74HC4851; 74HCT4851
8-channel analog multiplexer/demultiplexer with
injection-current effect control
Rev. 02 — 2 September 2008
Product data sheet
1. General description
The 74HC4851; 74HCT4851 are high-speed Si-gate CMOS devices and are specified in
compliance with JEDEC standard no. 7A.
The 74HC4851; 74HCT4851 are 8-channel analog multiplexers/demultiplexers with three
digital select inputs (S0 to S2), an active-LOW enable input (E), eight independent
inputs/outputs (Y0 to Y7) and a common input/output (Z). The devices feature
injection-current effect control, which has excellent value in automotive applications where
voltages in excess of the supply voltage are common.
With E LOW, one of the eight switches is selected (low impedance ON-state) by S0 to S2.
With E HIGH, all switches are in the high-impedance OFF-state, independent of S0 to S2.
The injection-current effect control allows signals at disabled analog input channels to
exceed the supply voltage without affecting the signal of the enabled analog channel.
This eliminates the need for external diode/resistor networks typically used to keep the
analog channel signals within the supply-voltage range.
2. Features
n Injection-current cross coupling < 1 mV/mA
n Wide supply voltage range from 2.0 V to 6.0 V for 74HC4851
n ESD protection:
u HBM JESD22-A114E exceeds 2000 V
u CDM JESD22-C101C exceeds 1000 V
n Latch-up performance exceeds 100 mA per JESD 78 Class II level A
n Low ON-state resistance:
u 400 Ω (typical) at VCC = 2.0 V
u 215 Ω (typical) at VCC = 3.0 V
u 120 Ω (typical) at VCC = 3.3 V
u 76 Ω (typical) at VCC = 4.5 V
u 59 Ω (typical) at VCC = 6.0 V
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
3. Applications
n
n
n
n
Analog multiplexing and demultiplexing
Digital multiplexing and demultiplexing
Signal gating
Automotive application
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC4851D
−40 °C to +125 °C
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
74HC4851PW
−40 °C to +125 °C
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
74HC4851BQ
−40 °C to +125 °C
DHVQFN16 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5 × 3.5 × 0.85 mm
SOT763-1
74HCT4851D
−40 °C to +125 °C
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
74HCT4851PW −40 °C to +125 °C
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
74HCT4851BQ −40 °C to +125 °C
DHVQFN16 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5 × 3.5 × 0.85 mm
SOT763-1
5. Functional diagram
11
10
9
6
13
S0
S1
S2
11
14
10
15
9
12
1
5
2
E
6
4
3
0
8X
2
G8
Y0
Y1
MUX/DMUX
0
Y2
1
Y3
2
Y4
3
Y5
Y6
5
Y7
6
7
13
14
15
12
1
5
2
4
001aad542
001aad541
Fig 2. IEC logic symbol
74HC_HCT4851_2
Product data sheet
3
4
Z
Fig 1. Logic symbol
0
7
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
2 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
VCC
16
S0
S1
11
10
1-OF-8
DECODER
S2
E
9
6
INJECTION
CURRENT
CONTROL
13
INJECTION
CURRENT
CONTROL
14
INJECTION
CURRENT
CONTROL
15
INJECTION
CURRENT
CONTROL
12
INJECTION
CURRENT
CONTROL
1
INJECTION
CURRENT
CONTROL
5
INJECTION
CURRENT
CONTROL
2
INJECTION
CURRENT
CONTROL
4
INJECTION
CURRENT
CONTROL
3
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Z
8
001aaf875
GND
Fig 3. Functional diagram
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
3 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
6. Pinning information
6.1 Pinning
74HC4851
74HCT4851
Y4
terminal 1
index area
16 VCC
74HC4851
74HCT4851
1
16 VCC
Y6
2
15 Y2
Y6
2
15 Y2
Z
3
14 Y1
Z
3
14 Y1
Y7
4
13 Y0
Y5
5
E
6
n.c.
7
5
12 Y3
E
6
11 S0
n.c.
7
10 S1
GND
8
9
S2
12 Y3
GND(1)
11 S0
10 S1
9
Y5
S2
13 Y0
8
4
GND
Y7
1
Y4
001aaf877
Transparent top view
001aaf876
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
a supply pin or input.
Fig 4. Pin configuration SO16 and TSSOP16
Fig 5. Pin configuration DHVQFN16
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
Y4
1
independent input/output
Y6
2
independent input/output
Z
3
common input/output
Y7
4
independent input/output
Y5
5
independent input/output
E
6
enable input (active LOW)
n.c.
