INFINEON TC1167

32-Bit
TC1167
32-Bit Single-Chip Microcontroller
Data Sheet
V1.3 2009-10
Microcontrollers
Edition 2009-10
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
32-Bit
TC1167
32-Bit Single-Chip Microcontroller
Data Sheet
V1.3 2009-10
Microcontrollers
TC1167
TC1167 Data Sheet
Revision History: V1.3, 2009-10
Previous Version: V0.1
Page
Subjects (major changes since last revision)
4
Typo of TTCAN-related text is deleted from the MultiCAN features.
24
Text which describes the endurance of PFlash and DFlash is enhanced
28
The text in the Data Access Overlay is enhanced
54
Input spike-filter is added to PORST.
54
A footnote is added to VDDMF
84
The spike-filters parameters are included, tSF1, tSF2
88
The maximum limit for IOZ1 is updated.
88
Footnote regarding switch capacitance at analog input is updated.
96
The temperature sensor measurement time parameter is added.
104
The condition for HWCFG is deleted from hold time from PORST rising
edge.
105
The power, pad, reset timing figure is updated.
106
The notes under the PLL section is updated
98
IDD at 80MHz for Infineon Power Loop and text for test condition are
updated.
104
Footnotes for application reset boot time, tB are enhanced.
118
The method used for the specified thermal resistance values is
included.
Trademarks
TriCore® is a trademark of Infineon Technologies AG.
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Data Sheet
V1.3, 2009-10
TC1167
Table of Contents
Table of Contents
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
2.1
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.2
2.2.1
2.2.2
2.2.3
2.2.3.1
2.2.3.2
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.3.4.1
2.3.4.2
2.3.4.3
2.3.4.4
2.3.4.5
2.3.5
2.3.6
2.3.6.1
2.3.6.2
2.3.6.3
2.3.6.4
2.3.6.5
2.3.7
2.3.8
2.4
2.4.1
2.4.2
2.4.3
2.4.4
2.4.5
2.4.6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
About this Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Related Documentations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Text Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Reserved, Undefined, and Unimplemented Terminology . . . . . . . . . . . . 9
Register Access Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations and Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
System Architecture of the TC1167 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
TC1167 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
System Features of the TC1167 device . . . . . . . . . . . . . . . . . . . . . . . . 15
On Chip CPU Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
High-performance 32-bit CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
High-performance 32-bit Peripheral Control Processor . . . . . . . . . . . 17
On Chip System Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Flexible Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Direct Memory Access Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Clock Generation Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Features of the Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
External Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Die Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
General Purpose I/O Ports and Peripheral I/O Lines . . . . . . . . . . . . . . . 22
Program Memory Unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Boot ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Overlay RAM and Data Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Emulation Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Tuning Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Program and Data Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Data Access Overlay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
TC1167 Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
On-Chip Peripheral Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Asynchronous/Synchronous Serial Interfaces . . . . . . . . . . . . . . . . . . . . 30
High-Speed Synchronous Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . 32
Micro Second Channel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
MultiCAN Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Micro Link Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
General Purpose Timer Array (GPTA) . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Data Sheet
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V1.3, 2009-10
TC1167
Table of Contents
2.4.6.1
2.4.7
2.4.7.1
2.4.7.2
2.5
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5
2.5.6
Functionality of GPTA0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog-to-Digital Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FADC Short Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real Time Trace . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Calibration Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tool Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Self-Test Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FAR Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
43
46
46
48
50
50
51
51
52
52
52
3
3.1
3.1.1
3.1.2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TC1167 Pin Definition and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TC1167 Pin Configuration: PG-LQFP-176-5 . . . . . . . . . . . . . . . . . . . . .
Reset Behavior of the Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
52
52
53
75
4
Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
5
5.1
5.1.1
5.1.2
5.1.3
5.1.4
5.2
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.3
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
5.3.6
5.3.7
5.3.8
5.3.8.1
5.3.8.2
5.3.8.3
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . 79
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Analog to Digital Converters (ADC0/ADC1) . . . . . . . . . . . . . . . . . . . . . 88
Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . . . . 93
Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
DAP Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Micro Link Interface (MLI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Micro Second Channel (MSC) Interface Timing . . . . . . . . . . . . . . . 115
SSC Master / Slave Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Data Sheet
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V1.3, 2009-10
TC1167
Table of Contents
5.4
5.4.1
5.4.2
5.4.3
5.4.4
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Sheet
3
118
118
119
120
121
V1.3, 2009-10
TC1167
Summary of Features
1
•
•
•
•
•
•
•
•
Summary of Features
High-performance 32-bit super-scalar TriCore V1.3.1 CPU with 4-stage pipeline
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Single precision Floating Point Unit (FPU)
– 133 MHz operation at full temperature range
32-bit Peripheral Control Processor with single cycle instruction (PCP2)
– 8 Kbyte Parameter Memory (PRAM)
– 16 Kbyte Code Memory (CMEM)
– 133 MHz operation at full temperature range
Multiple on-chip memories
– 72 Kbyte Data Memory (LDRAM)
– 24 Kbyte Code Scratchpad Memory (SPRAM)
– 1 Mbyte Program Flash Memory (PFlash)
– 64 Kbyte Data Flash Memory (DFlash, represents 16 Kbyte EEPROM)
– Instruction Cache: up to 16 Kbyte (ICACHE, configurable)
– Data Cache: up to 4 Kbyte (DCACHE, configurable)
– 8 Kbyte Overlay Memory (OVRAM)
– 16 Kbyte BootROM (BROM)
8-Channel DMA Controller
Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels
serviced by CPU or PCP2
High performing on-chip bus structure
– 64-bit Local Memory Buses between CPU, Flash and Data Memory
– 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
– One bus bridge (LFI Bridge)
Versatile On-chip Peripheral Units
– Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator,
parity, framing and overrun error detection
– Two High-Speed Synchronous Serial Channels (SSC) with programmable data
length and shift direction
– One serial Micro Second Bus interface (MSC) for serial port expansion to external
power devices
– One High-Speed Micro Link interface (MLI) for serial inter-processor
communication
– One MultiCAN Module with 2 CAN nodes and 64 free assignable message objects
for high efficiency data handling via FIFO buffering and gateway data transfer
– One General Purpose Timer Array Modules (GPTA) with additional Local Timer
Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer
functionality to realize autonomous and complex Input/Output management
32 analog input lines for ADC
Data Sheet
4
V1.3, 2009-10
TC1167
Summary of Features
•
•
•
•
•
•
•
•
•
•
•
•
– 2 independent kernels (ADC0, ADC1)
– Analog supply voltage range from 3.3 V to 5 V (single supply)
– Performance for 12 bit resolution (@fADCI = 10 MHz)
4 different FADC input channels
Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz)
– 10-bit A/D conversion (higher resolution can be achieved by averaging of
consecutive conversions in digital data reduction filter)
88 digital general purpose I/O lines (GPIO), 4 input lines
Digital I/O ports with 3.3 V capability
On-chip debug support for OCDS Level 1 (CPU, PCP, DMA, On Chip Bus)
Dedicated Emulation Device chip available (TC1767ED)
– multi-core debugging, real time tracing, and calibration
– four/five wire JTAG (IEEE 1149.1) or two wire DAP (Device Access Port) interface
Power Management System
Clock Generation Unit with PLL
Core supply voltage of 1.5 V
I/O voltage of 3.3 V
Full industrial temperature range: -40° to +85°C
Package variant: PG-LQFP-176-5
Data Sheet
5
V1.3, 2009-10
TC1167
Summary of Features
Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
•
•
The derivative itself, i.e. its function set, the temperature range, and the supply
voltage
The package and the type of delivery.
For the available ordering codes for the TC1167 please refer to the “Product Catalog
Microcontrollers”, which summarizes all available microcontroller variants.
This document describes the derivatives of the device.The Table 1 enumerates these
derivatives and summarizes the differences.
Table 1
TC1167 Derivative Synopsis
Derivative
Ambient Temperature Range
SAF-TC1167-128F133HL
TA = -40oC to +85oC
Data Sheet
6
V1.3, 2009-10
TC1167
Introduction
2
Introduction
This Data Sheet describes the Infineon TC1167, a 32-bit microcontroller DSP, based on
the Infineon TriCore Architecture.
2.1
About this Document
This document is designed to be read primarily by design engineers and software
engineers who need a detailed description of the interactions of the TC1167 functional
units, registers, instructions, and exceptions.
This TC1167 Data Sheet describes the features of the TC1167 with respect to the
TriCore Architecture. Where the TC1167 directly implements TriCore architectural
functions, this manual simply refers to those functions as features of the TC1167. In all
cases where this manual describes a TC1167 feature without referring to the TriCore
Architecture, this means that the TC1167 is a direct implementation of the TriCore
Architecture.
Where the TC1167 implements a subset of TriCore architectural features, this manual
describes the TC1167 implementation, and then describes how it differs from the TriCore
Architecture. Such differences between the TC1167 and the TriCore Architecture are
documented in the section covering each such subject.
2.1.1
Related Documentations
A complete description of the TriCore architecture is found in the document entitled
“TriCore Architecture Manual”. The architecture of the TC1167 is described separately
this way because of the configurable nature of the TriCore specification: Different
versions of the architecture may contain a different mix of systems components. The
TriCore architecture, however, remains constant across all derivative designs in order to
preserve compatibility.
This Data Sheets together with the “TriCore Architecture Manual” are required to
understand the complete TC1167 micro controller functionality.
2.1.2
Text Conventions
This document uses the following text conventions for named components of the
TC1167:
•
•
•
Functional units of the TC1167 are given in plain UPPER CASE. For example: “The
SSC supports full-duplex and half-duplex synchronous communication”.
Pins using negative logic are indicated by an overline. For example: “The external
reset pin, ESR0, has a dual function.”.
Bit fields and bits in registers are in general referenced as
“Module_Register name.Bit field” or “Module_Register name.Bit”. For example: “The
Current CPU Priority Number bit field CPU_ICR.CCPN is cleared”. Most of the
Data Sheet
7
V1.3, 2009-10
TC1167
Introduction
•
•
•
•
•
register names contain a module name prefix, separated by an underscore character
“_” from the actual register name (for example, “ASC0_CON”, where “ASC0” is the
module name prefix, and “CON” is the kernel register name). In chapters describing
the kernels of the peripheral modules, the registers are mainly referenced with their
kernel register names. The peripheral module implementation sections mainly refer
to the actual register names with module prefixes.
Variables used to describe sets of processing units or registers appear in mixed
upper and lower cases. For example, register name “MSGCFGn” refers to multiple
“MSGCFG” registers with variable n. The bounds of the variables are always given
where the register expression is first used (for example, “n = 0-31”), and are repeated
as needed in the rest of the text.
The default radix is decimal. Hexadecimal constants are suffixed with a subscript
letter “H”, as in 100H. Binary constants are suffixed with a subscript letter “B”, as in:
111B.
When the extent of register fields, groups register bits, or groups of pins are
collectively named in the body of the document, they are represented as
“NAME[A:B]”, which defines a range for the named group from B to A. Individual bits,
signals, or pins are given as “NAME[C]” where the range of the variable C is given in
the text. For example: CFG[2:0] and SRPN[0].
Units are abbreviated as follows:
– MHz = Megahertz
– μs = Microseconds
– kBaud, kbit = 1000 characters/bits per second
– MBaud, Mbit = 1,000,000 characters/bits per second
– Kbyte, KB = 1024 bytes of memory
– Mbyte, MB = 1048576 bytes of memory
In general, the k prefix scales a unit by 1000 whereas the K prefix scales a unit by
1024. Hence, the Kbyte unit scales the expression preceding it by 1024. The
kBaud unit scales the expression preceding it by 1000. The M prefix scales by
1,000,000 or 1048576, and μ scales by .000001. For example, 1 Kbyte is
1024 bytes, 1 Mbyte is 1024 × 1024 bytes, 1 kBaud/kbit are 1000 characters/bits
per second, 1 MBaud/Mbit are 1000000 characters/bits per second, and 1 MHz is
1,000,000 Hz.
Data format quantities are defined as follows:
– Byte = 8-bit quantity
– Half-word = 16-bit quantity
– Word = 32-bit quantity
– Double-word = 64-bit quantity
Data Sheet
8
V1.3, 2009-10
TC1167
Introduction
2.1.3
Reserved, Undefined, and Unimplemented Terminology
In tables where register bit fields are defined, the following conventions are used to
indicate undefined and unimplemented function. Furthermore, types of bits and bit fields
are defined using the abbreviations as shown in Table 2.
Table 2
Bit Function Terminology
Function of Bits
Description
Unimplemented,
Reserved
Register bit fields named 0 indicate unimplemented functions
with the following behavior.
• Reading these bit fields returns 0.
• These bit fields should be written with 0 if the bit field is
defined as r or rh.
• These bit fields have to be written with 0 if the bit field is
defined as rw.
These bit fields are reserved. The detailed description of these
bit fields can be found in the register descriptions.
rw
The bit or bit field can be read and written.
rwh
As rw, but bit or bit field can be also set or reset by hardware.
r
The bit or bit field can only be read (read-only).
w
The bit or bit field can only be written (write-only). A read to this
register will always give a default value back.
rh
This bit or bit field can be modified by hardware (read-hardware,
typical example: status flags). A read of this bit or bit field give
the actual status of this bit or bit field back. Writing to this bit or
bit field has no effect to the setting of this bit or bit field.
s
Bits with this attribute are “sticky” in one direction. If their reset
value is once overwritten by software, they can be switched
again into their reset state only by a reset operation. Software
cannot switch this type of bit into its reset state by writing the
register. This attribute can be combined to “rws” or “rwhs”.
f
Bits with this attribute are readable only when they are accessed
by an instruction fetch. Normal data read operations will return
other values.
2.1.4
Register Access Modes
Read and write access to registers and memory locations are sometimes restricted. In
memory and register access tables, the terms as defined in Table 3 are used.
Data Sheet
9
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TC1167
Introduction
Table 3
Access Terms
Symbol
Description
U
Access Mode: Access permitted in User Mode 0 or 1.
Reset Value: Value or bit is not changed by a reset operation.
SV
Access permitted in Supervisor Mode.
R
Read-only register.
32
Only 32-bit word accesses are permitted to this register/address range.
E
Endinit-protected register/address.
PW
Password-protected register/address.
NC
No change, indicated register is not changed.
BE
Indicates that an access to this address range generates a Bus Error.
nBE
Indicates that no Bus Error is generated when accessing this address
range, even though it is either an access to an undefined address or the
access does not follow the given rules.
nE
Indicates that no Error is generated when accessing this address or
address range, even though the access is to an undefined address or
address range. True for CPU accesses (MTCR/MFCR) to undefined
addresses in the CSFR range.
2.1.5
Abbreviations and Acronyms
The following acronyms and terms are used in this document:
ADC
Analog-to-Digital Converter
AGPR
Address General Purpose Register
ALU
Arithmetic and Logic Unit
ASC
Asynchronous/Synchronous Serial Controller
BCU
Bus Control Unit
BROM
Boot ROM & Test ROM
CAN
Controller Area Network
CMEM
PCP Code Memory
CISC
Complex Instruction Set Computing
CPS
CPU Slave Interface
CPU
Central Processing Unit
Data Sheet
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V1.3, 2009-10
TC1167
Introduction
CSA
Context Save Area
CSFR
Core Special Function Register
DAP
Device Access Port
DAS
Device Access Server
DCACHE
Data Cache
DFLASH
Data Flash Memory
DGPR
Data General Purpose Register
DMA
Direct Memory Access
DMI
Data Memory Interface
ERU
External Request Unit
EMI
Electro-Magnetic Interference
FADC
Fast Analog-to-Digital Converter
FAM
Flash Array Module
FCS
Flash Command State Machine
FIM
Flash Interface and Control Module
FPI
Flexible Peripheral Interconnect (Bus)
FPU
Floating Point Unit
GPIO
General Purpose Input/Output
GPR
General Purpose Register
GPTA
General Purpose Timer Array
ICACHE
Instruction Cache
I/O
Input / Output
JTAG
Joint Test Action Group = IEEE1149.1
LBCU
Local Memory Bus Control Unit
LDRAM
Local Data RAM
LFI
Local Memory-to-FPI Bus Interface
LMB
Local Memory Bus
LTC
Local Timer Cell
MLI
Micro Link Interface
MMU
Memory Management Unit
MSB
Most Significant Bit
MSC
Micro Second Channel
Data Sheet
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Introduction
NC
Non Connect
NMI
Non-Maskable Interrupt
OCDS
On-Chip Debug Support
OVRAM
Overlay Memory
PCP
Peripheral Control Processor
PMU
Program Memory Unit
PLL
Phase Locked Loop
PFLASH
Program Flash Memory
PMI
Program Memory Interface
PMU
Program Memory Unit
PRAM
PCP Parameter RAM
RAM
Random Access Memory
RISC
Reduced Instruction Set Computing
SBCU
System Peripheral Bus Control Unit
SCU
System Control Unit
SFR
Special Function Register
SPB
System Peripheral Bus
SPRAM
Scratch-Pad RAM
SRAM
Static Data Memory
SRN
Service Request Node
SSC
Synchronous Serial Controller
STM
System Timer
WDT
Watchdog Timer
Data Sheet
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TC1167
Introduction
2.2
System Architecture of the TC1167
The TC1167 combines three powerful technologies within one silicon die, achieving new
levels of power, speed, and economy for embedded applications:
•
•
•
Reduced Instruction Set Computing (RISC) processor architecture
Digital Signal Processing (DSP) operations and addressing modes
On-chip memories and peripherals
DSP operations and addressing modes provide the computational power necessary to
efficiently analyze complex real-world signals. The RISC load/store architecture
provides high computational bandwidth with low system cost. On-chip memory and
peripherals are designed to support even the most demanding high-bandwidth real-time
embedded control-systems tasks.
Additional high-level features of the TC1167 include:
•
•
•
•
•
•
•
•
•
Program Memory Unit – instruction memory and instruction cache
Serial communication interfaces – flexible synchronous and asynchronous modes
Peripheral Control Processor – standalone data operations and interrupt servicing
DMA Controller – DMA operations and interrupt servicing
General-purpose timers
High-performance on-chip buses
On-chip debugging and emulation facilities
Flexible interconnections to external components
Flexible power-management
TC1167 clock frequencies:
•
•
•
Maximum CPU clock frequency: 133 MHz1)
Maximum PCP clock frequency: 133 MHz2)
Maximum SPB frequency: 80 MHz3)
The TC1167 is a high-performance microcontroller with TriCore CPU, program and data
memories, buses, bus arbitration, an interrupt controller, a peripheral control processor,
a DMA controller and several on-chip peripherals. The TC1167 is designed to meet the
needs of the most demanding embedded control systems applications where the
competing issues of price/performance, real-time responsiveness, computational power,
data bandwidth, and power consumption are key design elements.
The TC1167 offers several versatile on-chip peripheral units such as serial controllers,
timer units, and Analog-to-Digital converters. Within the TC1167, all these peripheral
units are connected to the TriCore CPU/system via the Flexible Peripheral Interconnect
(FPI) Bus and the Local Memory Bus (LMB). Several I/O lines on the TC1167 ports are
reserved for these peripheral units to communicate with the external world.
1) For CPU frequencies > 80 MHz, 2:1 mode has to be enabled. CPU 2:1 mode means: fSPB = 0.5 * fCPU
2) For PCP frequencies > 80 MHz, 2:1 mode has to be enabled. PCP 2:1 mode means: fSPB = 0.5 * fPCP
3) CPU 1:1 Mode means: fSPB = fCPU . PCP 1:1 mode means: fSPB = fPCP
Data Sheet
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Introduction
2.2.1
TC1167 Block Diagram
Figure 1 shows the block diagram of the TC1167.
FP U
PMI
16 KB SPRAM
8 KB ICACHE
( Configurable)
Abbreviations:
ICACHE:
DCACHE
SPRAM :
LDRAM:
OVRAM :
BROM :
PFlash :
DFlash:
PRAM :
PCODE :
DM I
68 KB LDRAM
4 KB DCACHE
(Configurable)
TriCore
CP U
CP S
Instruction Cache
Data Cache
Scratch-Pad RAM
Local Data RAM
Overlay RAM
Boot ROM
Program Flash
Data Flash
Param eter RAM in PCP
Code RAM in PCP
LBCU
Loc al M em ory B us( LM B)
1,5V , 3.3V
E xt. supply
1 M B Pflash 1)
64 KB DFlash
8 KB OVRAM
16 KB BROM
DM A
LFI Bridge
( 8 C ha n n els )
S MI F
M
PMU
OCDS Debug
Interface/
JTAG
M/ S
M LI 0
AS C1
G TP A0
P CP2
Core
S TM
Interrupts
System Peripheral Bus (SPB)
AS C0
FPI-Bus Interface
8 K B P RA M
Interrupt
S ystem
S CU
16 K B P M E M
ADC0
1 6 C h a nn e ls
S BCU
P LL
S S C0
f PL L
E xt.
Request
Unit
28
(5V m ax)
ADC1
1 6 C h a nn e ls
4
S S C1
M ulti
CAN
( 2 N o de s,
6 4 B u ffe r )
FADC ( 3.3V )
4 diff ch .
(3.3V m ax)
4
M S C0
( LV D S)
Note :
1 ) Program Flash C ached Space , Size :1 M byte , Segm ent : 8 H , Start Address 8000 0000
Program Flash Non Cached , Size : 1 M byte, Segm ent : A H , Start Address A 000 0000 H
Data Sheet
5V
E xt. ADC supply
P orts
LTCA2
Figure 1
M emcheck
B loc kD iagram
TC 1 16 7
LQFP -1 76
H
TC1167 Block Diagram
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Introduction
2.2.2
System Features of the TC1167 device
The TC1167 has the following features:
Packages
•
PG-LQFP-176-5 package, 0.5 mm pitch
Clock Frequencies
•
•
•
Maximum CPU clock frequency: 133 MHz1)
Maximum PCP clock frequency: 133 MHz2)
Maximum SPB clock frequency: 80 MHz3)
1) For CPU frequencies > 80 MHz, 2:1 mode has to be enabled. CPU 2:1 mode means: fSPB = 0.5 * fCPU
2) For PCP frequencies > 80 MHz, 2:1 mode has to be enabled. PCP 2:1 mode means: fSPB = 0.5 * fPCP
3) CPU 1:1 Mode means: fSPB = fCPU . PCP 1:1 mode means: fSPB = fPCP
Data Sheet
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TC1167
Introduction
2.2.3
On Chip CPU Core
The TC1167 includes a high Performance CPUand a Peripheral Control Processor.
