Datasheet Download

Datasheet
Resistive Type Touch Screen Controller ICs
BU21023GUL BU21023MUV
General Description
Packages
VCSP50L2
Features
„
„
„
„
„
„
„
„
„
„
„
„
„
W(Typ) x D(Typ) x H(Max)
2.60mm x 2.60mm x 0.55mm
5.00mm x 5.00mm x 1.00mm
VCSP50L2
VQFN028V5050
Unlike most resistive touch screen controllers, the
BU21023 4-wire resistive touch screen controller
enables dual-touch detection and gesture recognition.
These intelligent controllers expose a set of registers to
a HOST processor and are configured through software.
The controllers can detect single point coordinates, dual
coordinates, pinch, spread, rotate left and rotate right
gestures, enabling pan and zoom operations in
applications that previously had to rely exclusively on
capacitive touch technology. Resistive touch does not
require custom screen development which reduces
development cost, and results in faster time to market
across a family of products.
VQFN028V5050
Applications
„
Enables single touch, dual touch & gesture
recognition using standard 4-wire resistive touch
screens
Adjustable touch detection threshold allows fine
tuning of pressure sensitivity for an application
Enables measurement of single point touch
pressure
SPI- and I2C interface for interfacing to HOST
processor
Programmable interrupt polarity
10-bit ADC provides sufficient resolution for finger
or stylus inputs
Firmware for internal CPU may be downloaded
from HOST processor or from an EEPROM
Includes filtering options to eliminate false
coordinates
Built in support for intelligent calibration
Easy to swap X & Y coordinates or adapt to
different touch screen connections
Single 3V power supply
Available in small packages and temperature
ranges
Ideally suited for consumer
„
„
Products with an LCD can benefit from pan and
zoom operations.
Smart phones, Digital Cameras, Video Cameras,
GPS Receivers, Printers,
Copiers, automotive navigation screens, touch
kiosks
Tablet PCs , Notebook computers, LCD displays
(with USB interface)
Key Specifications and Lineup
Parameter
BU21023GUL
BU21023MUV
4-wire resistive
touch screen
4-wire resistive
touch screen
Maximum Detection Point
2
2
Integrated Filter Process
Yes
Yes
Gesture Detection
Yes
Yes
Supplied Voltage Range(V)
2.7 to 3.6
2.7 to 3.6
Temperature Range(°C)
-20 to +85
-20 to +85
Host I/F
4-wire SPI
2-wire serial
4-wire SPI
2-wire serial
Pakage
VCSP50L2
VQFN028V5050
Screen
○Product structure：Silicon monolithic integrated circuit
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has no designed protection against radioactive rays
1/17
TSZ02201-0L5L3F300180-1-2
17.Mar.2014 Rev.003
BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
Pin Configuration and Pin Description
【BU21023GUL】
T4
PVDD
DVDD
VDD
VSS
A
XP
AVDD
DVDD_EXT
CLK_EXT
B
XN
YP
RSTB
T1
T2
YN
SEL_CSB
SO
T3
SDA_SI
INT
YN
SEL_CSB
SO
T3
IFSEL
XN
YP
RSTB
T1
T2
AVDD
DVDD_EXT
CLK_EXT
XP
IFSEL
B
ECL
EDA
SCL_SCK
SDA_SI
INT
E
T4
PVDD
DVDD
VDD
VSS
1
2
3
4
5
A
1
2
3
4
5
TOP VIEW (BALL SIDE DOWN)
4.
5.
6.
7.
8.
9.
SCL_SCK
C
D
1.
2.
3.
EDA
D
C
No.
D1
C1
C2
B1
A1
A2
B3
A3
B4
A4
A5
C3
B5
C4
C5
D4
D5
D3
E5
D2
E4
E3
E2
E1
ECL
E
Pin Name
YN
XN
YP
XP
T4
PVDD
AVDD
DVDD
DVDD_EXT
VDD
VSS
RSTB
CLK_EXT
T1
T2
T3
IFSEL
SO
INT
SEL_CSB
SDA_SI
SCL_SCK
EDA
ECL
I/O
I/O
I/O
I/O
I/O
I/O
O
O
I/O
I
I
I
I
I
I
I
O
O
I
I/O
I
I/O
O
BOTTOM VIEW (BALL SIDE UP)
Function
Screen interface
Screen interface
Screen interface
Screen interface
Test pin
Regulator output (for supply screen voltage)
Regulator output (for supply analog block)
Regulator output (for supply digital block) or supply digital voltage
Digital voltage enable (H=Hi-z , L=DVDD Enable)
Supply voltage
Ground
H/W reset
Supply external clock for debug
Test pin
Test pin
Test pin
Interface select pin (L=SPI, H=2-wire serial)
SPI
Serial data output
2-wire
Interrupt output
SPI
Chip select
2-wire Slave address select
SPI
Serial data input
2-wire Serial data in-out
SPI
Serial clock input
2-wire Serial clock input
EEPROM SDA
EEPROM SCL
Figure
E
E
E
E
E
E
E
A
A
A
A
A
F
C
C
C
C
C
C
Please use 1.0µF capacitors between AVDD and DVDD to GND, and leave PVDD terminal open.
