Store and transport requirements

UM10569
Store and transport requirements
Rev. 3.00 — 9 March 2015
User manual
Document information
Info
Content
Keywords
Storage, transport, shelf life, dry-baking, drying, dry-packing
Abstract
This document describes the store and transport requirements of final
commercial and semi-finished products of NXP Semiconductors
UM10569
NXP Semiconductors
Store and transport requirements
Revision history
Rev
Date
Description
v.3
20150309
third, enhanced revision
v.2
20140124
second revision
v.1
20120625
new user manual, first revision
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Store and transport requirements
1. Introduction
This specification describes the technical conditions of shelf life and transport of final
commercial and semi-finished products of NXP Semiconductors. Other aspects like sales,
warranty, legal and commercial issues are regulated by NXP’s “Terms and Conditions of
commercial Sale“, see Ref. 7 on page 13.
2. Objectives
It is essential that the quality of products entering store areas is maintained and that the
products are easily identified. The quality of stored products must not deteriorate by
additional handling while in store.
Transport conditions must be such that the quality and reliability of the product and its
packing shall not be harmed in any way.
3. Definitions
Bake to seal time — The maximum time after bake that components may be exposed to
ambient conditions prior to being sealed in MBBs.
Desiccant — An absorbent material used to maintain a low relative humidity.
ESD — ElectroStatic Discharge
FFC — Film Frame Carrier
Floor life — The permissible time period between removing the MBB and soldering.
HIC — Humidity Indicator Card.
IC — Integrated Circuit
MBB — Moisture Barrier Bag.
MSL — Moisture Sensitivity Level
PQ-box — The box for containing and protecting the prescribed Packing Quantity of final
product (also called Inner Box).
RH — Relative Humidity
Shelf life — The possible storage life before the product is used.
SMD — Surface-Mount Device
Transport — In this standard, transport includes the whole path and temporary storage
from the sending warehouse to the receiving point, which can be a warehouse or the
customer.
4. General conditions
Products have to be packed in a way that ensures protection against mechanical,
environmental and electrical influences during transport and storage.
Store and transport conditions should be such that the integrity of the product and its
packing are not harmed in any way.
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Store and transport requirements
5. Receiving inspection
Dry-packed packages should be inspected for a bag seal date on the caution or bar code
label to determine remaining shelf life. The bags should be inspected to verify that there
are no holes, gouges, tears, punctures, or openings of any kind that would expose either
the contents or an inner layer of a multilayer bag. If openings are found and the humidity
indicator card (HIC) indicates that the maximum humidity has been exceeded, then the
parts should be baked using the bake times of Table 3 or Table 4. This resets the floor life
if the parts to be used and shelf life if the parts are to be dry-packed.
6. Store conditions
Secure and clean store areas shall be provided to isolate and protect the products.
Conditions in the store areas shall be such that the quality of the products does not
deteriorate due to, among others, harmful gasses or electrical fields.
The following conditions have to be taken into account:
• Temperature
– Min. +8 C
– Max. +45 C
• Humidity
– Min. 25 %
– Max 75 %
– No condensation under any condition is allowed.
• Light intensity
– No direct sun light
7. Transport conditions
In the case of transporting, the following conditions have to be observed.
7.1 General transport conditions
During transport the packing and the products should be protected against extreme
temperatures, humidity and mechanical forces.
The following conditions have to be taken into account:
• Temperature
– Min. +8 C
– Max. +60 C
(Higher temperature causes a serious risk of deformation of the packing material
and lower temperature the risk of condensation within the package).
– In tropical conditions, the packing shall not be placed in direct sunlight.
• Humidity
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Store and transport requirements
– Direct contact of packing boxes with water is prohibited.
• Mechanical forces
– Transport must be done in such a way that the PQ-boxes are not deformed and
forces are not directly passed on to PQ-boxes.
• Time
– The total transport time should be as short as possible. When transport time
exceeds 5 days the transport conditions shall be the same as store conditions, or
the products have to be sealed with inclusion of a dry-agent.
7.2 Conditioned air transport
Air transport is possible with conditioned cargo rooms. This conditional air transport is
advised for all products, but mandatory for air transport of products in sealed bags, like dry
pack.
