PHILIPS P5CD144

P5Cx012/02x/40/73/80/144
family
Secure dual interface and contact PKI smart card controller
Rev. 03 — 24 January 2008
Objective short data sheet
1. General description
1.1 SmartMX family approach
The new CMOS14 SmartMX family members feature a modular set of devices with:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
12 KB to 144 KB EEPROM
200 KB user ROM
6144 B RAM
High-performance secured Public Key Infrastructure (PKI) coprocessor (RSA, ECC)
Secured dual/triple-DES coprocessor
Secured AES coprocessor
Memory Management Unit (MMU)
ISO/IEC 7816 contact interface
Optional ISO/IEC 14443 A Contactless Interface Unit (CIU)
Optional S2C interface for NFC communication link
5-metal-layer 0.14 µm CMOS technology
EEPROM with typical 500000 cycles endurance and minimum 20 years retention time
Broad spectrum of delivery types
Optional certified crypto library modules for RSA, ECC, DES, AES, SHA and PRNG
1.2 SmartMX family properties
The long-term approved SmartMX family features a significantly enhanced secure smart
card IC architecture. Extended instructions for Java and C code, linear addressing, high
speed at low power and a universal memory management unit are among many other
improvements added to the classic 80C51 core architecture. The technology transfer step
from 5-metal-layer 0.18 µm to 5-metal-layer 0.14 µm CMOS technology offers now even
more advantages in terms of security features, memory resources, crypto coprocessor
calculation speed for RSA and ECC as well as availability of secure hardware support for
2/3-key Digital Encryption Standard (DES) and Advanced Encryption Standard (AES)
operations.
The availability of contact interface, optional contactless or S2C interface enables the easy
implementation of native or open platform and multi-application operating systems in
market segments like e.g. banking, E-passport, ID card, Health Card, secure access, Java
card, Near Field Communication (NFC) connectable mobile hand sets as well as Trusted
Platform Modules (TPM).
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
1.3 Naming conventions
Table 1.
Naming conventions
P5xyzzz SmartMX platform
x
Type of category:
y
Interface options:
C = PKI controller + Triple-DES coprocessor + AES coprocessor on selected products
C = contact interface - ISO/IEC 7816
D = dual interface - ISO/IEC 7816 + ISO/IEC 14443 contactless interface
N = ISO/IEC 7816 + S2C Interface for NFC
zzz
Amount of non-volatile memory in KB, increasing count for further product options
1.4 Cryptographic hardware coprocessors
1.4.1 FameXE coprocessor
The approved and modular FameXE architecture supports the trend of increasing RSA
keys with faster execution speeds as well as Elliptic Curve Cryptography (ECC) based on
GF(p) or GF(2n) at best performance. FameXE supports RSA with an operand length of
up to 8-kbit (up to 4-kbit with intermediate storage in RAM only).
The FameXE PKI coprocessor supports 192-bit ECC key length that offers the same level
of security as 2048-bit RSA. An ECC GF(2n) based signature, using a 163-bit key can be
executed in less than 30 ms providing a security level comparable to 1024-bit RSA. The
operand size for ECC, supported by FameXE, is only limited by the 2.5 KB size of the
FXRAM. FameXE is easy to use and the flexible interface provides programmers with the
freedom to implement their own cryptology solutions. A secured and CC EAL5+ certified
crypto library providing a large range of required functions will be available for all devices
in order to support customers in implementing public key-based solutions.
1.4.2 Triple-DES coprocessor
The DES for widely used symmetric encryption is supported by a dedicated, high
performance, highly attack resistant hardware coprocessor. Single DES and triple-DES,
based on two or three DES keys, can be executed within less than 40 µs. Relevant
standards (ISO/IEC, ANSI, FIPS) and Message Authentication Code (MAC) are fully
supported. A secured crypto library element for DES is available.
1.4.3 AES coprocessor
SmartMX is the first smart card microcontroller platform to provide a dedicated high
performance 128-bit parallel processing coprocessor to support secure AES. The
implementation is based on FIPS197 as standardized by the National Institute for
Standards and Technology (NIST), and supports key lengths of 128-bit, 192-bit, and
256-bit with performance levels comparable to DES. AES is the next generation for
symmetric data encryption and recommended successor of DES providing significantly
improved security level. A secured crypto library element for AES is available.
