V6203609 VID

REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Correct lead finish on last page. Update
boilerplate. - CFS
05-11-01
Thomas M. Hess
B
Update boilerplate paragraphs to current
requirements. - PHN
12-06-04
Thomas M. Hess
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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Original date of drawing
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CODE IDENT. NO.
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TITLE
MICROCIRCUIT, DIGITAL-LINEAR, CMOS, 12BIT, ANALOG-TO-DIGITAL CONVERTER,
MONOLITHIC SILICON
DWG NO.
V62/03609
16236
B
PAGE
1
OF
28
5962-V060-12
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance linear-digital microcircuit, with an operating
temperature range of -55°C to +125°C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/03609
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
01
Circuit function
THS1206-EP
CMOS, 12-bit, 6 MSPS, analog-to-digital
converter
1.2.2 Case outline(s). The case outlines are as specified herein.
Outline letter
Number of pins
X
32
JEDEC PUB 95
Package style
MO-153
Plastic thin shrink small outline
package with gull wing leads
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer:
Finish designator
A
B
C
D
E
Z
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Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
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1.3 Absolute maximum ratings.
1/
Supply voltage range:
DGND to DVDD ..................................................................................... -0.3 V to 6.5 V
BGND to BVDD ..................................................................................... -0.3 V to 6.5 V
AGND to AVDD ..................................................................................... -0.3 V to 6.5 V
Analog input voltage range ...................................................................... AGND – 0.3 V to AVDD + 1.5 V
Reference input voltage ........................................................................... -0.3 V + AGND to AVDD + 0.3 V
Digital input voltage range ........................................................................ -0.3 V to BVDD / DVDD + 0.3 V
Power dissipation (PD) (TA ≤ 25°C) ........................................................ 1453 mW 2/
Operating virtual junction temperature range (TJ) .................................... -55°C to +150°C
Storage temperature range ...................................................................... -65°C to +150°C
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds ............. 260°C
1.4 Recommended operating conditions. 3/
Power supply section
Supply voltage:
AVDD ..................................................................................................... 4.75 V to 5.25 V
DVDD ..................................................................................................... 3 V to 5.25 V
BVDD ..................................................................................................... 3 V to 5.25 V
Analog and reference inputs section
Analog input voltage in single-ended configuration .................................. VREFM to VREFP
Common-mode input voltage VCM in differential configuration ................ 1 V to 4 V
External reference voltage, VREFP ........................................................... AVDD – 1.2 V maximum
External reference voltage, VREFM ........................................................... 1.4 V minimum
Digital inputs section
High-level input voltage (VIH):
With BVDD = 3.3 V ................................................................................ 2 V minimum
With BVDD = 5.25 V .............................................................................. 2.6 V minimum
Low-level input voltage (VIL)
With BVDD = 3.3 V ................................................................................ 0.6 V maximum
With BVDD = 5.25 V .............................................................................. 0.6 V maximum
Input CONV_CLK frequency, (with DVDD = 3 V to 5.25 V) ...................... 0.1 MHz to 6 MHz
CONV_CLK pulse duration, clock high, tW (CONV_CLKH):
With DVDD = 3 V to 5.25 V ................................................................... 80 ns to 5000 ns
CONV_CLK pulse duration, clock low, tW (CONV_CLKL):
With DVDD = 3 V to 5.25 V ................................................................... 80 ns to 5000 ns
Ambient operating temperature (TA) ........................................................... -55°C to +125°C
1/
2/
3/
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “
recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
The derating factor above TA = +25°C is 11.62 mW/°C.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
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2. APPLICABLE DOCUMENTS
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JEP95
–
Registered and Standard Outlines for Semiconductor Devices
(Copies of these documents are available online at http://www.jedec.org or from JEDEC – Solid State Technology Association, 3103
North 10th Street, Suite 240–S, Arlington, VA 22201.)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
3.5.3 Block diagram. The block diagram shall be as shown in figure 3.
3.5.4 Timing waveforms. The timing waveforms shall be as shown in figure 4.
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TABLE I. Electrical performance characteristics.