.
2.2.3.1
High-performance 32-bit CPU
This chapter gives an overview about the TriCore 1 architecture.
TriCore (TC1.3.1) Architectural Highlights
•
•
•
•
•
•
•
•
•
•
•
•
•
Unified RISC MCU/DSP
32-bit architecture with 4 Gbytes unified data, program, and input/output address
space
Fast automatic context-switching
Multiply-accumulate unit
Floating point unit
Saturating integer arithmetic
High-performance on-chip peripheral bus (FPI Bus)
Register based design with multiple variable register banks
Bit handling
Packed data operations
Zero overhead loop
Precise exceptions
Flexible power management
High-efficiency TriCore Instruction Set
•
•
•
•
•
16/32-bit instructions for reduced code size
Data types include: Boolean, array of bits, character, signed and unsigned integer,
integer with saturation, signed fraction, double-word integers, and IEEE-754 singleprecision floating point
Data formats include: Bit, 8-bit byte, 16-bit half-word, 32-bit word, and 64-bit doubleword data formats
Powerful instruction set
Flexible and efficient addressing mode for high code density
Integrated CPU related On-Chip Memories
•
•
Instruction memory: 24 KB total. After reset, configured into:1)
– 24 Kbyte Scratch-Pad RAM (SPRAM)
– 0 Kbyte Instruction Cache (ICACHE)
Data memory: 72 KB total. After reset, configured into:1)
1) Software configurable. Available options are described in the CPU chapter.
Data Sheet
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TC1167
Introduction
•
– 72 Kbyte Local Data RAM (LDRAM)
– 0 Kbyte Data Cache (DACHE)
On-chip SRAMs with parity error detection
2.2.3.2
High-performance 32-bit Peripheral Control Processor
The PCP is a flexible Peripheral Control Processor optimized for interrupt handling and
thus unloading the CPU.
Features
•
•
•
•
•
•
•
•
•
•
•
Data move between any two memory or I/O locations
Data move with predefined limit supported
Read-Modify-Write capabilities
Full computation capabilities including basic MUL/DIV
Read/move data and accumulate it to previously read data
Read two data values and perform arithmetic or logical operation and store result
Bit-handling capabilities (testing, setting, clearing)
Flow control instructions (conditional/unconditional jumps, breakpoint)
Dedicated Interrupt System
PCP SRAMs with parity error detection
PCP/FPI clock mode 1:1 and 2:1 available
Integrated PCP related On-Chip Memories
•
•
16 Kbyte Code Memory (CMEM)
8 Kbyte Parameter Memory (PRAM)
2.3
On Chip System Units
The TC1167 micro controller offers several versatile on-chip system peripheral units
such as DMA controller, embedded Flash module, interrupt system and ports.
2.3.1
Flexible Interrupt System
The TC1167 includes a programmable interrupt system with the following features:
Features
•
•
•
•
•
Fast interrupt response
Hardware arbitration
Independent interrupt systems for CPU and PCP
Programmable service request nodes (SRNs)
Each SRN can be mapped to the CPU or PCP interrupt system
Data Sheet
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Introduction
•
Flexible interrupt-prioritizing scheme with 255 interrupt priority levels per SRN to
choose from
2.3.2
Direct Memory Access Controller
The TC1167 includes a fast and flexible DMA controller with independant DMA channels
( DMA Move engine).
Features
•
•
•
•
•
•
•
•
•
•
independent DMA channels
– Up to 16 selectable request inputs per DMA channel
– 2-level programmable priority of DMA channels within the DMA Sub-Block
– Software and hardware DMA request
– Hardware requests by selected on-chip peripherals and external inputs
3-level programmable priority of the DMA Sub-Block at the on chip bus interfaces
Buffer capability for move actions on the buses (at least 1 move per bus is buffered)
Individually programmable operation modes for each DMA channel
– Single Mode: stops and disables DMA channel after a predefined number of DMA
transfers
– Continuous Mode: DMA channel remains enabled after a predefined number of
DMA transfers; DMA transaction can be repeated
– Programmable address modification
– Two shadow register modes (with / w/o automatic re-set and direct write access).
Full 32-bit addressing capability of each DMA channel
– 4 Gbyte address range
– Data block move supports > 32 Kbyte moves per DMA transaction
– Circular buffer addressing mode with flexible circular buffer sizes
Programmable data width of DMA transfer/transaction: 8-bit, 16-bit, or 32-bit
Register set for each DMA channel
– Source and destination address register
– Channel control and status register
– Transfer count register
Flexible interrupt generation (the service request node logic for the MLI channel is
also implemented in the DMA module)
DMA module is working on SPB frequency, LMB interface on LMB frequency.
Dependant on the target/destination address, Read/write requests from the Move
Engine are directed to the SPB, LMB, MLI or to the the Cerberus.
2.3.3
System Timer
The TC1167’s STM is designed for global system timing applications requiring both high
precision and long range.
Data Sheet
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TC1167
Introduction
Features
•
•
•
•
•
•
•
•
Free-running 56-bit counter
All 56 bits can be read synchronously
Different 32-bit portions of the 56-bit counter can be read synchronously
Flexible interrupt generation based on compare match with partial STM content
Driven by maximum 80 MHz (= fSYS, default after reset = fSYS/2)
Counting starts automatically after a reset operation
STM registers are reset by an application reset if bit ARSTDIS.STMDIS is cleared. If
bit ARSTDIS.STMDIS is set, the STM is not reset.
STM can be halted in debug/suspend mode
Special STM register semantics provide synchronous views of the entire 56-bit counter,
or 32-bit subsets at different levels of resolution.
The maximum clock period is 256 × fSTM. At fSTM = 80 MHz, for example, the STM counts
28.56 years before overflowing. Thus, it is capable of continuously timing the entire
expected product life time of a system without overflowing.
In case of a power-on reset, a watchdog reset, or a software reset, the STM is reset. After
one of these reset conditions, the STM is enabled and immediately starts counting up. It
is not possible to affect the content of the timer during normal operation of the TC1167.
The timer registers can only be read but not written to.
The STM can be optionally disabled for power-saving purposes, or suspended for
debugging purposes via its clock control register. In suspend mode of the TC1167
(initiated by writing an appropriate value to STM_CLC register), the STM clock is
stopped but all registers are still readable.
Due to the 56-bit width of the STM, it is not possible to read its entire content with one
instruction. It needs to be read with two load instructions. Since the timer would continue
to count between the two load operations, there is a chance that the two values read are
not consistent (due to possible overflow from the low part of the timer to the high part
between the two read operations). To enable a synchronous and consistent reading of
the STM content, a capture register (STM_CAP) is implemented. It latches the content
of the high part of the STM each time when one of the registers STM_TIM0 to STM_TIM5
is read. Thus, STM_CAP holds the upper value of the timer at exactly the same time
when the lower part is read. The second read operation would then read the content of
the STM_CAP to get the complete timer value.
The content of the 56-bit System Timer can be compared against the content of two
compare values stored in the STM_CMP0 and STM_CMP1 registers. Interrupts can be
generated on a compare match of the STM with the STM_CMP0 or STM_CMP1
registers.
Figure 2 provides an overview on the STM module. It shows the options for reading
parts of STM content.
Data Sheet
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V1.3, 2009-10
TC1167
Introduction
STM Module
31
23
STM_CMP0
to DMA etc.
15
7
Compare Register 0
31
Interrupt
Control
Clock
Control
23
STM_CMP1
STM
IRQ0
55
STM
IRQ1
0
47
15
7
0
Compare Register1
39
31
23
15
7
0
56-bit System Timer
Enable /
Disable
00 H
STM_CAP
fSTM
00 H
STM_TIM6
STM_TIM5
Address
Decoder
STM_TIM4
STM_TIM3
PORST
STM_TIM2
STM_TIM1
STM_TIM0
MCB06185_mod
Figure 2
Data Sheet
General Block Diagram of the STM Module Registers
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Introduction
2.3.4
System Control Unit
The following SCU introduction gives an overview about the TC1167 System Control
Unit (SCU).
2.3.4.1
Clock Generation Unit
The Clock Generation Unit (CGU) allows a very flexible clock generation for the TC1167.
During user program execution the frequency can be programmed for an optimal ratio
between performance and power consumption.
2.3.4.2
Features of the Watchdog Timer
The main features of the WDT are summarized here.
•
•
•
•
•
•
•
•
•
16-bit Watchdog counter
Selectable input frequency: fFPI/256 or fFPI/16384
16-bit user-definable reload value for normal Watchdog operation, fixed reload value
for Time-Out and Prewarning Modes
Incorporation of the ENDINIT bit and monitoring of its modifications
Sophisticated Password Access mechanism with fixed and user-definable password
fields
Access Error Detection: Invalid password (during first access) or invalid guard bits
(during second access) trigger the Watchdog reset generation
Overflow Error Detection: An overflow of the counter triggers the Watchdog reset
generation
Watchdog function can be disabled; access protection and ENDINIT monitor function
remain enabled
Double Reset Detection: If a Watchdog induced reset occurs twice, a severe system
malfunction is assumed and the TC1167 is held in reset until a system / class 0 reset
occurs.
2.3.4.3
Reset Operation
The following reset request triggers are available:
•
•
•
•
•
•
•
1 External power-on hardware reset request trigger; PORST, (cold reset)
2 External System Request reset triggers; ESR0 and ESR1 (warm reset)
Watchdog Timer (WDT) reset request trigger, (warm reset)
Software reset (SW), (warm reset)
Debug (OCDS) reset request trigger, (warm reset)
JTAG reset (special reset)
Resets via the JTAG interface
Note: The JTAG and OCDS resets are described in the OCDS chapter.
There are two basic types of reset request triggers:
Data Sheet
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V1.3, 2009-10
TC1167
Introduction
•
•
Trigger sources that do not depend on a clock, such as the PORST. This trigger force
the device into an asynchronous reset assertion independently of any clock. The
activation of an asynchronous reset is asynchronous to the system clock, whereas
its de-assertion is synchronized.
Trigger sources that need a clock in order to be asserted, such as the input signals
ESR0, and ESR1, the WDT trigger, the parity trigger, or the SW trigger.
2.3.4.4
External Interface
The SCU provides interface pads for system purpose. Various functions are covered by
these pins. Due to the different tasks some of the pads can not be shared with other
functions but most of them can be shared with other functions. The following functions
are covered by the SCU controlled pads:
•
•
•
•
•
Reset request triggers
Reset indication
Trap request triggers
Interrupt request triggers
Non SCU module triggers
The first three points are covered by the ESR pads and the last two points by the ERU
pads.
2.3.4.5
Die Temperature Measurement
The Die Temperature Sensor (DTS) generates a measurement result that indicates
directly the current temperature. The result of the measurement can be read via an DTS
register.
2.3.5
General Purpose I/O Ports and Peripheral I/O Lines
The TC1167 includes a flexible Ports structure with the following features:
Features
•
•
•
•
•
•
•
Digital General-Purpose Input/Output (GPIO) port lines
Input/output functionality individually programmable for each port line
Programmable input characteristics (pull-up, pull-down, no pull device)
Programmable output driver strength for EMI minimization (weak, medium, strong)
Programmable output characteristics (push-pull, open drain)
Programmable alternate output functions
Output lines of each port can be updated port-wise or set/reset/toggled bit-wise
Data Sheet
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TC1167
Introduction
2.3.6
Program Memory Unit (PMU)
The devices of the AudoF family contain at least one Program Memory Unit. This is
named “PMU0”. Some devices contain additional PMUs which are named “PMU1”, …
In the TC1167, the PMU0 contains the following submodules:
•
•
•
•
•
The Flash command and fetch control interface for Program Flash and Data Flash.
The Overlay RAM interface with Online Data Acquisition (OLDA) support.
The Boot ROM interface.
The Emulation Memory interface.
The Local Memory Bus LMB slave interface.
Following memories are controlled by and belong to the PMU0:
•
•
•
•
1 Mbyte of Program Flash memory (PFlash)
64 Kbyte of Data Flash memory (DFlash, represents 16 Kbyte EEPROM)
16 Kbyte of Boot ROM (BROM)
8 Kbyte Overlay RAM (OVRAM)
The following figure shows the block diagram of the PMU0:
To/From
Local Memory Bus
64
LMB Interface
Slave
PMU0
Overlay RAM
Interface
PMU
Control
64
64
64
ROM Control
64
OVRAM
64
Flash Interface Module
64
BROM
DFLASH
Emulation
Memory
Interface
PFLASH
Emulation Memory
(ED chip only )
Figure 3
Data Sheet
PMU0_BasicBlockDiag_generic
PMU0 Basic Block Diagram
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Introduction
2.3.6.1
Boot ROM
The internal 16 Kbyte Boot ROM (BROM) is divided into two parts, used for:
•
•
firmware (Boot ROM), and
factory test routines (Test ROM).
The different sections of the firmware in Boot ROM provide startup and boot operations
after reset. The TestROM is reserved for special routines, which are used for testing,
stressing and qualification of the component.
2.3.6.2
Overlay RAM and Data Acquisition
The overlay memory OVRAM is provided in the PMU especially for redirection of data
accesses to program memory to the OVRAM by using the data overlay function. The
data overlay functionality itself is controlled in the DMI module.
For online data acquisition (OLDA) of application or calibration data a virtual 32 KB
memory range is provided which can be accessed without error reporting. Accesses to
this OLDA range can also be redirected to an overlay memory.
2.3.6.3
Emulation Memory Interface
In TC1767 Emulation Device, an Emulation Memory (EMEM) is provided, which can fully
be used for calibration via program memory or OLDA overlay. The Emulation Memory
interface shown in Figure 3 is a 64-bit wide memory interface that controls the CPUaccesses to the Emulation Memory in the TC1167 Emulation Device. In the TC1167
production device, the EMEM interface is always disabled.
2.3.6.4
Tuning Protection
Tuning protection is required by the user to absolutely protect control data (e.g. for
engine control), serial number and user software, stored in the Flash, from being
manipulated, and to safely detect changed or disturbed data. For the internal Flash,
these protection requirements are excellently fulfilled in the TC1167 with
•
•
•
Flash read and write protection with user-specific protection levels, and with
dedicated HW and firmware, supporting the internal Flash read protection, and with
the Alternate Boot Mode.
Special tuning protection support is provided for external Flash, which must also be
protected.
2.3.6.5
Program and Data Flash
The embedded Flash module of PMU0 includes 1 Mbyte of Flash memory for code or
constant data (called Program Flash) and additionally 64 Kbyte of Flash memory used
for emulation of EEPROM data (called Data Flash). The Program Flash is realized as
Data Sheet
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V1.3, 2009-10
TC1167
Introduction
one independent Flash bank, whereas the Data Flash is built of two Flash banks,
allowing the following combinations of concurrent Flash operations:
•
•
•
Read code or data from Program Flash, while one bank of Data Flash is busy with a
program or erase operation.
Read data from one bank of Data Flash, while the other bank of Data Flash is busy
with a program or erase operation.
Program one bank of Data Flash while erasing the other bank of Data Flash, read
from Program Flash.
Both, the Program Flash and the Data Flash, provide error correction of single-bit errors
within a 64-bit read double-word, resulting in an extremely low failure rate. Read
accesses to Program Flash are executed in 256-bit width, to Data Flash in 64-bit width
(both plus ECC). Single-cycle burst transfers of up to 4 double-words and sequential
prefetching with control of prefetch hit are supported for Program Flash.
The minimum programming width is the page, including 256 bytes in Program Flash and
128 bytes in Data Flash. Concurrent programming and erasing in Data Flash is
performed using an automatic erase suspend and resume function.
A basic block diagram of the Flash Module is shown in the following figure.
Control
Redundancy
Control
FSI
Control
Flash Command
State Machine FCS
Voltage Control
SFRs
FSRAM
Microcode
Address
Addr Bus
64
64
Write Bus
Page
Write
Buffers
256 byte
and
128 byte
WR_DATA
Program
Flash
8
ECC Block
PF-Read
Buffer
ECC Code
8
64
Read Bus
64
256+32 bit
and
DF-Read
Buffer
Bank 0
Data
Flash
Bank 1
Bank 0
Bank 1
64+8 bit
RD_DATA
Flash Interface&Control Module
FIM
PMU
Flash Array Module
FAM
Flash FSI & Array
Flash_BasicBlockDiagram_generic.vsd
Figure 4
Basic Block Diagram of Flash Module
All Flash operations are controlled simply by transferring command sequences to the
Flash which are based on JEDEC standard. This user interface of the embedded Flash
is very comfortable, because all operations are controlled with high level commands,
such as “Erase Sector”. State transitions, such as termination of command execution, or
errors are reported to the user by maskable interrupts. Command sequences are
Data Sheet
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V1.3, 2009-10
TC1167
Introduction
normally written to Flash by the CPU, but may also be issued by the DMA controller (or
OCDS).
The Flash also features an advanced read/write protection architecture, including a read
protection for the whole Flash array (optionally without Data Flash) and separate write
protection for all sectors (only Program Flash). Write protected sectors can be made reprogrammable (enabled with passwords), or they can be locked for ever (ROM function).
Each sector can be assigned to up to three different users for write protection. The
different users are organized hierarchically.
Program Flash Features and Functions
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1 Mbyte on-chip Program Flash in PMU0.
Any use for instruction code or constant data.
256 bit read interface (burst transfer operation).
Dynamic correction of single-bit errors during read access.
Transfer rate in burst mode: One 64-bit double-word per clock cycle.
Sector architecture:
– Eight 16 Kbyte, one 128 Kbyte and seven 256 Kbyte sectors.
– Each sector separately erasable.
– Each sector lockable for protection against erase and program (write protection).
One additional configuration sector (not accessible to the user).
Optional read protection for whole Flash, with sophisticated read access supervision.
Combined with whole Flash write protection — thus supporting protection against
Trojan horse programs.
Sector specific write protection with support of re-programmability or locked forever.
Comfortable password checking for temporary disable of write or read protection.
User controlled configuration blocks (UCB) in configuration sector for keywords and
for sector-specific lock bits (one block for every user; up to three users).
Pad supply voltage (VDDP) also used for program and erase (no VPP pin).
Efficient 256 byte page program operation.
All Flash operations controlled by CPU per command sequences (unlock sequences)
for protection against unintended operation.
End-of-busy as well as error reporting with interrupt and bus error trap.
Write state machine for automatic program and erase, including verification of
operation quality.
Support of margin check.
Delivery in erased state (read all zeros).
Global and sector status information.
Overlay support with SRAM for calibration applications.
Configurable wait state selection for different CPU frequencies.
Endurance = 1000; minimum 1000 program/erase cycles per physical sector;
reduced endurance of 100 per 16 KB sector.
Operating lifetime (incl. Retention): 20 years with endurance=1000.
Data Sheet
26
V1.3, 2009-10
TC1167
Introduction
•
For further operating conditions see data sheet section “Flash Memory Parameters”.
Data Flash Features and Functions
•
•
•
•
•
•
•
•
•
•
•
•
•
•
64 Kbyte on-chip Flash, configured in two independent Flash banks of equal size.
64 bit read interface.
Erase/program one bank while data read access from the other bank.
Programming one bank while erasing the other bank using an automatic
suspend/resume function.
Dynamic correction of single-bit errors during read access.
Sector architecture:
– Two sectors of equal size.
– Each sector separately erasable.
128 byte pages to be written in one step.
Operational control per command sequences (unlock sequences, same as those of
Program Flash) for protection against unintended operation.
End-of-busy as well as error reporting with interrupt and bus error trap.
Write state machine for automatic program and erase.
Margin check for detection of problematic Flash bits.
Endurance = 30000 (can be device dependent); i.e. 30000 program/erase cycles per
sector are allowed, with a retention of min. 5 years.
Dedicated DFlash status information.
Other characteristics: Same as Program Flash.
Data Sheet
27
V1.3, 2009-10
TC1167
Introduction
2.3.7
Data Access Overlay
The data overlay functionality provides the capability to redirect data accesses by the
TriCore to program memory (segments 8H and AH) called “target memory” to a different
memory called “overlay memory”.
Depending on the device the following overlay memories can be available:
•
•
•
Overlay SRAM in the PMU.
Emulation Memory1).
External memory2).
This functionality makes it possible, for example, to modify the application’s test and
calibration parameters (which are typically stored in the program memory) during run
time of a program.
As the address translation is implemented in the DMI, it affects only data accesses
(reads and writes) of the TriCore. Instruction fetches by the TriCore or accesses by any
other master (including the debug interface) are not redirected.
Summary of Features and Functions
•
•
•
•
•
•
•
•
•
16 overlay ranges (“blocks”) configurable.
Support of 8 Kbyte embedded Overlay SRAM (OVRAM) in PMU.
Support of up to 256 Kbyte overlay/calibration memory (EMEM)1).
Support of up to 2 MB overlay memory in external memory (EBU space)2).
Support of Online Data Acquisition into range of up to 32 KB and of its overlay.
Support of different overlay memory selections for every enabled overlay block.
Sizes of overlay blocks selectable depending on the overlay memory:
– OVRAM: from 16 byte to 2 Kbyte.
– EMEM1) and external memory2): 1 Kbyte to 128 Kbyte.
All configured overlay ranges can be enabled with only one register write access.
Programmable flush (invalidate) control for data cache in DMI.
2.3.8
TC1167 Development Support
Overview about the TC1167 development environment:
Complete Development Support
A variety of software and hardware development tools for the 32-bit microcontroller
TC1167 are available from experienced international tool suppliers. The development
environment for the Infineon 32-bit microcontroller includes the following tools:
•
Embedded Development Environment for TriCore Products
1) Only available in Emulation Device “ED”.
