SmartRF06EB User’s Guide

User’s Guide
SWRU321A – May 2013
SmartRF06 Evaluation Board
User’s Guide
SmartRF™ is a trademark of Texas Instruments
User’s Guide
SWRU321A – May 2013
Table of Contents
4.1
4.1.1
4.1.2
5.1
6.1
6.1.1
6.2
6.2.1
6.2.2
6.2.3
6.3
6.3.1
6.3.2
6.3.3
6.4
6.5
6.6
6.7
6.8
6.9
6.9.1
6.9.2
6.10
6.11
6.11.1
6.11.2
6.11.3
6.11.4
6.12
6.12.1
6.12.2
7.1
7.2
7.3
INSTALLING SMARTRF STUDIO AND USB DRIVERS ................................................................ 7
SmartRF Studio ................................................................................................................. 7
FTDI USB driver ................................................................................................................ 7
ABSOLUTE MAXIMUM RATINGS ........................................................................................... 11
XDS100V3 EMULATOR...................................................................................................... 13
UART back channel ........................................................................................................ 14
POWER SOURCES ............................................................................................................. 14
USB Power ...................................................................................................................... 15
Battery Power .................................................................................................................. 15
External Power Supply .................................................................................................... 16
POWER DOMAINS .............................................................................................................. 17
XDS Domain ................................................................................................................... 17
EM Domain...................................................................................................................... 17
3.3 V Domain .................................................................................................................. 18
LCD ................................................................................................................................. 18
MICRO SD CARD SLOT ...................................................................................................... 19
ACCELEROMETER .............................................................................................................. 19
AMBIENT LIGHT SENSOR .................................................................................................... 20
BUTTONS .......................................................................................................................... 20
LEDS ............................................................................................................................... 21
General Purpose LEDs ................................................................................................... 21
XDS100v3 Emulator LEDs .............................................................................................. 21
EM CONNECTORS ............................................................................................................. 21
BREAKOUT HEADERS AND JUMPERS ................................................................................... 23
I/O Breakout Headers ..................................................................................................... 23
XDS100v3 Emulator Bypass Headers ............................................................................ 24
20-pin ARM JTAG Header .............................................................................................. 25
10-pin ARM Cortex Debug Header ................................................................................. 26
CURRENT MEASUREMENT .................................................................................................. 27
High-side current sensing ............................................................................................... 27
Current Measurement Jumper ........................................................................................ 27
20-PIN ARM JTAG HEADER .............................................................................................. 29
10-PIN ARM CORTEX DEBUG HEADER ............................................................................... 29
CUSTOM STRAPPING ......................................................................................................... 30
List of Figures
Figure 1 – Driver install: a) Update driver, b) Specify path to FTDI drivers..................................... 8
Figure 2 – Driver install: a) VCP loaded and b) drivers successfully installed ................................ 8
Figure 3 – SmartRF06EB (rev. 1.2.1) with EM connected ............................................................ 10
Figure 4 – SmartRF06EB architecture .......................................................................................... 12
Figure 5 – SmartRF06EB revision 1.2.1 front side ........................................................................ 13
Figure 6 – SmartRF06EB revision 1.2.1 reverse side ................................................................... 13
Figure 7 – Jumper mounted on J5 to enable the UART back channel ......................................... 14
Figure 8 – Main power switch (P501) and source selection switch (P502) ................................... 15
Figure 9 – SmartRF06EB power selection switch (P502) in “USB” position ................................. 15
Figure 10 – SmartRF06EB power source selection switch (P502) in “BAT” position ................... 16
Figure 11 – SmartRF06EB external power supply header (J501) ................................................ 16
Figure 12 – Power domain overview of SmartRF06EB ................................................................. 17
Figure 13 – Mount a jumper on J502 to bypass EM domain voltage regulator ............................. 18
Figure 14 – Simplified schematic of Ambient Light Sensor setup ................................................. 20
Figure 15 – SmartRF06EB EM connectors RF1 and RF2 ............................................................ 21
Page 3/32
User’s Guide
SWRU321A – May 2013
Figure 16 – SmartRF06EB I/O breakout overview ........................................................................ 23
Figure 17 – XDS100v3 Emulator Bypass Header (P408) ............................................................. 24
Figure 18 – 20-pin ARM JTAG header (P409) .............................................................................. 25
Figure 19 – 10-pin ARM Cortex Debug header (P410) ................................................................. 26
Figure 20 – Simplified schematic of high-side current sensing setup ........................................... 27
Figure 21 – Measuring current consumption using jumper J503 .................................................. 27
Figure 22 – Simplified connection diagram for different debugging scenarios ............................. 28
Figure 23 – Debugging external target using SmartRF06EB ........................................................ 29
Figure 24 – ARM JTAG header (P409) with strapping to debug external target .......................... 30
List of Tables
Table 1 – SmartRF06EB features ................................................................................................... 5
Table 2 – Supply voltage: Recommended operating conditions and absolute max. ratings ........ 11
Table 3 – Temperature: Recommended operating conditions and storage temperatures ........... 11
Table 4 – UART Back channel signal connections ....................................................................... 14
Table 5 – Power domain overview of SmartRF06EB .................................................................... 17
Table 6 – LCD signal connections ................................................................................................. 19
Table 7 – Micro SD Card signal connections ................................................................................ 19
Table 8 – Accelerometer signal connections ................................................................................. 20
Table 9 – Ambient Light Sensor signal connections ..................................................................... 20
Table 10 – Button signal connections ........................................................................................... 20
Table 11 – General purpose LED signal connections ................................................................... 21
Table 12 – EM connector RF1 pin-out........................................................................................... 22
Table 13 – EM connector RF2 pin-out........................................................................................... 22
Table 14 – SmartRF06EB I/O breakout overview ......................................................................... 24
Table 15 – 20-pin ARM JTAG header pin-out (P409) ................................................................... 25
Table 16 – 10-pin ARM Cortex Debug header pin-out (P410) ...................................................... 26
Table 17 – Debugging external target: Minimum strapping (cJTAG support) ............................... 30
Table 18 – Debugging external target: Optional strapping ............................................................ 30
Page 4/32
User’s Guide
SWRU321A – May 2013
1 Introduction
The SmartRF06 Evaluation Board (SmartRF06EB or simply EB) is the motherboard in
development kits for Low Power RF ARM Cortex®-M based System on Chips from Texas
Instruments. The board has a wide range of features, listed in Table 1 below.
Component
Description
TI XDS100v3 Emulator
cJTAG and JTAG emulator for easy programming and
debugging of SoCs on Evaluation Modules or external targets.
Easy plug and play access to full SoC control using SmartRF™
Studio PC software. Integrated serial port over USB enables
communication between the SoC via the UART back channel.
Big LCD display for demo use and user interface development.
Four general purpose LEDs for demo use or debugging.
External flash for extra storage, over-the-air upgrades and more.
Five push-buttons for demo use and user interfacing.
Three-axis highly configurable digital accelerometer for
application development and demo use.
Ambient Light Sensor for application development and demo
use.
Current sense amplifier for high side current measurements.
Easy access to SoC GPIO pins for quick and easy debugging.
High-speed USB 2.0
interface
64x128 pixels serial LCD
LEDs
Micro SD card slot
Buttons
Accelerometer
Light Sensor
Current measurement
Breakout pins
Table 1 – SmartRF06EB features
2 About this manual
This manual contains reference information about the SmartRF06EB.
Chapter 4 will give a quick introduction on how to get started with the SmartRF06EB. It describes
how to install SmartRF™ Studio to get the required USB drivers for the evaluation board. Chapter
5 briefly explains how the EB can be used throughout a project’s development cycle. Chapter 6
gives an overview of the various features and functionality provided by the board.
A troubleshooting guide is found in chapter 8 and Appendix A contains the schematics for
SmartRF06EB revision 1.2.1.
The PC tools SmartRF™ Studio and SmartRF™ Flash Programmer have their own user manual.
See chapter 9 for references to relevant documents and web pages.
Page 5/32
User’s Guide
SWRU321A – May 2013
3 Acronyms and Abbreviations
ALS
Ambient Light Sensor
cJTAG
Compact JTAG (IEEE 1149.7)
CW
Continuous Wave
DK
Development Kit
EB
Evaluation Board
EM
Evaluation Module
FPGA
Field-Programmable Gate Array
I/O
Input/Output
JTAG
Joint Test Action Group (IEEE 1149.1)
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LPRF
Low Power RF
MCU
Micro Controller
MISO
Master In, Slave Out (SPI signal)
MOSI
Master Out, Slave In (SPI signal)
NA
Not Applicable / Not Available
NC
Not Connected
RF
Radio Frequency
RTS
Request to Send
RX
Receive
SoC
System on Chip
SPI
Serial Peripheral Interface
TI
Texas Instruments
TP
Test Point
TX
Transmit
UART
Universal Asynchronous Receive Transmit
USB
Universal Serial Bus
VCP
Virtual COM Port
Page 6/32
User’s Guide
SWRU321A – May 2013
4 Getting Started
Before connecting the SmartRF06EB to the PC via the USB cable, it is highly recommended to
perform the steps described below.
4.1 Installing SmartRF Studio and USB drivers
Before your PC can communicate with the SmartRF06EB over USB, you will need to install the
USB drivers for the EB. The latest SmartRF Studio installer [1] includes USB drivers both for
Windows x86 and Windows x64 platforms.
After you have downloaded SmartRF Studio from the web, extract the zip-file, run the installer
and follow the instructions. Select the complete installation to include the SmartRF Studio
program, the SmartRF Studio documentation and the necessary drivers needed to communicate
with the SmartRF06EB.
4.1.1 SmartRF Studio
SmartRF Studio is a PC application developed for configuration and evaluation of many RF-IC
products from Texas Instruments. The application is designed for use with SmartRF Evaluation
Boards, such as SmartRF06EB, and runs on Microsoft Windows operating systems.
SmartRF Studio lets you explore and experiment with the RF-ICs as it gives full overview and
access to the devices’ registers to configure the radio and has a control interface for simple radio
operation from the PC.
This means that SmartRF Studio will help radio system designers to easily evaluate the RF-IC at
an early stage in the design process. It also offers a flexible code export function of radio register
settings for software developers.
The latest version of SmartRF Studio can be downloaded from the Texas Instruments website [1],
where you will also find a complete user manual.
4.1.2 FTDI USB driver
SmartRF PC software such as SmartRF Studio uses a proprietary USB driver from FTDI [2] to
communicate with SmartRF06 evaluation boards. Connect your SmartRF06EB to the computer
with a USB cable and turn it on. If you did a complete install of SmartRF Studio, Windows will
recognize the device automatically and the SmartRF06EB is ready for use!
4.1.2.1 Install FTDI USB driver manually in Windows
If the SmartRF06EB was not properly recognized after plugging it into your PC, try the following
steps to install the necessary USB drivers. The steps described are for Microsoft Windows 7, but
are very similar to those in Windows XP and Windows Vista. It is assumed that you have already
downloaded and installed the latest version of SmartRF Studio 7 [1].
Open the Windows Device Manager and right click on the first “Texas Instruments XDS100v3”
found under “Other devices” as shown in Figure 1a.