• Temperature
– Min. +8 C
– Max. +45 C
• Humidity
– Avg. 16 %
• Air pressure
– Min. 700 mbar
– Max. 1060 mbar
8. Shelf life conditions
8.1 Packed end products
The shelf life for packed end products is 4 years after the date code. This includes
encapsulated products in standard packing, encapsulated products in dry pack.
For products in dry pack, the dry conditions are guaranteed for one year (this is not shelf
life, see above). When the HIC shows a relative humidity of higher than 10 %, the
products have to be baked before use (see Section 10).
8.2 Wafers and bare die
Wafers and bare die have to be packed in dry pack, or stored under the following
conditions:
•
•
•
•
Inert gas
Dry air or dry nitrogen
No sources of corrosive material such as halogenic contamination
Temperature 18 C to 24 C
The shelf life for wafers or bare die is 3 years (excluding wafers with Au/Ge backside and
assuming condition of <60 % relative humidity) after diffusion process end (Fab. date
code).
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Store and transport requirements
The shelf life for products on FFC (Film Frame Carrier) is 6 months due to the FFC
material.
8.2.1 Maximum shelf life versus humidity
Parts of bare wafers and bare die products that are sensitive for aging are aluminum and
backside metal surfaces (e.g. Ti, Ni, Ag or AuGe). Shelf life of wafers and bare die with a
combination of given bond and back side material at different humidity levels are given in
Table 1.
Table 1.
Shelf life of wafers and bare die
The indicated humidity levels in the table should not be exceeded.
Relative humidity[1]
Bond pad material
Back side
Technical shelf life
< 10 %
all types
all types
> 15 years[2]
< 30 %
all types
all types
6 years
< 50 %
Al
all types (not AuGe)
4 years
< 50 %
all types
AuGe
1 year
< 60 %
Al
all types (not AuGe)
3 years
< 60 %
Ag
Ag
4 years
< 60 %
Au
AuAs
> 15 years[2]
< 80 %
Al
all types
0.1 years
[1]
RH % should be monitored or evidence (humidity indicator card) should be available that RH % requirement was really met during the
storage period.
[2]
The life time at such low humidity is limited only by the amount of desiccant added and the integrity of the MBB over time.
The shelf life time of bare wafer and bare die products is determined by the halogen (F, Cl,
Br) contamination level in the product environment and the humidity which affect the
degradation of aluminum bond pads. At low humidity, the halogen contamination has no
aging effect, but at higher humidity, the halogens become volatile.
Humidity is the most important aging factor in the aging of wafers with backside metal.
Additionally, gold contamination on Ti/Ni/Ag backside metal surface accelerates the aging
process.
Silver surfaces are very sensitive for sulphur contamination. MBB will be a barrier for
airborne sulphur contamination and therefore wafers packed in a sealed MBB are safe.
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Store and transport requirements
9. Floor life and bake to seal time
The floor life starts with opening the MBB. The floor life and the bake to seal time of IC
products are dependent on the MSL (see Table 2). If the bake to seal time is exceeded,
the products must be baked again.
Table 2.
Moisture Classification Level, floor life, and bake to seal time
Moisture Sensitivity
Level (MSL)
Ambient conditions
1
[1][2]
Bake to seal time
Temperature RH
Floor life (out of
bag time)
30 C
 90 %
no limit
no limit
 60 %
1 year
7 days
2
[3]
2a
[3]
4 weeks
3
[3]
168 hours
4
[3]
72 hours
5
[3]
48 hours
5a
[3]
24 hours
6
[4]
6 hours
24 hours
no limit
[1]
Products with MSL1 are not dry packed.
[2]
Wafers and bare die are rated as MSL 1. They do not require baking but require dry packing to avoid
oxidation.
[3]
Products that are moisture sensitive (MSL 2 through MSL 6) shall be baked prior dry-packed.
[4]
Products of MSL 6 must be baked before use within 6 hours at the customer.
If partial lots are used, the remaining products must be resealed or placed in safe storage
within 1 hour of bag opening. If the bag opening time or the floor life has expired or an
excess moisture exposure happened, the products have to be backed prior dry-packing.
