DICE/DWF SPECIFICATION RH137 Negative Adjustable Regulator This pad is NO CONNECT on H Package PAD FUNCTION 4 2 3 3 1. 2. 3. 4. DIE CROSS REFERENCE ADJUST OUTPUT INPUT OUTPUT SENSE (CONNECT TO OUTPUT) 2 LTC Finished Part Number RH137K RH137K RH137H RH137H Order DICE CANDIDATE Part Number Below RH137K DICE RH137K DWF RH137H DICE RH137H DWF Please refer to LTC standard product data sheet for other applicable product information. *DWF = DICE in wafer form. 1 L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. 85mils × 89mils DICE ELECTRICAL TEST LIMITS (Note 1) TA = 25°C MIN MAX –1.225 –1.200 –1.275 –1.300 UNITS SYMBOL PARAMETER CONDITIONS VREF Reference Voltage |VIN – VOUT| = 5V, IOUT = 10mA 3V ≤ |VIN – VOUT| ≤ 30V, 10mA ≤ IOUT ≤ 200mA P ≤ PMAX ΔVOUT ΔVIN Line Regulation 3V ≤ |VIN – VOUT| ≤ 30V 0.02 %/V ΔVOUT ΔIOUT Load Regulation 10mA ≤ IOUT ≤ IMAX, |VOUT| ≤ 5V (Note 2) 10mA ≤ IOUT ≤ IMAX, |VOUT| ≥ 5V (Note 2) 25 0.5 mV % IADJ Adjust Pin Current 100 μA ΔIADJ Adjust Pin Current Change 10mA ≤ IOUT ≤ IMAX 3V ≤ |VIN – VOUT| ≤ 30V 5 5 μA μA IMIN Minimum Load Current |VIN – VOUT| = 30V |VIN – VOUT| = 3V 5 3 mA mA Current Limit |VIN – VOUT| ≤ 15V H Package K Package 0.5 1.5 A A |VIN – VOUT| = 30V H Package K Package 0.15 0.24 A A Note 1: Dice are probe tested at 25°C to the limits shown except for high current tests. Dice are tested under low current conditions which assure full load current specifications when assembled in packaging systems approved by Linear Technology. For absolute maximum ratings, typical specifications, performance curves and finished product specifications, please refer to the standard product RH data sheet. V V Note 2: Testing is done using a pulsed low duty cycle technique. See thermal regulation specifications for output changes due to heating effects. Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 1 DICE/DWF SPECIFICATION RH137 Rad Hard die are susceptible to surface damage because there is no silicon nitride passivation as on standard die. Silicon nitride protects the die surface from scratches by its hard and dense properties. The passivation on Rad Hard die is silicon dioxide that is much “softer” than silicon nitride. the die around from the chip tray, use a Teflon-tipped vacuum wand. This wand can be made by pushing a small diameter Teflon tubing onto the tip of a steel-tipped wand. The inside diameter of the Teflon tip should match the die size for efficient pickup. The tip of the Teflon should be cut square and flat to ensure good vacuum to die surface. Ensure the Teflon tip remains clean from debris by inspecting under stereoscope. LTC recommends that die handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move During die attach, care must be exercised to ensure no tweezers touch the top of the die. Rad Hard die require special handling as compared to standard IC chips. Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production. I.D.No. 66-13-0136 2 Linear Technology Corporation LT 1111 REV B • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 1998