7
not connected
GND
8
ground (0 V)
S2
9
select input
S1
10
select input
S0
11
select input
Y3
12
independent input/output
Y0
13
independent input/output
Y1
14
independent input/output
Y2
15
independent input/output
VCC
16
supply voltage
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
4 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
7. Functional description
Table 3.
Function table[1]
Input
Channel ON
E
S2
S1
S0
L
L
L
L
Y0 to Z
L
L
L
H
Y1 to Z
L
L
H
L
Y2 to Z
L
L
H
H
Y3 to Z
L
H
L
L
Y4 to Z
L
H
L
H
Y5 to Z
L
H
H
L
Y6 to Z
L
H
H
H
Y7 to Z
H
X
X
X
-
[1]
H = HIGH voltage level;
L = LOW voltage level;
X = don’t care.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Min
Max
Unit
−0.5
+7.0
V
input voltage
[1]
−0.5
VCC + 0.5
V
VSW
switch voltage
[2]
−0.5
VCC + 0.5
V
IIK
input clamping current
VI < −0.5 V or VI > VCC + 0.5 V
-
±20
mA
ISK
switch clamping current
VSW < −0.5 V or VSW > VCC + 0.5 V
-
±20
mA
ISW
switch current
VSW > −0.5 V or VSW < VCC + 0.5 V
-
±25
mA
ICC
supply current
-
50
mA
VI
Conditions
IGND
ground current
−50
-
mA
Tstg
storage temperature
−65
+150
°C
Ptot
total power dissipation
-
500
mW
Tamb = −40 °C to +125 °C
[3]
[1]
The minimum and maximum input voltage rating may be exceeded if the input clamping current rating is observed.
[2]
The minimum and maximum switch voltage rating may be exceeded if the switch clamping current rating is observed.
[3]
For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C.
For TSSOP16 package: Ptot derates linearly with 5.5 mW/K above 60 °C.
For DHVQFN16 packages: Ptot derates linearly with 4.5 mW/K above 60 °C.
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
5 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
Conditions
VCC
supply voltage
74HC4851
74HCT4851
Unit
Min
Typ
Max
Min
Typ
Max
2.0
-
6.0
4.5
5.0
5.5
V
VI
input voltage
0
-
VCC
0
-
VCC
V
VSW
switch voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
−40
-
+125
−40
-
+125
∆t/∆V
input transition rise and
fall rate
VCC = 2.0 V
-
6.0
1000
-
-
-
ns/V
VCC = 3.0 V
-
6.0
800
-
-
-
ns/V
VCC = 3.3 V
-
6.0
800
-
-
-
ns/V
VCC = 4.5 V
-
6.0
500
-
6.0
500
ns/V
VCC = 6.0 V
-
6.0
400
-
-
-
ns/V
°C
10. Static characteristics
Table 6.
RON resistance
At recommended operating conditions; voltages are referenced to GND (ground 0 V); For test circuit see Figure 8.
Symbol
Parameter
25 °C
Conditions
Min
Typ
−40 °C to +85 °C −40 °C to +125 °C Unit
Max
Min
Max
Min
Max
74HC4851
RON(peak) ON resistance VI = VCC to GND; E = VIL
(peak)
VCC = 2.0 V; ISW = 2 mA
-
400
650
-
670
-
700
Ω
VCC = 3.0 V; ISW ≤ 2 mA
-
215
330
-
360
-
380
Ω
VCC = 3.3 V; ISW ≤ 2 mA
-
120
270
-
305
-
345
Ω
VCC = 4.5 V; ISW ≤ 2 mA
-
76
210
-
240
-
270
Ω
VCC = 6.0 V; ISW ≤ 2 mA
-
59
195
-
220
-
250
Ω
-
4
10
-
15
-
20
Ω
-
2
8
-
12
-
16
Ω
∆RON
ON resistance VI = 0.5 × VCC; E = VIL
mismatch
VCC = 2.0 V; ISW = 2 mA
between
VCC = 3.0 V; ISW ≤ 2 mA
channels
VCC = 3.3 V; ISW ≤ 2 mA
-
2
8
-
12
-
16
Ω
VCC = 4.5 V; ISW ≤ 2 mA
-
2
8
-
12
-
16
Ω
VCC = 6.0 V; ISW ≤ 2 mA
-
3
9
-
13
-
18
Ω
RON(peak) ON resistance VI = VCC to GND; E = VIL
(peak)
VCC = 4.5 V; ISW ≤ 2 mA
-
76
210
-
240
-
270
Ω
-
2
8
-
12
-
16
Ω
74HCT4851
∆RON
ON resistance VI = 0.5 × VCC; E = VIL
mismatch
VCC = 4.5 V; ISW ≤ 2 mA
between
channels
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
6 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
Table 7.
