quality
• Higher than 8 kV in-circuit ESD protection lowers cost of extra
components
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
PKG. DWG. #
16-pin plastic SO
–40°C to +85°C
PDIUSBD11 D
PDIUSBD11 D
SOT162-1
16-pin plastic DIP
–40°C to +85°C
PDIUSBD11 N
PDIUSBD11 N
SOT38-4
BLOCK DIAGRAM
12 MHz
3.3V
UPSTREAM
PORT
D+
D–
PLL
1.5kW
INTEGRATED
RAM
D+
SoftConnect
ANALOG
TX/RX
FULL SPEED
BIT CLOCK
RECOVERY
INTERRUPT
MEMORY
MANAGEMENT
UNIT
PHILIPS
SIE
I2C
SLAVE
INTERFACE
SDA
SCL
SV00823
NOTE:
1. This is a conceptual block diagram and does not include each individual signal.
1999 Jul 22
2
853-2050 22023
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
Analog Transceiver
I2C Slave Interface
The transceiver interfaces directly to the USB cables through some
termination resistors. They are capable of transmitting and receiving
serial data at “full speed” (12 Mbit/s) only.
This block implements the necessary I2C interface protocol. A slave
I2C allows for simple micro-coding. An interrupt is used to alert the
microcontroller whenever the PDIUSBD11 needs attention. As a
slave I2C device, the PDIUSBD11 I2C clock: SCL is an input and is
controlled by the microcontroller. The I2C interface can run up to
1 Mbit/s.
PLL
A 12 MHz to 48 MHz clock multiplier PLL (Phase-Locked Loop) is
integrated on-chip. This allows for the use of low-cost 12 MHz
crystal. EMI is also minimized due to lower frequency crystal. No
external components are needed for the operation of the PLL.
SoftConnect
The connection to the USB is accomplished by bringing D+ (for
high-speed USB device) high through a 1.5 kW pull-up resistor. In
the PDIUSBD11, the 1.5 kW pull-up resistor is integrated on-chip
and is not connected to VCC by default. The connection of the
internal resistor to Vcc is established through a command sent by
the external/system microcontroller. This allows the system
microcontroller to complete its initialization sequence before
deciding to establish connection to the USB. Re-initialization of the
USB bus connection can also be affected without requiring the pull
out of the cable.
Bit Clock Recovery
The bit clock recovery circuit recovers the clock from the incoming
USB data stream using 4X over-sampling principle. It is able to track
jitter and frequency drift specified by the USB specification.
Philips Serial Interface Engine (PSIE)
The Philips SIE implements the full USB protocol layer. It is
completely hardwired for speed and needs no firmware intervention.
The functions of this block include: synchronization pattern
recognition, parallel/serial conversion, bit stuffing/de-stuffing, CRC
checking/generation, PID verification/generation, address
recognition, handshake evaluation/generation.
The PDIUSBD11 will check for USB VBUS availability before the
connection can be established. VBUS sensing is provided through
VBUS pin.
It should be noted that the tolerance of the internal resistors is
higher (30%) than that specified by the USB specification (5%).
However, the overall VSE voltage specification for the connection
can still be met with good margin. The decision to make sure of this
feature lies with the users.
Memory Management Unit (MMU) and Integrated
RAM
The MMU and the integrated RAM is used to handle the large
difference in data rate between USB, running in bursts of 12 Mbit/s
and the I2C interface to the microcontroller, running at up to 1 Mbit/s.
This allows the microcontroller to read and write USB packets at its
own speed through I2C.
SoftConnect is a patent pending technology from Philips
Semiconductors.