Select “Update Driver Software…” and, in
<Studio install dir>\Drivers\ftdi as shown in Figure 1b.
Page 7/32
the
appearing
dialog,
browse
to
User’s Guide
SWRU321A – May 2013
a)
b)
Figure 1 – Driver install: a) Update driver, b) Specify path to FTDI drivers
Press Next and wait for the driver to be installed. The selected device should now appear in the
Device Manager as “TI XDS100v3 Channel x” (x = A or B) as seen in Figure 2b. Repeat the
above steps for the second “Texas Instruments XDS100v3” listed under “Other devices”.
4.1.2.1.1 Enable XDS100v3 UART back channel on Windows
If you have both “TI XDS100v3 Channel A” and “TI XDS100v3 Channel B” listed under Universal
Serial Bus Controllers, you can proceed. Right click on “TI XDS100v3 Channel B” and select
Properties. Under the Advanced tab, make sure “Load VCP” is checked as shown in Figure 2a.
A “USB Serial Port” may be listed under “Other devices”, as seen in Figure 1a. Follow the same
steps as for the “Texas Instruments XDS100v3” devices to install the VCP driver. When the
drivers from <Studio install dir>\Drivers\ftdi is properly installed, you should see the USB Serial
Port device be listed under “Ports (COM & LPT)” as shown in Figure 2b.
The SmartRF06EB drivers are now installed correctly.
Figure 2 – Driver install: a) VCP loaded and b) drivers successfully installed
Page 8/32
User’s Guide
SWRU321A – May 2013
4.1.2.2 Install XSD100v3 UART back channel on Linux
The ports on SmartRF06EB will typically be mounted as ttyUSB0 or ttyUSB1. The UART back
channel is normally mounted as ttyUSB1.
1.
2.
3.
4.
Download the Linux drivers from [2].
Untar the ftdi_sio.tar.gz file on your Linux system.
Connect the SmartRF06EB to your system.
Install driver
a. Verify the USB Product ID (PID) and Vendor ID (VID).
The TI XDS100v3 USB VID is 0x0403 and the PID is 0xA6D1, but if you wish to
find the PID using a terminal window/shell, use
> lsusb | grep -i future
b. Install driver using modprobe
In a terminal window/shell, navigate to the ftdi_sio folder and run
> sudo modprobe ftdi_sio vendor=0x403 product=0xA6D1
SmartRF06EB should now be correctly mounted. The above steps have been tested on Fedora
and Ubuntu distributions.
If the above steps failed, try uninstalling ‘brltty’ prior to step 5 (technical note TN_101, [2]).
> sudo apt-get remove brltty
Page 9/32
User’s Guide
SWRU321A – May 2013
5 Using the SmartRF06 Evaluation Board
The SmartRF06EB is a flexible test and development platform that works together with RF
Evaluation Modules from Texas Instruments.
An Evaluation Module (EM) is a small RF module with RF chip, balun, matching filter, SMA
antenna connector and I/O connectors. The modules can be plugged into the SmartRF06EB
which lets the PC take direct control of the RF device on the EM over the USB interface.
SmartRF06EB currently supports:
-
CC2538EM
SmartRF06EB is included in e.g. the CC2538 development kit.
Figure 3 – SmartRF06EB (rev. 1.2.1) with EM connected
The PC software that controls the SmartRF06EB + EM is SmartRF Studio. Studio can be used to
perform several RF tests and measurements, e.g. to set up a CW signal and send/receive
packets.
Page 10/32
User’s Guide
SWRU321A – May 2013
The EB+EM can be of great help during the whole development cycle for a new RF product.
-
Perform comparative studies. Compare results obtained with EB+EM with results from
your own system.
-
Perform basic functional tests of your own hardware by connecting the radio on your
board to SmartRF06EB. SmartRF Studio can be used to exercise the radio.
-
Verify your own software with known good RF hardware, by simply connecting your own
microcontroller to an EM via the EB. Test the send function by transmitting packets from
your SW and receive with another board using SmartRF Studio. Then transmit using
SmartRF Studio and receive with your own software.
-
Develop code for your SoC and use the SmartRF06EB as a standalone board without PC
tools.
The SmartRF06EB can also be used as a debugger interface to the SoCs from IAR Embedded
workbench for ARM or Code Composer Studio from Texas Instruments. For details on how to use
the SmartRF06EB to debug external targets, see chapter 7.
5.1 Absolute Maximum Ratings
The minimum and maximum operating supply voltages and absolute maximum ratings for the
active components onboard the SmartRF06EB are summarized in Table 2. Table 3 lists the
recommended operating temperature and storage temperature ratings. Please refer to the
respective component’s datasheet for further details.
Operating voltage
Component
1
XDS100v3 Emulator [4]
LCD [5]
Accelerometer [6]
Ambient light sensor [7]
Min. [V]
+1.8
+3.0
+1.62
2
+2.3
Max. [V]
+3.6
+3.3
+3.6
+5.5
Absolute max. rating
Min. [V]
-0.3
-0.3
-0.3
NA
Max. [V]
+3.75
+3.6
+4.25
+6
Table 2 – Supply voltage: Recommended operating conditions and absolute max. ratings
Component
XDS100v3 Emulator [4]
LCD [5]
Accelerometer [6]
Ambient light sensor [7]
Operating temperature
Min. [˚C]
-20
-20
-40
-40
Max. [˚C]
+70
+70
+85
+85
Storage temperature
Min. [˚C]
-50
-30
-50
-40
Max. [˚C]
+110
+80
+150
+85
Table 3 – Temperature: Recommended operating conditions and storage temperatures
1
2
The XDS100v3 Emulator is USB powered. Values refer to the supply and I/O pin voltages of the connected target.
Recommended minimum operating voltage.
Page 11/32
User’s Guide
SWRU321A – May 2013
6 SmartRF06 Evaluation Board Overview
SmartRF06EB acts as the motherboard in development kits for ARM® Cortex™ based Low
Power RF SoCs from Texas Instruments. The board has several user interfaces and connections
to external interfaces, allowing fast prototyping and testing of both software and hardware. An
overview of the SmartRF06EB architecture is found in Figure 4. The board layout is found in
Figure 5 and Figure 6, while the schematics are located in Appendix A.
This chapter will give an overview of the general architecture of the board and describe the
available I/O. The following sub-sections will explain the I/O in more detail. Pin connections
between the EM and the evaluation board I/O can be found in section 6.10.
EM Domain (1.8 – 3.6 V)
Light Sensor
Buttons
LEDs
Accelerometer
I/O Breakout Headers
EM Connectors
20-pin
ARM JTAG
Header
(c)JTAG
UART back
channel
3.3 V Domain
Enable
Bypass Header
I/O breakout headers
10-pin
ARM Cortex
Debug Header
Level shifter
Load switch
XDS100v3
Emulator
LCD
XDS
LEDs
SD Card Reader
USB
XDS Domain
3.3 V Domain
Figure 4 – SmartRF06EB architecture
Page 12/32
Level shifter
User’s Guide
SWRU321A – May 2013
EM I/O breakout
EM connectors
Ambient Light
Sensor
XDS LEDs
EM current
measurement
testpoint and
jumper
LEDs
Accelerometer
XDS bypass
header
Main power
switch
Power source
selection switch
20-pin ARM
JTAG Header
EM reset button
UART back
channel enable
Jumper
Regulator
bypass jumper
10-pin ARM
Cortex Header
External power
supply connector
General purpose
buttons
LCD
UART back
channel
breakout
Micro SD
card slot
Figure 5 – SmartRF06EB revision 1.2.1 front side
XDS100v3
Emulator
1.5 V AAA
Alkaline Battery
holder
1.5 V AAA
Alkaline Battery
holder
CR2032 coin
cell battery
holder
Figure 6 – SmartRF06EB revision 1.2.1 reverse side
6.1 XDS100v3 Emulator
The XDS100v3 Emulator from Texas Instruments has cJTAG and regular JTAG support. cJTAG
is a 2-pin extension to regular 4-pin JTAG. The XDS100v3 consists of a USB to JTAG chip from
FTDI [2] and an FPGA to convert JTAG instructions to cJTAG format.
Page 13/32
User’s Guide
SWRU321A – May 2013
In addition to regular debugging capabilities using cJTAG or JTAG, the XDS100v3 Emulator
supports a UART backchannel over a USB Virtual COM Port (VCP) to the PC. The UART back
channel supports flow control, 8-N-1 format and data rates up to 12Mbaud.
Please see the XDS100v3 emulator product page [4] for detailed information about the emulator.
The XDS100v3 Emulator is powered over USB and is switched on as long as the USB cable is
connected to the SmartRF06EB and the main power switch (S501) is in the ON position. The
XDS100v3 Emulator supports targets with operating voltages between 1.8 V and 3.6. The min
(max) operating temperature is -20 (+70) ˚C.
6.1.1 UART back channel
The mounted EM can be connected to the PC via the XDS100v3 Emulator’s UART back channel.
When connected to a PC, the XDS100v3 is enumerated as a Virtual COM Port (VCP) over USB.
The driver used is a royalty free VCP driver from FTDI, available for e.g. Microsoft Windows,
Linux and Max OS X. The UART back channel gives the mounted EM access to a four pin UART
interface, supporting 8-N-1 format at data rates up to 12 Mbaud.
To enable the SmartRF06EB UART back channel the “Enable UART over XDS100v3” jumper
(J5), located on the lower right side of the EB, must be mounted (Figure 7). Table 4 shows an
overview of the I/O signals related to UART Back Channel.
Figure 7 – Jumper mounted on J5 to enable the UART back channel
Signal name
Description
Probe header
EM pin
RF1.7_UART_RX
RF1.9_UART_TX
RF1.3_UART_CTS
RF2.18_UART_RTS
UART Receive (EM data in)
UART Transmit (EM data out)
UART Clear To Send signal
UART Request To Send signal
EM_UART_RX (P412.2)
EM_UART_TX (P412.3)
EM_UART_CTS (P412.4)
EM_UART_RTS (P412.5)
RF1.7
RF1.9
RF1.3
RF2.18
Table 4 – UART Back channel signal connections
6.2 Power Sources
There are three ways to power the SmartRF06EB; batteries, USB bus and external power supply.
The power source can be selected using the power source selection switch (S502) seen in Figure
8. The XDS100v3 Emulator can only be powered over USB. The main power supply switch
(S501) cuts power to the SmartRF06EB.
Never connect batteries and an external power source to the SmartRF06EB at the
same time! Doing so may lead to excessive currents that may damage the batteries
or cause onboard components to break. The CR2032 coin cell battery is in particular
very sensitive to reverse currents (charging) and must never be combined with other
power sources (AAA batteries or an external power source).
Page 14/32
User’s Guide
SWRU321A – May 2013
Figure 8 – Main power switch (P501) and source selection switch (P502)
6.2.1 USB Power
When the SmartRF06EB is connected to a PC via a USB cable, it can draw power from the USB
bus. The onboard voltage regulator supplies approximately 3.3 V to the mounted EM and the EB
peripherals. To power the mounted EM and the EB peripherals from the USB bus, the power
source selection switch (S502) should be in “USB” position (Figure 9).
