FEX 025 VFBGA3x3x08 SAC

Compliant with IEC 62474/ D9.00
Compliant to IEC 61249-2-21:2003
Termination Base Alloy:
Copper Alloy (Cu)
Semiconductor Device Type:
GJ
JEDEC 97
Product Marking
and/or Pkg.
Labeling
e1
Package Homogeneous Materials:
8.1 Electronics (e.g. pc boards, displays)
(FEX) 025 VFBGA 3x3x0.8mm SAC
Basic Substance
CAS Number
"Contained In"
Sub-Component
% Total
Weight
mg/part
ppm
fused silica
solid epoxy resin
phenol resin
Cristalline Silica
carbon black
Copper
60676-86-0
25068-38-6
108-95-2
112945-52-5
1333-86-4
7440-50-8
Mold Compound
Mold Compound
Mold Compound
Mold Compound
Mold Compound
Lead Frame
35.442
5.030
5.030
1.144
0.230
10.321
5.671
0.805
0.805
0.183
0.037
1.651
354,422
50,297
50,297
11,438
2,297
103,213
Glass fibers
65997-17-3
Lead Frame
6.153
0.984
61,525
Phenol polymer
9003-36-5
Lead Frame
6.153
0.984
61,525
Silica, chemically prepared
Nickel
Barite
Magnesium silicate
Araldite GY 250
(2-Methoxymethylethoxy)propanol
Misc.
Aluminium-hydroxide-oxide
Gold
Silver (Ag)
Diester Resin
Acrlate Resin
7631-86-9
7440-02-0
7727-43-7
14807-96-6
25068-38-6
34590-94-8
system
24623-77-6
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Die Attach
Die Attach
Die Attach
2.300
1.121
0.719
0.575
0.575
0.230
0.431
0.144
0.029
0.905
0.226
0.085
0.368
0.179
0.115
0.092
0.092
0.037
0.069
0.023
0.005
0.145
0.036
0.014
23,000
11,213
7,188
5,750
5,750
2,300
4,313
1,438
288
9,050
2,263
849
Polymeric Resin
Trade Secret
Die Attach
0.034
0.005
339
Silicon
Doped Gold
Tin
Silver
Copper
7440-21-3
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Chip (Die)
Wire Bond
SAC 305 Solder ball
SAC 305 Solder ball
SAC 305 Solder ball
5.000
0.625
16.888
0.525
0.088
100.000
0.800
0.100
2.702
0.084
0.014
16.000
50,000
6,250
168,875
5,250
875
1,000,000
TOTALS:
7.50
(mg) Total
fused silica
solid epoxy resin
phenol resin
Cristalline Silica
carbon black
Mold Compound
% ot Total Weight
60676-86-0
25068-38-6
108-95-2
112945-52-5
1333-86-4
75.61
10.73
10.73
2.44
0.49
Total
4.60
(mg) Total
Copper
Glass fibers
Phenol polymer
Silica, chemically prepared
Nickel
Barite
Magnesium silicate
Araldite GY 250
(2-Methoxymethylethoxy)propanol
Misc.
Aluminium-hydroxide-oxide
Gold
(mg) Total
Silver (Ag)
Diester Resin
Acrlate Resin
Polymeric Resin
% of Total Weight
7440-50-8
65997-17-3
9003-36-5
7631-86-9
7440-02-0
7727-43-7
14807-96-6
25068-38-6
34590-94-8
system
24623-77-6
7440-57-5
35.90
21.40
21.40
8.00
3.90
2.50
2.00
2.00
0.80
1.50
0.50
0.10
(mg) Total
Doped Silicon
% of Total Weight
7440-22-4
Trade Secret
Trade Secret
Trade Secret
72.40
18.10
6.79
2.71
% of Total Weight
7440-21-3
100.00
Total
0.10
(mg) Total
If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology
Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if
any, is not below the threshold of regulatory concern for any regulatory scheme world-wide.
Doped Gold
The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and
certain “reels” may be made from PVC plastic.
% of Total Weight
7440-57-5
100.00
Total
2.80
SAC 305 Solder ball
% of Total Weight
Tin
7440-31-5
96.50
Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product
warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s
quotations, sales order acknowledgement, and invoices.
Silver
7440-22-4
3.00
Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or
otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or
of this Certificate of Compliance for semiconductor products.
Copper
7440-50-8
0.50
Total
Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at
http://echa.europa.eu/web/guest/candidate-list-table
16.00
Au
0.625
100.00
(mg) Total
Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in
their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the
completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier
information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is
provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels
of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts.
5
100.00
Wire Bond
Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at
http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/
1.25
100.00
Chip (Die)
This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March
2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero)
28.75
100.00
Die Attach
Total
0.80
0.0160 g Total Mass
Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
100.00
Lead Frame
Total
0.20
46.875
17.5
100.00
100.00
1:40 PM : 8/17/2015