ENDPOINT DESCRIPTIONS
ENDPOINT#
0
1
2
3
ENDPOINT INDEX
TRANSFER TYPE
2
Control
3
5
Generic
4
6
Generic
7
8
Generic
9
NOTE:
1. Generic endpoint can be used for Interrupt or Bulk endpoint.
1999 Jul 22
3
DIRECTION
MAX
PACKET SIZE
(BYTES)
OUT
8
IN
8
OUT
8
IN
8
OUT
8
IN
8
OUT
8
IN
8
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
PIN DESCRIPTION
PIN NO
PIN SYMBOL
TYPE
1
TEST
Input
2
RESET_N
Input
3
XTAL1
Input
4
XTAL2
Output
5
CLKOUT
Output
DRIVE
DESCRIPTION
Connect to GND for normal operation
ST
Power-on reset
Crystal connection 1 (12MHz)
Crystal connection 2 (12MHz)
3 mA
Programmable output clock for external devices
6
VCC
Power
7
SUSPEND
Output
OD6
Voltage supply 3.3V±0.3V
Device is in suspended state
8
INT_N
Output
OD6
Connect to microcontroller interrupt
9
SDA
I/O
OD6
I2C bi-directional data
10
SCL
I/O
OD6
I2C bit-clock
11
GND
Power
12
DP
AI/O
Ground reference
USB D+ connection
13
DM
AI/O
USB D– connection
14
AGND
Power
Analog ground reference
15
AVCC
Power
Analog voltage supply 3.3V±0.3V
16
VBUS
Input
USB VBUS sensing pin
NOTES:
1. Signals ending in _N indicate active LOW signals.
ST: Schmitt Trigger
OD6: Open Drain with 6 mA drive
AI/O: Analog I/O
APPLICATION DIAGRAM
3.3V
USB Upstream
12 MHz
CLKOUT
I2C
µC
D11
FUNCTIONAL BLOCK
e.g. Monitor Control, Mouse, Keyboard, ...
SV00824
1999 Jul 22
4
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
I2C Interface
Protocol
The I2C bus is used to interface to an external microcontroller
needed to control the operation of the USB device. For cost
consideration, the target system microcontroller can be shared and
utilized for both the functional part as well as the USB protocol
interfacing. The PDIUSBD11 implements a slave I2C interface.
When the PDIUSBD11 needs to communicate with the
microcontroller it asserts an interrupt signal. The microcontroller
services this interrupt by reading the appropriate status register on
the PDIUSBD11 through the I2C bus. (For more information about
the I2C serial bus, refer to the I 2C Handbook, Philips order number
9397 750 00013).
An I2C transaction starts with a Start Condition, followed by an
address. When the address matches either the command or data
address the transaction starts and runs until a Stop Condition or
another Start Condition (repeated start) occurs.
The command address is write-only and is unable to do a read. The
next bytes in the message are interpreted as commands. Several
command bytes can be sent after one command address. Each of
the command bytes is acknowledged and passed on to the Memory
Management Unit inside the PDIUSBD11.
When the Start Condition address matches the data address, the
next bytes are interpreted as data. When the RW bit in the address
indicates a master writes data to slave (=‘0’) the bytes are received,
acknowledged and passed on to the Memory Management Unit. If
the RW bit in the address indicates a master reads data from slave
(=‘1’) the PDIUSBD11 will send data to the master. The I2C-master
must acknowledge all data bytes except the last one. In this way the
I2C interface knows when the last byte has been transmitted and it
then releases the SDA line so that the master controller can
generate the Stop Condition.
The I2C interface on the PDIUSBD11 defines two types of
transactions:
• command transaction
– A command transaction is used to
define which data (e.g., status byte, buffer data, ...) will be read
from/written to the USB interface in the next data transaction. A
data transaction usually follows a command transaction.
• data transaction
– A data transaction reads data from/writes
data to the USB interface. The meaning of the data is dependent
on the command transaction which was sent before the data
transaction.
Repeated start support allows another packet to be sent without
generating a Stop Condition.
Timing
Two addresses are used to differentiate between command and
data transactions. Writing to the command address is interpreted as
a command, while reading from/writing to the data address is used
to transfer data between the PDIUSBH11A and the controller.
The I2C interface in the PDIUSBD11 can support clock speeds up to
1 MHz.
ADDRESS TABLE
Type of Address
Physical Address
MSB to LSB
(Binary)
Command
0011 011
Data
0011 010
1999 Jul 22
5
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
COMMAND SUMMARY
Some commands have the same command code (e.g., Read Buffer and Write Buffer). In these cases, the direction of the Data Phase (read or
write) indicates which command is executed.
