74LVC4066 Quad bilateral switch Rev. 02 — 27 August 2007 Product data sheet 1. General description The 74LVC4066 is a high-speed Si-gate CMOS device. The 74LVC4066 provides four single pole, single-throw analog switch functions. Each switch has two input/output terminals (nY and nZ) and an active HIGH enable input (nE). When nE is LOW, the analog switch is turned off. Schmitt-trigger action at the enable inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 1.65 V to 5.5 V. 2. Features ■ Wide supply voltage range from 1.65 V to 5.5 V ■ Very low ON resistance: ◆ 7.5 Ω (typical) at VCC = 2.7 V ◆ 6.5 Ω (typical) at VCC = 3.3 V ◆ 6 Ω (typical) at VCC = 5 V ■ Switch current capability of 32 mA ■ High noise immunity ■ CMOS low-power consumption ■ Direct interface TTL-levels ■ Latch-up performance exceeds 250 mA ■ ESD protection: ◆ HBM JESD22-A114E exceeds 2000 V ◆ MM JESD22-A115-A exceeds 200 V ■ Enable inputs accept voltages up to 5 V ■ Multiple package options ■ Specified from −40 °C to +85 °C and −40 °C to +125 °C 74LVC4066 NXP Semiconductors Quad bilateral switch 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC4066D −40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74LVC4066PW −40 °C to +125 °C TSSOP14 plastic thin small outline package; 14 leads; body width 4.4 mm SOT402-1 74LVC4066BQ −40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 × 3 × 0.85 mm SOT762-1 4. Functional diagram 1 1Y 13 1E 4 2Y 1Z 2 1 1 2Z 3 2 13 # 4 4 5 2E 8 3Y 6 3E 11 4Y 12 4E 5 3Z 9 4Z 10 3 5 1 X1 1 # 2 1 3 X1 # 8 6 1 13 # 9 # 11 10 12 # 8 6 1 # 11 12 # (a) 1 9 X1 1 1 10 X1 (b) mnb111 mnb112 Fig 1. Logic symbol Fig 2. Logic symbol (IEEE/IEC) Z Y E VCC mna658 Fig 3. Logic diagram (one switch) 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 2 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 5. Pinning information 1Y terminal 1 index area 14 VCC 5.1 Pinning 1 14 VCC 1Z 2 13 1E 1Z 2 13 1E 12 4E 2Z 3 12 4E 2Y 4 4066 11 4Y 2E 5 GND(1) 10 4Z 3E 6 1 1Y 4066 11 4Y 10 4Z 2E 5 3E 6 9 3Z GND 7 8 3Y 9 8 4 3Y 2Y 7 3 GND 2Z 3Z 001aad118 Transparent top view 001aad117 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 4. Pin configuration for SO14 and TSSOP14 Fig 5. Pin configuration for DHVQFN14 5.2 Pin description Table 2. Pin description Symbol Pin Description 1Y 1 independent input/output 1Z 2 independent output/input 2Z 3 independent output/input 2Y 4 independent input/output 2E 5 enable input (active HIGH) 3E 6 enable input (active HIGH) GND 7 ground (0 V) 3Y 8 independent input/output 3Z 9 independent output/input 4Z 10 independent output/input 4Y 11 independent input/output 4E 12 enable input (active HIGH) 1E 13 enable input (active HIGH) VCC 14 supply voltage 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 3 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 6. Functional description Table 3. Function table[1] Input nE Switch L OFF H ON [1] H = HIGH voltage level; L = LOW voltage level. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions VI input voltage IIK input clamping current ISK switch clamping current VI < −0.5 V or VI < VCC + 0.5 V VSW switch voltage enable and disable mode ISW switch current −0.5 < VSW < VCC + 0.5 V ICC [1] VI < −0.5 V or VI < VCC + 0.5 V Min Max Unit −0.5 +6.5 V −0.5 +6.5 V −50 - mA - ±50 mA −0.5 +6.5 V - ±50 mA supply current - 100 mA IGND ground current −100 - mA Tstg storage temperature −65 +150 °C - 500 mW total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [3] [1] The minimum input voltage rating may be exceeded if the input current rating is observed. [2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed. [3] For SO14 packages: above 70 °C derate linearly with 8 mW/K. For (T)SSOP14 packages: above 60 °C derate linearly with 5.5 mW/K. For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K. 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 4 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter Conditions VCC supply voltage VI input voltage VSW switch voltage Tamb ambient temperature ∆t/∆V input transition rise and fall rate [1] Min Typ Max Unit 1.65 - 5.5 V 0 - 5.5 V 0 - VCC V −40 - +125 °C VCC = 1.65 V to 2.7 V [2] - - 20 ns/V VCC = 2.7 V to 5.5 V [2] - - 10 ns/V [1] To avoid sinking GND current from terminal nZ when switch current flows in terminal nY, the voltage drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminal nZ, no GND current will flow from terminal nY. In this case, there is no limit for the voltage drop across the switch. [2] Applies to control signal levels. 9. Static characteristics Table 6. Static characteristics At recommended operating conditions voltages are referenced to GND (ground = 0 V). Symbol Parameter VIH VIL HIGH-level input voltage LOW-level input voltage −40 °C to +85 °C Conditions VCC = 1.65 V to 1.95 V −40 °C to +125 °C Unit Min Typ[1] Max Min Max 0.65VCC - - 0.65VCC - V VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - V VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - V VCC = 4.5 V to 5.5 V 0.7VCC - - 0.7VCC - V VCC = 1.65 V to 1.95 V - - 0.35VCC - VCC = 2.3 V to 2.7 V - - 0.7 - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 - 0.8 V VCC = 4.5 V to 5.5 V 0.35VCC V - - 0.3VCC - 0.3VCC V - ±0.1 ±5 - ±20 µA II input leakage current pin nE; VCC = 5.5 V; VI = 5.5 V or GND [2] IS(OFF) OFF-state leakage current VI = VIH or VIL; VCC = 5.5 V; see Figure 6 [2] - ±0.1 ±5 - ±20 µA IS(ON) ON-state leakage current VI = VIH or VIL; VCC = 5.5 V; see Figure 7 [2] - ±0.1 ±5 - ±20 µA ICC supply current VI = VCC or GND; VSW = GND or VCC; VCC = 5.5 V; IO = 0 A; [2] - 0.1 10 - 40 µA ∆ICC additional pin nE; VI = VCC − 0.6 V; VCC = 5.5 V; supply current VSW = GND or VCC [2] - 5 500 - 5000 µA 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 5 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch Table 6. Static characteristics …continued At recommended operating conditions voltages are referenced to GND (ground = 0 V). Symbol Parameter −40 °C to +85 °C Conditions −40 °C to +125 °C Unit Min Typ[1] Max Min Max CI input capacitance - 12.5 - - - pF CS(OFF) OFF-state capacitance - 8.0 - - - pF CS(ON) ON-state capacitance - 14.0 - - - pF [1] All typical values are measured at Tamb = 25 °C. [2] These typical values are measured at VCC = 3.3 V. 9.1 Test circuits VCC VCC E VIL IS Y Z IS IS GND VI E VIH Z Y GND VI VO 001aag488 VO 001aag489 VI = VCC or GND and VO = GND or VCC. VI = VCC or GND and VO = open circuit. Fig 6. Test circuit for measuring OFF-state leakage current Fig 7. Test circuit for measuring ON-state leakage current 9.2 ON resistance Table 7. ON resistance At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Figure 9 to Figure 