FPBGA Pbfree Auwire672

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
1.48%
0.0489
Mold
36.73%
1.212
D/A Epoxy
0.21%
0.60%
0.0197
Solder Balls
19.89%
0.656
Foil
18.87%
22.23%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
MSL: 3
Peak Reflow Temp: 250°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 8.11 x 8.34 mm
29.38%
2.94%
2.94%
1.29%
0.18%
0.970
0.0970
0.0970
0.0424
0.0061
Silica (Fused or Amorphous)
Epoxy resin
Phenol resin
Cristalline Silica
Carbon Black
60676-86-0
14808-60-7
1333-86-4
0.17%
0.04%
0.0055
0.0014
Silver
Organic esters and resins
7440-22-4
-
Mold Compound composition:
75 to 95% Silica Fused or Amorphous (LSC uses 80% in our calculation)
1 to 20% Epoxy resin (LSC uses 8% in our calculation)
2 to 20% Phenol resin (LSC uses 8% in our calculation)
<5% Cristalline Silica (LSC uses 3.5% in our calculation)
<1% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball
Qualified Solder ball compositions:
Sn95.5/Ag4/Cu0.5
Sn96.5/Ag3/Cu0.5
LSC uses: Sn96/Ag3.5/Cu0.5 for calculations
0.0069
Wire
Substrate
672 fpBGA
3.30
Grams
19.09%
0.70%
0.10%
0.630
0.0230
0.0033
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
12.83%
6.04%
0.424
0.1993
Glass fiber
BT Resins
65997-17-3
-
Copper (Cu)
7440-50-8
0.623
0.734
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B4