2) Only available in Emulation Device with EBU.
Data Sheet
28
V1.3, 2009-10
TC1167
Introduction
•
•
•
The TC1167 On-chip Debug Support (OCDS) provides a JTAG port for
communication between external hardware and the system
The System Timer (STM) with high-precision, long-range timing capabilities
The TC1167 includes a power management system, a watchdog timer as well as
reset logic
Data Sheet
29
V1.3, 2009-10
TC1167
Introduction
2.4
On-Chip Peripheral Units
The TC1167 micro controller offers several versatile on-chip peripheral units such as
serial controllers, timer units, and Analog-to-Digital converters. Several I/O lines on the
TC1167 ports are reserved for these peripheral units to communicate with the external
world.
On-Chip Peripheral Units
•
•
•
•
•
•
•
•
Two Asynchronous/Synchronous Serial Channels (ASC) with baud-rate generator,
parity, framing and overrun error detection
Two Synchronous Serial Channels (SSC) with programmable data length and shift
direction
One Micro Second Bus Interface (MSC) for serial communication
One CAN Module (MultiCAN) for high-efficiency data handling via FIFO buffering and
gateway data transfer
One Micro Link Serial Bus Interfaces (MLI) for serial multiprocessor communication
One General Purpose Timer Array (GPTA) with a powerful set of digital signal filtering
and timer functionality to accomplish autonomous and complex Input/Output
management
Two Analog-to-Digital Converter Units (ADC0, ADC1) with 8-bit, 10-bit, or 12-bit
resolution.
One fast Analog-to-Digital Converter Unit (FADC)
2.4.1
Asynchronous/Synchronous Serial Interfaces
The TC1167 includes two Asynchronous/Synchronous Serial Interfaces, ASC0. and
ASC1. Both ASC modules have the same functionality.
Figure 5 shows a global view of the Asynchronous/Synchronous Serial Interface (ASC).
Data Sheet
30
V1.3, 2009-10
TC1167
Introduction
Clock
Control
fASC
RXD
Address
Decoder
Interrupt
Control
ASC
Module
(Kernel)
TXD
RXD
Port
Control
TXD
EIR
TBIR
TIR
RIR
To DMA
MCB05762_mod
Figure 5
General Block Diagram of the ASC Interface
The ASC provides serial communication between the
microcontrollers, microprocessors, or external peripherals.
TC1167
and
other
The ASC supports full-duplex asynchronous communication and half-duplex
synchronous communication. In Synchronous Mode, data is transmitted or received
synchronous to a shift clock that is generated by the ASC internally. In Asynchronous
Mode, 8-bit or 9-bit data transfer, parity generation, and the number of stop bits can be
selected. Parity, framing, and overrun error detection are provided to increase the
reliability of data transfers. Transmission and reception of data is double-buffered. For
multiprocessor communication, a mechanism is included to distinguish address bytes
from data bytes. Testing is supported by a loop-back option. A 13-bit baud rate generator
provides the ASC with a separate serial clock signal, which can be accurately adjusted
by a prescaler implemented as fractional divider.
Data Sheet
31
V1.3, 2009-10
TC1167
Introduction
Features
•
•
•
•
•
Full-duplex asynchronous operating modes
– 8-bit or 9-bit data frames, LSB first
– Parity-bit generation/checking
– One or two stop bits
– Baud rate from 5.0 Mbit/s to 1.19 bit/s (@ 80 MHz module clock)
– Multiprocessor mode for automatic address/data byte detection
– Loop-back capability
Half-duplex 8-bit synchronous operating mode
– Baud rate from 10.0 Mbit/s to 813.8 bit/s (@ 80 MHz module clock)
Double-buffered transmitter/receiver
Interrupt generation
– On a transmit buffer empty condition
– On a transmit last bit of a frame condition
– On a receive buffer full condition
– On an error condition (frame, parity, overrun error)
Implementation features
– Connections to DMA Controller
– Connections of receiver input to GPTA (LTC) for baud rate detection and LIN break
signal measuring
2.4.2
High-Speed Synchronous Serial Interfaces
The TC1167 includes two High-Speed Synchronous Serial Interfaces, SSC0 and SSC1.
Both SSC modules have the same functionality.
Figure 6 shows a global view of the Synchronous Serial interface (SSC).
Data Sheet
32
V1.3, 2009-10
TC1167
Introduction
fSSC
Clock
Control
Master
fCLC
Slave
Address
Decoder
RIR
Interrupt
Control
TIR
EIR
DMA Requests
SSC
Module
(Kernel)
Slave
Master
Slave
Master
MRSTA
MRSTB
MTSR
MTSR
MTSRA
MTSRB
MRST
SCLKA
SCLKB
SCLK
MRST
Port
Control
SLSI[7:1]
SLSO[7:0]
SLSOANDO[7:0]
SLSOANDI[7:0]
SCLK
SLSI[7:1]
SLSO[7:0]
SLSOANDO[7:0]
Enable
M/S Select
MCB06058_mod
Figure 6
General Block Diagram of the SSC Interface
The SSC supports full-duplex and half-duplex serial synchronous communication up to
40 Mbit/s (@ 80 MHz module clock, Master Mode). The serial clock signal can be
generated by the SSC itself (Master Mode) or can be received from an external master
(Slave Mode). Data width, shift direction, clock polarity and phase are programmable.
This allows communication with SPI-compatible devices. Transmission and reception of
data are double-buffered. A shift clock generator provides the SSC with a separate serial
clock signal. One slave select input is available for slave mode operation. Eight
programmable slave select outputs (chip selects) are supported in Master Mode.
Data Sheet
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V1.3, 2009-10
TC1167
Introduction
Features
•
•
•
•
•
•
•
Master and Slave Mode operation
– Full-duplex or half-duplex operation
– Automatic pad control possible
Flexible data format
– Programmable number of data bits: 2 to 16 bits
– Programmable shift direction: LSB or MSB shift first
– Programmable clock polarity: Idle low or idle high state for the shift clock
– Programmable clock/data phase: Data shift with leading or trailing edge of the shift
clock
Baud rate generation
– Master Mode: 40.0 Mbit/s to 610.36 bit/s (@ 80 MHz module clock)
– Slave Mode: 20 Mbit/s to 610.36 bit/s (@ 80 MHz module clock)
Interrupt generation
– On a transmitter empty condition
– On a receiver full condition
– On an error condition (receive, phase, baud rate, transmit error)
Flexible SSC pin configuration
Seven slave select inputs SLSI[7:1] in Slave Mode
Eight programmable slave select outputs SLSO in Master Mode
– Automatic SLSO generation with programmable timing
– Programmable active level and enable control
2.4.3
Micro Second Channel Interface
The Micro Second Channel (MSC) interface provides serial communication links
typically used to connect power switches or other peripheral devices. The serial
communication link includes a fast synchronous downstream channel and a slow
asynchronous upstream channel. Figure 7 shows a global view of the interface signals
of the MSC interface.
Data Sheet
34
V1.3, 2009-10
TC1167
Introduction
fMSC
Clock
Control
fCLC
FCLP
FCLN
Interrupt SR[3:0]
Control
4
MSC
Module
(Kernel)
SOP
Downstream
Channel
Address
Decoder
SON
EN0
EN1
EN2
To DMA
ALTINH[15:0]
16
Upstream
Channel
ALTINL[15:0]
EN3
16
8
SDI[7:0]
EMGSTOPMSC
MCB06059
Figure 7
General Block Diagram of the MSC Interface
The downstream and upstream channels of the MSC module communicate with the
external world via nine I/O lines. Eight output lines are required for the serial
communication of the downstream channel (clock, data, and enable signals). One out of
eight input lines SDI[7:0] is used as serial data input signal for the upstream channel. The
source of the serial data to be transmitted by the downstream channel can be MSC
register contents or data that is provided on the ALTINL/ALTINH input lines. These input
lines are typically connected with other on-chip peripheral units (for example with a timer
unit such as the GPTA). An emergency stop input signal makes it possible to set bits of
the serial data stream to dedicated values in an emergency case.
Clock control, address decoding, and interrupt service request control are managed
outside the MSC module kernel. Service request outputs are able to trigger an interrupt
or a DMA request.
Features
•
•
Fast synchronous serial interface to connect power switches in particular, or other
peripheral devices via serial buses
High-speed synchronous serial transmission on downstream channel
– Serial output clock frequency: fFCL = fMSC/2
– Fractional clock divider for precise frequency control of serial clock fMSC
Data Sheet
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V1.3, 2009-10
TC1167
Introduction
•
•
– Command, data, and passive frame types
– Start of serial frame: Software-controlled, timer-controlled, or free-running
– Programmable upstream data frame length (16 or 12 bits)
– Transmission with or without SEL bit
– Flexible chip select generation indicates status during serial frame transmission
– Emergency stop without CPU intervention
Low-speed asynchronous serial reception on upstream channel
– Baud rate: fMSC divided by 4, 8, 16, 32, 64, 128, or 256
– Standard asynchronous serial frames
– Parity error checker
– 8-to-1 input multiplexer for SDI lines
– Built-in spike filter on SDI lines
Selectable pin types of downstream channel interface:
four LVDS differential output drivers or four digital GPIO pins
Data Sheet
36
V1.3, 2009-10
TC1167
Introduction
2.4.4
MultiCAN Controller
The MultiCAN module provides two independent CAN nodes in the PG-LQFP-176-5
package, representing two serial communication interfaces. The number of available
message objects is 64.
MultiCAN Module Kernel
fC AN
Clock
Control
Address
Decoder
Interrupt
Control
fC L C
Message
Object
Buffer
64
Objects
Linked
List
Control
CAN
Node 1
TXDC1
CAN
Node 0
TXDC0
RXDC1
Port
Control
RXDC0
CAN Control
MCA06060_N2
Figure 8
Overview of the MultiCAN Module
The MultiCAN module contains two independently operating CAN nodes with Full-CAN
functionality that are able to exchange Data and Remote Frames via a gateway function.
Transmission and reception of CAN frames is handled in accordance to CAN
specification V2.0 B (active). Each CAN node can receive and transmit standard frames
with 11-bit identifiers as well as extended frames with 29-bit identifiers.
All two CAN nodes share a common set of message objects. Each message object can
be individually allocated to one of the CAN nodes. Besides serving as a storage
container for incoming and outgoing frames, message objects can be combined to build
gateways between the CAN nodes or to set up a FIFO buffer.
The message objects are organized in double-chained linked lists, where each CAN
node has its own list of message objects. A CAN node stores frames only into message
objects that are allocated to the message object list of the CAN node, and it transmits
only messages belonging to this message object list. A powerful, command-driven list
controller performs all message object list operations.
Data Sheet
37
V1.3, 2009-10
TC1167
Introduction
The bit timings for the CAN nodes are derived from the module timer clock (fCAN) and are
programmable up to a data rate of 1 Mbit/s. External bus transceivers are connected to
a CAN node via a pair of receive and transmit pins.
Features
•
•
•
•
•
•
•
•
•
•
Compliant with ISO 11898
CAN functionality according to CAN specification V2.0 B active
Dedicated control registers for each CAN node
Data transfer rates up to 1 Mbit/s
Flexible and powerful message transfer control and error handling capabilities
Advanced CAN bus bit timing analysis and baud rate detection for each CAN node
via a frame counter
Full-CAN functionality: A set of 64 message objects can be individually
– Allocated (assigned) to any CAN node
– Configured as transmit or receive object
– Setup to handle frames with 11-bit or 29-bit identifier
– Identified by a timestamp via a frame counter
– Configured to remote monitoring mode
Advanced Acceptance Filtering
– Each message object provides an individual acceptance mask to filter incoming
frames.
– A message object can be configured to accept standard or extended frames or to
accept both standard and extended frames.
– Message objects can be grouped into four priority classes for transmission and
reception.
– The selection of the message to be transmitted first can be based on frame
identifier, IDE bit and RTR bit according to CAN arbitration rules, or on its order in
the list.
Advanced message object functionality
– Message objects can be combined to build FIFO message buffers of arbitrary size,
limited only by the total number of message objects.
– Message objects can be linked to form a gateway that automatically transfers
frames between 2 different CAN buses. A single gateway can link any two CAN
nodes. An arbitrary number of gateways can be defined.
Advanced data management
– The message objects are organized in double-chained lists.
– List reorganizations can be performed at any time, even during full operation of the
CAN nodes.
– A powerful, command-driven list controller manages the organization of the list
structure and ensures consistency of the list.
– Message FIFOs are based on the list structure and can easily be scaled in size
during CAN operation.
Data Sheet
38
V1.3, 2009-10
TC1167
Introduction
•
– Static allocation commands offer compatibility with MultiCAN applications that are
not list-based.
Advanced interrupt handling
– Up to 16 interrupt output lines are available. Interrupt requests can be routed
individually to one of the 16 interrupt output lines.
– Message post-processing notifications can be combined flexibly into a dedicated
register field of 256 notification bits.
2.4.5
Micro Link Interface
This TC1167 contains one Micro Link Interface, MLI0.
The Micro Link Interface (MLI) is a fast synchronous serial interface to exchange data
between microcontrollers or other devices, such as stand-alone peripheral components.
Figure 9 shows how two microcontrollers are typically connected together via their MLI
interfaces.
Controller 1
Controller 2
CPU
CPU
Peripheral
A
Peripheral
B
Peripheral
C
Peripheral
D
Memory
MLI
MLI
Memory
System Bus
System Bus
MCA06061
Figure 9
Typical Micro Link Interface Connection
Features
•
•
•
•
•
•
Synchronous serial communication between an MLI transmitter and an MLI receiver
Different system clock speeds supported in MLI transmitter and MLI receiver due to
full handshake protocol (4 lines between a transmitter and a receiver)
Fully transparent read/write access supported (= remote programming)
Complete address range of target device available
Specific frame protocol to transfer commands, addresses and data
Error detection by parity bit
Data Sheet
39
V1.3, 2009-10
TC1167
Introduction
•
•
•
•
32-bit, 16-bit, or 8-bit data transfers supported
Programmable baud rate: fMLI/2 (max. fMLI = fSYS)
Address range protection scheme to block unauthorized accesses
Multiple receiving devices supported
Data Sheet
40
V1.3, 2009-10
TC1167
Introduction
Figure 10 shows a general block diagram of the MLI module.
TREADY[D:A] 4
TVALID[D:A]
fSYS
Fract.
Divider
MLI
Transmitter
I/O
Control
4
TDATA
TCLK
TR[3:0]
fMLI
Port
Control
MLI Module
BRKOUT
RCLK[D:A]
4
RREADY[D:A] 4
SR[7:0]
Move
Engine
MLI
Receiver
I/O
Control
RVALID[D:A]
4
RDATA[D:A]
4
MCB06062_mod
Figure 10
General Block Diagram of the MLI Modules
The MLI transmitter and MLI receiver communicate with other MLI receivers and MLI
transmitters via a four-line serial connection each. Several I/O lines of these connections
are available outside the MLI module kernel as a four-line output or input vector with
index numbering A, B, C and D. The MLI module internal I/O control blocks define which
signal of a vector is actually taken into account and also allow polarity inversions (to
adapt to different physical interconnection means).
Data Sheet
41
V1.3, 2009-10
TC1167
Introduction
2.4.6
General Purpose Timer Array (GPTA)
The TC1167 contains the General Purpose Timer Array (GPTA0). Figure 11 shows a
global view of the GPTA module.
The GPTA provides a set of timer, compare, and capture functionalities that can be
flexibly combined to form signal measurement and signal generation units. They are
optimized for tasks typical of engine, gearbox, and electrical motor control applications,
but can also be used to generate simple and complex signal waveforms required for
other industrial applications.
GPTA0
Clock Generation Cells
FPC0
FPC1
DCM0
PDL0
DCM1
FPC2
FPC3
FPC4
DCM2
DIGITAL
PLL
PDL1
DCM3
FPC5
fGPTA Clock Distribution Cells
GT0
GT1
Cl ock Bus
Clock
Conn .
Signal
Generation Cells
LTCA2
GTC00
GTC01
GTC02
GTC03
LTC00
LTC01
LTC02
LTC03
LTC00
LTC01
LTC02
LTC03
Global
Timer
Cell Array
Local
Timer
Cell Array
Local
Timer
Cell Array
GTC30
GTC31
LTC62
LTC63
LTC30
LTC31
I/O Line Sharing Block
I/O Line
Sharing Block
Interrupt Sharing Block
Interrupt
Sharing Block
MCB05910_TC1767_LTC 32
Figure 11
Data Sheet
General Block Diagram of the GPTA Modules in the TC1167
42
V1.3, 2009-10
TC1167
Introduction
2.4.6.1
Functionality of GPTA0
The General Purpose Timer Array (GPTA0) provides a set of hardware modules
required for high-speed digital signal processing:
•
•
•
•
•
•
•
•
Filter and Prescaler Cells (FPC) support input noise filtering and prescaler operation.
Phase Discrimination Logic units (PDL) decode the direction information output by a
rotation tracking system.
Duty Cycle Measurement Cells (DCM) provide pulse-width measurement
capabilities.
A Digital Phase Locked Loop unit (PLL) generates a programmable number of GPTA
module clock ticks during an input signal’s period.
Global Timer units (GT) driven by various clock sources are implemented to operate
as a time base for the associated Global Timer Cells.
Global Timer Cells (GTC) can be programmed to capture the contents of a Global
Timer on an external or internal event. A GTC may also be used to control an external
port pin depending on the result of an internal compare operation. GTCs can be
logically concatenated to provide a common external port pin with a complex signal
waveform.
Local Timer Cells (LTC) operating in Timer, Capture, or Compare Mode may also be
logically tied together to drive a common external port pin with a complex signal
waveform. LTCs – enabled in Timer Mode or Capture Mode – can be clocked or
triggered by various external or internal events.
On-chip Trigger and Gating Signals (OTGS) can be configured to provide trigger or
gating signals to integrated peripherals.
Input lines can be shared by an LTC and a GTC to trigger their programmed operation
simultaneously.
The following list summarizes the specific features of the GPTA units.
Clock Generation Unit
•
•
Filter and Prescaler Cell (FPC)
– Six independent units
– Three basic operating modes:
Prescaler, Delayed Debounce Filter, Immediate Debounce Filter
– Selectable input sources:
Port lines, GPTA module clock, FPC output of preceding FPC cell
– Selectable input clocks:
GPTA module clock, prescaled GPTA module clock, DCM clock, compensated or
uncompensated PLL clock.
– fGPTA/2 maximum input signal frequency in Filter Modes
Phase Discriminator Logic (PDL)
– Two independent units
– Two operating modes (2- and 3- sensor signals)
Data Sheet
43
V1.3, 2009-10
TC1167
Introduction
•
•
•
– fGPTA/4 maximum input signal frequency in 2-sensor Mode, fGPTA/6 maximum input
signal frequency in 3-sensor Mode
Duty Cycle Measurement (DCM)
– Four independent units
– 0 - 100% margin and time-out handling
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Digital Phase Locked Loop (PLL)
– One unit
– Arbitrary multiplication factor between 1 and 65535
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Clock Distribution Unit (CDU)
– One unit
– Provides nine clock output signals:
fGPTA, divided fGPTA clocks, FPC1/FPC4 outputs, DCM clock, LTC prescaler clock
Signal Generation Unit
•
•
•
Global Timers (GT)
– Two independent units
– Two operating modes (Free-Running Timer and Reload Timer)
– 24-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Global Timer Cell (GTC)
– 32 units related to the Global Timers
– Two operating modes (Capture, Compare and Capture after Compare)
– 24-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Local Timer Cell (LTC)
– 64 independent units
– Three basic operating modes (Timer, Capture and Compare) for 63 units
– Special compare modes for one unit
– 16-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Interrupt Sharing Unit
•
143 interrupt sources, generating up to 46 service requests
Data Sheet
44
V1.3, 2009-10
TC1167
Introduction
On-chip Trigger Unit
•
16 on-chip trigger signals
I/O Sharing Unit
•
Interconnecting inputs and outputs from internal clocks, FPC, GTC, LTC, ports, and
MSC interface
Data Sheet
45
V1.3, 2009-10
TC1167
Introduction
2.4.7
Analog-to-Digital Converters
The TC1167 includes two Analog to Digital Converter modules (ADC0, ADC1) and one
Fast Analog to Digital Converter (FADC).
2.4.7.1
ADC Block Diagram
The analog to digital converter module (ADC) allows the conversion of analog input
values into discrete digital values based on the successive approximation method.
This module contains 2 independent kernels (ADC0, ADC1) that can operate
autonomously or can be synchronized to each other. An ADC kernel is a unit used to
convert an analog input signal (done by an analog part) and provides means for
triggering conversions, data handling and storage (done by a digital part).
analog part kernel 0
...
analog
inputs
AD
converter
data (result)
handling
conversion
control
request
control
analog part kernel 1
...
analog
inputs
digital part kernel 0
digital part kernel 1
AD
converter
data (result)
handling
conversion
control
request
control
bus
interface
ADC_2_kernels
Figure 12
ADC Module with two ADC Kernels
Features of the analog part of each ADC kernel:
•
•
•
•
•
•
Input voltage range from 0V to analog supply voltage
Analog supply voltage range from 3.3 V to 5 V (single supply)
(5V nominal supply voltage, performance degradation accepted for lower voltages)
Input multiplexer width of 16 possible analog input channels (not all of them are
necessarily available on pins)
VAREF and 1 alternative reference input at channel 0
Programmable sample time (in periods of fADCI)
Wide range of accepted analog clock frequencies fADCI
Data Sheet
46
V1.3, 2009-10
TC1167
Introduction
•
•
Multiplexer test mode (channel 7 input can be connected to ground via a resistor for
test purposes during run time by specific control bit)
Power saving mechanisms
Features of the digital part of each ADC kernel:
•
•
•
•
•
•
•
•
•
•
•
•
Independent result registers (16 independent registers)
5 conversion request sources (e.g. for external events, auto-scan, programmable
sequence, etc.)
