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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16727A
Generic Copy
Issue Date: 17-Nov-2011
TITLE: Copper Wire for SOIC and TSSOP packages in Carmona, Philippines
PROPOSED FIRST SHIP DATE: 17-Feb-2012
AFFECTED CHANGE CATEGORY(S): Assembly Process
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Shannon Riggs<[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office, Shannon Riggs
<[email protected]>
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Ken Fergus<[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
A General Announcement (GA#16200) was published on 1-29-09 regarding the ongoing Copper
Wirebond conversion program at ON Semiconductor. This is a FPCN to notify customers of its plan to
qualify Copper Wire (in place of Gold Wire) on SOIC and TSSOP packages assembled at the
Carmona, Philippine assembly location. Reliability Qualification and full electrical characterization over
temperature has now been completed on the designated package qualification vehicles.
Issue Date: 17-Nov-2011
Rev. 06-Jan-2010
Page 1 of 2
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16727A
RELIABILITY DATA SUMMARY:
Reliability Test Results:
#
1
Test
Prep
A1
PC
A2
PC -HAST
A3
A4
PC-TC
PC-AC
Name
Test Conditions
Sample preparation and initial
part testing
Done
Done
MSL 1 260
Test at R and Hot
0/240
0/240
0/240
0/240
0/240
TA= +130°C, RH =
85%, PSIG= 18.8,
bias
c = 0, Room, Hot
96 hours
0/80
0/80
0/80
0/80
144 hours
192 hours
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
500
0/80
0/80
0/80
0/80
1000cyc
0/78
0/80
0/68
0/78
-65/+150 C
121C/100%RH,15psi
g
c = 0, Room, Hot
c = 0, Room
150C at 1008hrs
c = 0, Room, Hot
B1
HTOL
High Temp Op Life
TA = 150°C for
1008hrs
c = 0, Room, Hot
Solderability (>95% coverage)
Resistance to solder heat
Control
Done
High Temperature Storage Life
SD
Lot C
Done
HTSL
RSH
Lot B
Initial
Electrical
A6
C3
96 hours
0/80
0/80
0/80
0/80
192 hours
240 hours
0/80
0/80
0/78
0/78
0/78
0/78
0/78
0/
504 hours
1008 hours
0/80
0/80
0/80
0/80
0/80
0/80
0/80
0/80
504 hours
0/80
0/80
0/80
0/80
1008 hours
0/80
0/80
0/80
0/80
10 units per lot
Pass
0/10
0/10
0/10
0/10
Test at R
Pass
0/10
0/10
0/10
0/10
JESD22 – B106
260°C Immersion
ELECTRICAL CHARACTERISTIC SUMMARY:
There is no electrical characterization difference in products assembled with copper wire. Electrical
data is available upon request.
CHANGED PART IDENTIFICATION:
Products affected on this FPCN will have part number date code greater than WW7, 2012.
List of affected General Parts:
MC33172DR2GH
NCV33072DR2G
NCV33074DR2G
NCV33174DTBR2G
NCV833DR2G
SA33072DR2G
Issue Date: 17-Nov-2011
(rej/ss)
Lot A
---
Preconditioned Temperature
Cycle
Preconditioned
Autoclave/Unbiased HAST
(rej/ ss) (rej/ ss)
Read Point
Various
Preconditioning Test
(Test@Room/hot) SMD only;
Mositure preconditioning for
THB/HAST, AC/UHAST, TC;
Peak reflow Temp = 260C
Preconditioned Highly accelerated
stress test
End Point Req’s Test Results (rej/ ss)
Rev. 06-Jan-2010
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