For information about storing in a dry atmosphere cabinet or a dry cabinet, see Ref. 4
“IPC/JEDEC J-STD-033C”.
10. Dry-baking and drying
Before sealing product devices in MBBs, the products must be dry. This can be done by
dry-baking or drying.
10.1 Dry-baking
Dry-bake conditions are:
• Bake temperature: +125 C + 0 C/5 C
• Bake time, see Table 3
– Packages, not mentioned in this table, are baked 5 times the package thickness
(in mm), see Table 4 and Ref. 4 “IPC/JEDEC J-STD-033C”
– The x’s in a package name in Table 3 cover all versions except specifically
mentioned versions
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Store and transport requirements
Table 3.
Dry-bake time per package type
Bake temperature +125 C + 0 C/5 C.
Package family
Dry-bake time in hours
SO
8
SSOP, HSOP, VSO
10
TSSOP, HTSSOP
5
HBCC
5
xxQFP packages
12
LQFP, HLQFP, TQFP, HTQFP
8
PLCC, HSSON
12
xxBGA packages, <40  40
mm2
10
xxBGA packages, 40  40
mm2
15
TFBGA, LBGA, LFBGA
5
HVQFN, HVSON
5
SOJ
24
Remark: Baking deteriorates the solderability; do not bake for longer and not more often
than required.
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Store and transport requirements
10.2 Drying
Products, packed in tubes or tapes cannot be baked at 125 C and therefore must be
dried at lower temperatures, see Ref. 4 “IPC/JEDEC J-STD-033C”.
Table 4.
Reference conditions for drying mounted or unmounted SMD packages according to Ref. 4 “IPC/JEDEC
J-STD-033C”
Package body
MSL
Bake at
+125 C + 10 C/0 C
+90 C + 8 C/0 C
5 % RH
+40 C + 5 C/0 C
5 % RH
Exceeding floor life by
>72 hours
72 hours
>72 hours
72 hours
>72 hours
72 hours
5 hours
3 hours
17 hours
11 hours
8 days
5 days
2a
7 hours
5 hours
23 hours
13 hours
9 days
7 days
3
9 hours
7 hours
33 hours
23 hours
13 days
9 days
4
11 hours
7 hours
37 hours
23 hours
15 days
9 days
5
12 hours
7 hours
41 hours
24 hours
17 days
10 days
5a
16 hours
10 hours
54 hours
24 hours
22 days
10 days
Thickness >1.4 mm 2
2.0 mm
2a
18 hours
15 hours
63 hours
2 days
25 days
20 days
Thickness 1.4 mm 2
21 hours
16 hours
3 days
2 days
29 days
22 days
3
27 hours
17 hours
4 days
2 days
37 days
23 days
4
34 hours
20 hours
5 days
3 days
47 days
28 days
5
40 hours
25 hours
6 days
4 days
57 days
35 days
5a
2 days
40 hours
8 days
6 days
79 days
56 days
Thickness >2.0 mm 2
4.5 mm
2a
2 days
2 days
10 days
7 days
79 days
67 days
2 days
2 days
10 days
7 days
79 days
67 days
3
2 days
2 days
10 days
8 days
79 days
67 days
4
2 days
2 days
10 days
10 days
79 days
67 days
5
2 days
2 days
10 days
10 days
79 days
67 days
5a
2 days
2 days
10 days
10 days
79 days
67 days
BGA package
>17 mm  17 mm
or any stacked die
package
UM10569
User manual
2 to 5a 96 hours
as above per not applicable
package
thickness and
moisture level
as above per not applicable
package
thickness and
moisture level
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as above per
package
thickness and
moisture level
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Store and transport requirements
11. Dry-packing
11.1 Material requirements
Moisture absorbing packing materials that are used in the MBB (e.g. the cardboard guard
band for reels and the Humidity Indicator or HIC), shall be dry, before packing in the
moisture barrier bag. Moisture absorbing packing material should therefore be kept dry in
a drying box or an oven, with sufficient capacity to store (and dry) the required packing
material for at least 24 hours, before use.
Remark: Exposure of the desiccant, HIC and paper guard band to the environment shall
be for no more than 5 minutes, before packing and sealing the MBB.