Synchronization of the ADC kernels for concurrent conversion starts
Control an external analog multiplexer, respecting the additional set up time
Programmable sampling times for different channels
Possibility to cancel running conversions on demand with automatic restart
Flexible interrupt generation (possibility of DMA support)
Limit checking to reduce interrupt load
Programmable data reduction filter by adding conversion results
Support of conversion data FIFO
Support of suspend and power down modes
Individually programmable reference selection for each channel (with exception of
dedicated channels always referring to VAREF)
Data Sheet
47
V1.3, 2009-10
TC1167
Introduction
2.4.7.2
FADC Short Description
General Features
•
•
•
•
•
•
•
•
•
•
•
Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz)
10-bit A/D conversion (higher resolution can be achieved by averaging of
consecutive conversions in digital data reduction filter)
Successive approximation conversion method
Each differential input channel can also be used as single-ended input
Offset calibration support for each channel
Programmable gain of 1, 2, 4, or 8 for each channel
Free-running (Channel Timers) or triggered conversion modes
Trigger and gating control for external signals
Built-in Channel Timers for internal triggering
Channel timer request periods independently selectable for each channel
Selectable, programmable digital anti-aliasing and data reduction filter block with four
independent filter units
VFAREF VDDAF VDDMF VDDIF
VFAGND VSSAF VSSMF
fFADC
Data
Reduction
Unit
fCLC
Interrupt
Control
SRx
A/D
Control
A/D
Converter
Stage
SRx
DMA
TS[H:A]
GS[H:A]
Channel
Trigger
Control
Input Structure
Clock
Control
FAIN0P
FAIN0N
FAIN1P
FAIN1N
FAIN2P
FAIN2N
FAIN3P
FAIN3N
input
channel
input
channel
input
channel
input
channel
0
1
2
3
Channel
Timers
MCB06065_m4
Figure 13
Block Diagram of the FADC Module with 4 Input Channels
As shown in Figure 13, the main FADC functional blocks are:
•
An Input Structure containing the differential inputs and impedance control.
Data Sheet
48
V1.3, 2009-10
TC1167
Introduction
•
•
•
•
•
An A/D Converter Stage responsible for the analog-to-digital conversion including an
input multiplexer to select between the channel amplifiers
A Data Reduction Unit containing programmable anti-aliasing and data reduction
filters
A Channel Trigger Control block determining the trigger and gating conditions for the
FADC channels
A Channel Timer for each channel to independently trigger the conversions
An A/D Control block responsible for the overall FADC functionality
FADC Power Supply and References
The FADC module is supplied by the following power supply and reference voltage lines:
•
•
•
•
VDDMF / VSSMF: FADC Analog Channel Amplifier Power Supply (3.3 V)
VDDIF / VSSMF: FADC Analog Input Stage Power Supply (3.3 - 5 V),
the VDDIF supply does not appear as supply pin, because it is internally connected to
the VDDM supply of the ADC that is sharing the FADC input pins.
VDDAF / VSSAF: FADC Analog Part Power Supply (1.5 V),
to be fed in externally
VFAREF / VFAGND: FADC Reference Voltage (3.3 V max.) and FADC Reference Ground
Input Structure
The input structure of the FADC in the TC1167 contains:
•
•
A differential analog input stage for each input channel to select the input impedance
(differential or single-ended measurement) and to decouple the FADC input signal
from the pins.
A channel amplifier for each input channel with a settling time (about 5µs) when
changing the characteristics of an input stage (changing between unused,
differential, single-ended N, or single-ended P mode).
Data Sheet
49
V1.3, 2009-10
TC1167
Introduction
FAIN0P
Analog Input
Stages
Rp
FAIN0N
Rn
Channel Amplifier
Stages
VDDMF
VSSMF
FAIN2P
Rp
FAIN2N
Rn
VDDMF
Converter Stage
A/D conversion
Control control
gain
CHNR
VSSMF
FAIN1P
Rp
FAIN1N
Rn
A/D
VDDMF
VDDAF VSSAF
VSSMF
FAIN3P
Rp
FAIN3N
Rn
VDDMF
VSSMF
VDDIF
Figure 14
2.5
MCA06432_m4n
VSSMF
FADC Input Structure in TC1167
On-Chip Debug Support (OCDS)
The TC1167 contains resources for different kinds of “debugging”, covering needs from
software development to real-time-tuning. These resources are either embedded in
specific modules (e.g. breakpoint logic of the TriCore) or part of a central peripheral
(known as CERBERUS).
2.5.1
On-Chip Debug Support
The classic software debug approach (start/stop, single-stepping) is supported by
several features labelled “OCDS Level 1”:
•
•
•
Run/stop and single-step execution independently for TriCore and PCP.
Means to request all kinds of reset without usage of sideband pins.
Halt-after-Reset for repeatable debug sessions.
Data Sheet
50
V1.3, 2009-10
TC1167
Introduction
•
•
•
•
•
•
•
•
•
•
Different Boot modes to use application software not yet programmed to the Flash.
A total of four hardware breakpoints for the TriCore based on instruction address,
data address or combination of both.
Unlimited number of software breakpoints (DEBUG instruction) for TriCoreand PCP.
Debug event generated by access to a specific address via the system peripheral
bus.
Tool access to all SFRs and internal memories independent of the Cores.
Two central Break Switches to collect debug events from all modules (TriCore,PCP,
DMA, BCU, break input pins) and distribute them selectively to breakable modules
(TriCore, PCP,break output pins).
Central Suspend Switch to suspend parts of the system (TriCore,PCP,Peripherals)
instead if breaking them as reaction to a debug event.
Dedicated interrupt resources to handle debug events inside TriCore (breakpoint
trap, software interrupt) and Cerberus(can trigger PCP), e.g. for implementing
Monitor programs.
Access to all OCDS Level 1 resources also for TriCoreitselfand PCP themselves for
debug tools integrated into the application code.
Triggered Transfer of data in response to a debug event; if target is programmed to
be a device interface simple variable tracing can be done.
Additionally, in depth performance analysis and profiling support is provided by the
Emulation Device through MCDS Event Counters driven by a variety of trigger signals
(e.g. cache hit, wait state, interrupt accepted).
2.5.2
•
Real Time Trace
For detailed tracing of the system’s behavior a pin-compatible Emulation Device is
available.1)
2.5.3
Calibration Support
Two main use cases are catered for by resources in addition the OCDS Level 1
infrastructure: Overlay of non-volatile on-chip memory and non-intrusive signaling:
•
•
•
•
8 KB SRAM for Overlay.
Can be split into up to 16 blocks which can overlay independent regions of on-chip
Data Flash.
Changing the configuration is triggered by a single SFR access to maintain
consistency.
Overlay configuration switch does not require the TriCore to be stopped or
suspended.
1) The OCDS L2 interface of AudoNG is not available.
Data Sheet
51
V1.3, 2009-10
TC1167
Introduction
•
•
•
•
•
Invalidation of the Data Cache (maintaining write-back data) can be done
concurrently with the same SFR.
256 KB additional Overlay RAM on Emulation Device.
The 256 KB Trace memory of the Emulation Device can optionally be used for
Overlay also.
A dedicated trigger SFR with 32 independent status bits is provided to centrally post
requests from application code to the host computer.
The host is notified automatically when the trigger SFR is updated by the TriCoreor
PCP. No polling via a system bus is required.
2.5.4
Tool Interfaces
Three options exist for the communication channel between Tools (e.g. Debugger,
Calibration Tool) and TC1167:
•
•
•
•
•
•
•
•
Two wire DAP (Device Access Port) protocol for long connections or noisy
environments.
Four (or five) wire JTAG (IEEE 1149.1) for standardized manufacturing tests.
CAN (plus software linked into the application code) for low bandwidth deeply
embedded purposes.
DAP and JTAG are clocked by the tool.
Bit clock up to 40 MHz for JTAG, up to 80 MHz for DAP.
Hot attach (i.e. physical disconnect/reconnect of the host connection without reset of
the TC1167) for all interfaces.
Infineon standard DAS (Device Access Server) implementation for seamless,
transparent tool access over any supported interface.
Lock mechanism to prevent unauthorized tool access to critical application code.
2.5.5
Self-Test Support
Some manufacturing tests can be invoked by the application (e.g. after power-on) if
needed:
•
Hardware-accelerated checksum calculation (e.g. for Flash content).
2.5.6
FAR Support
To efficiently locate and identify faults after integration of a TC1167 into a system special
functions are available:
•
•
•
Boundary Scan (IEEE 1149.1) via JTAG and DAP.
SSCM (Single Scan Chain Mode1)) for structural scan testing of the chip itself.
1) This function requires access to some device pins (e.g. TESTMODE) in addition to those needed for OCDS.
Data Sheet
52
V1.3, 2009-10
TC1167
Pinning
3
Pinning
3.1
TC1167 Pin Definition and Functions
Figure 15 shows the Logic Symbol of the device.
General Control
PORST
TES TMODE
ES R0
ES R1
Alternate Functions
16
16
TRST
14
TCK / DA P0
O CDS /
JTAG Control
Analog Inputs
Analog Power
S upply
16
TDI / BRKIN
TDO / DAP2 /
B RKOUT
TMS / DA P1
4
16
A N[35 :0 ]
VDDM
VSSM
V D D MF
V SSMF
V D D AF
V AR EF 0
VAG N D 0
VF AR EF
V F AG N D
TC1 167
P G -LQ FP176 -x
VD D F L3
Digital Circuitry
Power Supply
VD D
VD D P
VSS
9
10
4
P ort 0
GP TA, SCU
P ort 3
GP TA, SSC1,
ADC0, OCDS
GP TA, SSC0/1,
MLI 0, MSC0
GP TA, ASC0/1,
SSC0/1, SCU, CAN
P ort 4
GP TA, SCU
P ort 5
GP TA, MLI0
P ort 6
GP TA, MSC0
X TAL1
X TAL2
V D D O SC
V D D O SC3
V SSO SC
Oscillator
P ort 1
Port 2
11
TC 1167_LogS y m_176
Figure 15
Data Sheet
TC1167 Logic Symbol for the package variant PG-LQFP-176-5.
52
V1.3, 2009-10
OUT 40 /OUT 8/IN 40/IN 26/ P 5.0
OUT 41 /OUT 9/IN 41/IN 27/ P 5.1
OUT 42 /OUT 10 /IN 42/IN 28/ P 5.2
OUT 43/ OUT 11/IN 43/ P 5.3
OUT 44 /OUT 12 /IN 44/IN 29/ P 5.4
OUT 45 /OUT 13 /IN 45/IN 30/ P 5.5
OUT 46 /OUT 14 /IN 46/IN 31/ P 5.6
OUT 47/ OUT 15/IN 47/ P 5.7
T CLK 0/ OUT 95/P 5 .15
VDD
V DDP
V SS
RDA T A 0B /OUT 89 /P 5. 8
RV A LID0 B /OUT 90/ P 5.9
R RE A DY 0B /OUT 91 /P 5 .10
RC LK 0B /OUT 92 /P 5 .11
T DA T A0 /S LS O07 /OUT 93 /P 5 .12
T V A LID 0B /S LS O16 /P 5 .13
T RE A D Y0B /OUT 94 /P 5 .14
V DDP
V DD(SB)
V SS
V DDAF
VDDMF
V SSMF
VF AREF
V F AGND
A N35
A N34
A N33
A N32
A N31
A N30
A N29
A N28
A N7
A N27
A N26
A N25
A N24
A N23
A N22
A N21
A N20
Figure 16
1)
Data Sheet
17 6
17 5
17 4
17 3
17 2
17 1
17 0
16 9
16 8
1 67
16 6
16 5
16 4
16 3
162
161
160
159
158
1 57
156
155
154
153
15 2
15 1
15 0
14 9
14 8
147
14 6
14 5
14 4
14 3
14 2
14 1
14 0
13 9
13 8
137
13 6
13 5
13 4
13 3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
TC1167
53
O UT5 2/O UT2 8/IN 52/I N28/ P 4.0
O UT5 3/O UT2 9/IN 53/I N29/ P 4.1
E X T CLK 1/O UT5 4/O UT3 0/IN 54/I N30/ P 4.2
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
P 3.9 /OUT 91 /RX D1A
P 3.1 0/O UT9 2/RE Q0
P 3.0 OUT 84/ /RX D0A
P 3.1 OUT 85/ /TX D0
P 3.1 4/O UT9 6RX DCA N1/ RX D1B
P 3.1 5/O UT9 7/T X DCA N1/T X D1
P 0.1 3/IN 13/O UT1 3/O UT6 9
P 0.1 2/IN 12/O UT1 2/O UT6 8
P 0.5 /IN5 /HW CF G5/O UT5 /OUT 61
P 0.4 /IN4 /HW CF G4/O UT4 /OUT 60
P 2.1 3/IN 13/O UT3 /S LS I1 1/S DI0
P 2.8 /S LS O0 4/S LS O 14/ EN0 0
P 2.1 2/IN 12/O UT2 /M TS R1A / SO P 0B
P 2.1 1/IN 11/O UT1 /S CLK 1 A/ FCL P0 B
P 2.1 0/IN 10/O UT0 /M RST 1A
P 2.9 /S LS O0 5/S LS O 15/ EN0 1
P 6.3 /IN2 5/OUT 7/ OUT 83/ SO P 0A
P 6.2 /IN2 4/OUT 6/ OUT 82/ SO N0
P 6.1 /IN1 5/OUT 5/ OUT 81/ FCL P0 A
P 6.0 /IN1 4/OUT 4/ OUT 80/ FCL N0
V SS
V DDP
V DD
P 0.1 1/IN 11/O UT1 1/O UT6 7
P 0.1 0/IN 10/O UT1 0/O UT6 6
P 0.9 /IN9 /OUT 9/O UT6 5
P 0.8 /IN8 /OUT 8/O UT6 4
P 0.3 /IN3 /HW CF G3/O UT3 /OUT 59
P 0.2 /IN2 /HW CF G2/O UT2 /OUT 58
P 0.1 /IN1 /HW CF G1/O UT1 /OUT 57
P 0.0 /IN0 /HW CF G0/O UT0 /OUT 56
P 3.1 1/O UT9 3//RE Q 1
P 3.1 2/O UT9 4//RX DCA N0 /RX D0B
P 3.1 3/O UT9 5//T X DCA N0/T X D0
V DDFL 3
V SS
V DDP
P 0.1 5/IN 15/R EQ 5/O UT1 5/O UT7 1
P 0.1 4/IN 14/R EQ 4/O UT1 4/O UT7 0
P 0.7 /IN7 /HW CF G7/RE Q 3/O UT7 /OUT 63
P 0.6 /IN6 /HW CF G6/RE Q 2/O UT6 /OUT 62
V SS
V DDP
V DD
3.1.1
A D0E M UX 2/O UT1 8/IN1 8/P 1 .14
A D0E M UX 1/O UT1 7/IN1 7/P 1 .13
A D0E M UX 0/OU T1 6/IN1 6/P 1 .12
T CLK 0/ OUT 28/ OUT 32/I N32 /P 2.0
S LS O 13/ SL S O03 /OUT 33 /TRE A DY 0A /I N33/ P 2.1
T V A LID0 A/ OUT 29/ OUT 34/I N34/ P2 .2
T DA TA 0/ OUT 30/ OUT 35/I N35/ P2 .3
OUT 31 /OUT 36/ RCLK 0A /I N36/ P2 .4
RRE A DY 0A /O UT3 7/OU T1 10/I N37/ P2 .5
O UT3 8/O UT1 11/ RV AL ID0A /I N38/ P 2.6
OUT 39/ RDA TA 0A /I N39/ P 2.7
V SS
V DDP
VDD
V SS
A N19
A N18
A N17
A N16
A N15
A N14
V AGND0
V AREF 0
VSSM
V DDM
A N13
A N12
A N11
A N10
A N9
A N8
A N6
A N5
A N4
A N3
A N2
A N1
A N0
VDD
V DDP
V SS
TC1167
Pinning
TC1167 Pin Configuration: PG-LQFP-176-5
This chapter shows the pin configuration of the package variant PG-LQFP-176-51).
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
P 3.4/ OUT 88/ M T S R0
P 3.7/ S LS I01 /OUT 89 //S LS O02 /S LS O 12
P 3.3/ OUT 87/ M RS T0
P 3.2/ OUT 86/ S CLK 0
P 3.8/ S LS O06 /OUT 90 /T X D1
P 3.6/ S LS O01 /S LS O11 /S LS O 01& S LS O 11
P 3.5/ S LS O00 /S LS O10 /S LS O 00& S LS O 10
V SS
V DDP
V DD
E S R0
P ORS T
E S R1
P1 .1/IN 17/ OUT 17/ OUT 73
T E S T M ODE
P 1 .15 /B RK IN/B RK OUT
P 1 .0/IN 16/ OUT 16/ OUT 72/B RK IN/ B R K OUT
T CK/DA P 0
T RS T
T DO/DA P 2/B RK IN/B RK OUT
T M S/DA P 1
T DI/B RK IN/B RK OU T
P 1.7/ IN23 /OUT 23 /OUT 79
P 1.6/ IN22 /OUT 22 /OUT 78
P 1.5/ IN21 /OUT 21 /OUT 77
P 1.4/ IN20 /E M GS T OP/OUT 20 /OUT 76
V DDOSC3
V DDOSC
V SSOSC
X T A L2
X T A L1
V SS
V DDP
V DD
P 1.3 /IN19 /OUT 19 /OUT 75
P 1.11 /IN27 /IN 51/S CLK 1B /OUT 27 /OUT 51
P 1.10 /IN26 /IN 50/OUT 26 /OUT 50 /S LS O 17
P 1.9/ IN25 /IN49 /M RS T1 B/ OUT 25/ OU T 49
P 1.8/ IN24 /IN48 /M T S R1 B/ OUT 24/ OU T 48
P 1.2/ IN18 /OUT 18 /OUT 74
V SS
V DDP
P 4.3/ IN31 /IN55 /OUT 31 /OUT 55 /E X T CLK 0
V DD
MCP 06067
TC1167 Pinning for PG-LQFP-176-5
TC1767 ED: PG-LQFP-176-6
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin
Pin Definitions and Functions (PG-LQFP-176-5 Package1))
Symbol
Ctrl.
