PMD5002K MOSFET driver Rev. 01 — 6 November 2006 Product data sheet 1. Product profile 1.1 General description PNP switching transistor and high-speed switching diode to protect the base-emitter junction in reverse direction in a SOT346 (SC-59A/TO-236) small Surface-Mounted Device (SMD) plastic package. 1.2 Features n n n n n n Switching transistor and high-speed switching diode as driver High-speed switching diode to protect the base-emitter junction Application-optimized pinout Internal connections to minimize layout effort Space-saving solution Reduces component count 1.3 Applications n Power MOSFET driver 1.4 Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Min Typ Max Unit open base - - −40 V - - −0.6 A - - −1 A - - 0.2 A - - 1.1 V PNP transistor VCEO collector-emitter voltage IC collector current ICM peak collector current single pulse; tp ≤ 1 ms Diode IF VF [1] forward current forward voltage Pulse test: tp ≤ 300 µs; δ ≤ 0.02. IF = 200 mA [1] PMD5002K NXP Semiconductors MOSFET driver 2. Pinning information Table 2. Pinning Pin Description Simplified outline 1 base TR1, anode D1 2 emitter TR1, cathode D1 3 collector TR1 Symbol 3 3 TR1 1 2 D1 1 2 006aaa656 3. Ordering information Table 3. Ordering information Type number PMD5002K Package Name Description Version SC-59A plastic surface-mounted package; 3 leads SOT346 4. Marking Table 4. Marking codes Type number Marking code PMD5002K D5 PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 2 of 15 PMD5002K NXP Semiconductors MOSFET driver 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit PNP transistor VCBO collector-base voltage open emitter - −40 V VCEO collector-emitter voltage open base - −40 V IC collector current - −0.6 A ICM peak collector current - −1 A IB base current - −0.2 A IBM peak base current single pulse; tp ≤ 1 ms - −0.3 A Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW [2] - 330 mW [3] - 445 mW single pulse; tp ≤ 1 ms Diode IF forward current IFRM repetitive peak forward current tp ≤ 1 ms; δ = 0.25 - 0.2 A - 0.6 A IFSM non-repetitive peak forward current square wave tp ≤ 1 µs - 9 A tp ≤ 100 µs - 3 A tp ≤ 10 ms - 1.7 A Device Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 3 of 15 PMD5002K NXP Semiconductors MOSFET driver 006aaa870 500 Ptot (mW) (1) 400 (2) 300 (3) 200 100 0 −75 −25 25 75 125 175 Tamb (°C) (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Symbol Thermal characteristics Parameter Conditions Min Typ Max Unit [1] - - 500 K/W [2] - - 375 K/W [3] - - 280 K/W PNP transistor Rth(j-a) thermal resistance from junction to ambient in free air [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 4 of 15 PMD5002K NXP Semiconductors MOSFET driver 006aaa871 103 duty cycle = 1 0.75 0.5 0.33 Zth(j-a) (K/W) 102 0.2 0.1 0.05 10 0.02 0.01 0 1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aa872 103 duty cycle = Zth(j-a) (K/W) 1 0.75 0.5 0.33 102 0.2 0.1 0.05 10 0.02 0.01 0 1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, mounting pad for collector 1 cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 5 of 15 PMD5002K NXP Semiconductors MOSFET driver 006aaa873 103 duty cycle = Zth(j-a) (K/W) 1 0.75 102 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01 0 1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) Ceramic PCB, Al2O3, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 6 of 15 PMD5002K NXP Semiconductors MOSFET driver 7. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit collector-base cut-off current VCB = −40 V; IE = 0 A - - −10 nA VCB = −40 V; IE = 0 A; Tj = 150 °C - - −10 µA DC current gain VCE = −5 V; IC = −1 mA 100 180 - 100 125 - 50 80 - - −130 −250 mV - −280 −500 mV - −0.86 −1 PNP transistor ICBO hFE VCE = −5 V; IC = −200 mA VCE = −5 V; IC = −500 mA collector-emitter saturation voltage IC = −200 mA; IB = −20 mA base-emitter saturation voltage IC = −200 mA; IB = −20 mA base-emitter voltage VCE = −5 V; IC = −300 mA forward voltage IF = 200 mA td delay time IC = −0.15 A; IB = −5 mA tr VCEsat VBEsat IC = −500 mA; IB = −50 mA [1] V - −0.97 −1.1 V - −830 - mV - - 1.1 V - 7 - ns rise time - 34 - ns ton turn-on time - 41 - ns ts storage time - 610 - ns tf fall time - 172 - ns