3
The maximum current consumption is limited by the regulator to 1500 mA .
Figure 9 – SmartRF06EB power selection switch (P502) in “USB” position
6.2.2 Battery Power
The SmartRF06EB can be powered using two 1.5 V AAA alkaline batteries or a 3 V CR2032 coin
cell battery. The battery holders for the AAA batteries and the CR2032 coin cell battery are
located on the reverse side of the PCB. To power the mounted EM and the EB peripherals using
batteries, the power source selection switch (S502) should be in “BAT” position (Figure 10).
When battery powered, the EM power domain is by default regulated to 2.1 V. The voltage
regulator may be bypassed by mounting a jumper on J502. See section 6.3.2 for more details.
Do not power the SmartRF06EB using two 1.5 V AAA batteries and a 3 V CR2032
coin cell battery at the same time. Doing so may lead to excessive currents that may
damage the batteries or cause onboard components to break.
3
Note that most USB power sources are limited to 500 mA.
Page 15/32
User’s Guide
SWRU321A – May 2013
Figure 10 – SmartRF06EB power source selection switch (P502) in “BAT” position
6.2.3 External Power Supply
The SmartRF06EB can be powered using an external power supply. To power the mounted EM
and the EB peripherals using an external power supply, the power source selection switch (S502)
should be in “BAT” position (Figure 10 in section 6.2.2).
The external supply’s ground should be connected to the SmartRF06EB ground, e.g. to the
ground pad in the top left corner of the EB. Connect the positive supply connector to the external
power header J501 (Figure 11). The applied voltage must be in the range from 2.1 V to 3.6 V and
limited to max 1.5 A.
When powered by an external power supply, the EM power domain is by default regulated to
2.1 V. The voltage regulator may be bypassed by mounting a jumper on J502. See section 6.3.2
for more details.
There is a risk of damaging the onboard components if the applied voltage on the
external power connector/header is lower than -0.3 V or higher than 3.6 V
(combined absolute maximum ratings for onboard components). See section 5.1 for
further information.
Figure 11 – SmartRF06EB external power supply header (J501)
Page 16/32
User’s Guide
SWRU321A – May 2013
6.3 Power Domains
The SmartRF06EB is divided into three power domains, described in detail in the following
sections. The SmartRF06EB components, and what power domain they belong to, is shown in
Figure 12 and Table 5 below.
Mounted EM
XDS domain
(3.3 V)
Level
EM domain
(1.8 - 3.6 V)
Level
3.3 V domain
(3.3 V)
XDS100v3, XDS LEDs
shifters
ACC, ALS, keys, LEDs
shifters
LCD, SD card
Power sources
USB, batteries, external supply
Figure 12 – Power domain overview of SmartRF06EB
Component
Power domain
Power source
Evaluation Module
General Purpose LEDs
Accelerometer
Ambient Light Sensor
Current measurement
MCU
LEDs
XDS100v3 Emulator
XDS100v3 LEDs
SD Card Slot
LCD
EM domain (LO_VDD)
EM domain (LO_VDD)
EM domain (LO_VDD)
EM domain (LO_VDD)
EM domain (LO_VDD)
USB, battery, external
USB, battery, external
USB, battery, external
USB, battery, external
USB, battery, external
EM domain (LO_VDD)
XDS domain
XDS domain
3.3 V domain (HI_VDD)
3.3 V domain (HI_VDD)
USB, battery, external
USB
USB
Same as EM domain
Same as EM domain
MSP
Table 5 – Power domain overview of SmartRF06EB
6.3.1 XDS Domain
The XDS100v3 Emulator (see section 6.1) onboard the SmartRF06EB is in the XDS domain. The
XDS domain is powered over USB. The USB voltage supply (+5 V) is down-converted to +3.3 V
and +1.5 V for the different components of the XDS100v3 Emulator.
The SmartRF06EB must be connected to e.g. a PC over USB for the XDS domain to be powered
up. The domain is turned on/off by the SmartRF06EB main power switch.
6.3.2 EM Domain
The mounted EM board and most of the SmartRF06EB peripherals are powered in the EM
domain and signals in this domain (accessible by the EM), are prefixed “LV_” in the schematics.
Table 5 lists the EB peripherals that are powered in the EM domain. The domain is turned on/off
by the SmartRF06EB power switch.
Page 17/32
User’s Guide
SWRU321A – May 2013
The EM domain may be powered using various power sources; USB powered (regulated to 3.3
V), battery powered (regulated to 2.1 V or unregulated) and using an external power supply
(regulated to 2.1 V or unregulated).
When battery powered or powered by an external source, the EM power domain is by default
regulated to 2.1 V using a step down converter. The step down converter may be bypassed by
mounting a jumper on J502 (Figure 13), powering the EM domain directly from the source. When
J502 is not mounted, the EM power domain is regulated to 2.1 V. The maximum current
consumption of the EM power domain is then limited by the regulator to 410 mA.
Figure 13 – Mount a jumper on J502 to bypass EM domain voltage regulator
NOTE: Mounting a jumper on J502 will not have any effect if the SmartRF06EB is powered
over USB (when the power source selection switch, S502, is in “USB” position).
6.3.3 3.3 V Domain
The 3.3 V domain is a sub domain of the EM domain. The 3.3 V domain is regulated to 3.3 V
using a buck-boost converter, irrespective of the source powering the EM domain. Signals in the
3.3V domain (controlled by the EM) are prefixed “HV_” for High Voltage in the schematics.
Two EB peripherals are in the 3.3 V domain, the LCD and the SD card slot, as listed in Table 5.
These peripherals are connected to the EM domain via level shifters U401 and U402.
The 3.3 V domain may be switched on (off) completely by the mounted EM board by pulling
signal LV_3.3V_EN to a logical 1 (0). See Table 14 in section 6.11.1 for details about the
mapping between the EM and signals onboard the SmartRF06EB.
6.4 LCD
The SmartRF06EB comes with a 128x64 pixels display from Electronic Assembly (DOGM128E-6)
[4]. The LCD display is available to mounted EM via a SPI interface, enabling software
development of user interfaces and demo use. Table 6 shows an overview of the I/O signals
related to the LCD.
The recommended operating condition for the LCD display is a supply voltage between 3.0 V and
3.3 V. The LCD display is powered from the 3.3 V power domain (HI_VDD). The min (max)
operating temperature is -20 (+70) ˚C.
The LCD connector on SmartRF06EB is very tight to ensure proper contact between
the EM and the LCD. Be extremely cautious when removing the LCD to avoid the
display from breaking.
Page 18/32
User’s Guide
SWRU321A – May 2013
Signal name
LV_3.3V_EN
LV_LCD_MODE
LV_LCD_RESET
¯¯¯¯¯¯¯¯¯¯¯¯¯¯
LV_LCD_CS
¯¯¯¯¯¯¯¯¯¯
LV_SPI_SCK
LV_SPI_MOSI
Description
4
3.3 V domain enable signal
LCD mode signal
LCD reset signal (active low)
LCD Chip Select (active low)
SPI Clock
SPI MOSI (LCD input)
Probe header
EM pin
RF1.15 (P407.1)
RF1.11 (P406.7)
RF1.13 (P406.9)
RF1.17 (P407.3)
RF1.16_SCK (P407.2)
RF1.18_MOSI (P407.4)
RF1.15
RF1.11
RF1.13
RF1.17
RF1.16
RF1.18
Table 6 – LCD signal connections
6.5 Micro SD Card Slot
The SmartRF06EB has a micro SD card slot for connecting external SD/MMC flash devices (flash
device not included). A connected flash device is available to the mounted EM via a SPI interface,
giving it access to extra flash, enabling over-the-air upgrades and more. Table 8 shows an
overview of I/O signals related to the micro SD card slot.
The micro SD card is powered from the 3.3 V power domain (HI_VDD).
Signal name
LV_3.3V_EN
LV_SDCARD_CS
¯¯¯¯¯¯¯¯¯¯¯¯¯¯
LV_SPI_SCK
LV_SPI_MOSI
LV_SPI_MISO
Description
4
3.3 V domain enable signal
SD card Chip Select (active low)
SPI Clock
SPI MOSI (SD card input)
SPI MISO (SD card output)
Probe header
EM pin
RF1.15 (P407.1)
RF2.12 (P411.1)
RF1.16_SCK (P407.2)
RF1.18_MOSI (P407.4)
RF1.20_MISO (P407.5)
RF1.15
RF2.12
RF1.16
RF1.18
RF1.20
Table 7 – Micro SD Card signal connections
6.6 Accelerometer
The SmartRF06EB is equipped with a BMA250 digital accelerometer from Bosch Sensortech [6].
The accelerometer is available to the mounted EM via an SPI interface and has two dedicated
interrupt lines. The accelerometer is suitable for application development, prototyping and demo
use. Table 8 shows an overview of I/O signals related to the accelerometer.
The recommended operating condition for the accelerometer is a supply voltage between 1.62 V
and 3.6 V. The min (max) operating temperature is -40 (+85) ˚C.
Signal name
Description
Probe header
EM pin
LV_ACC_PWR
LV_ACC_INT1
LV_ACC_INT2
LV_ACC_CS
¯¯¯¯¯¯¯¯¯¯¯
LV_SPI_SCK
LV_SPI_MOSI
Acc. power enable signal
Acc. interrupt signal
Acc. interrupt signal
Acc. Chip Select (active low)
SPI Clock
SPI MOSI (acc. input)
RF2.8 (P407.8)
RF2.16 (P411.5)
RF2.14 (P411.3)
RF2.10 (P407.9)
RF1.16_SCK (P407.2)
RF1.18_MOSI (P407.4)
RF2.8
RF2.16
RF2.14
RF2.10
RF1.16
RF1.18
4
The LCD and SD card are both powered in the 3.3 V domain and cannot be powered on/off individually.
Page 19/32
User’s Guide
SWRU321A – May 2013
LV_SPI_MISO
SPI MISO (acc. output)
RF1.20_MISO (P407.5)
RF1.20
Table 8 – Accelerometer signal connections
6.7 Ambient Light Sensor
The SmartRF06EB has an analog SFH 5711 ambient light sensor (ALS) from Osram [7] that is
available for the mounted EM via the EM connectors, enabling quick application development for
demo use and prototyping. Figure 14 and Table 9 shows an overview of I/O signals related to the
ambient light sensor.
The recommended operating condition for the ambient light sensor is a supply voltage between
2.3 V and 5.5 V. The min (max) operating temperature is -40 (+85) ˚C.
LV_ALS_PWR
Ambient Light Sensor
LV_ALS_OUT
22 kOhm
Figure 14 – Simplified schematic of Ambient Light Sensor setup
Signal name
Description
Probe header
EM pin
LV_ALS_PWR
LV_ALS_OUT
ALS power enable signal
ALS output signal (analog)
RF2.6 (P407.7)
RF2.5 (P411.6)
RF2.6
RF2.5
Table 9 – Ambient Light Sensor signal connections
6.8 Buttons
There are 6 buttons on the SmartRF06EB. Status of the LEFT, RIGHT, UP, DOWN and SELECT
buttons are available to the mounted EM. These buttons are intended for user interfacing and
development of demo applications.
