ROHM BD8201FM_07

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Structure
Product Name
Device Name
Externals dimensional drawing
POWER DISSIPATION
BLOCK DIAGRAM
Applied circuit chart
Features
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Silicon Monolithic Integrated Circuit
Power Driver For CD/DVD Players
BD8201FM
Figure 1
Figure 2
Figure 3
Figure 4
・It is 4ch driver IC of BTL driver 3 ch and Loading driver 1 ch.
・Loading driver is high D range type of MOS Output
・With Loading driver Output voltage setting terminal.
・With MUTE SW.
・A built-in thermal shutdown circuit is installed.
・Built in Power-supply voltage descent Mute.
・BIAS Voltage descent Mute.
・HSOP-M28 Package
● ABSOLUTE MAXIMUM RATINGS (Ta=25℃)
Parameter
Symbol
Power Supply Voltage
Vcc
Power Dissipation
Pd
Operating Temperature Range
Topr
Storage Temperature Range
Tstg
Limits
15
2.2 *
-40 to +85
-55 to +150
Unit
V
W
℃
℃
*1 When mounted on the glass/epoxy board with the size: 70 mm×70 mm, the thickness: 1.6 mm,
and the rate of copper foil occupancy area: 3% or less.
Over Ta=25°C, derating at the rate of 17.6mW/°C.
● Range of operation power-supply voltage
Parameter
Symbol
MIN
TYP
MAX
Unit
BTL driver Pre part power-supply voltage
BTL driver CH1 part power-supply voltage
BTL driver CH2,3 part power-supply voltage
Loading driver power-supply voltage
PREVCC
VCC1
VCC23
LDVCC
4.5
4.5
4.5
4.5
7.5
7.5
5.0
7.5
14
PREVCC
PREVCC
14
V
V
V
V
REV. A
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● ELECTRIC CHARACTERISTICS
(Unless otherwise noted Ta=25℃, PREVCC=LDVCC=VCC1=7.5V,VCC23=5V,BIAS=1.65V, RL=8Ω)
Parameter
Symbol
Circuit Current (at no signal) (LDVcc)
ICCLD
Circuit Current (at no signal) (Vcc1)
ICC1
Circuit Current (at no signal) (Vcc23)
ICC23
Circuit Current (at no signal) (PreVcc)
ICCPRE
<BTL Driver CH1∼CH3>
Output Offset Voltage
VOFS
Maximum Output Amplitude (CH1)
VOM1
Maximum Output Amplitude (CH2,3)
VOM23
Closed circuit voltage gain (CH1)
GVC1
Closed circuit voltage gain (CH2,3)
GVC2
Positive and negative voltage gain (CH1∼CH3) ΔGVC
Mute ON Voltage
VMON
Mute・Release voltage
VMOFF
Mute terminal inflow current
IMUTE
Bias Terminal Input Current
IBIAS
<Loading driver block CH4>
Output Offset Voltage
VOFSL
Input terminalthreshold voltageH
VIH
Input terminalthreshold voltageM
VIM
Input terminalthreshold voltageL
VIL
Maximum Output Amplitude
VOMLD
Voltage gain (Loading)
GVLD
Positive and negative voltage gain (Loading) ΔGVLD
Input terminal inflow current
IINL
Terminal LDCONT inflow current
ILDC
MIN.
TYP.
MAX.
Unit
Condition
−
−
−
−
−
−
−
−
1.5
1.0
1.0
25
mA
mA
mA
mA
Under braking
No load applied
No load applied
No load applied
-50
4.7
3.7
9
16
-2.0
GND
2.0
−
−
0
5.4
4.0
12
18
0
−
−
50
50
+50
−
−
15
20
2.0
0.5
PREVCC
100
100
mV
V
V
dB
dB
dB
V
V
μA
μA
-35
2.8
1.2
GND
6.7
4.0
-2.0
−
−
0
−
−
−
−
6.0
0
30
25
+35
LDVCC
2.1
0.5
−
8.0
2.0
60
80
mV
V
V
V
V
dB
dB
μA
μA
● Not designed for radiation resistance.
● OUTLINE DIMENSIONS, SYMBOLS
BD8201FM
Lot No.
REV. A
RIN=10KΩ
VMUTE=3.3V
Under braking
RL=9Ω
LDCONT=1V
LDIN=3.3V
LDCONT=3.3V
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● APPLICATION CIRCUIT DIAGRAM
T.S.D : (Thermal shutdown)
Resistance unit : [Ω]
● Each terminal explanation
No
Pin Name
Description
.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Note:
LDMUTE
LDIN
LDCONT
MUTE
BIAS
LDGND
LDVCC
PREGND
PREVCC
VCC1
TEST
GND
VO1(-)
VO1(+)
Loading driver MUTE terminal
Loading driver input terminal
Loading driver Voltage setting terminal
BTL driver MUTE terminal (CH1,CH2,CH3)
Bias input terminal
GND terminal (Loading driver part)
VCC terminal (Loading driver part)
(BTL driver,Pre part)
(BTL driver,Pre part)
VCC terminal (CH1 POWER part)
Input terminal for TEST mode
GND terminal (CH1 POWER part)
BTL driver (CH1) negative output terminal
BTL driver (CH1) positive output terminal
No.
Pin Name
Description
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VO2(+)
VO2(-)
VO3(+)
VO3(-)
GND
GND
VCC2,3
LDVCC
LDGND
VIN1
VIN2
VIN3
LDOUT(-)
LDOUT(+)
BTL driver (CH2) positive output terminal
BTL driver (CH2) negative output terminal
BTL driver (CH3) positive output terminal
BTL driver (CH3) negative output terminal
GND terminal (CH2,CH3 POWER part)
GND terminal (CH2,CH3 POWER part)
Power supply voltage terminal (CH2,CH3 POWER part)
VCC terminal (Loading driver part)
GND terminal (Loading driver part)
CH1 input terminal
CH2 input terminal
CH3 input terminal
Loading driver negative output terminal
Loading driver positive output
The positive or negative polarity of driver outputs is determined by the input polarity.