COMMAND NAME
RECIPIENT
CODING
DATA PHASE
Initialization Commands
Set Address/Enable
Function
D1h
Write 1 byte
Set Endpoint Enable
Function
D8h
Write 1 byte
Set Mode
Function
F3h
Write 2 byte
F4h
Read 2 bytes
00h
Read 1 byte (optional)
01h
Read 1 byte (optional)
00h+Endpoint Index
Read 1 byte (optional)
Data Flow Commands
Read Interrupt Register
Select Endpoint
Control OUT Endpoint
Control IN Endpoint
Other Endpoints
Read Last Transaction Status
Control OUT Endpoint
40h
Read 1 byte
Control IN Endpoint
41h
Read 1 byte
40h+Endpoint Index
Read 1 byte
Control OUT Endpoint
80h
Read 1 byte
Control IN Endpoint
81h
Read 1 byte
Other Endpoints
Read Endpoint Status
80h+Endpoint Index
Read 1 byte
Read Buffer
Other Endpoints
Selected Endpoint
F0h
Read n bytes
Write Buffer
Selected Endpoint
F0h
Write n bytes
Set Endpoint Status
Control OUT Endpoint
40h
Write 1 byte
Set Endpoint Status
Control IN Endpoint
41h
Write 1 byte
40h+Endpoint Index
Write 1 byte
Other Endpoints
Acknowledge Setup
Selected Endpoint
F1h
None
Clear Buffer
Selected Endpoint
F2h
None
Validate Buffer
Selected Endpoint
FAh
None
Send Resume
F6h
None
Read Current Frame Number
F5h
Read 1 or 2 bytes
General Commands
1999 Jul 22
6
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
COMMAND DESCRIPTIONS
Set Mode
Command Procedure
Command
: F3h
There are three basic types of commands: Initialization, Data Flow,
and General commands. Respectively, these are used to initialize
the function; for data flow between the function and the host; and
some general commands.
Data
: Write 2 bytes
The Set Mode command is followed by two data writes. The first
byte contains the configuration byte values. The second byte is the
clock division factor byte.
Initialization Commands
Configuration Byte
Initialization commands are used during the enumeration process of
the USB network. These commands are used to enable the function
endpoints. They are also used to set the USB assigned address.
7
1
6
X
5
X
4
0
3
1
2
1
1
0
Set Address / Enable
0
1
POWER ON VALUE
REMOTE WAKEUP
Command
: D1h, (Function)
Data
: Write 1 byte
NO LAZYCLOCK
CLOCK RUNNING
DEBUG MODE
SoftConnect
This command is used to set the USB assigned address and enable
the function.
RESERVED; WRITE 0
FUTURE MODE
SV00827
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
POWER ON VALUE
Remote Wakeup
A ‘1’ indicates that a remote wakeup feature is
ON. Bus reset will set this bit to ‘1’.
No LazyClock
A ‘1’ indicates that CLKOUT will not switch to
LazyClock. A ‘0’ indicates that the CLKOUT
switches to LazyClock 1ms after the Suspend
pin goes high. LazyClock frequency is 30KHz
±40%. The programmed value will not be
changed by a bus reset.
Clock Running
A ‘1’ indicates that the internal clocks and PLL
are always running even during Suspend state.
A ‘0’ indicates that the internal clock, crystal
oscillator and PLL are stopped whenever not
needed. To meet the strict Suspend current
requirement, this bit needs to be set to ‘0’. The
programmed value will not be changed by a bus
reset.
Debug Mode
A ‘1’ indicates that all errors and “NAKing” are
reported and a ‘0’ indicates that only OK and
babbling are reported. The programmed value
will not be changed by a bus reset.
SoftConnect
A ‘1’ indicates that the upstream pull-up resistor
will be connected if VBUS is available. A ‘0’
means that the upstream resistor will not be
connected. The programmed value will not be
changed by a bus reset.
FutureMode
Write a ‘1’.
ADDRESS
ENABLE
SV00825
Address
The value written becomes the address.
Enable
A ‘1’ enables this function.
Set Endpoint Enable
Command
: D8h
Data
: Write 1 byte
The generic endpoints can only be enabled when the function is
enabled via the Set Address/Enable command.