11.1.1 Desiccant requirements
• The desiccant must meet Ref. 5 “MIL-D-3464E”, Type II. The desiccant shall be
dustless, noncorrosive, and absorbent to the amounts specified in the standard.
• The desiccant capacity at 10 % RH and 25 C per unit shall be ≥2.5 grams. The
desiccant capacity at 10 % RH and 25 C per unit shall be provided by desiccant
supplier.
• If desiccant capacity is <2.5 grams, then desiccant amounts shown in Table 5 and
Table 6 must be recalculated, see Ref. 4 “IPC/JEDEC J-STD-033C”.
• The desiccant type shall be bentonite clay.
• The desiccant bag shall be moisture permeable Tyvek.
• Desiccant is typically supplied in packs containing two units but this is not a
requirement and different size desiccant packs can be used.
The desiccant shall be stored in closed containers as received. After taking out the
required quantity of desiccant, the container shall be closed immediately. A humidity
indicator with a 5 % RH measuring spot shall be used in the desiccant container to check
the humidity. Once this spot is showing another color than is specified for “dry”, the
desiccant shall be reactivated (baked) first, in an oven according to suppliers
recommendation before using. Desiccants made of so-called Molecular Sieve, cannot be
reactivated.
Table 5.
UM10569
User manual
Desiccant requirement for wafer pack
MBB size (cm)
Typical wafer size (mm)
Total units of desiccant required
30
37
10
5
36
38
125
5
40
48.3
125; 150
7
50.5
77.5
200
12
76
82
300
19
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Table 6.
Desiccant requirement for finished products
MBB size (cm)
Pack type
Total units of desiccant required
20.5
47.5
5 tray
4
17
43
1 tray
4
22.5
30
reel, 180  12/16/24
4
38.1
45.7
reel, 330  12/16/24
6
40
48.3
reel, 330  32/44
6
9
61
SO-S tube
4
13.5
65
SO-L tube
4
20
67
PLCC tube
5
20
75
SMS tube
6
11
61
HSOP20 tube
4
11.1.2 Humidity Indicator Card (HIC) requirements
• The HIC shall have three color spots with sensitivity values of 5 %, 10 % and 60 %
RH.
• The HIC shall comply with Ref. 4 “IPC/JEDEC J-STD-033C” and be Cobalt free
version.
11.1.3 Moisture Barrier Bag (MBB) requirements
The moisture barrier bag shall meet Ref. 6 “MIL-PRF-81705E (W/AMENDMENT 1)”, Type
I requirements for flexibility, ESD protection, mechanical strength, and puncture
resistance. The bags shall be heat sealable. The Water Vapor Transmission Rate (WVTR)
shall be ≤0.0310 g/m2 (0.002 g/100 in2) in 24 hours at 40 C after flex testing per condition
‘‘E’’ Ref. 1 “ASTM F392 / F392M-11”. The WVTR is measured using Ref. 2 “ASTM
F1249-13”.
11.1.4 Requirements for a material drying oven
• Temperature: +55 C + 0 C/5 C.
• A dry air inlet, producing 10 liters of dry air per minute per 1 m3 cabinet space. Dry air
can be obtained from e.g. the standard high pressure (>4 ATO) air supply, the use of a
dust and oil filter is obligatory.
• The heating system is in the bottom part of the oven. This results in an RH of 1/4th of
the original RH from the air inlet, or 1/5th at Tamb = 20 C.
• Sufficient ventilation by openings in bottom and top, total 50 cm2.
• Use a humidity indicator to check the RH in the cabinet.
11.2 Dry-pack process requirements
In the dry-pack process, the carriers (trays, tubes, and reels) are placed in a qualified
moisture barrier bag, with desiccants and a humidity indicator (HIC). The bag is
pre-printed (if not: labeled) with a moisture caution label and the packing (PQ) box is
identified (pre-printed) with a moisture warning sticker/printed logo.
Remark: The Moisture Barrier Bag must not be folded or creased. Do not use any MBB
that has been creased or crumpled.
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Remark: When, at repacking, a new bag and new desiccant is packed, the Bag Seal Date
line on the moisture caution label must be filled in.