● Function Description
1. MUTE(Pin 4)
BTL driver part (CH1 to CH3) can be switched mode ON/OFF by inputting H lever (above 2.0V) or L level (below 0.5V) to this terminal.
2. LDMUTE(Pin 1)
Loading driver part can be switched ON/OFF by inputting H level (above 2.0V) or L level (below 0.5V) to this terminal.
3.BIAS dropping mute
Setting BIAS terminal (Pin5) voltage to 0.7 or below (Typ.) will activate mute function for BTL driver part (CH1 to CH3). Set BIAS terminal voltage to 1.1V or above.
REV. A
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4. The following table shows logics for loading driver operation.
IN P U T
O U TP U T
L D M U TE
L D IN
LDCO NT
O U T+
O U T-
L
X
X
Hi Z
Hi Z
H ig h im pe dan c e
F U N C TIO N
H
X
< 0 .7 V
Hi Z
Hi Z
H ig h im pe dan c e
H
L
> 0 .7 V
L
H
R E V m o de
H
H
> 0 .7 V
H
L
F W D m o de
H
M or Hi Z
> 0 .7 V
L
L
B r e ak m o de
Although the output voltage can be changed by the input voltage through the LDCONT terminal (gain 6dB Typ.), it never exceeds the maximum output voltage restricted
by the power supply voltage even if applying a voltage much larger than the normal value.
Also, output of loading driver corresponded to LDCONT terminal becomes High-impedance mode by setting LDCONT terminal (3pin) to 0.7V or below.
5.Protection circuit for VCC and GND fault
This IC contains protection circuit for VCC and GND fault to prevent itself from breaking caused by short between BTL driver output pin and VCC (VCC fault) or BTL
driver output pin and GND (GND fault).
Make sure output pin should not short to VCC or GND. However in case VCC and GND fault occur, internal circuit prevents IC from breaking by limiting current.
(available for only CH1, CH2, CH3)
Protection circuit for GND fault is contained to prevent from breaking caused by short between loading driver output pin and GND. Make sure output pin should not short
to GND. However in case GND fault occurs, internal circuit prevents IC from breaking by limiting current.
● Caution on use
1.Bypass capacitor
Connect bypass capacitor(0.1μF) close to this IC pin between power supplies. Also, connect capacitor(10μF∼) which is greater capacity and small ESR close to power
supply terminal for reducing impedance.
2.TEST terminal
TEST terminal is pulled-up in IC, therefore use it as open or by shorted with VCC.
3.About absolute maximum ratings
Exceeding the absolute maximum ratings, such as the applied voltage or the operating temperature range, may cause permanent device damage. As these cases cannot be
limited to the broken short mode or the open mode, if a special mode where the absolute maximum ratings may be exceeded is assumed, it is recommended to take
mechanical safety measures such as attaching fuses..
4.About power supply lines
As a measure against the back current regenerated by a counter electromotive force of the motor, a capacitor to be used as a regenerated-current path can be installed
between the power supply and GND and its capacitance value should be determined after careful check that any problems, for example, a leak capacitance of the
electrolytic capacitor at low temperature, are not found in various characteristics.
5.About GND potential
The electric potential of the GND terminal must be kept lowest in the circuitry at any operation states
6.About thermal design
With consideration of the power dissipation (Pd) under conditions of actual use, a thermal design provided with an enough margin should be done.
7.About operations in a strong electric field
When used in a strong electric field, note that a malfunction may occur.
8.ASO
When using this IC, the output Tr must be set not to exceed the values specified in the absolute maximum ratings and ASO.
9.Thermal shutdown circuit
This IC incorporates a thermal shutdown circuit (TSD circuit). When the chip temperature reaches the value shown below, the coil output to the motor will be set to open.
The thermal shutdown circuit is designed only to shut off the IC from a thermal runaway and not intended to protect or guarantee the entire IC functions.
Therefore, users cannot assume that the TSD circuit once activated can be used continuously in the subsequent operations.
TSD ON Temperature [℃](typ.)
175
Hysteresis Temperature [℃](typ.)
25
10.About earth wiring patterns
When a small signal GND and a large current GND are provided, it is recommended that the large current GND pattern and the small signal GND pattern should be separated
and grounded at a single point of the reference point of the set in order to prevent the voltage of the small signal GND from being affected by a voltage change caused by the
resistance of the pattern wiring and the large current.
Make sure that the GND wiring patterns of the external components will not change, too.
11. About each input terminal
This IC is a monolithic IC which has a P+ isolations and P substrate to isolate elements each other.
This P layer and an N layer in each element form a PN junction to construct various parasitic elements.
Due to the IC structure, the parasitic elements are inevitably created by the potential relationship.
Activation of the parasitic elements can cause interference between circuits and may result in a malfunction or, consequently, a fatal damage. Therefore, make sure that the IC
must not be used under
conditions that may activate the parasitic elements, for example, applying the lower voltage than the ground level(GND, P substrate) to the input terminals.
Note that, while not applying the power supply voltage to the IC, any voltage must not be applied to the input terminals. In addition, do not apply the voltage to input
terminals without applying the
power supply voltage to the IC. Also while applying the power supply voltage, each input terminal must be the power supply voltage or less; or within the guaranteed values in
the electric characteristics.
REV. A
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
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Appendix1-Rev2.0