The EM RESET button resets the mounted EM by pulling its reset line low (RF2.15_RESET
¯¯¯¯¯¯¯¯¯¯¯¯¯).
Table 10 shows an overview of I/O signals related to the buttons.
Signal name
Description
Probe header
EM pin
LV_BTN_LEFT
LV_BTN_RIGHT
LV_BTN_UP
LV_BTN_DOWN
LV_BTN_SELECT
LV_BTN_RESET
¯¯¯¯¯¯¯¯¯¯¯¯¯¯
Left button (active low)
Right button (active low)
Up button (active low)
Down button (active low)
Select button (active low)
EM reset button (active low)
RF1.6 (P406.4)
RF1.8 (P406.5)
RF1.10 (P406.6)
RF1.12 (P406.8)
RF1.14 (P406.10)
¯¯¯¯¯¯¯¯¯¯¯¯¯ (P411.4)
RF2.15_RESET
RF1.6
RF1.8
RF1.10
RF1.12
RF1.14
RF2.15
Table 10 – Button signal connections
Page 20/32
User’s Guide
SWRU321A – May 2013
6.9 LEDs
6.9.1 General Purpose LEDs
The four LEDs D601, D602, D603, D604 can be controlled from the mounted EM and are suitable
for demo use and debugging. The LEDs are active high. Table 11 shows an overview of I/O
signals related to the LEDs.
Signal name
Description
Probe header
EM pin
LV_LED_1
LV_LED_2
LV_LED_3
LV_LED_4
LED 1 (red)
LED 2 (yellow)
LED 3 (green)
LED 4 (red-orange)
RF2.11 (P407.10)
RF2.13 (P411.2)
RF1.2 (P406.1)
RF1.4 (P406.2)
RF2.11
RF2.13
RF1.2
RF1.4
Table 11 – General purpose LED signal connections
6.9.2 XDS100v3 Emulator LEDs
The XDS100v3 emulator has two LEDs to indicate its status, D2 and D4. The LEDs are located
on the top side of the SmartRF06EB. LED D2 is lit whenever the XDS100v3 Emulator is powered,
while LED D4 (ADVANCED MODE) is lit when the XDS100v3 is in an active cJTAG debug state.
6.10 EM Connectors
The EM connectors, shown in Figure 15, are used for connecting an EM board to the
SmartRF06EB. The connectors RF1 and RF2 are the main interface and are designed to inhibit
incorrect mounting of the EM board. The pin-out of the EM connectors is given in Table 12 and
Table 13.
Figure 15 – SmartRF06EB EM connectors RF1 and RF2
Page 21/32
User’s Guide
SWRU321A – May 2013
EM pin
Signal name
Description
RF1.1
RF1.2
RF1.3
RF1.4
RF1.5
RF1.6
RF1.7
RF1.8
RF1.9
RF1.10
RF1.11
RF1.12
RF1.13
RF1.14
RF1.15
RF1.16
RF1.17
RF1.18
RF1.19
RF1.20
GND
RF1.2
RF1.3_UART_CTS
RF1.4
RF1.5
RF1.6
RF1.7_UART_RX
RF1.8
RF1.9_UART_TX
RF1.10
RF1.11
RF1.12
RF1.13
RF1.14
RF1.15
RF1.16_SPI_SCK
RF1.17
RF1.18_SPI_MOSI
GND
RF1.20_SPI_MISO
Ground
GPIO signal to EM board
UART back channel / GPIO
GPIO signal to EM board
GPIO signal to EM board
GPIO signal to EM board
UART back channel (EM RX)
GPIO signal to EM board
UART back channel (EM TX)
GPIO signal to EM board
GPIO signal to EM board
GPIO signal to EM board
GPIO signal to EM board
GPIO signal to EM board
GPIO signal to EM board
EM SPI Clock
GPIO signal to EM board
EM SPI MOSI
Ground
EM SPI MISO
Probe
header
Breakout
header
P406.1
P412.4
P406.2
P406.3
P406.4
P412.2
P406.5
P412.3
P406.6
P406.7
P406.8
P406.9
P406.10
P407.1
P407.2
P407.3
P407.4
P403.1-2
P408.15-16
P403.3-4
P403.5-6
P403.7-8
P408.11-12
P403.9-10
P408.13-14
P403.11-12
P403.13-14
P403.15-16
P403.17-18
P403.19-20
P404.1-2
P404.3-4
P404.5-6
P404.7-8
P407.5
P404.9-10
Table 12 – EM connector RF1 pin-out
EM pin
Signal name
Description
RF2.1
RF2.2
RF2.3
RF2.4
RF2.5
RF2.6
RF2.7
RF2.8
RF2.9
RF2.10
RF2.11
RF2.12
RF2.13
RF2.14
RF2.15
RF2.16
RF2.17
RF2.18
RF2.19
RF2.1_JTAG_TCK
GND
RF_VDD2
RF2.4_JTAG_TMS
RF2.5
RF2.6
RF_VDD1
RF2.8
RF_VDD1
RF2.10
RF2.11
RF2.12
RF2.13
RF2.14
¯¯¯¯¯¯¯¯¯¯¯¯¯
RF2.15_RESET
RF2.16
RF2.17_JTAG_TDI
RF2.18_UART_RTS
RF2.19_JTAG_TDO
JTAG Test Clock
Ground
EM power
JTAG Test Mode Select
GPIO signal to EM board
GPIO signal to EM board
EM power
GPIO signal to EM board
EM power
GPIO signal to EM board
GPIO signal to EM board
GPIO signal to EM board
GPIO signal to EM board
GPIO signal to EM board
EM reset signal (active low)
GPIO signal to EM board
GPIO / JTAG Test Data In
GPIO / UART Back Channel
GPIO / JTAG Test Data Out
RF2.20
GND
Ground
Probe
header
Breakout
header
P409.9
P408.1-2
TP10
P409.7
P407.6
P407.7
TP10
P407.8
TP10
P407.9
P407.10
P411.1
P411.2
P411.3
P411.4
P411.5
P409.5
P412.5
P409.13
J503.1-2
P408.3-4
P404.11-12
P404.13-14
J503.1-2
P404.15-16
J503.1-2
P404.17-18
P404.19-20
P405.1-2
P405.3-4
P405.5-6
P405.7-8
P405.9-10
P408.5-6
P408.17-18
P408.7-8
Table 13 – EM connector RF2 pin-out
Page 22/32
User’s Guide
SWRU321A – May 2013
6.11 Breakout Headers and Jumpers
The SmartRF06EB has several breakout headers, giving access to all EM connector pins. An
overview of the SmartRF06EB I/O breakout headers is given in Figure 16. Probe headers P406,
P407, P411 and P412 give access to the I/O signals of the mounted EM. Breakout headers P403,
P404 and P405 allow the user to map any EM I/O signal to any peripheral on the SmartRF06EB.
The XDS bypass header (P408) makes it possible to disconnect the XDS100v3 Emulator
onboard the EB from the EM. Using the 20-pin ARM JTAG header (P409) or the 10-pin ARM
Cortex Debug Header (P410), it is possible to debug external targets using the onboard emulator.
NOTE: By default, all jumpers are mounted on P403, P404, P405 and P408. The default
configuration is assumed in this user’s guide unless otherwise stated.
Evaluation
Module
Peripheral
probe headers
P406, P407,
P411
20-pin
ARM-JTAG
Debug Header
P409
I/O breakout headers
P403, P404, P405
XDS bypass header
P408
SmartRF06EB
peripherals
ACC, ALS, keys, LCD,
LED, SD card
XDS100v3
Emulator
10-pin Cortex
Debug Header
P410
UART back
channel probe
header
P412
Figure 16 – SmartRF06EB I/O breakout overview
6.11.1
I/O Breakout Headers
The I/O breakout headers on SmartRF06EB consist of pin connectors P406, P407, P411 and
P412. P406, P407 and P411 are located at the top left side of SmartRF06EB. All EM signals
available on these probe headers can be connected to or disconnected from SmartRF06EB
peripherals using jumpers on headers P403, P404, P405.
Probe header P412 is located near the bottom right corner of the SmartRF06EB. The signals
available on P412 are connected to the XDS100v3 Emulator’s UART back channel using jumpers
on header P408.
The I/O breakout mapping between the SmartRF06EB and the mounted EM is given in Table 14.
The leftmost column in the below table refers to the silk print seen on the SmartRF06EB. The
rightmost column shows the corresponding CC2538 I/O pad on CC2538EM.
Page 23/32
User’s Guide
SWRU321A – May 2013
Probe
header
Silk print
EB signal name
EM
connector
CC2538EM
I/O
P406
RF1.2
RF1.4
RF1.5
RF1.6
RF1.8
RF1.10
RF1.11
RF1.12
RF1.13
RF1.14
LV_LED_3
LV_LED_4
NC
LV_BTN_LEFT
LV_BTN_RIGHT
LV_BTN_UP
LV_LCD_MODE
LV_BTN_DOWN
LV_LCD_RESET
¯¯¯¯¯¯¯¯¯¯¯¯¯¯
LV_BTN_SELECT
RF1.2
RF1.4
RF1.5
RF1.6
RF1.8
RF1.10
RF1.11
RF1.12
RF1.13
RF1.14
PC2
PC3
PB1
PC4
PC5
PC6
PB2
PC7
PB3
PA3
P407
RF1.15
RF1.16_SCK
RF1.17
RF1.18_MOSI
RF1.20_MISO
RF2.5
RF2.6
RF2.8
RF2.10
RF2.11
LV_3.3V_EN
LV_SPI_SCK
LV_LCD_CS
¯¯¯¯¯¯¯¯¯¯
LV_SPI_MOSI
LV_SPI_MISO
LV_ALS_OUT
LV_ALS_PWR
LV_ACC_PWR
LV_ACC_CS
¯¯¯¯¯¯¯¯¯¯¯
LV_LED_1
RF1.15
RF1.16
RF1.17
RF1.18
RF1.20
RF2.5
RF2.6
RF2.8
RF2.10
RF2.11
PB4
PA2
PB5
PA4
PA5
PA6
PA7
PD4
PD5
PC0
P411
RF2.12
RF2.13
RF2.14
RF2.15_RESET
RF2.16
¯¯¯¯¯¯¯¯¯¯¯¯¯¯
LV_SDCARD_CS
LV_LED_2
LV_ACC_INT2
LV_BTN_RESET
¯¯¯¯¯¯¯¯¯¯¯¯¯¯
LV_ACC_INT1
RF2.12
RF2.13
RF2.14
RF2.15
RF2.16
PD0
PC1
PD1
nRESET
PD2
P412
EM_UART_RX
EM_UART_TX
EM_UART_CTS
EM_UART_RTS
RF1.7_UART_RX
RF1.9_UART_TX
RF1.3_UART_CTS
RF2.18_UART_RTS
RF1.7
RF1.9
RF1.3
RF2.18
PA0
PA1
PB0
PD3
Table 14 – SmartRF06EB I/O breakout overview
6.11.2
XDS100v3 Emulator Bypass Headers
The XDS100v3 Emulator bypass header, P408, is by default mounted with jumpers (Figure 17),
connecting the XDS100v3 Emulator to a mounted EM or external target. By removing the jumpers
on P408, the XDS100v3 Emulator may be disconnected from the target.