Test
Symbol
Digital input section
High-level input current
IIH
Low-level input current
IIL
Input capacitance
CIN
High-level output voltage
VOH
Low-level output voltage
VOL
High-impedance-state output current
IOZ
Output capacitance
COUT
Load capacitance at databus D0 – D11
CL
Resolution
Integral nonlinearity
RES
INL
Differential nonlinearity
DNL
Offset error
OE
2/
1/
Conditions
-55°C ≤ TA ≤ +125°C
Limits
Unit
Min
Max
DVDD = digital inputs
-50
50
µA
Digital input = 0 V
-50
50
µA
5 TYP
IOH = -50 µA, BVDD = 3.3 V
BVDD – 0.5
IOH = -50 µA, BVDD = 5 V
BVDD – 0.5
pF
V
IOL = 50 µA, BVDD = 3.3 V
0.4
IOL = 50 µA, BVDD = 5 V
0.4
-10
CS1 = DGND, CS0 = DVDD
10
5 TYP
-20
µA
pF
30
pF
±1.8
Bits
LSB
12
After calibration in differential mode
After calibration in single-ended mode
V
±1
20
LSB
20
LSB
±10
µA
LSB
20 TYP
Gain error 2/
Analog input section
Input capacitance
GE
-20
Input leakage current
IINL
Internal voltage reference section
Accuracy
VREFP
3.3
3.7
V
VREFM
1.3
1.7
V
REFOUT
TC
2.3
Temperature coefficient
Reference noise
RN
Power supply section
Analog supply current
IDDA
Digital supply current
15 TYP
CIN
VAIN = VREFM to VREFP
2.7
V
50 TYP
PPM/°C
10 TYP
µV
40
mA
IDDD
1
mA
Buffer supply current
IDDB
4
mA
Supply current in power-down mode
IDD P
10
mA
Power dissipation
PD
216
mW
Power dissipation In power down
PD
AVDD = 5 V, BVDD = DVDD = 3.3 V
30 TYP
mW
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
1/
Conditions
-55°C ≤ TA ≤ +125°C
Limits
Min
Unit
Max
AC section
Signal-to-noise ratio + distortion
3/
SINAD
Differential mode
63
Single-ended mode 4/
Signal-to-noise ratio 3/
SNR
Differential mode
64
Single-ended mode 4/
Total harmonic distortion
3/
THD
68 TYP
Differential mode
-67
Single-ended mode
Effective number of bits
Spurious free dynamic range
ENOB
(SNR)
3/
SFDR
Analog input section
Full power bandwidth with a source impedance
of 150 Ω in differential configuration
Full power bandwidth with a source impedance
of 150 Ω in single ended configuration
Small signal bandwidth with a source impedance
of 150 Ω in differential configuration
Small signal bandwidth with a source impedance
of 150 Ω in single ended configuration
Timing specification section
Delay time
Delay time
Latency
Timing section
Clock cycle of the internal clock oscillator
dB
64 TYP
-68 TYP
Differential mode
10.17
Single-ended mode 4/
Bits
10.4 TYP
Differential mode
67
dB
Single-ended mode
69 TYP
FS sinewave, -3 dB
96 TYP
FS sinewave, -3 dB
54 TYP
100 mVpp sinewave, -3 dB
96 TYP
100 mVpp sinewave, -3 dB
54 TYP
MHz
td(DATA_AV)
td(o)
tpipe
5/
Pulse width, CONVST 5/
Aperture time
ns
CONV CLK
159
tC
t1
1 analog input
1.5 x tC
2 analog input
2.5 x tC
3 analog input
3.5 x tC
4 analog input
4.5 x tC
1 TYP
tdA
Time between consecutive start of single conversion
t2
5/
1 analog input
2 x tC
2 analog input
3 x tC
3 analog input
4 x tC
4 analog input
5 x tC
175
ns
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
1/
Conditions
-55°C ≤ TA ≤ +125°C
Limits
Min
Unit
Max
Timing section - continued
Delay time, DATA-AV becomes active for the
trigger level condition: TRIG0 = 0, TRG1 = 0
td(DATA_AV)
5/
Delay time, DATA-AV becomes active for the
trigger level condition: TRIG0 = 1, TRG1 = 0
td(DATA-AV)
5/
Delay time, DATA-AV becomes active for the
trigger level condition:TRIG0 = 0, TRG1 = 1
1/
2/
3/
4/
5/
6 x tC
2 analog inputs, TL = 2
7 x tC
3 analog inputs, TL = 3
8 x tC
4 analog inputs, TL = 4
9 x tC