7
X
6
X
5
X
4
X
3
X
2
X
1
0
0
X
POWER ON VALUE
RESERVED; WRITE 0
FUNCTION GENERIC ENDPOINTS
RESERVED; WRITE 0
SV00826
Function Generic Endpoint
1999 Jul 22
A value of ‘1’ indicates the
function generic endpoints are
enabled.
7
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
Interrupt Register Byte 2
Clock Division Factor Byte
7
X
6
X
5
X
4
X
3
1
2
0
1
1
0
1
7
X
POWER ON VALUE
6
0
5
X
4
X
3
X
2
X
1
0
0
0
POWER ON VALUE
CLOCK DIVISION FACTOR
ENDPOINT INDEX 8
RESERVED
ENDPOINT INDEX 9
RESERVED
SV00828
Clock Division Factor
BUS RESET
RESERVED
The value indicates clock division factor for
CLKOUT. The output frequency is
48 MHz/(N+1) where N is the Clock Division
Factor. The reset value is 11. This will
produce the output frequency of 4 MHz
which can then be programmed up (or down)
by the user. The minimum value is one giving
the range of frequency from 4 to 24 MHz.
The PDIUSBD11 design ensures no
glitching during frequency change. The
programmed value will not be changed by a
bus reset.
SV00830
Select Endpoint
Command
: 00-0Dh
Data
: Optional Read 1 byte
The Select Endpoint command initializes an internal pointer to the
start of the Selected buffer. Optionally, this command can be
followed by a data read, which returns ‘0’ if the buffer is empty and
‘1’ if the buffer is full.
Data Flow Commands
7
X
Data flow commands are used to manage the data transmission
between the USB endpoints and the monitor. Much of the data flow
is initiated via an interrupt to the microcontroller. The microcontroller
utilizes these commands to access and determine whether the
endpoint FIFOs have valid data.
Data
: Read 2 bytes
Interrupt Register Byte 1
4
0
3
0
2
0
1
X
0
X
POWER ON VALUE
RESERVED
CONTROL OUT ENDPOINT
CONTROL IN ENDPOINT
ENDPOINT INDEX 4
ENDPOINT INDEX 5
ENDPOINT INDEX 6
ENDPOINT INDEX 7
SV00829
This command indicates the origin of an interrupt. A ‘1’ indicates an
interrupt occurred at this endpoint. The bits are cleared by reading
the endpoint status register through the Read Endpoint Status
command.
After a bus reset, an interrupt will be generated and bit 6 of the
Interrupt Register Byte 2 will be ‘1’. The interrupt is internally cleared
by reading the interrupt register. A bus reset is completely identical
to the hardware reset through the RESET_N pin with the sole
difference of interrupt notification.
1999 Jul 22
3
X
2
X
1
X
0
0
POWER ON VALUE
RESERVED
Full/Empty
: F4h
5
0
4
X
SV00831
Command
6
0
5
X
FULL/EMPTY
Read Interrupt Register
7
0
6
X
8
A ‘1’ indicates the buffer is full, ‘0’ indicates an
empty buffer.
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
Read Last Transaction Status
Read Endpoint Status
Command
: 40–4Dh
Command
: 80–8Dh
Data
: Read 1 byte
Data
: Read 1 byte
The Read Last Transaction Status command is followed by one data
read that returns the status of the last transaction of the endpoint.
This command also resets the corresponding interrupt flag in the
interrupt register, and clears the status, indicating that it was read.
7
X
6
X
5
0
4
0
3
0
6
0
5
0
4
0
3
0
2
0
1
0
1
X
0
X
POWER ON VALUE
RESERVED
This command is useful for debugging purposes. Since it keeps
track of every transaction, the status information is overwritten for
each new transaction.
7
0
2
0
SETUP PACKET
STALL
DATA 0/1 PACKET
BUFFER FULL
0
0
POWER ON VALUE
RESERVED
DATA RECEIVE/TRANSMIT SUCCESS
SV00833
ERROR CODE (SEE TABLE)
SETUP PACKET
DATA 0/1 PACKET
PREVIOUS STATUS NOT READ
SV00832
Data Receive/
Transmit Success
A ‘1’ indicates data has been received
or transmitted successfully.
Setup Packet
A ‘1’ indicates the last received packet had a
SETUP token.
STALL
A ‘1’ indicates the endpoint is stalled.
