BAS3005S-02LRH Low VF Schottky Diode • Reverse voltage: 30 V • Forward current: 0.5 A • Low forward voltage and smallest package form factor (1.0 x 0.6 x < 0.4 mm) for mobile phone battery charger application • Pb-free (RoHS compliant) package • Qualified according AEC Q101 BAS3005S-02LRH 1 2 Type BAS3005S-02LRH Package TSLP-2-17 Configuration single Marking 5A Maximum Ratings at TA = 25 °C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage1) VR 30 V Forward current1), TS ≤ 132 °C IF 0.5 A Non-repetitive peak surge forward current I FSM 2 (t ≤ 10 ms) 150 Junction temperature Tj Operating temperature range T op -55 ...150 Storage temperature T stg -65 ...150 Thermal Resistance Junction - soldering point2) RthJS 1 ≤ 60 °C K/W For TA > 25 °C the derating of VR and IF has to be considered. 2For calculation of RthJA please refer to Application Note Thermal Resistance 1 2009-02-02 BAS3005S-02LRH Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Reverse current1) IR VR = 5 V - - 15 VR = 30 V - - 300 Forward voltage1) IF = 0.1 mA - 140 190 IF = 10 mA - 260 310 IF = 200 mA - 370 420 IF = 500 mA - 450 500 - 10 15 CT µA mV VF AC Characteristics Diode capacitance Unit pF VR = 5 V, f = 1 MHz 1Pulsed test: tp = 300 µs; D = 0.01 2 2009-02-02 BAS3005S-02LRH Diode capacitance CT = ƒ (VR) Reverse current IR = ƒ (TA) f = 1MHz VR = Parameter 10 -2 35 A pF 10 -3 IR CT 25 20 10 -4 15 10 30 V 20 V 10 V 5V 10 -5 5 0 0 5 10 15 20 V 10 -6 0 30 25 50 75 °C 100 VR 150 TA Reverse current IR = ƒ(VR) TA = Parameter Forward Voltage VF = ƒ (TA) IF = Parameter 10A-2 0.5 V 10 -3 TA = + 125°C 10 -4 TA = + 85°C 500 mA 0.4 10 VF IR 0.35 -5 TA = + 25°C 100 mA 0.3 10 -6 0.25 10 -7 0.2 10 mA 1 mA 0.15 10 -8 TA = - 40°C 0.1 10 -9 10 -10 0 0.05 5 10 15 20 V 0 -50 30 VR -25 0 25 50 75 100 °C 150 TA 3 2009-02-02 BAS3005S-02LRH Forward current IF = ƒ (VF) Permissible Reverse voltage VR = ƒ (TA) tp = Paramter, Duty cycle < 0.01 Device mounted on PCB with Rth = 160 K/W 10 A 0 35 V V Rmax 10 -1 IF 10 -2 10 20 125 °C 85 °C 25 °C - 40 °C -3 25 DC 20 ms 1 ms 15 10 -4 10 10 -5 5 10 -6 0 0.1 0.2 0.3 0.4 V 0 0 0.6 VF 20 40 60 80 100 °C 130 TA Forward current IF = ƒ (T S) BAS3005S-02LRH 600 mA IF 400 300 200 100 0 0 15 30 45 60 75 90 105 120 °C 150 TS 4 2009-02-02 Package TSLP-2-17 BAS3005S-02LRH Package Outline Top view Bottom view 0.39 +0.01 -0.03 0.6 ±0.05 0.05 MAX. 1 1 0.25 ±0.035 1) 2 1±0.05 0.65 ±0.05 2 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminal Foot Print 0.45 Copper Solder mask 0.375 0.35 0.275 1 0.925 0.3 0.35 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 0.5 Cathode marking 8 1.16 4 0.76 5 2009-02-02 BAS3005S-02LRH Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2009-02-02