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
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Rev. 03 — 24 January 2008
2 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
1.5 SmartMX interfaces
1.5.1 SmartMX contact interface
Operating in accordance with ISO/IEC 7816, the SmartMX contact interface is supported
by a built-in Universal Asynchronous Receiver/Transmitter (UART), which enables data
rates of up to 1 Mbit/s allowing for the automatic generation of all typical baud rates and
supports transmission protocols T = 0 and T = 1. Either one or two additional IOs are
available.
1.5.2 SmartMX contactless interface
The optional contactless interface is fully compatible with ISO/IEC 14443 A as well as
NXP Semiconductors field proven MIFARE technology. A dedicated Contactless Interface
Unit (CIU) manages and supports communication using data rates of up to 848 kbit/s. A
true anti-collision method (according to ISO/IEC 14443-3) enables multiple cards to be
handled simultaneously.
The optional MIFARE functionality provided in configurations B1 (MIFARE 1 KB
emulation) and B4 (MIFARE 4 KB emulation) safeguard the interface compatibility with
any installed MIFARE infrastructure. The ability to run the MIFARE protocol concurrently
with other contactless transmission protocols implemented by the user OS (T = CL or self
defined) enables the combination of new services and existing applications based on
MIFARE (e.g. ticketing) on a single dual interface controller based smart card.
A tutorial software library for ISO/IEC 14443-3 and ISO/IEC 14443-4 is available to
support NXP Semiconductors customers for easy integration of the contactless
technology into current system solutions.
1.5.3 SmartMX S2C interface
The S2C interface is intended for use with NXP Semiconductors NFC circuits (e.g. PN511,
PN531) in order to configure a secure NFC system, e.g. in mobile hand sets.
Operated both in Contact mode (ISO/IEC 7816) and in S2C mode the user defines the
final function of the controller chip with its operating system. This allows the same level of
security, functionality and flexibility for the contact interface as well as for S2C interface.
The S2C interface is connected to the internal ISO 14443 CIU. The CIU handles the
demodulation and the modulation of the S2C signals in a way that a full contactless
communication via this interface and the NFC IC can be enabled. As the S2C interface is
connected to the CIU the power of the P5CN080/P5CN144 has to be supplied via the
VDD and VSS pads to use the S2C interface. The S2C interface does not need any
software adaptation compared to the normal contactless operation.
Connected to the S2C interface of a NFC IC the device is compatible with existing MIFARE
reader infrastructure and the optional emulation modes of MIFARE 1 KB or MIFARE 4 KB
enable fast system integration and backward compatibility to MIFARE based cards. The
communication on the S2C interface supports both the ISO/IEC 14443 A part 3 and the
ISO/IEC 14443 part 4.
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
3 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
1.6 Security features
SmartMX incorporates a big range of both inherent and OS controlled security features as
counter measure against all types of attacks. NXP Semiconductors has used the deep
knowledge of chip security, combined with the used handshaking circuit technology, the
very dense 5-metal-layer 0.14 µm technology, glue logic and active shielding methodology
for optimum results in CC EAL5+, EMVCo and other third party certifications and
approvals.
SmartMX Memory Management Unit (MMU), designed to define various memory
segments and assign security attributes accordingly, supports a strong firewall concept
that keeps different applications separate from each other. Only the System mode has full
access privileges to all memory space and on-chip peripherals, while the User mode only
has privileges defined upon card personalization and executed under the control of the
System mode.
1.7 Security evaluation and certificates
The reached target of the certification is CC EAL5+. Also third party approvals like e.g.
EMVCo (Visa, CAST), ZKA and others, depending on the application requirements, are
available.
NXP Semiconductors continues to drive forward third party security evaluations to provide
its customers with the relevant information and documentation needed to execute
subsequent composite evaluations of implemented applications.
