SAM9X35 Microcontroller Schematic Check List 1. Introduction This application note is a schematic review check list for systems embedding the Atmel® AT91SAM ARM®-based SAM9X35 Embedded MPU. It gives requirements concerning the different pin connections that must be considered before starting any new board design and describes the minimum hardware resources required to quickly develop an application with the SAM9X35. It does not consider PCB layout constraints. AT91SAM ARM-based Embedded MPU It also gives advice regarding low-power design constraints to minimize power consumption. This application note is not intended to be exhaustive. Its objective is to cover as many configurations of use as possible. The Check List table has a column reserved for reviewing designers to verify the line item has been checked. Application Note 11132A–ATARM–01-Aug-11 2. Associated Documentation Before going further into this application note, it is strongly recommended to check the latest documents for the SAM9X35 Microcontroller on Atmel’s Web site. Table 2-1 gives the associated documentation needed to support full understanding of this application note. Table 2-1. Associated Documentation Information 2 Document Title User Manual Electrical/Mechanical Characteristics Ordering Information Errata AT91SAM ARM-based Embedded MPU - SAM9X35 Datasheet Internal architecture of processor ARM/Thumb instruction sets Embedded in-circuit-emulator ARM9EJ-S™ Technical Reference Manual ARM926EJ-S™ Technical Reference Manual Evaluation Kit User Guide SAM9X35-EK User Guide Application Note 11132A–ATARM–01-Aug-11 Application Note 3. Schematic Check List CAUTION: The AT91SAM9 board design must comply with the power-up and power-down sequence guidelines provided in the datasheet to guarantee reliable operation of the device. 1.0V, 1.8V and 3.3V Power Supplies Schematic Example(1) 10µH VDDOSC 1R 100nF 4.7µF DC/DC Converter GNDOSC VDDANA 100nF 3.3V GNDANA VDDBU 100nF GNDBU VDDIOP0,1 100nF GNDIOP VDDUTMII 100nF GNDUTMI DC/DC Converter VDDIOM 100nF 1.8V GNDIOM VDDNF 100nF GNDIOM DC/DC Converter VDDCORE 100nF 1V GNDCORE Linear Regulator 10µH VDDPLLA 1V 1R 100nF 4.7µF GNDOSC VDDUTMIC 2.2µF 100nF GNDUTMI (1) These values are given only as a typical example 3 11132A–ATARM–01-Aug-11 ; Signal Name Recommended Pin Connection Description Powers the device. VDDCORE 0.9V to 1.1V Decoupling capacitor (100 nF)(1)(2) Decoupling/Filtering capacitors must be added to improve startup stability and reduce source voltage drop. Supply ripple must not exceed 20 mVrms. Powers the PLLA cell. VDDPLLA 0.9V to 1.1V Decoupling/filtering RLC circuit(1) The VDDPLLA power supply pin draws small current, but it is noise sensitive. Care must be taken in VDDPLLA power supply routing, decoupling and also on bypass capacitors. Supply ripple must not exceed 10 mVrms. VDDNF VDDBU 1.65V to 1.95V or 3.0V to 3.6V Decoupling capacitor (100 nF)(1)(2) 1.8V to 3.6V Decoupling capacitor (100 nF)(1)(2) The VDDNF power supply the NAND Flash I/Os Powers the Backup unit. (Slow Clock Oscillator, On-chip RC and a part of the System Controller). Supply ripple must not exceed 30 mVrms. Powers the main oscillator cells. 