INFINEON XC2787X

16/32-Bit
Architecture
XC2787X
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2000 Family Derivatives / High Line
Data Sheet
V1.2 2010-09
Microcontrollers
Edition 2010-09
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
16/32-Bit
Architecture
XC2787X
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2000 Family Derivatives / High Line
Data Sheet
V1.2 2010-09
Microcontrollers
XC2787X
XC2000 Family Derivatives / High Line
XC2787X Data Sheet
Revision History: V1.2 2010-09
Previous Versions:
V1.1, 2010-02 Preliminary
Page
Subjects (major changes since last revision)
various
Superset symbol VDDI removed. Replaced by VDDIM and VDDI1.
50
ID codes updated: SCU_IDCHIP, SCU_IDMEM, JTAG_ID
83
Parameter VDDI removed from absolute maximum ratings. VDDIM and VDDI1
voltages are generated internally.
84
Parameter VDDI min/max values replaced by VDDIM and VDDI1 typical values.
Type of parameter changed from SR to CC. VDDIM and VDDI1 voltages are
generated internally.
103
Min/Max values for fWU added. Typical values removed.
103
Reference frequency for tSSO corrected to fWU
106
Clarified the number of flash erase cycles - NER - description. Minimum data
retention time tRET listed in note column.
129
Master mode upper voltage range values for t1, t2 and t3 corrected
130
Master mode lower voltage range values for t1, t2, t3 and t5 corrected
130
Slave mode upper voltage range values for t11 and t14 corrected
131
Slave mode lower voltage range values for t10, t11, t12, t13 and t14 corrected
143
Added section “Quality Declarations”
Trademarks
C166™, TriCore™ and DAVE™ are trademarks of Infineon Technologies AG.
We Listen to Your Comments
Is there any information in this document that you feel is wrong, unclear or missing?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
[email protected]
Data Sheet
4
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Table of Contents
Table of Contents
1
1.1
1.2
1.3
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Basic Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Special Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Definition of Feature Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
2.1
2.2
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Bus Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Protection Unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Checker Module (MCHK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Units (CC1 and CC2) . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Units CCU6x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Universal Serial Interface Channel Modules (USIC) . . . . . . . . . . . . . . . . .
MultiCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4
4.1
4.1.1
4.2
4.2.1
4.3
4.3.1
4.3.2
4.3.3
4.4
4.5
4.6
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Voltage Range definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
DC Parameters for Upper Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . 90
DC Parameters for Lower Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . 92
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
System Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Data Sheet
5
51
52
56
57
59
59
60
61
62
65
67
71
73
74
76
77
77
78
79
80
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Table of Contents
4.7
4.7.1
4.7.2
4.7.2.1
4.7.2.2
4.7.2.3
4.7.3
4.7.4
4.7.5
4.7.5.1
4.7.6
4.7.7
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wakeup Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Selecting and Changing the Operating Frequency . . . . . . . . . . . . .
External Clock Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pad Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bus Cycle Control with the READY Input . . . . . . . . . . . . . . . . . . . .
Synchronous Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . .
Debug Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
108
108
109
110
113
114
115
117
121
126
129
134
5
5.1
5.2
5.3
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
140
140
142
143
Data Sheet
6
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Summary of Features
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2787X (XC2000 Family)
1
Summary of Features
For a quick overview and easy reference, the features of the XC2787X are summarized
here.
•
•
•
•
•
•
High-performance CPU with five-stage pipeline and MPU
– 10 ns instruction cycle @ 100 MHz CPU clock (single-cycle execution)
– One-cycle 32-bit addition and subtraction with 40-bit result
– One-cycle multiplication (16 × 16 bit)
– Background division (32 / 16 bit) in 21 cycles
– One-cycle multiply-and-accumulate (MAC) instructions
– Enhanced Boolean bit manipulation facilities
– Zero-cycle jump execution
– Additional instructions to support HLL and operating systems
– Register-based design with multiple variable register banks
– Fast context switching support with two additional local register banks
– 16 Mbytes total linear address space for code and data
– 1,024 Bytes on-chip special function register area (C166 Family compatible)
– Integrated Memory Protection Unit (MPU)
Interrupt system with 16 priority levels providing 112 interrupt nodes
– Selectable external inputs for interrupt generation and wake-up
– Fastest sample-rate 10 ns
Eight-channel interrupt-driven single-cycle data transfer with
Peripheral Event Controller (PEC), 24-bit pointers cover total address space
Clock generation from internal or external clock sources,
using on-chip PLL or prescaler
Hardware CRC-Checker with Programmable Polynomial to Supervise On-Chip
Memory Areas
On-chip memory modules
– 8 Kbytes on-chip stand-by RAM (SBRAM)
– 2 Kbytes on-chip dual-port RAM (DPRAM)
– 24 Kbytes on-chip data SRAM (DSRAM)
– Up to 112 Kbytes on-chip program/data SRAM (PSRAM)
– Up to 1,600 Kbytes on-chip program memory (Flash memory)
– Memory content protection through Error Correction Code (ECC)
Data Sheet
7
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Summary of Features
•
•
•
•
•
•
•
•
•
•
On-Chip Peripheral Modules
– Two synchronizable A/D Converters with up to 24 channels, 10-bit resolution,
conversion time below 1 μs, optional data preprocessing (data reduction, range
check), broken wire detection
– Two 16-channel general purpose capture/compare unit (CCx)
– Four capture/compare units for flexible PWM signal generation (CCU6x)
– Multi-functional general purpose timer unit with 5 timers
– 8 serial interface channels to be used as UART, LIN, high-speed synchronous
channel (SPI/QSPI), IIC bus interface (10-bit addressing, 400 kbit/s), IIS interface
– On-chip MultiCAN interface (Rev. 2.0B active) with 128 message objects
(Full CAN/Basic CAN) on 2 CAN nodes and gateway functionality
– On-chip system timer and on-chip real time clock
Up to 12 Mbytes external address space for code and data
– Programmable external bus characteristics for different address ranges
– Multiplexed or demultiplexed external address/data buses
– Selectable address bus width
– 16-bit or 8-bit data bus width
– Five programmable chip-select signals
Single power supply from 3.0 V to 5.5 V
Power reduction and wake-up modes
Programmable watchdog timer and oscillator watchdog
Up to 118 general purpose I/O lines
On-chip bootstrap loaders
Supported by a full range of development tools including C compilers, macroassembler packages, emulators, evaluation boards, HLL debuggers, simulators,
logic analyzer disassemblers, programming boards
On-chip debug support via Device Access Port (DAP) or JTAG interface
144-pin Green LQFP package, 0.5 mm (19.7 mil) pitch
Data Sheet
8
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Summary of Features
Ordering Information
The ordering code for an Infineon microcontroller provides an exact reference to a
specific product. This ordering code identifies:
•
•
•
the function set of the corresponding product type
the temperature range:
– SAF-…: -40°C to 85°C
– SAH-…: -40°C to 110°C
– SAK-…: -40°C to 125°C
the package and the type of delivery.
For ordering codes for the XC2787X please contact your sales representative or local
distributor.
This document describes several derivatives of the XC2787X group:
Basic Device Types are readily available and
Special Device Types are only available on request.
As this document refers to all of these derivatives, some descriptions may not apply to a
specific product, in particular to the special device types.
For simplicity the term XC2787X is used for all derivatives throughout this document.
Data Sheet
9
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Summary of Features
1.1
Basic Device Types
Basic device types are available and can be ordered through Infineon’s direct and/or
distribution channels.
Table 1
Synopsis of XC2787X Basic Device Types
1)
Derivative
Flash
Memory2)
XC2787X-200FxL 1,600
Kbytes
PSRAM3) Capt./Comp.
Modules
ADC4) Interfaces4)
Chan.
112
Kbytes
16 + 8 2 CAN Nodes,
6 Serial Chan.
CC1/2
CCU60/1/2/3
1) x is a placeholder for available speed grade in MHz. Can be 100 only.
2) Specific information about the on-chip Flash memory in Table 3.
3) All derivatives additionally provide 8 Kbytes SBRAM, 2 Kbytes DPRAM, and 24 Kbytes DSRAM.
4) Specific information about the available channels in Table 4.
Analog input channels are listed for each Analog/Digital Converter module separately (ADC0 + ADC1).
1.2
Special Device Types
Special device types are only available for high-volume applications on request.
Table 2
Synopsis of XC2787X Special Device Types
1)
Derivative
Flash
Memory2)
XC2787X-136FxL 1,088
Kbytes
PSRAM3) Capt./Comp.
Modules
ADC4)
Chan.
Interfaces4)
80
Kbytes
16 + 8
2 CAN Nodes
6 Serial Chan.
CC1/2
CCU60/1/2/3
1) x is a placeholder for available speed grade in MHz. Can be 80 or 100.
2) Specific information about the on-chip Flash memory in Table 3.
3) All derivatives additionally provide 8 Kbytes SBRAM, 2 Kbytes DPRAM, and 24 Kbytes DSRAM.
4) Specific information about the available channels in Table 4.
Analog input channels are listed for each Analog/Digital Converter module separately (ADC0 + ADC1).
Data Sheet
10
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Summary of Features
1.3
Definition of Feature Variants
The XC2787X types are offered with several Flash memory sizes. Table 3 describes the
location of the available memory areas for each Flash memory size.
Table 3
Flash Memory Allocation
Total Flash Size
Flash Area A1)
Flash Area B
Flash Area C
1,600 Kbytes
C0’0000H …
C0’EFFFH
C1’0000H …
D8’FFFFH
n.a.
1,088 Kbytes
C0’0000H …
C0’EFFFH
C1’0000H …
CF’FFFFH
D8’0000H …
D8’FFFFH
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
The XC2787X types are offered with different interface options. Table 4 lists the
available channels for each option.
Table 4
Interface Channel Association
Total Number
Available Channels / Message Objects
16 ADC0 channels
CH0 … CH15
8 ADC1 channels
CH0 … CH7
2 CAN nodes
CAN0, CAN1
128 message objects
6 serial channels
U0C0, U0C1, U1C0, U1C1, U2C0, U2C1
Data Sheet
11
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
2
General Device Information
The XC2787X series (16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance) is a part of the Infineon XC2000 Family of full-feature singlechip CMOS microcontrollers. These devices extend the functionality and performance of
the C166 Family in terms of instructions (MAC unit), peripherals, and speed. They
combine high CPU performance (up to 100 million instructions per second) with
extended peripheral functionality and enhanced IO capabilities. Optimized peripherals
can be adapted flexibly to meet the application requirements. These derivatives utilize
clock generation via PLL and internal or external clock sources. On-chip memory
modules include program Flash, program RAM, and data RAM.
VAREFVAGND VDDIM VDDI1 VDDP VSS
(2)
(1)
(1)
(4)
(9)
(4)
Port 0
8 bit
XTAL1
XTAL2
Port 1
8 bit
ESR0
ESR1
ESR2
Port 2
14 bit
Port 11
6 bit
Port 3
8 bit
Port 10
16 bit
Port 4
8 bit
Port 9
8 bit
Port 6
4 bit
Port 15
8 bit
Port 7
5 bit
Port 5
16 bit
Port 8
6 bit
TRST DAP/JTAG Debug
2 / 4 bit
2 bit
TESTM
PORST
via Port Pins
MC_HE_ LOGSYMB 144
Figure 1
Data Sheet
Logic Symbol
12
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
2.1
Pin Configuration and Definition
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
V DDPB
P8 .5
P8 .6
ESR 0
ESR 2
ESR1
PORST
XTAL1
XTA L2
P1.7
P9 .7
P1 .6
P9 .6
P1 .5
P1 0.15
P1 .4
P1 0.14
V DDI1
P9.5
P9.4
P1 .3
P1 0.13
P9 .3
P1 0.12
P1 .2
P9 .2
P1 0.11
P1 0.10
P1 .1
P1 0.9
P9 .1
P1 0.8
P9 .0
P1 .0
V DDPB
V SS
The pins of the XC2787X are described in detail in Table 5, which includes all alternate
functions. For further explanations please refer to the footnotes at the end of the table.
The following figure summarizes all pins, showing their locations on the four sides of the
package.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
LQFP-144
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
VDDP B
P3.7
P0.7
P10.7
P3.6
P10.6
P0.6
P3.5
P10.5
P3.4
P10.4
P3.3
P0.5
P10.3
P2.10
P3.2
P2.13
VDDI1
P0.4
P10.2
P3.1
P0.3
P10.1
P3.0
P10.0
P0.2
P2.9
P4.7
P2.8
P0.1
P2.7
P4.6
P4.5
P0.0
VDDP B
VSS
P5.4
P5.5
P5 .6
P5 .7
P5.8
P5.9
P5 .1 0
P5 .1 1
P5 .1 2
P5 .1 3
P5 .1 4
P5 .1 5
P2 .1 2
P2 .1 1
P1 1.5
V DDI1
P2.0
P2.1
P1 1.4
P2.2
P1 1.3
P4.0
P2.3
P1 1.2
P4.1
P2.4
P1 1.1
P1 1.0
P2.5
P4.2
P2.6
P4.4
P4.3
V DDPB
V SS
V DDPB
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
V SS
V DDPB
TESTM
P7.2
P8.4
TRST
P8.3
P7.0
P7.3
P8.2
P7.1
P7.4
P8.1
V DDI1
VDDIM
P6.0
P6.1
P6.2
P6.3
V DDPA
P15.0
P15.1
P15.2
P15.3
P15.4
P15.5
P15.6
P15.7
V ARE F1
V ARE F0
V AGND
P5.0
P5.1
P5.2
P5.3
V DDPB
MC_HE_PIN144
Figure 2
Data Sheet
XC2787X Pin Configuration (top view)
13
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Key to Pin Definitions
•
•
Ctrl.: The output signal for a port pin is selected by bit field PC in the associated
register Px_IOCRy. Output O0 is selected by setting the respective bit field PC to
1x00B, output O1 is selected by 1x01B, etc.
Output signal OH is controlled by hardware.
Type: Indicates the pad type and its power supply domain (A, B, M, 1).
– St: Standard pad
– Sp: Special pad e.g. XTALx
– DP: Double pad - can be used as standard or high speed pad
– In: Input only pad
– PS: Power supply pad
Table 5
Pin Definitions and Functions
Pin
Symbol
Ctrl.
Type Function
3
TESTM
I
In/B
4
P7.2
O0 / I St/B
Bit 2 of Port 7, General Purpose Input/Output
EMUX0
O1
Testmode Enable
Enables factory test modes, must be held HIGH for
normal operation (connect to VDDPB).
An internal pull-up device will hold this pin high
when nothing is driving it.
St/B
External Analog MUX Control Output 0 (ADC1)
CCU62_CCP I
OS0A
St/B
CCU62 Position Input 0
TDI_C
St/B
JTAG Test Data Input
If JTAG pos. C is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
Data Sheet
IH
14
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
5
P8.4
O0 / I St/B
Type Function
Bit 4 of Port 8, General Purpose Input/Output
CCU60_COU O1
T61
St/B
CCU60 Channel 1 Output
CCU62_CC6
1
St/B
CCU62 Channel 1 Output
O2
CC1_CC2
O3
St/B
CC1 Channel 2 Output
TMS_D
IH
St/B
JTAG Test Mode Selection Input
If JTAG pos. D is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
CCU62_CC6
1INB
I
St/B
CCU62 Channel 1 Input
6
TRST
I
In/B
Test-System Reset Input
For normal system operation, pin TRST should be
held low. A high level at this pin at the rising edge
of PORST activates the XC2787X’s debug
system. In this case, pin TRST must be driven low
once to reset the debug system.
An internal pull-down device will hold this pin low
when nothing is driving it.
7
P8.3
O0 / I St/B
Bit 3 of Port 8, General Purpose Input/Output
CCU60_COU O1
T60
St/B
CCU60 Channel 0 Output
CCU62_CC6
0
O2
St/B
CCU62 Channel 0 Output
TDI_D
IH
St/B
JTAG Test Data Input
If JTAG pos. D is selected during start-up, an
internal pull-up device will hold this pin low when
nothing is driving it.
CCU62_CC6
0INB
I
St/B
CCU62 Channel 0 Input
Data Sheet
15
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
8
P7.0
O0 / I St/B
Bit 0 of Port 7, General Purpose Input/Output
T3OUT
O1
St/B
GPT12E Timer T3 Toggle Latch Output
T6OUT
O2
St/B
GPT12E Timer T6 Toggle Latch Output
TDO_A
OH /
IH
St/B
JTAG Test Data Output / DAP1 Input/Output
If DAP pos. 0 or 2 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
ESR2_1
I
St/B
ESR2 Trigger Input 1
P7.3
O0 / I St/B
Bit 3 of Port 7, General Purpose Input/Output
EMUX1
O1
St/B
External Analog MUX Control Output 1 (ADC1)
9
10
11
Type Function
U0C1_DOUT O2
St/B
USIC0 Channel 1 Shift Data Output
U0C0_DOUT O3
St/B
USIC0 Channel 0 Shift Data Output
CCU62_CCP I
OS1A
St/B
CCU62 Position Input 1
TMS_C
IH
St/B
JTAG Test Mode Selection Input
If JTAG pos. C is selected during start-up, an
internal pull-up device will hold this pin low when
nothing is driving it.
U0C1_DX0F
I
St/B
USIC0 Channel 1 Shift Data Input
P8.2
O0 / I St/B
Bit 2 of Port 8, General Purpose Input/Output
CCU60_CC6
2
O1
St/B
CCU60 Channel 2 Output
TxDC1
O2
St/B
CAN Node 1 Transmit Data Output
U1C1_DOUT O3
St/B
USIC1 Channel 1 Shift Data output
CCU60_CC6
2INB
St/B
CCU60 Channel 2 Input
I
P7.1
O0 / I St/B
Bit 1 of Port 7, General Purpose Input/Output
EXTCLK
O1
St/B
Programmable Clock Signal Output
CCU62_CTR
APA
I
St/B
CCU62 Emergency Trap Input
BRKIN_C
I
St/B
OCDS Break Signal Input
Data Sheet
16
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
12
P7.4
O0 / I St/B
Bit 4 of Port 7, General Purpose Input/Output
EMUX2
13
16
Type Function
O1
St/B
External Analog MUX Control Output 2 (ADC1)
U0C1_DOUT O2
St/B
USIC0 Channel 1 Shift Data Output
U0C1_SCLK
OUT
St/B
USIC0 Channel 1 Shift Clock Output
CCU62_CCP I
OS2A
St/B
CCU62 Position Input 2
TCK_C
IH
St/B
DAP0/JTAG Clock Input
If JTAG pos. C is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
If DAP pos. 2 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
U0C0_DX0D
I
St/B
USIC0 Channel 0 Shift Data Input
U0C1_DX1E
I
St/B
USIC0 Channel 1 Shift Clock Input
P8.1
O0 / I St/B
Bit 1 of Port 8, General Purpose Input/Output
CCU60_CC6
1
O1
St/B
CCU60 Channel 1 Output
CC1_CC1
O2
St/B
CC1 Channel 1 Output
CCU60_CC6
1INB
I
St/B
CCU60 Channel 1 Input
RxDC1F
I
St/B
CAN Node 1 Receive Data Input
O3
P6.0
O0 / I DA/A Bit 0 of Port 6, General Purpose Input/Output
EMUX0
O1
DA/A External Analog MUX Control Output 0 (ADC0)
BRKOUT
O3
DA/A OCDS Break Signal Output
ADCx_REQG I
TyG
DA/A External Request Gate Input for ADC0/1
U1C1_DX0E
DA/A USIC1 Channel 1 Shift Data Input
Data Sheet
I
17
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
17
P6.1
O0 / I DA/A Bit 1 of Port 6, General Purpose Input/Output
EMUX1
O1
DA/A External Analog MUX Control Output 1 (ADC0)
T3OUT
O2
DA/A GPT12E Timer T3 Toggle Latch Output
18
19
Type Function
U1C1_DOUT O3
DA/A USIC1 Channel 1 Shift Data Output
ADCx_REQT I
RyE
DA/A External Request Trigger Input for ADC0/1
ESR1_6
DA/A ESR1 Trigger Input 6
I
P6.2
O0 / I DA/A Bit 2 of Port 6, General Purpose Input/Output
EMUX2
O1
DA/A External Analog MUX Control Output 2 (ADC0)
T6OUT
O2
DA/A GPT12E Timer T6 Toggle Latch Output
U1C1_SCLK
OUT
O3
DA/A USIC1 Channel 1 Shift Clock Output
U1C1_DX1C
I
DA/A USIC1 Channel 1 Shift Clock Input
P6.3
O0 / I DA/A Bit 3 of Port 6, General Purpose Input/Output
T3OUT
O2
DA/A GPT12E Timer T3 Toggle Latch Output
U1C1_SELO
0
O3
DA/A USIC1 Channel 1 Select/Control 0 Output
U1C1_DX2D
I
DA/A USIC1 Channel 1 Shift Control Input
ADCx_REQT I
RyF
DA/A External Request Trigger Input for ADC0/1
21
P15.0
In/A
Bit 0 of Port 15, General Purpose Input
ADC1_CH0
I
In/A
Analog Input Channel 0 for ADC1
22
P15.1
I
In/A
Bit 1 of Port 15, General Purpose Input
ADC1_CH1
I
In/A
Analog Input Channel 1 for ADC1
P15.2
I
In/A
Bit 2 of Port 15, General Purpose Input
ADC1_CH2
I
In/A
Analog Input Channel 2 for ADC1
T5INA
I
In/A
GPT12E Timer T5 Count/Gate Input
P15.3
I
In/A
Bit 3 of Port 15, General Purpose Input
ADC1_CH3
I
In/A
Analog Input Channel 3 for ADC1
T5EUDA
I
In/A
GPT12E Timer T5 External Up/Down Control
Input
23
24
Data Sheet
I
18
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
Type Function
25
P15.4
I
In/A
Bit 4 of Port 15, General Purpose Input
ADC1_CH4
I
In/A
Analog Input Channel 4 for ADC1
T6INA
I
In/A
GPT12E Timer T6 Count/Gate Input
P15.5
I
In/A
Bit 5 of Port 15, General Purpose Input
26
27
28
29
30
31
32
33
34
35
ADC1_CH5
I
In/A
Analog Input Channel 5 for ADC1
T6EUDA
I
In/A
GPT12E Timer T6 External Up/Down Control
Input
P15.6
I
In/A
Bit 6 of Port 15, General Purpose Input
ADC1_CH6
I
In/A
Analog Input Channel 6 for ADC1
P15.7
I
In/A
Bit 7 of Port 15, General Purpose Input
ADC1_CH7
I
In/A
Analog Input Channel 7 for ADC1
VAREF1
VAREF0
VAGND
-
PS/A Reference Voltage for A/D Converter ADC1
-
PS/A Reference Voltage for A/D Converter ADC0
-
PS/A Reference Ground for A/D Converters ADC0/1
P5.0
I
In/A
Bit 0 of Port 5, General Purpose Input
ADC0_CH0
I
In/A
Analog Input Channel 0 for ADC0
P5.1
I
In/A
Bit 1 of Port 5, General Purpose Input
ADC0_CH1
I
In/A
Analog Input Channel 1 for ADC0
P5.2
I
In/A
Bit 2 of Port 5, General Purpose Input
ADC0_CH2
I
In/A
Analog Input Channel 2 for ADC0
TDI_A
I
In/A
JTAG Test Data Input
P5.3
I
In/A
Bit 3 of Port 5, General Purpose Input
ADC0_CH3
I
In/A
Analog Input Channel 3 for ADC0
T3INA
I
In/A
GPT12E Timer T3 Count/Gate Input
Data Sheet
19
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
Type Function
39
P5.4
I
In/A
Bit 4 of Port 5, General Purpose Input
ADC0_CH4
I
In/A
Analog Input Channel 4 for ADC0
CCU63_T12
HRB
I
In/A
External Run Control Input for T12 of CCU63
T3EUDA
I
In/A
GPT12E Timer T3 External Up/Down Control
Input
TMS_A
I
In/A
JTAG Test Mode Selection Input
40
41
42
43
44
P5.5
I
In/A
Bit 5 of Port 5, General Purpose Input
ADC0_CH5
I
In/A
Analog Input Channel 5 for ADC0
CCU60_T12
HRB
I
In/A
External Run Control Input for T12 of CCU60
P5.6
I
In/A
Bit 6 of Port 5, General Purpose Input
ADC0_CH6
I
In/A
Analog Input Channel 6 for ADC0
P5.7
I
In/A
Bit 7 of Port 5, General Purpose Input
ADC0_CH7
I
In/A
Analog Input Channel 7 for ADC0
P5.8
I
In/A
Bit 8 of Port 5, General Purpose Input
ADC0_CH8
I
In/A
Analog Input Channel 8 for ADC0
ADC1_CH8
I
In/A
Analog Input Channel 8 for ADC1
CCU6x_T12H I
RC
In/A
External Run Control Input for T12 of
CCU60/1/2/3
CCU6x_T13H I
RC
In/A
External Run Control Input for T13 of
CCU60/1/2/3
U2C0_DX0F
I
In/A
USIC2 Channel 0 Shift Data Input
P5.9
I
In/A
Bit 9 of Port 5, General Purpose Input
ADC0_CH9
I
In/A
Analog Input Channel 9 for ADC0
ADC1_CH9
I
In/A
Analog Input Channel 9 for ADC1
CC2_T7IN
I
In/A
CAPCOM2 Timer T7 Count Input
Data Sheet
20
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
Type Function
45
P5.10
I
In/A
Bit 10 of Port 5, General Purpose Input
ADC0_CH10
I
In/A
Analog Input Channel 10 for ADC0
ADC1_CH10
I
In/A
Analog Input Channel 10 for ADC1
BRKIN_A
I
In/A
OCDS Break Signal Input
U2C1_DX0F
I
In/A
USIC2 Channel 1 Shift Data Input
CCU61_T13
HRA
I
In/A
External Run Control Input for T13 of CCU61
46
47
48
49
50
51
P5.11
I
In/A
Bit 11 of Port 5, General Purpose Input
ADC0_CH11
I
In/A
Analog Input Channel 11 for ADC0
ADC1_CH11
I
In/A
Analog Input Channel 11 for ADC1
P5.12
I
In/A
Bit 12 of Port 5, General Purpose Input
ADC0_CH12
I
In/A
Analog Input Channel 12 for ADC0
P5.13
I
In/A
Bit 13 of Port 5, General Purpose Input
ADC0_CH13
I
In/A
Analog Input Channel 13 for ADC0
CCU63_T13
HRF
I
In/A
External Run Control Input for T13 of CCU63
P5.14
I
In/A
Bit 14 of Port 5, General Purpose Input
ADC0_CH14
I
In/A
Analog Input Channel 14 for ADC0
CC1_T0IN
I
St/B
CAPCOM1 Timer T7 Count Input
P5.15
I
In/A
Bit 15 of Port 5, General Purpose Input
ADC0_CH15
I
In/A
Analog Input Channel 15 for ADC0
P2.12
O0 / I St/B
Bit 12 of Port 2, General Purpose Input/Output
U0C0_SELO
4
O1
St/B
USIC0 Channel 0 Select/Control 4 Output
U0C1_SELO
3
O2
St/B
USIC0 Channel 1 Select/Control 3 Output
READY
IH
St/B
External Bus Interface READY Input
Data Sheet
21
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
52
P2.11
O0 / I St/B
Bit 11 of Port 2, General Purpose Input/Output
U0C0_SELO
2
O1
St/B
USIC0 Channel 0 Select/Control 2 Output
U0C1_SELO
2
O2
St/B
USIC0 Channel 1 Select/Control 2 Output
U3C1_DOUT O3
St/B
USIC3 Channel 1 Shift Data Output
BHE/WRH
OH
St/B
External Bus Interf. High-Byte Control Output
Can operate either as Byte High Enable (BHE) or
as Write strobe for High Byte (WRH).