1.8 Optional crypto library
NXP Semiconductors will offer for all family types an optional crypto library:
• Various algorithms
– AES encryption and decryption using the AES coprocessor
– DES and Triple-DES encryption and decryption using the DES coprocessor
– RSA encryption and decryption, signature generation and verification for
straightforward and CRT keys up to 5024 bits
– RSA key generation
– ECC over GF(p) signature generation and verification (ECDSA) and Diffie-Hellman
key exchange for keys up to 544 bits
– ECC over GF(p) key generation
– ECC over GF(2n) signature generation and verification (ECDSA) and
Diffie-Hellman key exchange for keys up to 571 bits
– ECC over GF(2n) key generation
– SHA-1, SHA-224 and SHA-256 hash algorithm
– Pseudo-Random Number Generator (PRNG)
• Easy to use API for all algorithms
• Secure operation in contact as well as in the contactless mode
• Latest built-in security features to avoid power (SPA/DPA), timing and fault attacks
(DFA)
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
4 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
• Common criteria CC EAL5+ certification planned [except ECC over GF(2n)] according
to BSI-PP-0002 protection profile
2. Features
2.1 Standard family features
n EEPROM: choice of 12 KB, 20 KB, 40 KB, 72 KB, 80 KB or 144 KB
u Data retention time: 20 years minimum
u Endurance: 500000 cycles typical
n ROM: 200 KB
n RAM: 6144 B
u 256 B IRAM + 3.25 KB standard RAM usable for CPU
u 2560 B FXRAM usable for FameXE
n Dedicated Secure_MX51 Smart Card CPU (Memory eXtended/enhanced 80C51)
u 5-metal-layer 0.14 µm CMOS technology
u Operating in Contact and Contactless mode (dependent on family type option)
u Featuring a 24-bit universal memory space, 24-bit program counter
u Combined universal program and data linear address range up to 16 MB
u Additional instructions to improve:
- Pointer operations
- Performance
- Code density of both C and Java source code
n ISO/IEC 7816 contact interface
n PKI coprocessor FameXE
n Support of major Public Key Cryptography (PKC) systems like RSA, Elgamel, DSS,
Diffie-Hellman, Guillou-Quisquater, Fiat-Shamir and Elliptic Curves
u 8192 bits maximum key length for RSA with randomly chosen modulus
u 4096 bits maximum key length for calculation within RAM
u 32-bit interface
u Boolean operations for acceleration of standard, symmetric cipher algorithms
n High speed Triple-DES coprocessor (64-bit parallel processing DES engine)
u Two or three keys loadable
u DES3 performance < 40 µs
n High speed AES coprocessor (128-bit parallel processing AES engine)
n Memory Management Unit (MMU)
n Low power and low voltage design using NXP Semiconductors handshaking
technology
n Multiple source vectorized interrupt system with four priority levels
n Watch exception provides software debugging facility
n Multiple source RESET system
n Two 16-bit timers
n High reliable EEPROM for both data storage and program execution
n Bytewise EEPROM programming and read access
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
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Rev. 03 — 24 January 2008
5 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
n Versatile EEPROM programming of 1 B to 64 B at a time or, optionally 1 B to 128 B at
a time
n Typical EEPROM page erasing time: 1.7 ms
n Typical EEPROM page programming time: 1.0 ms
u Power-saving Idle mode
u Wake-up from Idle mode by RESET or any activated interrupt
u Power-saving Sleep (power-down) mode or Clockstop mode
u Wake-up from Sleep or Clockstop mode by RESET or external interrupt
n Contact configuration and serial interface according to ISO/IEC 7816: GND, VDD,
CLK, RST_N, IO1
n ISO/IEC 7816 UART supporting standard protocols T = 0 and T = 1 as well as high
speed personalization up to 1 Mbit/s
n External or internally generated configurable CPU clock
n 1 MHz to 10 MHz operating external clock frequency range
u Internal CPU clock up to 30 MHz with synchronous operation
u Internal clocking independent of externally applied frequency
n High speed 16-bit CRC engine according to ITU-T polynomial definition
n Low power Random Number Generator (RNG) in hardware, AIS-31 compliant
n 1.62 V to 5.5 V extended operating voltage range for class C, B and A
n Optional extended Class B operation mode (targeted for battery supplied applications)
n −25 °C to +85 °C ambient temperature