Injection current coupling
At recommended operating conditions; voltages are referenced to GND (ground 0 V); For test circuit see Figure 9.
Symbol
Parameter
Conditions
74HC4851
74HCT4851
Min
Typ[1]
Max
Min
Typ[1]
Unit
Max
VCC = 3.3 V
-
0.05
1
-
-
-
mV
VCC = 5.0 V
-
0.03
1
-
0.03
1
mV
VCC = 3.3 V
-
0.55
5
-
-
-
mV
VCC = 5.0 V
-
0.27
5
-
0.27
5
mV
VCC = 3.3 V
-
0.04
2
-
-
-
mV
VCC = 5.0 V
-
0.03
2
-
0.03
2
mV
VCC = 3.3 V
-
0.56
20
-
-
-
mV
VCC = 5.0 V
-
0.48
20
-
0.48
20
mV
Tamb = −40 °C to +125 °C
∆VO
|ISW| ≤ 1 mA; RS ≤ 3.9 kΩ
output voltage
variation
[2][3]
|ISW| ≤ 10 mA; RS ≤ 3.9 kΩ
|ISW| ≤ 1 mA; RS ≤ 20 kΩ
|ISW| ≤ 10 mA; RS ≤ 20 kΩ
[1]
Typical values are measured at Tamb = 25 °C.
[2]
∆VO here is the maximum variation of output voltage of an enabled analog channel when current is injected into any disabled channel.
[3]
ISW = total current injected into all disabled channels.
Table 8.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V);
25 °C
Symbol Parameter
Conditions
−40 °C to +85 °C −40 °C to +125 °C
Min
Typ
Max
Min
Max
Min
Max
Unit
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 3.3 V
2.3
-
-
2.3
-
2.3
-
V
VCC = 4.5 V
3.15
-
-
3.15
-
3.15
-
V
VCC = 6.0 V
4.2
-
-
4.2
-
4.2
-
V
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 3.3 V
-
-
1.0
-
1.0
-
1.0
V
VCC = 4.5 V
-
-
1.35
-
1.35
-
1.35
V
VCC = 6.0 V
-
-
1.8
-
1.8
-
1.8
V
-
-
±0.1
-
±0.1
-
±1.0
µA
74HC4851
VIH
VIL
II
HIGH-level
input
voltage
LOW-level
input
voltage
input
leakage
current
control inputs
control inputs
control inputs;
VI = GND or VCC
VCC = 6.0 V
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
7 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
Table 8.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground 0 V);
25 °C
Symbol Parameter
Conditions
IS(OFF)
E = VIH; VI = GND or VCC;
VO = VCC or GND;
VCC = 6.0 V; see Figure 6
OFF-state
leakage
current
−40 °C to +85 °C −40 °C to +125 °C
Min
Typ
Max
Min
Max
Min
Max
Unit
per channel
-
-
±0.1
-
±0.5
-
±1.0
µA
all channels
-
-
±0.2
-
±2.0
-
±4.0
µA
IS(ON)
ON-state
leakage
current
E = VIL; VI = GND or VCC;
VO = VCC or GND;
VCC = 6.0 V; see Figure 7
-
-
±0.1
-
±0.5
-
±1.0
µA
ICC
supply
current
VI = GND or VCC;VCC = 6.0 V
-
-
2.0
-
5.0
-
20.0
µA
CI
input
S0, S1, S2 and E
capacitance
-
2
10
-
10
-
10
pF
Csw
switch
Z; OFF-state
capacitance Yn; OFF-state
-
15
40
-
40
-
40
pF
-
3
15
-
15
-
15
pF
2.0
-
-
2.0
-
2.0
-
V
-
-
0.8
-
0.8
-
0.8
V
-
-
±0.1
-
±0.1
-
±1.0
µA
per channel
-
-
±0.1
-
±0.5
-
±1.0
µA
all channels
-
-
±0.2
-
±2.0
-
±4.0
µA
-
-
±0.1
-
±0.5
-
±1.0
µA
74HCT4851
VIH
VIL
II
IS(OFF)
HIGH-level
input
voltage
control inputs
LOW-level
input
voltage
control inputs
input
leakage
current
control inputs;
VI = GND or VCC
OFF-state
leakage
current
E = VIH; VI = GND or VCC;
VO = VCC or GND;
VCC = 5.5 V; see Figure 6
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
VCC = 5.5 V
IS(ON)
ON-state
leakage
current
E = VIL; VI = GND or VCC;
VO = VCC or GND;
VCC = 5.5 V; see Figure 7
ICC
supply
current
VI = GND or VCC
∆ICC
additional
supply
current
control inputs;
VI = VCC − 2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V; IO = 0 A
CI
Csw
-
-
2.0
-
5.0
-
20.0
µA
-
-
300
-
370
-
370
µA
input
S0, S1, S2 and E
capacitance
-
2
10
-
10
-
10
pF
switch
Z; OFF-state
capacitance Yn; OFF-state
-
15
40
-
40
-
40
pF
-
3
15
-
15
-
15
pF
VCC = 5.5 V
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
8 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
VCC
IS
selected
channel(1)
Yn
VI
Z
VCC
VIL
E
VIH
n.c.