14. Symbol RON(peak) Parameter −40 °C to +85 °C Conditions −40 °C to +125 °C Unit Min Typ[1] Max Min Max ISW = 4 mA; VCC = 1.65 V to 1.95 V - 34.0 130 - 195 Ω ON resistance (peak) VI = GND to VCC; see Figure 8 ISW = 8 mA; VCC = 2.3 V to 2.7 V - 12.0 30 - 45 Ω ISW = 12 mA; VCC = 2.7 V - 10.4 25 - 38 Ω ISW = 24 mA; VCC = 3 V to 3.6 V - 7.8 20 - 30 Ω ISW = 32 mA; VCC = 4.5 V to 5.5 V - 6.2 15 - 23 Ω 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 6 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch Table 7. ON resistance …continued At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Figure 9 to Figure 14. Symbol RON(rail) Parameter ON resistance (rail) −40 °C to +85 °C Conditions −40 °C to +125 °C Unit Min Typ[1] Max Min Max ISW = 4 mA; VCC = 1.65 V to 1.95 V - 8.2 18 - 27 Ω ISW = 8 mA; VCC = 2.3 V to 2.7 V - 7.1 16 - 24 Ω ISW = 12 mA; VCC = 2.7 V - 6.9 14 - 21 Ω ISW = 24 mA; VCC = 3 V to 3.6 V - 6.5 12 - 18 Ω ISW = 32 mA; VCC = 4.5 V to 5.5 V - 5.8 10 - 15 Ω ISW = 4 mA; VCC = 1.65 V to 1.95 V - 10.4 30 - 45 Ω ISW = 8 mA; VCC = 2.3 V to 2.7 V - 7.6 20 - 30 Ω ISW = 12 mA; VCC = 2.7 V - 7.0 18 - 27 Ω ISW = 24 mA; VCC = 3 V to 3.6 V - 6.1 15 - 23 Ω - 4.9 10 - 15 Ω ISW = 4 mA; VCC = 1.65 V to 1.95 V - 26.0 - - - Ω VI = GND; see Figure 8 VI = VCC; see Figure 8 ISW = 32 mA; VCC = 4.5 V to 5.5 V RON(flat) ON resistance (flatness) VI = GND to VCC [2] ISW = 8 mA; VCC = 2.3 V to 2.7 V - 5.0 - - - Ω ISW = 12 mA; VCC = 2.7 V - 3.5 - - - Ω ISW = 24 mA; VCC = 3 V to 3.6 V - 2.0 - - - Ω ISW = 32 mA; VCC = 4.5 V to 5.5 V - 1.5 - - - Ω [1] Typical values are measured at Tamb = 25 °C and nominal VCC. [2] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and temperature. 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 7 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 9.3 ON resistance test circuit and graphs mna673 40 RON (Ω) 30 VSW (1) 20 VCC E VIH (2) (3) Y 10 Z (4) GND VI (5) ISW 0 0 1 2 3 4 5 VI (V) 001aag490 RON = VSW / ISW. (1) VCC = 1.8 V. (2) VCC = 2.5 V. (3) VCC = 2.7 V. (4) VCC = 3.3 V. (5) VCC = 5.0 V. Fig 8. Test circuit for measuring ON resistance 001aaa712 55 RON (Ω) Fig 9. Typical ON resistance as a function of input voltage; Tamb = 25 °C 001aaa708 15 RON (Ω) 45 13 35 11 (4) (3) (2) (1) (1) (2) 25 9 (3) (4) 15 7 5 5 0 0.4 0.8 1.2 1.6 2.0 0 0.5 VI (V) 1.5 2.0 2.5 VI (V) (1) Tamb = 125 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (3) Tamb = 25 °C. (4) Tamb = −40 °C. (4) Tamb = −40 °C. Fig 10. ON resistance as a function of input voltage; VCC = 1.8 V Fig 11. ON resistance as a function of input voltage; VCC = 2.5 V 74LVC4066_2 Product data sheet 1.0 © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 8 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 001aaa709 13 001aaa710 10 RON (Ω) RON (Ω) 11 8 (1) (1) 9 (2) (2) 6 (3) (3) 7 (4) (4) 4 5 0 0.5 1.0 1.5 2.0 2.5 3.0 VI (V) 0 1 2 3 4 VI (V) (1) Tamb = 125 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (3) Tamb = 25 °C. (4) Tamb = −40 °C. (4) Tamb = −40 °C. Fig 12. ON resistance as a function of input voltage; VCC = 2.7 V Fig 13. ON resistance as a function of input voltage; VCC = 3.3 V 001aaa711 7 RON (Ω) 6 5 (1) (2) (3) 4 (4) 3 0 1 2 3 4 5 VI (V) (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (4) Tamb = −40 °C. Fig 14. ON resistance as a function of input voltage; VCC = 5.0 V 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 9 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 10. Dynamic characteristics Table 8. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit Figure 17. Symbol Parameter −40 °C to +85 °C Conditions Min Max Min Max VCC = 1.65 V to 1.95 V - 0.8 2.0 - 3.0 ns VCC = 2.3 V to 2.7 V - 0.4 1.2 - 2.0 ns propagation delay nY to nZ or nZ to nY; see Figure 15 tpd [2][3] VCC = 2.7 V - 0.4 1.0 - 1.5 ns VCC = 3.0 V to 3.6 V - 0.3 0.8 - 1.5 ns - 0.2 0.6 - 1.0 ns VCC = 4.5 V to 5.5 V enable time ten nE to nY or nZ; see Figure 16 [4] VCC = 1.65 V to 1.95 V 1.0 5.3 10 1.0 12.5 ns VCC = 2.3 V to 2.7 V 1.0 3.0 5.6 1.0 7.0 ns VCC = 2.7 V 1.0 2.6 5.0 1.0 6.5 ns VCC = 3.0 V to 3.6 V 1.0 2.5 4.4 1.0 5.5 ns 1.0 1.9 3.9 1.0 5.0 ns VCC = 1.65 V to 1.95 V 1.0 4.2 9.0 1.0 11.5 ns VCC = 2.3 V to 2.7 V 1.0 2.4 5.5 1.0 7.0 ns VCC = 2.7 V 1.0 3.6 6.5 1.0 8.5 ns VCC = 3.0 V to 3.6 V 1.0 3.4 6.0 1.0 7.5 ns 1.0 2.5 5.0 1.0 6.5 ns VCC = 2.5 V - 11.0 - - - pF VCC = 3.3 V - 12.5 - - - pF VCC = 5.0 V - 15.6 - - - pF VCC = 4.5 V to 5.5 V disable time tdis nE to nY or nZ; see Figure 16 [5] VCC = 4.5 V to 5.5 V power dissipation capacitance CPD −40 °C to +125 °C Unit Typ[1] CL = 50 pF; fi = 10 MHz; VI = GND to VCC [6] [1] Typical values are measured at Tamb = 25 °C and nominal VCC. [2] tpd is the same as tPLH and tPHL. [3] Propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified capacitance when driven by an ideal voltage source (zero output impedance). [4] ten is the same as tPZH and tPZL. [5] tdis is the same as tPLZ and tPHZ. [6] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ{(CL + CS(ON)) × VCC2 × fo} where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; CS(ON) = maximum ON-state switch capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ{(CL + CS(ON)) × VCC2 × fo} = sum of the outputs. 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 10 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 10.1 Waveforms and test circuit VI nY or nZ input VM VM GND t PLH t PHL VOH nZ or nY output VM VM VOL 001aaa541 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 15. Input (nY or nZ) to output (nZ or nY) propagation delays VI nE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW nY or nZ VM VX VOL t PZH t PHZ nY or nZ output HIGH-to-OFF OFF-to-HIGH VOH Vy VM GND switch enabled switch disabled switch enabled 001aaa542 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 16. Enable and disable times Table 9. Measurement points Supply voltage Input Output VCC VM VM VX VY 1.65 V to 1.95 V 0.5VCC 0.5 VCC VOL + 0.15 V VOH − 0.15 V 2.3 V to 2.7 V 0.5VCC 0.5VCC VOL + 0.15 V VOH − 0.15 V 2.7 V 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V 3.0 V to 3.6 V 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V 4.5 V to 5.5 V 0.5VCC 0.5VCC VOL + 0.3 V VOH − 0.3 V 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 11 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 10. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. VEXT = External voltage for measuring switching times. Fig 17. Load circuit for switching times Table 10. Test data Supply voltage Input Load VEXT VCC VI tr, tf CL RL tPLH, tPHL tPZH, tPHZ tPZL, tPLZ 1.65 V to 1.95 V VCC ≤ 2.0 ns 30 pF 1 kΩ open GND 2VCC 2.3 V to 2.7 V VCC ≤ 2.0 ns 30 pF 500 Ω open GND 2VCC 2.7 V 2.7 V ≤ 2.5 ns 50 pF 500 Ω open GND 6V 3.0 V to 3.6 V 2.7 V ≤ 2.5 ns 50 pF 500 Ω open GND 6V 4.5 V to 5.5 V VCC ≤ 2.5 ns 50 pF 500 Ω open GND 2VCC 10.2 Additional dynamic characteristics Table 11. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C. Symbol Parameter Conditions THD total harmonic distortion RL = 10 kΩ; CL = 50 pF; fi = 1 kHz; see Figure 18 Min Typ Max Unit VCC = 1.65 V - 0.032 - % VCC = 2.3 V - 0.008 - % VCC = 3 V - 0.006 - % VCC = 4.5 V - 0.005 - % VCC = 1.65 V - 0.068 - % VCC = 2.3 V - 0.009 - % VCC = 3 V - 0.008 - % VCC = 4.5 V - 0.006 - % RL = 10 kΩ; CL = 50 pF; fi = 10 kHz; see Figure 18 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 12 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch Table 11. Additional dynamic characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C. Symbol Parameter Conditions f(-3dB) -3 dB frequency response RL = 600 Ω; CL = 50 pF; see Figure 19 Min Typ Max Unit VCC = 1.65 V - 170 - MHz VCC = 2.3 V - 210 - MHz VCC = 3 V - 212 - MHz VCC = 4.5 V - 215 - MHz VCC = 1.65 V - > 500 - MHz VCC = 2.3 V - > 500 - MHz VCC = 3 V - > 500 - MHz VCC = 4.5 V - > 500 - MHz VCC = 1.65 V - −46 - dB VCC = 2.3 V - −46 - dB VCC = 3 V - −46 - dB VCC = 4.5 V - −46 - dB VCC = 1.65 V - −42 - dB VCC = 2.3 V - −42 - dB VCC = 3 V - −42 - dB VCC = 4.5 V - −42 - dB RL = 50 Ω; CL = 5 pF; see Figure 19 αiso isolation (OFF-state) RL = 600 Ω; CL = 50 pF; fi = 1 MHz; see Figure 20 RL = 50 Ω; CL = 5 pF; fi = 1 MHz; see Figure 20 Vct Xtalk crosstalk voltage crosstalk between digital inputs and switch; RL = 600 Ω; CL = 50 pF; fi = 1 MHz; tr = tf = 2 ns; see Figure 21 VCC = 1.65 V - 69 - mV VCC = 2.3 V - 87 - mV VCC = 3 V - 156 - mV VCC = 4.5 V - 302 - mV VCC = 1.65 V - −58 - dB VCC = 2.3 V - −58 - dB VCC = 3 V - −58 - dB VCC = 4.5 V - −58 - dB VCC = 1.65 V - −58 - dB VCC = 2.3 V - −58 - dB VCC = 3 V - −58 - dB VCC = 4.5 V - −58 - dB between switches; RL = 600 Ω; CL = 50 pF; fi = 1 MHz; see Figure 22 between switches; RL = 50 Ω; CL = 5 pF; fi = 1 MHz; see Figure 22 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 13 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch Table 11. Additional dynamic characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C. Symbol Parameter Conditions Qinj charge injection CL = 0.1 nF; Vgen = 0 V; Rgen = 0 Ω; fi = 1 MHz; RL = 1 MΩ; see Figure 23 Min Typ Max Unit VCC = 1.8 V - 3.3 - pC VCC = 2.5 V - 4.1 - pC VCC = 3.3 V - 5.0 - pC VCC = 4.5 V - 6.4 - pC VCC = 5.5 V - 7.5 - pC 10.2.1 Test circuits VCC 0.5VCC E VIH RL Y/Z 10 pF Z/Y VO 600 Ω fi CL D 001aag492 Test conditions: VCC = 1.65 V: Vi = 1.4 V (p-p). VCC = 2.3 V: Vi = 2 V (p-p). VCC = 3 V: Vi = 2.5 V (p-p). VCC = 4.5 V: Vi = 4 V (p-p). Fig 18. Test circuit for measuring total harmonic distortion VCC E VIH 0.1 pF fi 0.5VCC Y/Z RL Z/Y 50 Ω VO CL dB 001aag491 Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads −3 dB. Fig 19. Test circuit for measuring the frequency response when switch is in ON-state 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 14 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 0.5VCC VCC RL VIL 0.1 pF 0.5VCC E RL Y/Z Z/Y VO 50 Ω fi CL dB 001aag493 Adjust fi voltage to obtain 0 dBm level at input. Fig 20. Test circuit for measuring isolation (OFF-state) VCC E Y/Z G logic input 50 Ω Z/Y 600 Ω VO RL 0.5VCC CL 0.5VCC 