P11.5
O0 / I St/B
Bit 5 of Port 11, General Purpose Input/Output
CCU61_CC6
0
O1
St/B
CCU61 Channel 0 Output
CCU61_COU O2
T63
St/B
CCU61 Channel 3 Output
U3C1_SELO
1
O3
St/B
USIC3 Channel 1 Select/Control 1 Output
CCU61_CC6
0INB
I
St/B
CCU61 Channel 0 Input
U3C1_DX2B
I
St/B
USIC3 Channel 1 Shift Control Input
P2.0
O0 / I St/B
Bit 0 of Port 2, General Purpose Input/Output
CCU63_CC6
0
O2
St/B
CCU63 Channel 0 Output
AD13
OH /
IH
St/B
External Bus Interface Address/Data Line 13
RxDC0C
I
St/B
CAN Node 0 Receive Data Input
CCU63_CC6
0INB
I
St/B
CCU63 Channel 0 Input
T5INB
I
St/B
GPT12E Timer T5 Count/Gate Input
53
55
Data Sheet
Type Function
22
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
56
P2.1
O0 / I St/B
Bit 1 of Port 2, General Purpose Input/Output
TxDC0
O1
St/B
CAN Node 0 Transmit Data Output
CCU63_CC6
1
O2
St/B
CCU63 Channel 1 Output
AD14
OH /
IH
St/B
External Bus Interface Address/Data Line 14
CCU63_CC6
1INB
I
St/B
CCU63 Channel 1 Input
T5EUDB
I
St/B
GPT12E Timer T5 External Up/Down Control
Input
ESR1_5
I
St/B
ESR1 Trigger Input 5
P11.4
O0 / I St/B
Bit 4 of Port 11, General Purpose Input/Output
CCU61_CC6
2
O1
St/B
CCU61 Channel 2 Output
U3C1_DOUT O2
St/B
USIC3 Channel 1 Shift Data Output
CCU61_CC6
2INB
I
St/B
CCU61 Channel 2 Input
U3C1_DX0B
I
St/B
USIC3 Channel 1 Shift Data Input
P2.2
O0 / I St/B
Bit 2 of Port 2, General Purpose Input/Output
TxDC1
O1
St/B
CAN Node 1 Transmit Data Output
CCU63_CC6
2
O2
St/B
CCU63 Channel 2 Output
AD15
OH /
IH
St/B
External Bus Interface Address/Data Line 15
CCU63_CC6
2INB
I
St/B
CCU63 Channel 2 Input
ESR2_5
I
St/B
ESR2 Trigger Input 5
57
58
Data Sheet
Type Function
23
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
59
P11.3
O0 / I St/B
60
61
62
Type Function
Bit 3 of Port 11, General Purpose Input/Output
CCU61_COU O1
T63
St/B
CCU61 Channel 3 Output
CCU61_COU O2
T62
St/B
CCU61 Channel 2 Output
CCU61_T13
HRF
I
St/B
External Run Control Input for T13 of CCU61
P4.0
O0 / I St/B
Bit 0 of Port 4, General Purpose Input/Output
CC2_CC24
O3 / I St/B
CAPCOM2 CC24IO Capture Inp./ Compare Out.
CS0
OH
External Bus Interface Chip Select 0 Output
P2.3
O0 / I St/B
St/B
Bit 3 of Port 2, General Purpose Input/Output
U0C0_DOUT O1
St/B
USIC0 Channel 0 Shift Data Output
CCU63_COU O2
T63
St/B
CCU63 Channel 3 Output
CC2_CC16
O3 / I St/B
CAPCOM2 CC16IO Capture Inp./ Compare Out.
A16
OH
St/B
External Bus Interface Address Line 16
ESR2_0
I
St/B
ESR2 Trigger Input 0
U0C0_DX0E
I
St/B
USIC0 Channel 0 Shift Data Input
U0C1_DX0D
I
St/B
USIC0 Channel 1 Shift Data Input
RxDC0A
I
St/B
CAN Node 0 Receive Data Input
P11.2
O0 / I St/B
Bit 2 of Port 11, General Purpose Input/Output
CCU61_CC6
1
O1
St/B
CCU61 Channel 1 Output
U3C1_DOUT O2
St/B
USIC3 Channel 1 Shift Data Output
CCU63_CCP I
OS2A
St/B
CCU63 Position Input 2
CCU61_CC6
1INB
St/B
CCU61 Channel 1 Input
Data Sheet
I
24
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
63
P4.1
O0 / I St/B
Bit 1 of Port 4, General Purpose Input/Output
U3C0_SELO
3
O1
USIC3 Channel Select/Control 3 Output
CC2_CC25
O3 / I St/B
CAPCOM2 CC25IO Capture Inp./ Compare Out.
CS1
OH
64
65
Type Function
St/B
St/B
External Bus Interface Chip Select 1 Output
CCU62_CCP I
OS0B
St/B
CCU62 Position Input 0
T4EUDB
I
St/B
GPT12E Timer T4 External Up/Down Control
Input
ESR1_8
I
St/B
ESR1 Trigger Input 8
P2.4
O0 / I St/B
Bit 4 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
TxDC0
O2
St/B
CAN Node 0 Transmit Data Output
CC2_CC17
O3 / I St/B
CAPCOM2 CC17IO Capture Inp./ Compare Out.
A17
OH
St/B
External Bus Interface Address Line 17
ESR1_0
I
St/B
ESR1 Trigger Input 0
U0C0_DX0F
I
St/B
USIC0 Channel 0 Shift Data Input
RxDC1A
I
St/B
CAN Node 1 Receive Data Input
P11.1
O0 / I St/B
Bit 1 of Port 11, General Purpose Input/Output
CCU61_COU O1
T61
St/B
CCU61 Channel 1 Output
TxDC0
O2
St/B
CAN Node 0 Transmit Data Output
U3C1_SELO
0
O3
St/B
USIC3 Channel 1 Select/Control 0 Output
CCU63_CCP I
OS1A
St/B
CCU63 Position Input 1
CCU61_CTR
APD
I
St/B
CCU61 Emergency Trap Input
U3C1_DX2A
I
St/B
USIC3 Channel 1 Shift Control Input
Data Sheet
25
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
66
P11.0
O0 / I St/B
67
68
Type Function
Bit 0 of Port 11, General Purpose Input/Output
CCU61_COU O1
T60
St/B
CCU61 Channel 0 Output
U3C1_SCLK
OUT
St/B
USIC3 Channel 1 Shift Clock Output
CCU63_CCP I
OS0A
St/B
CCU63 Position Input 0
RxDC0F
St/B
CAN Node 0 Receive Data Input
O2
I
U3C1_DX1A
I
St/B
USIC3 Channel 1 Shift Clock Input
ESR1_7
I
St/B
ESR1 Trigger Input 7
P2.5
O0 / I St/B
Bit 5 of Port 2, General Purpose Input/Output
U0C0_SCLK
OUT
O1
St/B
USIC0 Channel 0 Shift Clock Output
TxDC0
O2
St/B
CAN Node 0 Transmit Data Output
CC2_CC18
O3 / I St/B
CAPCOM2 CC18IO Capture Inp./ Compare Out.
A18
OH
St/B
External Bus Interface Address Line 18
U0C0_DX1D
I
St/B
USIC0 Channel 0 Shift Clock Input
ESR1_10
I
St/B
ESR1 Trigger Input 10
U3C1_DX0D
I
St/B
USIC3 Channel 1 Shift Data Input
P4.2
O0 / I St/B
Bit 2 of Port 4, General Purpose Input/Output
U3C0_SCLK
OUT
O1
USIC3 Channel 0 Shift Clock Output
CC2_CC26
O3 / I St/B
CAPCOM2 CC26IO Capture Inp./ Compare Out.
CS2
OH
St/B
External Bus Interface Chip Select 2 Output
T2INA
St/B
I
St/B
GPT12E Timer T2 Count/Gate Input
CCU62_CCP I
OS1B
St/B
CCU62 Position Input 1
U3C0_DX1B
St/B
USIC3 Channel 0 Shift Clock Input
Data Sheet
I
26
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
69
P2.6
O0 / I St/B
Bit 6 of Port 2, General Purpose Input/Output
U0C0_SELO
0
O1
St/B
USIC0 Channel 0 Select/Control 0 Output
U0C1_SELO
1
O2
St/B
USIC0 Channel 1 Select/Control 1 Output
CC2_CC19
O3 / I St/B
CAPCOM2 CC19IO Capture Inp./ Compare Out.
A19
OH
St/B
External Bus Interface Address Line 19
70
71
Type Function
U0C0_DX2D
I
St/B
USIC0 Channel 0 Shift Control Input
RxDC0D
I
St/B
CAN Node 0 Receive Data Input
ESR2_6
I
St/B
ESR2 Trigger Input 6
P4.4
O0 / I St/B
Bit 4 of Port 4, General Purpose Input/Output
U3C0_SELO
2
O1
USIC3 Channel 0 Select/Control 2 Output
CC2_CC28
O3 / I St/B
CAPCOM2 CC28IO Capture Inp./ Compare Out.
CS4
OH
St/B
External Bus Interface Chip Select 4 Output
CLKIN2
I
St/B
Clock Signal Input 2
U3C0_DX2C
I
St/B
USIC3 Channel 0 Shift Control Input
P4.3
O0 / I St/B
U0C1_DOUT O1
St/B
St/B
Bit 3 of Port 4, General Purpose Input/Output
USIC0 Channel 1 Shift Data Output
CC2_CC27
O3 / I St/B
CAPCOM2 CC27IO Capture Inp./ Compare Out.
CS3
OH
St/B
External Bus Interface Chip Select 3 Output
T2EUDA
I
St/B
GPT12E Timer T2 External Up/Down Control
Input
CCU62_CCP I
OS2B
St/B
CCU62 Position Input 2
Data Sheet
27
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
75
P0.0
O0 / I St/B
76
St/B
USIC1 Channel 0 Shift Data Output
CCU61_CC6
0
O3
St/B
CCU61 Channel 0 IOutput
A0
OH
St/B
External Bus Interface Address Line 0
U1C0_DX0A
I
St/B
USIC1 Channel 0 Shift Data Input
CCU61_CC6
0INA
I
St/B
CCU61 Channel 0 Input
ESR1_11
I
St/B
ESR1 Trigger Input 11
P4.5
O0 / I St/B
CC2_CC29
St/B
O3 / I St/B
Bit 5 of Port 4, General Purpose Input/Output
USIC3 Channel 0 Shift Data Output
CAPCOM2 CC29IO Capture Inp./Compare Out.
CCU61_CCP I
OS0A
St/B
CCU61 Position Input 0
U3C0_DX0B
I
St/B
USIC3 Channel 0 Shift Data Input
ESR2_10
I
St/B
ESR2 Trigger Input 10
P4.6
O0 / I St/B
U3C0_DOUT O1
78
Bit 0 of Port 0, General Purpose Input/Output
U1C0_DOUT O1
U3C0_DOUT O1
77
Type Function
St/B
Bit 6 of Port 4, General Purpose Input/Output
USIC3 Channel 0 Shift Data Output
CC2_CC30
O3 / I St/B
CAPCOM2 CC30IO Capture Inp./ Compare Out.
T4INA
I
St/B
GPT12E Timer T4 Count/Gate Input
CCU61_CCP I
OS1A
St/B
CCU61 Position Input 1
P2.7
O0 / I St/B
Bit 7 of Port 2, General Purpose Input/Output
U0C1_SELO
0
O1
St/B
USIC0 Channel 1 Select/Control 0 Output
U0C0_SELO
1
O2
St/B
USIC0 Channel 0 Select/Control 1 Output
CC2_CC20
O3 / I St/B
CAPCOM2 CC20IO Capture Inp./ Compare Out.
A20
OH
St/B
External Bus Interface Address Line 20
U0C1_DX2C
I
St/B
USIC0 Channel 1 Shift Control Input
RxDC1C
I
St/B
CAN Node 1 Receive Data Input
ESR2_7
I
St/B
ESR2 Trigger Input 7
Data Sheet
28
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
79
P0.1
O0 / I St/B
80
Type Function
Bit 1 of Port 0, General Purpose Input/Output
U1C0_DOUT O1
St/B
USIC1 Channel 0 Shift Data Output
TxDC0
O2
St/B
CAN Node 0 Transmit Data Output
CCU61_CC6
1
O3
St/B
CCU61 Channel 1 Output
A1
OH
St/B
External Bus Interface Address Line 1
U1C0_DX0B
I
St/B
USIC1 Channel 0 Shift Data Input
CCU61_CC6
1INA
I
St/B
CCU61 Channel 1 Input
U1C0_DX1A
I
St/B
USIC1 Channel 0 Shift Clock Input
P2.8
O0 / I DP/B Bit 8 of Port 2, General Purpose Input/Output
U0C1_SCLK
OUT
O1
DP/B USIC0 Channel 1 Shift Clock Output
EXTCLK
O2
DP/B Programmable Clock Signal Output
1)
81
CC2_CC21
O3 / I DP/B CAPCOM2 CC21IO Capture Inp./ Compare Out.
A21
OH
DP/B External Bus Interface Address Line 21
U0C1_DX1D
I
DP/B USIC0 Channel 1 Shift Clock Input
P4.7
O0 / I St/B
Bit 7 of Port 4, General Purpose Input/Output
CC2_CC31
O3 / I St/B
CAPCOM2 CC31IO Capture Inp./ Compare Out.
T4EUDA
I
St/B
GPT12E Timer T4 External Up/Down Control
Input
CCU61_CCP I
OS2A
St/B
CCU61 Position Input 2
Data Sheet
29
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
82
P2.9
O0 / I St/B
83
Type Function
Bit 9 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
TxDC1
O2
St/B
CAN Node 1 Transmit Data Output
CC2_CC22
O3 / I St/B
CAPCOM2 CC22IO Capture Inp./ Compare Out.
A22
OH
St/B
External Bus Interface Address Line 22
CLKIN1
I
St/B
Clock Signal Input 1
TCK_A
IH
St/B
DAP0/JTAG Clock Input
If JTAG pos. A is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
If DAP pos. 0 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
P0.2
O0 / I St/B
Bit 2 of Port 0, General Purpose Input/Output
U1C0_SCLK
OUT
O1
St/B
USIC1 Channel 0 Shift Clock Output
TxDC0
O2
St/B
CAN Node 0 Transmit Data Output
CCU61_CC6
2
O3
St/B
CCU61 Channel 2 Output
A2
OH
St/B
External Bus Interface Address Line 2
U1C0_DX1B
I
St/B
USIC1 Channel 0 Shift Clock Input
CCU61_CC6
2INA
I
St/B
CCU61 Channel 2 Input
Data Sheet
30
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
84
P10.0
O0 / I St/B
85
86
Type Function
Bit 0 of Port 10, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
CCU60_CC6
0
O2
St/B
CCU60 Channel 0 Output
AD0
OH /
IH
St/B
External Bus Interface Address/Data Line 0
CCU60_CC6
0INA
I
St/B
CCU60 Channel 0 Input
ESR1_2
I
St/B
ESR1 Trigger Input 2
U0C0_DX0A
I
St/B
USIC0 Channel 0 Shift Data Input
U0C1_DX0A
I
St/B
USIC0 Channel 1 Shift Data Input
P3.0
O0 / I St/B
Bit 0 of Port 3, General Purpose Input/Output
U2C0_DOUT O1
St/B
USIC2 Channel 0 Shift Data Output
ESR1_1
I
St/B
ESR1 Trigger Input 1
U2C0_DX0A
I
St/B
USIC2 Channel 0 Shift Data Input
U2C0_DX1A
I
St/B
USIC2 Channel 0 Shift Clock Input
P10.1
O0 / I St/B
Bit 1 of Port 10, General Purpose Input/Output
U0C0_DOUT O1
St/B
USIC0 Channel 0 Shift Data Output
CCU60_CC6
1
O2
St/B
CCU60 Channel 1 Output
AD1
OH /
IH
St/B
External Bus Interface Address/Data Line 1
CCU60_CC6
1INA
I
St/B
CCU60 Channel 1 Input
U0C0_DX1A
I
St/B
USIC0 Channel 0 Shift Clock Input
U0C0_DX0B
I
St/B
USIC0 Channel 0 Shift Data Input
Data Sheet
31
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
87
P0.3
O0 / I St/B
Bit 3 of Port 0, General Purpose Input/Output
U1C0_SELO
0
O1
St/B
USIC1 Channel 0 Select/Control 0 Output
U1C1_SELO
1
O2
St/B
USIC1 Channel 1 Select/Control 1 Output
CCU61_COU O3
T60
St/B
CCU61 Channel 0 Output
A3
St/B
External Bus Interface Address Line 3
88
89
OH
Type Function
U1C0_DX2A
I
St/B
USIC1 Channel 0 Shift Control Input
RxDC0B
I
St/B
CAN Node 0 Receive Data Input
P3.1
O0 / I St/B
Bit 1 of Port 3, General Purpose Input/Output
U2C0_DOUT O1
St/B
USIC2 Channel 0 Shift Data Output
U2C0_DX0B
I
St/B
USIC2 Channel 0 Shift Data Input
P10.2
O0 / I St/B
Bit 2 of Port 10, General Purpose Input/Output
U0C0_SCLK
OUT
O1
St/B
USIC0 Channel 0 Shift Clock Output
CCU60_CC6
2
O2
St/B
CCU60 Channel 2 Output
U3C0_SELO
1
O3
St/B
USIC3 Channel 0 Select/Control 1 Output
AD2
OH /
IH
St/B
External Bus Interface Address/Data Line 2
CCU60_CC6
2INA
I
St/B
CCU60 Channel 2 Input
U0C0_DX1B
I
St/B
USIC0 Channel 0 Shift Clock Input
U3C0_DX2B
I
St/B
USIC3 Channel 0 Shift Control Input
Data Sheet
32
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
90
P0.4
O0 / I St/B
Bit 4 of Port 0, General Purpose Input/Output
U1C1_SELO
0
O1
St/B
USIC1 Channel 1 Select/Control 0 Output
U1C0_SELO
1
O2
St/B
USIC1 Channel 0 Select/Control 1 Output
CCU61_COU O3
T61
St/B
CCU61 Channel 1 Output
A4
St/B
External Bus Interface Address Line 4
92
93
94
OH
Type Function
U1C1_DX2A
I
St/B
USIC1 Channel 1 Shift Control Input
RxDC1B
I
St/B
CAN Node 1 Receive Data Input
ESR2_8
I
St/B
ESR2 Trigger Input 8
P2.13
O0 / I St/B
Bit 13 of Port 2, General Purpose Input/Output
U2C1_SELO
2
O1
USIC2 Channel 1 Select/Control 2 Output
P3.2
O0 / I St/B
Bit 2 of Port 3, General Purpose Input/Output
U2C0_SCLK
OUT
O1
St/B
USIC2 Channel 0 Shift Clock Output
U2C0_DX1B
I
St/B
USIC2 Channel 0 Shift Clock Input
P2.10
O0 / I St/B
St/B
Bit 10 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
U0C0_SELO
3
O2
St/B
USIC0 Channel 0 Select/Control 3 Output
CC2_CC23
O3 / I St/B
CAPCOM2 CC23IO Capture Inp./ Compare Out.