E
Yn
IS
Yn
Z
GND
VI
any disabled
channel
GND
IS
VO
VO
001aaf878
001aaf879
(1) Channel is selected by S0, S1 and S2.
Fig 6. Test circuit for measuring OFF-state leakage
current
Fig 7. Test circuit for measuring ON-state leakage
current
VCC
Yn
VI(1)
any disabled
channel
ISW
VSW
V
Z
VCC
E
VIL
E
VIL
Yn
VI(2)
Yn
VI
Z
GND
RS
ISW
selected
channel(1)
GND
001aaf880
RON = VSW / ISW.
VO
VI
001aaf881
(1) Channel is selected by S0, S1 and S2.
VI(1) < GND or VI(1) > VCC.
GND < VI(2) < VCC.
Fig 8. Test circuit for measuring ON resistance
Fig 9. Test circuit for injection current coupling
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
9 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
11. Dynamic characteristics
Table 9.
Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V); for load circuit see Figure 14.
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
-
10.0
25
-
29
-
32
ns
VCC = 3.0 V
-
6.0
15.5
-
17.5
-
19.5
ns
VCC = 3.3 V
-
5.0
14.5
-
16.5
-
18.5
ns
VCC = 4.5 V
-
4.0
11.5
-
12.5
-
13.5
ns
-
3.0
10
-
11
-
12
ns
VCC = 2.0 V
-
18.0
32
-
35
-
40
ns
VCC = 3.0 V
-
9.5
17.5
-
20
-
23
ns
VCC = 3.3 V
-
8.5
16.5
-
19
-
22
ns
VCC = 4.5 V
-
6.5
13
-
15
-
17
ns
-
5.0
12.5
-
14.5
-
16.5
ns
VCC = 2.0 V
-
-
95
-
105
-
115
ns
VCC = 3.0 V
-
-
90
-
100
-
110
ns
VCC = 3.3 V
-
-
85
-
95
-
105
ns
VCC = 4.5 V
-
-
80
-
90
-
100
ns
VCC = 6.0 V
-
-
78
-
80
-
80
ns
74HC4851
tpd
propagation delay
Z, Yn to Yn, Z;
see Figure 10
[1]
VCC = 6.0 V
Sn to Z, Yn;
see Figure 11
[1]
VCC = 6.0 V
ten
tdis
enable time
disable time
E to Z, Yn;
see Figure 12
E to Z, Yn;
see Figure 12
[2]
[3]
VCC = 2.0 V
-
-
99
-
105
-
115
ns
VCC = 3.0 V
-
-
90
-
100
-
110
ns
VCC = 3.3 V
-
-
85
-
95
-
105
ns
VCC = 4.5 V
-
-
80
-
90
-
100
ns
-
-
78
-
80
-
80
ns
VCC = 3.3 V
-
28
-
-
-
-
-
pF
VCC = 5.0 V
-
33
-
-
-
-
-
pF
VCC = 6.0 V
CPD
power dissipation
capacitance
per channel;
see Figure 12
[4]
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
10 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
Table 9.
Dynamic characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground 0 V); for load circuit see Figure 14.