Figure 17 – XDS100v3 Emulator Bypass Header (P408)
Page 24/32
User’s Guide
SWRU321A – May 2013
6.11.3
20-pin ARM JTAG Header
The SmartRF06EB comes with a standard 20-pin ARM JTAG header [8] (Figure 18), enabling the
user to debug an external target using the XDS100v3 Emulator. The pin-out of the ARM JTAG
header is given in Table 15. Chapter 7 has more information on how to debug an external target
using the XDS100v3 Emulator onboard the SmartRF06EB.
Figure 18 – 20-pin ARM JTAG header (P409)
Pin
Signal
Description
EB signal name
P409.1
P409.2
P409.3
P409.4
P409.5
P409.6
P409.7
P409.8
P409.9
P409.10
P409.11
P409.12
P409.13
P409.14
P409.15
P409.16
P409.17
P409.18
P409.19
P409.20
VTRef
VSupply
nTRST
GND
TDI
GND
TMS
GND
TCK
GND
RTCK
GND
TDO
GND
nSRST
GND
DBGRQ
GND
DBGACK
GND
Voltage reference
Voltage supply
Test Reset
Ground
Test Data In
Ground
Test Mode Select
Ground
Test Clock
Ground
Return Clock
Ground
Test Data Out
Ground
System Reset
Ground
Debug Request
Ground
Debug Acknowledge
Ground
VDD_SENSE
NC
NC
GND
RF2.17_JTAG_TDI
GND
RF2.4_JTAG_TMS
GND
RF2.1_JTAG_TCK
GND
NC
GND
RF2.19_JTAG_TDO
GND
¯¯¯¯¯¯¯¯¯¯¯¯¯
RF2.15_RESET
GND
NC
GND
NC
GND
Table 15 – 20-pin ARM JTAG header pin-out (P409)
Page 25/32
XDS
bypass
header
P408.19-20
P408.5-6
P408.3-4
P408.1-2
P408.7-8
P408.9-10
User’s Guide
SWRU321A – May 2013
6.11.4
10-pin ARM Cortex Debug Header
The SmartRF06EB comes with a standard 10-pin ARM Cortex debug header [8] (Figure 19),
enabling the user to debug an external target using the XDS100v3 Emulator. The ARM Cortex
debug header is located near the right hand edge of the EB. The header pin-out is given in Table
16. Chapter 7 has more information on how to debug an external target using the XDS100v3
Emulator onboard the SmartRF06EB.
Figure 19 – 10-pin ARM Cortex Debug header (P410)
Pin
Signal
Description
EB signal name
P410.1
P410.2
P410.3
P410.4
P410.5
P410.6
P410.7
P410.8
P410.9
P410.10
VCC
TMS
GND
TCK
GND
TDO
KEY
TDI
GNDDetect
nRESET
Voltage reference
Test Mode Select
Ground
Test Clock
Ground
Test Data Out
Key
Test Data In
Ground detect
System Reset
VDD_SENSE
RF2.4_JTAG_TMS
GND
RF2.1_JTAG_TCK
GND
RF2.19_JTAG_TDO
NC
RF2.17_JTAG_TDI
GND
¯¯¯¯¯¯¯¯¯¯¯¯¯
RF2.15_RESET
XDS bypass
header
P408.19-20
P408.3-4
P408.1-2
P408.7-8
P408.5-6
P408.9-10
Table 16 – 10-pin ARM Cortex Debug header pin-out (P410)
Page 26/32
User’s Guide
SWRU321A – May 2013
6.12 Current Measurement
The SmartRF06EB provides two options for easy measurements of the current consumption of a
mounted EM. The following sections describe these two options in detail.
6.12.1
High-side current sensing
The SmartRF06EB comes with a current sensing unit for measuring the current consumption of
the mounted EM (Figure 20). The current sensing setup is “high-side”, that is, it measures the
current going to the mounted EM. The current is converted to a voltage, available at the
CURMEAS_OUTPUT test point (TP11), located near the right edge of the SmartRF06EB. Using
the SmartRF06EB together with for example an oscilloscope makes it easy to measure the EM
current consumption as a function of time.
The relationship between the voltage measured at CURMEAS_OUTPUT, V CURMEAS, and the EM
current consumption, IEM, is given by Equation 1 below.
I EM
V CURMEAS
(1)
15
IEM
To EM
0.15 Ohm
G = 100
VCURMEAS
Figure 20 – Simplified schematic of high-side current sensing setup
6.12.2
Current Measurement Jumper
SmartRF06EB has a current measurement header, J503, for easy measurement of EM current
consumption. Header J503 is located on the upper right hand side of the EB. By replacing the
jumper with an ammeter, as shown in Figure 21, the current consumption of the mounted EM can
be measured.
Figure 21 – Measuring current consumption using jumper J503
Page 27/32
User’s Guide
SWRU321A – May 2013
7 Debugging an external target using SmartRF06EB
You can easily use XDS100v3 Emulator onboard the SmartRF06EB to debug an external target.
It is in this chapter assumed that the target is self-powered.
When debugging an external, self-powered target using SmartRF06EB, make sure to remove the
jumper from the current measurement header (J503) as shown in the second scenario of Figure
22. In this scenario, the onboard XDS100v3 senses the target voltage of the external target. In
the left side scenario of the same figure, the XDS100v3 senses the target voltage of the EB’s EM
domain.
Having a jumper mounted on header J503 when debugging an external target will
cause a conflict between the EB’s EM domain supply voltage and the target’s supply
voltage. This may result in excess currents, damaging the onboard components of
the SmartRF06EB or the target board.
In Figure 22, the right hand side scenario shows how it is possible to debug an EM mounted on
the SmartRF06EB using an external debugger. In this scenario, all the jumpers must be removed
from the SmartRF06EB header P408 to avoid signaling conflicts between the onboard XDS100v3
Emulator and the external debugger.
06EB XDS + EM
06EB XDS + external target
External debugger + EM
EM
EM
EM
(EM domain)
(EM domain)
(EM domain)
J503
(mounted)
P408
(jumpers on)
Current measurement jumper
XDS bypass header
XDS100v3
J503
J503
(not mounted)
(mounted)
P409/P410
Ext. target
Debug
header
(Target VDD)
P409/P410
P408
P408
(jumpers on)
(jumpers off)
XDS100v3
External
debugger
XDS100v3
Figure 22 – Simplified connection diagram for different debugging scenarios
Page 28/32
User’s Guide
SWRU321A – May 2013
7.1 20-pin ARM JTAG Header
The SmartRF06EB has a standard 20-pin ARM JTAG header mounted on the right hand side
(P409). Make sure all the jumpers on the XDS bypass header (P408) are mounted and that the
jumper is removed from header J503.
Connect the external board to the 20-pin ARM JTAG header (P409) using a 20-pin flat cable as
seen in Figure 23. Make sure pin 1 on P409 matches pin 1 on the external target. See sections
6.11.3 and 6.11.2 for more info about the 20-pin ARM JTAG header and the XDS bypass header,
respectively.
Figure 23 – Debugging external target using SmartRF06EB
7.2 10-pin ARM Cortex Debug Header
The SmartRF06EB has a standard 10-pin ARM Cortex Debug header mounted on the right hand
side (P410). Make sure all the jumpers on the XDS bypass header (P408) are mounted and that
the jumper is removed from header J503.
Connect the external board to the 10-pin ARM JTAG header using a 10-pin flat cable. Make sure
pin 1 on P410 matches pin 1 on the external target See sections 6.11.4 and 6.11.2 for more info
about the 10-pin ARM Cortex Debug header and the XDS bypass header, respectively.
Page 29/32
User’s Guide
SWRU321A – May 2013
7.3 Custom Strapping
If the external board does not have a 20-pin ARM JTAG connector nor a 10-pin ARM Cortex
connector, the needed signals may be strapped from the onboard XDS100v3 Emulator to the
external target board.
Make sure all the jumpers on the XDS bypass header (P408) are mounted and that the jumper is
removed from header J503. Table 17 shows the signals that must be strapped between the
SmartRF06EB and the target board. Table 18 shows additional signals that are optional or
needed for debugging using 4-pin JTAG. Figure 24 shows where the signals listed in Table 17
and Table 18 can be found on the 20-pin ARM JTAG header.
EB Signal Name
EB
Breakout
Description
VDD_SENSE
GND
RF2.1_JTAG_TCK
RF2.4_JTAG_TMS
P409.1
P409.4
P409.9
P409.7
Target voltage supply
Common ground for EB and external board
Test Clock
Test Mode Select
Table 17 – Debugging external target: Minimum strapping (cJTAG support)
EB Signal Name
EB
Breakout
Description
RF2.17_JTAG_TDI
RF2.19_JTAG_TDO
¯¯¯¯¯¯¯¯¯¯¯¯¯
RF2.15_RESET
P409.5
P409.13
P409.15
Test Data In (optional for cJTAG)
Test Data Out (optional for cJTAG)
Target reset signal (optional)
Table 18 – Debugging external target: Optional strapping
VDD_SENSE
GND
RF2.17_JTAG_TDI
RF2.4_JTAG_TMS
RF2.1_JTAG_TCK
RF2.19_JTAG_TDO
RF2.15_RESET
2-pin cJTAG
+
4-pin JTAG
Optional
Figure 24 – ARM JTAG header (P409) with strapping to debug external target
Page 30/32
User’s Guide
SWRU321A – May 2013
8 Frequently Asked Questions
Q1
A1
Nothing happens when I power up the evaluation board. Why?
Make sure you have a power source connected to the EB. Verify that the power source
selection switch (S502) is set correctly according to your power source. When powering
the EB from either batteries or an external power source, S502 should be in “BAT”
position. When powering the EB over USB, the switch should be in “USB” position. Also,
make sure the EM current measurement jumper (J503) is short circuited.
Q2
A2
Why are there two JTAG connectors on the SmartRF06EB, which one should I use?
The SmartRF06EB comes with two different standard debug connectors, the 20-pin ARM
JTAG connector (P409) and the compact 10-pin ARM Cortex debug connector (P410).
These debug connectors are there to more easily debug external targets without the
need of customized strapping. For more details on how to debug external targets using
the SmartRF06EB, see chapter 7.
Q3
A3
Can I use the SmartRF06EB to debug an 8051 SoC such as CC2530?
No, you cannot debug an 8051 SoC using the SmartRF06EB.
Q4
A4
When connecting my SmartRF06EB to my PC, no serial port appears. Why?
It may be that the virtual COM port on the SmartRF06EB’s XDS100 channel B hasn’t
been enabled. Section 4.1.2.1.1 describes how to enable the Vritual COM Port in the
USB driver.