n Broad spectrum of delivery types:
u Wafers
u Modules
2.2 Product specific family features
n P5CC021, P5CC040, P5CC073, P5CC080 and P5CC144
u ISO/IEC 7816 contact interface
u Two additional IO ports IO2 and IO3 for full-duplex serial data communication
n P5CD012, P5CD020, P5CD040, P5CD080 and P5CD144
u CIU fully compatible with ISO/IEC 14443 A:
- Fully supports the T = CL protocol according ISO/IEC 14443-4
- Data transfer rates supported: 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s
u MIFARE contactless interface according ISO/IEC 14443-2:
- 13.56 MHz operating frequency
- Reliable communication due to 100 % ASK
- High speed efficient frame support
- True anticollision
u MIFARE reader infrastructure compatibility
u Optional MIFARE 1 KB and MIFARE 4 KB emulation
u Two additional IO ports IO2 and IO3 for full-duplex serial data communication
n P5CN080 and P5CN144
u S2C interface
u One additional IO port IO2 for full-duplex serial data communication
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
6 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
2.3 Security features
n Enhanced security sensors:
u Low and high clock frequency sensor
u Low and high temperature sensor
u Low and high supply voltage sensor
u Single Fault Injection (SFI) attack detection
u Light sensors (included integrated memory light sensor functionality)
n Electronic fuses for safeguarded mode control
n Active shielding
n Unique ID for each die
n Clock input filter for protection against spikes
n Power-up and power-down reset
n Optional programmable card disable feature
n Memory security (encryption and physical measures) for RAM, EEPROM and ROM
n Memory Management Unit (MMU) including memory protection:
u Secure multi application operating systems via two different operation modes:
System mode and User mode
u OS controlled access restriction mechanism to peripherals in User mode
u Memory mapping up to 8-MB code memory
u Memory mapping up to 8-MB (64-kbit) data memory
n Optional disabling of ROM read instructions by code executed in EEPROM
n Optional disabling of any code execution out of RAM
n EEPROM programming:
u No external clock
u Hardware sequencer controlled
u On-chip high voltage generation
u Enhanced error correction mechanism
n 64-B or 128-B EEPROM for customer-defined Security FabKey. Featuring batch, wafer
or die-individual security data, included encrypted diversification features on request
n 14 B user write protected security area in EEPROM (byte access, inhibit functionality
per byte)
n 32 B write once security area in EEPROM (bit access)
n 32 B user read only area in EEPROM (byte access)
n Customer specific EEPROM initialization available
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
7 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
2.4 Design-in support
n Approved development tool chain:
u Keil PK51 development tool package inclusive µVision3/dScope C51 simulator,
additional specific hardware drivers inclusive simulation of contactless interface
and ISO/IEC 7816 card interface board. A SmartMX DBox allows software
debugging and integration tests.
u Ashling Ultra-Emulator platform, stand alone ROM prototyping boards and
ISO/IEC 7816 and ISO/IEC 14443 card interface board. Code coverage and
performance measurement software tools for real time software testing.
u Dual interface dummy modules OM6711 (PDM 1.1 - SOT658) with special antenna
bonding on C4 and C8 for testing the implanting process and antenna connection.
n Software libraries:
u Libraries supporting contactless communication according to ISO 14443,
part 3 and 4
u EEPROM read/write routines
3. Applications
3.1 Application areas
n
n
n
n
n
n
Banking
Java cards
E-passports
ID cards
Secure access
Trusted platform modules
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
8 of 18
P5Cx012/02x/40/73/80/144 family
NXP Semiconductors
Secure dual interface and contact PKI smart card controller
4. Quick reference data
Table 2.
Quick reference data
Symbol Parameter
supply voltage
VDD
Conditions
Min
Typ
Max
Unit
Class A: 5 V range
4.5
5.0
5.5
V
2.7
3.0
3.3
V
2.2
3.0
3.3
V
1.62
1.8
1.98
V
Class B: 3 V range
Class BE: 3 V range
Class C: 1.8 V range
[1]
[1]
In case of extended Class B (Class BE) operation mode (targeted for battery supplied applications), the
class C is not supported.
5. Ordering information
Table 3.
