ROHM BD6071HFN-TR

Datasheet
White LED Driver
with Synchronous Boost Converter
and PWM Brightness Control for up to 3 LEDs in Series
BD6071HFN
●General Description
BD6071HFN is boost DC/DC converter possible to
boost output voltage up to 14V (Max.) and drive the
white LEDs at constant. It is possible that turning on
white LED steadily by a series connection which has no
current variation, and by a fast transient response with
current mode. And, BD6071HFN is white LED driver IC
with synchronous rectification. With synchronous
rectification (no external schottky diode required) and
small package, they can save mount space.
●Key Specifications
 Operating power supply voltage range: 2.7V to 5.5V
 Switching frequency:
1MHz(Typ.)
 Quiescent Current:
0.1μA (Typ.)
 Operating temperature range:
-30°C to +85°C
●Package W(Typ.) x D(Typ.) x H(Max.)
●Features
 Boost DC/DC converter
 Adjustment of brightness by external PWM pulse
 Possible to driving 3 LEDs
 Soft start function
 Synchronous rectification Boost DC/DC converter
 No external schottky diode required
 Output Open • Short protect
HSON8
2.90mm x 3.00mm x 0.60mm
●Applications
This driver is applicable for various fields such as
mobile phones, portable game machines, Inter-phone
camera, audio player, portable DVD player, back light for
printer display etc… and support light of the camera for
the mobile phone, simple flash. And, these can use
power supply for OEL.
●Typical Application Circuit
●Pin Configuration
VIN
CIN
1μF
L
22μH
VIN
[Top View]
8
7
6
5
1
2
3
4
VOUT
SW
COUT
1μF
BD6071HFN
White LED
VFB
RFB
24Ω
Figure 1. Pin configuration HSON8 (Top view)
GND GNDA
EN
TEST
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BD6071HFN
●Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Ratings
Unit
Terminal voltage 1
VMAX1
7 *1
V
Terminal voltage 2
VMAX2
20 *1
Power dissipation
2
Applicable to VIN,EN,VFB,
TEST pins
V
Applicable to SW,VOUT pins
70mm×70mm×1.6mm at
glass epoxy board mounting
Pd
630 *
mW
Operating temperature range
Topr
-30 ~ +85
°C
Storage temperature range
Tstg
-55 ~ +150
°C
*1
*2
Conditions
These values are based on GND and GNDA pins.
When it’s used by more than Ta=25°C, it’s reduced by 5.04mW/°C.
●Recommended Operating Ratings (Ta=-30°C to +85°C)
Parameter
Operating supply voltage
Symbol
VIN
Ratings
Min.
Typ.
Max.
2.7
3.6
5.5
Unit
V
Conditions
VIN pin
●Electrical Characteristics (Unless otherwise specified Ta = +25°C, VIN = 3.6V)
Parameter
Symbol
Limits
Min.
Typ.
Max.
-
0.4
Unit
Conditions
<EN Terminal>
EN threshold voltage (Low)
VthL
-
EN threshold voltage (High)
VthH
1.4
-
-
V
Iin
-
18.3
30.0
μA
EN=5.5V
Iout
-2.0
-0.1
-
μA
EN=0V
Iq
-
0.1
2.0
μA
EN=0V
EN=2.6V,VFB=1.0V,VIN=3.6V
EN terminal input current
EN terminal output current
V
<Switching regulator>
Quiescent Current
Current Consumption
Idd
-
1.1
1.5
mA
Feedback voltage
VFB
0.47
0.50
0.53
V
Inductor current limit
Icoil
200
265
330
mA
SW saturation voltage
Vsat
-
0.14
0.28
V
Isw=200mA, VOUT=13V
SW on resistance P
Ronp
-
2.1
3.2
Ω
Ipch=200mA, VOUT =13V
Switching frequency
fSW
0.8
1.0
1.2
MHz
Duty cycle limit
Duty
82.7
85.0
-
%
Output voltage range
Vo
-
-
14.0
V
Over voltage limit
Ovl
14.0
14.5
15.0
V
Start up time
Ts
-
0.5
1.0
ms
*1
VIN =3.6V *1
VFB=0V
VFB=0V
This parameter is tested with dc measurement.