Type Function
P0.0
I/O0
IN0
I
A1/
PU
IN0
I
LTCA2 Input 0
HWCFG0
I
Hardware Configuration Input 0
OUT0
O1
GPTA0 Output 0
OUT56
O2
GPTA0 Output 56
OUT0
O3
LTCA2 Output 0
P0.1
I/O0
IN1
I
IN1
I
LTCA2 Input 1
HWCFG1
I
Hardware Configuration Input 1
OUT1
O1
GPTA0 Output 1
OUT57
O2
GPTA0 Output 57
OUT1
O3
LTCA2 Output 1
P0.2
I/O0
IN2
I
IN2
I
LTCA2 Input 2
HWCFG2
I
Hardware Configuration Input 2
OUT2
O1
GPTA0 Output 2
OUT58
O2
GPTA0 Output 58
OUT2
O3
LTCA2 Output 2
P0.3
I/O0
IN3
I
IN3
I
LTCA2 Input 3
HWCFG3
I
Hardware Configuration Input 3
OUT3
O1
GPTA0 Output 3
OUT59
O2
GPTA0 Output 59
OUT3
O3
LTCA2 Output 3
Port 0
145
146
147
148
Data Sheet
A1/
PU
A1/
PU
A1/
PU
Port 0 General Purpose I/O Line 0
GPTA0 Input 0
Port 0 General Purpose I/O Line 1
GPTA0 Input 1
Port 0 General Purpose I/O Line 2
GPTA0 Input 2
Port 0 General Purpose I/O Line 3
GPTA0 Input 3
54
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
166
P0.4
I/O0
IN4
I
A1/
PU
IN4
I
LTCA2 Input 4
HWCFG4
I
Hardware Configuration Input 4
OUT4
O1
GPTA0 Output 4
OUT60
O2
GPTA0 Output 60
OUT4
O3
LTCA2 Output 4
P0.5
I/O0
IN5
I
IN5
I
LTCA2 Input 5
HWCFG5
I
Hardware Configuration Input 5
OUT5
O1
GPTA0 Output 5
OUT61
O2
GPTA0 Output 61
OUT5
O3
LTCA2 Output 5
P0.6
I/O0
IN6
I
IN6
I
LTCA2 Input 6
HWCFG6
I
Hardware Configuration Input 6
REQ2
I
External Request Input 2
OUT6
O1
GPTA0 Output 6
OUT62
O2
GPTA0 Output 62
OUT6
O3
LTCA2 Output 6
P0.7
I/O0
IN7
I
IN7
I
LTCA2 Input 7
HWCFG7
I
Hardware Configuration Input 7
REQ3
I
External Request Input 3
OUT7
O1
GPTA0 Output 7
OUT63
O2
GPTA0 Output 63
OUT7
O3
LTCA2 Output 7
167
173
174
Data Sheet
A1/
PU
A1/
PU
A1/
PU
Port 0 General Purpose I/O Line 4
GPTA0 Input 4
Port 0 General Purpose I/O Line 5
GPTA0 Input 5
Port 0 General Purpose I/O Line 6
GPTA0 Input 6
Port 0 General Purpose I/O Line 7
GPTA0 Input 7
55
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
149
P0.8
I/O0
IN8
I
A1/
PU
IN8
I
LTCA2 Input 8
OUT8
O1
GPTA0 Output 8
OUT64
O2
GPTA0 Output 64
OUT8
O3
LTCA2 Output 8
P0.9
I/O0
IN9
I
IN9
I
LTCA2 Input 9
OUT9
O1
GPTA0 Output 9
OUT65
O2
GPTA0 Output 65
OUT9
O3
LTCA2 Output 9
P0.10
I/O0
IN10
I
OUT10
O1
GPTA0 Output 10
OUT66
O2
GPTA0 Output 66
OUT10
O3
LTCA2 Output 10
P0.11
I/O0
IN11
I
OUT11
O1
GPTA0 Output 11
OUT67
O2
GPTA0 Output 67
OUT11
O3
LTCA2 Output 11
P0.12
I/O0
IN12
I
OUT12
O1
GPTA0 Output 12
OUT68
O2
GPTA0 Output 68
OUT12
O3
LTCA2 Output 12
150
151
152
168
Data Sheet
A1/
PU
A1/
PU
A1/
PU
A1/
PU
Port 0 General Purpose I/O Line 8
GPTA0 Input 8
Port 0 General Purpose I/O Line 9
GPTA0 Input 9
Port 0 General Purpose I/O Line 10
GPTA0 Input 10
Port 0 General Purpose I/O Line 11
GPTA0 Input 11
Port 0 General Purpose I/O Line 12
GPTA0 Input 12
56
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
169
P0.13
I/O0
IN13
I
A1/
PU
OUT13
O1
GPTA0 Output 13
OUT69
O2
GPTA0 Output 69
OUT13
O3
LTCA2 Output 13
P0.14
I/O0
IN14
I
REQ4
I
External Request Input 4
OUT14
O1
GPTA0 Output 14
OUT70
O2
GPTA0 Output 70
OUT14
O3
LTCA2 Output 14
P0.15
I/O0
IN15
I
REQ5
I
External Request Input 5
OUT15
O1
GPTA0 Output 15
OUT71
O2
GPTA0 Output 71
OUT15
O3
LTCA2 Output 15
P1.0
I/O0
IN16
I
BRKIN
I
Break Input
OUT16
O1
GPTA0 Output 16
OUT72
O2
GPTA0 Output 72
OUT16
O3
LTCA2 Output 16
BRKOUT
O
Break Output (controlled by OCDS module)
P1.1
I/O0
IN17
I
OUT17
O1
GPTA0 Output 17
OUT73
O2
GPTA0 Output 73
OUT17
O3
LTCA2 Output 17
175
176
A1/
PU
A1/
PU
Port 0 General Purpose I/O Line 13
GPTA0 Input 13
Port 0 General Purpose I/O Line 14
GPTA0 Input 14
Port 0 General Purpose I/O Line 15
GPTA0 Input 15
Port 1
116
119
Data Sheet
A2/
PU
A1/
PU
Port 1 General Purpose I/O Line 0
GPTA0 Input 16
Port 1 General Purpose I/O Line 1
GPTA0 Input 17
57
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
93
P1.2
I/O0
IN18
I
A1/
PU
OUT18
O1
GPTA0 Output 18
OUT74
O2
GPTA0 Output 74
OUT18
O3
LTCA2 Output 18
P1.3
I/O0
IN19
I
IN19
I
LTCA2 Input 19
OUT19
O1
GPTA0 Output 19
OUT75
O2
GPTA0 Output 75
OUT19
O3
LTCA2 Output 19
P1.4
I/O0
IN20
I
IN20
I
LTCA2 Input 20
EMGSTOP
I
Emergency Stop Input
OUT20
O1
GPTA0 Output 20
OUT76
O2
GPTA0 Output 76
OUT20
O3
LTCA2 Output 20
P1.5
I/O0
IN21
I
IN21
I
LTCA2 Input 21
OUT21
O1
GPTA0 Output 21
OUT77
O2
GPTA0 Output 77
OUT21
O3
LTCA2 Output 21
P1.6
I/O0
IN22
I
IN22
I
LTCA2 Input 22
OUT22
O1
GPTA0 Output 22
OUT78
O2
GPTA0 Output 78
OUT22
O3
LTCA2 Output 22
98
107
108
109
Data Sheet
A1/
PU
A1/
PU
A1/
PU
A1/
PU
Port 1 General Purpose I/O Line 2
GPTA0 Input 18
Port 1 General Purpose I/O Line 3
GPTA0 Input 19
Port 1 General Purpose I/O Line 4
GPTA0 Input 20
Port 1 General Purpose I/O Line 35
GPTA0 Input 21
Port 1 General Purpose I/O Line 6
GPTA0 Input 22
58
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
110
P1.7
I/O0
IN23
I
A1/
PU
IN23
I
LTCA2 Input 23
OUT23
O1
GPTA0 Output 23
OUT79
O2
GPTA0 Output 79
OUT23
O3
LTCA2 Output 23
P1.8
I/O0
IN24
I
IN48
I
GPTA0 Input 48
MTSR1B
I
SSC1 Slave Receive Input B (Slave Mode)
OUT24
O1
GPTA0 Output 24
OUT48
O2
GPTA0 Output 48
MTSR1B
O3
SSC1 Master Transmit Output B (Master Mode)
P1.9
I/O0
IN25
I
IN49
I
GPTA0 Input 49
MRST1B
I
SSC1 Master Receive Input B (Master Mode)
OUT25
O1
GPTA0 Output 25
OUT49
O2
GPTA0 Output 49
MRST1B
O3
SSC1 Slave Transmit Output B (Slave Mode)
P1.10
I/O0
IN26
I
IN50
I
GPTA0 Input 50
OUT26
O1
GPTA0 Output 26
OUT50
O2
GPTA0 Output 50
SLSO17
O3
SSC1 Slave Select Output 7
94
95
96
Data Sheet
A2/
PU
A2/
PU
A2/
PU
Port 1 General Purpose I/O Line 7
GPTA0 Input 23
Port 1 General Purpose I/O Line 8
GPTA0 Input 24
Port 1 General Purpose I/O Line 9
GPTA0 Input 25
Port 1 General Purpose I/O Line 10
GPTA0 Input 26
59
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
97
P1.11
I/O0
IN27
I
A2/
PU
IN51
I
GPTA0 Input 51
SCLK1B
I
SSC1 Clock Input B
OUT27
O1
GPTA0 Output 27
OUT51
O2
GPTA0 Output 51
SCLK1B
O3
SSC1 Clock Output B
P1.12
I/O0
IN16
I
AD0EMUX0
O1
ADC0 External Multiplexer Control Output 0
AD0EMUX0
O2
ADC0 External Multiplexer Control Output 0
OUT16
O3
LTCA2 Output 16
P1.13
I/O0
IN17
I
AD0EMUX1
O1
ADC0 External Multiplexer Control Output 1
AD0EMUX1
O2
ADC0 External Multiplexer Control Output 1
OUT17
O3
LTCA2 Output 17
P1.14
I/O0
IN18
I
AD0EMUX2
O1
ADC0 External Multiplexer Control Output 2
AD0EMUX2
O2
ADC0 External Multiplexer Control Output 2
OUT18
O3
LTCA2 Output 18
P1.15
I/O0
BRKIN
I
Reserved
O1
-
Reserved
O2
-
Reserved
O3
-
BRKOUT
O
Break Output (controlled by OCDS module)
73
72
71
117
A1/
PU
A1/
PU
A1/
PU
A2/
PU
Port 1 General Purpose I/O Line 11
GPTA0 Input 27
Port 1 General Purpose I/O Line 12
LTCA2 Input 16
Port 1 General Purpose I/O Line 13
LTCA2 Input 17
Port 1 General Purpose I/O Line 14
LTCA2 Input 18
Port 1 General Purpose I/O Line 15
Break Input
Port 2
Data Sheet
60
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
74
P2.0
I/O0
IN32
I
A2/
PU
OUT32
O1
GPTA0 Output 32
TCLK0
O2
MLI0 Transmitter Clock Output 0
OUT28
O3
LTCA2 Output 28
P2.1
I/O0
IN33
I
TREADY0A
I
MLI0 Transmitter Ready Input A
OUT33
O1
GPTA0 Output 33
SLSO03
O2
SSC0 Slave Select Output Line 3
SLSO13
O3
SSC1 Slave Select Output Line 3
P2.2
I/O0
IN34
I
OUT34
O1
GPTA0 Output 34
TVALID0
O2
MLI0 Transmitter Valid Output
OUT29
O3
LTCA2 Output 29
P2.3
I/O0
IN35
I
OUT35
O1
GPTA0 Output 35
TDATA0
O2
MLI0 Transmitter Data Output
OUT30
O3
LTCA2 Output 30
P2.4
I/O0
IN36
I
RCLK0A
I
MLI Receiver Clock Input A
OUT36
O1
GPTA0 Output 36
OUT36
O2
GPTA0 Output 36
OUT31
O3
LTCA2 Output 31
75
76
77
78
Data Sheet
A2/
PU
A2/
PU
A2/
PU
A2/
PU
Port 2 General Purpose I/O Line 0
GPTA0 Input 32
Port 2 General Purpose I/O Line 1
GPTA0 Input 33
Port 2 General Purpose I/O Line 2
GPTA0 Input 34
Port 2 General Purpose I/O Line 3
GPTA0 Input 35
Port 2 General Purpose I/O Line 4
GPTA0 Input 36
61
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
79
P2.5
I/O0
IN37
I
A2/
PU
OUT37
O1
GPTA0 Output 37
RREADY0A
O2
MLI0 Receiver Ready Output A
OUT110
O3
LTCA2 Output 110
P2.6
I/O0
IN38
I
RVALID0A
I
MLI Receiver Valid Input A
OUT38
O1
GPTA0 Output 38
OUT38
O2
GPTA0 Output 38
OUT111
O3
LTCA2 Output 111
P2.7
I/O0
IN39
I
RDATA0A
I
MLI Receiver Data Input A
OUT39
O1
GPTA0 Output 39
OUT39
O2
GPTA0 Output 39
Reserved
O3
-
P2.8
I/O0
SLSO04
O1
SLSO14
O2
SSC1 Slave Select Output 4
EN00
O3
MSC0 Enable Output 0
P2.9
I/O0
SLSO05
O1
SLSO15
O2
SSC1 Slave Select Output 5
EN01
O3
MSC0 Enable Output 1
80
81
164
160
Data Sheet
A2/
PU
A2/
PU
A2/
PU
A2/
PU
Port 2 General Purpose I/O Line 5
GPTA0 Input 37
Port 2 General Purpose I/O Line 6
GPTA0 Input 38
Port 2 General Purpose I/O Line 7
GPTA0 Input 39
Port 2 General Purpose I/O Line 8
SSC0 Slave Select Output 4
Port 2 General Purpose I/O Line 9
SSC0 Slave Select Output 5
62
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
161
P2.10
I/O0
MRST1A
I
A2/
PU
IN10
I
LTCA2 Input 10
MRST1A
O1
SSC1 Slave Transmit Output
OUT0
O2
LTCA2 Output 0
Reserved
O3
-
P2.11
I/O0
SCLK1A
I
IN11
I
LTCA2 Input 11
SCLK1A
O1
SSC1 Clock Output A
OUT1
O2
LTCA2 Output 1
FCLP0B
O3
MSC0 Clock Output Positive B
P2.12
I/O0
MTSR1A
I
IN12
I
LTCA2 Input 12
MTSR1A
O1
SSC1 Master Transmit Output A
OUT2
O2
LTCA2 Output 2
SOP0B
O3
MSC0 Serial Data Output Positive B
P2.13
I/O0
SLSI11
I
SDI0
I
MSC0 Serial Data Input
IN13
I
LTCA2 Input 13
OUT3
O1
LTCA2 Output 3
Reserved
O2
-
Reserved
O3
-
162
163
165
A2/
PU
A2/
PU
A1/
PU
Port 2 General Purpose I/O Line 10
SSC1 Master Receive Input A
Port 2 General Purpose I/O Line 11
SSC1 Clock Input A
Port 2 General Purpose I/O Line 12
SSC1 Slave Receive Input A
Port 2 General Purpose I/O Line 13
SSC1 Slave Select Input 1
Port 3
Data Sheet
63
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
136
P3.0
I/O0
RXD0A
I
A1/
PU
RXD0A
O1
ASC0 Output (Sync. Mode)
RXD0A
O2
ASC0 Output (Sync. Mode)
OUT84
O3
GPTA0 Output 84
P3.1
I/O0
TXD0
O1
TXD0
O2
ASC0 Output
OUT85
O3
GPTA0 Output 85
P3.2
I/O0
SCLK0
I
SCLK0
O1
SSC0 Clock Output (Master Mode)
SCLK0
O2
SSC0 Clock Input (Master Mode)
OUT86
O3
GPTA0 Output 86
P3.3
I/O0
MRST0
I
MRST0
O1
SSC0 Slave Transmit Output (Slave Mode)
MRST0
O2
SSC0 Slave Transmit Output (Slave Mode)
OUT87
O3
GPTA0 Output 87
P3.4
I/O0
MTSR0
I
MTSR0
O1
SSC0 Master Transmit Output (Master Mode)
MTSR0
O2
SSC0 Master Transmit Output (Master Mode)
OUT88
O3
GPTA0 Output 88
P3.5
I/O0
SLSO00
O1
SLSO10
O2
135
129
130
132
126
SLSOANDO0 O3
Data Sheet
A1/
PU
A2/
PU
A2/
PU
A2/
PU
A2/
PU
Port 3 General Purpose I/O Line 0
ASC0 Receiver Input A (Async. & Sync. Mode)
Port 3 General Purpose I/O Line 1
ASC0 Output
Port 3 General Purpose I/O Line 2
SSC0 Clock Input (Slave Mode)
Port 3 General Purpose I/O Line 3
SSC0 Master Receive Input (Master Mode)
Port 3 General Purpose I/O Line 4
SSC0 Slave Receive Input (Slave Mode)
Port 3 General Purpose I/O Line 5
SSC0 Slave Select Output 0
SSC1 Slave Select Output 0
SSC0 AND SSC1 Slave Select Output 0
64
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
127
P3.6
I/O0
SLSO01
O1
A2/
PU
SLSO11
O2
128
138
137
144
SSC0 Slave Select Output 1
SSC1 Slave Select Output 1
SLSOANDO1 O3
131
Port 3 General Purpose I/O Line 6
SSC0 AND SSC1 Slave Select Output 1
P3.7
I/O0
SLSI01
I
SLSO02
O1
SSC0 Slave Select Output 2
SLSO12
O2
SSC1 Slave Select Output 2
OUT89
O3
GPTA0 Output 89
P3.8
I/O0
SLSO06
O1
TXD1
O2
ASC1 Transmit Output
OUT90
O3
GPTA0 Output 90
P3.9
I/O0
RXD1A
I
RXD1A
O1
ASC1 Receiver Output A (Synchronous Mode)
RXD1A
O2
ASC1 Receiver Output A (Synchronous Mode)
OUT91
O3
GPTA0 Output 91
P3.10
I/O0
REQ0
I
Reserved
O1
-
Reserved
O2
-
OUT92
O3
GPTA0 Output 92
P3.11
I/O0
REQ1
I
Reserved
O1
-
Reserved
O2
-
OUT93
O3
GPTA0 Output 93
Data Sheet
A2/
PU
A2/
PU
A1/
PU
A1/
PU
A1/
PU
Port 3 General Purpose I/O Line 7
SSC0 Slave Select Input 1
Port 3 General Purpose I/O Line 8
SSC0 Slave Select Output 6
Port 3 General Purpose I/O Line 9
ASC1 Receiver Input A
Port 3 General Purpose I/O Line 10
External Request Input 0
Port 3 General Purpose I/O Line 11
External Request Input 1
65
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
143
P3.12
I/O0
RXDCAN0
I
A1/
PU
RXD0B
I
ASC0 Receiver Input B
RXD0B
O1
ASC0 Receiver Output B (Synchronous Mode)
RXD0B
O2
ASC0 Receiver Output B (Synchronous Mode)
OUT94
O3
GPTA0 Output 94
P3.13
I/O0
TXDCAN0
O1
TXD0
O2
ASC0 Transmit Output
OUT95
O3
GPTA0 Output 95
P3.14
I/O0
RXDCAN1
I
RXD1B
I
ASC1 Receiver Input B
RXD1B
O1
ASC1 Receiver Output B (Synchronous Mode)
RXD1B
O2
ASC1 Receiver Output B (Synchronous Mode)
OUT96
O3
GPTA0 Output 96
P3.15
I/O0
TXDCAN1
O1
TXD1
O2
ASC1 Transmit Output
OUT97
O3
GPTA0 Output 97
P4.0
I/O0
IN28
I
IN52
I
GPTA0 Input 52
OUT28
O1
GPTA0 Output 28
OUT52
O2
GPTA0 Output 52
Reserved
O3
-
142
134
133
A2/
PU
A1/
PU
A2/
PU
Port 3 General Purpose I/O Line 12
CAN Node 0 Receiver Input
Port 3 General Purpose I/O Line 13
CAN Node 0 Transmitter Output
Port 3 General Purpose I/O Line 14
CAN Node 1 Receiver Input
Port 3 General Purpose I/O Line 15
CAN Node 1 Transmitter Output
Port 4
86
Data Sheet
A1/
PU
Port 4 General Purpose I/O Line 0
GPTA0 Input 28
66
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
87
P4.1
I/O0
IN29
I
A1/
PU
IN53
I
GPTA0 Input 53
OUT29
O1
GPTA0 Output 29
OUT53
O2
GPTA0 Output 53
Reserved
O3
-
P4.2
I/O0
IN30
I
IN54
I
GPTA0 Input 54
OUT30
O1
GPTA0 Output 30
OUT54
O2
GPTA0 Output 54
EXTCLK1
O3
External Clock 1 Output
P4.3
I/O0
IN31
I
IN55
I
GPTA0 Input 55
OUT31
O1
GPTA0 Output 31
OUT55
O2
GPTA0 Output 55
EXTCLK0
O3
External Clock 0 Output
P5.0
I/O0
IN40
I
IN26
I
LTCA2 Input 26
OUT40
O1
GPTA0 Output 40
OUT8
O2
LTCA2 Output 8
Reserved
O3
-
88
90
A2/
PU
A2/
PU
Port 4 General Purpose I/O Line 1
GPTA0 Input 29
Port 4 General Purpose I/O Line 2
GPTA0 Input 30
Port 4 General Purpose I/O Line 3
GPTA0 Input 31
Port 5
1
Data Sheet
A1/
PU
Port 5 General Purpose I/O Line 0
GPTA0 Input 40
67
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
2
P5.1
I/O0
IN41
I
A1/
PU
IN27
I
LTCA2 Input 27
OUT41
O1
GPTA0 Output 41
OUT9
O2
LTCA2 Output 9
Reserved
O3
-
P5.2
I/O0
IN42
I
IN28
I
LTCA2 Input 28
OUT42
O1
GPTA0 Output 42
OUT10
O2
LTCA2 Output 10
Reserved
O3
-
P5.3
I/O0
IN43
I
OUT43
O1
GPTA0 Output 43
OUT11
O2
LTCA2 Output 11
Reserved
O3
-
P5.4
I/O0
IN44
I
IN29
I
LTCA2 Input 29
OUT44
O1
GPTA0 Output 44
OUT12
O2
LTCA2 Output 12
Reserved
O3
-
P5.5
I/O0
IN45
I
IN30
I
LTCA2 Input 30
OUT45
O1
GPTA0 Output 45
OUT13
O2
LTCA2 Output 13
Reserved
O3
-
3
4
5
6
Data Sheet
A1/
PU
A1/
PU
A1/
PU
A1/
PU
Port 5 General Purpose I/O Line 1
GPTA0 Input 41
Port 5 General Purpose I/O Line 2
GPTA0 Input 42
Port 5 General Purpose I/O Line 3
GPTA0 Input 43
Port 5 General Purpose I/O Line 4
GPTA0 Input 44
Port 5 General Purpose I/O Line 5
GPTA0 Input 45
68
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
7
P5.6
I/O0
IN46
I
A1/
PU
IN31
I
LTCA2 Input 31
OUT46
O1
GPTA0 Output 46
OUT14
O2
LTCA2 Output 14
Reserved
O3
-
P5.7
I/O0
IN47
I
OUT47
O1
GPTA0 Output 47
OUT15
O2
LTCA2 Output 15
Reserved
O3
-
P5.8
I/O0
RDATA0B
I
Reserved
O1
-
Reserved
O2
-
OUT89
O3
LTCA2 Output 89
P5.9
I/O0
RVALID0B
I
Reserved
O1
-
Reserved
O2
-
OUT90
O3
LTCA2 Output 90
P5.10
I/O0
RREADY0B
O1
Reserved
O2
-
OUT91
O3
LTCA2 Output 91
P5.11
I/O0
RCLK0B
I
Reserved
O1
-
Reserved
O2
-
OUT92
O3
LTCA2 Output 92
8
13
14
15
16
Data Sheet
A1/
PU
A2/
PU
A2/
PU
A2/
PU
A2/
PU
Port 5 General Purpose I/O Line 6
GPTA0 Input 46
Port 5 General Purpose I/O Line 7
GPTA0 Input 47
Port 5 General Purpose I/O Line 8
MLI0 Receiver Data Input B
Port 5 General Purpose I/O Line 9
MLI0 Receiver Data Valid Input B
Port 5 General Purpose I/O Line 10
MLI0 Receiver Ready Input B
Port 5 General Purpose I/O Line 11
MLI0 Receiver Clock Input B
69
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
17
P5.12
I/O0
TDATA0
O1
A2/
PU
SLSO07
O2
SSC0 Slave Select Output 7
OUT93
O3
LTCA2 Output 93
P5.13
I/O0
TVALID0B
O1
SLSO16
O2
SSC1 Slave Select Output 6
Reserved
O3
-
P5.14
I/O0
TREADY0B
I
Reserved
O1
-
Reserved
O2
-
OUT94
O3
LTCA2 Output 94
P5.15
I/O0
TCLK0
O1
Reserved
O2
-
OUT95
O3
LTCA2 Output 95
P6.0
I/O0
IN14
I
FCLN0
O1
OUT80
O2
GPTA0 Output 80
OUT4
O3
LTCA2 Output 4
P6.1
I/O0
IN15
I
FCLP0A
O1
OUT81
O2
GPTA0 Output 81
OUT5
O3
LTCA2 Output 5
18
19
9
A2/
PU
A2/
PU
A2/
PU
Port 5 General Purpose I/O Line 12
MLI0 Transmitter Data Output
Port 5 General Purpose I/O Line 13
MLI0 Transmitter Valid Input B
Port 5 General Purpose I/O Line 14
MLI0 Transmitter Ready Input B
Port 5 General Purpose I/O Line 15
MLI0 Transmitter Clock Output
Port 6
156
157
Data Sheet
A1/
F/
PU
A1/
F/
PU
Port 6 General Purpose I/O Line 0
LTCA2 Input 14
MSC0 Clock Output Negative
Port 6 General Purpose I/O Line 1
LTCA2 Input 15
MSC0 Clock Output Positive A
70
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
158
P6.2
I/O0
IN24
I
SON0
O1
A1/
F/
PU
OUT82
O2
GPTA0 Output 82
OUT6
O3
LTCA2 Output 6
P6.3
I/O0
IN25
I
SOP0A
O1
OUT83
O2
GPTA0 Output 83
OUT7
O3
LTCA2 Output 7
159
A1/
F/
PU
Port 6 General Purpose I/O Line 2
LTCA2 Input 24
MSC0 Serial Data Output Negative
Port 6 General Purpose I/O Line 3
LTCA2 Input 25
MSC0 Serial Data Output Positive A
Analog Input Port
67
AN0
I
D
Analog Input 0
66
AN1
I
D
Analog Input 1
65
AN2
I
D
Analog Input 2
64
AN3
I
D
Analog Input 3
63
AN4
I
D
Analog Input 4
62
AN5
I
D
Analog Input 5
61
AN6
I
D
Analog Input 6
36
AN7
I
D
Analog Input 7
60
AN8
I
D
Analog Input 8
59
AN9
I
D
Analog Input 9
58
AN10
I
D
Analog Input 10
57
AN11
I
D
Analog Input 11
56
AN12
I
D
Analog Input 12
55
AN13
I
D
Analog Input 13
50
AN14
I
D
Analog Input 14
49
AN15
I
D
Analog Input 15
48
AN16
I
D
Analog Input 16
47
AN17
I
D
Analog Input 17
46
AN18
I
D
Analog Input 18
Data Sheet
71
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
45
AN19
I
D
Analog Input 19
44
AN20
I
D
Analog Input 20
43
AN21
I
D
Analog Input 21
42
AN22
I
D
Analog Input 22
41
AN23
I
D
Analog Input 23
40
AN24
I
D
Analog Input 24
39
AN25
I
D
Analog Input 25
38
AN26
I
D
Analog Input 26
37
AN27
I
D
Analog Input 27
35
AN28
I
D
Analog Input 28
34
AN29
I
D
Analog Input 29
33
AN30
I
D
Analog Input 30
32
AN31
I
D
Analog Input 31
31
AN32
I
D
Analog Input 32
30
AN33
I
D
Analog Input 33
29
AN34
I
D
Analog Input 34
28
AN35
I
D
Analog Input 35
54
VDDM
VSSM
VAREF0
VAREF1
VAGND0
VDDMF
VDDAF
VSSMF
VSSAF
VFAREF
VFAGND
-
-
ADC Analog Part Power Supply (3.3V - 5V)
-
-
ADC Analog Part Ground
-
-
ADC0 Reference Voltage
-
-
ADC1 Reference Voltage
-
-
ADC Reference Ground
-
-
FADC Analog Part Power Supply (3.3V)2)
-
-
FADC Analog Part Logic Power Supply (1.5V)
-
-
FADC Analog Part Ground
-
-
FADC Analog Part Ground
-
-
FADC Reference Voltage
-
-
FADC Reference Ground
53
52,
51
24
23
25,
26
27
Data Sheet
72
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl.
Type Function
10, VDD
213),
68,
84,
89,
99,
123,
153,
170
-
-
Digital Core Power Supply (1.5V)
11, VDDP
20,
69,
83,
91,
100,
124,
139,
154,
171
-
-
Port Power Supply (3.3V)
12, VSS
22,
70,
82,
85,
92,
101,
125,
140,
155,
172
-
-
Digital Ground
-
-
Main Oscillator and PLL Power Supply (1.5V)
-
-
Main Oscillator Power Supply (3.3V)
-
-
Main Oscillator and PLL Ground
141
VDDOSC
VDDOSC3
VSSOSC
VDDFL3
-
-
Power Supply for Flash (3.3V)
102
XTAL1
I
Main Oscillator Input
103
XTAL2
O
Main Oscillator Output
105
106
104
Symbol
Data Sheet
73
V1.3, 2009-10
TC1167
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Pin
Symbol
Ctrl.
Type Function
111
TDI
I
BRKIN
I
A2/
PU
BRKOUT
O
TMS
I
DAP1
I/O
TDO
I/O
DAP2
I/O
BRKIN
I
OCDS Break Input Line
BRKOUT
O
OCDS Break Output Line
114
TRST
I
A1/
PD
JTAG Reset Input
115
TCK
I
JTAG Clock Input
DAP0
I
A1/
PD
118
TESTMODE
I
PU
Test Mode Select Input
120
ESR1
I/O
A2/
PD
External System Request Reset Input 1
121
PORST
I
PD
Power On Reset Input
(input pad with input spike-filter)
122
ESR0
I/O
A2
External System Request Reset Input 0
Default configuration during and after reset is
open-drain driver, corresponding to A2 strong
driver, sharp edge. The driver drives low during
power-on reset.
112
113
JTAG Serial Data Input
OCDS Break Input Line
OCDS Break Output Line
A2/
PD
JTAG State Machine Control Input
A2/
PU
JTAG Serial Data Output
Device Access Port Line 1
Device Access Port Line 2
Device Access Port Line 0
1) TC1767 ED: PG-LQFP-176-6
2) This pin is also connected to the analog power supply for comparator of the ADC module.
3) For the TC1767 emulation device (ED), this pin is bonded to VDDSB (ED Stand By RAM supply). In the TC1767
non ED device, this pin is bonded to a VDD pad.
Legend for Table 4
Column “Ctrl.”:
I = Input (for GPIO port lines with IOCR bit field selection PCx = 0XXXB)
O = Output
O0 = Output with IOCR bit field selection PCx = 1X00B
O1 = Output with IOCR bit field selection PCx = 1X01B (ALT1)
Data Sheet
74
V1.3, 2009-10
TC1167
Pinning
O2 = Output with IOCR bit field selection PCx = 1X10B(ALT2)
O3 = Output with IOCR bit field selection PCx = 1X11(ALT3)
Column “Type”:
A1 = Pad class A1 (LVTTL)
A2 = Pad class A2 (LVTTL)
F = Pad class F (LVDS/CMOS)
D = Pad class D (ADC)
PU = with pull-up device connected during reset (PORST = 0)
PD = with pull-down device connected during reset (PORST = 0)
TR = tri-state during reset (PORST = 0)
3.1.2
Reset Behavior of the Pins
Table 5 describes the pull-up/pull-down behavior of the System I/O pins during poweron reset.
•
Table 5
List of Pull-up/Pull-down PORST Reset Behavior of the Pins
Pins
PORST = 0
PORST = 1
All GPIOs, TDI, TESTMODE
Pull-up
PORST, TRST, TCK, TMS
Pull-down
ESR0
The open-drain driver is Pull-up2)
used to drive low.1)
ESR1
Pull-down3)
TDO
Pull-up
High-impedance
1) Valid additionally after deactivation of PORST until the internal reset phase has finished. See the SCU chapter
for details.
2) See the SCU_IOCR register description.
3) see the SCU_IOCR register description.
Data Sheet
75
V1.3, 2009-10
TC1167
Identification Registers
4
Identification Registers
The Identification Registers uniquely identify a module or the whole device.
Table 4-1
TC1167 Identification Registers
Short Name
Value
Address
Stepping
ADC0_ID
0058 C000H
F010 1008H
–
ADC1_ID
0058 C000H
F010 1408H
–
ASC0_ID
0000 4402H
F000 0A08H
–
ASC1_ID
0000 4402H
F000 0B08H
–
CAN_ID
002B C061H
F000 4008H
–
CBS_JDPID
0000 6350H
F000 0408H
–
CBS_JTAGID
1015 9083H
F000 0464H
–
CPS_ID
0015 C007H
F7E0 FF08H
–
CPU_ID
000A C006H
F7E1 FE18H
–
DMA_ID
001A C004H
F000 3C08H
–
DMI_ID
0008 C005H
F87F FC08H
–
FADC_ID
0027 C003H
F010 0408H
–
FLASH0_ID
0053 C001H
F800 2008H
–
FPU_ID
0054 C003H
F7E1 A020H
–
GPTA0_ID
0029 C005H
F000 1808H
–
LBCU_ID
000F C005H
F87F FE08H
–
LFI_ID
000C C006H
F87F FF08H
–
LTCA2_ID
002A C005H
F000 2808H
–
MCHK_ID
001B C001H
F010 C208H
–
MLI0_ID
0025 C007H
F010 C008H
–
MSC0_ID
0028 C003H
F000 0808H
–
PCP_ID
0020 C006H
F004 3F08H
–
PMI_ID
000B C005H
F87F FD08H
–
PMU0_ID
0050 C001H
F800 0508H
–
SBCU_ID
0000 6A0CH
F000 0108H
–
SCU_CHIPID
0000 9001H
F000 0640H
–
SCU_ID
0052 C001H
F000 0508H
–
Data Sheet
76
V1.3, 2009-10
TC1167
Identification Registers
Table 4-1
TC1167 Identification Registers (cont’d)
Short Name
Value
Address
Stepping
SCU_MANID
0000 1820H
F000 0644H
–
SCU_RTID
0000 0007H
F000 0648H
AD-step
SSC0_ID
0000 4511H
F010 0108H
–
SSC1_ID
0000 4511H
F010 0208H
–
STM_ID
0000 C006H
F000 0208H
–
Data Sheet
77
V1.3, 2009-10
TC1167
Electrical Parameters
5
Electrical Parameters
5.1
General Parameters
5.1.1
Parameter Interpretation
The parameters listed in this section partly represent the characteristics of the TC1167
and partly its requirements on the system. To aid interpreting the parameters easily
when evaluating them for a design, they are marked with an two-letter abbreviation in
column “Symbol”:
•
•
CC
Such parameters indicate Controller Characteristics which are a distinctive feature of
the TC1167 and must be regarded for a system design.
SR
Such parameters indicate System Requirements which must provided by the
microcontroller system in which the TC1167 designed in.
Data Sheet
78
V1.3, 2009-10
TC1167
Electrical Parameters
5.1.2
Pad Driver and Pad Classes Summary
This section gives an overview on the different pad driver classes and its basic
characteristics. More details (mainly DC parameters) are defined in the Section 5.2.1.
Table 6
Pad Driver and Pad Classes Overview
Leakage1) Termination
Class Power Type
Supply
Sub Class
Speed Load
Grade
A
LVTTL
I/O,
LVTTL
outputs
A1
(e.g. GPIO)
6 MHz
100 pF 500 nA
A2
(e.g. serial
I/Os)
40
MHz
50 pF
6 μA
Series
termination
recommended
3.3 V
No
F
3.3 V
LVDS/
CMOS
–
50
MHz
–
–
Parallel
termination2),
100 Ω ± 10%
DE
5V
ADC
–
–
–
–
see Table 11
1) Values are for TJmax = 150 °C.
2) In applications where the LVDSpins are not used (disabled), these pins must be either left unconnected, or
properly terminated with the differential parallel termination of 100 Ω ± 10%.
Data Sheet
79
V1.3, 2009-10
TC1167
Electrical Parameters
5.1.3
Absolute Maximum Ratings
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > related VDD or VIN < VSS) the
voltage on the related VDD pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Table 7
Absolute Maximum Rating Parameters
Parameter
Symbol
Values
Min. Typ. Max.
TA
Storage temperature
TST
TJ
Junction temperature
Voltage at 1.5 V power supply VDD
pins with respect to VSS1)
Voltage at 3.3 V power supply VDDP
pins with respect to VSS2)
Voltage at 5 V power supply VDDM
pins with respect to VSS
Voltage on any Class A input VIN
Ambient temperature
Unit Note /
Test Con
dition
SR -40
–
85
°C
Under bias
SR -65
–
150
°C
–
SR -40
–
150
°C
Under bias
–
–
2.25
V
–
SR –
–
3.75
V
–
SR –
–
5.5
V
–
VDDP + 0.5
V
Whatever
is lower
SR
SR -0.5 –
pin and dedicated input pins
with respect to VSS
or max. 3.7
Voltage on any Class D
analog input pin with respect
to VAGND
VAIN
VAREFx
Voltage on any Class D
analog input pin with respect
to VSSAF, if the FADC is
switched through to the pin.
VAINF
VFAREF
-0.5 –
VDDM + 0.5
V
–
-0.5 –
VDDM + 0.5
V
–
SR
SR
1) Applicable for VDD, VDDOSC, VDDPLL, and VDDAF.
2) Applicable for VDDP, VDDFL3, and VDDMF.
Data Sheet
80
V1.3, 2009-10
TC1167
Electrical Parameters
5.1.4
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation of the TC1167. All parameters specified in the following table refer to these
operating conditions, unless otherwise noted.
Table 8
Operating Condition Parameters
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
Typ. Max.
1.42
–
1.582)
V
–
3.13
–
3.473)
V
For Class A pins
(3.3 V ± 5%)
3.13
–
3.473)
V
–
3.13
–
3.473)
V
FADC
1.42
–
1.58
2)
V
FADC
4.75
–
5.25
V
For Class DE
pins, ADC
SR 0
–
–
V
–
SR –
-40
85
°C
–
–
–
–
–
See separate
specification
Page 88,
Page 93
-1
–
3
mA
4)
Sum of overload current Σ|IOV|
at class D pins
–
–
10
mA
per single ADC
Overload coupling
KOVAP
5)
factor for analog inputs K
–
–
5×10-5
0 < IOV < 3 mA
–
–
5×10-4
-1 mA < IOV < 0
Digital supply voltage1)
VDD
SR
VDDOSC SR
VDDP
SR
VDDOSC3 SR
VDDFL3 SR
Analog supply voltages VDDMF SR
VDDAF SR
VDDM
SR
Digital ground voltage
Ambient temperature
under bias
VSS
TA
Analog supply voltages –
Overload current at
class D pins
IOV
OVAN
CPU & LMB Bus
Frequency
fCPU
SR
–
–
133
80
MHz Derivative
dependent
PCP Frequency
fPCP
SR
–
–
133
80
MHz
Derivative
dependent
FPI Bus Frequency
fSYS
ISC
SR
–
–
80
MHz
6)
–
+5
mA
7)
Short circuit current
Data Sheet
SR -5
81
6)
V1.3, 2009-10
TC1167
Electrical Parameters
Table 8
Operating Condition Parameters
Parameter
Symbol
Values
Absolute sum of short
circuit currents of a pin
group (see Table 9)
Σ|ISC_PG|
Inactive device pin
current
IID
Absolute sum of short
circuit currents of the
device
Σ|ISC_D|
External load
capacitance
CL
Min.
Typ. Max.
Unit Note /
Test Condition
–
–
20
mA
See note
–
1
mA
All power supply
voltages VDDx = 0
–
–
100
mA
See note4)
–
–
–
pF
Depending on pin
class. See DC
characteristics
SR
SR -1
SR
SR
1) Digital supply voltages applied to the TC1167 must be static regulated voltages which allow a typical voltage
swing of ±5%.
2) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 μs and the cumulated summary of the pulses does not exceed 1 h.
3) Voltage overshoot up to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 μs and the cumulated summary of the pulses does not exceed 1 h.
4) See additional document “TC1767 Pin Reliability in Overload“ for definition of overload current on digital pins.
5) The overload coupling factor (kA) defines the worst case relation of an overload condition (IOV) at one pin to
the resulting leakage current (IleakTOT) into an adjacent pin: IleakTOT = ±kA × |IOV| + IOZ1.
Thus under overload conditions an additional error leakage voltage (VAEL) will be induced onto an adjacent
analog input pin due to the resistance of the analog input source (RAIN). That means VAEL = RAIN ×
|IleakTOT|.
The definition of adjacent pins is related to their order on the silicon.
The Injected leakage current always flows in the opposite direction from the causing overload current.
Therefore, the total leakage current must be calculated as an algebraic sum of the both component leakage
currents (the own leakage current IOZ1 and the optional injected leakage current).
6) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter
parameters.
7) Applicable for digital outputs.
Table 9
Pin Groups for Overload/Short-Circuit Current Sum Parameter
Group
Pins
1
P5.[14:8]
2
P1.[14:12]; P2.[7:0]
3
P4.[3:0]
4
P1.[3:2]; P1.[11:8]
Data Sheet
82
V1.3, 2009-10
TC1167
Electrical Parameters
Table 9
Pin Groups for Overload/Short-Circuit Current Sum Parameter
Group
Pins
5
P1.[7:4]; TDI/BRKIN/BRKOUT; TRST, TCK/DAP0; P1.[1:0]; P1.15;
TESTMODE; ESR0; PORST; ESR1
6
P3.[10:0]; P3.[15:14]
7
P3.[13:11]; P0.[3:0]; P0.[11:8]
8
P6.[3:0]; P2.[13:8]; P0.[5:4]; P0.[13:12]
9
P0.[7:6]; P0.[15:14]; P5.[7:0]; P5.15
Data Sheet
83
V1.3, 2009-10
TC1167
Electrical Parameters
5.2
DC Parameters
5.2.1
Input/Output Pins
Table 10
Input/Output DC-Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
Typ. Max.
10
–
Unit Note / Test Condition
General Parameters
Pull-up current1)
|IPUH|
100
μA
CC
|IPDL|
Pull-down
current1)
Pin capacitance
(Digital I/O)
class A1/A2/F/Input pads.
10
–
150
μA
CC
1)
CIO
VIN < VIHAmin;
VIN >VILAmax;
class A1/A2/F/Input pads.
–
–
10
pF
f = 1 MHz
TA = 25 °C
CC
Input only Pads (VDDP = 3.13 to 3.47 V = 3.3 V ± 5%)
Input low voltage
VILI
-0.3
–
0.36 ×
V
–
–
VDDP
VDDP+
V
Whatever is lower
SR
0.62 ×
Input high voltage VIHI
SR VDDP
Ratio VIL/VIH
CC 0.58
Input high voltage VIHJ
0.64 ×
TRST, TCK
SR VDDP
0.1 ×
0.3 or
max.
3.6
–
–
–
–
–
VDDP+
V
Whatever is lower
0.3 or
max.
3.6
–
–
V
4)
–
–
±3000
±6000
nA
((VDDP/2)-1) < VIN <
((VDDP/2)+1)
Otherwise
Spike filter always tSF1
–
blocked pulse
CC
duration
–
10
ns
Input hysteresis
HYSI
CC VDDP
Input leakage
current2)
Data Sheet
IOZI
CC
84
V1.3, 2009-10
TC1167
Electrical Parameters
Table 10
Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)
Parameter
Spike filter passthrough pulse
duration
Symbol
tSF2
Values
Min.
Typ. Max.
100
–
–
Unit Note / Test Condition
ns
CC
Class A Pads (VDDP = 3.13 to 3.47 V = 3.3V ± 5%)
Output low voltage VOLA
2)3)
Output high
voltage2) 3)
–
–
0.4
V
CC
VOHA
IOL = 2 mA for medium
and strong driver mode,
IOL = 500 μA for weak
driver mode
2.4
–
–
V
CC
IOH = -2 mA for medium
and strong driver mode,
IOH = -500 μA for weak
driver mode
VDDP - –
–
V
0.4
IOH = -1.4 mA for medium
and strong driver mode,
IOH = -400 μA for weak
driver mode
–
0.36 ×
V
–
Input high voltage VIHA1
0.62 ×
Class A1 pins
SR VDDP
–
VDDP
VDDP+
V
Whatever is lower
Ratio VIL/VIH
–
–
–
–
Input high voltage VIHA2
0.60 ×
Class A2 pins
SR VDDP
–
VDDP+
0.3 or
max.
3.6
V
Whatever is lower
Ratio VIL/VIH
CC 0.60
–
–
–
–
Input hysteresis
HYSA
0.1 ×
CC VDDP
–
–
V
4)
Input leakage
current Class A2
pins
IOZA2
–
±3000
nA
((VDDP/2)-1) < VIN <
((VDDP/2)+1)
Otherwise2)
Input low voltage
Class A1/2 pins
Data Sheet
VILA
-0.3
SR
SR 0.58
–
0.3 or
max.
3.6
±6000
85
V1.3, 2009-10
TC1167
Electrical Parameters
Table 10
Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)
Parameter
Input leakage
current
Class A1 pins
Symbol
IOZA1
Values
Min.
Typ. Max.
–
–
±500
Unit Note / Test Condition
nA
0 V <VIN < VDDP
CC
Class F Pads, LVDS Mode (VDDP = 3.13 to 3.47 V = 3.3V ± 5%)
Output low voltage VOL CC 875
Output high
voltage
VOH CC
Output differential VOD CC 150
voltage
Output offset
voltage
VOS CC 1075
Output impedance R0
CC 40
–
mV
Parallel termination
100 Ω ± 1%
–
1525
mV
Parallel termination
100 Ω ± 1%
–
400
mV
Parallel termination
100 Ω ± 1%
–
1325
mV
Parallel termination
100 Ω ± 1%
–
140
Ω
–
Class F Pads, CMOS Mode (VDDP = 3.13 to 3.47 V = 3.3V ± 5%)
Input low voltage
Class F pins
VILF
-0.3
–
0.36 ×
V
–
–
VDDP
VDDP+
V
Whatever is lower
SR
Input high voltage VIHF
0.6 ×
Class F pins
SR VDDP
0.3 or
max 3.6
Input hysteresis
Class F pins
HYSF
0.05 ×
CC VDDP
–
–
V
Input leakage
current Class F
pins
IOZF
–
±3000
nA
((VDDP/2)-1) < VIN <
((VDDP/2)+1)
Otherwise2)
–
CC
±6000
Output low voltage VOLF
5)
Output high
voltage2) 5)
–
–
0.4
V
IOL = 2 mA
2.4
–
–
V
CC V
DDP 0.4
–
–
V
IOH = -2 mA
IOH = -1.4 mA
–
–
–
–
–
CC
VOHF
Class D Pads
See ADC Characteristics
1) Not subject to production test, verified by design / characterization.