001aag494 Fig 21. Test circuit for measuring crosstalk voltage (between digital inputs and switch) 0.5VCC 1E VIH 0.1 pF Ri 1Y or 1Z 600 Ω fi RL 1Z or 1Y CHANNEL ON 50 Ω CL 50 pF VO1 0.5VCC 2E VIL RL 2Y or 2Z Ri 600 Ω 2Z or 2Y CHANNEL OFF CL 50 pF VO2 001aag496 20 log10 (VO2 / VO1) or 20 log10 (VO1 / VO2). Fig 22. Test circuit for measuring crosstalk between switches 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 15 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch VCC E Rgen G logic input Y/Z Z/Y VO RL 1 MΩ Vgen CL 0.1 nF 001aag495 logic input (E) off on off ∆VO VO mna675 Qinj = ∆VO × CL. ∆VO = output voltage variation. Rgen = generator resistance. Vgen = generator voltage. Fig 23. Test circuit for measuring charge injection 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 16 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 11. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 24. Package outline SOT108-1 (SO14) 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 17 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 25. Package outline SOT402-1 (TSSOP14) 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 18 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 6 y y1 C v M C A B w M C b L 1 7 Eh e 14 8 13 9 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 3.1 2.9 1.65 1.35 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 2 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT762-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 26. Package outline SOT762-1 (DHVQFN14) 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 19 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 12. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor TTL Transistor-Transistor Logic HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model DUT Device Under Test 13. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC4066_2 20070827 Product data sheet - 74LVC4066_1 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Section 2 “Features”: Added: Wide supply voltage range from 1.65 V to 5.5 V Added: Switch handling capability of 32 mA Added: Multiple package options Deleted: Complies with JEDESD-8 standards Added: Specified from −40 °C to +85 °C and −40 °C to +125 °C Added: Enable input accepts voltages up to 5 V • Section 7 “Limiting values” Added: Derating factors of the applicable packages • Section 9 “Static characteristics” Changed: Maximum values of ON resistance (peak) parameters and graphics. • Section 10 “Dynamic characteristics”: Changed: Typical values of the charge injection. 74LVC4066_1 20030812 Product specification 74LVC4066_2 Product data sheet - - © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 20 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 74LVC4066_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 27 August 2007 21 of 22 74LVC4066 NXP Semiconductors Quad bilateral switch 16. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 9.1 9.2 9.3 10 10.1 10.2 10.2.1 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ON resistance test circuit and graphs. . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms and test circuit . . . . . . . . . . . . . . . 11 Additional dynamic characteristics . . . . . . . . . 12 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 August 2007 Document identifier: 74LVC4066_2