1.65V to 3.6V VDDOSC Decoupling/Filtering RLC circuit(1) The VDDOSC power supply pin draws small current, but it is noise sensitive. Care must be taken in VDDOSC power supply routing, decoupling and also on bypass capacitors. Supply ripple must not exceed 30 mVrms. Powers the External Memory Interface I/O lines. VDDIOM 1.65V to 1.95V or 3.0V to 3.6V Decoupling capacitor (100 nF)(1)(2) Dual voltage range supported. The I/O drives are selected by programming the EBI_DRIVE field in the CCFG_EBICSA register. At power-up, the high drive mode for 3.3V memories is selected. Decoupling/Filtering capacitors must be added to improve startup stability and reduce source voltage drop. Powers the USB device and host UTMI+ interface. 4 VDDUTMII 3V to 3.6V Decoupling capacitor (100 nF)(1)(2) VDDUTMIC 0.9V to 1.1V Decoupling/Filtering capacitors (100 nF and 2.2µF)(1)(2) Decoupling/Filtering capacitors must be added to improve startup stability and reduce source voltage drop. Powers the USB device and host UTMI+ core. Decoupling/Filtering capacitors must be added to improve startup stability and reduce source voltage drop. Application Note 11132A–ATARM–01-Aug-11 Application Note ; Signal Name Recommended Pin Connection Description VDDIOP0 VDDIOP1 1.65V to 3.6V Decoupling/Filtering capacitors (100 nF)(1)(2) VDDANA 3.0V to 3.6V Decoupling/Filtering RLC circuit(1) Application dependent Powers the Analog to Digital Converter (ADC) and some PIOD I/O lines. GNDCORE Core Chip Ground GNDCORE pins are common to VDDCORE pins. GNDCORE pins should be connected as shortly as possible to the system ground plane. GNDBU Backup Ground GNDBU pin is provided for VDDBU pins. GNDBU pin should be connected as shortly as possible to the system ground plane. GNDIOM DDR2 and EBI I/O Lines Ground GNDIOM pins are common to VDDIOM and VDDNF pins. GNDIOM pins should be connected as shortly as possible to the system ground plane. GNDIOP Peripherals and ISI I/O lines Ground GNDIOP pins are common to VDDIOP0, VDDIOP1 pins. GNDIOP pins should be connected as shortly as possible to the system ground plane. GNDOSC PLLA, PLLUTMI and Oscillator Ground GNDOSC pin is provided for VDDOSC, VDDPLLA pins. GNDOSC pin should be connected as shortly as possible to the system ground plane. GNDUTMI UDPHS and UHPHS UTMI+ Core and interface Ground GNDUTMI pins are common to VDDUTMII and VDDUTMIC pins. GNDUTMI pins should be connected as shortly as possible to the system ground plane. GNDANA Analog Ground GNDANA pins are common to VDDANA pins. GNDANA pins should be connected as shortly as possible to the system ground plane. Powers the peripherals I/O lines. Decoupling/Filtering capacitors must be added to improve startup stability and reduce source voltage drop. Note: For more information please refer to the Core Power Supply POR Characteristics section of the SAM9X35 Datasheet. 5 11132A–ATARM–01-Aug-11 ; Signal Name Recommended Pin Connection Description Clock, Oscillator and PLL Crystal load capacitance to check (CCRYSTAL). SAM9X35 XOUT XIN GNDOSC Crystals between 8 and 16 MHz XIN XOUT 12 MHz Main Oscillator in Normal Mode USB High Speed (not Full Speed) Host and Device peripherals need a 12 MHz clock. Capacitors on XIN and XOUT (crystal load capacitance dependent) CCRYSTAL CLEXT CLEXT Example: for a 12 MHz crystal with a load capacitance of CCRYSTAL= 15 pF, external capacitors are required: CLEXT = 22 pF. Refer to the electrical specifications of the SAM9X35 Datasheet XIN XOUT 6 XIN: external clock source XOUT: can be left unconnected 12 MHz Main Oscillator in Bypass Mode USB High speed (not Full Speed) Host and Device peripherals need a 12 MHz clock. XIN XOUT XIN: can be left unconnected XOUT: can be left unconnected 12 MHz Main Oscillator Only USB High speed (not Full Speed) Host and Device peripherals need a 12 MHz clock. VDDOSC square wave signal External clock source up to 50 MHz Duty Cycle: 40 to 60% Refer to the electrical specifications of the SAM9X35 Datasheet Typical nominal frequency 12 MHz Duty Cycle: 45 to 55% Refer to the electrical specifications of the SAM9X35 Datasheet Application Note 11132A–ATARM–01-Aug-11 Application Note ; Signal Name Recommended Pin Connection Description Crystal load capacitance to check (CCRYSTAL32). SAM9X35 XIN32 XIN32 XOUT32 Slow Clock Oscillator GNDBU C CRYSTAL32 32.768 kHz Crystal Capacitors on XIN32 and XOUT32 (crystal load capacitance dependent) XOUT32 CLEXT32 CLEXT32 Example: for a 32.768 kHz crystal with a load capacitance of CCRYSTAL32= 12.5 pF, external capacitors are required: CLEXT32 = 19 pF. Refer to the electrical specifications of the SAM9X35 Datasheet. XIN32 XOUT32 Slow Clock Oscillator in Bypass Mode XIN32: external clock source XOUT32: can be left unconnected VDDBU square wave signal External clock source up to 44 kHz Refer to the electrical specifications of the SAM9X35 Datasheet. Bias Voltage Reference for USB To reduce as much as possible the noise on VBG pin please check the Layout consideration below: - VBG path as short as possible - ground connection to GNDUTMI VBG 0.9 - 1.1V(5) 6K8 ± 1% W VBG 10 pF GNDUTMI Refer to the Signal Description List of the SAM9X35 Datasheet. 7 11132A–ATARM–01-Aug-11 ; Signal Name Recommended Pin Connection Description ICE and JTAG(3) TCK Pull-up (100 kOhm)(1) This pin is a Schmitt trigger input. No internal pull-up resistor. TMS Pull-up (100 kOhm)(1) This pin is a Schmitt trigger input. No internal pull-up resistor. TDI Pull-up (100 kOhm)(1) This pin is a Schmitt trigger input. No internal pull-up resistor. TDO Floating Output driven at up to VVDDIOP0 RTCK Floating Output driven at up to VVDDIOP0 NTRST Please refer to the Pin Description of the SAM9X35 Datasheet This pin is a Schmitt trigger input. Internal pull-up resistor to VVDDIOP0 (100 kOhm). JTAGSEL In harsh environments,(4) It is strongly recommended to tie this pin to GNDBU if not used or to add an external low-value resistor (such as 1 kOhm). Internal pull-down resistor to GNDBU (15 kOhm). Must be tied to VVDDBU to enter JTAG Boundary Scan. Reset/Test NRST is a bidirectional pin (Schmitt trigger input). NRST Application dependent. Can be connected to a push button for hardware reset. It is handled by the on-chip reset controller and can be driven low to provide a reset signal to the external components or asserted low externally to reset the microcontroller. By default, the User Reset is enabled after a General Reset so that it is possible for a component to assert low and reset the microcontroller. An internal pull-up resistor to VVDDIOP0 (100 kOhm) is available for User Reset and External Reset control. 8 TST In harsh environments,(4) It is strongly recommended to tie this pin to GNDBU if not used or to add an external low-value resistor (such as 1 kOhm) This pin is a Schmitt trigger input. Internal pull-down resistor to GNDBU (15 kOhm). BMS Application dependent. Must be tied to VVDDIOP0 to boot from Embedded ROM. Must be tied to GNDIOP to boot from external memory (EBI Chip Select 0). Application Note 11132A–ATARM–01-Aug-11 Application Note ; Signal Name Recommended Pin Connection Description Shutdown/Wakeup Logic SHDN Application dependent. A typical application connects the pin SHDN to the shutdown input of the DC/DC Converter providing the main power supplies. This pin is a push-pull output. SHDN pin is driven low to GNDBU by the Shutdown Controller (SHDWC). WKUP 0V to VVDDBU This pin is an input-only. WKUP behavior can be configured through the Shutdown Controller (SHDWC). PIO PAx PBx PCx PDx All PIOs are pulled-up inputs (100 kOhms) at reset except those which are multiplexed with the Address Bus signals that require to be enabled as peripherals: Refer to the column “Reset State” of the Pin Description table in the I/O Description section of the SAM9X35 Datasheet. Application dependent. Schmitt Trigger on All Inputs To reduce power consumption if not used, the concerned PIO can be configured as an output, driven at ‘0’ with internal pull-up disabled. ADC TSADVREF 2.4V to VDDANA Decoupling/Filtering capacitors. Application dependent ADVREF is a pure analog input. To reduce power consumption, if ADC is not used: connect ADVREF to GNDANA. EBI D0-D31 Application dependent. Data Bus (D0 to D31) D0-D15 lines are pulled-up inputs to VDDIOM at reset. D16-D31 lines are pulled-up inputs to VVDDNF at reset. Note: D16 to D31 are multiplexed with the PIOD controller. Address Bus (A0 to A25) All address lines are driven to ‘0’ at reset. A0-A25 Application dependent. Note: A20 to A25 are multiplexed with the PIOD controller. 9 11132A–ATARM–01-Aug-11 ; Signal Name Recommended Pin Connection Description DDR2 - SMC - SDRAM Controller - NAND Flash Support See “External Bus Interface (EBI) Hardware Interface” on page 12. USB High Speed Host (UHPHS) HFSDPA/HFSDPB HHSDPA/HHSDPB Application dependent.(5) Integrated pull-down resistor to prevent over consumption when the host is disconnected. HFSDMA/HFSDMB HHSDMA/HHSDMB Application dependent.(5) Integrated pull-down resistor to prevent over consumption when the host is disconnected. USB Full Speed Host (UHPHS) HFSDPC Application dependent.(5) Integrated pull-down resistor to prevent over consumption when the host is disconnected. HFSDMC Application dependent.(5) Integrated pull-down resistor to prevent over consumption when the host is disconnected. USB High Speed Device (UDPHS) DHSDM/DFSDP Application dependent(6) Integrated programmable pull-up resistor. Integrated programmable pull-down resistor to prevent over consumption when the host is disconnected. To reduce power consumption, if USB Device is not used, connect the embedded pull-up. Integrated programmable pull-down resistor to prevent over consumption when the host is disconnected. DHSDP/DFSDM Application dependent(6) To reduce power consumption, if USB Device is not used, connect the embedded pull-down. Notes: 1. These values are given only as a typical example. 2. Decoupling capacitors must be connected as close as possible to the microcontroller and on each concerned pin. 100nF VDDCORE 100nF VDDCORE 100nF VDDCORE GND 10 Application Note 11132A–ATARM–01-Aug-11 Application Note 3. It is recommended to establish accessibility to a JTAG connector for debug in any case. 4. In a well-shielded environment subject to low magnetic and electric field interference, the pin may be left unconnected. In noisy environments, a connection to ground is recommended. 5. Example of USB High Speed Host connection: A termination 39 Ohm serial resistor must be connected to HFSDPx and HFSDMx. More details are in the USB Host High Speed Port section of the SAM9X35 Datasheet. PIO (VBUS DETECT) 15k Ω (1) "A" Receptacle 1 = VBUS 2 = D3 = D+ 4 = GND HHSDM 39 ± 1% Ω HFSDM 3 4 (1) 22k Ω Shell = Shield HHSDP CRPB 1 2 39 ± 1% Ω CRPB: 1µF to 10µF HFSDP 6K8 ± 1% Ω VBG 10 pF GND 6. Typical USB High Speed Device connection: As there is an embedded pull-up, no external circuitry is necessary to enable and disable the 1.5 k Ohm pull-up. A termination 39 Ohm serial resistor must be connected to DFSDP and DFSDM. More details are in the USB High Speed Device Port section of the SAM9X35 Datasheet. PIO (VBUS DETECT) 15k Ω "B" Receptacle 1 = VBUS 2 = D3 = D+ 4 = GND 1 DHSDM 39 ± 1% Ω DFSDM 2 Shell = Shield 22k Ω CRPB 3 DHSDP 4 39 ± 1% Ω CRPB:1µF to 10µF DFSDP 6K8 ± 1% Ω VBG 10 pF GND 11 11132A–ATARM–01-Aug-11 4. External Bus Interface (EBI) Hardware Interface These tables detail the connections to be applied between the EBI pins and the external devices for each Memory Controller. Table 4-1. EBI Pins and External Static Devices Connections Pins of the Interfaced Device 8-bit Static Device Signals: EBI_ 2 x 8-bit Static Devices 16-bit Static Device Controller 4 x 8-bit Static Devices 2 x 16-bit Static Devices 32-bit Static Device SMC D0 - D7 D0 - D7 D0 - D7 D0 - D7 D0 - D7 D0 - D7 D0 - D7 D8 - D15 – D8 - D15 D8 - D15 D8 - D15 D8 - 15 D8 - 15 – – – D16 - D23 D16 - D23 D16 - D23 – – – D24 - D31 D24 - D31 D24 - D31 D16 - D23 (5) D24 - D31 (3) NLB BE0 A0/NBS0 A0 – NLB – A1/NWR2/NBS2/DQ M2 A1 A0 A0 WE(2) NLB(4) BE2 A[2:22] A[1:21] A[1:21] A[0:20] A[0:20] A[0:20] A[23:25] A[22:24] A[22:24] A[21:23] A[21:23] A[21:23] NCS0 CS CS CS CS CS CS NCS1/DDRSDCS CS CS CS CS CS CS NCS2 CS CS CS CS CS CS NCS3/NANDCS A2 - A22(5) (5) A23 - A25 (5) CS CS CS CS CS CS (5) CS CS CS CS CS CS (5)) NCS5 CS CS CS CS CS CS NRD OE OE OE OE OE OE WE WE NCS4 NWR0/NWE NWR1/NBS1 NWR3/NBS3/DQM3 Notes: (1) WE WE – WE – (1) – (2) WE WE (2) NUB WE BE1 (4) BE3 NUB (2) – (3) WE NUB 1. NWR0 enables lower byte writes. NWR1 enables upper byte writes. 2. NWRx enables corresponding byte x writes (x = 0,1,2 or 3). 3. NBS0 and NBS1 enable respectively lower and upper bytes of the lower 16-bit word. 4. NBS2 and NBS3 enable respectively lower and upper bytes of the upper 16-bit word. 5. Multiplexed pins with PD15-PD31. Table 4-2. EBI Pins and External Device Connections Signals: EBI_ DDR2/LPDDR SDRAM NAND Flash DDRC SDRAMC NFC D0 - D15 D0 - D15 D0 - D15 NFD0-NFD15(1) D16 - D31 – D16 - D31 NFD0-NFD15(1)– A0/NBS0 – – – A1/NWR2/NBS2/DQM2 – DQM2 – Controller 12 Pins of the Interfaced Device Application Note 11132A–ATARM–01-Aug-11 Application Note Table 4-2. EBI Pins and External Device Connections (Continued) Signals: EBI_ Pins of the Interfaced Device DDR2/LPDDR SDRAM NAND Flash DDRC SDRAMC NFC DQM0-DQM1 DQM0-DQM1 DQM0-DQM1 – DQS0-DQM1 DQS0-DQS1 – – A[0:8] A[0:8] – Controller A2 - A10 A11 A9 A9 – SDA10 A10 A10 – A12 A13 - A14 – – – A[11:12] A[11:12] – A15 A13 A13 – A16/BA0 BA0 BA0 – A17/BA1 BA1 BA1 – A18/BA2 BA2 BA2 – A19-A20 – – – A21/NANDALE – – ALE A22/NANDCLE – – CLE A23 - A24 – – – A25 – – – NCS0 – – – DDRCS SDCS – – – – NCS1/DDRSDCS NCS2 NCS3/NANDCS – – CE NCS4 – – – NCS5 – – – NANDOE – – OE NANDWE – – WE NRD – – – NWR0/NWE – – – NWR1/NBS1 – – – NWR3/NBS3/DQM3 – DQM3 – CFCE1 – – – CFCE2 – – – SDCK CK CK – SDCK# CK# – – SDCKE CKE CKE – RAS RAS RAS – CAS CAS CAS – SDWE WE WE – Pxx(2) – – CE – – RDY Pxx(2) Notes: 1. A switch, NFD0_ON_D16, enables the user to select Nand Flash path on D0-D7 or D16-D24 depending on memory power supplies. this switch is located in the EBICSA register in the Bus Matrix User Interface. 