If DVDD_EXT=”H“, the DVDD pin can be connected to an external 1.8V power source.
Please pull up the ECL, EDA, and INT pins using 10k ohm resistors as shown in the application diagram at the end of this document.
ECL and EDA pins may be directly connected to GND if an external EEPROM is not being used. Please connect a 0.1µF capacitor between T4 and GND.
T1, T2 & T3 pins should be connected to GND.
When using the 2 wire serial interface, please pull up the SCL_SCK, SDA_SI pins via 10k ohms and leave SO unconnected.
Please note that the values of resistors and capacitors mentioned here are only recommended values.
RSTB should be held low until supply voltage VDD has ramped up and has reached a stable level.
The polarity of INT pin is programmable via register 0x30.
Connect CLK_EXT to GND for normal use.
INT terminal is used as input pin in test mode.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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17.Mar.2014 Rev.003
BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
NC
NC
YN
XN
YP
XP
2
3
4
5
6
7
25
11
DVDD
SDA_SI
24
12
DVDD_EXT
ECL
27
9
PVDD
SEL_CSB
23
13
VDD
NC
28
8
T4
INT
22
14
VSS
Pin name
NC
NC
NC
YN
XN
YP
XP
T4
PVDD
AVDD
DVDD
DVDD_EXT
VDD
VSS
RSTB
CLK_EXT
T1
T2
T3
IFSEL
SO
INT
SEL_CSB
SDA_SI
SCL_SCK
EDA
ECL
NC
I/O
I/O
I/O
I/O
I/O
I/O
O
O
I/O
I
I
I
I
I
I
I
O
O
I
I/O
I
I/O
O
-
15
SCL_SCK
AVDD
16
DVDD
10
RSTB
11
26
CLK_EXT
25
EDA
17
SCL_SCK
T1
AVDD
18
10
T2
26
19
EDA
20
DVDD_EXT
T3
12
IFSEL
24
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
4.
5.
6.
7.
8.
9.
10.
NC
SDA_SI
21
PVDD
SO
9
7
27
XP
ECL
6
VDD
YP
13
5
23
XN
SEL_CSB
4
T4
3
8
YN
28
NC
NC
2
VSS
NC
14
1
22
NC
INT
VIEW(LEAD
(LEAD SIDE
DOWN)
TOP TOP
VIEW
SIDE
DOWN)
1.
2.
3.
1
RSTB
T1
17
15
T3
T2
19
IFSEL
20
18
SO
21
【BU21023MUV】
16 CLK_EXT
Pin Configuration and Pin Description - continued
BOTTOM VIEW
VIEW (LEAD
SIDE UP)
BOTTOM
(LEAD
SIDE UP)
Function
Screen interface
Screen interface
Screen interface
Screen interface
Test pin
Regulator output (for supply screen voltage)
Regulator output (for supply analog block)
Regulator output (for supply digital block) or supply digital voltage
Digital voltage enable (H=Hi-Z , L=DVDD enable)
Supply voltage
Ground
H/W reset
Supply external clock for debug
Test pin
Test pin
Test pin
Interface select pin (L=SPI, H=2-wire serial)
SPI
Serial data output
2-wire
Interrupt output
SPI
Chip select
2-wire Slave address select
SPI
Serial data input
2-wire Serial data in-out
SPI
Serial clock input
2-wire Serial clock input
EEPROM SDA
EEPROM SCL
-
Figure
E
E
E
E
E
E
E
A
A
A
A
A
F
C
C
C
C
C
C
-
Please use 1.0µF capacitors between AVDD and DVDD to GND, and leave PVDD terminal open.
If DVDD_EXT=”H “, the DVDD pin can be connected to an external 1.8V power source.
Please pull up the ECL, EDA, and INT pins using 10k ohm resistors as shown in the application diagram at the end of this document.