Data 0/1 Packet
A ‘1’ indicates if the last received or sent packet
had a DATA1 PID.
Buffer Full
A ‘1’ indicates that the buffer is full.
Read Buffer
Error Code
See Table 1, Error Codes.
Setup Packet
A ‘1’ indicates the last successful
received packet had a SETUP token
(this will always read ‘0’ for IN buffers).
Command
: F0h
Data
: Read multiple bytes (max 10)
Data 0/1 Packet
A ‘1’ indicates the last successful
received or sent packet had a DATA1
PID.
The Read Buffer command is followed by a number of data reads,
which return the contents of the selected endpoint data buffer. After
each read, the internal buffer pointer is incremented by 1.
Previous Status not Read
A ‘1’ indicates a second event occurred
before the previous status was read.
The buffer pointer is not reset to the buffer start by the Read Buffer
command. This means that reading or writing a buffer can be
interrupted by any other command (except for Select Endpoint), or
can be done by more than one I2C transaction (read the first 2 bytes
to get the number of data bytes, then read the rest in other
transactions).
Table 1. ERROR CODES
ERROR
CODE
RESULT
0000
No Error
0001
PID encoding Error; bits 7–4 are not the inversion of
bits 3–0
0010
PID unknown; encoding is valid, but PID does not exist
0011
Unexpected packet; packet is not of the type expected
(= token, data or acknowledge), or SETUP token to a
non-control endpoint
0100
Token CRC Error
0101
Data CRC Error
0110
Time Out Error
0111
Babble Error
1000
Unexpected End-of-packet
1001
Sent or received NAK
1010
Sent Stall, a token was received, but the endpoint was
stalled
1011
Overflow Error, the received packet was longer than
the available buffer space
1101
Bitstuff Error
1111
Wrong DATA PID; the received DATA PID was not the
expected one
1999 Jul 22
The data in the buffer are organized as follows:
• byte 0:
• byte 1:
• byte 2:
• byte 3:
Reserved: can have any value
Number/length of data bytes
Data byte 1
Data byte 2
......
Write Buffer
Command
: F0h
Data
: Write multiple bytes (max 10)
The Write Buffer command is followed by a number of data writes,
which load the endpoints buffer. The data must be organized in the
same way as described in the Read Buffer command. The first byte
(reserved) should always be ‘0’. As in the Read Buffer command,
the data can be split up into different I2C data transactions.
WARNING:
There is no protection against writing or reading over a buffer’s
boundary or against writing into an OUT buffer or reading from an IN
buffer. Any of these actions could cause an incorrect operation. Data
in an OUT buffer are only meaningful after a successful transaction.
9
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
Clear Buffer
Acknowledge Setup
Command
: F2h
Command
: F1h
Data
: None
Data
: None
When a packet is received completely, an internal endpoint buffer
full flag is set. All subsequent packets will be refused by returning a
NAK. When the microcontroller has read the data, it should free the
buffer by the Clear Buffer command. When the buffer is cleared,
new packets will be accepted.
The arrival of a SETUP packet flushes the IN buffer and disables the
Validate Buffer and Clear Buffer commands for both IN and OUT
endpoints.
The microcontroller needs to re-enable these commands by the
Acknowledge Setup command. This ensures that the last SETUP
packet stays in the buffer and no packet can be sent back to the
host until the microcontroller has acknowledged explicitly that it has
seen the SETUP packet.
Validate Buffer
Command
: FAh
Data
: None
The microcontroller must send the Acknowledge Setup command to
both the IN and OUT endpoints.
When the microprocessor has written data into an IN buffer, it should
set the buffer full flag by the Validate Buffer command. This indicates
that the data in the buffer are valid and can be sent to the host when
the next IN token is received.
GENERAL COMMANDS
Send Resume
Set Endpoint Status
Command
: 40–4Dh
Data
: Write 1 byte
4
X
3
X
2
X
1
X
0
0
Command
: F5h
Data
: Read One or Two Bytes
This command is followed by one or two data reads and returns the
frame number of the last successfully received SOF. The frame
number is returned Least Significant Byte first.
Even when unstalled, writing Set Endpoint Status to ‘0’ initializes the
endpoint.