Page 31/32
User’s Guide
SWRU321A – May 2013
9 References
[1] SmartRF Studio Product Page
http://www.ti.com/tool/smartrftm-studio
[2] FTDI USB Driver Page
http://www.ftdichip.com
[3] SmartRF Flash Programmer Product Page
http://www.ti.com/tool/flash-programmer
[4] XDS100 Emulator Product Page
http://processors.wiki.ti.com/index.php/XDS100
[5] Electronic Assembly DOGM128-6 Datasheet
http://www.lcd-module.com/eng/pdf/grafik/dogm128e.pdf
[6] Bosch Sensortec BMA250 Datasheet
http://ae-bst.resource.bosch.com/media/products/dokumente/bma250/bst-bma250ds002-05.pdf
[7] Osram SFH 5711
http://www.osram-os.com
[8] Cortex-M Debug Connectors
http://infocenter.arm.com/help/topic/com.arm.doc.faqs/attached/13634/cortex_debu
g_connectors.pdf
10 Document History
Revision
Date
Description/Changes
SWRU321A
2013-05-21
SWRU321
2012-09-07
Minor fixes to Figure 4. Fixed incorrect EM mapping in Table 11.
Added steps for installing SmartRF06EB on Linux.
Initial version.
Page 32/32
User’s Guide
SWRU321A – May 2013
Appendix A
Schematics
SmartRF06EB 1.2.1
FIDUCIAL_MARK_1mm
FM1
FIDUCIAL_MARK_1mm FIDUCIAL_MARK_1mm
FM2
FM3
1
1
1
FIDUCIAL_MARK_1mm FIDUCIAL_MARK_1mm FIDUCIAL_MARK_1mm
FM4
FM5
FM6
1
1
TESTPOINT_PAD
TP12
HOLE_3
H1
XDS100v3 - FPGA
EM INTERFACE/
LEVEL SHIFTERS
1
TESTPOINT_PAD
TP13
HOLE_3
H2
HOLE_3
H3
HOLE_3
H4
XDS100v3 - FTDI
POWER SUPPLY
HIGH VOLTAGE
PERIPHERALS
LOW VOLTAGE
PERIPHERALS
CONTRACT NO.
COMPANY NAME
Texas Instruments
DWG
APPROVALS
DATE
DRAWN
MAW
12/07/12
SIZE
CHECKED
13/07/12
A3
ISSUED
13/07/12
SmartRF06EB
SCALE
FSCM NO.
- Top Level
DWG NO.
SHEET
REV.
1.2.1
1(7)
P3.3VXDS
GND
R33
R_51_0402_G
4
3
1
2 CLK_100M
2
1
VCCPLF
RESET_N
C26
1
C34
C_15N_0402_X7R_K_25
2
2
1
TPD4E002
U7
2
1
R54
R_5K1_0402_J
VDD
OUTPUT
2
1
STANDBY
TPD4E002
U12
1
T_EMU5
C27
C_4U7_0603_X5R_K_6
3
T_EMU3
UART_EN_N
IO1
GND
IO4
T_EMU4
4
GND
1
T_DIS
IO1
2
TPD4E002
IO2
5
IO3
T_TRST
3
T_TVD
1
IO4
GND
TPD4E002
IO2
IO3
5
T_TMS
4
T_EMU2
2
J5
2
R1
L_BEAD_102_0402
1
2
ASDM
C25
2
P3.3VXDS
+1.5V
1
C_100N_0402_X5R_K_10
1
R49
R_1K0_0402_F
P3.3VXDS
O1
ASDM 100.000MHZ
C_4U7_0603_X5R_K_6
P3.3VXDS P3.3VXDS
2
PINROW_SMD_1X2_2.54MM
TPD4E002
U8
1
IO1
2
T_TDI
3
T_TCK
1
IO4
GND
TPD4E002
IO2
IO3
5
T_RTCK
4
T_TDO
TPD4E002
U9
IO1
2
TCK
TDI
50
P3.3VXDS
TMS
GND
GBB0/IO37RSB0
GBB1/IO38RSB0
GBA0/IO39RSB0
VMV1
GBA1/IO40RSB0
85
84
83
82
81
80
79
78
77
76
VTARGET
1
2
R15
R_51_0402_G
R18
R_51_0402_G
1
1
2
2
R16
R_51_0402_G
R23
R_51_0402_G
R17
R_51_0402_G
R22
R_470_0402_F
1
1
1
1
R21
1
R20
2
2
2
2
R_470_0402_F
2
2
2
1
T_TMS
T_TDI
PWRGOOD
P3.3VXDS
T_TDO
P3.3VXDS
T_RTCK
T_TCK
T_EMU0
T_SRST
1
PWRGOOD
2
T_EMU1
3
R_470_0402_F
4
5
V_USB
OUTA
INAINA+
V+
U6
OPA2363
OUTB
INB-
V-
INB+
ENA
ENB
R27
R_1K0_0402_F
10
9
V_USB
1
2
Q1
BC846
1
2
1
8
7
2
3
6
GNDQ
VMV0
GBA2/IO41RSB0
IO42RSB0
GBB2/IO43RSB0
GBC2/IO45RSB0
IO47RSB0
VCC
GND
VCCIB0
GCC1/IO51RSB0
GCC0/IO52RSB0
GCA1/IO55RSB0
GCA0/IO56RSB0
GCB2/IO58RSB0
GCC2/IO59RSB0
GDC1/IO61RSB0
GDC0/IO62RSB0
GDA1/IO65RSB0
VJTAG
TRST
TDO
NC
VPUMP
GND
OPA2363
Testpoint_Circle_40mils
Testpoint_Circle_40mils
TP8 TP9
P1.8V
2
1
VTARGET
1
T_TVD
51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75
2
1
2
C_100N_0402_X5R_K_10
49
86
2
48
GBC1/IO36RSB0
P1.5V
1
PRG_TMS
IO32RSB0
GBC0/IO35RSB0
T_EMU3
88
87
ADV_MODE
T_TMS
C24
PRG_TDI
PRG_TMS
GDA2/IO70RSB1
R_51_0402_G
ADV_MODE
C_4U7_0603_X5R_K_6
47
GDB2/IO71RSB1
R53
2
CDBP0130L-G
1
R43
PRG_TCK
GDC2/IO72RSB1
2
R_10K_0402_F
46
R_10K_0402_F
1
R50
R_1K0_0402_F
45
IO28RSB0
R47
T_EMU4
C23
PRG_TDO
IO25RSB0
2
D1
R44
2
R_10K_0402_F
PRG_TDO
P3.3VXDS
IO75RSB1
2
2
PRG_TDI
44
IO81RSB1
1
R48
R_10K_0402_F
43
R_51_0402_G
1
T_EMU2
1
PRG_TMS
IO19RSB0
IO22RSB0
89
R_51_0402_G
R52
EXT_SELECT
T_EMU5
C22
42
IO84RSB1
VCCIB0
90
R51
EXT_SELECT
C_100N_0402_X5R_K_10
PRG_TCK
IO87RSB1
GND
91
2
2
41
VCC
92
2
R_51_0402_G
1
R46
40
VCCIB1
IO15RSB0
93
1
R55
T_DIS
T_TRST
R_10K_0402_F
SUSPEND
ALT_FUNC
GND
IO13RSB0
94
2
R_51_0402_G
1
P3.3VXDS
VCC
1
P3.3VXDS
39
IO11RSB0
95
T_DIS
1
R19
1
38
IO09RSB0
96
R31
37
IO93RSB1
IO07RSB0
97
2
P1.5V
IO94RSB1
GAC1/IO05RSB0
98
The XDS100 is connected to the EM through
connector P408. See the EM interface page
for details.
R_10K_0402_F
36
IO95RSB1
GAC0/IO04RSB0
99
1
TCK
IO96RSB1
GAB1/IO03RSB0
LED_EL19-21SRC
2 D4
R29
35
GAB0/IO02RSB0
VTARGET
2
34
TDI
IO97RSB1
GAA1/IO01RSB0
100
R_120K_0402_F
33
TDO
IO99RSB1
GAA0/IO00RSB0
2
TMS
IO100RSB1
T_SRST
1
R30
32
GEC2/IO104RSB1
IO102RSB1
T_EMU1
4
P3.3VXDS
1
31
TRST
GEB2/IO105RSB1
P3.3VXDS
A3PN125-VQFP
R_120K_0402_F
EMU_EN
GEA2/IO106RSB1
A3PN125-ZVQG100
EMU0
30
3
R42
R_220_0402_J
29
4
R41
R_10K_0402_F
28
RTCK
5
1
SRST_OUT
6
5
2
27
7
IO3
R12
R_0_0402
CLK_FAIL
8
TPD4E002
IO2
1
26
1
GND
TVD
2
GAA2/IO67RSB1
IO68RSB1
GAB2/IO69RSB1
IO132RSB1
GAC2/IO131RSB1
IO130RSB1
IO129RSB1
GND
GFB1/IO124RSB1
GFB0/IO123RSB1
VCOMPLF
GFA0/IO122RSB1
VCCPLF
GFA1/IO121RSB1
GFA2/IO120RSB1
VCC
VCCIB1
GEC0/IO111RSB1
GEB1/IO110RSB1
GEB0/IO109RSB1
GEA1/IO108RSB1
GEA0/IO107RSB1
VMV1
GNDQ
25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
GND
GND
GND
UART_EN_N
GND
VCCPLF
GND
P3.3VXDS
POD_RLS
EMU1
CBL_DIS
DTSA_BYP
RESET_N
P3.3VXDS
P1.5V
CLK_100M
U11
IO4
GND
3
T_EMU0
TP5
TP6
TP7
PRG_TCK
Testpoint_Circle_40mils
PRG_TRST
2
R25
R_120K_0402_F
2
1
C21
C_100N_0402_X5R_K_10
2
1
PRG_TDI
Testpoint_Circle_40mils
VTARGET
Testpoint_Circle_40mils
P1.5V
PRG_TMS
VTARGET
TP4
Testpoint_Circle_40mils
PRG_TDO
PRG_TRST
P3.3VXDS
TP3
PRG_TDO
P3.3VXDS
R24
R_5K1_0402_J
1
Testpoint_Circle_40mils
CONTRACT NO.
COMPANY NAME
Texas Instruments
APPROVALS
DATE
DRAWN
MAW
12/07/12
CHECKED
13/07/12
ISSUED
13/07/12
DWG
SmartRF06EB - XDS100v3 - FPGA
SIZE
FSCM NO.
DWG NO.
A3
SCALE
SHEET
REV.