ECL and EDA pins may be directly connected to GND if an external EEPROM is not being used. Please connect a 0.1µF capacitor between
T4 and GND. T1, T2 & T3 pins should be connected to GND.
When using the 2 wire serial interface, please pull up the SCL_SCK, SDA_SI pins via 10k ohms and leave SO unconnected.
Please note that the values of resistors and capacitors mentioned here are only recommended values.
RSTB should be held low until supply voltage VDD has ramped up and has reached a stable level.
The polarity of INT pin is programmable via register 0x30.
Connect CLK_EXT to GND for normal use.
INT terminal is used as input pin in test mode.
Unconnected NC terminals.
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TSZ02201-0L5L3F300180-1-2
17.Mar.2014 Rev.003
BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
I/O equivalence circuit
PAD
PAD
Figure B
Figure A
PAD
PAD
Figure D
Figure C
PAD
PAD
CIN
Figure E
Figure F
Figure BU21023GUL / BU21023MUV I/O Equivalent Circuit
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TSZ02201-0L5L3F300180-1-2
17.Mar.2014 Rev.003
BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
Block Diagram and Description of each Block
【BU21023GUL / BU21023MUV】
Screen I/F
4-wire resistive touch screen interface
ADC
10-bit A/D converter
OSC
Internal 20MHz oscillator block with optional external clock input
Regulator
Internal regulator provides 1.8V DVDD supply. DVDD can also be supplied from an
external source if DVDD_EXT pin is tied high.
Clock Generator
System clock and timing generation (10MHz CPU clock)
CPU Core
For dual touch processing, programmability and HOST interface
Work Memory
Data memory for CPU
Program Memory
EEPROM I/F
Host I/F
Program memory for CPU. Code can be downloaded by HOST processor or from an
external EEPROM
To connect to external EEPROM when downloading program memory from EEPROM.
Use of external EEPROM is optional.
4-wire SPI or 2-wire I2C interface provides access to registers
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BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VDD
-0.3 to +4.5
V
Input Voltage
VIN
-0.3 to VDD+0.3
V
0.83 (Note 1)
W
0.70 (Note 2)
W
-50 to +125
°C
BU21023GUL
Power Dissipation
Conditions
Pd
BU21023MUV
Storage Temperature Range
Tstg
(Note1) Derate by 8.30 mW /°C centigrade when ambient temperature exceeds 25°C. Measured using PCB measuring 50mm x58mm.
(Note 2) Derate by 7.04mW /°C centigrade when ambient temperature exceeds 25°C. Measured using PCB(1 layer) measuring 70x70x1.6mm3.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Rating
Unit
Min
Typ
Max
VDD
2.70
3.00
3.60
V
Digital Core Power Supply
DVDD
1.62
1.80
1.98
V
Operating Temperature Range
Topr
-20
+25
+85
°C
Power Supply Voltage
Conditions
DVDD_EXT=H
Note: The BU21023 controllers can be operated with a single 3V VDD supply.
It is also possible to supply 1.8V DVDD from an external source if the DVDD_EXT pin is connected to logic high.
Electrical Characteristics (Ta=25°C, VDD=3.00V)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
Low-Level Input Voltage
VIL
-0.5
-
0.2xVDD
V
High-Level Input Voltage
VIH
0.8xVDD
-
VDD+0.5
V
Low-Level Output Voltage
VOL
-
-
0.4
V
High-Level Output Voltage
VOH
VDD-0.4
-
-
V
Standby Current
IST
-
-
1
µA
RSTB=L
Sleep Current1
ICC1
-
60
100
µA
DVDD_EXT =L
Sleep Current2
ICC2
-
10
20
µA
DVDD_EXT =H
Operating Current
IDD
-
4
6
mA
No Load
Freq
18
20
22
MHz
Oscillation Frequency
Resolution
Ad
1024x1024
Bit
Differential Non-Linearity Error
DNL
-3.0
-
+3.0
LSB
Integral Non-Linearity Error
INL
-3.0
-
+3.0
LSB
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BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
HOST-I/F mode (4-wire SPI)
(SCK=SCL_SCK, SI=SDA_SI, CSB=SEL_CSB, SO=SO)
6
7
9
CSB
1
SCK
2
3
4
SI
Write
0
W
A
6
W
A
5
W
A
4
W
A
3
5
W
A
2
W
A
1
W
D
7
W
A
0
Register Address
SI
Read
1
R
A
6
R
A
5
R
A
4
R
A
3
W
D
5
W
D
6
W
D
4
W
D
3
W
D
2
W
D
1
W
D
7
W
D
0
R
A
1
W
D
5
Write (WA + 1)
Write (WA)
R
A
2
W
D
6
W
D
1
W
D
0
Write (WA + n)
R
A
0
Register Address
8
SO
Read
R
D
7
z
R
D
5
R
D
6
R
D
4
R
D
3
R
D
2
R
D
1
R
D
7
R
D
0
R
D
6
Read (RA + 1)
Read (RA)
R
D
5
R
D
1
R
D
0
z
Read (RA + n)
Condition : VDD = 3.0V Ta=25°C
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
CSB Setup Time
t1
30
-
-
ns
SCK "H" Level Period
t2
30
-
-
ns
SCK "L" Level Period
t3
30
-
-
ns
SI Setup Time
t4
20
-
-
ns
SI Holding Time
t5
20
-
-
ns
CSB Holding Time
t6
20
-
-
ns
CSB "H" Level Time
t7
50
-
-
ns
Data Output Delay Time
t8
-
-
15
ns
SCK Frequency
t9
-
-
15
MHz
Note: SPI interface is selected by tying IFSEL pin to logic low. IFSEL= logic high selects the 2-wire Interface
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BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
HOST-I/F mode (2-wire serial)
(SCL=SCL_SCK, SDA=SDA_SI)
2
The 2-wire serial mode presents an I C interface for all practical purposes, but it is not a complete implementation
2
2
conforming to the I C specification. BU21023MUV/BU21023GUL devices can co-exist with other I C devices on the same
bus. The slave address for 2-wire serial communication is 5Ch or 5Dh. This is determined by the SEL_CSB pin.
SEL_CSB = “L”
SEL_CSB = “H”
: Slave address = 5Ch
: Slave address = 5Dh
tSU;STO
tHD;STA
SDA
tSU;DAT
tHD;DAT
SCL
SCL
Address
Parameter
Data
ACK
Symbol
ACK
Data
ACK
Limit
Unit
Min
Typ
Max
fSCL
0
-
400
kHz
tHD:STA
0.6
-
-
µs
SCL “L”
tLOW
1.3
-
-
µs
SCL “H”
tHIGH
0.6
-
-
µs
Data Hold Time
tHD:DAT
0.1
-
-
µs
Data Setup Time
tSU:DAT
0.1
-
-
µs
STOP Condition Setup Time
tSU:STO
0.6
-
-
µs
SCL Clock Frequency
START Condition Hold Time
・Write protocol
S SLAVE ADDRESS W A REGISTER ADDRESS A
7bit = 5Ch or 5Dh
8bit
・Read protocol
S SLAVE ADDRESS W A REGISTER ADDRESS A
7bit = 5Ch or 5Dh
8bit
from Master to Slave
from Slave to Master
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WRITE DATA
S
S
P
R
W
A
N
Conditions
A P
SLAVE ADDRESS
R A
READ DATA
7bit = 5Ch or 5Dh
8bit
= START condition
= STOP condition
= data direction READ (SDA HIGH)
= data direction WRITE (SDA LOW)
= acknowledge (SDA LOW)
= not acknowledge (SDA HIGH)
N P
TSZ02201-0L5L3F300180-1-2
17.Mar.2014 Rev.003
BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
EEPROM I/F
(SCL=ECL , SDA=EDA )
BU21023 controllers include an EEPROM interface for firmware download.
Device address of EEPROM is set via register 0x51(EEPROM_ADDR).
Timing Chart
tSU;STO
tHD;STA
SDA
tSU;DAT
tHD;DAT
SCL
Address
Parameter
Read
/Write
Data
ACK
Symbol
Data
ACK
Limit
Unit
Min
Typ
Max
fSCL
270
310
350
kHz
tHD:STA
0.7
-
0.9
µs
SCL ”L” Width
tLOW
1.4
-
1.8
µs
SCL ”H” Width
tHIGH
1.4
-
1.8
µs
Data Hold Time
tHD:DAT
0.7
-
0.9
µs
Data Setup Time
tSU:DAT
0.7
-
0.9
µs
STOP Setup Time
tSU:STO
0.7
-
0.9
µs
SCL Clock Frequency
START Hold Time
ACK
Condition
Protocol
*IC does not support the write command.
*IC supports the following read command.
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BU21023GUL BU21023MUV
BU21024FV-M
Datasheet
Background Information
A resistive touch screen is made up of multiple layers of sandwiched resistive films and protective coatings all sitting on top
of an LCD display. Resistive touch screens work by direct contact of a stylus or a finger flexing a pair of resistive films, hence
any blunt pointing instrument or a gloved finger may be used.
Touch screen resolution
The resolution of a touch screen is typically measured in dots per inch (dpi) and is a function of the physical size of the touch
screen and the ADC used in the conversion circuitry. For example, a 3”x5” screen used with the BU21023 devices can
provide a theoretical resolution of 1024 /5 = 204 dpi. In the case of resistive touch screens, the direct contact nature of its
operation and finger thickness often impose an upper limit on the effective system resolution that may be achieved,
regardless of the resolution of the ADC itself.
Description of Function
The BU21023 devices connect to a standard 4-wire resistive touch screen on one side and to a HOST processor on the
other side. The BU21023 include the analog and digital circuitry to process and provide dual touch coordinate data and pinch,
spread gesture information to the HOST .
The BU21023 devices include an internal CPU and provide a high degree of programmability by exposing a set of registers
that can be accessed by a HOST through SPI or I2C serial interfaces. The IFSEL pin determines whether SPI or I2C interface
is selected, The BU21023 devices include an INT pin whose polarity can be programmed via registers. When an interrupt
occurs, for example, due to touch detection, the HOST processor is required to read an interrupt status register to determine
the cause of the interrupt and take appropriate action.
The program memory of the internal CPU may be initialized via the HOST interface or via an external EEPROM. This is
selected by a register setting.
The BU21023 devices support two sensing modes; continuous and interval sensing modes, that are register- selectable. In
the continuous sensing mode, the embedded CPU reads Z, X & Y coordinates continuously when a touch is detected. The
interval sensing mode allows a delay to be inserted between each cycle.
The BU21023 devices enable optimization of touch detection threshold for a given screen. They also include several
sophisticated calibration algorithms.
Often, a description of the registers followed by flow charts requires application note to explain the steps in finer detail.
The application note also includes information on touch screen parameters that one should look for when selecting resistive
touch screens for multi-touch.
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BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
Application Examples
【BU21023GUL BU21023MUV】
BU21023GUL/MUV support 2 HOST interfaces (4-wire SPI and 2-wire serial bus).
The figures shown below are application circuits when each interface is used.
(Although BU21023GUL is CSP package, it is shown in similar figure for comparison.)
*Please connect the terminal of ECL/EDA to GND when downloading the firmware from the HOST.
ECL and EDA pins pull up to VDD if an external EEPROM is used. (example : 10kΩ)
*Please insert TVS diode or Zener diode to each sensor line to enhance resistance to ESD.
*Please pull up the INT terminal to VDD or HOST IO voltage (max 4.5V).
*In the case of 4-wire SPI use, please pull down the SO terminal to GND.
If not in use, connect it to the GND.
Example 1: BU21023GUL/MUV Application Circuit (4-wireSPI)
In the case of 2-wire serial interface use,
please pull up the INT, SCL_SCK, SDA_SI terminal to VDD or HOST IO voltage(max4.5V).
Example 2: BU21023GUL/MUV Application Circuit (2-wire Serial bus)
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Datasheet
BU21024FV-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BU21024FV-M
Datasheet
Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Others
In case of use this IC, please peruse some other detail documents, we called Functional description, Application note.
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BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
Ordering Information
B
U
2
1
0
Part Number
2
3
x
x
x
-
Package
GUL : VCSP50L2
MUV: VQFN028V5050
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
VCSP50L2
(TOP VIEW)
VQFN028V5050 (TOP VIEW)
1PIN MARK
Part Number Marking
Part Number Marking
U21023
U21023
LOT Number
LOT Number
1PIN MARK
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BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
Physical Dimension, Tape and Reel Information
Package Name
VCSP50L2 (BU21023GUL)
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
∗ Order quantity needs to be multiple of the minimum quantity.
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17.Mar.2014 Rev.003
BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
Physical Dimension, Tape and Reel Information – continued
Package Name
VQFN028V5050 (BU21023MUV)
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
∗ Order quantity needs to be multiple of the minimum quantity.
16/17
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17.Mar.2014 Rev.003
BU21023GUL BU21023MUV
Datasheet
BU21024FV-M
Revision History
Date
Revision
07.Oct.2013
001
07.Feb.2014
002
17.Mar.2014
003
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Changes
New Release
Remove the description of BU21024FV-M
Added 3D package image
Change description p10 from “other document” to “application note”.
17/17
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17.Mar.2014 Rev.003
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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