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Datasheet
BD6071HFN
●Pin Descriptions
PIN Name
In/Out
Pin number
Function
GNDA
-
1
Analog GND
EN
In
2
Enable control(pull down is integrated on resistance)
TEST
In
3
TEST input (pull down is integrated on resistance)
VIN
In
8
Power supply input
VFB
In
4
Feedback input voltage
VOUT
Out
7
Output
SW
In
6
Switching terminal
GND
-
5
Thermal PAD
-
-
Power GND
Heat radiation PAD of back side
Connect to GNDA
●Block Diagram
VIN
SW
VOUT
over voltage
protect
Q2
TSD
Q1
Q
S
Q
R
short protect
PWM comp
+
Control
Current
Sense
+
-
+
-
ERRAMP
+
VFB
+
OSC
300kΩ
GND
GNDA
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Datasheet
BD6071HFN
●Typical Performance Curves
VIN [V]
VIN [V]
Figure 2. Current Consumption vs.
power source voltage
Figure 3. Quiescent current vs.
power source voltage
VIN [V]
Figure 4. Oscillation frequency
vs. power source voltage
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Figure 5. Efficiency vs. LED current in each coil
< 2LED > (VOUT=7.5V, VIN=3.6V, Ta=25°C)
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Datasheet
BD6071HFN
●Typical Performance Curves - continued
Figure 6. Efficiency vs. LED current in each coil
< 3LED > (VOUT=10.5V, VIN=3.6V, Ta=25°C)
Figure 7. Efficiency vs. LED current
< 2LED > (VOUT=7.5V, Ta=25°C)
Temperature [°C]
Figure 9. Inductor current limits vs.
Temperature
Figure 8. Efficiency vs. LED current
< 3LED > (VOUT=10.5V, Ta=25°C)
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Datasheet
BD6071HFN
Output Power [mW]
●Typical Performance Curves - continued
Figure 10. Output power vs.
power source voltage
Figure 11. Feedback voltage vs.
Power source voltage
Figure 12. Soft Start
( VIN = 3.6V, Ta = 25°C, 3LED, 20mA Load )
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Figure 13. LED Open output voltage
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Datasheet
BD6071HFN
●Typical Performance Curves - continued
Figure 14. LED luminance adjustment
( VIN = 3.6V, Ta = 25°C, 3LED, 20mA Load )
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BD6071HFN
●Operation
BD6071HFN is a fixed frequency PWM current mode DC/DC converter, and adopts synchronous rectification architecture
(Refer to the Block Diagram of p.3). As for the inputs of the PWM comparator as the feature of the PWM current mode, one
is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that
controls the inductor current into Slope waveform for sub harmonic oscillation prevention. This output controls Q1 and Q2
via the RS latch.
Timing of Q1 and Q2 is precisely adjusted so that they will not turn ON at the same time, thus putting them into
non-overlapped relation.
In the period where Q1 is ON, energy is accumulated in the external inductor, and in the period where Q1 is OFF, energy is
transferred to the capacitor of VOUT via Q2.
Further, BD6071HFN has many safety functions, and their detection signals stop switching operation at once.
●Description of Functions
1) Soft starts and off status
BD6071HFN has soft start function and off status function.
The soft start function and the off status function prevent large current from flowing to the IC via coil.
Occurrence of rush current at turning on is prevented by the soft start function, and occurrence of invalid current at
turning off is prevented by the off status function.
2) Isolation control
BD6071HFN has isolation control to prevent LED wrong lighting at power off.
The cause of the LED wrong lighting is leak current from VIN to the white LED.
Therefore, when BD6071HFN gets in power off (EN = L), the isolation control cuts the DC path between SW and VOUT,
thereby the leak current from VIN to LED is prevented.
VIN
White LED
VOUT
SW
VFB
Figure 15. Isolation control
3) Short-circuit protection and over voltage protection
BD6071HFN has short-circuit protection and over voltage protection. These detect the voltage of VOUT, and at error, they
stop the output Tr. Details are as shown below.
