FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16451 Generic Copy 12-Apr-2010 TITLE: Additional Assembly/Test Site for capacity expansion of Surface Mount Zener in SMA package. PROPOSED FIRST SHIP DATE: 12-Jul-2010 AFFECTED CHANGE CATEGORY(S): Subcontractor Assembly/Test Site FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Huey Shan Wong < [email protected] > SAMPLES / ELECT DATA: Contact your local ON Semiconductor Sales Office or Huey Shan Wong < [email protected] > ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Laura Rivers < [email protected] > NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: This is the final notification announcing that ON Semiconductor is adding assembly and test manufacturing capacity for SMA packaged Zener halide-free affected devices at Liteon Seeful’s factory in China. Liteon currently produces Zener, TVS, & Rectifier surface mount products for ON Semiconductor. Issue Date: 12–Apr-2010 Rev. 06-Jan-2010 Page 1 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16451 RELIABILITY DATA SUMMARY: Reliability Test Results: P6SMB91AT3G Test: Conditions: HTRB TA=150C,80% Rated Voltage HTSL Ta = 150C Precondition MSL1@ 260C , 3 X IR at 260 C Autoclave+PC Ta=121C RH=100% ~15 psig HAST +PC Ta=131C RH=85%, psig~18.8 bias=80% rated V or100V Max IOL+PC Ta=25C, Delta TJ = 100 C, Ton/off = 2 min. TC+PC Ta= -65 C to 150 C RSH Ta=260C, 10 sec dwell DPA Post TC DPA Post H3TRB Interval: 1008 hrs 1008 hrs 96 hrs 96 hrs 15000 cyc 1000 cyc Results 0/240 0/240 0/960 0/240 0/240 0/240 0/240 0/90 0/6 0/6 ELECTRICAL CHARACTERISTIC SUMMARY: Product performance meets data sheet specifications. CHANGED PART IDENTIFICATION: Devices with date code of 1027 and greater may be sourced from either Seremban (Malaysia) or Seefull in Shanghai (China). Issue Date: 12-Apr-2010 Rev. 06-Jan-2010 Page 2 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16451 List of affected General Parts: 1SMA5925BT3G 1SMA5927BT3G 1SMA5928BT3G 1SMA5929BT3G 1SMA5930BT3G 1SMA5931BT3G 1SMA5932BT3G 1SMA5933BT3G 1SMA5934BT3G 1SMA5935BT3G 1SMA5936BT3G 1SMA5937BT3G 1SMA5938BT3G 1SMA5939BT3G 1SMA5940BT3G 1SMA5941BT3G 1SMA5942BT3G 1SMA5943BT3G 1SMA5945BT3G Issue Date: 12-Apr-2010 Rev. 06-Jan-2010 Page 3 of 3