A23
OH
St/B
External Bus Interface Address Line 23
U0C1_DX0E
I
St/B
USIC0 Channel 1 Shift Data Input
CAPINA
I
St/B
GPT12E Register CAPREL Capture Input
U3C1_DX0A
I
St/B
USIC3 Channel 1 Shift Data Input
Data Sheet
33
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
95
P10.3
O0 / I St/B
96
97
Type Function
Bit 3 of Port 10, General Purpose Input/Output
CCU60_COU O2
T60
St/B
CCU60 Channel 0 Output
AD3
OH /
IH
St/B
External Bus Interface Address/Data Line 3
U0C0_DX2A
I
St/B
USIC0 Channel 0 Shift Control Input
U0C1_DX2A
I
St/B
USIC0 Channel 1 Shift Control Input
U3C0_DX0A
I
St/B
USIC3 Channel 0 Shift Data Input
P0.5
O0 / I St/B
Bit 5 of Port 0, General Purpose Input/Output
U1C1_SCLK
OUT
O1
St/B
USIC1 Channel 1 Shift Clock Output
U1C0_SELO
2
O2
St/B
USIC1 Channel 0 Select/Control 2 Output
CCU61_COU O3
T62
St/B
CCU61 Channel 2 Output
A5
St/B
External Bus Interface Address Line 5
OH
U1C1_DX1A
I
St/B
USIC1 Channel 1 Shift Clock Input
U1C0_DX1C
I
St/B
USIC1 Channel 0 Shift Clock Input
P3.3
O0 / I St/B
Bit 3 of Port 3, General Purpose Input/Output
U2C0_SELO
0
O1
St/B
USIC2 Channel 0 Select/Control 0 Output
U2C1_SELO
1
O2
St/B
USIC2 Channel 1 Select/Control 1 Output
U2C0_DX2A
I
St/B
USIC2 Channel 0 Shift Control Input
Data Sheet
34
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
98
P10.4
O0 / I St/B
Bit 4 of Port 10, General Purpose Input/Output
U0C0_SELO
3
O1
St/B
USIC0 Channel 0 Select/Control 3 Output
CCU60_COU O2
T61
St/B
CCU60 Channel 1 Output
U3C0_DOUT O3
St/B
USIC3 Channel 0 Shift Data Output
AD4
OH /
IH
St/B
External Bus Interface Address/Data Line 4
U0C0_DX2B
I
St/B
USIC0 Channel 0 Shift Control Input
U0C1_DX2B
I
St/B
USIC0 Channel 1 Shift Control Input
ESR1_9
I
St/B
ESR1 Trigger Input 9
P3.4
O0 / I St/B
Bit 4 of Port 3, General Purpose Input/Output
U2C1_SELO
0
O1
St/B
USIC2 Channel 1 Select/Control 0 Output
U2C0_SELO
1
O2
St/B
USIC2 Channel 0 Select/Control 1 Output
U0C0_SELO
4
O3
St/B
USIC0 Channel 0 Select/Control 4 Output
U2C1_DX2A
I
St/B
USIC2 Channel 1 Shift Control Input
P10.5
O0 / I St/B
Bit 5 of Port 10, General Purpose Input/Output
U0C1_SCLK
OUT
O1
St/B
USIC0 Channel 1 Shift Clock Output
CCU60_COU O2
T62
St/B
CCU60 Channel 2 Output
U2C0_DOUT O3
St/B
USIC2 Channel 0 Shift Data Output
AD5
OH /
IH
St/B
External Bus Interface Address/Data Line 5
U0C1_DX1B
I
St/B
USIC0 Channel 1 Shift Clock Input
99
100
Data Sheet
Type Function
35
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
101
P3.5
O0 / I St/B
Bit 5 of Port 3, General Purpose Input/Output
U2C1_SCLK
OUT
O1
St/B
USIC2 Channel 1 Shift Clock Output
U2C0_SELO
2
O2
St/B
USIC2 Channel 0 Select/Control 2 Output
U0C0_SELO
5
O3
St/B
USIC0 Channel 0 Select/Control 5 Output
U2C1_DX1A
I
St/B
USIC2 Channel 1 Shift Clock Input
P0.6
O0 / I St/B
102
103
Type Function
Bit 6 of Port 0, General Purpose Input/Output
U1C1_DOUT O1
St/B
USIC1 Channel 1 Shift Data Output
TxDC1
O2
St/B
CAN Node 1 Transmit Data Output
CCU61_COU O3
T63
St/B
CCU61 Channel 3 Output
A6
OH
St/B
External Bus Interface Address Line 6
U1C1_DX0A
I
St/B
USIC1 Channel 1 Shift Data Input
CCU61_CTR
APA
I
St/B
CCU61 Emergency Trap Input
U1C1_DX1B
I
St/B
USIC1 Channel 1 Shift Clock Input
P10.6
O0 / I St/B
Bit 6 of Port 10, General Purpose Input/Output
U0C0_DOUT O1
St/B
USIC0 Channel 0 Shift Data Output
U1C0_SELO
0
O3
St/B
USIC1 Channel 0 Select/Control 0 Output
AD6
OH /
IH
St/B
External Bus Interface Address/Data Line 6
U0C0_DX0C
I
St/B
USIC0 Channel 0 Shift Data Input
U1C0_DX2D
I
St/B
USIC1 Channel 0 Shift Control Input
CCU60_CTR
APA
I
St/B
CCU60 Emergency Trap Input
Data Sheet
36
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
104
P3.6
O0 / I St/B
105
106
107
Type Function
Bit 6 of Port 3, General Purpose Input/Output
U2C1_DOUT O1
St/B
USIC2 Channel 1 Shift Data Output
U0C0_SELO
6
O3
St/B
USIC0 Channel 0 Select/Control 6 Output
U2C1_DX0A
I
St/B
USIC2 Channel 1 Shift Data Input
U2C1_DX1B
I
St/B
USIC2 Channel 1 Shift Clock Input
P10.7
O0 / I St/B
Bit 7 of Port 10, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
CCU60_COU O2
T63
St/B
CCU60 Channel 3 Output
AD7
OH /
IH
St/B
External Bus Interface Address/Data Line 7
U0C1_DX0B
I
St/B
USIC0 Channel 1 Shift Data Input
CCU60_CCP I
OS0A
St/B
CCU60 Position Input 0
T4INB
I
St/B
GPT12E Timer T4 Count/Gate Input
P0.7
O0 / I St/B
Bit 7 of Port 0, General Purpose Input/Output
U1C1_DOUT O1
St/B
USIC1 Channel 1 Shift Data Output
U1C0_SELO
3
O2
St/B
USIC1 Channel 0 Select/Control 3 Output
A7
OH
St/B
External Bus Interface Address Line 7
U1C1_DX0B
I
St/B
USIC1 Channel 1 Shift Data Input
CCU61_CTR
APB
I
St/B
CCU61 Emergency Trap Input
P3.7
O0 / I St/B
Bit 7 of Port 3, General Purpose Input/Output
U2C1_DOUT O1
St/B
USIC2 Channel 1 Shift Data Output
U2C0_SELO
3
O2
St/B
USIC2 Channel 0 Select/Control 3 Output
U0C0_SELO
7
O3
St/B
USIC0 Channel 0 Select/Control 7 Output
U2C1_DX0B
I
St/B
USIC2 Channel 1 Shift Data Input
Data Sheet
37
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
111
P1.0
O0 / I St/B
Bit 0 of Port 1, General Purpose Input/Output
U1C0_MCLK
OUT
O1
St/B
USIC1 Channel 0 Master Clock Output
U1C0_SELO
4
O2
St/B
USIC1 Channel 0 Select/Control 4 Output
A8
OH
St/B
External Bus Interface Address Line 8
ESR1_3
I
St/B
ESR1 Trigger Input 3
CCU62_CTR
APB
I
St/B
CCU62 Emergency Trap Input
T6INB
I
St/B
GPT12E Timer T6 Count/Gate Input
P9.0
O0 / I St/B
Bit 0 of Port 9, General Purpose Input/Output
CCU63_CC6
0
O1
St/B
CCU63 Channel 0 Output
112
113
Type Function
CC1_CC6
O2
St/B
CAPCOM1 CC6 Compare Output
CCU63_CC6
0INA
I
St/B
CCU63 Channel 0 Input
T6EUDB
I
St/B
GPT12E Timer T6 External Up/Down Control
Input
P10.8
O0 / I St/B
Bit 8 of Port 10, General Purpose Input/Output
U0C0_MCLK
OUT
O1
St/B
USIC0 Channel 0 Master Clock Output
U0C1_SELO
0
O2
St/B
USIC0 Channel 1 Select/Control 0 Output
U2C1_DOUT O3
St/B
USIC2 Channel 1 Shift Data Output
AD8
St/B
External Bus Interface Address/Data Line 8
CCU60_CCP I
OS1A
St/B
CCU60 Position Input 1
U0C0_DX1C
St/B
USIC0 Channel 0 Shift Clock Input
OH /
IH
I
BRKIN_B
I
St/B
OCDS Break Signal Input
T3EUDB
I
St/B
GPT12E Timer T3 External Up/Down Control
Input
ESR2_11
I
St/B
ESR2 Trigger Input 11
Data Sheet
38
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
114
P9.1
O0 / I DP/B Bit 1 of Port 9, General Purpose Input/Output
CCU63_CC6
1
O1
DP/B CCU63 Channel 1 Output
CC1_CC5
O2
DP/B CAPCOM1 CC5 Compare Output
CCU63_CC6
1INA
I
DP/B CCU63 Channel 1 Input
P10.9
O0 / I DP/B Bit 9 of Port 10, General Purpose Input/Output
U0C0_SELO
4
O1
DP/B USIC0 Channel 0 Select/Control 4 Output
U0C1_MCLK
OUT
O2
DP/B USIC0 Channel 1 Master Clock Output
AD9
OH /
IH
DP/B External Bus Interface Address/Data Line 9
115
116
Type Function
CCU60_CCP I
OS2A
DP/B CCU60 Position Input 2
TCK_B
IH
DP/B DAP0/JTAG Clock Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
If DAP pos. 1 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
T3INB
I
DP/B GPT12E Timer T3 Count/Gate Input
P1.1
O0 / I St/B
Bit 1 of Port 1, General Purpose Input/Output
CCU62_COU O1
T62
St/B
CCU62 Channel 2 Output
U1C0_SELO
5
O2
St/B
USIC1 Channel 0 Select/Control 5 Output
U2C1_DOUT O3
St/B
USIC2 Channel 1 Shift Data Output
A9
OH
St/B
External Bus Interface Address Line 9
ESR2_3
I
St/B
ESR2 Trigger Input 3
U2C1_DX0C
I
St/B
USIC2 Channel 1 Shift Data Input
Data Sheet
39
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
117
P10.10
O0 / I St/B
Bit 10 of Port 10, General Purpose Input/Output
U0C0_SELO
0
O1
St/B
USIC0 Channel 0 Select/Control 0 Output
CCU60_COU O2
T63
St/B
CCU60 Channel 3 Output
AD10
OH /
IH
St/B
External Bus Interface Address/Data Line 10
U0C0_DX2C
I
St/B
USIC0 Channel 0 Shift Control Input
118
119
Type Function
U0C1_DX1A
I
St/B
USIC0 Channel 1 Shift Clock Input
TDI_B
IH
St/B
JTAG Test Data Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
P10.11
O0 / I St/B
Bit 11 of Port 10, General Purpose Input/Output
U1C0_SCLK
OUT
O1
St/B
USIC1 Channel 0 Shift Clock Output
BRKOUT
O2
St/B
OCDS Break Signal Output
U3C0_SELO
0
O3
St/B
USIC3 Channel 0 Select/Control 0 Output
AD11
OH /
IH
St/B
External Bus Interface Address/Data Line 11
U1C0_DX1D
I
St/B
USIC1 Channel 0 Shift Clock Input
TMS_B
IH
St/B
JTAG Test Mode Selection Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
U3C0_DX2A
I
St/B
USIC3 Channel 0 Shift Control Input
P9.2
O0 / I St/B
Bit 2 of Port 9, General Purpose Input/Output
CCU63_CC6
2
O1
St/B
CCU63 Channel 2 Output
CC1_CC4
O2
St/B
CAPCOM1 CC4 Compare Output
CCU63_CC6
2INA
I
St/B
CCU63 Channel 2 Input
CAPINB
I
St/B
GPT12E Register CAPREL Capture Input
Data Sheet
40
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
120
P1.2
O0 / I St/B
Bit 2 of Port 1, General Purpose Input/Output
CCU62_CC6
2
O1
St/B
CCU62 Channel 2 Output
U1C0_SELO
6
O2
St/B
USIC1 Channel 0 Select/Control 6 Output
U2C1_SCLK
OUT
O3
St/B
USIC2 Channel 1 Shift Clock Output
A10
OH
St/B
External Bus Interface Address Line 10
ESR1_4
I
St/B
ESR1 Trigger Input 4
CCU61_T12
HRB
I
St/B
External Run Control Input for T12 of CCU61
CCU62_CC6
2INA
I
St/B
CCU62 Channel 2 Input
U2C1_DX0D
I
St/B
USIC2 Channel 1 Shift Data Input
U2C1_DX1C
I
St/B
USIC2 Channel 1 Shift Clock Input
P10.12
O0 / I St/B
121
122
Type Function
Bit 12 of Port 10, General Purpose Input/Output
U1C0_DOUT O1
St/B
USIC1 Channel 0 Shift Data Output
TDO_B
OH /
IH
St/B
JTAG Test Data Output / DAP1 Input/Output
If DAP pos. 1 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
AD12
OH /
IH
St/B
External Bus Interface Address/Data Line 12
U1C0_DX0C
I
St/B
USIC1 Channel 0 Shift Data Input
U1C0_DX1E
I
St/B
USIC1 Channel 0 Shift Clock Input
P9.3
O0 / I St/B
Bit 3 of Port 9, General Purpose Input/Output
CCU63_COU O1
T60
St/B
CCU63 Channel 0 Output
BRKOUT
St/B
OCDS Break Signal Output
Data Sheet
O2
41
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
123
P10.13
O0 / I St/B
124
125
Type Function
Bit 13 of Port 10, General Purpose Input/Output
U1C0_DOUT O1
St/B
USIC1 Channel 0 Shift Data Output
U1C0_SELO
3
O3
St/B
USIC1 Channel 0 Select/Control 3 Output
WR/WRL
OH
St/B
External Bus Interface Write Strobe Output
Active for each external write access, when WR,
active for ext. writes to the low byte, when WRL.
U1C0_DX0D
I
St/B
USIC1 Channel 0 Shift Data Input
P1.3
O0 / I St/B
Bit 3 of Port 1, General Purpose Input/Output
CCU62_COU O1
T63
St/B
CCU62 Channel 3 Output
U1C0_SELO
7
O2
St/B
USIC1 Channel 0 Select/Control 7 Output
U2C0_SELO
4
O3
St/B
USIC2 Channel 0 Select/Control 4 Output
A11
OH
St/B
External Bus Interface Address Line 11
ESR2_4
I
St/B
ESR2 Trigger Input 4
CCU62_T12
HRB
I
St/B
External Run Control Input for T12 of CCU62
P9.4
O0 / I St/B
Bit 4 of Port 9, General Purpose Input/Output
CCU63_COU O1
T61
St/B
CCU63 Channel 1 Output
U2C0_DOUT O2
St/B
USIC2 Channel 0 Shift Data Output
CCU62_COU O3
T63
St/B
CCU62 Channel 3 Output
Data Sheet
42
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
126
P9.5
O0 / I St/B
128
129
Type Function
Bit 5 of Port 9, General Purpose Input/Output
CCU63_COU O1
T62
St/B
CCU63 Channel 2 Output
U2C0_DOUT O2
St/B
USIC2 Channel 0 Shift Data Output
CCU62_COU O3
T62
St/B
CCU62 Channel 2 Output
U2C0_DX0E
I
St/B
USIC2 Channel 0 Shift Data Input
CCU60_CCP I
OS2B
St/B
CCU60 Position Input 2
P10.14
O0 / I St/B
Bit 14 of Port 10, General Purpose Input/Output
U1C0_SELO
1
O1
St/B
USIC1 Channel 0 Select/Control 1 Output
U0C1_DOUT O2
St/B
USIC0 Channel 1 Shift Data Output
U3C0_SCLK
OUT
O3
St/B
USIC3 Channel 0 Shift Clock Output
RD
OH
St/B
External Bus Interface Read Strobe Output
ESR2_2
I
St/B
ESR2 Trigger Input 2
U0C1_DX0C
I
St/B
USIC0 Channel 1 Shift Data Input
U3C0_DX1A
I
St/B
USIC3 Channel 0 Shift Clock Input
P1.4
O0 / I St/B
Bit 4 of Port 1, General Purpose Input/Output
CCU62_COU O1
T61
St/B
CCU62 Channel 1 Output
U1C1_SELO
4
O2
St/B
USIC1 Channel 1 Select/Control 4 Output
U2C0_SELO
5
O3
St/B
USIC2 Channel 0 Select/Control 5 Output
A12
OH
St/B
External Bus Interface Address Line 12
U2C0_DX2B
I
St/B
USIC2 Channel 0 Shift Control Input
Data Sheet
43
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
130
P10.15
O0 / I St/B
Bit 15 of Port 10, General Purpose Input/Output
U1C0_SELO
2
O1
St/B
USIC1 Channel 0 Select/Control 2 Output
U0C1_DOUT O2
St/B
USIC0 Channel 1 Shift Data Output
U1C0_DOUT O3
St/B
USIC1 Channel 0 Shift Data Output
ALE
OH
St/B
External Bus Interf. Addr. Latch Enable Output
U0C1_DX1C
I
St/B
USIC0 Channel 1 Shift Clock Input
P1.5
O0 / I St/B
131
132
Type Function
Bit 5 of Port 1, General Purpose Input/Output
CCU62_COU O1
T60
St/B
CCU62 Channel 0 Output
U1C1_SELO
3
O2
St/B
USIC1 Channel 1 Select/Control 3 Output
BRKOUT
O3
St/B
OCDS Break Signal Output
A13
OH
St/B
External Bus Interface Address Line 13
U2C0_DX0C
I
St/B
USIC2 Channel 0 Shift Data Input
P9.6
O0 / I St/B
Bit 6 of Port 9, General Purpose Input/Output
CCU63_COU O1
T63
St/B
CCU63 Channel 3 Output
CCU63_COU O2
T62
St/B
CCU63 Channel 2 Output
CCU62_COU O3
T61
St/B
CCU62 Channel 1 Output
CCU63
_CTRAPA
I
St/B
CCU63 Emergency Trap Input
CCU60_CCP I
OS1B
St/B
CCU60 Position Input 1
Data Sheet
44
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
133
P1.6
O0 / I St/B
Bit 6 of Port 1, General Purpose Input/Output
CCU62_CC6
1
O1 / I St/B
CCU62 Channel 1 Output
U1C1_SELO
2
O2
St/B
USIC1 Channel 1 Select/Control 2 Output
U2C0_DOUT O3
St/B
USIC2 Channel 0 Shift Data Output
A14
St/B
External Bus Interface Address Line 14
134
135
136
OH
Type Function
U2C0_DX0D
I
St/B
USIC2 Channel 0 Shift Data Input
CCU62_CC6
1INA
I
St/B
CCU62 Channel 1 Input
P9.7
O0 / I St/B
Bit 7 of Port 9, General Purpose Input/Output
CCU62_COU O1
T60
St/B
CCU62 Channel 0 Output
CCU62_COU O2
T63
St/B
CCU62 Channel 3 Output
CCU63_CTR
APB
I
St/B
CCU63 Emergency Trap Input
U2C0_DX1D
I
St/B
USIC2 Channel 0 Shift Clock Input
CCU60_CCP I
OS0B
St/B
CCU60 Position Input 0
P1.7
O0 / I St/B
Bit 7 of Port 1, General Purpose Input/Output
CCU62_CC6
0
O1
St/B
CCU62 Channel 0 Output
U1C1_MCLK
OUT
O2
St/B
USIC1 Channel 1 Master Clock Output
U2C0_SCLK
OUT
O3
St/B
USIC2 Channel 0 Shift Clock Output
A15
OH
St/B
External Bus Interface Address Line 15
U2C0_DX1C
I
St/B
USIC2 Channel 0 Shift Clock Input
CCU62_CC6
0INA
I
St/B
CCU62 Channel 0 Input
XTAL2
O
Sp/M Crystal Oscillator Amplifier Output
Data Sheet
45
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
Type Function
137
XTAL1
I
Sp/M Crystal Oscillator Amplifier Input
To clock the device from an external source, drive
XTAL1, while leaving XTAL2 unconnected.
Voltages on XTAL1 must comply to the core
supply voltage VDDIM.
ESR2_9
I
St/B
ESR2 Trigger Input 9
138
PORST
I
In/B
Power On Reset Input
A low level at this pin resets the XC2787X
completely. A spike filter suppresses input pulses
<10 ns. Input pulses >100 ns safely pass the filter.
The minimum duration for a safe recognition
should be 120 ns.
An internal pull-up device will hold this pin high
when nothing is driving it.
139
ESR1
O0 / I St/B
External Service Request 1
After power-up, an internal weak pull-up device
holds this pin high when nothing is driving it.
RxDC0E
I
St/B
CAN Node 0 Receive Data Input
U1C0_DX0F
I
St/B
USIC1 Channel 0 Shift Data Input
U1C0_DX2C
I
St/B
USIC1 Channel 0 Shift Control Input
U1C1_DX0C
I
St/B
USIC1 Channel 1 Shift Data Input
U1C1_DX2B
I
St/B
USIC1 Channel 1 Shift Control Input
U2C1_DX2C
I
St/B
USIC2 Channel 1 Shift Control Input
Data Sheet
46
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
140
ESR2
O0 / I St/B
External Service Request 2
After power-up, an internal weak pull-up device
holds this pin high when nothing is driving it.
RxDC1E
I
St/B
CAN Node 1 Receive Data Input
CCU60_CTR
APC
I
St/B
CCU60 Emergency Trap Input
CCU61_CTR
APC
I
St/B
CCU61 Emergency Trap Input
CCU62_CTR
APC
I
St/B
CCU62 Emergency Trap Input
CCU63_CTR
APC
I
St/B
CCU63 Emergency Trap Input
U1C1_DX0D
I
St/B
USIC1 Channel 1 Shift Data Input
U1C1_DX2C
I
St/B
USIC1 Channel 1 Shift Control Input
U2C1_DX0E
I
St/B
USIC2 Channel 1 Shift Data Input
U2C1_DX2B
I
St/B
USIC2 Channel 1 Shift Control Input
ESR0
O0 / I St/B
External Service Request 0
After power-up, ESR0 operates as open-drain
bidirectional reset with a weak pull-up.