・Short-circuit protection
In the case of short-circuit of the DC/DC output (VOUT) to GND, the coil or the IC may be destructed.
Therefore, at such an error as VOUT becoming 0.7V or below, the Under Detector shown in the figure works, and turns
off the output Tr, and prevents the coil and the IC from being destructed.
And the IC changes from its action condition into its non-action condition, and current does not flow to the coil (0mA).
・Over voltage protection
At such an error as the IC and the LED being cut off, over voltage causes the SW terminal and the VOUT terminal
exceed the absolute maximum ratings, and may destruct the IC. Therefore, when VOUT becomes 14.5V or higher, the
over voltage limit works, and turns off the output Tr, and prevents the SW terminal and the VOUT terminal from
exceeding the absolute maximum ratings.
At this moment, the IC changes from its action condition into its non action condition, and the output voltage goes down
slowly. And, when the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage goes
on up to 14.5V once again.
This protection action is shown in Figure 16.
COUT
SW
VOUT
OVER Detector
OVER VOLTAGE REF
driver
UNDER Detector
UNDER VOLTAGE REF
Control
Figure 16. Block diagram of short-circuit protection and over voltage
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BD6071HFN
4) Thermal shut down
BD6071HFN has thermal shut down function.
The thermal shut down works at 175°C or higher, and while holding the setting of EN control from the outside, the IC
changes from its action condition into its non action condition. And at 175°C or below, the IC gets back to its normal
action.
●Start Control and Brightness Control
BD6071HFN can control the start conditions by its EN terminal, and power off at 0.4V or below, and power on at 1.4V or
higher. And by changing the duty of power on and off by PWM control, the LED brightness can be adjusted.
Two techniques are available for the brightness adjustment. One is discrete time (PWM) adjustment, and the other is
continuous time adjustment.
1) PWM brightness adjustment is made by giving PWM signal to EN as shown in Figure 17.
The BD6071HFN power on/off is according to the PWM signal. By this method, LED current is controlled from 0 to the
maximum current. The average LED current increases in proportion with the duty cycle of PWM signal. While in PWM
off-cycle mode, the IC and LED both consume no currents, thus providing a high-efficiency operation. And please don’t
use duty less than 5% or more than 95% of current setting for the brightness adjustment because of the influence of
turning on and off operating is large. The recommended PWM frequency is 100Hz ~ 300Hz.
22µH
VIN
SW
VIN
VOUT
PWM
1µF
EN
TEST
GNDA
GND
VFB
24Ω
Figure 17. The brightness adjustment example of EN terminal by PWM (fPWM = 100Hz ~ 300Hz)
2-1) The continuous time the brightness adjustment is made by giving DC control voltage to VFB pin of BD6071HFN via a
series resistor as shown in Figure 18. LED luminance (current) changed by giving DC voltage to VFB directly. DC voltage
is given from filtered one of DAC signal, or PWM signal shown in Figure 20. The advantage of this approach is that the
PWM signal to be used to control the LED brightness can be set to a high frequency (1kHz or higher). And please don’t
use duty less than 5% or more than 95% of current setting for the brightness adjustment.
LED current (ILED) is approximated by the following equation.
ILED = [{(VFB-DAC) / R1} × R2 + VFB ] / RFB
22μH
VIN
3030
2525
SW
VOUT
2020
1μF
EN
ILED
TEST
GNDA
GND
4.7kΩ
VFB
22kΩ
R2
R1
24Ω
RFB
ILED [mA]
VIN
1515
1010
55
00
-5-5
Figure 18. The brightness adjustment example by DAC
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0
DAC
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0.5
0.5
1
1
1.5 2 2.5
1.5DAC2 [V] 2.5
(VFB=500mV)
3
3
3.5
3.5
4
4
Figure 19. DAC adjustment
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12.OCT.2012 Rev.001
Datasheet
BD6071HFN
22μH
VIN
25
SW
VIN
VOUT
20
1μF
EN
TEST
GNDA
GND
VFB
33kΩ
47kΩ
100kΩ
PWM
10kHz
0～2.85V
ILED [mA]
ILED
15
10
30Ω
5
47nF
0
0
10
20
30
40
50
60
70
80
90
100
HI Duty [%]
Figure 20. The brightness adjustment example of
VFB terminal by PWM (fPWM=10kHz)
Figure 21. VFB PWM Control
2-2) The brightness adjustment of below is done in adjusting of R2 ON time by R1 and Duty cycle of PWM.