5
X
: None
Read Current Frame Number
When a stalled endpoint is unstalled (either by the Set Endpoint
Status command or by receiving a SETUP token), it is also
re-initialized. This flushes the buffer and if it is an OUT buffer it waits
for a DATA 0 PID, if it is an IN buffer it writes a DATA 0 PID.
6
X
: F6h
Data
Sends an upstream resume signal for 10 ms. This command is
normally issued when the device is in suspend. The RESUME
command is not followed by a data read or write.
A stalled control endpoint is automatically unstalled when it receives
a SETUP token, regardless of the content of the packet. If the
endpoint should stay in its stalled state, the microcontroller can
re-stall it.
7
X
Command
POWER ON VALUE
7
X
6
X
5
X
4
X
3
X
2
X
1
X
0
X
LEAST SIGNIFICANT BYTE
7
X
6
X
5
X
4
X
3
X
2
X
1
X
0
X
MOST SIGNIFICANT BYTE
STALLED
RESERVED
SV00834
Stalled
1999 Jul 22
SV00835
A ‘1’ indicates the endpoint is stalled.
10
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
PARAMETER
TEST CONDITIONS
MAX
UNIT
3.0
3.6
V
DC input voltage range
0
5.5
V
VI/O
DC input voltage range for I/O
0
5.5
V
VAI/O
DC input voltage range for analog I/O
0
VCC
V
DC output voltage range
0
VCC
V
–40
85
°C
VI
VO
Tamb
DC supply voltage
MIN
Operating ambient temperature range in free air
See DC and AC characteristics per device
ABSOLUTE MAXIMUM RATINGS1
SYMBOL
VCC
PARAMETER
TEST CONDITIONS
DC supply voltage
IIK
DC input diode current
VI < 0
VI
DC input voltage
Note 2
VI/O
DC input voltage range for I/O
IOK
DC output diode current
VO > VCC or VO < 0
VO
DC output voltage
Note 2
IO
DC output sink or source current for other pins
VO = 0 to VCC
IO
DC output sink or source current for D+/D– pins
VO = 0 to VCC
IGND, ICC
MIN
MAX
–0.5
+4.6
V
–50
mA
–0.5
+5.5
V
–0.5
VCC + 0.5
V
±50
mA
–0.5
DC VCC or GND current
TSTG
Storage temperature range
PTOT
Power dissipation per package
–60
UNIT
VCC + 0.5
V
±15
mA
±50
mA
±100
mA
+150
°C
NOTES:
1. Stresses beyond those listed may cause damage to the device. These are stress ratings only and functional operation of the device at these
or any other conditions beyond those listed in the RECOMMENDED OPERATING CONDITIONS table is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC CHARACTERISTICS (Digital pins)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
0.6
V
Input Levels
VIL
LOW level input voltage
VIH
HIGH level input voltage
2.7
V
VTLH
LOW to HIGH threshold voltage
ST (Schmitt Trigger) pins
1.4
1.9
V
VTHL
HIGH to LOW threshold voltage
ST pins
0.9
1.5
V
VHYS
Hysteresis voltage
ST pins
0.4
0.7
V
IOL = rated drive
0.4
V
IOL = 20 µA
0.1
V
Output Levels
VOL
O
VOH
O
LOW level output voltage
HIGH level output voltage
IOH = rated drive
IOH = 20 µA
2.4
V
VCC – 0.1
V
Leakage Current
IOZ
IL
OFF state current
OD (Open Drain) pins
Input leakage current
IS
Suspend current
Oscillator stopped &
inputs to GND/VCC
IO
Operating current
I2C operating
1999 Jul 22
11
10
±5
µA
±5
µA
15
µA
mA
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
DC CHARACTERISTICS (AI/O pins)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
±10
µA
Leakage Current
ILO
Hi-Z state data line leakage
0V < VIN < 3.3V
VDI
Differential input sensitivity
|(D+) – (D–)|1
0.2
VCM
Differential common mode range
Includes VDI range
0.8
2.5
V
VSE
Single-ended receiver threshold
0.8
2.0
V
0.3
V
3.6
V
20
pF
Input Levels
V
Output Levels
VOL
Static output LOW
RL of 1.5kW to 3.6V
VOH
Static output HIGH
RL of 15kW to GND
Transceiver capacitance
Pin to GND
2.8
Capacitance
CIN
Output Resistance
ZDRV2
Driver output resistance
Steady state drive
29
44
W
Integrated Resistance
ZPU
Pull-up resistance
SoftConnect = ON
1.1
1.9
kW
ZPD
Pull-down resistance
Pull-down = ON
11
19
kW
NOTES:
1. D+ is the symbol for the USB positive data pin: DP.
D– is the symbol for the USB negative data pin: DM.