toff turn-off time - 782 - ns - 4 - ns - 3 - ns VBE IC = −500 mA; IB = −50 mA [1] [1] Diode VF [1] Device Device with optional capacitor C1 IC = −0.15 A; IB = −5 mA; C1 = 1 nF td delay time tr rise time ton turn-on time - 7 - ns ts storage time - 40 - ns tf fall time - 43 - ns toff turn-off time - 83 - ns [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 7 of 15 PMD5002K NXP Semiconductors MOSFET driver 006aaa897 400 006aaa898 −1.0 IB (mA) = −50 IC −45 (A) −40 −35 −0.8 hFE 300 (3) 200 (4) −0.6 (5) (2) −0.4 100 −30 −25 −20 −15 −10 −5 (1) −0.2 0 −10−1 −1 −10 −102 −103 0 0 −1 −2 −3 IC (mA) VCE = −5 V −4 −5 VCE (V) Tamb = 25 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C (4) Tamb = 125 °C (5) Tamb = 150 °C Fig 5. DC current gain as a function of collector current; typical values 006aaa899 −1.1 Fig 6. Collector current as a function of collector-emitter voltage; typical values 006aaa900 −1.2 VBEsat (V) VBE (V) −1.0 −0.9 (1) (1) −0.8 −0.7 (2) (2) −0.6 (3) −0.5 −0.3 −10−2 (3) −0.4 −10−1 −1 −10 −102 −103 IC (mA) VCE = −5 V −0.2 −10−1 −1 −102 −103 IC (mA) IC/IB = 20 (1) Tamb = −55 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = 100 °C (3) Tamb = 100 °C Fig 7. Base-emitter voltage as a function of collector current; typical values Fig 8. Base-emitter saturation voltage as a function of collector current; typical values PMD5002K_1 Product data sheet −10 © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 8 of 15 PMD5002K NXP Semiconductors MOSFET driver 006aaa901 −1 006aaa902 −1 VCEsat (V) VCEsat (V) −10−1 −10−1 (1) (2) (1) (2) (3) (3) −10−2 −10−1 −1 −10 −102 −10−2 −10−1 −103 −1 −10 IC (mA) −102 −103 IC (mA) Tamb = 25 °C IC/IB = 20 (1) Tamb = 100 °C (1) IC/IB = 100 (2) Tamb = 25 °C (2) IC/IB = 50 (3) Tamb = −55 °C (3) IC/IB = 10 Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values 8. Test information VCC RC oscilloscope (probe) VO C1 450 Ω (probe) 3 kΩ oscilloscope R2 VI TR1 DUT R1 D1 006aaa896 IC = −0.15 A; IB = −5 mA; R1 = 50 Ω; R2 = 1 kΩ; RC = 68 Ω; C1 = 1 nF Fig 11. Test circuit for switching times PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 9 of 15 PMD5002K NXP Semiconductors MOSFET driver 9. Package outline 1.3 1.0 3.1 2.7 3 0.6 0.2 3.0 1.7 2.5 1.3 1 2 1.9 0.50 0.35 Dimensions in mm 0.26 0.10 04-11-11 Fig 12. Package outline SOT346 (SC-59A/TO-236) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMD5002K [1] Package SOT346 Description 4 mm pitch, 8 mm tape and reel 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 15. PMD5002K_1 Product data sheet Packing quantity © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 10 of 15 PMD5002K NXP Semiconductors MOSFET driver 11. Soldering 3.30 1.00 0.70 (3x) 0.60 (3x) 0.70 (3x) 3 0.95 3.15 3.40 1.55 0.95 1 2 1.20 2.60 2.90 solder lands solder resist solder paste occupied area sot346 Dimensions in mm Fig 13. Reflow soldering footprint 4.70 2.80 solder lands solder resist occupied area Dimensions in mm 3 5.20 4.60 1.20 1 2 sot346 1.20 (2x) 3.40 preferred transport direction during soldering Fig 14. Wave soldering footprint PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 11 of 15 PMD5002K NXP Semiconductors MOSFET driver 12. Mounting 43.4 43.4 10 0.7 10 0.8 40 40 0.8 0.7 0.5 0.5 Dimensions in mm 006aaa674 PCB thickness: Dimensions in mm 006aaa675 PCB thickness = 1.6 mm FR4 PCB = 1.6 mm ceramic PCB = 0.635 mm Fig 15. FR4 PCB, standard footprint; ceramic PCB, Al2O3, standard footprint PMD5002K_1 Product data sheet Fig 16. FR4 PCB, mounting pad for collector 1 cm2 © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 12 of 15 PMD5002K NXP Semiconductors MOSFET driver 13. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMD5002K_1 20061106 Product data sheet - - PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 13 of 15 PMD5002K NXP Semiconductors MOSFET driver 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] PMD5002K_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 6 November 2006 14 of 15 PMD5002K NXP Semiconductors MOSFET driver 16. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information. . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 6 November 2006 Document identifier: PMD5002K_1