DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D333 BY558; BY578 Damper diodes Product specification File under Discrete Semiconductors, SC01 1998 Jun 25 Philips Semiconductors Product specification Damper diodes BY558; BY578 FEATURES DESCRIPTION • Glass passivated Rugged glass package, using a high temperature alloyed construction. • High maximum operating temperature This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. • Low leakage current • Excellent stability • Also available with preformed leads for easy insertion handbook, halfpage k • Designed to withstand transients up to 1700 V. a MAM384 APPLICATIONS • For use in multi-sync monitor horizontal deflection circuits Fig.1 Simplified outline (SOD115) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM VRRM PARAMETER CONDITIONS MIN. MAX. UNIT BY558 − 1500 V BY578 − 1700 V BY558 − 1500 V BY578 − 1700 V − 1400 V non-repetitive peak reverse voltage repetitive peak reverse voltage VR continuous reverse voltage IF(AV) average forward current IFRM repetitive peak forward current IFSM non-repetitive peak forward current Tstg storage temperature −65 +175 °C Tj junction temperature −65 +150 °C 1998 Jun 25 Ttp = 65 °C; see Fig.2; PCB mounting; averaged over any 20 ms period; see Fig.4 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax 2 − 2.5 A − 12 A − 80 A Philips Semiconductors Product specification Damper diodes BY558; BY578 ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS TYP. IF = 5 A; Tj = Tj max; see Fig.3 MAX. − UNIT VF forward voltage 1.3 V IF = 5 A; see Fig.3 − IR reverse current VR = VRRMmax; Tj = 150 °C − 175 µA trr reverse recovery time when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig.6 − 250 ns VFRM forward recovery voltage IF = 5 A; dIF/dt = 50 A/µs; see Fig.5 15 20 V tfr forward recovery time IF = 5 A; dIF/dt = 50 A/µs; VF = 5 V; see Fig.5 260 350 ns IF = 5 A; dIF/dt = 50 A/µs; VF = 2 V; see Fig.5 700 − ns 1.7 V THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 20 K/W Rth j-a thermal resistance from junction to ambient note 1 70 K/W Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.4. For more information please refer to the ‘General Part of Handbook SC01’. 1998 Jun 25 3 Philips Semiconductors Product specification Damper diodes BY558; BY578 GRAPHICAL DATA MGK455 MGK453 10 6 handbook, halfpage handbook, halfpage 3 IF (A) 2.5 a= Ptot 8 2 (W) 57 1. 4 6 4 2 2 0 Fig.2 0 0 1 2 IF(AV) (A) 0 3 1 2 VF (V) 3 Dotted line: Tj = 150 °C. Solid line: Tj = 25 °C. Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current. Fig.3 Forward current as a function of forward voltage; maximum values. 50 handbook, halfpage MGK454 handbook, halfpage 25 IF 7 10% 50 time tfr VF VFRM 2 VF 5 V/2 V 3 time MGA200 Dimensions in mm. Fig.5 Fig.4 Device mounted on a printed-circuit board. 1998 Jun 25 4 Forward recovery time and voltage definition. Philips Semiconductors Product specification Damper diodes BY558; BY578 handbook, full pagewidth IF (A) DUT + 10 Ω 0.5 25 V t rr 1Ω 50 Ω 0 t 0.25 0.5 IR (A) 1.0 Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns. Source impedance: 50 Ω; tr ≤ 15 ns. Fig.6 Test circuit and reverse recovery time waveform and definition. 1998 Jun 25 5 MAM057 Philips Semiconductors Damper diodes PACKAGE OUTLINE Product specification BY558; BY578 Hermetically sealed glass package; axial leaded; 2 leads SOD115 (1) k D G L a b L DIMENSIONS (mm are the original dimensions) UNIT b max. D max. G max. L min. mm 1.35 5.5 6.0 27 0 2.5 5 mm scale Note 1. The marking band indicates the cathode. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-10-14 SOD115 1998 Jun 25 EUROPEAN PROJECTION 6 Philips Semiconductors Product specification Damper diodes BY558; BY578 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. 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