■General properties <Actual values> Multi-layer circuit board materials Glass epoxy multi Pet Name Product number R-1755C R-1766 (GH) 1.98 1.93 1.91 2.00 2.00 930 930 915 920 940 0.63 0.57 0.55 0.48 0.38 0.2 0.2 0.2 0.2 0.2 165 165 154 150 133 176 170 173 163 153 215 210 190 190 185 410 360 360 380 350 45 45 32 35 34 280 260 260 250 265 14~16 14~16 14~16 14~16 12~14 5~6 14~16 14~16 14~16 14~16 29 32 19 20 19 33 27 30 18 19 27 29 25 27 - 22 25 27 23 25 4.4 4.7 4.7 4.8 4.8 10GHｚ 4.2 4.6 4.6 4.6 12GHz - - - - R-1515U R-1515D R-1566 (WN) R-15T1 2.00 2.00 2.37 929 950 950 915 - 0.58 0.62 0.62 1.3 0.2 0.2 0.2 0.2 0.2 0.2 135 140 145 145 145 145 145 133 135 140 150 145 148 148 148 175 153 155 150 180 170 170 170 170 345 355 370 370 315 380 385 350 350 350 44 43 40 42 50 65 40 35 40 40 24 200 255 236 240 250 260 270 180 200 180 180 150 12~14 14~16 11~13 10~12 11~13 11~13 11~13 11~13 11~13 11~13 11~13 11~13 15~17 13~15 13~15 14~16 13~15 12~14 13~15 13~15 13~15 13~15 13~15 13~15 13~15 13~15 15~17 20 20 25 25 24 23 24 24 23 23 24 24 24 24 26 18 19 23 23 23 22 21 22 22 21 21 22 22 22 22 25 - - 16.3 - 17.2 18.1 20.3 19.2 20.5 20 18.5 17.8 20.0 19.9 20.9 20.9 20.8 - - - 14.3 - 15.9 16.7 18.2 17.8 19 18.5 16.7 16.5 19.0 19.3 19.8 19.8 20.3 4.7 3.4 3.6 3.4 3.7 3.8 3.8 4.1 4.4 4.4 4.6 4.6 4.3 4.3 4.6 4.6 4.6 5.7 4.6 4.5 - - - 3.6 3.8 3.8 4.1 4.3 - 4.4 4.5 4.2 4.2 4.6 4.6 4.6 - - - 3.4 3.6 3.4 3.6 - - - - - - - - - - - - - R-1515E R-1515W R-1515A R-1515G R-5785(N) R-5785 R-5775(N) R-5775 R-5725S R-5725 R-1577 R-1755V - - 1.82 1.82 - 2.00 1.98 1.96 1.98 2.00 870 - - 880 880 - 850 935 910 900 0.7 0.7 - - 0.42 0.42 - 0.6 0.5 0.53 0.2 0.2 0.2 - - 0.2 0.2 - 0.2 0.2 240*1 220 180 230 - - - - 190 170 - - - - - 200 200 185 185 200 275*1 275*1 270*1 250 205 270*1 210 210 210 210 ℃ 400 400 390 390 390 400 400 400 410 α1 /℃ 20 20 22 22 30 20 42 42 α2 /℃ 65 65 95 97 140 100 280 Warp/MD α1 /℃ 0.5 3~4 8~10 9~11 11~13 5~6 Fill/TD α1 /℃ 0.5 3~4 8~10 9~11 11~13 Warp/MD GPa 34 32 35 35 Fill/TD GPa 32 30 33 Warp/MD GPa 26 24 Fill/TD GPa 24 1GHｚ Item Method Condition Unit Specific gravity JISK6911 - - 2.00 2.00 2.10 2.30 2.10 2.30 Specific heat DSC 25℃ J/kg℃ 870 870 870 840 870 Thermal conductive Laser-flash 25℃ W/m・K 0.7 0.7 0.7 0.7 Poisson's ratio JISK7113 23±3℃ - 0.2 0.2 0.2 TMA Rising temp: 10℃/min. ℃ 230*1 230*1 DSC Rising temp: 20℃/min. ℃ - DMA Rising temp: 5℃/min. ℃ TG/DTA (5％ down) Rising temp: 10℃/min. Glass transition temp. (Tg) Thermal decomposition temp. (Td) R-1755D R-1755M R-1755E R-A555(S) R-1533 R-1566(W) Z-axis -6 TMA CTE(×10 ) Flexural modules Young's modulus (Tension) JIS C6481 ASTM D3039 Dielectric constant (Dk) 1GHz : IPC TM650.2.5.5.9 10GHz : IPC TM650.2.5.5.5 12GHz : Balanced-type circular disk resonance method Dissipation factor (Df) 1GHｚ 0.0100 0.0100 0.0110 0.0150 0.0150 0.0110 0.0010 0.0015 0.0015 0.0020 0.0050 0.0050 0.0100 0.0160 0.0160 0.0140 0.0130 0.0150 0.0160 10GHｚ 0.0180 0.0180 0.0200 0.0170 0.0170 0.0170 12GHz - - - - - - - - - 0.0040 0.0070 0.0070 0.0130 0.0200 0.0020 0.0030 0.0040 0.0040 - 0.0190 0.0190 0.0190 0.0190 3.5 (RC70%) 3.3 (RC70%) 0.009 (RC70%) 0.012 (RC70%) 0.0130 0.0100 0.0100 0.0110 0.0180 0.0160 0.0160 - - - - - - - - - - - - - - - Flat-withstand voltage ASTM D149 Sample thickness: 0.2mm kV/mm 60*3 60*3 60*3 60*3 60*3 60*3 - - 69*3 69*3 - 70*3 66*3 70*3 70*3 70*3 70*3 70*3 64*3 80*3 68*3 70*3 70*3 57*3 Edgewise-withstand voltage ASTM D149 Sample thickness: 1.6mm kV 60 60 60 60 60 60 - - 60 60 - 60 51 60 60 60 60 45 49 60 50 52 52 60 without copper min > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 90 110 > 120 > 120 20 > 60 > 120 110 120 - With copper min > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 50 30 25 20 15 18 25 35 1 > 60 > 120 3 10 10 0.75mm 0.75mm 0.75mm 0.75mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.2mm Time to Delami (T288) Thickness The sample thickness is depending on the test method. Attn:; The above data is actual values and not guaranteed values. ※1 Measured by thin film tension geometry ( Other products are measured by flexural bending geometry.) ※2 From room temperature to 200℃ ※3 Flat-withstand voltage：0.2mm(exc. Flexible Circuit Board Materials) ■General properties <Actual values> Single sided circuit board materials Double sided circuit board materials Pet Name - - - - - Product number R-1787 R-1586(H) R-1788 R-1586 R-1786 R-1705 R-8500 R-8700 (SB) R-8700 R-8700EF - 2.03 2.12 1.80 1.80 1.80 1.91 1.43 1.43 1.43 25℃ J/kg℃ 980 1030 980 1050 970 920 1340 1340 Laser-flash 25℃ W/m・K 1.1 1.5 0.45 0.69 0.45 0.38 0.31 JISK7113 23±3℃ - 0.3 0.3 0.3 0.3 0.3 0.2 TMA Rising temp: 10℃/min. ℃ 140 145 160 115 140 DSC Rising temp: 20℃/min. ℃ 140 145 160 115 DMA Rising temp: 5℃/min. ℃ 155 155 190 TG/DTA (5％ down) Rising temp: 10℃/min. ℃ 345 320 /℃ 50 45 Item Method Condition Unit Specific gravity JISK6911 - Specific heat DSC Thermal conductive Poisson's ratio Glass transition temp. (Tg) Thermal decomposition temp. (Td) α1 R-F786W R-705T R-FR10 R-F775 1.35 1.40 1.21 1.43 1130 1090 1000 - 1130 0.31 0.24 0.17 0.5 - 0.24 0.4 0.4 0.3 0.3 0.33 - 0.3 - - - - - - 190 - - - - - - - - - - 150 - - - - 370*1 - 210*1 320 315 260 260 260 260 584 540 522 - 65 65 300*2 300*2 300*2 300*2 - - - (High heat resistance type) 1.43 1.43 1340 1340 0.31 0.31 0.4 0.4 140 - 140 140 135 155 320 320 50 70 350 *1 (TPI250) (TPI295) 350*1 (TPI250) 584 250 - α2 /℃ 240 210 135 280 270 270 400 Warp/MD α1 /℃ 18~23 16~20 15~19 20~25 20~25 11~13 15~20 15~20 15~20 13~18 18~20 19~21 17~19 35 18~20 Fill/TD α1 /℃ 20~25 19~23 17~21 23~28 23~28 13~15 17~22 17~22 17~22 15~20 16~19 19~21 17~19 35 16~19 Warp/MD GPa 18 16 16.5 16 16.5 23 9.5 9.5 9.5 9.5 - - - - - Fill/TD GPa 17 15 15.5 15 15.5 21 7.5 7.5 7.5 7.5 - - - - - Warp/MD GPa - - - - - 17.8 - - - - 7.1 5.1 3.4 - 7.1 Fill/TD GPa - - - - - 16.5 - - - - 7.1 5.1 3.4 - 7.1 1GHｚ 4.5 4.8 - 4.1 4 4.3 - - - - 3.2 3.2 3.0 3.1 3.2 10GHｚ - - - - - 4.2 - - - - 3.2 - 3.0 - 3.2 12GHz - - - - - - - - - - - - - - - - - - - 0.0020 0.0090 0.0008 0.0160 0.0020 TMA Flexural modules Young's modulus (Tension) R-F775 (Standard type) Z-axis CTE(×10-6) Flexible circuit board materials JIS C6481 ASTM D3039 Dielectric constant (Dk) 1GHz : IPC TM650.2.5.5.9 10GHz : IPC TM650.2.5.5.5 12GHz : Balanced-type circular disk resonance method Dissipation factor (Df) 1GHｚ 0.0060 0.0070 - 0.0070 0.0060 0.0160 10GHｚ - - - - - 0.0190 - - - - 0.0027 - 0.0016 - 0.0027 12GHz - - - - - - - - - - - - - - - 276 252 168 - 276 Flat-withstand voltage ASTM D149 Sample thickness: 0.2mm kV/mm 43*3 - - - 49*3 64*3 - - - Edgewise-withstand voltage ASTM D149 Sample thickness: 1.6mm kV 50 50 50 50 50 49 24 24 24 24 - - - - - without copper min - - - - - 20 - - - - - - - - - With copper min - - - - - 1 - - - - - - - - - 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 0.025mm 0.025mm 0.05mm 0.025mm 0.025mm Time to Delami (T288) Thickness Attn:; The above data is actual values and not guaranteed values. ※1 Measured by thin film tension geometry ( Other products are measured by flexural bending geometry.) ※2 From room temperature to 200℃ ※3 Flat-withstand voltage：0.2mm(exc. Flexible Circuit Board Materials)