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
1.6
3.7
11.5
1.1
12.5
1.1
13.5
ns
3.2
8.0
13
2.3
15
2.3
17
ns
4.2
8.6
25
3.0
30
3.0
35
ns
28.5
64.7
80
28.2
90
28
100
ns
-
30
-
-
-
-
-
pF
74HCT4851
propagation delay
tpd
Z, Yn to Yn, Z;
see Figure 10
[1]
VCC = 4.5 V
Sn to Z, Yn;
see Figure 11
[1]
VCC = 4.5 V
ten
enable time
E to Z, Yn;
see Figure 12
tdis
disable time
E to Z, Yn;
see Figure 12
[2]
VCC = 4.5 V
[3]
VCC = 4.5 V
power dissipation
capacitance
CPD
per channel;
see Figure 13
[4]
VCC = 5.0 V
[1]
tpd is the same as tPLH and tPHL.
[2]
ten is the same as tPZH and tPZL.
[3]
tdis is the same as tPLZ and tPHZ.
[4]
CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi + ∑{(CL + Csw) × VCC2 × fo} where:
fi = input frequency in MHz;
fo = output frequency in MHz;
∑{(CL + Csw) × VCC2 × fo} = sum of outputs;
CL = output load capacitance in pF;
Csw = switch capacitance in pF;
VCC = supply voltage in V.
12. Waveforms
VCC
Z or Yn
input
0.5VCC
GND
tPLH
tPHL
VCC
Yn or Z
output
0.5VCC
GND
001aah574
Fig 10. Input (Z, Yn) to output (Yn, Z) propagation delays
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
11 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
VI
VM
Sn input
GND
tPLH
tPHL
VCC
Yn or Z
output
VM
GND
001aah575
Measurement points are given in Table 10.
Fig 11. Input (Sn) to output (Yn, Z) propagation delays
VI
E input
VM
VM
0V
tPLZ
tPZL
VCC
VM
Z or Yn output
VX
VOL
tPHZ
VOH
tPZH
VY
VM
Z or Yn output
GND
switch ON
switch OFF
switch ON
001aah576
Measurement points are given in Table 10.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 12. Enable and disable times
Table 10.
Measurement points
Type
Input
Output
VM
VI
VM
VX
VY
74HC4851
0.5VCC
VCC
0.5VCC
VOL + 0.1(VCC − VOL)
0.9VOH
74HCT4851
1.3 V
3.0 V
0.5VCC
VOL + 0.1(VCC − VOL)
0.9VOH
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
12 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
VCC
A
Yn
G
selected
channel
Sn
Z
E
n.c.
Yn
disabled
channel
GND
001aah577
Fig 13. Test circuit for measuring power dissipation capacitance
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
13 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
VI
tW
90 %
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
10 %
tW
001aac221
a. Input pulse definition
switch
VCC
VCC
open
RL
G
VI
VO
DUT
CL
RT
GND
001aaf883
Definitions for test circuit:
RL = load resistance.
CL = load capacitance including jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
b. Load circuit
Test data is given in Table 11.
Fig 14. Input pulse definition and load circuit
Table 11.
Test data
Test
Input
Output
Control E, Sn
Switch Yn (Z)
VI[1]
VI
tPHL, tPLH
VCC
VCC
tPHZ, tPZH
VCC
tPLZ, tPZL
VCC
CPD
VCC
[1]
tr, tf
S1 position
Switch Z (Yn)
CL
RL
6 ns
50 pF
-
open
VCC
6 ns
50 pF
10 kΩ
GND
VCC
6 ns
50 pF
10 kΩ
VCC
VCC
6 ns
0 pF
-
open
For 74HCT4851: input voltage VI = 3.0 V.
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
14 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 15. Package outline SOT109-1 (SO16)
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
15 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
D
A
X
c
y
HE
v M A
Z
9
16
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 16. Package outline SOT403-1 (TSSOP16)
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
16 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT763-1
16 terminals; body 2.5 x 3.5 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
7
y
y1 C
v M C A B
w M C
b
L
1
8
Eh
e
16
9
15
10
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
c
D (1)
Dh
E (1)
Eh
0.2
3.6
3.4
2.15
1.85
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT763-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 17. Package outline SOT763-1 (DHVQFN16)
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
17 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
14. Abbreviations
Table 12.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
15. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74HC_HCT4851_2
20080902
Product data sheet
-
74HC4851_1
-
-
Modifications:
74HC4851_1
•
74HCT4851 device added.
20070309
Product data sheet
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
18 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74HC_HCT4851_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 2 September 2008
19 of 20
74HC4851; 74HCT4851
NXP Semiconductors
8-channel analog MUX/DEMUX with injection-current effect control
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 2 September 2008
Document identifier: 74HC_HCT4851_2