1 analog input, TL = 4
3 x t2 + 6 x tC
2 analog inputs, TL = 4
t2 +7 x tC
3 analog inputs, TL = 6
t2 + 8 x tC
4 analog inputs, TL = 8
t2 + 9 x tC
1 analog input, TL = 8
7 x t2 + 6 x tC
2 analog inputs, TL = 8
3 x t2 + 7 x tC
3 analog inputs, TL = 9
2 x t2 + 8 x tC
4 analog inputs, TL = 12
2 x t2 + 9 x tC
1 analog input, TL = 14
13 x t2 + 6 x tC
2 analog inputs, TL = 12
5 x t2 + 7 x tC
3 analog inputs, TL = 12
3 x t2 + 8 x tC
td(DATA-AV)
5/
Delay time, DATA-AV becomes active for the
trigger level condition: TRIG0 = 1, TRG1 = 1
1 analog input, TL = 1
td(DATA-AV)
5/
ns
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the
specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not
necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or
design.
This test is not production tested.
fS = 6 MHz, f1 = 2 MHz at –1 dBFS, AVDD = 5 V, BVDD = DVDD = 3.3 V, CL < 30 pF.
The SNR (ENOB) and SINAD is degraded typically be 2 dB in single-ended mode when the reading of data is asynchronous to the
sampling clock.
This timing parameter is ensured by design but is not tested.
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Case outline X
Terminal
symbol
A
A1
b
C
D
e
E
E1
L
Q
N
Millimeters
Min
----0.19
0.15
10.90
--6.20
7.80
0.50
0.05
Max
1.20
0.25
0.30
--11.10
0.65
--8.40
0.75
0.15
32
NOTE: All dimensions are in millimeters.
FIGURE 1. Case outlines.
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Device type
Case outline
Terminal
number
Terminal symbol
01
X
Terminal
number
Terminal symbol
1
2
D0
D1
17
18
DGND
3
D2
19
RD
4
D3
20
5
6
D4
D5
21
22
WR (R / W )
CS1
7
BVDD
23
AVDD
8
9
10
11
12
13
14
15
BGND
D6
D7
D8
D9
D10 / RA0
D11 / RA1
CONV_CLK ( CONVST )
24
25
26
27
28
29
30
31
AGND
REFM
REFP
REFOUT
REFIN
BINM
BINP
AINM
16
DATA_AV
32
AINP
DVDD
CS0
FIGURE 2. Terminal connection.
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Terminal symbol
I/O
AINP
AINM
BINP
BINM
I
I
I
I
I
Analog input, single-ended or positive input of differential channel A
Analog input, single-ended or negative input of differential channel A
Analog input, single-ended or positive input of differential channel B
Analog input, single-ended or negative input of differential channel B
Analog supply voltage
I
I
Analog ground
Digital supply voltage for buffer
I
I
Digital ground for buffer
Digital input. This input is used to apply an external conversion clock in continuous
conversion mode. In single conversion mode, this input functions as the conversion start (
AVDD
AGND
BVDD
BGND
CONV_CLK ( CONVST )
CS0
I
CS1
DATA_AV
I
O
DGND
Description
CONVST ) input. A high to low transition on this input holds simultaneously the selected
analog input channels and initiates a single conversion of all selected analog inputs.
Chip select input (active low)
Chip select input (active high)
Data available signal, which can be used to generate an interrupt for processors and as level
information of the internal FIFO. This signal can be configured to be active low or high and
can be configured as a static level or pulse output.
Digital ground. Ground reference for digital circuitry.
Digital supply voltage.
DVDD
I
I
D0-D9
D10/RA0
I/O/Z
I/O/Z
D11/RA1
I/O/Z
REFIN
I
REFP
I
REFM
I
Reference input, requires a bypass capacitor of 10 µF to AGND in order to bypass the internal
reference voltage. An external reference voltage at this input can be applied. This option can
be programmed through control register 0.
