2PD602AQL; 2PD602ARL; 2PD602ASL 50 V, 500 mA NPN general-purpose transistors Rev. 01 — 27 October 2008 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number[1] 2PD602AQL Package PNP complement NXP JEDEC SOT23 TO-236AB - 2PD602ARL 2PB710ARL 2PD602ASL 2PB710ASL 2PD602AQL/DG SOT23 TO-236AB - 2PD602ARL/DG 2PB710ARL/DG 2PD602ASL/DG 2PB710ASL/DG [1] /DG: halogen-free 1.2 Features n n n n General-purpose transistors Three current gain selections AEC-Q101 qualified Small SMD plastic package 1.3 Applications n General-purpose switching and amplification 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 50 V IC collector current - - 500 mA 2PD602AxL NXP Semiconductors 50 V, 500 mA NPN general-purpose transistors Table 2. Quick reference data …continued Symbol Parameter Conditions hFE DC current gain VCE = 10 V; IC = 150 mA [1] Min Typ Max hFE group Q 85 - 170 hFE group R 120 - 240 hFE group S 170 - 340 Unit [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 2. Pinning information Table 3. Pinning Pin Description 1 base 2 emitter 3 collector Simplified outline Graphic symbol 3 3 1 1 2 2 sym021 3. Ordering information Table 4. Ordering information Type number[1] 2PD602AQL Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 - plastic surface-mounted package; 3 leads SOT23 2PD602ARL 2PD602ASL 2PD602AQL/DG 2PD602ARL/DG 2PD602ASL/DG [1] /DG: halogen-free 4. Marking Table 5. Marking codes Type number Marking code[1] 2PD602AQL SH* 2PD602ARL SG* 2PD602ASL SF* 2PD602AXL_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 October 2008 2 of 9 2PD602AxL NXP Semiconductors 50 V, 500 mA NPN general-purpose transistors Table 5. Marking codes …continued Type number Marking code[1] 2PD602AQL/DG SX* 2PD602ARL/DG SW* 2PD602ASL/DG SV* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 60 V VCEO collector-emitter voltage open base - 50 V VEBO emitter-base voltage open collector - 5 V IC collector current - 500 mA ICM peak collector current single pulse; tp ≤ 1 ms - 1 A IBM peak base current single pulse; tp ≤ 1 ms - 200 mA Ptot total power dissipation Tamb ≤ 25 °C - 250 mW Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C [1] [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction in free air to ambient [1] Conditions Min Typ Max Unit - - 500 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 2PD602AXL_1 Product data sheet [1] © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 October 2008 3 of 9 2PD602AxL NXP Semiconductors 50 V, 500 mA NPN general-purpose transistors 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter ICBO IEBO hFE Conditions Min Typ Max Unit collector-base cut-off current VCB = 60 V; IE = 0 A - - 10 nA VCB = 60 V; IE = 0 A; Tj = 150 °C - - 5 µA nA emitter-base cut-off current VEB = 4 V; IC = 0 A 10 40 - - VCE = 10 V; IC = 500 mA hFE group Q VCE = 10 V; IC = 150 mA [1] 85 - 170 hFE group R VCE = 10 V; IC = 150 mA [1] 120 - 240 hFE group S VCE = 10 V; IC = 150 mA [1] 170 - 340 - - 600 mV hFE group Q 140 - - MHz hFE group R 160 - - MHz hFE group S 180 - - MHz - - 15 pF collector-emitter saturation voltage IC = 300 mA; IB = 30 mA [1] fT transition frequency VCE = 10 V; IC = 50 mA; f = 100 MHz [1] [1] - DC current gain VCEsat collector capacitance Cc [1] VCB = 10 V; IE = ie = 0 A; f = 1 MHz Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 2PD602AXL_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 October 2008 4 of 9 2PD602AxL NXP Semiconductors 50 V, 500 mA NPN general-purpose transistors 9. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm Fig 1. 0.15 0.09 04-11-04 Package outline SOT23 (TO-236AB) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] 2PD602AQL Package Description Packing quantity 3000 10000 SOT23 4 mm pitch, 8 mm tape and reel -215 -235 SOT23 4 mm pitch, 8 mm tape and reel -215 -235 2PD602ARL 2PD602ASL 2PD602AQL/DG 2PD602ARL/DG 2PD602ASL/DG [1] For further information and the availability of packing methods, see Section 14. [2] /DG: halogen-free 2PD602AXL_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 October 2008 5 of 9 2PD602AxL NXP Semiconductors 50 V, 500 mA NPN general-purpose transistors 11. Soldering 3.3 2.9 1.9 solder lands solder resist 3 2 1.7 solder paste 0.6 (3×) 0.7 (3×) occupied area Dimensions in mm 0.5 (3×) 0.6 (3×) 1 Fig 2. sot023_fr Reflow soldering footprint SOT23 (TO-236AB) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 Fig 3. Wave soldering footprint SOT23 (TO-236AB) 2PD602AXL_1 Product data sheet sot023_fw © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 October 2008 6 of 9 2PD602AxL NXP Semiconductors 50 V, 500 mA NPN general-purpose transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes 2PD602AXL_1 20081027 Product data sheet - - 2PD602AXL_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 October 2008 7 of 9 2PD602AxL NXP Semiconductors 50 V, 500 mA NPN general-purpose transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 2PD602AXL_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 October 2008 8 of 9 2PD602AxL NXP Semiconductors 50 V, 500 mA NPN general-purpose transistors 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Test information . . . . . . . . . . . . . . . . . . . . . . . . . Quality information . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 3 3 4 4 4 5 5 6 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 October 2008 Document identifier: 2PD602AXL_1