2) Only one of these parameters is tested, the other is verified by design characterization
Data Sheet
86
V1.3, 2009-10
TC1167
Electrical Parameters
3) Maximum resistance of the driver RDSON, defined for P_MOS / N_MOS transistor separately:
25 / 20 Ω for strong driver mode, IOH / L < 2 mA,
200 / 150 Ω for medium driver mode, IOH / L < 400 uA,
600 / 400 Ω for weak driver mode, IOH / L < 100 uA,
verified by design / characterization.
4) Function verified by design, value verified by design characterization.
Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce.
It cannot be guaranteed that it suppresses switching due to external system noise.
5) The following constraint applies to an LVDS pair used in CMOS mode: only one pin of a pair should be used
as output, the other should be used as input, or both pins should be used as inputs. Using both pins as outputs
is not recommended because of the higher crosstalk between them.
Data Sheet
87
V1.3, 2009-10
TC1167
Electrical Parameters
5.2.2
Analog to Digital Converters (ADC0/ADC1)
All ADC parameters are optimized for and valid in the range of VDDM = 5V ± 5%.
Table 11
ADC Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
Analog supply
voltage
Analog ground
voltage
Unit
Note /
Test Condition
Typ.
Max.
5
5.25
V
–
3.13
3.3
3.471)
V
–
VDD
SR 1.42
1.5
1.582)
V
Power supply for
ADC digital part,
internal supply
VSSM
SR -0.1
–
0.1
V
–
V
–
VAREF - V
–
VDDM
SR 4.75
Analog reference VAREFx SR VAGNDx+1
voltage14)
V
VDDM VDDM+
0.05
1)3)4)
Analog reference VAGNDx SR VSSMx ground14)
0.05V
1V
SR VAGNDx
–
VAREFx
V
–
Analog reference VAREFxVDDM/2
5)14)
voltage range
VAGNDx SR
–
VDDM + V
0.05
–
Analog input
voltage range
VAIN
0
fADC SR 1
fADCI
CC 0.5
–
80
MHz
–
–
10
MHz
–
tS
CC 2
–
257
TADCI –
Total unadjusted TUE6) CC –
error5)
–
±4
LSB
12-bit conversion,
without noise7)8)
–
–
±2
LSB
10-bit conversion8)
–
–
±1
LSB
8-bit conversion8)
–
±1.5
±3.0
LSB
12-bit conversion
without noise8)10)
–
±1.5
±3.0
LSB
12-bit conversion
without noise8)10)
–
±0.5
±3.5
LSB
12-bit conversion
without noise8)10)
Converter Clock
Internal ADC
clocks
Sample time
DNL error9) 5)
EADNL
CC
INL error9)5)
EAINL
CC
9)5)
Gain error
EAGAIN
CC
Data Sheet
88
V1.3, 2009-10
TC1167
Electrical Parameters
Table 11
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Symbol
9)5)
Offset error
EAOFF
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
–
±1.0
±4.0
LSB
12-bit conversion
without noise8)10)
-300
–
100
nA
(0% VDDM) < VIN <
(3% VDDM)
-100
–
200
nA
(3% VDDM) < VIN <
(97% VDDM)
-100
–
300
nA
(97% VDDM) < VIN <
(100% VDDM)
CC
Input leakage
IOZ1 CC
current at analog
inputs of ADC0/1
11) 12) 13)
Input leakage
current at
VAREF0/1,
per module
IOZ2
CC –
–
±1.5
μA
0 V < VAREF <
VDDM, no conversion
running
Input current at
VAREF0/114),
per module
IAREF
CC –
35
75
μA
rms
0 V < VAREF <
Total
capacitance of
the voltage
reference
inputs16)14)
CAREFTOT
Switched
capacitance at
the positive
reference
voltage input14)
CAREFSW
Resistance of
the reference
voltage input
path16)
RAREF
Total
capacitance of
the analog
inputs16)
CAINTOT
Data Sheet
VDDM15)
–
20
40
pF
8)
–
15
30
pF
8)17)
–
500
1000
Ω
500 Ohm increased
for AN[1:0] used as
reference input8)
–
25
30
pF
6)8)
CC
CC
CC
CC
89
V1.3, 2009-10
TC1167
Electrical Parameters
Table 11
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Switched
capacitance at
the analog
voltage inputs
Symbol
CAINSW
Unit
Note /
Test Condition
Min.
Typ.
Max.
–
7
20
pF
8)18)
700
1500
Ω
8)
550
90019)
Ω
Test feature
available only for
AIN7 8) 20)
15
rms
30
peak
mA
Test feature
available only for
AIN78)
CC
ON resistance of RAIN
the transmission
gates in the
analog voltage
path
ON resistance
for the ADC test
(pull-down for
AIN7)
Values
CC –
RAIN7T CC 180
Current through IAIN7T
resistance for the
ADC test (pulldown for AIN7)
CC –
1) Voltage overshoot up to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 μs and the cumulated summary of the pulses does not exceed 1 h.
2) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 μs and the cumulated summary of the pulses does not exceed 1 h.
3) A running conversion may become inexact in case of violating the normal operating conditions (voltage
overshoot).
VAREF
increases
or
the
VDDM
decreases,
so
that
the
reference
voltage
VAREF = (VDDM + 0.05 V to VDDM + 0.07 V), then the accuracy of the ADC decreases by 4 LSB12.
5) If a reduced reference voltage in a range of VDDM/2 to VDDM is used, then the ADC converter errors increase.
4) If
If the reference voltage is reduced with the factor k (k<1), then TUE, DNL, INL Gain and Offset errors increase
with the factor 1/k.
If a reduced reference voltage in a range of 1 V to VDDM/2 is used, then there are additional decrease in the
ADC speed and accuracy.
6) TUE is tested at VAREF = 5.0 V, VAGND = 0 V and VDDM = 5.0 V
7) ADC module capability.
8) Not subject to production test, verified by design / characterization.
9) The sum of DNL/INL/Gain/Offset errors does not exceed the related TUE total unadjusted error.
10) For 10-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with factor 0.25.
For 8-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with 0.0625.
11) The leakage current definition is a continuous function, as shown in Figure 19. The numerical values defined
determine the characteristic points of the given continuous linear approximation - they do not define step
function.
Data Sheet
90
V1.3, 2009-10
TC1167
Electrical Parameters
12) Only one of these parameters is tested, the other is verified by design characterization.
13) The leakage current decreases typically 30% for junction temperature decrease of 10oC.
14) Applies to AINx, when used as auxiliary reference inputs.
15) IAREF_MAX is valid for the minimum specified conversion time. The current flowing during an ADC conversion
with a duration of up to tC = 25µs can be calculated with the formula IAREF_MAX = QCONV/tC. Every conversion
needs a total charge of QCONV = 150pC from VAREF.
All ADC conversions with a duration longer than tC = 25µs consume an IAREF_MAX = 6µA.
16) For the definition of the parameters see also Figure 18.
17) This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage
at once. Instead of this smaller capacitances are successively switched to the reference voltage.
18) The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before the sampling moment.
Because of the parasitic elements the voltage measured at AINx can deviate from VAREF/2, and is typically
1.35V.
19) RAIN7T = 1400 Ohm maximum and 830 Ohm typical in the VDDM = 3.3V± 5% range.
20) The DC current at the pin is limited to 3 mA for the operational lifetime.
clock
generation
ADC kernel
interrupts,
etc.
fADC
divider for
fADCI
analog clock
f ADCI
registers
analog part
divider for
f ADCD
digital clock
fADCD
arbiter
ADC_clocking
Figure 17
Data Sheet
ADC0/ADC1 Clock Circuit
91
V1.3, 2009-10
TC1167
Electrical Parameters
Table 12
Conversion Time (Operating Conditions apply)
Parameter
Symbol
Value
Unit Note
CC 2 × TADC + (4 + STC + n) × TADCI μs
tC
Conversion
time with
post-calibration
2 × TADC + (2 + STC + n) × TADCI
Conversion
time without
post-calibration
REXT
VAIN =
n = 8, 10, 12 for
n - bit conversion
TADC = 1 / fADC
TADCI = 1 / fADCI
Analog Input Circuitry
RAIN, On
ANx
CEXT
CAINSW
CAINTOT - CAINSW
VAGNDx
RAIN7T
Reference Voltage Input Circuitry
RAREF, On
VAREFx
VAREF
CAREFTOT - CAREFSW
CAREFSW
VAGNDx
Analog_InpRefDiag
Figure 18
ADC0/ADC1 Input Circuits
Io z 1
300nA
200nA
100nA
-1 0 0 n A
V IN [V D D M % ]
3%
97% 100%
-3 0 0 n A
A D C L e a k a g e 1 0 .v s d
Figure 19
Data Sheet
ADC0/ADC1Analog Inputs Leakage
92
V1.3, 2009-10
TC1167
Electrical Parameters
5.2.3
Fast Analog to Digital Converter (FADC)
All parameters apply to FADC used in differential mode, which is the default and the
intended mode of operation, and which takes advantage of many error cancelation
effects inherent to differential measurements in general.
Table 13
FADC Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
DNL error
INL error
Gradient error9)
Unit
Note /
Test Condition
Typ. Max.
–
±1
LSB
9)
–
±4
LSB
9)
–
±5
%
Without calibration
gain 1, 2, 4
–
–
±6
%
Without calibration
gain 8
–
–
±203)
mV
With calibration1)
CC –
–
±903)
mV
Without calibration
–
–
±60
mV
–
–
3.474)
V
–
–
1.585)
V
–
–
0.1
V
–
–
3.474)6)
V
Nominal 3.3 V
EFDNL CC –
EFINL CC –
–
EFGRAD
CC
Offset error9)1)
EFOFF2)
Reference error of
internal VFAREF/2
EFREF
Analog supply
voltages
VDDMF SR 3.13
VDDAF SR 1.42
-0.1
VSSAF
Analog ground
voltage
CC
SR
Analog reference
voltage
VFAREF
Analog reference
ground
VFAGND
3.13
SR
VSSAF + V
0.05 V
–
VDDMF
V
–
–
10
mA
–
–
10
mA
7)
–
120
μA
rms
Independent of
conversion
Input leakage current IFOZ2
–
8)
at VFAREF
CC
–
±500
nA
0 V < VIN < VDDMF
–
Input leakage current IFOZ3
CC
at VFAGND8)
–
±8
μA
0 V < VIN < VDDMF
Analog input voltage VAINF
range
Analog supply
currents
Input current at
VFAREF
Data Sheet
VSSAF - –
SR 0.05 V
VFAGND –
SR
IDDMF SR –
IDDAF SR –
–
IFAREF
CC
93
V1.3, 2009-10
TC1167
Electrical Parameters
Table 13
FADC Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Values
Min.
Conversion time
tC_FADC CC –
Unit
Note /
Test Condition
CLK
of
For 10-bit conv.
Typ. Max.
–
21
fFADC
Converter clock
Input resistance of
the analog voltage
path (Rn, Rp)
fFADC SR 10
100
RFAIN
–
80
MHz
–
–
200
kΩ
9)
2
–
–
MHz
–
CC –
–
5
μs
–
CC
Channel amplifier
cutoff frequency9)
fCOFF
Settling time of a
channel amplifier
(after changing
channel amplifier
input)9)
tSET
CC
1) Calibration should be performed at each power-up. In case of continuous operation, calibration should be
performed minimum once per week, or on regular basis in order to compensate for temperature changes.
2) The offset error voltage drifts over the whole temperature range maximum ±6 LSB.
3) Applies when the gain of the channel equals one. For the other gain settings, the offset error increases; it must
be multiplied with the applied gain.
4) Voltage overshoots up to 4 V are permissible, provided the pulse duration is less than 100 μs and the
cumulated summary of the pulses does not exceed 1 h.
5) Voltage overshoots up to 1.7 V are permissible, provided the pulse duration is less than 100 μs and the
cumulated sum of the pulses does not exceed 1 h.
6) A running conversion may become inexact in case of violating the normal operating conditions (voltage
overshoots).
7) Current peaks of up to 40 mA with a duration of max. 2 ns may occur
8) This value applies in power-down mode.
9) Not subject to production test, verified by design / characterization.
The calibration procedure should run after each power-up, when all power supply
voltages and the reference voltage have stabilized.
Data Sheet
94
V1.3, 2009-10
TC1167
Electrical Parameters
FADC Analog Input Stage
RN
FAINxN
VFAREF /2
=
VFAGND
+
+
RP
FAINxP
-
FADC Reference Voltage
Input Circuitry
VFAREF
IFAREF
VFAREF
VFAGND
FADC_InpRefDiag
Figure 20
Data Sheet
FADC Input Circuits
95
V1.3, 2009-10
TC1167
Electrical Parameters
5.2.4
Table 14
Oscillator Pins
Oscillator Pins Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
Typ. Max.
Unit Note /
Test Condition
Frequency range
fOSC CC 8
–
25
MHz External Crystal
Mode selected
Input low voltage at
XTAL11)
VILX SR -0.2
–
0.3 ×
V
–
Input high voltage at
XTAL11)
VIHX SR 0.7 ×
–
VDDOSC3
IIX1 CC –
–
VDDOSC3
VDDOSC3 V
–
Input current at
XTAL1
+ 0.2
±25
μA
0 V < VIN < VDDOSC3
1) If the XTAL1 pin is driven by a crystal, reaching a minimum amplitude (peak-to-peak) of 0.3 × VDDOSC3 is
sufficient.
Note: It is strongly recommended to measure the oscillation allowance (negative
resistance) in the final target system (layout) to determine the optimal parameters
for the oscillator operation. Refer to the limits specified by the crystal supplier.
5.2.5
Table 15
Temperature Sensor
Temperature Sensor Characteristics (Operating Conditions apply)
Parameter
Symbol
Temperature sensor range
TSR
Temperature sensor
measurement time
tTSMT SR –
Start-up time after reset
tTSST SR –
TTSA CC –
Sensor accuracy
Data Sheet
Values
Unit Note /
Test Condition
Min. Typ. Max.
SR -40
96
150
°C
Junction
temperature
–
100
μs
–
–
10
μs
–
–
±6
°C
Calibrated
V1.3, 2009-10
TC1167
Electrical Parameters
The following formula calculates the temperature measured by the DTS in [oC] from the
RESULT bitfield of the DTSSTAT register.
(1)
DTSSTAT RESULT – 619
Tj = -----------------------------------------------------------------2, 28
Data Sheet
97
V1.3, 2009-10
TC1167
Electrical Parameters
5.2.6
Power Supply Current
The default test conditions (differences explicitly specified) are:
VDD = 1.58 V, VDDP = 3.47 V, Tj=150oC. All other operating conditions apply.
Table 16
Power Supply Currents, Maximum Power Consumption
Parameter
Symbol
Values
Min. Typ. Max.
Core active mode
supply current 1)2)
IDD
Unit Note /
Test Condition
CC –
–
330
mA
–
–
230
mA
Realistic core active
mode supply current 3)4)
fCPU=133 MHz
fCPU/fSYS = 2:1
VDD = 1.53 V,
TJ = 150oC
FADC 3.3 V analog
supply current
IDDMF
CC –
–
10
mA
–
FADC 1.5 V analog
supply current
IDDAF
CC –
–
10
mA
– 4)
Flash memory 3.3 V
supply current
IDDFL3R
CC –
–
60
mA
continuously
reading the Flash
memory 5)
IDDFL3E
CC –
–
61
mA
Flash memory
erase-verify6)
–
–
3
mA
– 4)
–
–
10
mA
– 4)
–
–
15
mA
in total for two pairs
–
–
16
mA
– 4) 7)
–
–
34
mA
IDDP including Data
Oscillator 1.5 V supply
Oscillator 3.3 V supply
LVDS 3.3 V supply
Pad currents,sum of
VDDP 3.3 V supplies
IDDOSC CC
IDDOSC3 CC
ILVDS
IDDP
CC
IDDP_FP CC
Flash programming
current 4) 8)
ADC 5 V power supply
Maximum Average
Power Dissipation1)
IDDM
PD
CC –
2
3
mA
ADC0 / 1
SR –
820
990
mW worst case
TA = 125oC,
PD × RΘJA < 25oC
1) Infineon Power Loop: CPU and PCP running, all peripherals active. The power consumption of each custom
application will most probably be lower than this value, but must be evaluated separately..
2) The IDD maximum value is 275 mA at fCPU = 80 MHz, constant TJ = 150oC, for the Infineon Max Power Loop.
The dependency in this range is, at constant junction temperature, linear.
fCPU/fSYS = 1:1 mode.
Data Sheet
98
V1.3, 2009-10
TC1167
Electrical Parameters
3) The IDD maximum value is 180 mA at fCPU = 80 MHz, constant TJ = 150oC, for the Realistic Pattern.
The dependency in this range is, at constant junction temperature, linear.
fCPU/fSYS = 1:1 mode.
4) Not tested in production separately, verified by design / characterization.
5) This value assumes worst case of reading flash line with all cells erased. In case of 50% cells written with “1”
and 50% cells written with “0”, the maximum current drops down to 53 mA.
6) Relevant for the power supply dimensioning, not for thermal considerations.
In case of erase of Data Flash, internal flash array loading effects may generate transient current spikes of up
to 15 mA for maximum 5 ms.
7) No GPIO activity, LVDS off
8) This value is relevant for the power supply dimensioning not for thermal considerations.
The currents caused by the GPIO activity depend on the particular application and should be added
separately.
Data Sheet
99
V1.3, 2009-10
TC1167
Electrical Parameters
5.3
AC Parameters
All AC parameters are defined with the temperature compensation disabled. That
means, keeping the pads constantly at maximum strength.
5.3.1
Testing Waveforms
VD D P
90%
90%
10%
10%
VSS
tR
tF
rise_fall_vddp.vsd
Figure 21
Rise/Fall Time Parameters
VD D P
VD D P / 2
Test Points
VD D P / 2
VSS
mct04881_vddp.vsd
Figure 22
Testing Waveform, Output Delay
VLoad+ 0.1 V
VLoad- 0.1 V
Timing
Reference
Points
VOH - 0.1 V
VOL - 0.1 V
MCT04880_new
Figure 23
Data Sheet
Testing Waveform, Output High Impedance
100
V1.3, 2009-10
TC1167
Electrical Parameters
5.3.2
Output Rise/Fall Times
Table 17
Output Rise/Fall Times (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note / Test Condition
Min. Typ. Max.
Class A1 Pads
Rise/fall times1) tRA1, tFA1 –
–
50
ns
140
18000
150
550
65000
Regular (medium) driver, 50 pF
Regular (medium) driver, 150 pF
Regular (medium) driver, 20 nF
Weak driver, 20 pF
Weak driver, 150 pF
Weak driver, 20 000 pF
tRA2, tFA2 –
–
3.7
ns
7.5
7
18
50
140
18000
150
550
65000
Strong driver, sharp edge, 50 pF
Strong driver, sharp edge, 100pF
Strong driver, med. edge, 50 pF
Strong driver, soft edge, 50 pF
Medium driver, 50 pF
Medium driver, 150 pF
Medium driver, 20 000 pF
Weak driver, 20 pF
Weak driver, 150 pF
Weak driver, 20 000 pF
tRF1, tFF1 –
tRF2, tFF2 –
–
2
ns
LVDS Mode
–
60
ns
CMOS Mode, 50 pF
Class A2 Pads
Rise/fall times
1)
Class F Pads
Rise/fall times
Rise/fall times
1) Not all parameters are subject to production test, but verified by design/characterization and test correlation.
Data Sheet
101
V1.3, 2009-10
TC1167
Electrical Parameters
5.3.3
Power Sequencing
V
+-5%
5V
VAREF
+-5%
3.3V
+-5%
1.5V
-12%
0.5V
-12%
0.5V
0.5V
t
VDDP
PORST
power
down
power
fail
t
Power-Up 8.vsd
Figure 24
5 V / 3.3 V / 1.5 V Power-Up/Down Sequence
The following list of rules applies to the power-up/down sequence:
1. All ground pins VSS must be externally connected to one single star point in the
system. Regarding the DC current component, all ground pins are internally directly
connected.
2. At any moment,
each power supply must be higher than any lower_power_supply - 0.5 V, or:
VDD5 > VDD3.3 - 0.5 V; VDD5 > VDD1.5 - 0.5 V;VDD3.3 > VDD1.5 - 0.5 V, see Figure 24.
3. During power-up and power-down, the voltage difference between the power supply
pins of the same voltage (3.3 V, 1.5 V, and 5 V) with different names (for example
VDDP, VDDFL3 ...), that are internaly connected via diodes must be lower than 100 mV.
On the other hand, all power supply pins with the same name (for example all VDDP
), are internaly directly connected. It is recommended that the power pins of the same
voltage are driven by a single power supply.
Data Sheet
102
V1.3, 2009-10
TC1167
Electrical Parameters
4. The PORST signal may be deactivated after all VDD5, VDD3.3, VDD1.5, and VAREF powersupplies and the oscillator have reached stable operation, within the normal
operating conditions.
5. At normal power down the PORST signal should be activated within the normal
operating range, and then the power supplies may be switched off. Care must be
taken that all Flash write or delete sequences have been completed.
6. At power fail the PORST signal must be activated at latest when any 3.3 V or 1.5 V
power supply voltage falls 12% below the nominal level. The same limit of 3.3 V-12%
applies to the 5 V power supply too. If, under these conditions, the PORST is
activated during a Flash write, only the memory row that was the target of the write
at the moment of the power loss will contain unreliable content. In order to ensure
clean power-down behavior, the PORST signal should be activated as close as
possible to the normal operating voltage range.
7. In case of a power-loss at any power-supply, all power supplies must be powereddown, conforming at the same time to the rules number 2 and 4.
8. Although not necessary, it is additionally recommended that all power supplies are
powered-up/down together in a controlled way, as tight to each other as possible.