The minimum value of the LED current is decided by VFB/R1 at the PWM 0%, the maximum value of the LED current is
decided by VFB/R1+VFB/R2 at the PWM 100%.
ILED is given as shown below.
ILED=VFB / R1 + VFB / R2 × HI Duty
Standard PWM frequency is 100Hz~1kHz. And please don’t use duty less than 5% or more than 95% of current setting
for the brightness adjustment.
25
22μH
VIN
20
SW
VIN
ILED [mA]
VOUT
1μF
EN
15
10
TEST
GNDA
GND
5
VFB
R2
47Ω
R1
47Ω
0
0
PWM
1kHz
50 60 70 80 90 100
HI Duty [%]
Figure 22. The brightness adjustment example of VFB terminal
by PWM (fPWM=100Hz ~ 1kHz)
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Figure 23. VFB PWM Control
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Datasheet
BD6071HFN
●Setting Range of LED Current
LED current is determined by the voltage of VFB
and the resistor connected to VFB terminal.
ILED is given as shown below.
ILED=VFB/RFB
The current in the standard application is as shown below.
VFB=0.5V, RFB=24Ω
ILED=20.8mA
22μH
VIN
1μF
SW
VIN
VOUT
PWM
EN
1μF
ILED
TEST
GNDA
GND
VFB
RFB
24Ω
Figure 24. Recommended circuit diagram
The shaded portion in the figure below is the setting range of LED current to become the standard. In case of using 2LED,
LED current might increase due to over boosting when VOUT is less than 5.5V. Therefore some ICs may not be used at
desired currents. Consequently, for the proper setting of LED current, thoroughly check it for the suitability under use
conditions including applicable power supply voltage and temperature.
VIN=4.2V to 5.5V
70
70
60
60
50
50
40
30
2LED
20
VIN=3.1V to 4.2V
80
ILED [mA]
ILED [mA]
80
40
30
2LED
20
3LED
3LED
10
10
0
5.5
0
7
8
9
10
11
12
13
14
7
8.5
10
11.5
13
14
VOUT [V]
VOUT [V]
Figure 25. LED Setting range of LED current
●Selection of External Parts
Recommended external parts are as shown below.
・Coil
Value
Tolerance
Manufacturer
22μH
±10%
MURATA
22μH
±20%
22μH
22μH
Product number
Size (mm)
DCR(Ω)
W
L
H
LQH32CN220K53
2.5
3.2
1.55
0.71
TDK
VLF3012AT220MR33
2.6
2.8
1.2
0.66
±20%
Coil Craft
DO1608
4.45
6.6
2.92
0.37
±20%
TDK
VLF3010AT220MR33
2.6
2.8
1.0
1.30
Please refer to the reference data of p.4, p.5 for the change in the efficiency when the coil is changed.
・Capacitor
Value
Manufacturer
Product number
Size (mm)
L
W
H
Temperature
range
<CIN>
1µF
MURATA
GRM188B11A105K
1.6
0.8
0.8
-25°C to +85°C
MURATA
GRM188B31E105K
1.6
0.8
0.8
-25°C to +85°C
<COUT>
1µF
・Resistor
Value
Tolerance
Manufacturer
Product number
Size (mm)
L
W
H
0.6
0.3
0.23
<RFB>
24Ω
±1%
ROHM
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Datasheet
BD6071HFN
The coil is the part that is most influential to efficiency. Select the coil whose direct current resistor (DCR) and current inductance characteristic is excellent. The BD6071HFN is designed for the inductance value of 22µH. Do not use other
inductance value. Select a capacitor of ceramic type with excellent frequency and temperature characteristics. Further,
select Capacitor to be used for CIN/COUT with small direct current resistance, and pay sufficient attention to the PCB
layout shown in the next page.
●PCB Layout
In order to make the most of the performance of this IC, its PCB layout is very important. Characteristics such as efficiency
and ripple and the likes change greatly with layout, which please note carefully.
To battery power source
CIN
GNDA
VIN
COUT
EN
TEST
RFB
VFB
L1
VOUT
SW
GND
To battery GND
Figure 26. PCB Layout Image
Connect the input bypath capacitor CIN nearest to between VIN and GNDA pin, as shown in the upper diagram. Thereby,
the input voltage ripple of the IC can be reduced. And, connect the output capacitor COUT nearest to between VOUT and
GND pin. Thereby, the output voltage ripple of the IC can be reduced. Connect the current setting RFB nearest to VFB pin.
Connect the GND connection side of RFB directly to GND pin. Connect the GNDA pin directly to GND pin. When those pins
are not connected directly near the chip, influence is given to the performance of BD6071HFN and may limit the current
drive performance. As for the wire to the inductor, make its resistance component small so as to reduce electric power
consumption and increase the entire efficiency. And keep the pins that are subject to the influence like VFB pin away from
the wire to SW.
<Heat radiation PAD of back side>
PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GNDA pin (analog ground).
Moreover, connect ground plane (GNDA) of board using via as shown in the patterns of next page.
The efficiency of heat radiation improves according to the area of ground plane (GNDA).
The PCB layout in consideration of these is shown in the Figure 28.
112mVpp
VOUT
(VIN=3.6V, Ta=25°C, VOUT=14V, 20mA Load)
Figure 27. Output noise
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Datasheet
BD6071HFN
●Recommended PCB Layout
Front surface (Top view)
Bottom surface (Top view)
Figure 28. PCB Layout
●Attention Point of PCB Layout
In PCB design, the wiring of power supply line should be low Impedance, and put the bypass capacitor if necessary.
Especially the wiring impedance must be lower around the DC/DC converter.
●About Heat Loss
In heat design, operate the DC/DC converter in the following condition.
(The following temperature is a guarantee temperature, so consider the margin.)
1. Periphery temperature Ta must be less than 85°C.
2. The loss of IC must be less than dissipation Pd.
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Datasheet
BD6071HFN
●Operational Notes
1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply
terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an
electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem
including the occurrence of capacity dropout at a low temperature, thus determining the constant.
5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
12) Thermal shutdown circuit (TSD)
When junction temperatures become 175°C (Typ.) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not
aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or
use the LSI assuming its operation.
13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
14) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0G3G0C200380-1-2
12.OCT.2012 Rev.001
Datasheet
BD6071HFN
●Ordering Information
B
D
6
0
7
1
H
F
N
-
Package
HFN : HSON8
Part
Number
TR
Packaging and forming specification
TR: Embossed tape and reel
●Marking Diagram
HSON8 (TOP VIEW)
Part Number Marking
B D 6
LOT Number
0 7 1
1PIN MARK
●Physical Dimensions Tape and Reel Information
HSON8
<Tape and Reel information>
0.475
6
5
2
3
4
1PIN MARK
(0.2)
1
+0.03 0.6MAX
0.02 –0.02
5
6
7
8
(1.8)
(0.45)
3.0 ± 0.2
2.8 ± 0.1
8 7
(0.05)
(2.2)
4
3
2
(0.3)
(0.15)
(0.2)
2.9±0.1
(MAX 3.1 include. BURR)
1
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
+0.1
0.13 –0.05
)
1pin
S
0.65
0.1 S
0.32±0.1
0.08
M
Direction of feed
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/16
TSZ02201-0G3G0C200380-1-2
12.OCT.2012 Rev.001
Datasheet
BD6071HFN
●Revision History
Date
Revision
12.Oct.2012
001
Changes
New Release
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0G3G0C200380-1-2
12.OCT.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.