U1C0_DX0E
I
St/B
USIC1 Channel 0 Shift Data Input
U1C0_DX2B
I
St/B
USIC1 Channel 0 Shift Control Input
P8.6
O0 / I St/B
141
142
Type Function
Bit 6 of Port 8, General Purpose Input/Output
CCU60_COU O1
T63
St/B
CCU60 Channel 3 Output
CC1_CC3
O2
St/B
CAPCOM1 CC3 Compare Output
MCHK_MAT
CH
O3
St/B
Memory Checker Match Output
CCU60_CTR
APB
I
St/B
CCU60 Emergency Trap Input
BRKIN_D
I
St/B
OCDS Break Signal Input
CCU62_CTR
APD
I
St/B
CCU62 Emergency Trap Input
Data Sheet
47
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
143
P8.5
O0 / I St/B
Type Function
Bit 5 of Port 8, General Purpose Input/Output
CCU60_COU O1
T62
St/B
CCU60 Channel 2 Output
CCU62_CC6
2
O2
St/B
CCU62 Channel 2 Output
TCK_D
IH
St/B
DAP0/JTAG Clock Input
If JTAG pos. D is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
CCU62_CC6
2INB
I
St/B
CCU62 Channel 2 Input
15
VDDIM
-
PS/M Digital Core Supply Voltage for Domain M
Decouple with a ceramic capacitor, see Data
Sheet for details.
14,
54,
91,
127
VDDI1
-
PS/1 Digital Core Supply Voltage for Domain 1
Decouple with a ceramic capacitor, see Data
Sheet for details.
All VDDI1 pins must be connected to each other.
20
VDDPA
-
PS/A Digital Pad Supply Voltage for Domain A
Connect decoupling capacitors to adjacent
VDDP/VSS pin pairs as close as possible to the pins.
Note: The A/D_Converters and ports P5, P6 and
P15 are fed from supply voltage VDDPA.
Data Sheet
48
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
Table 5
Pin
Symbol
2,
VDDPB
36,
38,
72,
74,
108,
110,
144
1,
37,
73,
109
Pin Definitions and Functions (cont’d)
VSS
Ctrl.
Type Function
-
PS/B Digital Pad Supply Voltage for Domain B
Connect decoupling capacitors to adjacent
VDDP/VSS pin pairs as close as possible to the pins.
Note: The on-chip voltage regulators and all ports
except P5, P6 and P15 are fed from supply
voltage VDDPB.
-
PS/-- Digital Ground
All VSS pins must be connected to the ground-line
or ground-plane.
Note: Also the exposed pad is connected
internally to VSS. To improve the EMC
behavior, it is recommended to connect the
exposed pad to the board ground.
For thermal aspects, please refer to the
Data Sheet. Board layout examples are
given in an application note.
1) To generate the reference clock output for bus timing measurement, fSYS must be selected as source for
EXTCLK and P2.8 must be selected as output pin. Also the high-speed clock pad must be enabled. This
configuration is referred to as reference clock output signal CLKOUT.
Data Sheet
49
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
General Device Information
2.2
Identification Registers
The identification registers describe the current version of the XC2787X and of its
modules.
Table 6
XC2787X Identification Registers
Short Name
Value
Address
Notes
SCU_IDMANUF
1820H
00’F07EH
SCU_IDCHIP
4001H
00’F07CH
marking EES-AA or ES-AA
4002H
00’F07CH
marking ES+AA, ES-AB or AB
SCU_IDMEM
318FH
00’F07AH
SCU_IDPROG
1313H
00’F078H
JTAG_ID
0018’A083H
---
marking EES-AA or ES-AA
1018’A083H
---
marking ES+AA
2018’A083H
---
marking ES-AB or AB
Data Sheet
50
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3
Functional Description
The architecture of the XC2787X combines advantages of RISC, CISC, and DSP
processors with an advanced peripheral subsystem in a well-balanced design. On-chip
memory blocks allow the design of compact systems-on-silicon with maximum
performance suited for computing, control, and communication.
The on-chip memory blocks (program code memory and SRAM, dual-port RAM, data
SRAM) and the generic peripherals are connected to the CPU by separate high-speed
buses. Another bus, the LXBus, connects additional on-chip resources and external
resources (see Figure 3). This bus structure enhances overall system performance by
enabling the concurrent operation of several subsystems of the XC2787X.
The block diagram gives an overview of the on-chip components and the advanced
internal bus structure of the XC2787X.
DPRAM
OCDS
Debug Support
DSRAM
EBC
LXBus Control
External Bus
Control
CPU
DMU
Flash Memory
PMU
IMB
PSRAM
MAC Unit
WDT
System Functions
MPU
Clock, Reset, Power
Control, StandBy RAM
Interrupt & PEC
RTC
LXBus
MCHK
ADC0 ADC1
Module Module
8-/10Bit,
24
Chan.
8-/10Bit,
24
Chan.
GPT
5
Timers
CCx
Modules
16
Chan.
each
CCU6x
Modules
3+1
Chan.
each
Peripheral Data Bus
Interrupt Bus
USICx
Modules
Multi
CAN
Shared
MOs,
6
Nodes
2
Chan.
each
Analog and Digital General Purpose IO (GPIO) Ports
MC_H-SERIES_BLOCKDIAGRAM
Figure 3
Data Sheet
Block Diagram
51
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.1
Memory Subsystem and Organization
The memory space of the XC2787X is configured in the von Neumann architecture. In
this architecture all internal and external resources, including code memory, data
memory, registers and I/O ports, are organized in the same linear address space.
Table 7
XC2787X Memory Map 1)
Address Area
Start Loc. End Loc.
Area Size2)
IMB register space
FF’FF00H
FF’FFFFH
256 Bytes
Reserved
F0’0000H
FF’FEFFH
< 1 Mbyte
Minus IMB registers
Reserved for EPSRAM
E9’C000H
EF’FFFFH
400 Kbytes
Mirrors EPSRAM
Emulated PSRAM
E8’0000H
E9’BFFFH
up to
112 Kbytes
With Flash timing
Reserved for PSRAM
E1’C000H
E7’FFFFH
400 Kbytes
Mirrors PSRAM
PSRAM
E0’0000H
E1’BFFFH
up to
112 Kbytes
Program SRAM
Reserved for Flash
D9’0000H
DF’FFFFH
448 Kbytes
Flash 6
D8’0000H
D8’FFFFH
64 Kbytes
Flash 5
D4’0000H
D7’FFFFH
256 Kbytes
Flash 4
D0’0000H
D3’FFFFH
256 Kbytes
Flash 3
CC’0000H CF’FFFFH
256 Kbytes
Flash 2
C8’0000H
CB’FFFFH
256 Kbytes
Flash 1
C4’0000H
C7’FFFFH
256 Kbytes
Flash 0
C0’0000H
C3’FFFFH
256 Kbytes3)
External memory area
40’0000H
BF’FFFFH
8 Mbytes
External IO area4)
21’0000H
3F’FFFFH
1,984 Kbytes
Reserved
20’C000H
20’FFFFH
16 Kbytes
USIC0–3 alternate regs. 20’B000H
20’BFFFH
4 Kbytes
Accessed via EBC
MultiCAN alternate regs. 20’8000H
20’AFFFH
12 Kbytes
Accessed via EBC
Reserved
20’6800H
20’7FFFH
6 Kbytes
USIC0–4 registers
20’4000H
20’67FFH
10 Kbytes
Accessed via EBC
MultiCAN registers
20’0000H
20’3FFFH
16 Kbytes
Accessed via EBC
External memory area
01’0000H
1F’FFFFH
1984 Kbytes
SFR area
00’FE00H
00’FFFFH
0.5 Kbytes
Dualport RAM (DPRAM) 00’F600H
00’FDFFH
2 Kbytes
Data Sheet
52
Notes
Minus res. seg.
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
Table 7
XC2787X Memory Map (cont’d)1)
Address Area
Start Loc. End Loc.
Area Size2)
Reserved for DPRAM
00’F200H
00’F5FFH
1 Kbytes
ESFR area
00’F000H
00’F1FFH
0.5 Kbytes
XSFR area
00’E000H
00’EFFFH
4 Kbytes
Data SRAM (DSRAM)
00’8000H
00’DFFFH
24 Kbytes
External memory area
00’0000H
00’7FFFH
32 Kbytes
Notes
1) Accesses to the shaded areas are reserved. In devices with external bus interface these accesses generate
external bus accesses.
2) The areas marked with “<” are slightly smaller than indicated, see column “Notes”.
3) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
4) Several pipeline optimizations are not active within the external IO area. This is necessary to control external
peripherals properly.
This common memory space consists of 16 Mbytes organized as 256 segments of
64 Kbytes; each segment contains four data pages of 16 Kbytes. The entire memory
space can be accessed bytewise or wordwise. Portions of the on-chip DPRAM and the
register spaces (ESFR/SFR) additionally are directly bit addressable.
The internal data memory areas and the Special Function Register areas (SFR and
ESFR) are mapped into segment 0, the system segment.
The Program Management Unit (PMU) handles all code fetches and, therefore, controls
access to the program memories such as Flash memory and PSRAM.
The Data Management Unit (DMU) handles all data transfers and, therefore, controls
access to the DSRAM and the on-chip peripherals.
Both units (PMU and DMU) are connected to the high-speed system bus so that they can
exchange data. This is required if operands are read from program memory, code or
data is written to the PSRAM, code is fetched from external memory, or data is read from
or written to external resources. These include peripherals on the LXBus such as USIC
or MultiCAN. The system bus allows concurrent two-way communication for maximum
transfer performance.
Up to 112 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user
code or data. The PSRAM is accessed via the PMU and is optimized for code fetches.
A section of the PSRAM with programmable size can be write-protected.
Note: The actual size of the PSRAM depends on the quoted device type.
Data Sheet
53
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
Up to 24 Kbytes of on-chip Data SRAM (DSRAM) are used for storage of general user
data. The DSRAM is accessed via a separate interface and is optimized for data access.
2 Kbytes of on-chip Dual-Port RAM (DPRAM) provide storage for user-defined
variables, for the system stack, and for general purpose register banks. A register bank
can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0, …, RL7,
RH7) General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR,
any location in the DPRAM is bit addressable.
8 Kbytes of on-chip Stand-By SRAM (SBRAM) provide storage for system-relevant
user data that must be preserved while the major part of the device is powered down.
The SBRAM is accessed via a specific interface and is powered in domain M.
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word-wide registers which are
used to control and monitor functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XC2000 Family. In order to ensure
upward compatibility they should either not be accessed or written with zeros.
In order to meet the requirements of designs where more memory is required than is
available on chip, up to 12 Mbytes (approximately, see Table 7) of external RAM and/or
ROM can be connected to the microcontroller. The External Bus Interface also provides
access to external peripherals.
The on-chip Flash memory stores code, constant data, and control data. The
1,600 Kbytes of on-chip Flash memory consist of 1 module of 64 Kbytes (preferably for
data storage) and 6 modules of 256 Kbytes. Each module is organized in 4-Kbyte
sectors.
The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used
internally to store operation control parameters and protection information.
Note: The actual size of the Flash memory depends on the chosen device type.
Each sector can be separately write protected1), erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A user-defined password
sequence temporarily unlocks protected areas. The Flash modules combine 128-bit
read access with protected and efficient writing algorithms for programming and erasing.
Dynamic error correction provides extremely high read data security for all read access
operations. Access to different Flash modules can be executed in parallel.
For Flash parameters, please see Section 4.6.
1) To save control bits, sectors are clustered for protection purposes, they remain separate for
programming/erasing.
Data Sheet
54
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
Memory Content Protection
The contents of on-chip memories can be protected against soft errors (induced e.g. by
radiation) by activating the parity mechanism or the Error Correction Code (ECC).
The parity mechanism can detect a single-bit error and prevent the software from using
incorrect data or executing incorrect instructions.
The ECC mechanism can detect and automatically correct single-bit errors. This
supports the stable operation of the system.
It is strongly recommended to activate the ECC mechanism wherever possible because
this dramatically increases the robustness of an application against such soft errors.
Data Sheet
55
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.2
External Bus Controller
All external memory access operations are performed by a special on-chip External Bus
Controller (EBC). The EBC also controls access to resources connected to the on-chip
LXBus (MultiCAN and the USIC modules). The LXBus is an internal representation of
the external bus that allows access to integrated peripherals and modules in the same
way as to external components.
The EBC can be programmed either to Single Chip Mode, when no external memory is
required, or to an external bus mode with the following selections1):
•
•
•
Address Bus Width with a range of 0 … 24-bit
Data Bus Width 8-bit or 16-bit
Bus Operation Multiplexed or Demultiplexed
The bus interface uses Port 10 and Port 2 for addresses and data. In the demultiplexed
bus modes, the lower addresses are output separately on Port 0 and Port 1. The number
of active segment address lines is selectable, restricting the external address space to
8 Mbytes … 64 Kbytes. This is required when interface lines shall be assigned to Port 2.
External CS signals (address windows plus default) can be generated and output on
Port 4 in order to save external glue logic. External modules can be directly connected
to the common address/data bus and their individual select lines.
Important timing characteristics of the external bus interface are programmable (with
registers TCONCSx/FCONCSx) to allow the user to adapt it to a wide range of different
types of memories and external peripherals.
Access to very slow memories or modules with varying access times is supported by a
special ‘Ready’ function. The active level of the control input signal is selectable.
In addition, up to four independent address windows may be defined (using registers
ADDRSELx) to control access to resources with different bus characteristics. These
address windows are arranged hierarchically where window 4 overrides window 3, and
window 2 overrides window 1. All accesses to locations not covered by these four
address windows are controlled by TCONCS0/FCONCS0. The currently active window
can generate a chip select signal.
The external bus timing is based on the rising edge of the reference clock output
CLKOUT. The external bus protocol is compatible with that of the standard C166 Family.
1) Bus modes are switched dynamically if several address windows with different mode settings are used.
Data Sheet
56
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.3
Central Processing Unit (CPU)
The core of the CPU consists of a 5-stage execution pipeline with a 2-stage instructionfetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and
accumulate unit (MAC), a register-file providing three register banks, and dedicated
SFRs. The ALU features a multiply-and-divide unit, a bit-mask generator, and a barrel
shifter.
PSRAM
Flash/ROM
PMU
CPU
Prefetch
Unit
Branch
Unit
FIFO
CSP
IP
VECSEG
CPUCON1
CPUCON2
Return
Stack
IDX0
IDX1
QX0
QX1
QR0
QR1
+/-
+/-
Multiply
Unit
MRW
+/-
MCW
MSW
MAH
MAL
2-Stage
Prefetch
Pipeline
TFR
Injection/
Exception
Handler
5-Stage
Pipeline
IFU
DPP0
DPP1
DPP2
DPP3
DPRAM
IPIP
SPSEG
SP
STKOV
STKUN
ADU
Division Unit
Bit-Mask-Gen.
Multiply Unit
Barrel-Shifter
MDC
CP
R15
R15
R14
R15
R14
R14
R15
R14
GPRs
GPRs
GPRs
GPRs
R1
R1
R0
R0R1
R0
R1
R0
RF
+/-
PSW
MDH
MDL
ZEROS
ONES
MAC
Buffer
ALU
WB
DSRAM
EBC
Peripherals
DMU
mca04917_x.vsd
Figure 4
Data Sheet
CPU Block Diagram
57
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
With this hardware most XC2787X instructions are executed in a single machine cycle
of 10 ns @ 100-MHz CPU clock. For example, shift and rotate instructions are always
processed during one machine cycle, no matter how many bits are shifted. Also,
multiplication and most MAC instructions execute in one cycle. All multiple-cycle
instructions have been optimized so that they can be executed very fast; for example, a
32-/16-bit division is started within 4 cycles while the remaining cycles are executed in
the background. Another pipeline optimization, the branch target prediction, eliminates
the execution time of branch instructions if the prediction was correct.
The CPU has a register context consisting of up to three register banks with 16 wordwide GPRs each at its disposal. One of these register banks is physically allocated within
the on-chip DPRAM area. A Context Pointer (CP) register determines the base address
of the active register bank accessed by the CPU at any time. The number of these
register bank copies is only restricted by the available internal RAM space. For easy
parameter passing, a register bank may overlap others.
A system stack of up to 32 Kwords is provided for storage of temporary data. The system
stack can be allocated to any location within the address space (preferably in the on-chip
RAM area); it is accessed by the CPU with the stack pointer (SP) register. Two separate
SFRs, STKOV and STKUN, are implicitly compared with the stack pointer value during
each stack access to detect stack overflow or underflow.
The high performance of the CPU hardware implementation can be best utilized by the
programmer with the highly efficient XC2787X instruction set. This includes the following
instruction classes:
•
•
•
•
•
•
•
•
•
•
•
•
•
Standard Arithmetic Instructions
DSP-Oriented Arithmetic Instructions
Logical Instructions
Boolean Bit Manipulation Instructions
Compare and Loop Control Instructions
Shift and Rotate Instructions
Prioritize Instruction
Data Movement Instructions
System Stack Instructions
Jump and Call Instructions
Return Instructions
System Control Instructions
Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes
and words. A variety of direct, indirect or immediate addressing modes are provided to
specify the required operands.
Data Sheet
58
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.4
Memory Protection Unit (MPU)
The XC2787X’s Memory Protection Unit (MPU) protects user-specified memory areas
from unauthorized read, write, or instruction fetch accesses. The MPU can protect the
whole address space including the peripheral area. This completes established
mechanisms such as the register security mechanism or stack overrun/underrun
detection.
Four Protection Levels support flexible system programming where operating system,
low level drivers, and applications run on separate levels. Each protection level permits
different access restrictions for instructions and/or data.
Every access is checked (if the MPU is enabled) and an access violating the permission
rules will be marked as invalid and leads to a protection trap.
A set of protection registers for each protection level specifies the address ranges and
the access permissions. Applications requiring more than 4 protection levels can
dynamically re-program the protection registers.
3.5
Memory Checker Module (MCHK)
The XC2787X’s Memory Checker Module calculates a checksum (fractional polynomial
division) on a block of data, often called Cyclic Redundancy Code (CRC). It is based on
a 32-bit linear feedback shift register and may, therefore, also be used to generate
pseudo-random numbers.
The Memory Checker Module is a 16-bit parallel input signature compression circuitry
which enables error detection within a block of data stored in memory, registers, or
communicated e.g. via serial communication lines. It reduces the probability of error
masking due to repeated error patterns by calculating the signature of blocks of data.
The polynomial used for operation is configurable, so most of the commonly used
polynomials may be used. Also, the block size for generating a CRC result is
configurable via a local counter. An interrupt may be generated if testing the current data
block reveals an error.
An autonomous CRC compare circuitry is included to enable redundant error detection,
e.g. to enable higher safety integrity levels.
The Memory Checker Module provides enhanced fault detection (beyond parity or ECC)
for data and instructions in volatile and non volatile memories. This is especially
important for the safety and reliability of embedded systems.
Data Sheet
59
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.6
Interrupt System
The architecture of the XC2787X supports several mechanisms for fast and flexible
response to service requests; these can be generated from various sources internal or
external to the microcontroller. Any of these interrupt requests can be programmed to be
serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC).
Using a standard interrupt service the current program execution is suspended and a
branch to the interrupt vector table is performed. With the PEC just one cycle is ‘stolen’
from the current CPU activity to perform the PEC service. A PEC service implies a single
byte or word data transfer between any two memory locations with an additional
increment of either the PEC source pointer, the destination pointer, or both. An individual
PEC transfer counter is implicitly decremented for each PEC service except when
performing in the continuous transfer mode. When this counter reaches zero, a standard
interrupt is performed to the corresponding source-related vector location. PEC services
are particularly well suited to supporting the transmission or reception of blocks of data.
The XC2787X has eight PEC channels, each with fast interrupt-driven data transfer
capabilities.
With a minimum interrupt response time of 7/111) CPU clocks, the XC2787X can react
quickly to the occurrence of non-deterministic events.
Interrupt Nodes and Source Selection
The interrupt system provides 112 physical nodes with separate control register
containing an interrupt request flag, an interrupt enable flag and an interrupt priority bit
field. Most interrupt sources are assigned to a dedicated node. A particular subset of
interrupt sources shares a set of nodes. The source selection can be programmed using
the interrupt source selection (ISSR) registers.
External Request Unit (ERU)
A dedicated External Request Unit (ERU) is provided to route and preprocess selected
on-chip peripheral and external interrupt requests. The ERU features 4 programmable
input channels with event trigger logic (ETL) a routing matrix and 4 output gating units
(OGU). The ETL features rising edge, falling edge, or both edges event detection. The
OGU combines the detected interrupt events and provides filtering capabilities
depending on a programmable pattern match or miss.
Trap Processing
The XC2787X provides efficient mechanisms to identify and process exceptions or error
conditions that arise during run-time, the so-called ‘Hardware Traps’. A hardware trap
causes an immediate system reaction similar to a standard interrupt service (branching
1) Depending if the jump cache is used or not.
Data Sheet
60
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
to a dedicated vector table location). The occurrence of a hardware trap is also indicated
by a single bit in the trap flag register (TFR). Unless another higher-priority trap service
is in progress, a hardware trap will interrupt any ongoing program execution. In turn,
hardware trap services can normally not be interrupted by standard or PEC interrupts.
Depending on the package option up to 3 External Service Request (ESR) pins are
provided. The ESR unit processes their input values and allows to implement user
controlled trap functions (System Requests SR0 and SR1). In this way reset, wakeup
and power control can be efficiently realized.
Software interrupts are supported by the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number. Alternatively to emulate an interrupt by software a
program can trigger interrupt requests by writing the Interrupt Request (IR) bit of an
interrupt control register.
3.7
On-Chip Debug Support (OCDS)
The On-Chip Debug Support system built into the XC2787X provides a broad range of
debug and emulation features. User software running on the XC2787X can be debugged
within the target system environment.
The OCDS is controlled by an external debugging device via the debug interface. This
either consists of the 2-pin Device Access Port (DAP) or of the JTAG port conforming to
IEEE-1149. The debug interface can be completed with an optional break interface.
The debugger controls the OCDS with a set of dedicated registers accessible via the
debug interface (DAP or JTAG). In addition the OCDS system can be controlled by the
CPU, e.g. by a monitor program. An injection interface allows the execution of OCDSgenerated instructions by the CPU.
Multiple breakpoints can be triggered by on-chip hardware, by software, or by an
external trigger input. Single stepping is supported, as is the injection of arbitrary
instructions and read/write access to the complete internal address space. A breakpoint
trigger can be answered with a CPU halt, a monitor call, a data transfer, or/and the
activation of an external signal.
Tracing of data can be obtained via the debug interface, or via the external bus interface
for increased performance.
Tracing of program execution is supported by the XC2000 Family emulation device. With
this device the DAP can operate on clock rates of up to 20 MHz.
The DAP interface uses two interface signals, the JTAG interface uses four interface
signals, to communicate with external circuitry. The debug interface can be amended
with two optional break lines.
Data Sheet
61
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.8
Capture/Compare Units (CC1 and CC2)
Each CAPCOM unit supports generation and control of timing sequences on up to
16 channels with a maximum resolution of one system clock cycle (eight cycles in
staggered mode). The CAPCOM unit is typically used to handle high-speed I/O tasks
such as pulse and waveform generation, pulse width modulation (PWM), digital to
analog (D/A) conversion, software timing, or time recording with respect to external
events.
Two 16-bit timers with reload registers provide two independent time bases for the
capture/compare register array.
The input clock for the timers is programmable to several prescaled values of the internal
system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2.
This provides a wide range of variation for the timer period and resolution and allows
precise adjustments to the application specific requirements. In addition, external count
inputs allow event scheduling for the capture/compare registers relative to external
events.
