1/4 Structure ： Silicon Monolithic Integrated Circuit Product Series ： Power Driver for Compact disc player type ： ＢＤ８２２２ＥＦＶ Feature ： ・4CH BTL Driver. ・Employs the HTSSOP-B24PIN power package for compaction. ・Has a wide dynamic range.（PowVcc1=8V, RL=8Ω、6.0Ｖ(typ.)） ・The thermal shutdown circuit contained. ・Switches CH2 input by Control input terminal(CNT). ・Incorporates mute function by CNT terminal and mute terminal. ○Absolute maximum ratings(Ta=25℃) Parameter Power supply voltage CNT terminal MUTE terminal BIASSW terminal Symbol PowVcc 1,PowVcc 2 BIAS1, BIAS2, LDIN, SLIN, IN1, IN3, IN4 CNT MUTE1,2, 3 4 BIASSW Power dissipation Pd Input terminal Operating temperature range Storage temperature Junction temperature Topr Tstg Tjmax Limits 15 Unit Ｖ PowVcc 2 Ｖ PowVcc 2 PowVcc 2 PowVcc 2 1.1*1 4.0*2 -40∼+85 -55∼+150 +150 Ｖ Ｖ Ｖ Ｗ ℃ ℃ ℃ *1 70mm×70mm×1.6mm, occupied copper foil is less than 3%,one layer substrate(back copper foil 0mm×0mm) Reduce power by 8.8mW for each degree above 25℃. *2 70mm×70mm×1.6mm, occupied copper foil is less than 3%,four layer substrate(back copper foil 70mm×70mm) Reduce power by 32.0mW for each degree above 25℃. ○Operating conditions (Set the power supply voltage taking allowable dissipation into considering.) PowVcc 1,2 4.5 ∼ 10（Ｖ） Please use it with PowVcc 1= PowVcc 2 Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. Be careful to handle because the content of the description of this material might correspond to the labor (technology in the design, manufacturing, and use) in foreign country exchange and Foreign Trade Control Law. A radiation is not designed. REV. A 2/4 ○ Electrical characteristics （Unless otherwise noted, Ta=25℃, PowVcc1=PowVcc2=8V, BIAS=1.65V, RL=8Ω） Parameter Quiescent dissipation current < Driver > Output offset voltage (CH1,2) Output offset voltage (CH3,4) Maximum output amplitude (CH1,2) Maximum output amplitude (CH3,4) Closed circuit voltage gain (CH1,2) Closed circuit voltage gain (CH3,4) Input impedance (CH1,2) Input impedance (CH3,4) LD Internal reference voltage 1 LD Internal reference voltage 2 < Each function terminal > MUTE terminal low level input voltage MUTE terminal high level input voltage CNT terminal low level input voltage CNT terminal high level input voltage BIASSW terminal low level input voltage BIASSW terminal high level input voltage MUTE2 terminal low level input current MUTE2 terminal high level input current MUTE134 terminal low level input current MUTE134 terminal high level input current CNT terminal low level input current CNT terminal high level input current BIASSW terminal low level input current BIASSW terminal high level input current BIAS input terminal input current Symbol MIN TYP MAX Unit IQ − 30 45 mA At no-load Voof1 Voof2 VOM1 VOM2 Gvc1 Gvc2 ZIN1 ZIN2 INLDV1 INLDV2 -100 -50 5.4 4.7 24.0 15.5 13 31 1.52 2.30 0 0 6.0 5.3 25.7 17.5 20 47 1.65 2.50 100 50 − − 27.4 19.5 27 63 1.78 2.70 mV mV V V dB dB kΩ kΩ V V VIN=±0.3V VIN=±0.3V PIN21,22,24 PIN18,19 PIN20=H PIN20=L VML VMH VCNTL VCNTH VBSL VBSH IMTL IMTH IMTL IMTH ICNTL ICNTH IBSL IBSH IB1 − 2.0 − 2.0 − 2.0 -15 − -15 − -15 − -15 − − − − − − − − 0.5 − 0.5 − 0.5 − 15 170 15 360 15 170 15 170 104 V V V V V V µA µA µA µA µA µA µA µA µA 0 85 0 180 0 85 0 85 52 Condition PIN13,14,15 〃 PIN14=0V PIN14=5V PIN13=0V PIN13=5V PIN23=0V PIN23=5V PIN20=0V PIN20=5V PIN17=1.65V VIN：IN1, SLIN, IN3, and the IN4 voltage are the BIAS voltages. LDIN : ①1.65V＋0.05V、1.65V＋0.15V（LD Internal reference voltage 1.65V (typ.) ） ②2.5V＋ 0.05V、2.5V＋0.15V（LD Internal reference voltage 2.5V (typ.) ） ○Package outlines：HTSSOP-B24 D8222EFV Lot.No HTSSOP-B24(UNIT：mm) REV. A 3/4 ○Block diagram 24 23 22 21 20k 20k CNT 19 20k 18 17 BIAS 2.5V 15 14 13 MUTE2 MUTE1,3,4 PreGND 94k 94k 80k 16 47k 47k BIAS SW 80k 80k 20 1.65V T.S.D PowVcc1 PowGND1 LEVEL SHIFT LEVEL SHIFT LEVEL SHIFT LEVEL SHIFT 10k 10k 10k 10k 10k 10k 10k 10k 10k 10k 1 2 3 10k 10k CH1 4 5 10k 10k CH2 6 7 10k 10k CH3 PowGND2 PowVcc2 CH4 8 9 10 11 12 T.S.D：Thermal Shut-Down ○Pin description No. Symbol 1 PowVcc1 2 PowGND 3 VO1(-) 4 VO1(+) 5 Description No. Symbol 13 MUTE1,3,4 Power GND 14 MUTE2 Driver CH1 negative output 15 To Driver CH1 positive output 16 PreGND VO2(-) Driver CH2 negative output 17 BIAS 6 VO2(+) Driver CH2 positive output 18 IN4 CH4 input 7 VO3(-) Driver CH3 negative output 19 IN3 CH3 input 8 VO3(+) Driver CH3 positive output 20 BIASSW 9 VO4(-) Driver CH4 negative output 21 LDIN 10 VO4(+) Driver CH4 positive output 22 SLIN SL input 11 PowGND Power GND 23 CNT Control input terminal 12 PowVcc2 Pre Block and CH3,4 power supply terminal 24 IN1 IN1 input CH1,2 power supply terminal REV. A Description MUTE 1,3,4 terminal MUTE 2 terminal TEST OUT terminal PreGND BIAS input LD Reference voltage switch terminal LD input 4/4 ○ Cautions in using the IC 1. Absolute maximum ratings We are careful enough for quality control about this IC. So, there is no problem under normal operation, excluding that it exceeds the absolute maximum ratings. However, this IC might be destroyed when the absolute maximum ratings, such as impressed voltages or the operating temperature range, is exceeded, and whether the destruction is short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating is assumed. 