Ordering information
Type number
P5CC021UA
Package
Name
Description
Version
FFC
8 inch wafer (sawn; 150 µm thickness; on film
frame carrier; electronic fail die marking according
to SECSII format)
<tbd>
FFC
8 inch wafer (sawn; 75 µm thickness; on film frame <tbd>
carrier; electronic fail die marking according to
SECSII format)
PCM1.1
contact chip card module (super 35 mm format,
8-contact)
SOT658
PDM1.1
contactless chip card module (Plug-in type; super
35 mm format, 8-contact)
SOT658
P5CC040UA
P5CC073UA
P5CC080UA
P5CC144UA
P5CD012UA
P5CD020UA
P5CD040UA
P5CD080UA
P5CD144UA
P5CN080UA
P5CN144UA
P5CD012UE
P5CD020UE
P5CD040UE
P5CD080UE
P5CD144UE
P5CC021XS
P5CC040XS
P5CC073XS
P5CC080XS
P5CC144XS
P5CD012X1
P5CD020X1
P5CD040X1
P5CD080X1
P5CD144X1
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
9 of 18
P5Cx012/02x/40/73/80/144 family
NXP Semiconductors
Secure dual interface and contact PKI smart card controller
Table 3.
Ordering information …continued
Type number
P5CD012X0
Package
Name
Description
PDM1.1
contactless chip card module (super 35 mm format, SOT658
8-contact)
MOB4
plastic leadless module carrier package; 35 mm
wide tape
SOT500-2
MOB6
plastic leadless module carrier package; 35 mm
wide tape
SOT500-3
P5CD020X0
Version
P5CD040X0
P5CD080X0
P5CD144X0
P5CD012A4
P5CD020A4
P5CD040A4
P5CD080A4
P5CD144A4
P5CD012A6
P5CD020A6
P5CD040A6
P5CD080A6
P5CD144A6
Table 4.
Feature table
Product
type
EEPROM
[KB]
User
ROM
[KB]
Total
RAM
[KB]
CXRAM
[KB]
P5CD012
12
200
6
3.5
2.5
yes
yes
yes
3
dual interface
P5CC021
20
200
6
3.5
2.5
yes
yes
yes
3
contact
P5CD020
20
200
6
3.5
2.5
yes
yes
yes
3
dual interface
P5CC040
40
200
6
3.5
2.5
yes
yes
yes
3
contact
P5CD040
40
200
6
3.5
2.5
yes
yes
yes
3
dual interface
P5CC073
72
200
6
3.5
2.5
yes
yes
yes
3
contact
P5CN080
80
200
6
3.5
2.5
yes
yes
yes
3
contact + S2C
interface for NFC
P5CC080
80
200
6
3.5
2.5
yes
yes
yes
3
contact
P5CD080
80
200
6
3.5
2.5
yes
yes
yes
3
dual interface
P5CN144
144
200
6
3.5
2.5
yes
yes
yes
2
contact + S2C
interface for NFC
P5CC144
144
200
6
3.5
2.5
yes
yes
yes
3
contact
P5CD144
144
200
6
3.5
2.5
yes
yes
yes
3
dual interface
FXRAM Coprocessor
[KB]
FameXE DES
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
AES
ISO 7816 Interface option
IO pads
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
10 of 18
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IO2
PROGRAMMABLE
IO 1, 2, 3
EEPROM
RAM
200 KB
PROGRAM
MEMORY
20 KB/40 KB/
72 KB/80 KB/
144 KB
DATA AND
PROGRAM
MEMORY
6144 B
DATA
MEMORY
UART
ISO 7816
IO3
FameXE
ENHANCED PUBLIC
KEY
COPROCESSOR e.g.
RSA, ECC
NXP Semiconductors
IO1
ROM
6. Functional diagram
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
P5CC021 P5CC040 P5CC073 P5CC080
P5CC144
RST_N
CLOCK
FILTER
CLOCK
GENERATION
SECURE_MX51 CPU
TRIPLE-DES
COPROCESSOR
TIMERS
SECURITY SENSORS
RESET GENERATION
CRC16
16-bit 16-bit
T0
T1
AES
COPROCESSOR
FAST
RNG
VOLTAGE REGULATOR
11 of 18
© NXP B.V. 2008. All rights reserved.
VDD
VSS
Fig 1. Functional diagram P5CC021/P5CC040/P5CC073/P5CC080/P5CC144
001aae954
Secure dual interface and contact PKI smart card controller
Rev. 03 — 24 January 2008
CLK
P5Cx012/02x/40/73/80/144 family
MEMORY MANAGEMENT UNIT (MMU)
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NXP Semiconductors
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
P5CD020 P5CD040 P5CD080 P5CD144
LA
RF
INTERFACE
CIU
ISO 14443
ROM
EEPROM
RAM
200 KB
PROGRAM
MEMORY
20 KB/40 KB/
80 KB/144 KB
DATA AND
PROGRAM
MEMORY
6144 B
DATA
MEMORY
LB
IO1
IO2
PROGRAMMABLE
IO 1, 2, 3
UART
ISO 7816
IO3
FameXE
ENHANCED PUBLIC
KEY
COPROCESSOR e.g.