The capture/compare register array contains 16 dual purpose capture/compare
registers, each of which may be individually allocated to either CAPCOM timer and
programmed for capture or compare function.
All registers have each one port pin associated with it which serves as an input pin for
triggering the capture function, or as an output pin to indicate the occurrence of a
compare event.
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
register in response to an external event at the port pin which is associated with this
register. In addition, a specific interrupt request for this capture/compare register is
generated. Either a positive, a negative, or both a positive and a negative external signal
transition at the pin can be selected as the triggering event.
The contents of all registers which have been selected for one of the five compare modes
are continuously compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the selected compare mode.
Table 8
Compare Modes
Compare Modes
Function
Mode 0
Interrupt-only compare mode;
Several compare interrupts per timer period are possible
Mode 1
Pin toggles on each compare match;
Several compare events per timer period are possible
Data Sheet
62
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
Table 8
Compare Modes (cont’d)
Compare Modes
Function
Mode 2
Interrupt-only compare mode;
Only one compare interrupt per timer period is generated
Mode 3
Pin set ‘1’ on match; pin reset ‘0’ on compare timer overflow;
Only one compare event per timer period is generated
Double Register
Mode
Two registers operate on one pin;
Pin toggles on each compare match;
Several compare events per timer period are possible
Single Event Mode
Generates single edges or pulses;
Can be used with any compare mode
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
register in response to an external event at the port pin associated with this register. In
addition, a specific interrupt request for this capture/compare register is generated.
Either a positive, a negative, or both a positive and a negative external signal transition
at the pin can be selected as the triggering event.
The contents of all registers selected for one of the five compare modes are continuously
compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the compare mode selected.
Data Sheet
63
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
T78CON.
T7RSEL
Reload Reg.
T0 REL/T7REL
External
Sync. Start
fCC
T0IN/T7IN
T01CON. T6OUF
T0RSEL
T0 /T7
Input
Control
Timer T0/T7
CCxIO
CCxIO
CCxIRQ
CCxIRQ
Mode
Control
(Capture
or
Compare)
Sixteen
16 -bit
Capture/
Compare
Registers
CCxIO
CCxIRQ
T01CON.
T1RSEL fCC
T6OUF
External
Sync. Start
T0IRQ,
T7IRQ
Timer T1/T8
T1 /T8
Input
Control
T1IRQ,
T8IRQ
Reload Reg.
T1 REL/T8REL
T78CON.
T8RSEL
SYSCON1.GLCCST
CAPCOM1 provides channels x = 0 … 15.
(see signals CCxIO and CCxIRQ)
MCB05418_P11_CC12
CAPCOM2 provides channels x = 16 … 31.
(see signals CCxIO and CCxIRQ)
Figure 5
Data Sheet
CAPCOM Unit Block Diagram
64
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.9
Capture/Compare Units CCU6x
The XC2787X types feature the CCU60, CCU61, CCU62 and CCU63 unit(s).
CCU6 is a high-resolution capture and compare unit with application-specific modes. It
provides inputs to start the timers synchronously, an important feature in devices with
several CCU6 modules.
The module provides two independent timers (T12, T13), that can be used for PWM
generation, especially for AC motor control. Additionally, special control modes for block
commutation and multi-phase machines are supported.
Timer 12 Features
•
•
•
•
•
•
•
•
•
•
Three capture/compare channels, where each channel can be used either as a
capture or as a compare channel.
Supports generation of a three-phase PWM (six outputs, individual signals for highside and low-side switches)
16-bit resolution, maximum count frequency = peripheral clock
Dead-time control for each channel to avoid short circuits in the power stage
Concurrent update of the required T12/13 registers
Center-aligned and edge-aligned PWM can be generated
Single-shot mode supported
Many interrupt request sources
Hysteresis-like control mode
Automatic start on a HW event (T12HR, for synchronization purposes)
Timer 13 Features
•
•
•
•
•
•
One independent compare channel with one output
16-bit resolution, maximum count frequency = peripheral clock
Can be synchronized to T12
Interrupt generation at period match and compare match
Single-shot mode supported
Automatic start on a HW event (T13HR, for synchronization purposes)
Additional Features
•
•
•
•
•
•
•
Block commutation for brushless DC drives implemented
Position detection via Hall sensor pattern
Automatic rotational speed measurement for block commutation
Integrated error handling
Fast emergency stop without CPU load via external signal (CTRAP)
Control modes for multi-channel AC drives
Output levels can be selected and adapted to the power stage
Data Sheet
65
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
CCU6 Module Kernel
fSYS
T13
Channel 3
com pare
1
3
2
2
2
trap i nput
st art
Trap
Control
output select
1
Multichannel
Control
Hal l i nput
Channel 2
Deadtime
Control
compa re
1
compa re
Interrupts
Channel 1
compa re
T12
1
capture
TxHR
Channel 0
output select
com pare
3
1
CTRAP
CCPOS0
CCPOS1
CCPOS2
COUT60
CC60
COUT61
CC61
COUT62
CC62
COUT63
Input / Output Control
m c_ccu6_blockdiagram . vsd
Figure 6
CCU6 Block Diagram
Timer T12 can work in capture and/or compare mode for its three channels. The modes
can also be combined. Timer T13 can work in compare mode only. The multi-channel
control unit generates output patterns that can be modulated by timer T12 and/or timer
T13. The modulation sources can be selected and combined for signal modulation.
Data Sheet
66
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.10
General Purpose Timer (GPT12E) Unit
The GPT12E unit is a very flexible multifunctional timer/counter structure which can be
used for many different timing tasks such as event timing and counting, pulse width and
duty cycle measurements, pulse generation, or pulse multiplication.
The GPT12E unit incorporates five 16-bit timers organized in two separate modules,
GPT1 and GPT2. Each timer in each module may either operate independently in a
number of different modes or be concatenated with another timer of the same module.
Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for
one of four basic modes of operation: Timer, Gated Timer, Counter, and Incremental
Interface Mode. In Timer Mode, the input clock for a timer is derived from the system
clock and divided by a programmable prescaler. Counter Mode allows timer clocking in
reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the
operation of a timer is controlled by the ‘gate’ level on an external input pin. For these
purposes each timer has one associated port pin (TxIN) which serves as a gate or clock
input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles.
The counting direction (up/down) for each timer can be programmed by software or
altered dynamically by an external signal on a port pin (TxEUD), e.g. to facilitate position
tracking.
In Incremental Interface Mode the GPT1 timers can be directly connected to the
incremental position sensor signals A and B through their respective inputs TxIN and
TxEUD. Direction and counting signals are internally derived from these two input
signals, so that the contents of the respective timer Tx corresponds to the sensor
position. The third position sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer
overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out
monitoring of external hardware components. It may also be used internally to clock
timers T2 and T4 for measuring long time periods with high resolution.
In addition to the basic operating modes, T2 and T4 may be configured as reload or
capture register for timer T3. A timer used as capture or reload register is stopped. The
contents of timer T3 is captured into T2 or T4 in response to a signal at the associated
input pin (TxIN). Timer T3 is reloaded with the contents of T2 or T4, triggered either by
an external signal or a selectable state transition of its toggle latch T3OTL. When both
T2 and T4 are configured to alternately reload T3 on opposite state transitions of T3OTL
with the low and high times of a PWM signal, this signal can be continuously generated
without software intervention.
Data Sheet
67
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
T3CON.BPS1
fGPT
2n:1
Basic Clock
Interrupt
Request
(T2IRQ)
Aux. Timer T2
T2IN
T2EUD
U/D
T2
Mode
Reload
Control
Capture
Interrupt
Request
(T3IRQ)
T3IN
T3
Mode
Control
T3EUD
Core Timer T3
U/D
T3OTL
T3OUT
Toggle
Latch
Capture
T4IN
T4EUD
T4
Mode
Control
Reload
Aux. Timer T4
U/D
Interrupt
Request
(T4IRQ)
MC_GPT_BLOCK1
Figure 7
Data Sheet
Block Diagram of GPT1
68
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
With its maximum resolution of 2 system clock cycles, the GPT2 module provides
precise event control and time measurement. It includes two timers (T5, T6) and a
capture/reload register (CAPREL). Both timers can be clocked with an input clock which
is derived from the CPU clock via a programmable prescaler or with external signals. The
counting direction (up/down) for each timer can be programmed by software or altered
dynamically with an external signal on a port pin (TxEUD). Concatenation of the timers
is supported with the output toggle latch (T6OTL) of timer T6, which changes its state on
each timer overflow/underflow.
The state of this latch may be used to clock timer T5, and/or it may be output on pin
T6OUT. The overflows/underflows of timer T6 can also be used to clock the CAPCOM2
timers and to initiate a reload from the CAPREL register.
The CAPREL register can capture the contents of timer T5 based on an external signal
transition on the corresponding port pin (CAPIN); timer T5 may optionally be cleared
after the capture procedure. This allows the XC2787X to measure absolute time
differences or to perform pulse multiplication without software overhead.
The capture trigger (timer T5 to CAPREL) can also be generated upon transitions of
GPT1 timer T3 inputs T3IN and/or T3EUD. This is especially advantageous when T3
operates in Incremental Interface Mode.
Data Sheet
69
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
T6CON.BPS2
fGPT
2n:1
Basic Clock
Interrupt
Request
(T5IRQ)
GPT2 Timer T5
T5IN
T5EUD
T5
Mode
Control
U/D
Clear
Capture
CAPIN
T3IN/
T3EUD
CAPREL
Mode
Control
GPT2 CAPREL
Interrupt
Request
(CRIRQ)
Reload
Clear
Interrupt
Request
(T6IRQ)
Toggle
FF
T6IN
T6
Mode
Control
GPT2 Timer T6
T6OTL
T6OUT
T6OUF
U/D
T6EUD
MC_GPT_BLOCK2
Figure 8
Data Sheet
Block Diagram of GPT2
70
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.11
Real Time Clock
The Real Time Clock (RTC) module of the XC2787X can be clocked with a clock signal
selected from internal sources or external sources (pins).
The RTC basically consists of a chain of divider blocks:
•
•
•
Selectable 32:1 and 8:1 dividers (on - off)
The reloadable 16-bit timer T14
The 32-bit RTC timer block (accessible via registers RTCH and RTCL) consisting of:
– a reloadable 10-bit timer
– a reloadable 6-bit timer
– a reloadable 6-bit timer
– a reloadable 10-bit timer
All timers count up. Each timer can generate an interrupt request. All requests are
combined to a common node request.
fRTC
:32
M UX
RUN
M UX
Interrupt Sub Node
:8
PRE
REFCLK
CNT
INT0
CNT
INT1
CNT
INT2
RTCINT
CNT
INT3
REL-Register
f CNT
T14REL
10 Bits
6 Bits
6 Bits
10 Bits
T14
10 Bits
6 Bits
6 Bits
10 Bits
T14-Register
CNT-Register
M CB05568B
Figure 9
RTC Block Diagram
Note: The registers associated with the RTC are only affected by a power reset.
Data Sheet
71
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
The RTC module can be used for different purposes:
•
•
•
•
System clock to determine the current time and date
Cyclic time-based interrupt, to provide a system time tick independent of CPU
frequency and other resources
48-bit timer for long-term measurements
Alarm interrupt at a defined time
Data Sheet
72
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.12
A/D Converters
For analog signal measurement, up to two 10-bit A/D converters (ADC0, ADC1) with
16 + 8 multiplexed input channels and a sample and hold circuit have been integrated
on-chip. 4 inputs can be converted by both A/D converters. Conversions use the
successive approximation method. The sample time (to charge the capacitors) and the
conversion time are programmable so that they can be adjusted to the external circuit.
The A/D converters can also operate in 8-bit conversion mode, further reducing the
conversion time.
Several independent conversion result registers, selectable interrupt requests, and
highly flexible conversion sequences provide a high degree of programmability to meet
the application requirements. Both modules can be synchronized to allow parallel
sampling of two input channels.
For applications that require more analog input channels, external analog multiplexers
can be controlled automatically. For applications that require fewer analog input
channels, the remaining channel inputs can be used as digital input port pins.
The A/D converters of the XC2787X support two types of request sources which can be
triggered by several internal and external events.
•
•
Parallel requests are activated at the same time and then executed in a predefined
sequence.
Queued requests are executed in a user-defined sequence.
In addition, the conversion of a specific channel can be inserted into a running sequence
without disturbing that sequence. All requests are arbitrated according to the priority
level assigned to them.
Data reduction features reduce the number of required CPU access operations allowing
the precise evaluation of analog inputs (high conversion rate) even at a low CPU speed.
Result data can be reduced by limit checking or accumulation of results.
The Peripheral Event Controller (PEC) can be used to control the A/D converters or to
automatically store conversion results to a table in memory for later evaluation, without
requiring the overhead of entering and exiting interrupt routines for each data transfer.
Each A/D converter contains eight result registers which can be concatenated to build a
result FIFO. Wait-for-read mode can be enabled for each result register to prevent the
loss of conversion data.
In order to decouple analog inputs from digital noise and to avoid input trigger noise,
those pins used for analog input can be disconnected from the digital input stages. This
can be selected for each pin separately with the Port x Digital Input Disable registers.
The Auto-Power-Down feature of the A/D converters minimizes the power consumption
when no conversion is in progress.
Broken wire detection for each channel and a multiplexer test mode provide information
to verify the proper operation of the analog signal sources (e.g. a sensor system).
Data Sheet
73
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.13
Universal Serial Interface Channel Modules (USIC)
The XC2787X features the USIC modules USIC0, USIC1, USIC2, USIC3. Each module
provides two serial communication channels.
The Universal Serial Interface Channel (USIC) module is based on a generic data shift
and data storage structure which is identical for all supported serial communication
protocols. Each channel supports complete full-duplex operation with a basic data buffer
structure (one transmit buffer and two receive buffer stages). In addition, the data
handling software can use FIFOs.
The protocol part (generation of shift clock/data/control signals) is independent of the
general part and is handled by protocol-specific preprocessors (PPPs).
The USIC’s input/output lines are connected to pins by a pin routing unit. The inputs and
outputs of each USIC channel can be assigned to different interface pins, providing great
flexibility to the application software. All assignments can be made during runtime.
Bus
Buffer & Shift Structure Protocol Preprocessors
Pins
Control 0
DBU
0
PPP_B
DSU
0
PPP_C
PPP_D
Control 1
PPP_A
DBU
1
Pin Routing Shell
Bus Interface
PPP_A
PPP_B
DSU
1
PPP_C
PPP_D
fsys
Fractional
Dividers
Baud rate
Generators
USIC_basic.vsd
Figure 10
General Structure of a USIC Module
The regular structure of the USIC module brings the following advantages:
•
•
•
Higher flexibility through configuration with same look-and-feel for data management
Reduced complexity for low-level drivers serving different protocols
Wide range of protocols with improved performances (baud rate, buffer handling)
Data Sheet
74
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
Target Protocols
Each USIC channel can receive and transmit data frames with a selectable data word
width from 1 to 16 bits in each of the following protocols:
•
•
•
•
•
UART (asynchronous serial channel)
– module capability: maximum baud rate = fSYS / 4
– data frame length programmable from 1 to 63 bits
– MSB or LSB first
LIN Support (Local Interconnect Network)
– module capability: maximum baud rate = fSYS / 16
– checksum generation under software control
– baud rate detection possible by built-in capture event of baud rate generator
SSC/SPI/QSPI (synchronous serial channel with or without data buffer)
– module capability: maximum baud rate = fSYS / 2, limited by loop delay
– number of data bits programmable from 1 to 63, more with explicit stop condition
– MSB or LSB first
– optional control of slave select signals
IIC (Inter-IC Bus)
– supports baud rates of 100 kbit/s and 400 kbit/s
IIS (Inter-IC Sound Bus)
– module capability: maximum baud rate = fSYS / 2
Note: Depending on the selected functions (such as digital filters, input synchronization
stages, sample point adjustment, etc.), the maximum achievable baud rate can be
limited. Please note that there may be additional delays, such as internal or
external propagation delays and driver delays (e.g. for collision detection in UART
mode, for IIC, etc.).
Data Sheet
75
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.14
MultiCAN Module
The MultiCAN module contains independently operating CAN nodes with Full-CAN
functionality which are able to exchange Data and Remote Frames using a gateway
function. Transmission and reception of CAN frames is handled in accordance with CAN
specification V2.0 B (active). Each CAN node can receive and transmit standard frames
with 11-bit identifiers as well as extended frames with 29-bit identifiers.
All CAN nodes share a common set of message objects. Each message object can be
individually allocated to one of the CAN nodes. Besides serving as a storage container
for incoming and outgoing frames, message objects can be combined to build gateways
between the CAN nodes or to set up a FIFO buffer.
Note: The number of CAN nodes and message objects depends on the selected device
type.
The message objects are organized in double-chained linked lists, where each CAN
node has its own list of message objects. A CAN node stores frames only into message
objects that are allocated to its own message object list and it transmits only messages
belonging to this message object list. A powerful, command-driven list controller
performs all message object list operations.
MultiCAN Module Kernel
Clock
Control
CAN
Node 0
Interrupt
Control
Port
Control
...
Linked
List
Control
TXDCn
RXDCn
...
Message
Object
Buffer
...
Address
Decoder
CAN
Node n
fCAN
TXDC0
RXDC0
CAN Control
mc_multican_block.vsd
Figure 11
Data Sheet
Block Diagram of MultiCAN Module
76
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
MultiCAN Features
•
•
•
•
•
•
•
•
•
•
CAN functionality conforming to CAN specification V2.0 B active for each CAN node
(compliant to ISO 11898)
Independent CAN nodes
Set of independent message objects (shared by the CAN nodes)
Dedicated control registers for each CAN node
Data transfer rate up to 1 Mbit/s, individually programmable for each node
Flexible and powerful message transfer control and error handling capabilities
Full-CAN functionality for message objects:
– Can be assigned to one of the CAN nodes
– Configurable as transmit or receive objects, or as message buffer FIFO
– Handle 11-bit or 29-bit identifiers with programmable acceptance mask for filtering
– Remote Monitoring Mode, and frame counter for monitoring
Automatic Gateway Mode support
16 individually programmable interrupt nodes
Analyzer mode for CAN bus monitoring
3.15
System Timer
The System Timer consists of a programmable prescaler and two concatenated timers
(10 bits and 6 bits). Both timers can generate interrupt requests. The clock source can
be selected and the timers can also run during power reduction modes.
Therefore, the System Timer enables the software to maintain the current time for
scheduling functions or for the implementation of a clock.
3.16
Watchdog Timer
The Watchdog Timer is one of the fail-safe mechanisms which have been implemented
to prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after an application reset of the chip. It can be
disabled and enabled at any time by executing the instructions DISWDT and ENWDT
respectively. The software has to service the Watchdog Timer before it overflows. If this
is not the case because of a hardware or software failure, the Watchdog Timer
overflows, generating a prewarning interrupt and then a reset request.
The Watchdog Timer is a 16-bit timer clocked with the system clock divided by 16,384
or 256. The Watchdog Timer register is set to a prespecified reload value (stored in
WDTREL) in order to allow further variation of the monitored time interval. Each time it
is serviced by the application software, the Watchdog Timer is reloaded and the
prescaler is cleared.
Time intervals between 3.2 μs and 13.4 s can be monitored (@ 80 MHz).
Time intervals between 2.56 μs and 10.71 s can be monitored (@ 100 MHz).
Data Sheet
77
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
The default Watchdog Timer interval after power-up is 6.5 ms (@ 10 MHz).
3.17
Clock Generation
The Clock Generation Unit can generate the system clock signal fSYS for the XC2787X
from a number of external or internal clock sources:
•
•
•
•
External clock signals with pad voltage or core voltage levels
External crystal or resonator using the on-chip oscillator
On-chip clock source for operation without crystal/resonator
Wake-up clock (ultra-low-power) to further reduce power consumption
The programmable on-chip PLL with multiple prescalers generates a clock signal for
maximum system performance from standard crystals, a clock input signal, or from the
on-chip clock source. See also Section 4.7.2.
The Oscillator Watchdog (OWD) generates an interrupt if the crystal oscillator frequency
falls below a certain limit or stops completely. In this case, the system can be supplied
with an emergency clock to enable operation even after an external clock failure.
All available clock signals can be output on one of two selectable pins.
Data Sheet
78
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.18
Parallel Ports
The XC2787X provides up to 119 I/O lines which are organized into 11 input/output ports
and 2 input ports. All port lines are bit-addressable, and all input/output lines can be
individually (bit-wise) configured via port control registers. This configuration selects the
direction (input/output), push/pull or open-drain operation, activation of pull devices, and
edge characteristics (shape) and driver characteristics (output current) of the port
drivers. The I/O ports are true bidirectional ports which are switched to high impedance
state when configured as inputs. During the internal reset, all port pins are configured as
inputs without pull devices active.
All port lines have alternate input or output functions associated with them. These
alternate functions can be programmed to be assigned to various port pins to support the
best utilization for a given application. For this reason, certain functions appear several
times in Table 9.
All port lines that are not used for alternate functions may be used as general purpose
I/O lines.
Table 9
Summary of the XC2787X’s Ports
Port
Width
I/O
Connected Modules
P0
8
I/O
EBC (A7...A0), CCU6, USIC, CAN
P1
8
I/O
EBC (A15...A8), CCU6, USIC
P2
14
I/O
EBC (READY, BHE, A23...A16, AD15...AD13, D15...D13),
CAN, CC2, GPT12E, USIC, DAP/JTAG
P3
8
I/O
CAN, USIC
P4
8
I/O
EBC (CS4...CS0), CC2, CAN, GPT12E, USIC
P5
16
I
Analog Inputs, CCU6, DAP/JTAG, GPT12E, CAN, CC1
P6
4
I/O
ADC, CAN, GPT12E
P7
5
I/O
CAN, GPT12E, SCU, DAP/JTAG, CCU6, ADC, USIC
I/O
CCU6, DAP/JTAG, CC1, USIC
P8
P9
8
I/O
CCU6, DAP/JTAG, CAN, CC1
P10
16
I/O
EBC (ALE, RD, WR, AD12...AD0, D12...D0), CCU6, USIC,
DAP/JTAG, CAN
P11
6
I/O
CCU6, USIC, CAN
P15
8
I
Analog Inputs, GPT12E
Data Sheet
79
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
3.19
Instruction Set Summary
Table 10 lists the instructions of the XC2787X.