2. Includes external resistors of 22 W ± 1% each on D+ and D–.
LOAD FOR D+/D–
UPSTREAM: 1.5kW IS INTERNAL
VCC
TEST POINT
1.5kW*
S1
22W
D. U. T.
15kW
CL = 50pF, FULL SPEED
CL = 50PF, LOW SPEED (MIN TIMING)
CL = 350PF, LOW SPEED (MAX TIMING)
* 1.5kW ON D– (LOW SPEED) OR D+ (FULL SPEED) ONLY
CL
TEST
S1
D–/LS
D+/LS
D–/FS
D+/FS
CLOSE
OPEN
OPEN
CLOSE
SV00836
1999 Jul 22
12
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
AC CHARACTERISTICS (AI/O pins, FULL speed)
SYMBOL
PARAMETER
Driver characteristics
tr
tf
TEST CONDITIONS
MIN
MAX
UNIT
Between 10% and 90%
4
4
20
20
ns
ns
(tr/tf)
90
110
%
1.3
2.0
V
CL = 50 pF;
Rpu = 1.5 kW on D+ to VCC
Transition Time:
Rise time
Fall time
tRFM
Rise/fall time matching
VCRS
Output signal crossover voltage
Driver Timings
tEOPT
Source EOP width
Figure 1
160
175
ns
tDEOP
Differential data to EOP transition skew
Figure 1
–2
5
ns
–18.5
–9
18.5
9
ns
ns
Receiver Timings
tJR1
tJR2
tEOPR1
tEOPR2
Receiver Data Jitter Tolerance
To next transition
For paired transitions
EOP Width at Receiver
Must reject as EOP
Must accept
Characterized and not tested.
G
Guaranteed
t d by
b design.
d i
Figure 1
40
82
ns
ns
tPERIOD
CROSSOVER POINT
EXTENDED
CROSSOVER POINT
DIFFERENTIAL
DATA LINES
SOURCE EOP WIDTH: tEOPT
DIFFERENTIAL DATA TO
SEO/EOP SKEW
N * tPERIOD + tDEOP
RECEIVER EOP WIDTH: tEOPR1, tEOPR2
SV00837
Figure 1. Differential data to EOP transition skew and EOP width
1999 Jul 22
13
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
AC CHARACTERISTICS (I2C pins)
All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and VIH with an input voltage
swing of VSS and VDD.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
MAX
UNIT
1000
kHz
FSCL
SCL clock frequency
tBUF
Bus free time
0.5
ms
tSU;STA
Start condition set-up time
0.25
ms
tHD;STA
Start condition hold time
0.25
ms
tLOW
SCL LOW time
0.45
ms
tHIGH
SCL HIGH time
0.45
ms
tr
SCL and SDA rise time
0.3
ms
tf
SCL and SDA fall time
0.1
ms
tSU;DAT
Data set-up time
tHD;DAT
Data hold time
100
tVD;DAT
SCL LOW to data out valid
tSU;STO
Stop condition set-up time
BIT 7
MSB
(A7)
START
CONDITION
(S)
tLOW
BIT 0
LSB
(R/W)
BIT 6
(A6)
I 2C-bus
and how to use it”. This brochure may
ACKNOWLEDGE
(A)
STOP
CONDITION
(P)
tHIGH
1/fSCL
SCL
tr
tBUF
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD:DAT
tSU;STO
SV00756
Figure 2.