11.3 Sealing requirements
• Seal the MBB using “light vacuum” to reduce packing bulk, refer to Ref. 4
“IPC/JEDEC J-STD-033C”. The sealing condition should be adjusted for proper
sealing quality, based on visual inspection.
– The minimum vacuum condition is when the MBB is pulled closely around the
wafer box, trays, tubes, or reels with no air pockets between that MBB and the
wafer box, trays, tubes, or reels.
– The vacuum condition is too severe if the MBB is damaged or the wafer box, tubes,
or reels are deformed.
– For Wafer packs, the vacuum condition is too severe if the wafers show increased
breakage rates during handling.
• The sealed packs need a consistent and uniform appearance.
• Wafer packs should have the excess MBB folded and taped around the wafer box.
• The bag shall be sealed at 7 mm to 10 mm from the open edge to allow an additional
3 seal operation of this bag.
• Use heat sealing conditions recommend by MBB supplier.
• Establish and routinely run seal quality monitor on the MBB seal operation.
• To enable a visual check on the presence of a HIC, the HIC can be placed on top of
the desiccant bag that in turn is placed on top of the wafer box.
• For partial packing in tape and reel, recommend inserting the additional guard band at
the outer layer nearby the edge of reel (especially for lightweight reel) before dry
packing to minimize the possibility of reel flank bent.
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12. References
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[1]
ASTM F392 / F392M-11 — Standard Practice for Conditioning Flexible Barrier
Materials for Flex Durability
[2]
ASTM F1249-13 — Standard Test Method for Water Vapor Transmission Rate
Through Plastic Film and Sheeting Using a Modulated Infrared Sensor
[3]
IPC/JEDEC J-STD-020 — Moisture/Reflow sensitivity classification for Non
hermetic solid state Surface Mount Devices
[4]
IPC/JEDEC J-STD-033C — Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices
[5]
MIL-D-3464E — MILITARY SPECIFICATION: DESICCANTS, ACTIVATED,
BAGGED, PACKAGING USE AND STATIC DEHUMIDIFICATION
[6]
MIL-PRF-81705E (W/AMENDMENT 1) — PERFORMANCE SPECIFICATION:
BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC PROTECTIVE, HEATSEALABLE
[7]
Terms and conditions of commercial sale —
http://www.nxp.com/about/sales-offices-distributors/general-terms-and-conditions-of
-commercial-sale.html
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13. Legal information
13.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
13.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
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Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
13.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 3.00 — 9 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
14 of 15
UM10569
NXP Semiconductors
Store and transport requirements
14. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
9
10
10.1
10.2
11
11.1
11.1.1
11.1.2
11.1.3
11.1.4
11.2
11.3
12
13
13.1
13.2
13.3
14
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Objectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General conditions . . . . . . . . . . . . . . . . . . . . . . 3
Receiving inspection . . . . . . . . . . . . . . . . . . . . . 4
Store conditions. . . . . . . . . . . . . . . . . . . . . . . . . 4
Transport conditions . . . . . . . . . . . . . . . . . . . . . 4
General transport conditions. . . . . . . . . . . . . . . 4
Conditioned air transport . . . . . . . . . . . . . . . . . 5
Shelf life conditions. . . . . . . . . . . . . . . . . . . . . . 5
Packed end products . . . . . . . . . . . . . . . . . . . . 5
Wafers and bare die . . . . . . . . . . . . . . . . . . . . . 5
Maximum shelf life versus humidity . . . . . . . . . 6
Floor life and bake to seal time . . . . . . . . . . . . 7
Dry-baking and drying. . . . . . . . . . . . . . . . . . . . 7
Dry-baking . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Drying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Dry-packing . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Material requirements . . . . . . . . . . . . . . . . . . . 10
Desiccant requirements . . . . . . . . . . . . . . . . . 10
Humidity Indicator Card (HIC) requirements. . 11
Moisture Barrier Bag (MBB) requirements . . . 11
Requirements for a material drying oven . . . . 11
Dry-pack process requirements . . . . . . . . . . . 11
Sealing requirements . . . . . . . . . . . . . . . . . . . 12
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 9 March 2015
Document identifier: UM10569