The addressing modes that can be used with a specific instruction, the function of the
instructions, parameters for conditional execution of instructions, and the opcodes for
each instruction can be found in the “Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Table 10
Instruction Set Summary
Mnemonic
Description
Bytes
ADD(B)
Add word (byte) operands
2/4
ADDC(B)
Add word (byte) operands with Carry
2/4
SUB(B)
Subtract word (byte) operands
2/4
SUBC(B)
Subtract word (byte) operands with Carry
2/4
MUL(U)
(Un)Signed multiply direct GPR by direct GPR
(16- × 16-bit)
2
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
DIVL(U)
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
CPL(B)
Complement direct word (byte) GPR
2
NEG(B)
Negate direct word (byte) GPR
2
AND(B)
Bitwise AND, (word/byte operands)
2/4
OR(B)
Bitwise OR, (word/byte operands)
2/4
XOR(B)
Bitwise exclusive OR, (word/byte operands)
2/4
BCLR/BSET
Clear/Set direct bit
2
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/BFLDL
Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B)
Compare word (byte) operands
2/4
CMPD1/2
Compare word data to GPR and decrement GPR by 1/2
2/4
CMPI1/2
Compare word data to GPR and increment GPR by 1/2
2/4
PRIOR
Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
2
SHL/SHR
Shift left/right direct word GPR
2
Data Sheet
80
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
Table 10
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
ROL/ROR
Rotate left/right direct word GPR
2
ASHR
Arithmetic (sign bit) shift right direct word GPR
2
MOV(B)
Move word (byte) data
2/4
MOVBS/Z
Move byte operand to word op. with sign/zero extension
2/4
JMPA/I/R
Jump absolute/indirect/relative if condition is met
4
JMPS
Jump absolute to a code segment
4
JB(C)
Jump relative if direct bit is set (and clear bit)
4
JNB(S)
Jump relative if direct bit is not set (and set bit)
4
CALLA/I/R
Call absolute/indirect/relative subroutine if condition is met 4
CALLS
Call absolute subroutine in any code segment
4
PCALL
Push direct word register onto system stack and call
absolute subroutine
4
TRAP
Call interrupt service routine via immediate trap number
2
PUSH/POP
Push/pop direct word register onto/from system stack
2
SCXT
Push direct word register onto system stack and update
register with word operand
4
RET(P)
Return from intra-segment subroutine
(and pop direct word register from system stack)
2
RETS
Return from inter-segment subroutine
2
RETI
Return from interrupt service subroutine
2
SBRK
Software Break
2
SRST
Software Reset
4
IDLE
Enter Idle Mode
PWRDN
Unused instruction
4
1)
4
SRVWDT
Service Watchdog Timer
4
DISWDT/ENWDT
Disable/Enable Watchdog Timer
4
EINIT
End-of-Initialization Register Lock
4
ATOMIC
Begin ATOMIC sequence
2
EXTR
Begin EXTended Register sequence
2
EXTP(R)
Begin EXTended Page (and Register) sequence
2/4
EXTS(R)
Begin EXTended Segment (and Register) sequence
2/4
Data Sheet
81
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Functional Description
Table 10
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
NOP
Null operation
2
CoMUL/CoMAC
Multiply (and accumulate)
4
CoADD/CoSUB
Add/Subtract
4
Co(A)SHR
(Arithmetic) Shift right
4
CoSHL
Shift left
4
CoLOAD/STORE
Load accumulator/Store MAC register
4
CoCMP
Compare
4
CoMAX/MIN
Maximum/Minimum
4
CoABS/CoRND
Absolute value/Round accumulator
4
CoMOV
Data move
4
CoNEG/NOP
Negate accumulator/Null operation
4
1) The Enter Power Down Mode instruction is not used in the XC2787X, due to the enhanced power control
scheme. PWRDN will be correctly decoded, but will trigger no action.
Data Sheet
82
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4
Electrical Parameters
The operating range for the XC2787X is defined by its electrical parameters. For proper
operation the specified limits must be respected when integrating the device in its target
environment.
4.1
General Parameters
These parameters are valid for all subsequent descriptions, unless otherwise noted.
Table 11
Absolute Maximum Rating Parameters
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Note /
Test Condition
Output current on a pin
when high value is driven
IOH SR
-30
−
−
mA
Output current on a pin
when low value is driven
IOL SR
−
−
30
mA
-10
−
10
mA
1)
−
−
100
mA
1)
IOV SR
Absolute sum of overload Σ|IOV|
Overload current
currents
SR
Junction Temperature
TJ SR
-40
TST SR -65
VDDP SR -0.5
−
150
°C
−
150
°C
−
6.0
V
VIN SR
−
Storage Temperature
Digital supply voltage for
IO pads and voltage
regulators
Voltage on any pin with
respect to ground (Vss)
-0.5
VDDP + V
VIN≤ VDDP(max)
0.5
1) Overload condition occurs if the input voltage VIN is out of the absolute maximum rating range. In this case the
current must be limited to the listed values by design measures.
Note: Stresses above the values listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only. Functional operation
of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for an extended time may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Data Sheet
83
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.1.1
Operating Conditions
The following operating conditions must not be exceeded to ensure correct operation of
the XC2787X. All parameters specified in the following sections refer to these operating
conditions, unless otherwise noticed.
Note: Typical parameter values refer to room temperature and nominal supply voltage,
minimum/maximum
parameter
values
also
include
conditions
of
minimum/maximum temperature and minimum/maximum supply voltage.
Additional details are described where applicable.
Table 12
Operating Conditions
Parameter
Symbol
Voltage Regulator Buffer
Capacitance for DMP_M
CEVRM
Voltage Regulator Buffer
Capacitance for DMP_1
CEVR1
External Load
Capacitance
CL SR
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
1.0
−
4.7
μF
1)
0.68
−
2.2
μF
2)1)
−
203)
−
pF
SR
SR
pin out
driver= default
4)
fSYS SR −
IOVA SR -2
−
100
MHz
−
5
mA
not subject to
production test
Overload current for digital IOVD SR -5
inputs6)
−
5
mA
not subject to
production test
2.5 x
10-4
1.5 x
10-3
-
IOV< 0 mA; not
1.0 x
10-6
1.0 x
10-4
-
System frequency
Overload current for
analog inputs6)
Overload current coupling KOVA
factor for analog inputs7)
CC
−
−
Data Sheet
84
5)
subject to
production test
IOV> 0 mA; not
subject to
production test
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 12
Operating Conditions (cont’d)
Parameter
Symbol
Overload current coupling KOVD
factor for digital I/O pins
CC
Values
Unit
Typ.
Max.
−
1.0 x
10-2
3.0 x
10-2
IOV< 0 mA; not
1.0 x
10-4
5.0 x
10-3
IOV> 0 mA; not
−
subject to
production test
subject to
production test
Σ|IOV|
SR
−
−
50
Digital core supply voltage VDDIM
for domain M8)
CC
−
1.5
−
Digital core supply voltage VDDI1
for domain 18)
CC
−
1.5
−
−
5.5
V
0
−
V
Absolute sum of overload
currents
Note /
Test Condition
Min.
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR 3.0
Digital ground voltage
VSS SR
−
mA
not subject to
production test
1) To ensure the stability of the voltage regulators the EVRs must be buffered with ceramic capacitors. Separate
buffer capacitors with the recomended values shall be connected as close as possible to each VDDIM and VDDI1
pin to keep the resistance of the board tracks below 2 Ohm. Connect all VDDI1 pins together. The minimum
capacitance value is required for proper operation under all conditions (e.g. temperature). Higher values
slightly increase the startup time.
2) Use one Capacitor for each pin.
3) This is the reference load. For bigger capacitive loads, use the derating factors listed in the PAD properties
section.
4) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output
current may lead to increased delays or reduced driving capability (CL).
5) The operating frequency range may be reduced for specific device types. This is indicated in the device
designation (...FxxL). 80 MHz devices are marked ...F80L.
6) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range: VOV > VIHmax (IOV > 0) or VOV < VILmin ((IOV < 0). The absolute sum of input
overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified
limits. Proper operation under overload conditions depends on the application. Overload conditions must not
occur on pin XTAL1 (powered by VDDIM).
Data Sheet
85
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
7) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error
current adds to the respective pins leakage current (IOZ). The amount of error current depends on the overload
current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse
compared to the polarity of the overload current that produces it.The total current through a pin is |ITOT| = |IOZ|
+ (|IOV| KOV). The additional error current may distort the input voltage on analog inputs.
8) Value is controlled by on-chip regulator
Data Sheet
86
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.2
Voltage Range definitions
The XC2787X timing depends on the supply voltage. If such a dependency exists the
timing values are given for 2 voltage areas commonly used. The voltage areas are
defined in the following tables.
Table 13
Upper Voltage Range Definition
Parameter
Symbol
Values
Min.
Digital supply voltage for
IO pads and voltage
regulators
Table 14
VDDP SR 4.5
Max.
5
5.5
Note /
Test Condition
V
Lower Voltage Range Definition
Parameter
Symbol
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR 3.0
Values
Min.
4.2.1
Unit
Typ.
Unit
Typ.
Max.
3.3
4.5
Note /
Test Condition
V
Parameter Interpretation
The parameters listed in the following include both the characteristics of the XC2787X
and its demands on the system. To aid in correctly interpreting the parameters when
evaluating them for a design, they are marked accordingly in the column “Symbol”:
CC (Controller Characteristics):
The logic of the XC2787X provides signals with the specified characteristics.
SR (System Requirement):
The external system must provide signals with the specified characteristics to the
XC2787X.
Data Sheet
87
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.3
DC Parameters
These parameters are static or average values that may be exceeded during switching
transitions (e.g. output current).
The XC2787X can operate within a wide supply voltage range from 3.0 V to 5.5 V.
However, during operation this supply voltage must remain within 10 percent of the
selected nominal supply voltage. It cannot vary across the full operating voltage range.
Because of the supply voltage restriction and because electrical behavior depends on
the supply voltage, the parameters are specified separately for the upper and the lower
voltage range.
During operation, the supply voltages may only change with a maximum speed of
dV/dt < 1 V/ms.
Leakage current is strongly dependent on the operating temperature and the voltage
level at the respective pin. The maximum values in the following tables apply under worst
case conditions, i.e. maximum temperature and an input level equal to the supply
voltage.
The value for the leakage current in an application can be determined by using the
respective leakage derating formula (see tables) with values from that application.
The pads of the XC2787X are designed to operate in various driver modes. The DC
parameter specifications refer to the pad current limits specified in Section 4.7.4.
Data Sheet
88
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Pullup/Pulldown Device Behavior
Most pins of the XC2787X feature pullup or pulldown devices. For some special pins
these are fixed; for the port pins they can be selected by the application.
The specified current values indicate how to load the respective pin depending on the
intended signal level. Figure 12 shows the current paths.
The shaded resistors shown in the figure may be required to compensate system pull
currents that do not match the given limit values.
VDDP
Pullup
Pulldown
VSS
MC_XC2X_PULL
Figure 12
Data Sheet
Pullup/Pulldown Current Definition
89
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.3.1
DC Parameters for Upper Voltage Area
Keeping signal levels within the limits specified in this table ensures operation without
overload conditions. For signal levels outside these specifications, also refer to the
specification of the overload current IOV.
Note: Operating Conditions apply.
Table 15 is valid under the following conditions: VDDPtyp. 5 V; VDDP≥ 4.5 V; VDDP≤ 5.5 V
Table 15
DC Characteristics for Upper Voltage Range
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
10
pF
not subject to
production test
−
−
V
RS= 0 Ohm
Pin capacitance (digital
inputs/outputs). To be
doubled for double bond
pins.1)
CIO CC
Input Hysteresis2)
HYS CC 0.11 x
VDDP
Absolute input leakage
current on pins of analog
ports3)
|IOZ1|
CC
−
10
200
nA
VIN> VSS V;
VIN< VDDP
Absolute input leakage
current for all other pins.
To be doubled for double
bond pins.3)1)4)
|IOZ2|
CC
−
0.2
5
μA
−
0.2
15
μA
−
−
μA
−
−
30
μA
TJ≤ 110 °C;
VIN> VSS V;
VIN< VDDP
TJ≤ 150 °C;
VIN> VSS V;
VIN< VDDP
VIN≥
VIHmin(pulldown
_enabled) ;
VIN≤ VILmax(pull
up_enabled)
VIN≥ VIHmin(pull
up_enabled) ;
VIN≤ VILmax(pull
down_enabled)
0.7 x
−
Pull Level Force Current5) |IPLF| SR 250
Pull Level Keep Current6)
|IPLK|
SR
Input high voltage (all
except XTAL1)
VIH SR
Input low voltage
(all except XTAL1)
VIL SR
Data Sheet
VDDP
−
-0.3
VDDP + V
0.3
0.3 x
V
VDDP
90
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 15
DC Characteristics for Upper Voltage Range (cont’d)
Parameter
Symbol
Values
Min.
Output High voltage7)
Typ.
VOH CC VDDP - −
Unit
Note /
Test Condition
−
V
IOH≥ IOHmax
−
V
IOH≥ IOHnom 8)
Max.
1.0
VDDP - −
0.4
Output Low Voltage
7)
VOL CC
−
−
0.4
V
IOL≤ IOLnom 9)
−
−
1.0
V
IOL≤ IOLmax
1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the
normal value. For a list of affected pins refer to the pin definitions table in chapter 2.
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
3) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple
(VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the
leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Please refer to the definition of the overload coupling factor KOV.
4) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (TJ = junction temperature [°C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [μA]. For example, at
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (μA]. This voltage derating formula is an approximation
which applies for maximum temperature.
5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
device.
6) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
pin level.
7) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
8) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
9) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
Data Sheet
91
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.3.2
DC Parameters for Lower Voltage Area
Keeping signal levels within the limits specified in this table ensures operation without
overload conditions. For signal levels outside these specifications, also refer to the
specification of the overload current IOV.
Note: Operating Conditions apply.
Table 16
is valid under the following conditions: VDDPtyp. 3.3 V; VDDP≥ 3.0 V;
VDDP≤ 4.5 V
Table 16
DC Characteristics for Lower Voltage Range
Parameter
Symbol
Values
Pin capacitance (digital
inputs/outputs). To be
doubled for double bond
pins.1)
CIO CC
Input Hysteresis2)
HYS CC 0.07 x
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
10
pF
not subject to
production test
−
−
V
RS= 0 Ohm
VDDP
Absolute input leakage
current on pins of analog
ports3)
|IOZ1|
CC
−
10
200
nA
VIN> VSS V;
VIN< VDDP
Absolute input leakage
current for all other pins.
To be doubled for double
bond pins.3)1)4)
|IOZ2|
CC
−
0.2
2.5
μA
−
0.2
8
μA
−
−
μA
TJ≤ 110 °C;
VIN> VSS V;
VIN< VDDP
TJ≤ 150 °C;
VIN> VSS V;
VIN< VDDP
VIN≥ VIHmin(pull
down_enabled)
Pull Level Force Current5) |IPLF| SR 150
;
Pull Level Keep Current6)
|IPLK|
SR
Input high voltage (all
except XTAL1)
VIH SR
Data Sheet
−
−
0.7 x
−
VDDP
92
10
μA
VIN≤ VILmax(pull
up_enabled)
VIN≥ VIHmin(pull
up_enabled) ;
VIN≤ VILmax(pull
down_enabled)
VDDP + V
0.3
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 16
DC Characteristics for Lower Voltage Range (cont’d)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
-0.3
−
0.3 x
Input low voltage
(all except XTAL1)
VIL SR
Output High voltage7)
VOH CC VDDP - −
Note /
Test Condition
V
VDDP
−
V
IOH≥ IOHmax
−
V
IOH≥ IOHnom 8)
1.0
VDDP - −
0.4
Output Low Voltage7)
VOL CC
−
−
0.4
V
IOL≤ IOLnom 9)
−
−
1.0
V
IOL≤ IOLmax
1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the
normal value. For a list of affected pins refer to the pin definitions table in chapter 2.
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
3) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple
(VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the
leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Please refer to the definition of the overload coupling factor KOV.
4) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (TJ = junction temperature [°C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [μA]. For example, at
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (μA]. This voltage derating formula is an approximation
which applies for maximum temperature.
5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
device.
6) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
pin level.
7) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
8) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
9) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
Data Sheet
93
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.3.3
Power Consumption
The power consumed by the XC2787X depends on several factors such as supply
voltage, operating frequency, active circuits, and operating temperature. The power
consumption specified here consists of two components:
•
•
The switching current IS depends on the device activity
The leakage current ILK depends on the device temperature
To determine the actual power consumption, always both components, switching current
IS and leakage current ILK must be added:
IDDP = IS + ILK.
Note: The power consumption values are not subject to production test. They are
verified by design/characterization.
To determine the total power consumption for dimensioning the external power
supply, also the pad driver currents must be considered.
The given power consumption parameters and their values refer to specific operating
conditions:
•
•
Active mode:
Regular operation, i.e. peripherals are active, code execution out of Flash.
Stopover mode:
Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1
stopped.
Note: The maximum values cover the complete specified operating range of all
manufactured devices.
The typical values refer to average devices under typical conditions, such as
nominal supply voltage, room temperature, application-oriented activity.
After a power reset, the decoupling capacitors for VDDIM and VDDI1 are charged with
the maximum possible current.
For additional information, please refer to Section 5.2, Thermal Considerations.
Note: Operating Conditions apply.
Data Sheet
94
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 17
Parameter
Switching Power Consumption
Symbol
ISACT
Power supply current
(active) with all peripherals CC
active and EVVRs on
Values
Min.
Typ.
Max.
−
25 +
0.9 x
25 +
1.4 x
fSYS1)
fSYS1)
1.4
4.0
Power supply current in
ISSO CC −
stopover mode, EVVRs on
Unit
Note /
Test Condition
mA
power_mode=
active ;
voltage_range=
both 2)3)4)
mA
power_mode=
stopover ;
voltage_range=
both 4)
1) fSYS in MHz
2) The pad supply voltage pins (VDDPB) provide the input current for the on-chip EVVRs and the current
consumed by the pin output drivers. A small current is consumed because the drivers input stages are
switched. In Fast Startup Mode (with the Flash modules deactivated), the typical current is reduced to 3 + 0.6
x fSYS.
3) Please consider the additional conditions described in section "Active Mode Power Supply Current".
4) The pad supply voltage has only a minor influence on this parameter.
Active Mode Power Supply Current
The actual power supply current in active mode not only depends on the system
frequency but also on the configuration of the XC2787X’s subsystem.
Besides the power consumed by the device logic the power supply pins also provide the
current that flows through the pin output drivers.
A small current is consumed because the drivers’ input stages are switched.
The IO power domains can be supplied separately. Power domain A (VDDPA) supplies the
A/D converters and Port 6. Power domain B (VDDPB) supplies the on-chip EVVRs and all
other ports.
During operation domain A draws a maximum current of 1.5 mA for each active A/D
converter module from VDDPA.
In Fast Startup Mode (with the Flash modules deactivated), the typical current is reduced
to 3 + 0.6×fSYS mA.
Data Sheet
95
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
IS [mA]
ISACTmax
180
160
140
ISACTtyp
120
100
80
60
40
20
20
40
80
60
100 fSYS [MHz]
MC_XC2XH_IS
Figure 13
Supply Current in Active Mode as a Function of Frequency
Note: Operating Conditions apply.
Table 18
Parameter
Leakage Power Consumption
Symbol
Leakage supply current1)2) ILK1 CC
Data Sheet
Values
Unit
Note /
Test Condition
TJ= 25 °C
TJ= 85 °C
TJ= 125 °C
TJ= 150 °C
Min.
Typ.
Max.
−
0.04
0.06
mA
−
0.7
1.8
mA
−
3.1
8.6
mA
−
6.6
19.2
mA
96
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
1) The supply current caused by leakage depends mainly on the junction temperature and the supply voltage.
The temperature difference between the junction temperature TJ and the ambient temperature TA must be
taken into account. As this fraction of the supply current does not depend on device activity, it must be added
to other power consumption values.
2) All inputs (including pins configured as inputs) are set at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP and all outputs
(including pins configured as outputs) are disconnected.
Note: A fraction of the leakage current flows through domain DMP_A (pin VDDPA). This
current can be calculated as 7,000 × e-α, with α = 5000 / (273 + 1.3×TJ).
For TJ = 150°C, this results in a current of 160 μA.
The leakage power consumption can be calculated according to the following formulas:
ILK1 = 600,000 + e-α with α = 5000 / (273 + B×TJ)
Parameter B must be replaced by
•
•
1.1 for typical values
1.4 for maximum values
Data Sheet
97
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
ILK [mA]
20
150°C area boundary
ILK1max
18
16
14
12
10
125°C area boundary
8
ILK1typ
6
4
2
-50
0
100
50
125
150
TJ [°C]
MC_XC2XH_ILKN
Figure 14
Leakage Supply Current as a Function of Temperature
Data Sheet
98
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.4
Analog/Digital Converter Parameters
These parameters describe the conditions for optimum ADC performance.
Note: Operating Conditions apply.
Table 19
ADC Parameters
Parameter
Symbol
Switched capacitance at
an analog input
CAINSW
Total capacitance at an
analog input
CAINT
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
6
pF
not subject to
production test
−
−
14
pF
not subject to
production test
Switched capacitance at
the reference input
CAREFSW −
−
10
pF
not subject to
production test
Total capacitance at the
reference input
CAREFT
−
−
21
pF
not subject to
production test
Differential Non-Linearity
Error
|EADNL|
CC
−
0.8
1
LSB
Gain Error
|EAGAIN| −
CC
0.4
0.8
LSB
Integral Non-Linearity
|EAINL|
CC
−
0.8
1.2
LSB
Offset Error
|EAOFF|
CC
−
0.5
0.8
LSB
Analog clock frequency
fADCI SR 0.5
−
16.5
MHz voltage_range=
lower
0.5
−
20
MHz voltage_range=
upper
RAIN CC −
−
2
kOh
m
not subject to
production test
−
−
2
kOh
m
not subject to
production test
Input resistance of the
selected analog channel
Input resistance of the
reference input
Data Sheet
CC
CC
CC
CC
RAREF
CC
99
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 19
ADC Parameters (cont’d)
Parameter
Symbol
Values
Min.
Unit
Typ.
Max.
Broken wire detection
delay against VAGND1)
tBWG CC −
−
502)
Broken wire detection
delay against VAREF1)
tBWR CC −
−
503)
Conversion time for 8-bit
result1)
tc8 CC
−
−
−
−
−
1
2
LSB
Wakeup time from analog tWAF CC −
powerdown, fast mode
−
4
μs
Wakeup time from analog tWAS CC −
powerdown, slow mode
−
15
μs
−
1.5
V
VAIN SR VAGND
−
VAREF
V
VAREF
VAGND
−
VDDPA
V
SR
+ 1.0
(11 +
Note /
Test Condition
STC) x
tADCI +
2x
tSYS
Conversion time for 10-bit tc10 CC
result1)
(13 +
STC) x
tADCI +
2x
tSYS
Total Unadjusted Error
Analog reference ground
Analog input voltage
range
Analog reference voltage
|TUE|
CC
VAGND
VSS -
SR
0.05
4)
5)
+ 0.05
1) This parameter includes the sample time (also the additional sample time specified by STC), the time to
determine the digital result and the time to load the result register with the conversion result. Values for the
basic clock tADCI depend on programming.
2) The broken wire detection delay against VAGND is measured in numbers of consecutive precharge cycles at a
conversion rate of not more than 500 μs. Result below 10% (66H)
3) The broken wire detection delay against VAREF is measured in numbers of consecutive precharge cycles at a
conversion rate of not more than 10 μs. This function is influenced by leakage current, in particular at high
temperature. Result above 80% (332H)
Data Sheet
100
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4) TUE is tested at VAREF = VDDPA = 5.0 V, VAGND = 0 V. It is verified by design for all other voltages within the
defined voltage range. The specified TUE is valid only if the absolute sum of input overload currents on analog
port pins (see IOV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the
measurement time.
5) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these
cases will be X000H or X3FFH, respectively.
RSource
V AIN
R AIN, On
C AINT - C AINS
C Ext
A/D Converter
CAINS
MCS05570
Figure 15
Data Sheet
Equivalent Circuitry for Analog Inputs
101
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Sample time and conversion time of the XC2787X’s A/D converters are programmable.