REFOUT
O
Analog fixed reference output voltage of 2.5 V. Sink and source capability of 250 µA. The
reference output requires a capacitor of
10 µF to AGND for filtering and stability.
RD (See note)
I
The RD input is used only if the WR input is configured as a write only input. In this case, it
is a digital input, active low as a data read select from the processor.
WR (R / W ) (See note)
I
This input is programmable. It functions as a read-write input R / W and can also be
Digital input, output; D0 = LSB
Digital input, output. The data line D10 is also used as an address line (RA0) for the control
register. This is required for writing to the control register 0 and control register 1.
Digital input, output (D11 = MSB). The data line D11 is also used as an address line (RA1)
for the control register. This is required for writing to control register 0 and control register 1.
Common-mode reference input for the analog input channels. It is recommended that this pin
be connected to the reference output REFOUT.
Reference input, requires a bypass capacitor of 10 µF to AGND in order to bypass the internal
reference voltage. An external reference voltage at this input can be applied. This option can
be programmed through control register 0.
configured as write-only input WR , which is active low and used as data write selection from
the processor. In this case, the RD input is used as a read input from the processor.
NOTE: The start-conditions of RD and WR (R / W ) are unknown. The first access to the ADC has to be a write access
to initialize the ADC.
FIGURE 2. Terminal connections – continued.
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Reference voltage
This device has a built in reference, which provides the reference voltages for the ADC. VREFP is set to 3.5 V and VREFM is set to 1.5
V. An external reference can also be used through two reference input pins. REFP and REFM, if the reference source is programmed
as external. The voltage levels applied to these pins establish the upper and lower limits of the analog inputs to produce a full scale
and zero scale reading respectively.
Analog inputs
This device consists of 4 analog input, which are sampled simultaneously. These inputs can be selected individually and configured as
single ended or differential inputs. The desired analog input channel can be programmed.
Converter
This device uses a 12-bit pipelined multi-staged architecture with 4 1-bit stages followed by 4 2-bit stages, which achieves a high
sample rate with low power consumption. This device distributes the conversion over several smaller ADC sub-blocks, refining the
conversion with progressively higher accuracy as the device passes the results from stage to stage. This distributed conversion
requires a small fraction of the number of comparators used in a traditional flash ADC. A sample and hold amplifier (SHA) within each
of the stages permits the first stage to operate on a new input sample while the second through the eighth stages operate on the seven
preceding samples.
Conversion modes
The conversion can be performed in two different conversion modes. In the single conversion mode, the conversion is initiated by an
external signal ( CONVST ). An internal oscillator controls the conversion time. In the continuous conversion mode, an external clock
signal is applied to the clock input (CONV_CLK). A new conversion is started with every falling edge of the applied clock signal.
Sampling rate
The maximum possible conversion rate per channel is dependent on the selected analog input channels. The table below shows the
maximum conversion rate in the continuous conversion mode for different combinations.
Maximum conversion ratio in continuous conversion mode
Channel configuration
Number of channels
1 single ended channel
2 single ended channels
3 single ended channels
4 single ended channels
1 differential channel
2 differential channels
1 single ended and 1 differential channel
2 single ended and 1 differential channels
1
2
3
4
1
2
2
3
Maximum conversion
rate per channel
6 MSPS
3 MSPS
2 MSPS
1.5 MSPS
6 MSPS
3 MSPS
3 MSPS
2 MSPS
The maximum conversion rate in the continuous conversion mode per channel, fC is given by:
fC = 6 MSPS / (number of channels)
FIGURE 2. Terminal connections – continued.
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Sampling rate – continued.
Maximum conversion rate in single conversion mode
Channel configuration
Number of channels
1 single ended channel
2 single ended channels
3 single ended channels
4 single ended channels
1 differential channel
2 differential channels
1 single ended and 1 differential channel
2 single ended and 1 differential channels
1
2
3
4
1
2
2
3
Maximum conversion
rate per channel
3 MSPS
2 MSPS
1.5 MSPS
1.2 MSPS
3 MSPS
2 MSPS
1.5 MSPS
1.2 MSPS
Digital output data format
The digital output data format of this device can either be in binary format or in two’s complement format. The following tables list the
digital outputs for the analog input voltages.
Binary output format for single ended configuration
Analog input voltage
AIN = VREFP
Digital output code
FFFh
AIN = (VREFP + VREFM) / 2
800h
AIN = VREFM
000h
Two’s complement output format for single ended configuration
Analog input voltage
AIN = VREFP
Digital output code
7FFh
AIN = (VREFP + VREFM) / 2
000h
AIN = VREFM
800h
Binary output format for differential configuration
Analog input voltage
Vin = AINP – AINM
VREF = VREFP - VREFM
Digital output code
Vin = VREF
FFFh
Vin = 0
800h
Vin = -VREF
000h
FIGURE 2. Terminal connections – continued.
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Digital output data format – continued.
Two’s complement output format for differential configuration
Analog input voltage
Vin = AINP – AINM
VREF = VREFP - VREFM
Digital output code
Vin = VREF
7FFh
Vin = 0
000h
Vin = -VREF
800h
ADC control register
This device contains two 10-bit wide control registers (CR0, CR1) in order to program the device into the desired mode. The bit
definitions of both control registers are shown in the table below.
Bit definitions of control register CR0 and CR1
BIT
CR0
BIT 9
TEST1
BIT 8
TEST0
BIT 7
SCAN
BIT 6
DIFF1
BIT 5
DIFF0
BIT 4
CHSEL1
BIT 3
CHSEL0
BIT 2
PD
BIT 1
MODE
BIT 0
CR1
RBACK
OFFSET
BIN/2’s
R/W
DATA_P
DATA_T
TRIG1
TRIG0
OVFL/FRST
VREF
RESET
Writing to control register 0 and control register 1
The 10-bit wide control register 0 and control register 1 can be programmed by addressing the desired control register and writing the
register value to the ADC. The addressing is performed with the upper data bits D10 and D11, which function in this case as address
lines RA0 and RA1. During this write process, the data bits D0 to D9 contain the desired control register value. The table below shows
the addressing of each control register.
Control register addressing
D0-D9
Desired register value
Desired register value
Desired register value
Desires register value
D10/RA0
D11/RA1
0
1
0
1
0
0
1
1
Addressed control
register
Control register 0
Control register 1
Reserved for future
Reserved for future
FIGURE 2. Terminal connections – continued.
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ADC control registers
Control register 0
BIT 9
TEST1
BIT 8
TEST0
BIT 7
SCAN
BIT 6
DIFF1
BIT 5
DIFF0
BIT 4
CHSEL1
BIT 3
CHSEL0
BIT 2
PD
BIT 1
MODE
BIT 0
VREF
Control register 0 bit functions
Bits
0
Reset value
0
Name
1
0
MODE
VREF
Function
VREF select:
Bit 0 = 0 → The internal reference is selected
Bit 0 = 1 →The external reference voltage to selected.
Continuous conversion mode/single conversion mode
Bit 1 = 0 → Continuous conversion mode is selected.
An external clock signal is applied to the CONV_CLK input in this
mode. With every falling edge of the CONV_CLK signal a new
converted value is written into the FIFO.
Bit 1 = 1 → Single conversion mode is selected.
In this mode, the CONV_CLK input function as a CONVST input. A
single conversion is initiated on the device by pulsing the CONVST
2
0
PD
3,4
0,0
CHSEL0,
CHSEL1
5,6
1,0
DIFF0, DIFF1
7
0
SCAN
8,9
0,0
TEST0, TEST1
input. On the falling edge of CONVST , the sample and hold stages
of the selected analog inputs are placed into hold simultaneously and
the conversion sequence for the selected channels is started. The
signal DATA_AV (data available) becomes active when the trigger
condition is satisfied.
Power down
Bit 2 = 0 → The ADC is active
Bit 2 = 1 → Power down
The reading and writing to and from the digital outputs is possible
during power down. It is also possible to read out the FIFO.
Channel select.
Bit 3 and bit 4 select the analog input channel of the ADC. Refer to
the analog input channel configuration table.
Number of differential channels.
Bit 5 and bit 6 contain information about the number of selected
differential channels. Refer to the analog input channel configuration
table.
Autoscan enable.
Bit 7 enables or disables the autoscan function of the ADC. Refer to
the analog input channel configuration table.
Test input enable.
Bit 8 and bit 9 control the test function of the ADC. Three different
test voltages can be measured. This feedback allows the check of all
hardware connections and the ADC operation. Refer to the test
mode table for selection of the three different test voltages.
FIGURE 2. Terminal connections – continued.
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Analog input channel selection
The analog input channels of the device can be selected via bits 3 to 7 of control register 0. One single channel (single ended or
differential) is selected via bit 3 and bit 4 of control register 0. Bit 5 controls the selection between single ended and differential
configuration. Bit 6 and bit 7 select the autoscan mode, if more than one input channel is selected. The table below shows the possible
selections.
Analog input channel configuration
Bit 7
SCAN
0
0
0
0
0
0
1
Bit 6
DIFF1
0
0
0
0
0
0
0
Bit 5
DIFF0
0
0
0
0
1
1
0
Bit 4
CHSEL1
0
0
1
1
0
0
0
Bit 3
CHSEL0
0
1
0
1
0
1
1
1
0
0
1
0
1
0
0
1
1
1
0
1
0
1
1
0
1
1
0
1
1
0
0
1
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
1
1
0
0
0
1
1
1
1
1
1
0
0
1
0
1
1
0
0
1
1
0
1
0
0
1
0
0
1
0
1
0
1
Description of the selected inputs
Analog input AINP (single ended)
Analog input AINM (single ended)
Analog input BINP (single ended)
Analog input BINM (single ended)
Differential channel (AINP - AINM)
Differential channel (BINP - BINM)
Autoscan two single ended channels: AINP, AINM,
AINP,…
Autoscan three single ended channels: AINP, AINM,
BINP, AINP,…
Autoscan four single ended channels: AINP, AINM,
BINP, BINM, AINP,...
Autoscan one differential channel and one single
ended channel AINP, (BINP - BINM), AINP,
(BINP - BINM),…
Autoscan one differential channel and two single
ended channel AINP, AINM, (BINP - BINM), AINP,…
Autoscan two differential channels (AINP - AINM),
(BINP - BINM), (AINP - AINM),…
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
FIGURE 2. Terminal connections – continued.
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Analog input channel selection – continued.
Test mode
The test mode of the ADC is selected via bit 8 and bit 9 of control register 0. The differential sections are shown in the table below.
Three different options can be selected. This feature allows support testing of hardware connections between the ADC and the
processor.
Bit 9
Test1
0
0
Bit 8
Test0
0
1
Output result
1
0
((VREFM) + (VREFP)) / 2
1
1
VREFM
Normal mode
VREFP
Control register 1
BIT 9
RBACK
BIT 8
OFFSET
BIT 7
BIN/2’s
BIT 6
R/ W
BIT 5
DATA_P
BIT 4
DATA_T
BIT 3
TRIG1
BIT 2
TRIG0
BIT 1
OVFL/FRST
BIT 0
RESET
Control register 1 bit functions
Bits
0
Reset
value
0
1
0
Name
Function
RESET
Reset
Writing a 1 into this bit resets the device and sets the control register
0 and control register 1 to the reset values. In addition, the FIFO
pointer and offset register is reset. After reset, it takes 5 clock cycles
until the first value is converted and written into the FIFO.
Overflow flag (read only)
Bit 1 of control register 1 indicates an overflow in the FIFO.
Bit 1 = 0 → no overflow occurred.
Bit 1 = 1 → an overflow occurred. This bit is reset to 0, after this
control register is read from the processor.
FRST: FIFO reset (write only)
By writing a 1 into this bit, the FIFO is reset.
FIFO trigger level
Bit 2 and bit 3 of control register 1 are used to set the trigger level for
the FIFO. If the trigger level is reached, the signal DATA_AV (data
available) becomes active according to the settings of DATA_T and
DATA_P. This indicates to the processor that the ADC values can be
read. Refer to the FIFO trigger level table.
DATA_AV type.
Bit 4 of control register 1 controls whether the DATA_AV signal is a
pulse or static ( for edge or level sensitive interrupt inputs ). If it is set
to 0, the DATA_AV signal is static. If it is set to 1, the DATA_AV
signal is a pulse. Refer to DATA_AV type table.
OVFL
(read only)
2,3
0,0
FRST
(write only)
TRIG 0, TRIG 1
4
1
DATA_T
FIGURE 2. Terminal connections – continued.
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Control register 1 bit functions - continued
Bits
Name
Function
5
Reset
value
1
DATA_P
DATA_AV polarity.
Bit 5 of control register 1 control the polarity of DATA_AV. If it is set
to 1, DATA_AV is active high. If it is set to 0, DATA_AV is active low.
Refer to the DATA_AV type table.
6
0
R/ W
R/ W , RD/ WR selection.
Bit 6 of control register 1 controls the function of the inputs RD and
WR . When bit 6 in control register 1 is set to 1, WR becomes a R/
W input and RD is disabled. From now on, a read is signalled with
R/W high and write with R/W as low signal. If bit 6 in control register
7
0
BIN/2’s
8
0
OFFSET
9
0
RBACK
1 is set to 0, the input RD becomes a read input and the input WR
becomes a write input.
Complement select.
If bit 7 of control register 1 is set to 0, the output value of the ADC is
in twos complement. If bit 7 of control register 1 is set to 1, the output
value of the ADC is in binary format. Refer to digital output data
format tables..
Offset cancellation mode.
Bit 8 = 0 → normal conversion mode
Bit 8 = 1 → offset calibration mode
If a 1 is written into bit 8 of control register 1, the device internally
sets the inputs to zero and does a conversion. The conversion
results is stored in an offset register and subtracted from all
conversions in order to reduce the offset error.
Debug mode.
Bit 9 = 0 → normal conversion mode
Bit 9 = 1 → enable debug mode.
When bit 9 of control register 1 is set to 1, debug mode is enabled. In
this mode, the contents of control register 0 and control register 1 can
be read back. The first read after bit 9 is set to 1 contains the value
of control register 0. The second read after bit 9 is set to 1 contains
the value of control register 1.
FIGURE 2. Terminal connections – continued.
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FIFO trigger level
Bit 2 and bit 3 (TRIG1, TRIG0) of control register 1 are used to set the trigger level of the FIFO. If the trigger level is reached, the
DATA_AV (data available) signal becomes active according to the setting of the signal DATA_AV to indicate to the processor that the
ADC values can be read.
The table below shows four different programmable trigger levels for each configuration. The FIFO trigger level, which can be
selected, is dependent on the number of input channels. Both, a differential or single ended input is considered as one channel. The
processor therefore always reads the data from the FIFO in the same order and is able to distinguish between the channels.
Bit 3
TRIG1
Bit 2
TRIG0
0
0
1
1
0
1
0
1
Trigger level
for 1 channel
(ADC values)
01
04
08
14
Trigger level
for 2 channels
(ADC values)
02
04
08
12
Trigger level
for 3 channel
(ADC values)
03
06
09
12
Trigger level
for 4 channels
(ADC values)
04
08
12
Reversed
DATA_AV type
Bit 4 and bit 5 (DATA_T, DATA_P) of control register 1 are used to program the signal DATA_AV. Bit 4 of control register 1
determines whether the DATA_AV signal is static or a pulse. Bit 5 of the control register determines the polarity of DATA_AV. This is
shown in the table below.
Bit 5
DATA_P
0
0
1
1
Bit 4
DATA_T
0
1
0
1
DATA_AV type
Active low level
Active low pulse
Active high level
Active high pulse
FIGURE 2. Terminal connections – continued.
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FIGURE 3. Block diagram.
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In this mode, up to four analog input channels can be selected to be sampled simultaneously.
The maximum throughput rate is 6 MSPS in this mode. The timing of the DATA_AV signal is shown here in the case of a trigger level
set to 1 or 4.
FIGURE 4. Timing waveforms.
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The maximum throughput rate per channel is 3 MSPS in this mode. The data flow in the bottom of the figure shows the order the
converted data is written into the FIFO. The timing of the DATA_AV signal shown here is for a trigger level set to 2 or 4.
The maximum throughput rate per channel is 2 MSPS in this mode. The data flow in the bottom of the figure shows in which order the
converted data is written into the FIFO. The timing of the DATA_AV signal shown here is for a trigger level set to 3.
FIGURE 4. Timing waveforms – continued.
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CONTINUOUS CONVERSION MODE (4-CHANNEL OPERATION)
The maximum throughput rate per channel is 1.5 MSPS in this mode. The data flow in the bottom of the figure shows in which order
the converted data is written into the FIFO. The timing of the DATA_AV signal here is for a trigger level of 4.
The control signal DATA_AV is set to an active low pulse. This means that the connected processor has the task to read 1 value from
the ADC after every DATA_AV low pulse.
FIGURE 4. Timing waveforms – continued.
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The control signal DATA_AV is set to an active low pulse. This means that the connected processor has the task to read 4 values from
the ADC after every DATA_AV low pulse.
The control signal DATA_AV is set to an active low pulse. This means that the connected processor has the task to read 8 values from
the ADC after every DATA_AV low pulse.
FIGURE 4. Timing waveforms. – continued.
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The control signal DATA_AV is set to an active low pulse. This means that the connected processor has the task to read 14 values
from the ADC after every DATA_AV low pulse.
FIGURE 4. Timing waveforms. – continued.
This diagram shows the read timing behavior when the WR (R/ W ) input is programmed as a combined read-write
input R/ W . The RD input has to be tied to high-level in this configuration. This timing is called CS0 controlled because
CS0 is the last external signal of CS0 , CS1, and R/ W which becomes valid.
Design Parameters
Symbol
Min
0
Max
Unit
ns
ta
0
10
ns
th
0
5
ns
th(R/ W )
5
ns
tw(CS)
10
ns
Setup time, R/ W high to last CS valid
Access time, last CS valid to data valid
tSU(R/ W )
Hold time, first CS invalid to data invalid
Hold time, first external CS invalid to R/ W change
Pulse duration, CS active
FIGURE 4. Timing waveforms. – continued.
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This diagram shows the write timing behavior when the WR (R/ W ) input is programmed as a combined read-write
input R/ W . The RD input has to be tied to high-level in this configuration. This timing is called CS0 controlled because
CS0 is the last external signal of CS0 , CS1, and R/ W which becomes valid.
Design Parameters
Symbol
Min
0
Max
Unit
ns
Setup time, R/ W high to last CS valid
Setup time, data valid to first CS invalid
tSU(R/ W )
tSU
5
ns
Hold time, first CS invalid to data invalid
th
5
ns
th(R/ W )
5
ns
tw(CS)
10
ns
Hold time, first CS invalid to R/ W change
Pulse duration, CS active
FIGURE 4. Timing waveforms. – continued.
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This diagram shows the read timing behavior when the WR (R/ W ) input is programmed as a write-input only. The RD input acts as
the read-input in this configuration. This timing is called RD controlled because RD is the last external signal of CS0 , CS1, and RD
which becomes valid.
tSU(CS)
Min
0
Max
Setup time, RD low to last CS valid
Access time, last CS valid to data valid
Design Parameters
Unit
ns
ta
0
10
ns
Hold time, first CS invalid to data invalid
th
0
5
ns
th(CS)
5
ns
tw( RD )
10
ns
Hold time, RD change to first CS invalid
Pulse duration, RD active
Symbol
FIGURE 4. Timing waveforms. – continued.
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This diagram shows the write timing behavior when the WR (R/ W ) input is programmed as a write-input WR only. The input RD
acts as the read-input in this configuration. This timing is called WR controlled because WR is the last external signal of CS0 , CS1,
and WR which becomes valid.
Design Parameters
Symbol
tSU(CS)
Min
0
Setup time, data valid to first WR invalid
tsu
5
ns
Hold time, WR invalid to data invalid
th
5
ns
th(CS)
5
ns
tw( WR )
10
ns
Setup time, CS stable to last WR valid
Hold time, WR invalid to CS change
Pulse duration, WR active
Max
Unit
ns
FIGURE 4. Timing waveforms. – continued.
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4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Vendor part number
Top side marking
V62/03609-01XE
01295
THS1206MDAREP
THS1206MEP
1/ The vendor item drawing establishes an administrative control number for identifying the item
on the engineering documentation.
CAGE code
01295
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
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