1.2.1
2(7)
1
C16
2
C_100N_0402_X5R_K_10
C14
C12
1
2
C_100N_0402_X5R_K_10
1
2
C_100N_0402_X5R_K_10
C11
C9
1
2
C_100N_0402_X5R_K_10
1
2
C_4U7_0603_X5R_K_6
C6
C5
1
2
C_100N_0402_X5R_K_10
1
2
P3.3VXDS P3.3VXDS P3.3VXDS P3.3VXDS P3.3VXDS
P1.8V
C_100N_0402_X5R_K_10
C4
C3
1
2
P1.8V
C_100N_0402_X5R_K_10
1
2
P1.8V
C_4U7_0603_X5R_K_6
C31
C30
1
2
P1.8V
C_100N_0402_X5R_K_10
1
2
+1.5V
C_100N_0402_X5R_K_10
C29
C28
1
2
+1.5V
C_100N_0402_X5R_K_10
1
2
+1.5V
C_4U7_0603_X5R_K_6
+1.5V
P3.3VXDS
R7
L_BEAD_102_0402
2
1
1
1
C20
C_100N_0402_X5R_K_10
C19
2
2
C_4U7_0603_X5R_K_6
P3.3VXDS
R8
L_BEAD_102_0402
1
C17
C_100N_0402_X5R_K_10
49
3
NC
TPD2E001
IO1
1
4
GND
1
2
VBUS
2
3
ID
4
6
Shield
7
DM
DP
VCCIO
VCCIO
VCCIO
ACBUS0
ACBUS1
14
REF
ACBUS2
RESET
ACBUS3
ACBUS4
ACBUS5
ACBUS6
1
R_0_0402
R2
2
1
Shield
ADBUS0
ADBUS1
ADBUS2
ADBUS3
ADBUS4
ADBUS5
ADBUS6
ADBUS7
VREGOUT
USBDP 8
6
5
GND
VREGIN
USBDM7
2
D+
R10
R_12K_0402_F
D-
R_1K0_0402_F
R9
2
P1
USB-B_MICRO
5
IO2
56
EEPROM_CS
63
EEPROM_CLK
62
EEPROM_DATA
61
2
P3.3VXDS
ACBUS7
EECS
EECLK
EEDATA
FT2232H
BDBUS0
BDBUS1
BDBUS2
OSCI
BDBUS3
3
BDBUS4
CLK
2
2
R4
R_1K0_0402_F
1
R3
R_1K0_0402_F
93AA46B
DIN
CS
6
1
5
EEPROM_CS
4
EEPROM_CLK
P3.3VXDS
2
BDBUS6
BDBUS7
4
1
C13
TEST
3
1
2
13
C18
2
BCBUS0
C_27P_0402_NP0_J_50
BCBUS1
BCBUS2
BCBUS3
BCBUS4
BCBUS5
BCBUS6
BCBUS7
C8
C_100N_0402_X5R_K_10
PWREN
2
GND
GND
GND
5
GND
1
GND
GND
10
GND
SUSPEND
16
24
TCK
TDI
TDO
TMS
TRST
EMU_EN
EMU0
RTCK
26
SRST_OUT
27
CLK_FAIL
28
TVD
29
POD_RLS
30
EMU1
32
CBL_DIS
33
DTSA_BYP
34
ALT_FUNC
38
PRG_TCK
39
PRG_TDI
40
PRG_TDO
41
PRG_TMS
43
PRG_TRST
17
18
19
21
22
23
44
V_USB
45
46
48
52
53
54
1
55
57
LED_EL19-21SYGC
58
2 D2
59
60
PWREN
36
SUSPEND
PWREN
GND
1
AGND
3
GND
VCC
Y1
X_12.000/30/30/10/20
C_27P_0402_NP0_J_50
1
R6
R_2K7_0402_F
2
DO
1
2
U1
93AA46B
1
2
EEPROM_DATA
OSCO
BDBUS5
1
R5
R_1K0_0402_F
P3.3VXDS
P3.3VXDS
P3.3VXDS
U4
FT2232HL
2
50
VCC
42
31
R28
R_270_0402_F
U3
TPD2E001
20
64
1
VBUS
37
VCCIO
12
VCORE
9
VPLL
VPHY
4
VCORE
1
P3.3VXDS
P3.3VXDSP1.8V
1
P3.3VXDS
P1.8V
1
C15
2
2
C_4U7_0603_X5R_K_6
VCORE
2
11 15 25 35 47 51
CONTRACT NO.
COMPANY NAME
Texas Instruments
APPROVALS
DATE
DRAWN
MAW
12/07/12
CHECKED
13/07/12
ISSUED
13/07/12
DWG
SmartRF06EB - XDS100v3 - FTDI
SIZE
FSCM NO.
DWG NO.
A3
SCALE
SHEET
REV.
1.2.1
3(7)
EM DEBUG CONNECTION
EM CONNECTORS
RF1
SMD_HEADER_2X10
1
2
RF1.2
3
4
RF1.4
5
6
RF1.6
7
8
RF1.8
9
10
RF1.10
11
12
RF1.12
13
14
RF1.14
15
16
RF1.16_SPI_SCK
17
18
RF1.18_SPI_MOSI
19
20
RF1.20_SPI_MISO
GND
RF1.3_UART_CTS
RF1.5
RF1.7_UART_RX
RF1.9_UART_TX
RF1.11
RF1.13
RF1.15
RF1.17
GND
RF2.1_JTAG_TCK
RF_VDD2
RF2.5
RF_VDD1
RF_VDD1
RF2.11
RF2.13
RF2.15_RESET
RF2.17_JTAG_TDI
RF2.19_JTAG_TDO
Bypass jumper block for connection
between EM and XDS100v3
RF2
SMD_HEADER_2X10
1
2
GND
3
4
RF2.4_JTAG_TMS
5
6
RF2.6
7
8
RF2.8
9
10 RF2.10
11
12 RF2.12
13
14 RF2.14
15
16 RF2.16
17
18 RF2.18_UART_RTS
19
20 GND
P408
T_TCK
1
2
RF2.1_JTAG_TCK
T_TMS
3
4
RF2.4_JTAG_TMS
T_TDI
5
6
RF2.17_JTAG_TDI
T_TDO
7
8
RF2.19_JTAG_TDO
T_SRST
9
10
RF2.15_RESET
T_EMU3
11
12
RF1.7_UART_RX
T_EMU2
13
14
RF1.9_UART_TX
T_EMU5
15
16
RF1.3_UART_CTS
T_EMU4
17
18
RF2.18_UART_RTS
19
20
VDD_SENSE
T_TVD
PINROW_SMD_2X10_2.54MM
EM <--> EB BREAKOUT and PROBE HEADERS
20-pin ARM JTAG Connector
10-pin ARM Cortex
JTAG Connector
P409
VDD_SENSE
1
RF1.5
RF1.6
LV_BTN_RIGHT
9
10
RF1.8
LV_BTN_UP
11
12
RF1.10
LV_LCD_MODE
13
14
RF1.11
LV_BTN_DOWN
15
16
RF1.12
LV_LCD_RESET
17
18
RF1.13
LV_BTN_SELECT
19
20
RF1.14
5
6
7
8
9
10
RF1.2
RF1.4
RF1.5
RF1.6
RF1.8
RF1.10
RF1.11
RF1.12
RF1.13
RF1.14
LV_SDCARD_CS
1
2
RF2.12
LV_LED_2
3
4
RF2.13
4
GND
5
6
GND
RF2.4_JTAG_TMS
7
8
LV_ACC_INT2
5
6
RF2.14
GND
RF2.1_JTAG_TCK
9
10
LV_BTN_RESET
7
8
RF2.15_RESET
GND
11
12
GND
9
10
RF2.16
LV_ACC_INT1
PINROW_SMD_2X5_2.54MM
RF2.19_JTAG_TDO
13
14
GND
RF2.15_RESET
15
16
GND
17
18
GND
19
20
GND
RF1.15
4
RF1.16_SPI_SCK
LV_LCD_CS
5
6
RF1.17
LV_SPI_MOSI
7
8
RF1.18_SPI_MOSI
LV_SPI_MISO
9
10
RF1.20_SPI_MISO
LV_ALS_OUT
11
12
RF2.5
LV_ALS_PWR
13
14
RF2.6
LV_ACC_PWR
15
16
RF2.8
LV_ACC_CS
17
18
RF2.10
LV_LED_1
19
20
RF2.11
6
7
8
9
10
1
2
3
4
5
RF2.12
RF2.13
RF2.14
RF2.15_RESET
RF2.16
LO_VDD
P412
1
RF_VDD1
2
1
C401
1
2
C402
Optional
RC filter
EM CURRENT MEASUREMENT
1
2
3
4
5
RF1.7_UART_RX
RF1.9_UART_TX
RF1.3_UART_CTS
RF2.18_UART_RTS
6
TP10
RF_VDD2
LO_VDD
Testpoint_Circle_40mils
R502
R_0R15_0603_F
J503
1
VDD_SENSE
1
VDD_MEASURED
2
PINROW_SMD_1X2_2.54MM
1.6M
1
2
1
2
OUT
GND
LV_BTN_RESET
INA216
1.6M
34
R1
R2
S606
PUSH_BUTTON_SKRAAK
12
2
2
3
RESET
1
IN-
1
IN+
C_100N_0402_X5R_K_10
C507
PINROW_1X6
P404
PINROW_SMD_2X10_2.54MM
VDD_MEASURED
2
P411
RF2.4_JTAG_TMS
RF2.1_JTAG_TCK
RF2.19_JTAG_TDO
RF2.17_JTAG_TDI
RF2.15_RESET
PINROW_SMD_2X10_2.54MM
R402
R_0_0603
2
2
3
5
PINROW_1X10
1
LV_SPI_SCK
4
PINROW_1X5
LV_3.3V_EN
3
2
4
6
8
10
C_0603
2
RF1.15
RF1.16_SPI_SCK
RF1.17
RF1.18_SPI_MOSI
RF1.20_SPI_MISO
RF2.5
RF2.6
RF2.8
RF2.10
RF2.11
P410
1
3
5
7
9
PINROW_SMD_2X5_1.27MM
P407
1
VDD_SENSE
C_100N_0402_X5R_K_10
C404
8
4
C_100N_0402_X5R_K_10
C403
7
3
C_0805
LV_BTN_LEFT
6
RF1.4
PINROW_1X10
5
3
RF2.17_JTAG_TDI
P406
2
4
2
C_100N_0402_X5R_K_10
C508
3
1
U504
LV_LED_4
P405
INA216A3
LV_LED_3
P403
PINROW_SMD_2X10_2.54MM
RF1.2
1
2
TP11
1
2
TP20
4
CURMEAS_OUTPUT
TESTPIN_SMALL
TESTPIN_SMALL
Rshunt = 0.15 Ohm
Gain = 100
Vin = Ishunt x Rshunt
Vout = Vin x Gain
Saturation point for INA216
----------------------------Vout_max = LO_VDD (2.1V to 3.6V)
Vin_max = LO_VDD / 100 = 21mV to 36mV
Ishunt_max = 140mA to 240mA
CONTRACT NO.
COMPANY NAME
Texas Instruments
APPROVALS
DATE
DRAWN
MAW
12/07/12
CHECKED
13/07/12
ISSUED
13/07/12
DWG
SmartRF06EB SIZE
FSCM NO.
EM Interface /
Level Shifters
DWG NO.
A3
SCALE
SHEET
REV.