1999 Jul 22
I2C-bus
14
timing diagram
ms
ms
0.25
A detailed description of the
specification, with applications, is given in the brochure “The
be ordered using the Philips order number 9398 393 40011.
tSU;STA
ns
0.4
I2C-bus
PROTOCOL
ns
0
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
SO16: plastic small outline package; 16 leads; body width 7.5 mm
1999 Jul 22
15
SOT162-1
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
DIP16: plastic dual in-line package; 16 leads (300 mil)
1999 Jul 22
16
SOT38-4
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
SOLDERING
Introduction
This text gives a very brief insight to a complex technology. A more
in-depth account of soldering ICs can be found in our “Data
Handbook IC26; Integrated Circuit Packages” (document order
number 9398 652 90011).
WAVE SOLDERING
Conventional single-wave soldering is not recommended for surface
mount devices (SMDs) or printed-circuit boards with a high
component density, as solder bridging and non-wetting can present
major problems.
There is no soldering method that is ideal for all IC packages. Wave
soldering is often preferred when through-hole and surface mount
components are mixed on one printed circuit board. However, wave
soldering is not always suitable for surface mount ICs, or for
printed-circuit boards with high population densities. In these
situations, reflow soldering is often used.
To overcome these problems, the double-wave soldering method
was specifically developed.
If wave soldering is used, the following conditions must be observed
for optimal results:
• Use a double-wave soldering method comprising a turbulent wave
Through-hole mount packages
with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
SOLDERING BY DIPPING OR BY SOLDER WAVE
– larger than or equal to 1.27 mm, the footprint longitudinal axis
is preferred to be parallel to the transport direction of the
printed-circuit board;
The maximum permissible temperature of the solder is 260°C;
solder at this temperature must not be in contact with the joints for
more than 5 seconds. The total contact time of successive solder
waves must not exceed 5 seconds.
– smaller than 1.27 mm, the footprint longitudinal axis must be
parallel to the transport direction of the printed-circuit board.
The device may be mounted up to the seating plane, but the
temperature of the plastic body must not exceed the specified
maximum storage temperature (Tstg(max)). If the printed-circuit board
has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
The footprint must incorporate solder thieves at the downstream
end.
• For packages with leads on four sides, the footprint must be
placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate solder thieves
downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the package,
either below the seating plane or not more than 2 mm above it. If the
temperature of the soldering iron bit is less than 300°C, it may
remain in contact for up to 10 seconds. If the bit temperature is
between 300 and 400°C, contact may be made for up to 5 seconds.
During placement, and before soldering, the package must be fixed
with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be
soldered after the adhesive has cured.
Surface mount packages
Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will
eliminate the need for removal of corrosive residues in most
applications.
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of fine solder
particles, flux and binding agent) to be applied to the printed-circuit
board by screen printing, stencilling or pressure-syringe dispensing
before package placement.
MANUAL SOLDERING
Fix the component by first soldering two diagonally-opposite end
leads. Use a low-voltage (24 V or less) soldering iron applied to the
flat part of the lead. Contact time must be limited to 10 seconds at
up to 300°C.
Several methods exist for reflowing; for example, infrared/convection
heating in a conveyor-type oven. Throughput times (preheating,
soldering and cooling) vary between 100 and 200 seconds,
depending on heating method.
When using a dedicated tool, all other leads can be soldered in one
operation within 2 to 5 seconds between 270 and 320°C.
Typical reflow peak temperatures range from 215 250°C. The
top-surface temperature of the packages should preferably be kept
below 230°C.
1999 Jul 22
17
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
SUITABILITY OF IC PACKAGES FOR WAVE, REFLOW AND DIPPING SOLDERING METHODS
Soldering Method
Mo nting
Mounting
Through-hole mount
Package
DBS, DIP, HDIP, SDIP, SIL
BGA, SQFP,
HLQFP, HSQFP, HSOP, SMS
Surface mount
PLCC, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Reflow 1
Dipping
suitable 2
–
suitable
not suitable
suitable
–
suitable
–
Wave
not
suitable 3
suitable
suitable
–
not recommended 4, 5
suitable
–
not recommended 6
suitable
–
NOTES:
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to
time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in
them (the so-called “popcorn” effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages;
Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version)
cannot be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must
incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP, and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pith (e) equal to or larger than 0.65 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Jul 22
18
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
NOTES
1999 Jul 22
19
Philips Semiconductors
Product specification
USB device with serial interface
PDIUSBD11
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 07-99
Document order number:
1999 Jul 22
20
9397–750–06219