2. 3. Reverse polarity connection Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part. Please utilize the direction protection device as a diode in the supply line and motor coil line. Power supply line Due to return of regenerative current by reverse electromotive force, using electrolytic and ceramic suppress filter capacitors (0.1µF) close to the IC power input terminals (Vcc and GND) are recommended. Please note the electrolytic capacitor value decreases at lower temperatures and examine to dispense physical measures for safety. And, for ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of wiring. 4. GND line 5. Thermal design 6. 7. 8. 9. 10. 11. 12. Please keep the GND line the lowest potential always, and check the GND voltage when transient voltages are connected to the IC. Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough temperature margins. This product has exposed the frame to the back side of the package, but please note that it is assumed to use heat radiation efficiency by the heat radiation for this part. Please take the heat radiation pattern on not only the surface of the substrate but also the back of the substrate widely. Short circuit mode between terminals and wrong mounting Do not mount the IC in the wrong direction and displacement, and be careful about the reverse-connection of the power connector. Moreover, this IC might be destroyed when the dust short the terminals between them or GND. Radiation Strong electromagnetic radiation can cause operation failures. ASO (Area of Safety Operation) Do not exceed the maximum ASO and the absolute maximum ratings of the output driver. TSD (Thermal Shut-Down) The TSD is activated when the junction temperature (Tj) exceeds Tjmax, and the output terminal is switched to OPEN. The guarantee and protection of set are not purpose. Therefore, please do not use this IC after TSD circuit operates, nor use it for assumption that operates the TSD circuit. Capacitor between output driver and GND If a large capacitor is connected between the output driver and GND, this IC might be destroyed when Vcc becomes 0V or GND, because the electric charge accumulated in the capacitor flows to the output driver. Please set said capacitor to smaller than 0.1µF. Inspection by the set circuit board The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please discharge electricity in each and all process. Moreover, when attaching or detaching from jig in the inspection process, please turn off the power before mounting the IC, and turn on after mounting the IC, and vice versa. In addition, please take into consideration the countermeasures for electrostatic damage, such as giving the earth in assembly process, transportation or preservation. Input terminal This IC is a monolithic IC, and has P+ isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer and N-layer of each element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure below. When the GND voltage potential is greater than the voltage potential at Terminals A on the resistor, at Terminal B on the transistor, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding elements close to said parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the interference of circuit operation, then the wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than GND (P substrate). Please do not apply the voltage to the input terminal when the power-supply voltage is not impressed. Moreover, please impress each input terminal lower than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage is impressing. Resistor Transistor(NPN) Terminal-A Terminal-B C Terminal-B B E Terminal-A B P+ Parasitic element P+ P C E P+ P P+ Surrounding elements P-Substrate P-Substrate Parasitic element GND Parasitic element GND Parasitic element GND GND Simplified structure of IC 13. Earth wiring pattern If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and large current not to change voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of external parts, it is similar to the above-mentioned. REV. A Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2007 ROHM CO.,LTD. THE AMERICAS / EUPOPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev2.0