1.2.1
4(7)
BATTERIES
VBAT
1
BAT54J
L_2U2_0805_N_LQM21
2
3
L501
1
C501
U501
2
1
C502
1
2
2
1
2
3
R11
R_0_0402_3PORT_2-3
GND
SW
VIN
C503
C_2U2_0402_X5R_M_6P3VDC
1
STAT
ON/BYP
4
BATTERY or
EXTERNAL
C_2U2_0402_X5R_M_6P3VDC
VOUT
5
1
2
J501
TPS62730
6
Testpoint_Circle_40mils
V_UNREG
TPS63031
1
2
10 FB
9 GND
1
8 VINA
7 PS
3
VOUT
L2
PGND
L1
6 EN
VIN
Thermal
U502
2
4
P3.3V
2
1
L502
L_2U2_0805_N_LQM21
5
11
1
C504
C_2U2_0402_X5R_M_6P3VDC
2
LV_3.3V_EN
BUCK (2.1V)
MAIN ON/OFF SWITCH
V_UNREG
V_UNREG
2
REGULATOR
BYPASS
JUMPER
TP18
Testpoint_Circle_40mils
P2.1V
C_2U2_0402_X5R_M_6P3VDC
3
1
V_UNREG
PINROW_SMD_1X2_2.54MM
+
R501
R_47K_0402_F
2 1
CONNECTOR FOR
EXTERNAL POWER
J502
B502
B503
BUCK/BOOST (3.3V)
BATTERY or
EXTERNAL
ON
OFF
VBUS
2.1V
REG
VBAT
3.3V
REG
V_UNREG
USB (5V)
1
2
3
6
5
4
S501
SMD_SWITCH_DPDT
POWER SELECT SWITCH
V_USB
POWERED from BATTERY or
External Power Supply
3.3V FOR HV PERIPHERALS
LO_VDD
HI_VDD
USB
SMD_SWITCH_DPDT
S502
Software controlled switch
for enabling the "High Voltage"
domain for board peripherals.
U601
6
1
5
2
3
P3.3V
4
P2.1V
TPS22902
2
4
VIN
VOUT
ON
GND
1
3
R403
XDS100v3 VOLTAGE REGULATORS
P3.3VXDS
P3.3VXDS
U2
TPS73533
4
VOUT
NC
NR
EN
TPS73533
GND
1
2
3
GND
8
7
1
2
POWERED from USB
(XDS100v3)
2.1V FOR EM and LV PERIPHERALS
1
2
TP1
Testpoint_Circle_40mils
2
VIN
C1
C_100N_0402_X5R_K_10
1
2
5
C2
C_18N_0603_X7R_J_50
1
6
TP2
Testpoint_Circle_40mils
USB TO 3.3V
V_USB
C10
C_100N_0402_X5R_K_10
2
XDS 3.3V
R_10K_0402_F
P3.3VXDS
1
LV_3.3V_EN
C7
C_4U7_0603_X5R_K_6
P3.3VXDS
+1.5V
1
2
1
SUSPEND
2
3
VIN
GND
EN
VOUT
TLV70015
NC4
5
4
C33
C_100N_0402_X5R_K_10
TP19
U5
TLV70015
1
R32
R_10K_0402_F
V_USB
Testpoint_Circle_40mils
USB TO 1.5V (FPGA)
2
+
1
CR2032_SOCKET
2
V_UNREG
1
2
TP17
2
PINROW_SMD_1X2_2.54MM
B501
D3
+
1
C32
C_100N_0402_X5R_K_10
1XAAA_KEYSTONE
1XAAA_KEYSTONE
BATTERY REGULATORS
2
1
2
CONTRACT NO.
COMPANY NAME
Texas Instruments
DWG
SmartRF06EB -
APPROVALS
DATE
DRAWN
MAW
12/07/12
SIZE
CHECKED
13/07/12
A3
ISSUED
13/07/12
SCALE
FSCM NO.
Power Supply
DWG NO.
SHEET
REV.
1.2.1
5(7)
MICROSD
LEVEL SHIFTERS
HI_VDD
LO_VDD
J601
MICROSD-SPI
N/A
CS
DI/MOSI
VDD
SCLK
GND
DO/MISO
N/A
MicroSD
SPI-Mode
1
C405
C_100N_0402_X5R_K_10
2
HI_VDD
1
C406
C_100N_0402_X5R_K_10
2
LO_VDD
1
2
HI_VDD
HV_SDCARD_CS
HV_SPI_MOSI
3
U401
SN74AVC4T245
4
5
1
HV_SPI_SCK
6
VCCA
2
7
HV_SPI_MISO
1DIR
2DIR
1A1
1A2
2A1
2A2
GND
3
8
4
LV_SPI_SCK
LV_SPI_MOSI
LV_SPI_MISO
HI_VDD
5
6
7
8
1
C613
C_100N_0402_X5R_K_10
LO_VDD
2
16
VCCB
1OE
2OE
1B1
1B2
2B1
2B2
GND
15 LV_3.3V_EN
14 LV_SDCARD_CS
13 HV_SPI_SCK
12 HV_SPI_MOSI
11 HV_SPI_MISO
10
9
HI_VDD
LO_VDD LO_VDD LO_VDD
1
2
1
2
R_10K_0402_F
R_10K_0402_F
R612
1
R602
2
1
2
R_10K_0402_F
R601
C407
C_100N_0402_X5R_K_10
1
C408
C_100N_0402_X5R_K_10
2
LO_VDD
HI_VDD
U402
SN74AVC4T245
1
2
3
4
LV_LCD_RESET
LV_LCD_CS
LV_LCD_MODE
LV_SDCARD_CS
5
6
7
8
VCCA
1DIR
2DIR
1A1
1A2
2A1
2A2
GND
16
VCCB
1OE
2OE
1B1
1B2
2B1
2B2
GND
15 LV_3.3V_EN
14 LV_3.3V_EN
13 HV_LCD_RESET
12 HV_LCD_CS
11 HV_LCD_MODE
10 HV_SDCARD_CS
9
LEVEL SHIFTERS TRANSLATION :
2
U401:
U402:
LO
HI
1A1 --> 1B1
1A2 --> 1B2
2A1 <-- 2B1
2A2 <-- 2B2
LO
HI
1A1 --> 1B1
1A2 --> 1B2
2A1 --> 2B1
2A2 --> 2B2
1
R13
R_10K_0402_F
LO_VDD
LV_3.3V_EN
3
LV_3.3V_EN
LCD
HI_VDD
TP14
Testpoint_Circle_40mils
Q2
2N7002F
1
TP15
Testpoint_Circle_40mils
2
C_1U_0805_X7R_K_16
C604
C610
C_1U_0805_X7R_K_16
C_1U_0805_X7R_K_16
1
C601
2
C_1U_0402_X5R_K_6P3
1
V0
NC(C3-)
C609
2
3
R_0_0603
R615
1
2
R_0_0603
R614
2
R_0_0603
R606
1
C608
2
C_1U_0805_X7R_K_16
2
V1
NC(C2-)
SIP_SOCKET_SMD_1X3_2.54MM
1
P4
SIP_SOCKET_SMD_1X3_2.54MM
1
P3
2
1
C607
2
C_1U_0805_X7R_K_16
3
V2
2
1
1
C606
2
C_1U_0805_X7R_K_16
4
V3
NC(C1-)
DOGM128W-6_NO_CON
1
C605
C_1U_0805_X7R_K_16
5
V4
1
2
C_1U_0805_X7R_K_16
6
7
VSS
CAP2N
CAP2P 8
9
CAP1P
C603
13
1
2
3
2
HV_SPI_MISO
1
LCD1
1
HV_SPI_MOSI
HI_VDD
INSERT:
1 pc SIP_SOCKET_SMD_1X20_2.54MM
2 pc SIP_SOCKET_SMD_1X3_2.54MM
NC(A3+)
NC(A2+)
NC(A1+)
1
2
LCD
SIP_SOCKET_SMD_1X20_2.54MM
1
2
R_39_0603
R605
2
R_39_0603
R604
R_39_0603
R603
2
HI_VDD
1
HI_VDD
1
HI_VDD
VOUT 12
15
VSS
16
VDD2 14
17
VDD
18
SI
19
20
SCL
A0
RST
CS1B
P2
2
1
10
HV_LCD_RESET
HV_LCD_CS
2
CAP1N
HV_SPI_SCK
C602
HV_SPI_MOSI
HV_LCD_MODE
CAP3P 11
C_1U_0805_X7R_K_16
TP16
Testpoint_Circle_40mils
HV_SPI_SCK
CONTRACT NO.
COMPANY NAME
Texas Instruments
DWG
SmartRF06EB -
APPROVALS
DATE
DRAWN
MAW
12/07/12
SIZE
CHECKED
13/07/12
A3
ISSUED
13/07/12
SCALE
FSCM NO.
High Voltage
Peripherals
DWG NO.
SHEET
REV.
1.2.1
6(7)
2
LED_EL19-21SRC
34
1
1
R_820_0402_G
R607
S602
PUSH_BUTTON_SKRAAK
12
C615
C_100N_0402_X5R_K_10
LO_VDD
1
LV_BTN_SELECT
LV_SPI_MISO
LV_SPI_MOSI
LV_ACC_CS
2
12
34
S604
PUSH_BUTTON_SKRAAK
LV_SPI_SCK
LV_BTN_UP
LV_ACC_PWR
GREEN
12
LV_ALS_OUT
3
LV_ALS_PWR
LIGHT_SENSOR_SFH5711
1
2
1
2
2
1
R_680_0402_G
R609
S605
PUSH_BUTTON_SKRAAK
12
U602
BMA250
SDO
VDDIO
SDx
VDD
BMA250
CSB
NC
3-AXIS
11
PS Accelerometer
INT1
12
SCx
INT2
GNDIO GND
1
3
2
7
10
4
8
5
6
LV_ACC_PWR
LV_ACC_INT1
LV_ACC_INT2
9
34
D603
1
4
Iout
Accelerometer
1
R_680_0402_G
R608
LED_EL19-21SYGC
GND
VDD
LS601
Needs from 1.62V-3.6V
2
LV_LED_3
GND
LV_BTN_RIGHT
34
S603
PUSH_BUTTON_SKRAAK
D602
LED_EL19-21UYC_A2
1
2
2
YELLOW
LV_LED_2
RECOMMENDED 2.3V-5.5V
C614
12
2
LV_LED_1
1
D601
AMBIENT LIGHT SENSOR
2
ACCELEROMETER
R613
LO_VDD
1
LV_BTN_LEFT
R_22K_0603_G
BUTTONS
S601
PUSH_BUTTON_SKRAAK
C_100N_0402_X5R_K_10
LEDS
RED
LV_BTN_DOWN
C612
C_100N_0402_X5R_K_10
2
34
RED-ORANGE
2
1
D604
LV_LED_4
2
LED_EL19-21SURC
1
R_680_0402_G
R610
CONTRACT NO.
COMPANY NAME
Texas Instruments
DWG
SmartRF06EB -
APPROVALS
DATE
DRAWN
MAW
12/07/12
SIZE
CHECKED
13/07/12
A3
ISSUED
13/07/12
SCALE
FSCM NO.
Low Voltage
Peripherals
DWG NO.
SHEET
REV.
1.2.1
7(7)
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
【Important Notice for Users of this Product in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【ご使用にあたっての注】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
http://www.tij.co.jp
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
3.
4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even
if the EVM should fail to perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated