PCA9622 16-bit Fm+ I2C-bus 100 mA 40 V LED driver Rev. 03 — 31 August 2009 Product data sheet 1. General description The PCA9622 is an I2C-bus controlled 16-bit LED driver optimized for voltage switch dimming and blinking 100 mA Red/Green/Blue/Amber (RGBA) LEDs. Each LED output has its own 8-bit resolution (256 steps) fixed frequency individual PWM controller that operates at 97 kHz with a duty cycle that is adjustable from 0 % to 99.6 % to allow the LED to be set to a specific brightness value. An additional 8-bit resolution (256 steps) group PWM controller has both a fixed frequency of 190 Hz and an adjustable frequency between 24 Hz to once every 10.73 seconds with a duty cycle that is adjustable from 0 % to 99.6 % that is used to either dim or blink all LEDs with the same value. Each LED output can be off, on (no PWM control), set at its individual PWM controller value or at both individual and group PWM controller values. The PCA9622 operates with a supply voltage range of 2.3 V to 5.5 V and the 100 mA open-drain outputs allow voltages up to 40 V. The PCA9622 is one of the first LED controller devices in a new Fast-mode Plus (Fm+) family. Fm+ devices offer higher frequency (up to 1 MHz) and more densely populated bus operation (up to 4000 pF). The active LOW Output Enable input pin (OE) blinks all the LED outputs and can be used to externally PWM the outputs, which is useful when multiple devices need to be dimmed or blinked together without using software control. Software programmable LED Group and three Sub Call I2C-bus addresses allow all or defined groups of PCA9622 devices to respond to a common I2C-bus address, allowing for example, all red LEDs to be turned on or off at the same time or marquee chasing effect, thus minimizing I2C-bus commands. Seven hardware address pins allow up to 126 devices on the same bus. The Software Reset (SWRST) Call allows the master to perform a reset of the PCA9622 through the I2C-bus, identical to the Power-On Reset (POR) that initializes the registers to their default state causing the outputs to be set HIGH (LED off). This allows an easy and quick way to reconfigure all device registers to the same condition. The PCA9622, PCA9625 and PCA9635 software is identical and if the PCA9622 on-chip 100 mA NAND FETs do not provide enough current or voltage to drive the LEDs, then the PCA9635 with larger current or higher voltage external drivers can be used. PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 2. Features n 16 LED drivers. Each output programmable at: u Off u On u Programmable LED brightness u Programmable group dimming/blinking mixed with individual LED brightness n 1 MHz Fast-mode Plus compatible I2C-bus interface with 30 mA high drive capability on SDA output for driving high capacitive buses n 256-step (8-bit) linear programmable brightness per LED output varying from fully off (default) to maximum brightness using a 97 kHz PWM signal n 256-step group brightness control allows general dimming (using a 190 Hz PWM signal) from fully off to maximum brightness (default) n 256-step group blinking with frequency programmable from 24 Hz to 10.73 s and duty cycle from 0 % to 99.6 % n Sixteen open-drain outputs can sink between 0 mA to 100 mA and are tolerant to a maximum off state voltage of 40 V. No input function. n Output state change programmable on the Acknowledge or the STOP Command to update outputs byte-by-byte or all at the same time (default to ‘Change on STOP’). n Active LOW Output Enable (OE) input pin allows for hardware blinking and dimming of the LEDs n 7 hardware address pins allow 126 PCA9622 devices to be connected to the same I2C-bus and to be individually programmed n 4 software programmable I2C-bus addresses (one LED Group Call address and three LED Sub Call addresses) allow groups of devices to be addressed at the same time in any combination (for example, one register used for ‘All Call’ so that all the PCA9622s on the I2C-bus can be addressed at the same time and the second register used for three different addresses so that 1⁄3 of all devices on the bus can be addressed at the same time in a group). Software enable and disable for I2C-bus address. n Software Reset feature (SWRST Call) allows the device to be reset through the I2C-bus n 25 MHz internal oscillator requires no external components n Internal power-on reset n Noise filter on SDA/SCL inputs n No glitch on power-up n Supports hot insertion n Low standby current n Operating power supply voltage (VDD) range of 2.3 V to 5.5 V n 5.5 V tolerant inputs on non-LED pins n −40 °C to +85 °C operation n ESD protection exceeds 2000 V HBM per JESD22-A114, 100 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA n Packages offered: TSSOP32, HVQFN32 PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 2 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 3. Applications n n n n n RGB or RGBA LED drivers LED status information LED displays LCD backlights Keypad backlights for cellular phones or handheld devices 4. Ordering information Table 1. Ordering information Type number Topside mark Package Name Description Version PCA9622BS[1] P9622 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 × 5 × 0.85 mm SOT617-3 PCA9622DR PCA9622DR TSSOP32 SOT487-1 [1] plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm HVQFN32 package under development. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 3 of 39 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x PCA9622 SCL INPUT FILTER NXP Semiconductors 5. Block diagram PCA9622_3 Product data sheet A0 A1 A2 A3 A4 A5 A6 SDA I2C-BUS CONTROL VDD POWER-ON RESET Rev. 03 — 31 August 2009 VSS LED STATE SELECT REGISTER PWM REGISTER X BRIGHTNESS CONTROL 24.3 kHz GRPFREQ REGISTER 25 MHz OSCILLATOR MUX/ CONTROL FET DRIVER GRPPWM REGISTER 190 Hz '0' – permanently OFF '1' – permanently ON OE 002aad528 Fig 1. Block diagram of PCA9622 PCA9622 4 of 39 © NXP B.V. 2009. All rights reserved. Remark: Only one LED output shown for clarity. 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 97 kHz LEDn PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 6. Pinning information 6.1 Pinning 4 29 A6 A3 5 28 A5 A4 6 27 OE A3 1 24 A5 26 LED15 A4 2 23 OE 25 LED14 LED0 3 22 LED15 24 VSS LED1 4 23 LED13 VSS 5 LED3 11 22 LED12 LED2 6 20 VSS 19 LED13 LED4 12 21 LED11 LED3 7 18 LED12 20 LED10 LED4 8 17 LED11 32 A2 17 LED8 002aad531 Transparent top view 002aad530 Fig 2. LED10 16 9 18 LED9 LED7 16 VSS 14 VSS 15 19 VSS LED6 15 LED5 LED5 13 LED9 14 LED2 10 21 LED14 PCA9622BS LED8 13 9 PCA9622DR LED7 12 VSS 8 LED6 11 LED1 7 VSS 10 LED0 terminal 1 index area 25 A6 30 SCL A2 26 SCL 3 27 SDA 31 SDA A1 29 VSS 28 VDD 32 VDD 2 30 A0 1 A0 31 A1 VSS Pin configuration for TSSOP32 Fig 3. Pin configuration for HVQFN32 6.2 Pin description Table 2. Symbol Pin description Pin Type Description 29[1] power supply supply ground 2 30 I address input 0 A1 3 31 I address input 1 A2 4 32 I address input 2 A3 5 1 I address input 3 A4 6 2 I address input 4 LED0 7 3 O LED driver 0 LED1 8 4 O LED driver 1 VSS 9 5[1] power supply supply ground LED2 10 6 O LED driver 2 LED3 11 7 O LED driver 3 LED4 12 8 O LED driver 4 LED5 13 9 O LED driver 5 VSS 14 10[1] power supply supply ground LED6 15 11 O LED driver 6 LED7 16 12 O LED driver 7 LED8 17 13 O LED driver 8 TSSOP32 HVQFN32 VSS 1 A0 PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 5 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver Table 2. Symbol Pin description …continued Pin Type Description 14 O LED driver 9 19 15[1] power supply supply ground LED10 20 16 O LED driver 10 LED11 21 17 O LED driver 11 LED12 22 18 O LED driver 12 LED13 23 19 O LED driver 12 VSS 24 20[1] power supply supply ground LED14 25 21 O LED driver 14 LED15 26 22 O LED driver 15 OE 27 23 I active LOW output enable A5 28 24 I address input 5 A6 29 25 I address input 6 SCL 30 26 I serial clock line SDA 31 27 I/O serial data line VDD 32 28 power supply supply voltage TSSOP32 HVQFN32 18 VSS LED9 [1] HVQFN32 package supply ground is connected to both VSS pins and exposed center pad. VSS pins must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 6 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 7. Functional description Refer to Figure 1 “Block diagram of PCA9622”. 7.1 Device addresses Following a START condition, the bus master must output the address of the slave it is accessing. There are a maximum of 128 possible programmable addresses using the 7 hardware address pins. Two of these addresses, Software Reset and LED All Call, cannot be used because their default power-up state is ON, leaving a maximum of 126 addresses. Using other reserved addresses, as well as any other Sub Call address, will reduce the total number of possible addresses even further. 7.1.1 Regular I2C-bus slave address The I2C-bus slave address of the PCA9622 is shown in Figure 4. To conserve power, no internal pull-up resistors are incorporated on the hardware selectable address pins and they must be pulled HIGH or LOW. Remark: Using reserved I2C-bus addresses will interfere with other devices, but only if the devices are on the bus and/or the bus will be open to other I2C-bus systems at some later date. In a closed system where the designer controls the address assignment these addresses can be used since the PCA9622 treats them like any other address. The LED All Call, Software Rest and PCA9564 or PCA9665 slave address (if on the bus) can never be used for individual device addresses. • PCA9622 LED All Call address (1110 000) and Software Reset (0000 0110) which are active on start-up • PCA9564 (0000 000) or PCA9665 (1110 000) slave address which is active on start-up • • • • ‘reserved for future use’ I2C-bus addresses (0000 011, 1111 1XX) slave devices that use the 10-bit addressing scheme (1111 0XX) slave devices that are designed to respond to the General Call address (0000 000) High-speed mode (Hs-mode) master code (0000 1XX) slave address A6 A5 A4 A3 A2 A1 hardware selectable Fig 4. A0 R/W 002aab319 Slave address The last bit of the address byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 7 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 7.1.2 LED All Call I2C-bus address • Default power-up value (ALLCALLADR register): E0h or 1110 000 • Programmable through I2C-bus (volatile programming) • At power-up, LED All Call I2C-bus address is enabled. PCA9622 sends an ACK when E0h (R/W = 0) or E1h (R/W = 1) is sent by the master. See Section 7.3.8 “ALLCALLADR, LED All Call I2C-bus address” for more detail. Remark: The default LED All Call I2C-bus address (E0h or 1110 000) must not be used as a regular I2C-bus slave address since this address is enabled at power-up. All the PCA9622s on the I2C-bus will acknowledge the address if sent by the I2C-bus master. 7.1.3 LED Sub Call I2C-bus addresses • 3 different I2C-bus addresses can be used • Default power-up values: – SUBADR1 register: E2h or 1110 001 – SUBADR2 register: E4h or 1110 010 – SUBADR3 register: E8h or 1110 100 • Programmable through I2C-bus (volatile programming) • At power-up, Sub Call I2C-bus addresses are disabled. PCA9622 does not send an ACK when E2h (R/W = 0) or E3h (R/W = 1), E4h (R/W = 0) or E5h (R/W = 1), or E8h (R/W = 0) or E9h (R/W = 1) is sent by the master. See Section 7.3.7 “SUBADR1 to SUBADR3, I2C-bus subaddress 1 to 3” for more detail. Remark: The default LED Sub Call I2C-bus addresses may be used as regular I2C-bus slave addresses as long as they are disabled. 7.1.4 Software Reset I2C-bus address The address shown in Figure 5 is used when a reset of the PCA9622 needs to be performed by the master. The Software Reset address (SWRST Call) must be used with R/W = logic 0. If R/W = logic 1, the PCA9622 does not acknowledge the SWRST. See Section 7.6 “Software reset” for more detail. R/W 0 0 0 0 0 1 1 0 002aab416 Fig 5. Software Reset address Remark: The Software Reset I2C-bus address is a reserved address and cannot be used as a regular I2C-bus slave address or as an LED All Call or LED Sub Call address. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 8 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 7.2 Control register Following the successful acknowledgement of the slave address, LED All Call address or LED Sub Call address, the bus master will send a byte to the PCA9622, which will be stored in the Control register. The lowest 5 bits are used as a pointer to determine which register will be accessed (D[4:0]). The highest 3 bits are used as Auto-Increment flag and Auto-Increment options (AI[2:0]). register address AI2 AI1 AI0 D4 D3 D2 D1 D0 002aac147 Auto-Increment options Auto-Increment flag reset state = 80h Remark: The Control register does not apply to the Software Reset I2C-bus address. Fig 6. Control register When the Auto-Increment flag is set (AI2 = logic 1), the five low order bits of the Control register are automatically incremented after a read or write. This allows the user to program the registers sequentially. Four different types of Auto-Increment are possible, depending on AI1 and AI0 values. Table 3. Auto-Increment options AI2 AI1 AI0 Function 0 0 0 no Auto-Increment 1 0 0 Auto-Increment for all registers. D[4:0] roll over to ‘0 0000’ after the last register (1 1011) is accessed. 1 0 1 Auto-Increment for individual brightness registers only. D[4:0] roll over to ‘0 0010’ after the last register (1 0001) is accessed. 1 1 0 Auto-Increment for global control registers only. D[4:0] roll over to ‘1 0010’ after the last register (1 0011) is accessed. 1 1 1 Auto-Increment for individual and global control registers only. D[4:0] roll over to ‘0 0010’ after the last register (1 0011) is accessed. Remark: Other combinations not shown in Table 3 (AI[2:0] = 001, 010, and 011) are reserved and must not be used for proper device operation. AI[2:0] = 000 is used when the same register must be accessed several times during a single I2C-bus communication, for example, changes the brightness of a single LED. Data is overwritten each time the register is accessed during a write operation. AI[2:0] = 100 is used when all the registers must be sequentially accessed, for example, power-up programming. AI[2:0] = 101 is used when the 16 LED drivers must be individually programmed with different values during the same I2C-bus communication, for example, changing color setting to another color setting. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 9 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver AI[2:0] = 110 is used when the LED drivers must be globally programmed with different settings during the same I2C-bus communication, for example, global brightness or blinking change. AI[2:0] = 111 is used when individual and global changes must be performed during the same I2C-bus communication, for example, changing a color and global brightness at the same time. Only the 5 least significant bits D[4:0] are affected by the AI[2:0] bits. When the Control register is written, the register entry point determined by D[4:0] is the first register that will be addressed (read or write operation), and can be anywhere between 0 0000 and 1 1011 (as defined in Table 4). When AI[2] = 1, the Auto-Increment flag is set and the rollover value at which the register increment stops and goes to the next one is determined by AI[2:0]. See Table 3 for rollover values. For example, if the Control register = 1111 0100 (F4h), then the register addressing sequence will be (in hex): 14 → … → 1B → 00 → … → 13 → 02 → … → 13 → 02 → … → 13 → 02 → … as long as the master keeps sending or reading data. 7.3 Register definitions Table 4. Register summary[1][2] Register number (hex) D4 D3 D2 D1 D0 Name Type Function 00 0 0 0 0 0 MODE1 read/write Mode register 1 01 0 0 0 0 1 MODE2 read/write Mode register 2 02 0 0 0 1 0 PWM0 read/write brightness control LED0 03 0 0 0 1 1 PWM1 read/write brightness control LED1 04 0 0 1 0 0 PWM2 read/write brightness control LED2 05 0 0 1 0 1 PWM3 read/write brightness control LED3 06 0 0 1 1 0 PWM4 read/write brightness control LED4 07 0 0 1 1 1 PWM5 read/write brightness control LED5 08 0 1 0 0 0 PWM6 read/write brightness control LED6 09 0 1 0 0 1 PWM7 read/write brightness control LED7 0A 0 1 0 1 0 PWM8 read/write brightness control LED8 0B 0 1 0 1 1 PWM9 read/write brightness control LED9 0C 0 1 1 0 0 PWM10 read/write brightness control LED10 0D 0 1 1 0 1 PWM11 read/write brightness control LED11 0E 0 1 1 1 0 PWM12 read/write brightness control LED12 0F 0 1 1 1 1 PWM13 read/write brightness control LED13 10 1 0 0 0 0 PWM14 read/write brightness control LED14 11 1 0 0 0 1 PWM15 read/write brightness control LED15 12 1 0 0 1 0 GRPPWM read/write group duty cycle control 13 1 0 0 1 1 GRPFREQ read/write group frequency 14 1 0 1 0 0 LEDOUT0 read/write LED output state 0 15 1 0 1 0 1 LEDOUT1 read/write LED output state 1 16 1 0 1 1 0 LEDOUT2 read/write LED output state 2 17 1 0 1 1 1 LEDOUT3 read/write LED output state 3 PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 10 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver Table 4. Register summary[1][2] …continued Register number (hex) D4 D3 D2 D1 D0 Name Type Function 18 1 1 0 0 0 SUBADR1 read/write I2C-bus subaddress 1 19 1 1 0 0 1 SUBADR2 read/write I2C-bus subaddress 2 1A 1 1 0 1 0 SUBADR3 read/write I2C-bus subaddress 3 1B 1 1 0 1 1 ALLCALLADR read/write LED All Call I2C-bus address [1] Only D[4:0] = 0 0000 to 1 1011 are allowed and will be acknowledged. D[4:0] = 1 1100 to 1 1111 are reserved and will not be acknowledged. [2] When writing to the Control register, bit 4 must be programmed with logic 0 for proper device operation. 7.3.1 Mode register 1, MODE1 Table 5. MODE1 - Mode register 1 (address 00h) bit description Legend: * default value. Bit Symbol Access Value Description 7 AI2 read only 0 Register Auto-Increment disabled. 1* Register Auto-Increment enabled. 6 AI1 read only 0* Auto-Increment bit 1 = 0. 1 Auto-Increment bit 1 = 1. Auto-Increment bit 0 = 0. 5 AI0 read only 0* 1 Auto-Increment bit 0 = 1. 4 SLEEP R/W 0 Normal mode[1]. 1* Low power mode. Oscillator off[2]. 0* PCA9622 does not respond to I2C-bus subaddress 1. 1 PCA9622 responds to I2C-bus subaddress 1. 0* PCA9622 does not respond to I2C-bus subaddress 2. 1 PCA9622 responds to I2C-bus subaddress 2. 0* PCA9622 does not respond to I2C-bus subaddress 3. 1 PCA9622 responds to I2C-bus subaddress 3. 0 PCA9622 does not respond to LED All Call I2C-bus address. 1* PCA9622 responds to LED All Call I2C-bus address. 3 SUB1 2 SUB2 1 SUB3 0 ALLCALL R/W R/W R/W R/W [1] It takes 500 µs max. for the oscillator to be up and running once SLEEP bit has been set to logic 1. Timings on LEDn outputs are not guaranteed if PWMx, GRPPWM or GRPFREQ registers are accessed within the 500 µs window. [2] No blinking or dimming is possible when the oscillator is off. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 11 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 7.3.2 Mode register 2, MODE2 Table 6. MODE2 - Mode register 2 (address 01h) bit description Legend: * default value. Bit Symbol Access Value Description 7 - read only 0* reserved 6 - read only 0* reserved 5 DMBLNK R/W 0* group control = dimming 1 group control = blinking 4 INVRT R/W 0* reserved; write must always be a logic 0 3 OCH R/W 0* outputs change on STOP command[1] 1 outputs change on ACK 2 - R/W 1* reserved; write must always be a logic 1 1 - R/W 0* reserved; write must always be a logic 0 0 - R/W 1* reserved; write must always be a logic 1 [1] Change of the outputs at the STOP command allows synchronizing outputs of more than one PCA9622. Applicable to registers from 02h (PWM0) to 17h (LEDOUT) only. 7.3.3 PWM0 to PWM15, individual brightness control Table 7. PWM0 to PWM15 - PWM registers 0 to 15 (address 02h to 11h) bit description Legend: * default value. Address Register Bit Symbol Access Value Description 02h PWM0 7:0 IDC0[7:0] R/W 0000 0000* PWM0 Individual Duty Cycle 03h PWM1 7:0 IDC1[7:0] R/W 0000 0000* PWM1 Individual Duty Cycle 04h PWM2 7:0 IDC2[7:0] R/W 0000 0000* PWM2 Individual Duty Cycle 05h PWM3 7:0 IDC3[7:0] R/W 0000 0000* PWM3 Individual Duty Cycle 06h PWM4 7:0 IDC4[7:0] R/W 0000 0000* PWM4 Individual Duty Cycle 07h PWM5 7:0 IDC5[7:0] R/W 0000 0000* PWM5 Individual Duty Cycle 08h PWM6 7:0 IDC6[7:0] R/W 0000 0000* PWM6 Individual Duty Cycle 09h PWM7 7:0 IDC7[7:0] R/W 0000 0000* PWM7 Individual Duty Cycle 0Ah PWM8 7:0 IDC8[7:0] R/W 0000 0000* PWM8 Individual Duty Cycle 0Bh PWM9 7:0 IDC9[7:0] R/W 0000 0000* PWM9 Individual Duty Cycle 0Ch PWM10 7:0 IDC10[7:0] R/W 0000 0000* PWM10 Individual Duty Cycle 0Dh PWM11 7:0 IDC11[7:0] R/W 0000 0000* PWM11 Individual Duty Cycle 0Eh PWM12 7:0 IDC12[7:0] R/W 0000 0000* PWM12 Individual Duty Cycle 0Fh PWM13 7:0 IDC13[7:0] R/W 0000 0000* PWM13 Individual Duty Cycle 10h PWM14 7:0 IDC14[7:0] R/W 0000 0000* PWM14 Individual Duty Cycle 11h PWM15 7:0 IDC15[7:0] R/W 0000 0000* PWM15 Individual Duty Cycle A 97 kHz fixed frequency signal is used for each output. Duty cycle is controlled through 256 linear steps from 00h (0 % duty cycle = LED output off) to FFh (99.6 % duty cycle = LED output at maximum brightness). Applicable to LED outputs programmed with LDRx = 10 or 11 (LEDOUT0 to LEDOUT3 registers). IDCx [ 7:0 ] duty cycle = --------------------------256 PCA9622_3 Product data sheet (1) © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 12 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 7.3.4 GRPPWM, group duty cycle control Table 8. GRPPWM - Group brightness control register (address 12h) bit description Legend: * default value Address Register Bit Symbol Access Value Description 12h GRPPWM 7:0 GDC[7:0] R/W 1111 1111 GRPPWM register When DMBLNK bit (MODE2 register) is programmed with logic 0, a 190 Hz fixed frequency signal is superimposed with the 97 kHz individual brightness control signal. GRPPWM is then used as a global brightness control allowing the LED outputs to be dimmed with the same value. The value in GRPFREQ is then a ‘Don’t care’. General brightness for the 16 outputs is controlled through 256 linear steps from 00h (0 % duty cycle = LED output off) to FFh (99.6 % duty cycle = maximum brightness). Applicable to LED outputs programmed with LDRx = 11 (LEDOUT0 to LEDOUT3 registers). When DMBLNK bit is programmed with logic 1, GRPPWM and GRPFREQ registers define a global blinking pattern, where GRPFREQ contains the blinking period (from 24 Hz to 10.73 s) and GRPPWM the duty cycle (ON/OFF ratio in %). GDC [ 7:0 ] duty cycle = --------------------------256 (2) 7.3.5 GRPFREQ, group frequency Table 9. GRPFREQ - Group Frequency register (address 13h) bit description Legend: * default value. Address Register Bit Symbol Access Value Description 13h GRPFREQ 7:0 GFRQ[7:0] R/W 0000 0000* GRPFREQ register GRPFREQ is used to program the global blinking period when DMBLNK bit (MODE2 register) is equal to 1. Value in this register is a ‘Don’t care’ when DMBLNK = 0. Applicable to LED outputs programmed with LDRx = 11 (LEDOUT0 to LEDOUT3 registers). Blinking period is controlled through 256 linear steps from 00h (41 ms, frequency 24 Hz) to FFh (10.73 s). GFRQ [ 7:0 ] + 1 global blinking period = ---------------------------------------- ( s ) 24 PCA9622_3 Product data sheet (3) © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 13 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 7.3.6 LEDOUT0 to LEDOUT3, LED driver output state Table 10. LEDOUT0 to LEDOUT3 - LED driver output state register (address 14h to 17h) bit description Legend: * default value. Address Register Bit Symbol Access Value Description 14h LEDOUT0 7:6 LDR3 R/W 00* LED3 output state control 5:4 LDR2 R/W 00* LED2 output state control 3:2 LDR1 R/W 00* LED1 output state control 15h 16h 17h LEDOUT1 LEDOUT2 LEDOUT3 1:0 LDR0 R/W 00* LED0 output state control 7:6 LDR7 R/W 00* LED7 output state control 5:4 LDR6 R/W 00* LED6 output state control 3:2 LDR5 R/W 00* LED5 output state control 1:0 LDR4 R/W 00* LED4 output state control 7:6 LDR11 R/W 00* LED11 output state control 5:4 LDR10 R/W 00* LED10 output state control 3:2 LDR9 R/W 00* LED9 output state control 1:0 LDR8 R/W 00* LED8 output state control 7:6 LDR15 R/W 00* LED15 output state control 5:4 LDR14 R/W 00* LED14 output state control 3:2 LDR13 R/W 00* LED13 output state control 1:0 LDR12 R/W 00* LED12 output state control LDRx = 00 — LED driver x is off (default power-up state). LDRx = 01 — LED driver x is fully on (individual brightness and group dimming/blinking not controlled). LDRx = 10 — LED driver x individual brightness can be controlled through its PWMx register. LDRx = 11 — LED driver x individual brightness and group dimming/blinking can be controlled through its PWMx register and the GRPPWM registers. 7.3.7 SUBADR1 to SUBADR3, I2C-bus subaddress 1 to 3 SUBADR1 to SUBADR3 - I2C-bus subaddress registers 0 to 3 (address 18h to 1Ah) bit description Legend: * default value. Table 11. Address Register Bit Symbol Access Value Description 18h SUBADR1 7:1 A1[7:1] R/W 1110 001* I2C-bus subaddress 1 0 A1[0] R only 0* reserved 7:1 A2[7:1] R/W 1110 010* I2C-bus subaddress 2 0 A2[0] R only 0* reserved 7:1 A3[7:1] R/W 1110 100* I2C-bus subaddress 3 0 A3[0] R only 0* reserved 19h 1Ah SUBADR2 SUBADR3 Subaddresses are programmable through the I2C-bus. Default power-up values are E2h, E4h, E8h, and the device(s) will not acknowledge these addresses right after power-up (the corresponding SUBx bit in MODE1 register is equal to 0). PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 14 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver Once subaddresses have been programmed to their right values, SUBx bits need to be set to logic 1 in order to have the device acknowledging these addresses (MODE1 register). Only the 7 MSBs representing the I2C-bus subaddress are valid. The LSB in SUBADRx register is a read-only bit (0). When SUBx is set to logic 1, the corresponding I2C-bus subaddress can be used during either an I2C-bus read or write sequence. 7.3.8 ALLCALLADR, LED All Call I2C-bus address ALLCALLADR - LED All Call I2C-bus address register (address 1Bh) bit description Legend: * default value. Table 12. Address Register Bit Symbol Access Value Description 1Bh ALLCALLADR 7:1 AC[7:1] R/W 1110 000* ALLCALL I2C-bus address register 0 AC[0] R only 0* reserved The LED All Call I2C-bus address allows all the PCA9622s on the bus to be programmed at the same time (ALLCALL bit in register MODE1 must be equal to 1 (power-up default state)). This address is programmable through the I2C-bus and can be used during either an I2C-bus read or write sequence. The register address can also be programmed as a Sub Call. Only the 7 MSBs representing the All Call I2C-bus address are valid. The LSB in ALLCALLADR register is a read-only bit (0). If ALLCALL bit = 0, the device does not acknowledge the address programmed in register ALLCALLADR. 7.4 Active LOW output enable input The active LOW output enable (OE) pin, allows to enable or disable all the LED outputs at the same time. • When a LOW level is applied to OE pin, all the LED outputs are enabled. • When a HIGH level is applied to OE pin, all the LED outputs are high-impedance. The OE pin can be used as a synchronization signal to switch on/off several PCA9622 devices at the same time. This requires an external clock reference that provides blinking period and the duty cycle. The OE pin can also be used as an external dimming control signal. The frequency of the external clock must be high enough not to be seen by the human eye, and the duty cycle value determines the brightness of the LEDs. Remark: Do not use OE as an external blinking control signal when internal global blinking is selected (DMBLNK = 1, MODE2 register) since it will result in an undefined blinking pattern. Do not use OE as an external dimming control signal when internal global dimming is selected (DMBLNK = 0, MODE2 register) since it will result in an undefined dimming pattern. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 15 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver Remark: During power-down, slow decay of voltage supplies may keep LEDs illuminated. Consider disabling LED outputs using HIGH level applied to OE pin. 7.5 Power-on reset When power is applied to VDD, an internal power-on reset holds the PCA9622 in a reset condition until VDD has reached VPOR. At this point, the reset condition is released and the PCA9622 registers and I2C-bus state machine are initialized to their default states (all zeroes) causing all the channels to be deselected. Thereafter, VDD must be lowered below 0.2 V to reset the device. 7.6 Software reset The Software Reset Call (SWRST Call) allows all the devices in the I2C-bus to be reset to the power-up state value through a specific formatted I2C-bus command. To be performed correctly, it implies that the I2C-bus is functional and that there is no device hanging the bus. The SWRST Call function is defined as the following: 1. A START command is sent by the I2C-bus master. 2. The reserved SWRST I2C-bus address ‘0000 011’ with the R/W bit set to ‘0’ (write) is sent by the I2C-bus master. 3. The PCA9622 device(s) acknowledge(s) after seeing the SWRST Call address ‘0000 0110’ (06h) only. If the R/W bit is set to ‘1’ (read), no acknowledge is returned to the I2C-bus master. 4. Once the SWRST Call address has been sent and acknowledged, the master sends 2 bytes with 2 specific values (SWRST data byte 1 and byte 2): a. Byte 1 = A5h: the PCA9622 acknowledges this value only. If byte 1 is not equal to A5h, the PCA9622 does not acknowledge it. b. Byte 2 = 5Ah: the PCA9622 acknowledges this value only. If byte 2 is not equal to 5Ah, then the PCA9622 does not acknowledge it. If more than 2 bytes of data are sent, the PCA9622 does not acknowledge any more. 5. Once the right 2 bytes (SWRST data byte 1 and byte 2 only) have been sent and correctly acknowledged, the master sends a STOP command to end the SWRST Call: the PCA9622 then resets to the default value (power-up value) and is ready to be addressed again within the specified bus free time (tBUF). The I2C-bus master must interpret a non-acknowledge from the PCA9622 (at any time) as a ‘SWRST Call Abort’. The PCA9622 does not initiate a reset of its registers. This happens only when the format of the SWRST Call sequence is not correct. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 16 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 7.7 Individual brightness control with group dimming/blinking A 97 kHz fixed frequency signal with programmable duty cycle (8 bits, 256 steps) is used to control individually the brightness for each LED. On top of this signal, one of the following signals can be superimposed (this signal can be applied to the 4 LED outputs): • A lower 190 Hz fixed frequency signal with programmable duty cycle (8 bits, 256 steps) is used to provide a global brightness control. • A programmable frequency signal from 24 Hz to 1⁄10.73 Hz (8 bits, 256 steps) with programmable duty cycle (8 bits, 256 steps) is used to provide a global blinking control. 1 2 3 4 5 6 7 8 9 10 11 12 507 508 509 510 511 512 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10 11 Brightness Control signal (LEDn) N × 40 ns with N = (0 to 255) (PWMx Register) M × 256 × 2 × 40 ns with M = (0 to 255) (GRPPWM Register) 256 × 40 ns = 10.24 µs (97.6 kHz) Group Dimming signal 256 × 2 × 256 × 40 ns = 5.24 ms (190.7 Hz) 1 2 3 4 5 6 7 8 resulting Brightness + Group Dimming signal 002aab417 Minimum pulse width for LEDn Brightness Control is 40 ns. Minimum pulse width for Group Dimming is 20.48 µs. When M = 1 (GRPPWM register value), the resulting LEDn Brightness Control + Group Dimming signal will have 2 pulses of the LED Brightness Control signal (pulse width = N × 40 ns, with ‘N’ defined in PWMx register). This resulting Brightness + Group Dimming signal above shows a resulting Control signal with M = 4 (8 pulses). Fig 7. Brightness + Group Dimming signals PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 17 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 8. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 8.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 8). SDA SCL data line stable; data valid Fig 8. change of data allowed mba607 Bit transfer 8.1.1 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 9). SDA SCL S P START condition STOP condition mba608 Fig 9. Definition of START and STOP conditions 8.2 System configuration A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 10). PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 18 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER SLAVE 002aaa966 Fig 10. System configuration 8.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold time must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. data output by transmitter not acknowledge data output by receiver acknowledge SCL from master 1 S START condition 2 8 9 clock pulse for acknowledgement 002aaa987 Fig 11. Acknowledgement on the I2C-bus PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 19 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 9. Bus transactions slave address data for register D[4:0](1) control register S A6 A5 A4 A3 A2 A1 A0 0 START condition A X X X D4 D3 D2 D1 D0 A Auto-Increment options Auto-Increment flag R/W A acknowledge from slave P acknowledge from slave acknowledge from slave STOP condition 002aac148 (1) See Table 4 for register definition. Fig 12. Write to a specific register slave address control register S A6 A5 A4 A3 A2 A1 A0 0 START condition A 1 0 0 0 0 0 acknowledge from slave 0 0 MODE1 register selection Auto-Increment on all registers R/W MODE1 register MODE2 register A acknowledge from slave A A acknowledge from slave acknowledge from slave (cont.) Auto-Increment on SUBADR3 register ALLCALLADR register (cont.) A A acknowledge from slave acknowledge from slave P STOP condition 002aac149 Fig 13. Write to all registers using the Auto-Increment feature slave address control register S A6 A5 A4 A3 A2 A1 A0 0 START condition A R/W acknowledge from slave 1 0 1 0 0 0 PWM0 register 1 0 PWM0 register selection increment on Individual brightness registers only PWM1 register A acknowledge from slave A A acknowledge from slave acknowledge from slave (cont.) Auto-Increment on PWM14 register (cont.) PWM15 register PWM0 register PWMx register A A A A acknowledge from slave acknowledge from slave acknowledge from slave acknowledge from slave P STOP condition 002aac150 Fig 14. Multiple writes to Individual Brightness registers only using the Auto-Increment feature PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 20 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver slave address ReSTART condition control register S A6 A5 A4 A3 A2 A1 A0 0 START condition A 1 0 0 0 Auto-Increment on all registers R/W acknowledge from slave data from MODE2 register (cont.) 0 0 0 0 MODE1 register selection slave address data from MODE1 register A Sr A6 A5 A4 A3 A2 A1 A0 1 acknowledge from slave acknowledge from master R/W acknowledge from slave Auto-Increment on data from ALLCALLADR register data from PWM0 A (cont.) A data from MODE1 register A A A acknowledge from master acknowledge from master acknowledge from master A (cont.) acknowledge from master data from last read byte (cont.) A not acknowledge from master P STOP condition 002aac151 Fig 15. Read all registers using the Auto-Increment feature slave address(1) new LED All Call I2C address(2) control register sequence (A) S A6 A5 A4 A3 A2 A1 A0 0 START condition A X X X 1 1 0 1 1 ALLCALLADR register selection R/W acknowledge from slave A 1 0 1 0 1 acknowledge from slave 0 1 X A P acknowledge from slave Auto-Increment on STOP condition the 16 LEDs are on at the acknowledge(3) LED All Call I2C address sequence (B) S 1 0 1 0 START condition 1 0 1 control register 0 A X X X R/W acknowledge from the 4 devices 0 1 0 LEDOUT register (LED fully ON) 0 0 A 0 1 0 1 LEDOUT register selection acknowledge from the 4 devices 0 1 0 1 A P acknowledge from the 4 devices STOP condition 002aac152 (1) In this example, several PCA9622s are used and the same sequence (A) (above) is sent to each of them. (2) ALLCALL bit in MODE1 register is equal to 1 for this example. (3) OCH bit in MODE2 register is equal to 1 for this example. Fig 16. LED All Call I2C-bus address programming and LED All Call sequence example PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 21 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 10. Application design-in information up to 40 V up to 40 V VDD = 2.5 V, 3.3 V or 5.0 V I2C-BUS/SMBus MASTER SDA 10 kΩ 10 kΩ 10 kΩ(1) VDD SDA LED0 SCL SCL LED1 OE OE LED2 LED3 PCA9622 LED4 LED5 LED6 LED7 LED light bar up to 40 V LED light bar up to 40 V LED8 LED9 LED10 A0 LED11 A1 A2 A3 LED12 A4 LED13 A5 LED14 A6 LED15 VSS VSS 002aad532 (1) OE requires pull-up resistor if control signal from the master is open-drain. I2C-bus address = 0010 101x. Remark: During power-down, slow decay of voltage supplies may keep LEDs illuminated. Consider disabling LED outputs using HIGH level applied to OE pin. Fig 17. Typical application PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 22 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 10.1 Junction temperature calculation A device junction temperature can be calculated when the ambient temperature or the case temperature is known. When the ambient temperature is known, the junction temperature is calculated using Equation 4 and the ambient temperature, junction to ambient thermal resistance and power dissipation. T j = T amb + R th ( j-a ) × P tot (4) where: Tj = junction temperature Tamb = ambient temperature Rth(j-a) = junction to ambient thermal resistance Ptot = (device) total power dissipation When the case temperature is known, the junction temperature is calculated using Equation 5 and the case temperature, junction to case thermal resistance and power dissipation. T j = T case + R th ( j-c ) × P tot (5) where: Tj = junction temperature Tcase = case temperature Rth(j-c) = junction to case thermal resistance Ptot = (device) total power dissipation Here are two examples regarding how to calculate the junction temperature using junction to case and junction to ambient thermal resistance. In the first example (Section 10.1.1), given the operating condition and the junction to ambient thermal resistance, the junction temperature of PCA9622DR, in the TSSOP32 package, is calculated for a system operating condition in 50 °C1 ambient temperature. In the second example (Section 10.1.2), based on a specific customer application requirement where only the case temperature is known, applying the junction to case thermal resistance equation, the junction temperature of the PCA9626B, in the LQFP48 package, is calculated. 1. 50 °C is a typical temperature inside an enclosed system. The designers should feel free, as needed, to perform their own calculation using the examples. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 23 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 10.1.1 Example 1: Tj calculation of PCA9622DR, in TSSOP32 package, when Tamb is known Rth(j-a) = 83 °C/W Tamb = 50 °C LED output low voltage (LED VOL) = 0.5 V LED output current per channel = 80 mA Number of outputs = 16 IDD(max) = 12 mA VDD(max) = 5.5 V I2C-bus clock (SCL) maximum sink current = 25 mA I2C-bus data (SDA) maximum sink current = 25 mA 1. Find Ptot (device total power dissipation): – output total power = 80 mA × 16 × 0.5 V = 640 mW – chip core power consumption = 12 mA × 5.5 V = 66 mW – SCL power dissipation = 25 mA × 0.4 V = 10 mW – SDA power dissipation = 25 mA × 0.4 V = 10 mW Ptot = (320 + 55 + 10 + 10) mW = 708 mW 2. Find Tj (junction temperature): Tj = (Tamb + Rth(j-a) × Ptot) = (50 °C + 83 °C/W × 708 mW) = 108.8 °C 10.1.2 Example 2: Tj calculation where only Tcase is known This example uses a customer’s specific application of the PCA9626B, 24-channel LED controller in the LQFP48 package, where only the case temperature (Tcase) is known. Tj = Tcase + Rth(j-c) × Ptot, where: Rth(j-c) = 18 °C/W Tcase (measured) = 94.6 °C VOL of LED ~ 0.5 V IDD(max) = 18 mA VDD(max) = 5.5 V LED output voltage LOW = 0.5 V LED output current: 60 mA on 1 port = (60 mA × 1) 50 mA on 6 ports = (50 mA × 6) 40 mA on 2 ports = (40 mA × 2) 20 mA on 12 ports = (20 mA × 12) 1 mA on 3 ports = (1 mA × 3) I2C-bus maximum sink current on clock line = 25 mA I2C-bus maximum sink current on data line = 25 mA PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 24 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 1. Find Ptot (device total power dissipation) – output current (60 mA × 1 port); output power (60 mA × 1 × 0.5 V) = 30 mW – output current (50 mA × 6 ports); output power (50 mA × 6 × 0.5 V) = 150 mW – output current (40 mA × 2 ports); output power (40 mA × 2 × 0.5 V) = 40 mW – output current (20 mA × 12 ports); output power (20 mA × 12 × 0.5 V) = 120 mW – output current (1 mA × 3 ports); output power (1 mA × 3 × 0.5 V) = 1.5 mW Output total power = 341.5 mW – chip core power consumption = 18 mA × 5.5 V = 99 mW – SCL power dissipation = 25 mA × 0.4 V = 10 mW – SDA power dissipation = 25 mA × 0.4 V = 10 mW Ptot (device total power dissipation) = 460.5 mW 2. Find Tj (junction temperature): Tj = Tcase + Rth(j-a) × Ptot = 94.6 °C + 18 °C/W × 460.5 mW = 102.9 °C 11. Limiting values Table 13. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit VDD supply voltage Conditions −0.5 +6.0 V VI/O voltage on an input/output pin VSS − 0.5 5.5 V Vdrv(LED) LED driver voltage VSS − 0.5 40 V IO(LEDn) output current on pin LEDn IOL(tot) total LOW-level output current VOL = 0.5 V - 100 mA 1600 - mA ISS ground supply current per VSS pin - 800 mA Ptot total power dissipation Tamb = 25 °C - 1.8 W P/ch power dissipation per channel Tamb = 85 °C - 0.72 W Tamb = 25 °C - 100 mW - 45 mW - 125 °C −65 +150 °C −40 +85 °C [1] Tamb = 85 °C Tj junction temperature Tstg storage temperature Tamb ambient temperature [2] operating [1] Each bit must be limited to a maximum of 100 mA and the total package limited to 1600 mA due to internal busing limits. [2] Refer to Section 10.1 for junction temperature calculation. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 25 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver Table 14. TSSOP32 versus HVQFN32 power dissipation and output current capability Measurement TSSOP32 HVQFN32 maximum power dissipation (chip + output drivers) 1200 mW 2500 mW maximum power dissipation (output drivers only) 1110 mW 2410 mW Tamb = 25 °C maximum drive current per channel 1110 mW < ------------------------------------ = 138.8 mA [1 16-bit × 0.5 V 2410 mW < ------------------------------------ = 301.3 mA [1 16-bit × 0.5 V ] ] maximum power dissipation (chip + output drivers) 723 mW 1500 mW maximum power dissipation (output drivers only) 637 mW 1410 mW Tamb = 60 °C maximum drive current per channel 637 mW < ------------------------------------ = 79.6 mA 16-bit × 0.5 V 1410 mW < ------------------------------------ = 176.3 mA [1 16-bit × 0.5 V ] Tamb = 80 °C maximum power dissipation (chip + output drivers) 542 mW 1125 mW maximum power dissipation (output drivers only) 456 mW 1040 mW maximum drive current per channel [1] 456 mW < ------------------------------------ = 57 mA 16-bit × 0.5 V 1040 mW < ------------------------------------ = 130 mA [1] 16-bit × 0.5 V This value signifies package’s ability to handle more than 100 mA per output driver. The device’s maximum current rating per output is 100 mA. 12. Thermal characteristics Table 15. Symbol Rth(j-a) Rth(j-c) [1] Thermal characteristics Parameter Conditions thermal resistance from junction to ambient thermal resistance from junction to case Unit TSSOP32 83 °C/W HVQFN32 [1] 40 °C/W TSSOP32 [1] 23 °C/W HVQFN32 [1] 14 °C/W Calculated in accordance with JESD 51-7. PCA9622_3 Product data sheet Typ [1] © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 26 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 13. Static characteristics Table 16. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 2.3 - 5.5 V VDD = 2.7 V - 0.2 4 mA VDD = 3.6 V - 2 6 mA VDD = 5.5 V - 8.5 12 mA VDD = 2.7 V - 1.3 5 µA VDD = 3.6 V - 1.8 6 µA - 3.2 7 µA - 1.70 2.0 V Supply VDD supply voltage IDD supply current standby current Istb on pin VDD; operating mode; no load; fSCL = 1 MHz on pin VDD; no load; fSCL = 0 Hz; I/O = inputs; VI = VDD VDD = 5.5 V VPOR power-on reset voltage no load; VI = VDD or VSS [1] Input SCL; input/output SDA VIL LOW-level input voltage −0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VOL = 0.4 V; VDD = 2.3 V 20 - - mA VOL = 0.4 V; VDD = 5.0 V 30 - - mA IL leakage current VI = VDD or VSS −1 - +1 µA Ci input capacitance VI = VSS - 6 10 pF LED driver outputs Vdrv(LED) LED driver voltage IOL LOW-level output current VOL = 0.5 V 0 - 40 V 100 - - mA ILOH HIGH-level output leakage current Vdrv(LED) = 5 V - - ±1 µA Vdrv(LED) = 40 V - ±1 15 µA Ron ON-state resistance Co output capacitance Vdrv(LED) = 40 V; VDD = 2.3 V - 2 5 Ω - 2.5 5 pF VIL LOW-level input voltage −0.5 - +0.3VDD V [2] OE input VIH HIGH-level input voltage 0.7VDD - 5.5 V ILI input leakage current −1 - +1 µA Ci input capacitance - 15 40 pF Address inputs VIL LOW-level input voltage −0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V ILI input leakage current −1 - +1 µA Ci input capacitance - 3.7 5 pF [1] VDD must be lowered to 0.2 V in order to reset part. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 27 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver [2] Each bit must be limited to a maximum of 100 mA and the total package limited to 1600 mA due to internal busing limits. 002aae507 0.25 VDD = 5.5 V 4.5 V 3.0 V 2.3 V IOL (A) 0.15 0.05 0.05 0.15 VDD = 5.5 V 4.5 V 3.0 V 2.3 V IOL (A) 0.15 −0.05 −0.05 002aae508 0.25 0.35 −0.05 −0.05 0.55 0.15 VOL (V) 0.35 0.55 VOL (V) a. Tamb = −40 °C b. Tamb = 25 °C 002aae509 0.25 IOL (A) 0.15 VDD = 5.5 V 4.5 V 3.0 V 2.3 V 0.05 −0.05 −0.05 0.15 0.35 0.55 VOL (V) c. Tamb = 85 °C Fig 18. VOL versus IOL PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 28 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 14. Dynamic characteristics Table 17. Dynamic characteristics Symbol Parameter Standard-mode Fast-mode I2C-bus I2C-bus Conditions Min Max Min Max Fast-mode Plus I2C-bus Min Max Unit fSCL SCL clock frequency 0 100 0 400 0 1000 tBUF bus free time between a STOP and START condition 4.7 - 1.3 - 0.5 - kHz µs tHD;STA hold time (repeated) START condition 4.0 - 0.6 - 0.26 - µs tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - 0.26 - µs tSU;STO set-up time for STOP condition 4.0 - 0.6 - 0.26 - µs tHD;DAT data hold time 0 - 0 - 0 - ns 0.3 3.45 0.1 0.9 0.05 0.45 µs 0.3 3.45 0.1 0.9 0.05 0.45 µs tVD;ACK data valid acknowledge time [1] tVD;DAT data valid time [2] tSU;DAT data set-up time 250 - 100 - 50 - ns tLOW LOW period of the SCL clock 4.7 - 1.3 - 0.5 - µs tHIGH HIGH period of the SCL clock 4.0 - 0.6 - 0.26 - µs tf fall time of both SDA and SCL signals - 300 20 + 0.1Cb[5] 300 - 120 ns tr rise time of both SDA and SCL signals - 1000 20 + 0.1Cb[5] 300 - 120 ns tSP pulse width of spikes that must be suppressed by the input filter - 50 - 50 - 50 ns [3][4] [6] Output propagation delay tPLH LOW to HIGH propagation delay OE to LEDn; MODE2[1:0] = 01 - - - - - 150 ns tPHL HIGH to LOW propagation delay OE to LEDn; MODE2[1:0] = 01 - - - - - 150 ns td(SCL-Q) delay time from SCL to data output SCL to LEDn; MODE2[3] = 1; outputs change on ACK - - - - - 450 ns td(SDA-Q) delay time from SDA to data output SDA to LEDn; MODE2[3] = 0; outputs change on STOP condition - - - - - 450 ns Output port timing [1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 29 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver [2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. [3] A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to bridge the undefined region of SCL’s falling edge. [4] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time (tf) for the SDA output stage is specified at 250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. [5] Cb = total capacitance of one bus line in pF. [6] Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns. SDA tr tBUF tf tHD;STA tSP tLOW SCL tHD;STA P tSU;STA tHD;DAT S tHIGH tSU;DAT tSU;STO Sr P 002aaa986 Fig 19. Definition of timing protocol START condition (S) tSU;STA bit 7 MSB (A7) tLOW bit 6 (A6) tHIGH bit 1 (D1) bit 0 (D0) acknowledge (A) STOP condition (P) 1 / fSCL SCL tBUF tr tf SDA tHD;STA tSU;DAT tHD;DAT tVD;DAT tVD;ACK tSU;STO 002aab285 Rise and fall times refer to VIL and VIH. Fig 20. I2C-bus timing diagram PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 30 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 15. Test information VDD PULSE GENERATOR VI VO RL 500 Ω VDD open GND DUT RT CL 50 pF 002aab284 RL = Load resistor for LEDn. RL for SDA and SCL > 1 kΩ (3 mA or less current). CL = Load capacitance includes jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generators. Fig 21. Test circuitry for switching times PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 31 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 16. Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 (A 3) A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z θ mm 1.1 0.15 0.05 0.95 0.85 0.25 0.30 0.19 0.20 0.09 11.1 10.9 6.2 6.0 0.65 8.3 7.9 1 0.75 0.50 0.2 0.1 0.1 0.78 0.48 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT487-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 22. Package outline SOT487-1 (TSSOP32) PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 32 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 9 y1 C v M C A B w M C b 16 y L 17 8 e e2 Eh 1/2 e 24 1 terminal 1 index area 32 25 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 5.1 4.9 3.75 3.45 5.1 4.9 3.75 3.45 0.5 3.5 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT617-3 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 02-04-18 02-10-22 Fig 23. Package outline SOT617-3 (HVQFN32) PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 33 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 17. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 18. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 18.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 18.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 18.3 Wave soldering Key characteristics in wave soldering are: PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 34 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 18.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 24) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 18 and 19 Table 18. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 19. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 24. PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 35 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 24. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 19. Abbreviations Table 20. Abbreviations Acronym Description CDM Charged-Device Model DUT Device Under Test ESD ElectroStatic Discharge FET Field-Effect Transistor HBM Human Body Model I2C-bus Inter-Integrated Circuit bus LED Light Emitting Diode LCD Liquid Crystal Display LSB Least Significant Bit MM Machine Model MSB Most Significant Bit NMOS Negative-channel Metal-Oxide Semiconductor PCB Printed-Circuit Board PMOS Positive-channel Metal-Oxide Semiconductor PWM Pulse Width Modulation RGB Red/Green/Blue RGBA Red/Green/Blue/Amber SMBus System Management Bus PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 36 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 20. Revision history Table 21. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9622_3 20090831 Product data sheet - PCA9622_2 Modifications: • Table 1 “Ordering information”: HVQFN32 package version changed from “SOT617-1” to “SOT617-3” • • • • • Figure 3 “Pin configuration for HVQFN32”: adjusted size of exposed center pad Section 7.4 “Active LOW output enable input”: added 2nd “Remark” Figure 17 “Typical application”: added “Remark” Added (new) Section 10.1 “Junction temperature calculation”. Section 11 “Limiting values”: – Table 13 “Limiting values”: added “Tj, junction temperature” specification – Added (new) Table 14 “TSSOP32 versus HVQFN32 power dissipation and output current capability” • • • Added (new) Table 15 “Thermal characteristics” Table 16 “Static characteristics”, sub-section “LED driver outputs”: added ILOH specification Figure 23: changed package outline version from “SOT617-1” to “SOT617-3” PCA9622_2 20090611 Product data sheet - PCA9622_1 PCA9622_1 20090327 Product data sheet - - PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 37 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 21. Legal information 21.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 21.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 21.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 21.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 22. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PCA9622_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 31 August 2009 38 of 39 PCA9622 NXP Semiconductors 16-bit Fm+ I2C-bus 100 mA 40 V LED driver 23. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.3 7.1.4 7.2 7.3 7.3.1 7.3.2 7.3.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 7 Device addresses . . . . . . . . . . . . . . . . . . . . . . . 7 Regular I2C-bus slave address . . . . . . . . . . . . . 7 LED All Call I2C-bus address . . . . . . . . . . . . . . 8 LED Sub Call I2C-bus addresses . . . . . . . . . . . 8 Software Reset I2C-bus address . . . . . . . . . . . 8 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 9 Register definitions . . . . . . . . . . . . . . . . . . . . . 10 Mode register 1, MODE1 . . . . . . . . . . . . . . . . 11 Mode register 2, MODE2 . . . . . . . . . . . . . . . . 12 PWM0 to PWM15, individual brightness control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7.3.4 GRPPWM, group duty cycle control . . . . . . . . 13 7.3.5 GRPFREQ, group frequency . . . . . . . . . . . . . 13 7.3.6 LEDOUT0 to LEDOUT3, LED driver output state . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7.3.7 SUBADR1 to SUBADR3, I2C-bus subaddress 1 to 3 . . . . . . . . . . . . . . . . . . . . . . 14 7.3.8 ALLCALLADR, LED All Call I2C-bus address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7.4 Active LOW output enable input . . . . . . . . . . . 15 7.5 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 16 7.6 Software reset. . . . . . . . . . . . . . . . . . . . . . . . . 16 7.7 Individual brightness control with group dimming/blinking . . . . . . . . . . . . . . . . . . . . . . . 17 8 Characteristics of the I2C-bus. . . . . . . . . . . . . 18 8.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8.1.1 START and STOP conditions . . . . . . . . . . . . . 18 8.2 System configuration . . . . . . . . . . . . . . . . . . . 18 8.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 19 9 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 20 10 Application design-in information . . . . . . . . . 22 10.1 Junction temperature calculation . . . . . . . . . . 23 10.1.1 Example 1: Tj calculation of PCA9622DR, in TSSOP32 package, when Tamb is known . . . . 24 10.1.2 Example 2: Tj calculation where only Tcase is known . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 25 12 13 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 21 21.1 21.2 21.3 21.4 22 23 Thermal characteristics . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics . . . . . . . . . . . . . . . . . Test information. . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . Handling information . . . . . . . . . . . . . . . . . . . Soldering of SMD packages . . . . . . . . . . . . . . Introduction to soldering. . . . . . . . . . . . . . . . . Wave and reflow soldering . . . . . . . . . . . . . . . Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 27 29 31 32 34 34 34 34 34 35 36 37 38 38 38 38 38 38 39 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 31 August 2009 Document identifier: PCA9622_3