FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16658C Generic Copy Issue Date: 11-Apr-2013 TITLE: Sourcing MOSFET Die from United Microelectronics Corporation PROPOSED FIRST SHIP DATE: 11-Jul-2013 AFFECTED CHANGE CATEGORY(S): ON Semiconductor Wafer Fab Site FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Jason Jeong<[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office or Brian Goodburn<[email protected]> ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Donna Scheuch<[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: ON Semiconductor is already utilizing United Microelectronics Corp (UMC) for their High Cell Density (HD3e) and Trench (T2) MOSFET technology silicon platforms. A fraction of the Trench (T1) MOSFET portfolio started to use UMC Wafer Fab July 2012 per FPCN #16658, FPCN #16658A and FPCN #16658B. With additional qualification and electrical characterization of this silicon platform, more T1 products will be built with Die sourced from the UMC. Wafer shipments of this group of products will begin in July 2013. Reliability Qualification and full electrical characterization over temperature have been performed, and available upon request. Issue Date: 11-Apr-2013 Rev. 06-Jan-2010 Page 1 of 2 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16658C RELIABILITY DATA SUMMARY: Reliability Test Results: NTTFS5116PLTAG Test HTRB JESD22 A108 Conditions : Ta=175°C, 80% max rated Vdss 504 hrs Ta=75°C, 100% of max rated Vgss, 504 hrs Lots Samples/lot Total Samples 3 80 pc 0/240 HTGB JESD22 A108 3 80 pc 0/240 TC JESD22 A104 -65°C to+150°C; for 1000 cycles 3 80 pc 0/240 AC JESD22 A102 3 80 pc 0/240 H3TRB JESD22 A101 3 80 pc 0/240 IOL MIL-STD-750 (M1036&M1037) AEC-Q101 121°C/100% RH, 15 psi for 96 hrs 131°C/85% RH, 80% of max rated Bvdss, 96hrs Ta=+25°C, delta Tj=100°C On/off = 2 min 15000 cyc 3 80 pc 0/240 ELECTRICAL CHARACTERISTIC SUMMARY: There is no change in electrical parametric performance. Characterization data is available upon request. CHANGED PART IDENTIFICATION: There will be no physical change to the Devices assembled with Die from the United Microelectronics Corp (UMC) wafer fabrication facility. There will be Wafer Lot traceability from the manufacturing Lot to determine the Die origin. List of affected General Parts: NTTFS5116PLTAG NTTFS5116PLTWG NVTFS5116PLTAG NVTFS5116PLTWG Issue Date: 11-Apr-2013 Rev. 06-Jan-2010 Page 2 of 2