RSA, ECC
RST_N
CLOCK
FILTER
CLOCK
GENERATION
SECURE_MX51 CPU
TRIPLE-DES
COPROCESSOR
TIMERS
SECURITY SENSORS
RESET GENERATION
CRC16
16-bit 16-bit
T0
T1
AES
COPROCESSOR
FAST
RNG
VOLTAGE REGULATOR
12 of 18
© NXP B.V. 2008. All rights reserved.
VDD
VSS
Fig 2. Functional diagram P5CD012/P5CD020/P5CD040/P5CD080/P5CD144
001aae953
P5Cx012/02x/40/73/80/144 family
CLK
Secure dual interface and contact PKI smart card controller
Rev. 03 — 24 January 2008
MEMORY MANAGEMENT UNIT (MMU)
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NXP Semiconductors
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
P5CN080 P5CN144
SIGIN
S2C
INTERFACE
CIU
ISO 14443
ROM
EEPROM
RAM
200 KB
PROGRAM
MEMORY
80 KB/
144 KB
DATA AND
PROGRAM
MEMORY
6144 B
DATA
MEMORY
SIGOUT
IO1
PROGRAMMABLE
IO 1, 2
UART
ISO 7816
IO2
FameXE
ENHANCED PUBLIC
KEY
COPROCESSOR e.g.
RSA, ECC
RST_N
CLOCK
FILTER
CLOCK
GENERATION
SECURE_MX51 CPU
TRIPLE-DES
COPROCESSOR
TIMERS
SECURITY SENSORS
RESET GENERATION
CRC16
16-bit 16-bit
T0
T1
AES
COPROCESSOR
FAST
RNG
VOLTAGE REGULATOR
13 of 18
© NXP B.V. 2008. All rights reserved.
VDD
VSS
Fig 3. Functional diagram P5CN080/P5CN144
001aae955
P5Cx012/02x/40/73/80/144 family
CLK
Secure dual interface and contact PKI smart card controller
Rev. 03 — 24 January 2008
MEMORY MANAGEMENT UNIT (MMU)
P5Cx012/02x/40/73/80/144 family
NXP Semiconductors
Secure dual interface and contact PKI smart card controller
7. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
VSS (ground = 0 V).
Symbol Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
−0.5
+6.0
V
VI
input voltage
any signal pad
−0.5
VDD + 0.5
V
II
input current
pad IO1, IO2 or
IO3
-
±15.0
mA
IO
output current
pad IO1, IO2 or
IO3
-
±15.0
mA
Ilu
latch-up current
VI < 0 V
or VI > VDD
-
±100
mA
Vesd
electrostatic discharge voltage
pads VDD, VSS,
CLK, RST_N, IO1,
IO2, IO3
[1]
-
±4.0
kV
pads LA, LB
[1]
-
±2.0
kV
-
1
W
-
-
Ptot
total power dissipation
[2]
Tstg
storage temperature
[3]
[1]
MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 kΩ; Tamb = −25 °C to +85 °C.
[2]
Depending on appropriate thermal resistance of the package.
[3]
Depending on delivery type, refer to NXP Semiconductors General Specification for 8” Wafer and to NXP
Semiconductors Contact & Dual Interface Chip Card Module Specification.
8. Abbreviations
Table 6.
Abbreviations
Acronym
Description
AES
Advanced Encryption Standard
API
Application Programming Interface
ASK
Amplitude Shift Keying
CIU
Contactless Interface Unit
CRC
Cyclic Redundancy Check
CRT
Chinese Remainder Theorem
DES
Digital Encryption Standard
DFA
Differential Fault Analysis
DPA
Differential Power Analysis
DSS
Digital Signature Standard
ECC
Elliptic Curve Cryptography
ECDSA
Elliptic Curve Digital Signature Algorithm
EEPROM
Electrically Erasable Programmable Read-Only Memory
GF
Galois Function
MAC
Message Authentication Code
MMU
Memory Management Unit
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
14 of 18
P5Cx012/02x/40/73/80/144 family
NXP Semiconductors
Secure dual interface and contact PKI smart card controller
Table 6.
Abbreviations …continued
Acronym
Description
NFC
Near Field Communication
OS
Operating System
PKC
Public Key Cryptography
PKI
Public Key Infrastructure
PRNG
Pseudo-Random Number Generator
RNG
Random Number Generator
RSA
Rivest, Shamir and Adleman
S2C
SigIn-SigOut-Connection
SFI
Single Fault Injection
SHA
Secure Hash Algorithm
SMD
Surface Mounted Device
SPA
Simple Power Analysis
TPM
Trusted Platform Module
UART
Universal Asynchronous Receiver/Transmitter
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
P5CX012_02X_40_73_80_
144_FAM_SDS_3
20080124
Objective short data sheet
Modifications:
P5CX02X_40_73_80_144_
FAM_SDS_2
•
•
•
Change notice
Supersedes
P5CX02X_40_73_80_144_
FAM_SDS_2
Type number P5CD012 added
Table 3 “Ordering information” corrected and new type number added
Figure 2 added
20070424
Objective short data sheet
-
P5CX02X_40_80_144_FAM
_SDS_1
P5CX02X_40_80_144_FAM 20070216
_SDS_1
Objective short data sheet
-
-
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
15 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP B.V.
FabKey — is a trademark of NXP B.V.
11. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
16 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
12. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Naming conventions . . . . . . . . . . . . . . . . . . . . . .2
Quick reference data . . . . . . . . . . . . . . . . . . . . .9
Ordering information . . . . . . . . . . . . . . . . . . . . .9
Feature table . . . . . . . . . . . . . . . . . . . . . . . . . .10
Table 5.
Table 6.
Table 7.
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
13. Figures
Fig 1.
Fig 2.
Fig 3.
Functional diagram
P5CC021/P5CC040/P5CC073/P5CC080/
P5CC144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Functional diagram
P5CD012/P5CD020/P5CD040/P5CD080/
P5CD144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Functional diagram P5CN080/P5CN144 . . . . . . .13
continued >>
P5CX012_02X_40_73_80_144_FAM_SDS_3
Objective short data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 January 2008
17 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
14. Contents
1
1.1
1.2
1.3
1.4
1.4.1
1.4.2
1.4.3
1.5
1.5.1
1.5.2
1.5.3
1.6
1.7
1.8
2
2.1
2.2
2.3
2.4
3
3.1
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
13
14
General description . . . . . . . . . . . . . . . . . . . . . . 1
SmartMX family approach . . . . . . . . . . . . . . . . 1
SmartMX family properties . . . . . . . . . . . . . . . . 1
Naming conventions . . . . . . . . . . . . . . . . . . . . . 2
Cryptographic hardware coprocessors . . . . . . . 2
FameXE coprocessor . . . . . . . . . . . . . . . . . . . 2
Triple-DES coprocessor . . . . . . . . . . . . . . . . . . 2
AES coprocessor . . . . . . . . . . . . . . . . . . . . . . . 2
SmartMX interfaces . . . . . . . . . . . . . . . . . . . . . 3
SmartMX contact interface . . . . . . . . . . . . . . . . 3
SmartMX contactless interface . . . . . . . . . . . . 3
SmartMX S2C interface . . . . . . . . . . . . . . . . . . 3
Security features. . . . . . . . . . . . . . . . . . . . . . . . 4
Security evaluation and certificates . . . . . . . . . 4
Optional crypto library. . . . . . . . . . . . . . . . . . . . 4
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Standard family features . . . . . . . . . . . . . . . . . . 5
Product specific family features . . . . . . . . . . . . 6
Security features. . . . . . . . . . . . . . . . . . . . . . . . 7
Design-in support . . . . . . . . . . . . . . . . . . . . . . . 8
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application areas . . . . . . . . . . . . . . . . . . . . . . . 8
Quick reference data . . . . . . . . . . . . . . . . . . . . . 9
Ordering information . . . . . . . . . . . . . . . . . . . . . 9
Functional diagram . . . . . . . . . . . . . . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 January 2008
Document identifier: P5CX012_02X_40_73_80_144_FAM_SDS_3