9. Aditionally, regarding the ADC reference voltage VAREF:
– VAREF must power-up at the same time or later than VDDM, and
– VAREF must power-down eather earlier or at latest to satisfy the condition
VAREF < VDDM + 0.5 V. This is required in order to prevent discharge of VAREF filter
capacitance through the ESD diodes through the VDDM power supply. In case of
discharging the reference capacitance through the ESD diodes, the current must
be lower than 5 mA.
Data Sheet
103
V1.3, 2009-10
TC1167
Electrical Parameters
5.3.4
Table 18
Power, Pad and Reset Timing
Power, Pad and Reset Timing Parameters
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note /
Test Conditi
on
Min. VDDP voltage to
ensure defined pad
states1)
VDDPPA CC 0.6
–
–
V
–
Oscillator start-up time2)
tOSCS
tPOA
CC –
–
10
ms
–
SR 10
–
–
ms
–
ESR0 pulse width
tHD
CC program –
mable3)5)
–
fSYS
–
PORST rise time
tPOR
tPOS
SR –
–
50
ms
–
SR 0
–
–
ns
–
tPOH
SR 100
–
–
ns
TESTMODE
TRST
SR 0
–
–
ns
–
Minimum PORST active
time after power supplies
are stable at operating
levels
Setup time to PORST
rising edge4)
Hold time from PORST
rising edge
Setup time to ESR0 rising tHDS
edge
Hold time from ESR0
rising edge
tHDH
SR 16 ×
1/fSYS5)
–
–
ns
HWCFG
Ports inactive after
PORST reset active6)7)
tPIP
CC –
–
150
ns
–
Ports inactive after ESR0
reset active (and for all
logic)
tPI
CC –
–
8×
ns
1/fSYS
–
Power on Reset Boot
Time8)
tBP
CC –
–
2.5
ms
–
Application Reset Boot
Time9)10)
tB
CC 150
–
700
μs
150
–
960
μs
fCPU=133MHz
fCPU=80MHz
1) This parameter is valid under assumption that PORST signal is constantly at low level during the powerup/power-down of the VDDP.
Data Sheet
104
V1.3, 2009-10
TC1167
Electrical Parameters
2) tOSCS is defined from the moment when VDDOSC3 = 3.13 V until the oscillations reach an amplitude at XTAL1 of
0,3 × VDDOSC3. This parameter is verified by device characterization. The external oscillator circuitry must be
optimized by the customer and checked for negative resistance as recommended and specified by crystal
suppliers.
3) Any ESR0 activation is internally prolonged to SCU_RSTCNTCON.RELSA FPI bus clock (fFPI) cycles.
4) Applicable for input pins TESTMODE and TRST.
5) fFPI = fCPU / 2
6) Not subject to production test, verified by design / characterization.
7) This parameter includes the delay of the analog spike filter in the PORST pad.
8) The duration of the boot-time is defined between the rising edge of the PORST and the moment when the first
user instruction has entered the CPU and its processing starts.
9) The duration of the boot time is defined between the rising edge of the internal application reset and the clock
cycle when the first user instruction has entered the CPU pipeline and its processing starts.
10) The given time includes the time of the internal reset extension for a configured value of
SCU_RSTCNTCON.RELSA = 0x05BE.
VD D P -12%
V D D PPA
V D D PPA
VDDP
VDD
VD D -12%
tPOA
tPOA
PORST
tPOH
TRST
TESTMODE
tPOH
t hd
t hd
ESR0
tHDH
tHDH
tHDH
HWCFG
t PIP
tPI
t PIP
tPI
Pads
tPI
tPI
t PIP
tPI
Pad-state undefined
Tri-state or pull device active
reset_beh2
As programmed
Figure 25
Data Sheet
Power, Pad and Reset Timing
105
V1.3, 2009-10
TC1167
Electrical Parameters
5.3.5
Phase Locked Loop (PLL)
Note: All PLL characteristics defined on this and the next page are not subject to
production test, but verified by design characterization.
Table 19
PLL Parameters (Operating Conditions apply)
Parameter
Symbol
|Dm|
VCO frequency range
fVCO
VCO input frequency range fREF
fPLLBASE
PLL base frequency1)
PLL lock-in time
tL
Accumulated jitter
Values
Min.
Typ.
Max.
Unit Note /
Test Con
dition
–
–
7
ns
400
–
800
MHz –
8
–
16
MHz –
50
200
320
MHz –
–
–
200
μs
–
–
1) The CPU base frequency with which the application software starts after PORST is calculated by dividing the
limit values by 16 (this is the K2 factor after reset).
Phase Locked Loop Operation
When PLL operation is enabled and configured, the PLL clock fVCO (and with it the LMBBus clock fLMB) is constantly adjusted to the selected frequency. The PLL is constantly
adjusting its output frequency to correspond to the input frequency (from crystal or clock
source), resulting in an accumulated jitter that is limited. This means that the relative
deviation for periods of more than one clock cycle is lower than for a single clock cycle.
This is especially important for bus cycles using waitstates and for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
Two formulas are defined for the (absolute) approximate maximum value of jitter Dm in
[ns] dependent on the K2 - factor, the LMB clock frequency fLMB in [MHz], and the
number m of consecutive fLMB clock periods.
for
( K2 ≤ 100 )
( m ≤ ( f LMB [ MHz ] ) ⁄ 2 )
and
( 1 – 0, 01 × K2 ) × ( m – 1 )
D m [ ns ] = ⎛⎝ --------------------------------------------- + 5⎞⎠ × ⎛⎝ ---------------------------------------------------------------- + 0, 01 × K2⎞⎠
K2 × f LMB [ MHz ]
0, 5 × f LMB [ MHz ] – 1
740
else
Data Sheet
740
D m [ ns ] = --------------------------------------------- + 5
K2 × f LMB [ MHz ]
106
(2)
(3)
V1.3, 2009-10
TC1167
Electrical Parameters
With rising number m of clock cycles the maximum jitter increases linearly up to a value
of m that is defined by the K2-factor of the PLL. Beyond this value of m the maximum
accumulated jitter remains at a constant value. Further, a lower LMB-Bus clock
frequency fLMB results in a higher absolute maximum jitter value.
Figure 26 gives the jitter curves for several K2 / fLMB combinations.
±10.0
Dm
ns
fLMB = 40 M H z (K 2 = 10 )
f LMB = 40 M H z (K2 = 20)
±8.0
±7.0
±6.0
±4.0
f LMB = 80 M H z (K2 = 6)
f LMB = 80 M H z (K2 = 10 )
±2.0
±1.0
f LMB = 133 M H z (K2 = 6 )
±0.0
0
20
40
60
80
100
120
oo
m
D m = M ax . jitter
= N um ber of c ons ec utiv e f LMB periods
K2 = K2- div ider of PLL
m
Figure 26
T C 1167 _PLL _J IT T_C
Approximated Maximum Accumulated PLL Jitter for Typical LMBBus Clock Frequencies fLMB
Note: The specified PLL jitter values are valid if the capacitive load per output pin does
not exceed CL = 20 pF with the maximum driver and sharp edge. In case of
applications with many pins with high loads, driver strengths and toggle rates the
specified jitter values could be exceeded.
Note: The maximum peak-to-peak noise on the pad supply voltage, measured between
VDDOSC3 at pin 106 and VSSOSC at pin 104, is limited to a peak-to-peak voltage of
VPP = 100 mV for noise frequencies below 300 KHz and VPP = 40 mV for noise
frequencies above 300 KHz.
The maximum peak-to peak noise on the pad supply votage, measured between
VDDOSC at pin 105 and VSSOSC at pin 104, is limited to a peak-to-peak voltage of
VPP = 100 mV for noise frequencies below 300 KHz and VPP = 40 mV for noise
frequencies above 300 KHz.
Data Sheet
107
V1.3, 2009-10
TC1167
Electrical Parameters
These conditions can be achieved by appropriate blocking of the supply voltage
as near as possible to the supply pins and using PCB supply and ground planes.
Data Sheet
108
V1.3, 2009-10
TC1167
Electrical Parameters
5.3.6
JTAG Interface Timing
The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 20
JTAG Interface Timing Parameters
(Operating Conditions apply)
Parameter
Min.
Typ.
Max.
Unit Note /
Test Condition
t1 SR
t2 SR
t3 SR
t4 SR
t5 SR
t6 SR
25
–
–
ns
–
12
–
–
ns
–
10
–
–
ns
–
–
–
4
ns
–
–
–
4
ns
–
6
–
–
ns
–
t7 SR
6
–
–
ns
–
TDO valid after TCK falling t8 CC
edge1) (propagation delay) t CC
8
–
–
13
ns
CL = 50 pF
–
–
3
ns
CL = 20 pF
TDO hold after TCK falling t18 CC
edge1)
2
–
–
ns
TCK clock period
TCK high time
TCK low time
TCK clock rise time
TCK clock fall time
TDI/TMS setup
to TCK rising edge
TDI/TMS hold
after TCK rising edge
Symbol
Values
TDO high imped. to valid
from TCK falling edge1)2)
t9 CC
–
–
14
ns
CL = 50 pF
TDO valid to high imped.
from TCK falling edge1)
t10 CC
–
–
13.5
ns
CL = 50 pF
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.
Data Sheet
109
V1.3, 2009-10
TC1167
Electrical Parameters
t1
0.9 VD D P
0.5 VD D P
t5
t2
0.1 VD D P
t4
t3
MC_ JTAG_ TCK
Figure 27
Test Clock Timing (TCK)
TCK
t6
t7
t6
t7
TMS
TDI
t9
t8
t10
TDO
t 18
MC_JTAG
Figure 28
Data Sheet
JTAG Timing
110
V1.3, 2009-10
TC1167
Electrical Parameters
5.3.7
DAP Interface Timing
The following parameters are applicable for communication through the DAP debug
interface.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 21
DAP Interface Timing Parameters
(Operating Conditions apply)
Parameter
Symbol
t11 SR
t12 SR
t13 SR
t14 SR
t15 SR
t16 SR
DAP0 clock period
DAP0 high time
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup
to DAP0 rising edge
Values
Min.
Typ.
Max.
Unit Note /
Test Condition
12.5
–
–
ns
–
4
–
–
ns
–
4
–
–
ns
–
–
–
2
ns
–
–
–
2
ns
–
6
–
–
ns
–
DAP1 hold
after DAP0 rising edge
t17 SR
6
–
–
ns
–
DAP1 valid
per DAP0 clock period1)
t19 SR
8
–
–
ns
80 MHz,
CL = 20 pF
t19 SR
10
–
–
ns
40 MHz,
CL = 50 pF
1) The Host has to find a suitable sampling point by analyzing the sync telegram response.
t11
0.9 VD D P
0.5 VD D P
t1 5
t1 2
t14
0.1 VD D P
t1 3
MC_DAP0
Figure 29
Data Sheet
Test Clock Timing (DAP0)
111
V1.3, 2009-10
TC1167
Electrical Parameters
DAP0
t1 6
t1 7
DAP1
MC_ DAP1_RX
Figure 30
DAP Timing Host to Device
t1 1
DAP1
t1 9
MC_ DAP1_TX
Figure 31
Data Sheet
DAP Timing Device to Host
112
V1.3, 2009-10
TC1167
Electrical Parameters
5.3.8
Peripheral Timings
Note: Peripheral timing parameters are not subject to production test. They are verified
by design / characterization.
5.3.8.1
Micro Link Interface (MLI) Timing
MLI Transmitter Timing
t13
t14
t10
t12
TCLKx
t11
t15
t15
TDATAx
TVALIDx
t16
t17
TREADYx
MLI Receiver Timing
t23
t24
t20
t22
RCLKx
t21
t25
t26
RDATAx
RVALIDx
t27
t27
RREADYx
MLI_Tmg_2.vsd
Figure 32
MLI Interface Timing
Note: The generation of RREADYx is in the input clock domain of the receiver. The
reception of TREADYx is asynchronous to TCLKx.
Data Sheet
113
V1.3, 2009-10
TC1167
Electrical Parameters
Table 22
MLI Transmitter/Receiver Timing
(Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note /
Test Co
ndition
–
–
ns
MLI Transmitter Timing
TCLK clock period
TCLK high time
TCLK low time
TCLK rise time
TCLK fall time
TDATA/TVALID output
delay time
t10
t11
t12
t13
t14
t15
CC 2 × TMLI
1)
0.45 × t10 0.5 × t10 0.55 × t10 ns
2)3)
CC 0.45 × t10 0.5 × t10 0.55 × t10 ns
2)3)
CC
–
4)
ns
–
CC –
–
4)
ns
–
CC -3
–
4.4
ns
–
CC –
TREADY setup time to
TCLK rising edge
t16
SR 18
–
–
ns
–
TREADY hold time from
TCLK rising edge
t17
SR 0
–
–
ns
–
t20
t21
t22
t23
t24
t25
SR 1 × TMLI
–
–
ns
1)
SR –
0.5 × t20 –
ns
5)6)
SR –
0.5 × t20 –
ns
5)6)
SR –
–
4
ns
7)
SR –
–
4
ns
7)
SR 4.2
–
–
ns
–
RDATA/RVALID hold time t26
from RCLK rising edge
SR 2.2
–
–
ns
–
RREADY output delay time t27
CC 0
–
16
ns
–
MLI Receiver Timing
RCLK clock period
RCLK high time
RCLK low time
RCLK rise time
RCLK fall time
RDATA/RVALID setup
time to RCLK falling edge
1) TMLImin. = TSYS = 1/fSYS. When fSYS = 80 MHz, t10 = 25 ns and t20 = 12.5 ns.
2) The following formula is valid: t11 + t12 = t10
3) The min./max. TCLK low/high times t11/t12 include the PLL jitter of fSYS. Fractional divider settings must be
regarded additionally to t11/t12.
4) For high-speed MLI interface, strong driver sharp edge selection (class A2 pad) is recommended for TCLK.
5) The following formula is valid: t21 + t22 = t20
6) The min. and max. value of is parameter can be adjusted by considering the other receiver timing parameters.
Data Sheet
114
V1.3, 2009-10
TC1167
Electrical Parameters
7) The RCLK max. input rise/fall times are best case parameters for fSYS = 80 MHz. For reduction of EMI, slower
input signal rise/fall times can be used for longer RCLK clock periods.
5.3.8.2
Micro Second Channel (MSC) Interface Timing
Table 23
MSC Interface Timing (Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Min.
FCLP clock period1)2)
SOP/ENx outputs delay
from FCLP rising edge
SDI bit time
SDI rise time
SDI fall time
Typ.
Unit
Note /
Test Con
dition
Max.
t40
t45
CC 2 × TMSC3) –
–
ns
–
CC -10
10
ns
–
t46
t48
t49
CC 8 × TMSC
–
ns
–
SR
100
ns
–
SR
100
ns
–
1) FCLP signal rise/fall times are the same as the A2 Pads rise/fall times.
2) FCLP signal high and low can be minimum 1 × TMSC.
3) TMSCmin = TSYS = 1/fSYS. When fSYS = 80 MHz, t40 = 25 ns
t40
0.9 VDDP
0.1 VDDP
FCLP
t45
t45
SOP
EN
t48
t49
0.9 VDDP
0.1 VDDP
SDI
t46
t46
MSC_Tmg_1.vsd
Figure 33
MSC Interface Timing
Note: Sample the data at SOP with the falling edge of FCLP in the target device.
Data Sheet
115
V1.3, 2009-10
TC1167
Electrical Parameters
5.3.8.3
Table 24
SSC Master / Slave Mode Timing
SSC Master/Slave Mode Timing
(Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Min.
Typ. Max.
Unit Note /
Test Con
dition
Master Mode Timing
t50
t51
CC 2 × TSSC
–
–
ns
1)2)3)
CC 0
–
8
ns
–
MRST setup to SCLK
falling edge
t52
SR 13
–
–
ns
3)
MRST hold from SCLK
falling edge
t53
SR 0
–
–
ns
3)
t54
SR 4 × TSSC
t55/t54 SR 45
t56
SR TSSC + 5
–
–
ns
1)3)
–
55
%
–
–
–
ns
3)4)
MTSR hold from SCLK
latching edge
t57
SR TSSC + 5
–
–
ns
3)4)
SLSI setup to first SCLK
latching edge
t58
SR TSSC + 5
–
–
ns
3)
SLSI hold from last SCLK
latching edge
t59
SR 7
–
–
ns
–
MRST delay from SCLK
shift edge
t60
CC 0
–
15
ns
–
SLSI to valid data on MRST t61
CC –
–
10
ns
–
SCLK clock period
MTSR/SLSOx delay from
SCLK rising edge
Slave Mode Timing
SCLK clock period
SCLK duty cycle
MTSR setup to SCLK
latching edge
1) SCLK signal rise/fall times are the same as the A2 Pads rise/fall times.
2) SCLK signal high and low times can be minimum 1 × TSSC.
3) TSSCmin = TSYS = 1/fSYS. When fSYS = 80 MHz, t50 = 25 ns.
4) Fractional divider switched off, SSC internal baud rate generation used.
Data Sheet
116
V1.3, 2009-10
TC1167
Electrical Parameters
t50
SCLK1)2)
t51
t51
MTSR1)
t52
t53
Data
valid
MRST1)
t51
SLSOx2)
1) This timing is based on the following setup: CON.PH = CON.PO = 0.
2) The transition at SLSOx is based on the following setup: SSOTC.TRAIL = 0
and the first SCLK high pulse is in the first one of a transmission.
SSC_TmgMM
Figure 34
SSC Master Mode Timing
t54
First latching
SCLK edge
First shift
SCLK edge
SCLK1)
t55
t56
Last latching
SCLK edge
t55
t56
t57
Data
valid
MTSR1)
t57
Data
valid
t60
t60
MRST1)
t61
SLSI
t59
t58
1) This timing is based on the following setup: CON.PH = CON.PO = 0.
SSC_TmgSM
Figure 35
Data Sheet
SSC Slave Mode Timing
117
V1.3, 2009-10
TC1167
Electrical Parameters
5.4
Package and Reliability
5.4.1
Package Parameters
Table 25
Thermal Parameters (Operating Conditions apply)
Device
Package
RΘJCT1)
RΘJCB1)
RΘJLeads1) Unit
TC1167
PG-LQFP-176-5
6.5
5.5
23
Note
K/W
1) The top and bottom thermal resistances between the case and the ambient (RTCAT, RTCAB) are to be combined
with the thermal resistances between the junction and the case given above (RTJCT, RTJCB), in order to calculate
the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between the
case and the ambient (RTCAT, RTCAB) depend on the external system (PCB, case) characteristics, and are
under user responsibility.
The junction temperature can be calculated using the following equation: TJ = TA + RTJA × PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
RTJA can be obtained from the upper four partial thermal resistances.
Thermal resistances as measured by the ‘cold plate method’ (MIL SPEC-883 Method 1012.1).
Data Sheet
118
V1.3, 2009-10
TC1167
Electrical Parameters
5.4.2
Figure 36
Package Outline
PG-LQFP-176-5, Plastic Green Low Profile Quad Flat Package
You can find all of our packages, sorts of packing and others in our Infineon Internet
Page “Products”: http://www.infineon.com/products.
Data Sheet
119
V1.3, 2009-10
TC1167
Electrical Parameters
5.4.3
Flash Memory Parameters
The data retention time of the TC1167’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Table 26
Flash Parameters
Parameter
Symbol
Values
Min.
Unit
Note /
Test Condition
Typ. Max.
Program Flash
Retention Time,
Physical Sector1)2)
tRET CC 20
–
–
years
Max. 1000
erase/program
cycles
Program Flash
Retention Time
Logical Sector1)2)
tRETL CC 20
–
–
years
Max. 100
erase/program
cycles
Data Flash
Endurance
per 32 KB Sector
NE
–
–
cycles Max. data
retention time
5 years
Data Flash Endurance, NE8 CC 120000 –
EEPROM Emulation
(4 × 16 KB)
–
cycles Max. data
retention time
5 years
CC 30 000
tPR CC –
–
5
ms
–
Program Flash Erase
tERP CC –
Time per 256-KB Sector
–
5
s
fCPU = 133 MHz
Data Flash Erase Time tERD CC –
for 2 x 32-KB Sector
–
2.5
s
fCPU = 133 MHz
tWU CC –
–
4000/fCPU μs
+180
Programming Time
per Page3)
Wake-up time
–
1) Storage and inactive time included.
2) At average weighted junction temperature Tj = 100oC, or
the retention time at average weighted temperature of Tj = 110oC is minimum 10 years, or
the retention time at average weighted temperature of Tj = 150oC is minimum 0.7 years.
3) In case the Program Verify feature detects weak bits, these bits will be programmed once more. The
reprogramming takes additional 5 ms.
Data Sheet
120
V1.3, 2009-10
TC1167
Electrical Parameters
5.4.4
Table 27
Quality Declarations
Quality Parameters
Parameter
Symbol
Values
Unit
Note / Test Condition
Min. Typ. Max.
–
–
24000 hours –2) 3)
ESD susceptibility VHBM
according to
Human Body
Model (HBM)
–
–
2000
V
Conforming to
JESD22-A114-B
ESD susceptibility VHBM1
of the LVDS pins
–
–
500
V
–
ESD susceptibility VCDM
according to
Charged Device
Model (CDM)
–
–
500
V
Conforming to
JESD22-C101-C
Moisture
Sensitivity Level
–
–
3
–
Conforming to Jedec
J-STD-020C for 240°C
Operation
Lifetime1)
tOP
MSL
1) This lifetime refers only to the time when the device is powered on.
2) For worst-case temperature profile equivalent to:
2000 hours at Tj = 150oC
16000 hours at Tj = 125oC
6000 hours at Tj = 110oC
3) This 30000 hours worst-case temperature profile is also covered:
300 hours at Tj = 150oC
1000 hours at Tj = 140oC
1700 hours at Tj = 130oC
24000 hours at Tj = 120oC
3000 hours at Tj = 110oC
Data Sheet
121
V1.3, 2009-10
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG