■General properties <Actual values> As of June 10th, 2016 Multi-layer circuit board materials Glass epoxy multi Pet Name Product number Item Method Condition Unit Specific gravity JISK6911 - - Specific heat DSC 25 Thermal conductive Laser-flash 25 Poisson's ratio JISK7113 23±3 Glass transition temp. (Tg) Thermal decomposition temp. (Td) R-5775 R-5725S R-5725 R-5735 R-1577 R-1755V R-1755D R-1755M R-1755E R-A555(W) R-A555(S) R-1533 R-1566 (WN) R-1766 2.10 2.30 2.10 1.82 1.82 1.82 1.82 2.00 2.00 2.00 1.98 1.96 1.98 2.00 1.98 2.00 2.00 2.00 2.00 1.91 ℃ 870 840 870 - - 880 880 - 850 - 935 910 900 930 930 940 940 929 950 920 ・ J/kg ℃ W/m K 0.7 0.7 0.7 0.4 0.4 0.42 0.42 0.6 0.6 - 0.5 0.53 0.63 0.57 0.55 0.4 0.4 0.58 0.62 0.38 - 0.2 0.2 0.2 - - 0.2 0.2 - 0.2 - 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 ℃ Rising temp: 10 /min. ℃ 240*1 220 180 - - - - 190 170 185 165 165 154 150 133 160 145 145 145 140 DSC Rising temp: 20 /min. ℃ - - - 200 200 185 185 200 176 195 170 173 163 153 133 170 150 145 148 140 DMA Rising temp: 5 /min. ℃ 270*1 250 205 210 210 210 210 215 210 210 190 190 185 175 153 200 180 170 170 150 TG/DTA (5 down) Rising temp: 10 /min. ℃ 390 390 390 400 400 410 410 360 360 360 380 350 345 355 370 380 380 385 350 315 ℃ ℃ ℃ ℃ α1 / ℃ 22 22 30 42 42 45 45 32 35 31 34 44 43 40 42 37 40 35 40 65 α2 / ℃ 95 97 140 280 280 260 260 250 265 240 200 255 236 240 250 170 180 200 180 270 Warp/MD α1 / ℃ 8~10 9~11 11~13 14~16 14~16 14~16 14~16 12~14 12~14 12~15 14~16 11~13 10~12 11~13 11~13 11~13 11~13 11~13 11~13 11~13 Fill/TD α1 / ℃ 8~10 9~11 11~13 14~16 14~16 14~16 14~16 13~15 13~15 12~15 14~16 13~15 12~14 13~15 13~15 13~15 13~15 13~15 13~15 13~15 Warp/MD GPa 35 35 29 19 20 19 20 25 25 25 25 24 23 24 24 26 24 24 24 23 Fill/TD GPa 33 33 27 18 19 18 19 23 23 23 23 22 21 22 22 24 22 22 22 21 Warp/MD GPa 27 29 25 13.5 15.6 15 16.3 - 17.2 - 18.1 20.3 19.2 20.5 20 20.0 20.0 19.9 20.9 17.8 Fill/TD GPa 25 27 23 11.6 13.7 13.2 14.3 - 15.9 - 16.7 18.2 17.8 19 18.5 19.0 19.0 19.3 19.8 16.5 ｚ 4.7 4.8 4.8 3.4 3.6 3.4 3.7 3.8 3.8 3.9 4.1 4.4 4.4 4.6 4.6 3.4 3.5 4.6 4.6 4.3 ｚ 4.6 4.6 4.6 - - - 3.6 3.8 3.8 3.9 4.1 4.3 - 4.4 4.5 4.6 4.6 4.2 - - - 3.4 3.6 3.4 3.6 - - - - - - - - - - - ｚ 0.011 0.015 0.015 0.005 0.005 0.005 0.010 0.016 0.016 0.014 0.013 0.013 0.010 0.016 ｚ 0.020 0.017 0.017 0.007 0.007 0.007 0.013 0.020 - 0.019 0.019 0.018 0.016 0.019 12GHz - - - - - - - - - - - - - - - - TMA JIS C6481 Young's modulus (Tension) ASTM D3039 1GH Dielectric constant (Dk) 10GH 1GHz : IPC TM650.2.5.5.9 10GHz : IPC TM650.2.5.5.5 12GHz : Balanced-type circular disk resonance method Dissipation factor (Df) 12GHz 1GH 10GH 0.0010 0.0015 0.0015 0.0020 - - - 0.0040 0.0020 0.0030 0.0040 0.0040 (RC70%) (RC70%) 3.2 3.3 (RC70%) (RC70%) - - 0.008 0.009 (RC70%) (RC70%) 0.011 0.012 (RC70%) (RC70%) Flat-withstand voltage ASTM D149 Sample thickness: 0.2mm kV/mm 60*3 60*3 60*3 - - 69*3 69*3 70*3 70*3 70*3 66*3 70*3 70*3 70*3 70*3 80*3 80*3 68*3 70*3 64*3 Edgewise-withstand voltage ASTM D149 Sample thickness: 1.6mm kV 60 60 60 - - 60 60 60 60 60 51 60 60 60 60 60 60 50 52 49 without copper min > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 > 120 90 110 > 120 > 60 > 60 > 120 > 120 5 With copper min > 120 > 120 > 120 > 120 > 120 > 120 > 120 50 30 35 25 20 15 18 25 > 60 > 60 > 120 10 1 0.75mm 0.75mm 0.75mm 0.75mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm Time to Delami (T288) Thickness Attn:; The above data is actual values and not guaranteed values. 1 Measured by thin film tension geometry ( Other products are measured by flexural bending geometry.) 2 From room temperature to 200 3 Flat-withstand voltage 0.2mm(exc. Flexible Circuit Board Materials) ※ ※ ※ R-5775(N) ℃ Z-axis Flexural modules R-5785 TMA ％ CTE(×10-6) R-1515E R-1515W R-1515A R-5785(N) ： ℃ The sample thickness is depending on the test method. ■General properties <Actual values> As of June 10th, 2016 Single sided circuit board materials Double sided circuit board materials Glass epoxy Pet Name - - - - - Product number R-1787 R-1586(H) R-15T1 R-1586 R-1786 R-1705 R-8700 (EF) R-8500 R-8700 (SB) R-8700 2.03 2.12 2.37 1.80 1.80 1.91 1.43 1.43 1.43 ℃ 980 1030 915 1050 970 920 1340 1340 ・ Item Method Condition Unit Specific gravity JISK6911 - - Specific heat DSC 25 Thermal conductive Laser-flash 25 Poisson's ratio JISK7113 23±3 Glass transition temp. (Tg) Thermal decomposition temp. (Td) R-705T R-FR10 R-F775 1.35 1.40 1.21 1.43 1130 1090 1000 - 1130 1.43 1.43 1340 1340 J/kg ℃ W/m K 1.1 1.5 1.3 0.69 0.45 0.38 0.31 0.31 0.31 0.31 0.24 0.17 0.5 - 0.24 - 0.3 0.3 0.2 0.3 0.3 0.2 0.4 0.4 0.4 0.4 0.3 0.3 0.33 - 0.3 ℃ Rising temp: 10 /min. ℃ 140 145 145 115 140 140 - - - - - - - 190 - DSC Rising temp: 20 /min. ℃ 140 145 148 115 140 140 - - - - - - - - - DMA Rising temp: 5 /min. ℃ 155 155 170 135 155 150 - - - - 350*1 370*1 - 210*1 TG/DTA (5 down) Rising temp: 10 /min. ℃ 345 320 350 320 320 315 260 260 260 260 584 540 522 - ℃ 50 45 24 70 65 65 300*2 300*2 300*2 300*2 - - - ℃ ℃ ℃ ℃ α1 / (TPI250) (TPI295) 350*1 (TPI250) 584 250 - ℃ 240 210 150 280 270 270 / ℃ 18~23 16~20 15~17 20~25 20~25 11~13 13~18 15~20 15~20 15~20 18~20 19~21 17~19 35 18~20 ℃ 20~25 19~23 15~17 23~28 23~28 13~15 15~20 17~22 17~22 17~22 16~19 19~21 17~19 35 16~19 Warp/MD GPa 18 16 26 16 16.5 23 9.5 9.5 9.5 9.5 - - - - - Fill/TD GPa 17 15 25 15 15.5 21 7.5 7.5 7.5 7.5 - - - - - Warp/MD GPa - - 20.8 - - 17.8 - - - - 7.1 5.1 3.4 - 7.1 Fill/TD GPa - - 20.3 - - 16.5 - - - - 7.1 5.1 3.4 - 7.1 ｚ 4.5 4.8 5.7 4.1 4 4.3 - - - - 3.2 3.2 3.0 3.1 3.2 ｚ - - - - - 4.2 - - - - 3.2 - 3.0 - 3.2 12GHz - - - - - - - - - - - - - - - ｚ 0.006 0.007 0.011 0.007 0.006 0.016 - - - - 0.002 0.009 0.0008 0.016 0.002 ｚ - - - - - 0.019 - - - - 0.003 - 0.0016 - 0.003 12GHz - - - - - - - - - - - - - - - - - - 276 252 168 - 276 α2 / Warp/MD α1 Fill/TD α1 / TMA 400 JIS C6481 Young's modulus (Tension) ASTM D3039 1GH Dielectric constant (Dk) 10GH 1GHz : IPC TM650.2.5.5.9 10GHz : IPC TM650.2.5.5.5 12GHz : Balanced-type circular disk resonance method Dissipation factor (Df) 1GH 10GH Flat-withstand voltage ASTM D149 Sample thickness: 0.2mm kV/mm 43*3 - 57*3 - 49*3 64*3 Edgewise-withstand voltage ASTM D149 Sample thickness: 1.6mm kV 50 50 60 50 50 49 24 24 24 24 - - - - - without copper min - - - - - 20 - - - - - - - - - With copper min - - 10 - - 1 - - - - - - - - - 1.6mm 1.6mm 0.2mm 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 1.6mm 0.025mm 0.025mm 0.05mm 0.025mm 0.025mm Time to Delami (T288) Thickness Attn:; The above data is actual values and not guaranteed values. 1 Measured by thin film tension geometry ( Other products are measured by flexural bending geometry.) 2 From room temperature to 200 3 Flat-withstand voltage 0.2mm(exc. Flexible Circuit Board Materials) ※ ※ ※ R-F786W (High heat resistance type) ℃ Z-axis Flexural modules R-F775 (Standard type) TMA ％ CTE(×10-6) Flexible circuit board materials ： ℃