Compliant with IEC 62474/ D9.00 Compliant to IEC 61249-2-21:2003 Termination Base Alloy: Copper Alloy (Cu) Semiconductor Device Type: GJ JEDEC 97 Product Marking and/or Pkg. Labeling e1 Package Homogeneous Materials: 8.1 Electronics (e.g. pc boards, displays) (FEX) 025 VFBGA 3x3x0.8mm SAC Basic Substance CAS Number "Contained In" Sub-Component % Total Weight mg/part ppm fused silica solid epoxy resin phenol resin Cristalline Silica carbon black Copper 60676-86-0 25068-38-6 108-95-2 112945-52-5 1333-86-4 7440-50-8 Mold Compound Mold Compound Mold Compound Mold Compound Mold Compound Lead Frame 35.442 5.030 5.030 1.144 0.230 10.321 5.671 0.805 0.805 0.183 0.037 1.651 354,422 50,297 50,297 11,438 2,297 103,213 Glass fibers 65997-17-3 Lead Frame 6.153 0.984 61,525 Phenol polymer 9003-36-5 Lead Frame 6.153 0.984 61,525 Silica, chemically prepared Nickel Barite Magnesium silicate Araldite GY 250 (2-Methoxymethylethoxy)propanol Misc. Aluminium-hydroxide-oxide Gold Silver (Ag) Diester Resin Acrlate Resin 7631-86-9 7440-02-0 7727-43-7 14807-96-6 25068-38-6 34590-94-8 system 24623-77-6 7440-57-5 7440-22-4 Trade Secret Trade Secret Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Die Attach Die Attach Die Attach 2.300 1.121 0.719 0.575 0.575 0.230 0.431 0.144 0.029 0.905 0.226 0.085 0.368 0.179 0.115 0.092 0.092 0.037 0.069 0.023 0.005 0.145 0.036 0.014 23,000 11,213 7,188 5,750 5,750 2,300 4,313 1,438 288 9,050 2,263 849 Polymeric Resin Trade Secret Die Attach 0.034 0.005 339 Silicon Doped Gold Tin Silver Copper 7440-21-3 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Chip (Die) Wire Bond SAC 305 Solder ball SAC 305 Solder ball SAC 305 Solder ball 5.000 0.625 16.888 0.525 0.088 100.000 0.800 0.100 2.702 0.084 0.014 16.000 50,000 6,250 168,875 5,250 875 1,000,000 TOTALS: 7.50 (mg) Total fused silica solid epoxy resin phenol resin Cristalline Silica carbon black Mold Compound % ot Total Weight 60676-86-0 25068-38-6 108-95-2 112945-52-5 1333-86-4 75.61 10.73 10.73 2.44 0.49 Total 4.60 (mg) Total Copper Glass fibers Phenol polymer Silica, chemically prepared Nickel Barite Magnesium silicate Araldite GY 250 (2-Methoxymethylethoxy)propanol Misc. Aluminium-hydroxide-oxide Gold (mg) Total Silver (Ag) Diester Resin Acrlate Resin Polymeric Resin % of Total Weight 7440-50-8 65997-17-3 9003-36-5 7631-86-9 7440-02-0 7727-43-7 14807-96-6 25068-38-6 34590-94-8 system 24623-77-6 7440-57-5 35.90 21.40 21.40 8.00 3.90 2.50 2.00 2.00 0.80 1.50 0.50 0.10 (mg) Total Doped Silicon % of Total Weight 7440-22-4 Trade Secret Trade Secret Trade Secret 72.40 18.10 6.79 2.71 % of Total Weight 7440-21-3 100.00 Total 0.10 (mg) Total If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if any, is not below the threshold of regulatory concern for any regulatory scheme world-wide. Doped Gold The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and certain “reels” may be made from PVC plastic. % of Total Weight 7440-57-5 100.00 Total 2.80 SAC 305 Solder ball % of Total Weight Tin 7440-31-5 96.50 Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s quotations, sales order acknowledgement, and invoices. Silver 7440-22-4 3.00 Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or of this Certificate of Compliance for semiconductor products. Copper 7440-50-8 0.50 Total Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at http://echa.europa.eu/web/guest/candidate-list-table 16.00 Au 0.625 100.00 (mg) Total Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts. 5 100.00 Wire Bond Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/ 1.25 100.00 Chip (Die) This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March 2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero) 28.75 100.00 Die Attach Total 0.80 0.0160 g Total Mass Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data. 100.00 Lead Frame Total 0.20 46.875 17.5 100.00 100.00 1:40 PM : 8/17/2015