BAT60B... Silicon Schottky Diode • High current rectifier Schottky diode with very low VF drop (typ. 0.24 V at IF = 10mA) • For power supply applications • For clamping and protection in low voltage applications • For detection and step-up-conversion • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAT60B ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type BAT60B Package SOD323 Configuration single Marking white/5 Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage2) VR 10 V Forward current IF 3 A Non-repetitive peak surge forward current I FSM 5 Ptot 1350 (t ≤ 10ms) Total power dissipation mW TS ≤ 28°C 150 Junction temperature Tj Operating temperature range T op -55 ... 125 Storage temperature T stg -55 ... 150 °C 1Pb-containing 2For package may be available upon special request TA > 25 °C the derating of VR has to be considered. Please refer to curve Permissible reverse voltage. 1 2007-04-19 BAT60B... Thermal Resistance Parameter Symbol Value Unit Junction - soldering point 1) RthJS ≤ 90 K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Reverse current2) IR VR = 5 V - 5 15 VR = 8 V - 10 25 VR = 5 V, TA = 80 °C - 100 800 VR = 8 V, TA = 80 °C - 410 1500 Forward voltage2) Unit µA V VF IF = 10 mA 0.2 0.24 0.3 IF = 100 mA 0.26 0.32 0.38 IF = 500 mA 0.32 0.4 0.5 IF = 1000 mA 0.36 0.48 0.6 12 25 30 AC Characteristics Diode capacitance CT pF VR = 5 V, f = 1 MHz 1For calculation of RthJA please refer to Application Note Thermal Resistance 2Pulsed test: tp = 300 µs; D = 0.01 2 2007-04-19 BAT60B... Reverse current IR = ƒ(VR) Forward current IF = ƒ (VF) TA = Parameter TA = Parameter 10 0 10A-2 A 125°C 10 -3 85°C 25°C 10 -5 IF IR 10 10 -1 -4 10 -2 -40°C 25°C 85°C 125°C 10 -6 10 -3 10 -7 -40°C 10 -8 10 -4 10 -9 10 -10 0 2 4 6 8 V 10 -5 0 12 0.1 0.2 0.3 0.4 0.5 VR 0.6 V 0.8 VF Permissible Reverse voltage VR = ƒ (TA) Forward current IF = ƒ (T S) tp = Parameter; duty cycle < 0.01 Device mounted on PCB with Rth = 160 K/W 3500 12 V mA 10 9 IF VR 2500 8 7 2000 300µs 100ms DC 6 1500 5 4 1000 3 2 500 1 0 0 20 40 60 80 100 120 °C 0 0 150 TA 15 30 45 60 75 90 105 120 °C 150 TS 3 2007-04-19 BAT60B... Permissible Puls Load R thJS = ƒ (tp) Permissible Pulse Load IFmax / I FDC = ƒ (t p) 10 2 10 2 I Fmax/I FDC R thJS K/W 10 1 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp 4 2007-04-19 Package SOD323 BAT60B... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 ±0.05 A 1.7 +0.2 -0.1 Cathode marking 0.45 ±0.15 2.5 ±0.2 2 1 0.3 +0.1 -0.05 +0.05 0.3 -0.2 0.15 +0.1 -0.06 0.25 M A 0.8 1.7 0.8 Foot Print 0.6 Marking Layout (Example) BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2 2.9 8 4 Cathode marking 0.65 1.35 5 1 2007-04-19 BAT60B... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-19