The timing above can be calculated using Table 20.
The limit values for fADCI must not be exceeded when selecting the prescaler value.
Table 20
A/D Converter Computation Table
GLOBCTR.5-0
(DIVA)
A/D Converter
Analog Clock fADCI
INPCRx.7-0
(STC)
000000B
fSYS
fSYS / 2
fSYS / 3
fSYS / (DIVA+1)
fSYS / 63
fSYS / 64
00H
000001B
000010B
:
111110B
111111B
01H
02H
:
FEH
FFH
Sample Time1)
tS
tADCI × 2
tADCI × 3
tADCI × 4
tADCI × (STC+2)
tADCI × 256
tADCI × 257
1) The selected sample time is doubled if broken wire detection is active (due to the presampling phase).
Converter Timing Example A:
Assumptions:
Analog clock
Sample time
fSYS
fADCI
tS
= 100 MHz (i.e. tSYS = 10 ns), DIVA = 03H, STC = 00H
= fSYS / 4 = 25 MHz, i.e. tADCI = 40 ns
= tADCI × 2 = 80 ns
Conversion 10-bit:
tC10
= 13 × tADCI + 2 × tSYS = 13 × 40 ns + 2 × 10ns = 0.540 μs
Conversion 8-bit:
tC8
= 11 × tADCI + 2 × tSYS = 11 × 40 ns + 2 × 10 ns = 0.460 μs
Converter Timing Example B:
Assumptions:
Analog clock
Sample time
fSYS
fADCI
tS
= 40 MHz (i.e. tSYS = 25 ns), DIVA = 02H, STC = 03H
= fSYS / 3 = 13.3 MHz, i.e. tADCI = 75 ns
= tADCI × 5 = 375 ns
Conversion 10-bit:
tC10
= 16 × tADCI + 2 × tSYS = 16 × 75 ns + 2 × 25 ns = 1.25 μs
Conversion 8-bit:
tC8
Data Sheet
= 14 × tADCI + 2 × tSYS = 14 × 75 ns + 2 × 25 ns = 1.10 μs
102
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.5
System Parameters
The following parameters specify several aspects which are important when integrating
the XC2787X into an application system.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 21
Various System Parameters
Parameter
Symbol
Values
Min.
Unit
Typ.
Max.
Note /
Test Condition
Short-term deviation of
internal clock source
frequency1)
ΔfINT CC -1
−
1
%
Internal clock source
frequency
fINT CC
4.8
5.0
5.2
MHz
Wakeup clock source
frequency2)
fWU CC
400
−
700
kHz
FREQSEL= 00
210
−
390
kHz
FREQSEL= 01
140
−
260
kHz
FREQSEL= 10
110
−
200
kHz
FREQSEL= 11
−
12 /
μs
Startup time from stopover tSSO CC 11 /
fWU3)
mode with code execution
from PSRAM
Core voltage (PVC)
supervision level
VPVC CC VLV -
Supply watchdog (SWD)
supervision level
VSWD
fWU3)
VLV
0.03
CC
VLV +
0.07
5)
V
4)
VLV -
VLV
VLV +
0.15
V
voltage_range=
lower 5)
VLV 0.15
VLV
VLV +
0.15
V
voltage_range=
upper 5)
0.106)
1) The short-term frequency deviation refers to a timeframe of 20 ms and is measured relative to the current
frequency at the beginning of the respective timeframe
2) This parameter is tested for the fastest and the slowest selection. The medium selections are not subject to
production test - verified by design/characterization
3) fWU in MHz
4) This value includes a hysteresis of approximately 50 mV for rising voltage.
5) VLV = selected SWD voltage level
6) The limit VLV - 0.10 V is valid for the OK1 level. The limit for the OK2 level is VLV - 0.15 V.
Data Sheet
103
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Conditions for tSSO Timing Measurement
The time required for the transition from Stopover to Stopover Waked-Up mode is
called tSSO. It is measured under the following conditions:
Precondition: The Stopover mode has been entered using the procedure defined in the
Programmer’s Guide.
Start condition: Pin toggle on ESR pin triggering the startup sequence.
End condition: External pin toggle caused by first user instruction executed from PSRAM
after startup.
Coding of bit fields LEVxV in SWD and PVC Configuration Registers
Table 22
Coding of bit fields LEVxV in Register SWDCON0
Code
Default Voltage Level
0000B
2.9 V
0001B
3.0 V
0010B
3.1 V
0011B
3.2 V
0100B
3.3 V
0101B
3.4 V
0110B
3.6 V
0111B
4.0 V
1000B
4.2 V
1001B
4.5 V
1010B
4.6 V
1011B
4.7 V
1100B
4.8 V
1101B
4.9 V
1110B
5.0 V
1111B
5.5 V
Notes1)
LEV1V: reset request
LEV2V: no request
1) The indicated default levels are selected automatically after a power reset.
Data Sheet
104
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 23
Coding of bit fields LEVxV in Registers PVCyCONz
Notes1)
Code
Default Voltage Level
000B
0.95 V
001B
1.05 V
010B
1.15 V
011B
1.25 V
100B
1.35 V
LEV1V: reset request
101B
1.45 V
LEV2V: interrupt request 2)
110B
1.55 V
111B
1.65 V
1) The indicated default levels are selected automatically after a power reset.
2) Due to variations of the tolerance of both the Embedded Voltage Regulators (EVR) and the PVC levels, this
interrupt can be triggered inadvertently, even though the core voltage is within the normal range. It is,
therefore, recommended not to use the this warning level.
Data Sheet
105
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.6
Flash Memory Parameters
The XC2787X is delivered with all Flash sectors erased and with no protection installed.
The data retention time of the XC2787X’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 24
Flash Parameters
Parameter
Symbol
Values
Min.
Unit
Note /
Test Condition
Typ.
Max.
NPP SR −
−
71)
−
−
1
2)
Flash erase endurance for NSEC SR 10
security pages
−
−
cycle tRET≥ 20 years
s
Flash wait states3)
NWSFLAS 1
−
−
H SR
2
−
−
3
−
−
4
−
−
NWSFLE
0
−
−
SR
1
−
−
2
−
−
1
−
−
fSYS≤ 8 MHz
fSYS≤ 13 MHz
fSYS≤ 17 MHz
fSYS> 17 MHz
fSYS≤ 80 MHz
fSYS> 80 MHz
fSYS> 128 MHz
fSYS> 80 MHz;
fSYS≤ 128 MHz
Parallel Flash module
program/erase limit
depending on Flash read
activity
Flash wait state
extension4)
NFL_RD≤ 1
NFL_RD> 1
Erase time per
sector/page
tER CC
−
75)
8.0
ms
Programming time per
page
tPR CC
−
35)
3.5
ms
Data retention time
tRET CC 20
−
−
year
s
Drain disturb limit
NDD SR 32
−
−
cycle
s
Data Sheet
106
NER≤ 1.000 cycl
es
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 24
Flash Parameters (cont’d)
Parameter
Symbol
Values
Min.
Number of erase cycles
Unit
Note /
Test Condition
Typ.
Max.
NER SR −
−
15.000 cycle tRET≥ 5 years;
s
Valid for up to
64 user
selected
sectors (data
storage)
−
−
1.000
cycle tRET≥ 20 years
s
1) All Flash module(s) can be erased/programmed while code is executed and/or data is read from only one
Flash module or from PSRAM. The Flash module that delivers code/data can, of course, not be
erased/programmed.
2) Flash module 6 can be erased/programmed while code is executed and/or data is read from any other Flash
module.
3) Value of IMB_IMBCTRL.WSFLASH.
4) Value of IMB_IMBCTRL.WSFLE.
5) Programming and erase times depend on the internal Flash clock source. The control state machine needs a
few system clock cycles. This increases the stated durations noticably only at extremely low system clock
frequencies.
Access to the XC2787X Flash modules is controlled by the IMB. Built-in prefetch
mechanisms optimize the performance for sequential access.
Flash access waitstates only affect non-sequential access. Due to prefetch
mechanisms, the performance for sequential access (depending on the software
structure) is only partially influenced by waitstates.
Data Sheet
107
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.7
AC Parameters
These parameters describe the dynamic behavior of the XC2787X.
4.7.1
Testing Waveforms
These values are used for characterization and production testing (except pin XTAL1).
Output delay
Output delay
Hold time
Hold time
0.8 V DDP
0.7 V DDP
Input Signal
(driven by tester)
0.3 V DDP
0.2 V DDP
Output Signal
(measured)
Output timings refer to the rising edge of CLKOUT.
Input timings are calculated from the time, when the input signal reaches
V IH or V IL, respectively.
MCD05556C
Figure 16
Input Output Waveforms
VLoad + 0.1 V
V OH - 0.1 V
Timing
Reference
Points
V Load - 0.1 V
V OL + 0.1 V
For timing purposes a port pin is no longer floating when a 100 mV
change from load voltage occurs, but begins to float when a 100 mV
change from the loaded V OH /V OL level occurs (IOH / IOL = 20 mA).
MCA05565
Figure 17
Data Sheet
Floating Waveforms
108
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.7.2
Definition of Internal Timing
The internal operation of the XC2787X is controlled by the internal system clock fSYS.
Because the system clock signal fSYS can be generated from a number of internal and
external sources using different mechanisms, the duration of the system clock periods
(TCSs) and their variation (as well as the derived external timing) depend on the
mechanism used to generate fSYS. This must be considered when calculating the timing
for the XC2787X.
Phase Locked Loop Operation (1:N)
fI N
f SYS
TCS
Direct Clock Drive (1:1)
fI N
f SYS
TCS
Prescaler Operation (N:1)
fI N
f SYS
TCS
M C_XC2X_CLOCKGEN
Figure 18
Generation Mechanisms for the System Clock
Note: The example of PLL operation shown in Figure 18 uses a PLL factor of 1:4; the
example of prescaler operation uses a divider factor of 2:1.
The specification of the external timing (AC Characteristics) depends on the period of the
system clock (TCS).
Data Sheet
109
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Direct Drive
When direct drive operation is selected (SYSCON0.CLKSEL = 11B), the system clock is
derived directly from the input clock signal CLKIN1:
fSYS = fIN.
The frequency of fSYS is the same as the frequency of fIN. In this case the high and low
times of fSYS are determined by the duty cycle of the input clock fIN.
Selecting Bypass Operation from the XTAL11) input and using a divider factor of 1 results
in a similar configuration.
Prescaler Operation
When prescaler operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY =
1B), the system clock is derived either from the crystal oscillator (input clock signal
XTAL1) or from the internal clock source through the output prescaler K1 (= K1DIV+1):
fSYS = fOSC / K1.
If a divider factor of 1 is selected, the frequency of fSYS equals the frequency of fOSC. In
this case the high and low times of fSYS are determined by the duty cycle of the input
clock fOSC (external or internal).
The lowest system clock frequency results from selecting the maximum value for the
divider factor K1:
fSYS = fOSC / 1024.
4.7.2.1
Phase Locked Loop (PLL)
When PLL operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 0B),
the on-chip phase locked loop is enabled and provides the system clock. The PLL
multiplies the input frequency by the factor F (fSYS = fIN × F).
F is calculated from the input divider P (= PDIV+1), the multiplication factor N (=
NDIV+1), and the output divider K2 (= K2DIV+1):
(F = N / (P × K2)).
The input clock can be derived either from an external source at XTAL1 or from the onchip clock source.
The PLL circuit synchronizes the system clock to the input clock. This synchronization is
performed smoothly so that the system clock frequency does not change abruptly.
Adjustment to the input clock continuously changes the frequency of fSYS so that it is
locked to fIN. The slight variation causes a jitter of fSYS which in turn affects the duration
of individual TCSs.
1) Voltages on XTAL1 must comply to the core supply voltage VDDIM.
Data Sheet
110
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
The timing in the AC Characteristics refers to TCSs. Timing must be calculated using the
minimum TCS possible under the given circumstances.
The actual minimum value for TCS depends on the jitter of the PLL. Because the PLL is
constantly adjusting its output frequency to correspond to the input frequency (from
crystal or oscillator), the accumulated jitter is limited. This means that the relative
deviation for periods of more than one TCS is lower than for a single TCS (see formulas
and Figure 19).
This is especially important for bus cycles using waitstates and for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
The value of the accumulated PLL jitter depends on the number of consecutive VCO
output cycles within the respective timeframe. The VCO output clock is divided by the
output prescaler K2 to generate the system clock signal fSYS. The number of VCO cycles
is K2 × T, where T is the number of consecutive fSYS cycles (TCS).
The maximum accumulated jitter (long-term jitter) DTmax is defined by:
DTmax [ns] = ±(220 / (K2 × fSYS) + 4.3)
This maximum value is applicable, if either the number of clock cycles T > (fSYS / 1.2) or
the prescaler value K2 > 17.
In all other cases for a timeframe of T × TCS the accumulated jitter DT is determined by:
DT [ns] = DTmax × [(1 - 0.058 × K2) × (T - 1) / (0.83 × fSYS - 1) + 0.058 × K2]
fSYS in [MHz] in all formulas.
Example, for a period of 3 TCSs @ 33 MHz and K2 = 4:
Dmax = ±(220 / (4 × 33) + 4.3) = 5.97 ns (Not applicable directly in this case!)
D3 = 5.97 × [(1 - 0.058 × 4) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 4]
= 5.97 × [0.768 × 2 / 26.39 + 0.232]
= 1.7 ns
Example, for a period of 3 TCSs @ 33 MHz and K2 = 2:
Dmax = ±(220 / (2 × 33) + 4.3) = 7.63 ns (Not applicable directly in this case!)
D3 = 7.63 × [(1 - 0.058 × 2) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 2]
= 7.63 × [0.884 × 2 / 26.39 + 0.116]
= 1.4 ns
Data Sheet
111
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Acc. jitter DT
ns
±9
fSYS = 33 MHz fSYS = 66 MHz
fVCO = 66 MHz
±8
±7
f VCO = 132 MHz
±6
±5
±4
±3
±2
±1
Cycles T
0
1
20
40
60
80
100
MC_XC2X_JITTER
Figure 19
Approximated Accumulated PLL Jitter
Note: The specified PLL jitter values are valid if the capacitive load per pin does not
exceed CL = 20 pF.
The maximum peak-to-peak noise on the pad supply voltage (measured between
VDDPB pin 144 and VSS pin 1) is limited to a peak-to-peak voltage of VPP = 50 mV.
This can be achieved by appropriate blocking of the supply voltage as close as
possible to the supply pins and using PCB supply and ground planes.
PLL frequency band selection
Different frequency bands can be selected for the VCO so that the operation of the PLL
can be adjusted to a wide range of input and output frequencies:
Data Sheet
112
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 25
System PLL Parameters
Parameter
Symbol
Values
Min.
VCO output frequency
Table 26
Note /
Test Condition
Max.
−
112
MHz VCOSEL= 00b
;
VCOmode= con
trolled
−
−
38
MHz VCOSEL= 00b
;
VCOmode= fre
e running
96
−
200
MHz VCOSEL= 01b
;
VCOmode= con
trolled
−
−
76
MHz VCOSEL= 01b
;
VCOmode= fre
e running
fVCO CC 48
FlexRay PLL Parameters
Parameter
Symbol
Values
Min.
VCO output frequency
fVCA CC 480
80
4.7.2.2
Unit
Typ.
Unit
Note /
Test Condition
Typ.
Max.
−
480
MHz VCOmode= con
trolled
−
340
MHz VCOmode= fre
e running
Wakeup Clock
When wakeup operation is selected (SYSCON0.CLKSEL = 00B), the system clock is
derived from the low-frequency wakeup clock source:
fSYS = fWU.
In this mode, a basic functionality can be maintained without requiring an external clock
source and while minimizing the power consumption.
Data Sheet
113
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.7.2.3
Selecting and Changing the Operating Frequency
When selecting a clock source and the clock generation method, the required
parameters must be carefully written to the respective bit fields, to avoid unintended
intermediate states.
Many applications change the frequency of the system clock (fSYS) during operation in
order to optimize system performance and power consumption. Changing the operating
frequency also changes the switching currents, which influences the power supply.
To ensure proper operation of the on-chip EVRs while they generate the core voltage,
the operating frequency shall only be changed in certain steps. This prevents overshoots
and undershoots of the supply voltage.
To avoid the indicated problems, recommended sequences are provided which ensure
the intended operation of the clock system interacting with the power system.
Please refer to the Programmer’s Guide.
Data Sheet
114
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.7.3
External Clock Input Parameters
These parameters specify the external clock generation for the XC2787X. The clock can
be generated in two ways:
•
•
By connecting a crystal or ceramic resonator to pins XTAL1/XTAL2
By supplying an external clock signal
– This clock signal can be supplied either to pin XTAL1 (core voltage domain) or to
pin CLKIN1 or CLKIN2 (IO voltage domain)
If connected to CLKIN1 or CLKIN2, the input signal must reach the defined input levels
VIL and VIH. If connected to XTAL1, a minimum amplitude VAX1 (peak-to-peak voltage) is
sufficient for the operation of the on-chip oscillator.
Note: The given clock timing parameters (t1 … t4) are only valid for an external clock
input signal.
Note: Operating Conditions apply.
Table 27
External Clock Input Characteristics
Parameter
Symbol
Values
Min.
Oscillator frequency
XTAL1 input current
absolute value
XTAL11)
Max.
fOSC SR 4
−
40
MHz Input= Clock
Signal
4
−
20
MHz Input= Crystal
or Ceramic
Resonator
−
−
20
μA
6
−
−
ns
6
−
−
ns
−
8
8
ns
−
8
8
ns
0.3 x
−
−
V
−
−
V
−
−
V
−
1.7
V
|IIL| CC
VDDIM
0.4 x
VDDIM
0.5 x
VDDIM
Input voltage range limits
for signal on XTAL1
Data Sheet
Note /
Test Condition
Typ.
t1 SR
Input clock low time
t2 SR
t3 SR
Input clock rise time
Input clock fall time
t4 SR
Input voltage amplitude on VAX1 SR
Input clock high time
Unit
VIX1 SR -1.7 +
VDDIM
115
fOSC≥ 4 MHz;
fOSC< 16 MHz
fOSC≥ 16 MHz;
fOSC< 25 MHz
fOSC≥ 25 MHz;
fOSC≤ 40 MHz
2)
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
1) The amplitude voltage VAX1 refers to the offset voltage VOFF. This offset voltage must be stable during the
operation and the resulting voltage peaks must remain within the limits defined by VIX1.
2) Overload conditions must not occur on pin XTAL1.
Note: For crystal or ceramic resonator operation, it is strongly recommended to measure
the oscillation allowance (negative resistance) in the final target system (layout) to
determine the optimum parameters for oscillator operation.
The manufacturers of crystals and ceramic resonators offer an oscillator
evaluation service. This evaluation checks the crystal/resonator specification
limits to ensure a reliable oscillator operation.
t1
VOFF
t3
0.9 VAX1
0.1 VAX1
VAX1
t2
t4
tOSC = 1/fOSC
MC_ EXTCLOCK
Figure 20
Data Sheet
External Clock Drive XTAL1
116
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.7.4
Pad Properties
The output pad drivers of the XC2787X can operate in several user-selectable modes.
Strong driver mode allows controlling external components requiring higher currents
such as power bridges or LEDs. Reducing the driving power of an output pad reduces
electromagnetic emissions (EME). In strong driver mode, selecting a slower edge
reduces EME.
The dynamic behavior, i.e. the rise time and fall time, depends on the applied external
capacitance that must be charged and discharged. Timing values are given for a
capacitance of 20 pF, unless otherwise noted.
In general, the performance of a pad driver depends on the available supply voltage
VDDP. Therefore the following tables list the pad parameters for the upper voltage range
and the lower voltage range, respectively.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 28 is valid under the following conditions: VDDPtyp. 5 V; VDDP≥ 4.5 V; VDDP≤ 5.5 V
Table 28
Standard Pad Parameters for Upper Voltage Range
Parameter
Maximum output driver
current (absolute value)1)
Nominal output driver
current (absolute value)
Data Sheet
Symbol
IOmax
Values
Unit
Note /
Test Condition
4.0
mA
Driver_Strength
= Medium
−
10
mA
Driver_Strength
= Strong
−
−
0.5
mA
Driver_Strength
= Weak
−
−
1.0
mA
Driver_Strength
= Medium
−
−
2.5
mA
Driver_Strength
= Strong
−
−
0.1
mA
Driver_Strength
= Weak
Min.
Typ.
Max.
−
−
−
CC
IOnom
CC
117
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 28
Parameter
Standard Pad Parameters for Upper Voltage Range (cont’d)
Symbol
Rise and Fall times (10% - tRF CC
90%)
Values
Min.
Typ.
Max.
−
−
23 +
0.6 x
−
−
−
−
−
−
−
−
Unit
Note /
Test Condition
ns
CL≥ 20 pF;
CL≤ 100 pF;
CL
Driver_Strength
= Medium
11.6 + ns
0.22 x
CL≥ 20 pF;
CL≤ 100 pF;
CL
Driver_Strength
= Strong ;
Driver_Edge=
Medium
4.2 +
0.14 x
ns
CL≥ 20 pF;
CL≤ 100 pF;
CL
Driver_Strength
= Strong ;
Driver_Edge=
Sharp
20.6 + ns
0.22 x
CL≥ 20 pF;
CL≤ 100 pF;
CL
Driver_Strength
= Strong ;
Driver_Edge=
Slow
212 +
1.9 x
CL
ns
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Weak
1) An output current above |IOXnom| may be drawn from up to three pins at the same time. For any group of 16
neighboring output pins, the total output current in each direction (ΣIOL and Σ-IOH) must remain below 50 mA.
Data Sheet
118
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 29
Standard Pad Parameters for Lower Voltage Range
Parameter
Maximum output driver
current (absolute value)1)
Nominal output driver
current (absolute value)
Data Sheet
Symbol
IOmax
Values
Unit
Note /
Test Condition
2.5
mA
Driver_Strength
= Medium
−
10
mA
Driver_Strength
= Strong
−
−
0.5
mA
Driver_Strength
= Weak
−
−
1.0
mA
Driver_Strength
= Medium
−
−
2.5
mA
Driver_Strength
= Strong
−
−
0.1
mA
Driver_Strength
= Weak
Min.
Typ.
Max.
−
−
−
CC
IOnom
CC
119
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 29
Parameter
Standard Pad Parameters for Lower Voltage Range (cont’d)
Symbol
Rise and Fall times (10% - tRF CC
90%)
Values
Min.
Typ.
Max.
−
−
37 +
0.65 x
Unit
Note /
Test Condition
ns
CL≥ 20 pF;
CL≤ 100 pF;
CL
−
−
24 +
0.3 x
Driver_Strength
= Medium
ns
CL
−
−
6.2 +
0.24 x
Driver_Strength
= Strong ;
Driver_Edge=
Medium
ns
CL
−
−
34 +
0.3 x
−
500 +
2.5 x
CL
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Strong ;
Driver_Edge=
Sharp
ns
CL
−
CL≥ 20 pF;
CL≤ 100 pF;
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Strong ;
Driver_Edge=
Slow
ns
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Weak
1) An output current above |IOXnom| may be drawn from up to three pins at the same time. For any group of 16
neighboring output pins, the total output current in each direction (ΣIOL and Σ-IOH) must remain below 50 mA.