2. Any PIO line. 13 11132A–ATARM–01-Aug-11 5. AT91SAM Boot Program Hardware Constraints See the Boot Strategies section of the SAM9X35 Datasheet for more details on the boot program. 5.1 AT91SAM Boot Program Supported Crystals (MHz) A 12 MHz Crystal or external clock (in bypass mode) is mandatory in order to generate USB and PLL clocks correctly for the following boots. 5.2 NAND Flash Boot Boot is possible if the first page contains a valid header or if it is ONFI compliant. For more details please check the section Nand Flash Boot of the SAM9X35 Datasheet. Booting on a 16-bit NAND Flash devices is not possible. Table 5-1. 5.3 Pins Driven during NAND Flash Boot Program Execution Peripheral Pin PIO Line EBI CS3 SMC NANDCS PD4 EBI CS3 SMC NAND ALE A21 EBI CS3 SMC NAND CLE A22 EBI CS3 SMC Cmd//Addr/Data D[7:0] or D[23:16] SD Card Boot SD Card Boot supports all SD Card memories compliant with SD Memory Card Specification V2.0. This includes SDHC cards. Table 5-2. 5.4 Pins Driven during SD Card Boot Program Execution Peripheral Pin PIO Line MCI0 MCI0_CK PA17 MCI0 MCI0_CD PA16 MCI0 MCI0_D0 PA15 MCI0 MCI0_D1 PA18 MCI0 MCI0_D2 PA19 MCI0 MCI0_D3 PA20 Serial and DataFlash® Boot Two kinds of SPI Flash are supported, SPI Serial Flash and SPI DataFlash. The SPI Flash bootloader tries to boot on SPI0 Chip Select 0, first looking for SPI Serial Flash, and then for SPI DataFlash. The SPI Flash Boot program supports: • all Serial Flash devices • all Atmel DataFlash devices 14 Application Note 11132A–ATARM–01-Aug-11 Application Note Table 5-3. 5.5 Pins Driven during Serial or DataFlash Boot Program Execution Peripheral Pin PIO Line SPI0 MOSI PA12 SPI0 MISO PA11 SPI0 SPCK PA13 SPI0 NPCS0 PA14 TWI EEPROM Boot The TWI EEPROM Flash Boot program searches for a valid application in an EEPROM memory. TWI EEPROM Boot supports all I2C-compatible EEPROM memories using 7 bits device (Address 0x50). Table 5-4. 5.6 Pins Driven during TWI EEPROM Boot Program Execution Peripheral Pin PIO Line TWI0 TWD0 PA30 TWI0 TWCK0 PA31 SAM-BA® Boot The SAM-BA Boot Assistant supports serial communication via the DBGU or the USB Device Port. Table 5-5. Pins Driven during SAM-BA Boot Program Execution Peripheral Pin PIO Line DBGU DRXD PA9 DBGU DTXD PA10 15 11132A–ATARM–01-Aug-11 Revision History Doc. Rev Comments 11132A First issue 16 Change Request Ref. Application Note 11132A–ATARM–01-Aug-11 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1) (408) 441-0311 Fax: (+1) (408) 487-2600 Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. 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Atmel®, Atmel logo and combinations thereof, DataFlash®, SAM-BA® and others are registered trademarks and others are trademarks of Atmel Corporation or its subsidiaries. ARM®, the ARM Powered® logo, Thumb ® and others are registered trademarks or trademarks of ARM Ltd. Other terms and product names may be the trademarks of others. 11132A–ATARM–01-Aug-11