Data Sheet
120
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.7.5
External Bus Timing
The following parameters specify the behavior of the XC2787X bus interface.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 30
Parameters
Parameter
Symbol
CLKOUT Cycle Time1)
t5 CC
t6 CC
t7 CC
t8 CC
t9 CC
CLKOUT high time
CLKOUT low time
CLKOUT rise time
CLKOUT fall time
Values
Unit
Min.
Typ.
Max.
−
1 / fSYS −
2
−
−
2
−
−
−
−
3
−
−
3
Note /
Test Condition
ns
ns
1) The CLKOUT cycle time is influenced by PLL jitter. For longer periods the relative deviation decreases (see
PLL deviation formula).
t9
t5
t6
t7
t8
CLKOUT
MC_X_EBCCLKOUT
Figure 21
CLKOUT Signal Timing
Note: The term CLKOUT refers to the reference clock output signal which is generated
by selecting fSYS as the source signal for the clock output signal EXTCLK on pin
P2.8 and by enabling the high-speed clock driver on this pin.
Data Sheet
121
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Variable Memory Cycles
External bus cycles of the XC2787X are executed in five consecutive cycle phases (AB,
C, D, E, F). The duration of each cycle phase is programmable (via the TCONCSx
registers) to adapt the external bus cycles to the respective external module (memory,
peripheral, etc.).
The duration of the access phase can optionally be controlled by the external module
using the READY handshake input.
This table provides a summary of the phases and the ranges for their length.
Table 31
Programmable Bus Cycle Phases (see timing diagrams)
Bus Cycle Phase
Parameter
Address setup phase, the standard duration of this tpAB
phase (1 … 2 TCS) can be extended by 0 … 3 TCS
if the address window is changed
Valid Values Unit
1 … 2 (5)
TCS
Command delay phase
tpC
0…3
TCS
Write Data setup/MUX Tristate phase
tpD
0…1
TCS
Access phase
tpE
1 … 32
TCS
Address/Write Data hold phase
tpF
0…3
TCS
Note: The bandwidth of a parameter (from minimum to maximum value) covers the
whole operating range (temperature, voltage) as well as process variations. Within
a given device, however, this bandwidth is smaller than the specified range. This
is also due to interdependencies between certain parameters. Some of these
interdependencies are described in additional notes (see standard timing).
Note: Operating Conditions apply.
Table 32 is valid under the following conditions: CL= 20 pF; voltage_range= upper ;
voltage_range= upper
Table 32
External Bus Timing for Upper Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Output valid delay for RD, t10 CC
WR(L/H)
−
7
13
ns
t11 CC
−
7
14
ns
Address output valid delay t12 CC
for A23 ... A0
−
8
14
ns
Output valid delay for
BHE, ALE
Data Sheet
122
Note /
Test Condition
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 32
External Bus Timing for Upper Voltage Range (cont’d)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Address output valid delay t13 CC
for AD15 ... AD0 (MUX
mode)
−
8
15
ns
t14 CC
Data output valid delay for t15 CC
−
7
13
ns
−
8
15
ns
−
8
15
ns
t20 CC
-2
6
8
ns
Output hold time for BHE, t21 CC
ALE
-2
6
10
ns
Address output hold time
for AD15 ... AD0
t23 CC
-3
6
8
ns
Output hold time for CS
t24 CC
t25 CC
-3
6
11
ns
-3
6
8
ns
Input setup time for
t30 SR
READY, D15 ... D0, AD15
... AD0
25
15
−
ns
Input hold time READY,
t31 SR
D15 ... D0, AD15 ... AD01)
0
-7
−
ns
Output valid delay for CS
Note /
Test Condition
AD15 ... AD0 (write data,
MUX mode)
Data output valid delay for t16 CC
D15 ... D0 (write data,
DEMUX mode)
Output hold time for RD,
WR(L/H)
Data output hold time for
D15 ... D0 and AD15 ...
AD0
1) Read data are latched with the same internal clock edge that triggers the address change and the rising edge
of RD. Address changes before the end of RD have no impact on (demultiplexed) read cycles. Read data can
change after the rising edge of RD.
Table 33 is valid under the following conditions: CL= 20 pF; voltage_range= lower ;
voltage_range= lower
Data Sheet
123
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 33
External Bus Timing for Lower Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Output valid delay for RD, t10 CC
WR(L/H)
−
11
20
ns
t11 CC
−
10
21
ns
Address output valid delay t12 CC
for A23 ... A0
−
11
22
ns
Address output valid delay t13 CC
for AD15 ... AD0 (MUX
mode)
−
10
22
ns
t14 CC
Data output valid delay for t15 CC
−
10
13
ns
−
10
22
ns
−
10
22
ns
t20 CC
-2
8
10
ns
Output hold time for BHE, t21 CC
ALE
-2
8
10
ns
Address output hold time
for AD15 ... AD0
t23 CC
-3
8
10
ns
Output hold time for CS
t24 CC
t25 CC
-3
8
11
ns
-3
8
10
ns
Input setup time for
t30 SR
READY, D15 ... D0, AD15
... AD0
29
17
−
ns
Input hold time READY,
t31 SR
D15 ... D0, AD15 ... AD01)
0
-9
−
ns
Output valid delay for
BHE, ALE
Output valid delay for CS
Note /
Test Condition
AD15 ... AD0 (write data,
MUX mode)
Data output valid delay for t16 CC
D15 ... D0 (write data,
DEMUX mode)
Output hold time for RD,
WR(L/H)
Data output hold time for
D15 ... D0 and AD15 ...
AD0
1) Read data are latched with the same internal clock edge that triggers the address change and the rising edge
of RD. Address changes before the end of RD have no impact on (demultiplexed) read cycles. Read data can
change after the rising edge of RD.
Data Sheet
124
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
tpAB
tpC
tpD
tpE
tpF
CLKOUT
t21
t11
ALE
t11/ t12/t14
A23-A16,
BHE, CSx
t24
High Address
t20
t10
RD
WR(L/H)
t31
t13
AD15-AD0
(read)
t23
Low Address
Data In
t13
AD15-AD0
(write)
t30
t15
Low Address
t25
Data Out
MC_X_EBCMUX
Figure 22
Data Sheet
Multiplexed Bus Cycle
125
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
tpAB
tpC
tpD
tpE
tpF
CLKOUT
t21
t11
ALE
t11/ t12/t14
t24
A23-A0,
BHE, CSx
Address
t20
t10
RD
WR(L/H)
t31
t30
D15-D0
(read)
Data In
t16
D15-D0
(write)
t25
Data Out
MC_X_EBCDEMUX
Figure 23
4.7.5.1
Demultiplexed Bus Cycle
Bus Cycle Control with the READY Input
The duration of an external bus cycle can be controlled by the external circuit using the
READY input signal. The polarity of this input signal can be selected.
Synchronous READY permits the shortest possible bus cycle but requires the input
signal to be synchronous to the reference signal CLKOUT.
An asynchronous READY signal puts no timing constraints on the input signal but incurs
a minimum of one waitstate due to the additional synchronization stage. The minimum
Data Sheet
126
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
duration of an asynchronous READY signal for safe synchronization is one CLKOUT
period plus the input setup time.
An active READY signal can be deactivated in response to the trailing (rising) edge of
the corresponding command (RD or WR).
If the next bus cycle is controlled by READY, an active READY signal must be disabled
before the first valid sample point in the next bus cycle. This sample point depends on
the programmed phases of the next cycle.
tpD
tpE
tpRDY
tpF
CLKOUT
t10
t20
RD, WR
t31
t30
D15-D0
(read)
Data In
t25
D15-D0
(write)
Data Out
t31
t30
READY
Synchronous
Not Rdy
t31
t30
READY
t31
t30
READY
Asynchron.
t31
t30
Not Rdy
READY
MC_X_EBCREADY
Figure 24
Data Sheet
READY Timing
127
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Note: If the READY input is sampled inactive at the indicated sampling point (“Not Rdy”)
a READY-controlled waitstate is inserted (tpRDY),
sampling the READY input active at the indicated sampling point (“Ready”)
terminates the currently running bus cycle.
Note the different sampling points for synchronous and asynchronous READY.
This example uses one mandatory waitstate (see tpE) before the READY input
value is used.
Data Sheet
128
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.7.6
Synchronous Serial Interface Timing
The following parameters are applicable for a USIC channel operated in SSC mode.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 34
is valid under the following conditions: CL= 20 pF; SSC= master ;
voltage_range= upper
Table 34
USIC SSC Master Mode Timing for Upper Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
tSYS -
−
−
ns
Slave select output SELO t1 CC
active to first SCLKOUT
transmit edge
81)
Slave select output SELO t2 CC
inactive after last
SCLKOUT receive edge
tSYS -
−
−
ns
61)
t3 CC
-6
−
9
ns
Receive data input setup t4 SR
time to SCLKOUT receive
edge
31
−
−
ns
t5 SR
-4
−
−
ns
Data output DOUT valid
time
Data input DX0 hold time
from SCLKOUT receive
edge
Note /
Test Condition
1) tSYS = 1 / fSYS
Table 35
is valid under the following conditions: CL= 20 pF; SSC= master ;
voltage_range= lower
Data Sheet
129
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 35
USIC SSC Master Mode Timing for Lower Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
tSYS -
−
−
ns
Slave select output SELO t1 CC
active to first SCLKOUT
transmit edge
101)
Slave select output SELO t2 CC
inactive after last
SCLKOUT receive edge
tSYS -
−
−
ns
91)
t3 CC
-7
−
11
ns
Receive data input setup t4 SR
time to SCLKOUT receive
edge
40
−
−
ns
t5 SR
-5
−
−
ns
Data output DOUT valid
time
Data input DX0 hold time
from SCLKOUT receive
edge
Note /
Test Condition
1) tSYS = 1 / fSYS
Table 36
is valid under the following conditions: CL= 20 pF; SSC= slave ;
voltage_range= upper
Table 36
USIC SSC Slave Mode Timing for Upper Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
t10 SR
7
−
−
ns
Select input DX2 hold after t11 SR
last clock input DX1
receive edge1)
7
−
−
ns
t12 SR
7
−
−
ns
Select input DX2 setup to
first clock input DX1
transmit edge1)
Receive data input setup
time to shift clock receive
edge1)
Data Sheet
130
Note /
Test Condition
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 36
USIC SSC Slave Mode Timing for Upper Voltage Range (cont’d)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Data input DX0 hold time
from clock input DX1
receive edge1)
t13 SR
5
−
−
ns
Data output DOUT valid
time
t14 CC
7
−
33
ns
Note /
Test Condition
1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Table 37
is valid under the following conditions: CL= 20 pF; SSC= slave ;
voltage_range= lower
Table 37
USIC SSC Slave Mode Timing for Lower Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
t10 SR
7
−
−
ns
Select input DX2 hold after t11 SR
last clock input DX1
receive edge1)
7
−
−
ns
Receive data input setup
time to shift clock receive
edge1)
t12 SR
7
−
−
ns
Data input DX0 hold time
from clock input DX1
receive edge1)
t13 SR
5
−
−
ns
Data output DOUT valid
time
t14 CC
8
−
41
ns
Select input DX2 setup to
first clock input DX1
transmit edge1)
Note /
Test Condition
1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Data Sheet
131
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Master Mode Timing
t1
Select Output
SELOx
t2
Inactive
Inactive
Active
Clock Output
SCLKOUT
Receive
Edge
First Transmit
Edge
Last Receive
Edge
Transmit
Edge
t3
t3
Data Output
DOUT
t4
Data Input
DX0
t4
t5
Data
valid
t5
Data
valid
Slave Mode Timing
t10
Select Input
DX2
Clock Input
DX1
t11
Inactive
Inactive
Active
Receive
Edge
First Transmit
Edge
t12
Data Input
DX0
t12
t13
Data
valid
t 14
Last Receive
Edge
Transmit
Edge
t 13
Data
valid
t14
Data Output
DOUT
Transmit Edge: with this clock edge, transmit data is shifted to transmit data output.
Receive Edge: with this clock edge, receive data at receive data input is latched
.
Drawn for BRGH.SCLKCFG = 00B. Also valid for for SCLKCFG = 01B with inverted SCLKOUT signal.
USIC_SSC_TMGX.VSD
Figure 25
USIC - SSC Master/Slave Mode Timing
Note: This timing diagram shows a standard configuration where the slave select signal
is low-active and the serial clock signal is not shifted and not inverted.
Data Sheet
132
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 38
ERAY FlexRay Interface Timing
Parameter
Symbol
Values
Min.
Time span from last BSS
to FES without the
influence of quartz
tolerance (d10Bit_TX)1)
TxD data valid from
fsample flip flop txd_reg
=&gt; TxDA, TxDB
(dTxAsym)2)3)
t60 CC
Note /
Test Condition
1002.2 ns
5
fOSCDD= 20 MH
z; CL≤ 25 pF
−
1.5
CL≤ 25 pF
−
1046.0 ns
997.75 −
t61_minus_ −
t62
Max.
Typ.
Unit
ns
CC
Time span between last
BSS and FES without
influence of quartz
tolerance (d10Bit_RX)1)4)
t63 SR
RxD capture by fsample
(RxDA/RxDB =&gt;
sampling flip-flop)
(dRxAsym)4)
t64_minus_ −
966.5
fOSCDD= 20 MH
z
−
3.5
ns
t65 CC
1) PLL jitter included.
2) Refers to delays caused by the asymmetries of the output drivers of the digital logic and the GPIO pad drivers.
Quartz tolerance and PLL jitter are not included.
3) TxD output drivers have an asymmetry of rising and falling edges of |tF - tR| ≤ 1 ns.
4) Valid for output slopes of the Bus Driver of dRxSlope ≤ 5 ns at CL = 15pF, 20% x VDDP to 80% x VDDP, according
to the FlexRay Electrical Physical Layer Specification V2.1 B.
Data Sheet
133
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
4.7.7
Debug Interface Timing
The debugger can communicate with the XC2787X either via the 2-pin DAP interface or
via the standard JTAG interface.
Debug via DAP
The following parameters are applicable for communication through the DAP debug
interface.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 39 is valid under the following conditions: CL= 20 pF; voltage_range= upper
Table 39
DAP Interface Timing for Upper Voltage Range
Parameter
Symbol
DAP0 clock period1)
DAP0 high time
1)
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup to DAP0
rising edge
DAP1 hold after DAP0
rising edge
DAP1 valid per DAP0
clock period3)
t11 SR
t12 SR
t13 SR
t14 SR
t15 SR
t16 SR
t17 SR
t19 CC
Values
Unit
Min.
Typ.
Max.
Note /
Test Condition
25
−
−
ns
8
−
−
ns
8
−
−
ns
−
−
4
ns
−
−
4
ns
3
−
−
ns
pad_type= high
speed 2)
6
−
−
ns
pad_type= stan
dard
4
−
−
ns
pad_type= high
speed 2)
6
−
−
ns
pad_type= stan
dard
19
21
−
ns
pad_type= high
speed 2)
17
20
−
ns
pad_type= stan
dard
1) See the DAP chapter for clock rate restrictions in the Active::IDLE protocol state.
2) Available high speed pins can be found in the pin definitions table in chapter 2.
3) The Host has to find a suitable sampling point by analyzing the sync telegram response.
Data Sheet
134
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 40 is valid under the following conditions: CL= 20 pF; voltage_range= lower
Table 40
DAP Interface Timing for Lower Voltage Range
Parameter
Symbol
1)
t11 SR
t12 SR
t13 SR
t14 SR
t15 SR
t16 SR
DAP0 clock period
DAP0 high time
1)
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup to DAP0
rising edge
DAP1 hold after DAP0
rising edge
t17 SR
t19 CC
DAP1 valid per DAP0
clock period3)
Values
Unit
Min.
Typ.
Max.
25
−
−
ns
8
−
−
ns
Note /
Test Condition
8
−
−
ns
−
−
4
ns
−
−
4
ns
3
−
−
ns
pad_type= high
speed 2)
6
−
−
ns
pad_type= stan
dard
4
−
−
ns
pad_type= high
speed 2)
6
−
−
ns
pad_type= stan
dard
19
21
−
ns
pad_type= high
speed 2)
12
17
−
ns
pad_type= stan
dard
1) See the DAP chapter for clock rate restrictions in the Active::IDLE protocol state.
2) Available high speed pins can be found in the pin definitions table in chapter 2.
3) The Host has to find a suitable sampling point by analyzing the sync telegram response.
t 11
0.9 VDDP
0.5 VDDP
t15
t12
t 14
0.1 VDDP
t13
MC_DAP0
Figure 26
Data Sheet
Test Clock Timing (DAP0)
135
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
DAP0
t1 6
t1 7
DAP1
MC_ DAP1_RX
Figure 27
DAP Timing Host to Device
t1 1
DAP1
t1 9
MC_ DAP1_TX
Figure 28
DAP Timing Device to Host
Note: The transmission timing is determined by the receiving debugger by evaluating the
sync-request synchronization pattern telegram.
Debug via JTAG
The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 41 is valid under the following conditions: CL= 20 pF; voltage_range= upper
Table 41
JTAG Interface Timing for Upper Voltage Range
Parameter
TCK clock period
TCK high time
Data Sheet
Symbol
t1 SR
t2 SR
Values
Unit
Min.
Typ.
Max.
50
−
−
ns
16
−
−
ns
136
Note /
Test Condition
1)
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 41
JTAG Interface Timing for Upper Voltage Range (cont’d)
Parameter
Symbol
Values
Min.
Unit
Typ.
Max.
16
−
−
ns
−
−
8
ns
−
−
8
ns
6
−
−
ns
t7 SR
6
−
−
ns
TDO valid from TCK falling t8 CC
edge (propagation delay)2)
−
25
29
ns
TDO high impedance to
valid output from TCK
falling edge3)2)
t9 CC
−
25
29
ns
TDO valid output to high
impedance from TCK
falling edge2)
t10 CC
−
25
29
ns
TDO hold after TCK falling t18 CC
edge2)
5
−
−
ns
TCK low time
TCK clock rise time
TCK clock fall time
TDI/TMS setup to TCK
rising edge
TDI/TMS hold after TCK
rising edge
t3 SR
t4 SR
t5 SR
t6 SR
Note /
Test Condition
1) Under typical conditions, the JTAG interface can operate at transfer rates up to 20 MHz.
2) The falling edge on TCK is used to generate the TDO timing.
3) The setup time for TDO is given implicitly by the TCK cycle time.
Table 42 is valid under the following conditions: CL= 20 pF; voltage_range= lower
Table 42
JTAG Interface Timing for Lower Voltage Range
Parameter
Symbol
TCK clock period
t1 SR
t2 SR
t3 SR
t4 SR
t5 SR
t6 SR
TCK high time
TCK low time
TCK clock rise time
TCK clock fall time
TDI/TMS setup to TCK
rising edge
Data Sheet
Values
Unit
Min.
Typ.
Max.
50
−
−
ns
16
−
−
ns
16
−
−
ns
−
−
8
ns
−
−
8
ns
6
−
−
ns
137
Note /
Test Condition
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
Table 42
JTAG Interface Timing for Lower Voltage Range (cont’d)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
t7 SR
6
−
−
ns
TDO valid from TCK falling t8 CC
edge (propagation delay)1)
−
32
36
ns
TDO high impedance to
valid output from TCK
falling edge2)1)
t9 CC
−
32
36
ns
TDO valid output to high
impedance from TCK
falling edge1)
t10 CC
−
32
36
ns
TDO hold after TCK falling t18 CC
edge1)
5
−
−
ns
TDI/TMS hold after TCK
rising edge
Note /
Test Condition
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.
t1
0.9 VD D P
0.5 VD D P
t5
t2
t4
0.1 VD D P
t3
MC_ JTAG_ TCK
Figure 29
Data Sheet
Test Clock Timing (TCK)
138
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Electrical Parameters
TCK
t6
t7
t6
t7
TMS
TDI
t9
t8
t1 0
TDO
t18
MC_JTAG
Figure 30
Data Sheet
JTAG Timing
139
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Package and Reliability
5
Package and Reliability
The XC2000 Family devices use the package type PG-LQFP (Plastic Green - Low
Profile Quad Flat Package). The following specifications must be regarded to ensure
proper integration of the XC2787X in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 43
Package Parameters (PG-LQFP-144-13)
Parameter
Symbol
Limit Values
Min.
Unit Notes
Max.
Exposed Pad Dimension
Ex × Ey –
8.0 × 8.0
mm
–
Power Dissipation
PDISS
RΘJA
–
<1
W
–
–
44
K/W No thermal via1)
35
K/W 4-layer, no pad2)
21
K/W 4-layer, pad3)
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC2787X is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Data Sheet
140
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Package and Reliability
H
0.5
0.6 ±0.15
0.08 C 144x
COPLANARITY
17.5
7˚ MAX.
+0.05
0.15 -0
.06
1.6 MAX.
0.1±0.05
STAND OFF
1.4 ±0.05
Package Outlines
C
SEATING PLANE
0.22 ±0.05
0.08 M A-B D C 144x
22
20
Bottom View
0.2 A-B D 144x
1)
0.2 A-B D H 4x
Ex
Ey
22
B
20
A
1)
D
144
144
1
1
Index Marking
Exposed Diepad
1) Does not include plastic or metal protrusion of 0.25 max. per side
Figure 31
Index Marking
PG-LQFP-144-4, -13-PO V08
PG-LQFP-144-13 (Plastic Green Thin Quad Flat Package)
All dimensions in mm.
You can find complete information about Infineon packages, packing and marking in our
Infineon Internet Page “Packages”: http://www.infineon.com/packages
Data Sheet
141
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Package and Reliability
5.2
Thermal Considerations
When operating the XC2787X in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance RΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (PINT + PIOSTAT + PIODYN) × RΘJA
The internal power consumption is defined as
PINT = VDDP × IDDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
PIOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)
The dynamic external power consumption caused by the output drivers (PIODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Reduce VDDP, if possible in the system
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
Data Sheet
142
V1.2, 2010-09
XC2787X
XC2000 Family Derivatives / High Line
Package and Reliability
5.3
Quality Declarations
The operation lifetime of the XC2787X depends on the applied temperature profile in the
application. For a typical example, please refer to Table 45; for other profiles, please
contact your Infineon counterpart to calculate the specific lifetime within your application.
Table 44
Quality Parameters
Parameter
Symbol
Operation lifetime
Table 45
Unit
Note /
Test Condition
20
a
See Table 45
and Table 46
−
2 000
V
EIA/JESD22A114-B
−
3
−
JEDEC
J-STD-020C
Typ.
Max.
−
−
−
MSL CC −
tOP CC
ESD susceptibility
VHBM
according to Human Body SR
Model (HBM)
Moisture sensitivity level
Values
Min.
Typical Usage Temperature Profile
Operating Time (Sum = 20 years)
Operating Temperat.
Notes
1 200 h
TJ = 150°C
TJ = 125°C
TJ = 110°C
TJ = 100°C
TJ = 0…10°C, …,
Normal operation
3 600 h
7 200 h
12 000 h
7 × 21 600 h
Normal operation
Normal operation
Normal operation
Power reduction
60…70°C
Table 46
Long Time Storage Temperature Profile
Operating Time (Sum = 20 years)
Operating Temperat.
Notes
2 000 h
TJ = 150°C
TJ = 125°C
TJ = 110°C
TJ ≤ 150°C
Normal operation
16 000 h
6 000 h
151 200
Data Sheet
143
Normal operation
Normal operation
No operation
V1.2, 2010-09
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG