BC848 series 30 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package NXP JEITA JEDEC PNP complement BC848B SOT23 - TO-236AB BC858B BC848W SOT323 SC-70 - BC858W 1.2 Features General-purpose transistors SMD plastic packages 1.3 Applications General-purpose switching and amplification 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 30 V IC collector current - - 100 mA hFE DC current gain BC848B 200 290 450 BC848W 110 - 800 VCE = 5 V; IC = 2 mA BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 2. Pinning information Table 3. Pinning Pin Description 1 base 2 emitter 3 collector Simplified outline Symbol 3 3 1 1 2 006aaa144 2 sym021 3. Ordering information Table 4. Ordering information Type number Package Name Description Version BC848B - plastic surface mounted package; 3 leads SOT23 BC848W SC-70 plastic surface mounted package; 3 leads SOT323 4. Marking Table 5. Marking codes Type number Marking code[1] BC848B 1K* BC848W 1M* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BC848_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 2 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO VCEO collector-base voltage open emitter - 30 V collector-emitter voltage open base - 30 V VEBO emitter-base voltage open collector - 5 V IC collector current - 100 mA ICM peak collector current single pulse; tp ≤ 1 ms - 200 mA IBM peak base current single pulse; tp ≤ 1 ms - 200 mA Ptot total power dissipation Tamb ≤ 25 °C SOT23 - 250 mW SOT323 - 200 mW [1] Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air [1] Min Typ Max Unit SOT23 - - 500 K/W SOT323 - - 625 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BC848_SER_7 Product data sheet [1] © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 3 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Min Typ Max Unit collector-base cut-off VCB = 30 V; IE = 0 A current VCB = 30 V; IE = 0 A; Tj = 150 °C - - 15 nA - - 5 μA IEBO emitter-base cut-off current VEB = 5 V; IE = 0 A - - 100 nA hFE DC current gain VCE = 5 V; IC = 10 μA - 150 - BC848B 200 290 450 BC848W 110 - 800 - 90 250 mV ICBO Conditions VCE = 5 V; IC = 2 mA VCEsat VBEsat VBE collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA IC = 100 mA; IB = 5 mA [1] - 200 600 mV base-emitter saturation voltage IC = 10 mA; IB = 0.5 mA [2] - 700 - mV IC = 100 mA; IB = 5 mA [2] - 900 - mV base-emitter voltage IC = 2 mA; VCE = 5 V [3] 580 660 700 mV IC = 10 mA; VCE = 5 V [3] - - 770 mV 100 - - MHz - 2.5 3 pF - 2 10 dB fT transition frequency VCE = 5 V; IC = 10 mA; f = 100 MHz Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz NF noise figure VCE = 5 V; IC = 200 μA; RS = 2 kΩ; f = 1 kHz; B = 200 Hz [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. [2] VBEsat decreases by approximately 1.7 mV/K with increasing temperature. [3] VBE decreases by approximately 2 mV/K with increasing temperature. BC848_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 4 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors mgt727 600 VBE (mV) 1000 hFE (1) 500 mgt728 1200 (1) 400 800 (2) (2) 300 600 200 400 (3) (3) 100 200 0 10−1 1 10 102 0 10−2 103 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 1. 102 103 I C (mA) (3) Tamb = 150 °C BC848B: DC current gain as a function of collector current; typical values mgt729 104 VCEsat (mV) Fig 2. BC848B: Base-emitter voltage as a function of collector current; typical values mgt730 1200 VBEsat (mV) 1000 (1) 103 800 (2) 600 (3) 102 400 (1) 200 (3) (2) 10 10−1 1 10 102 0 10−1 103 1 IC/IB = 20 IC/IB = 10 (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 3. 102 103 (3) Tamb = 150 °C BC848B: Collector-emitter saturation voltage as a function of collector current; typical values Fig 4. BC848B: Base-emitter saturation voltage as a function of collector current; typical values BC848_SER_7 Product data sheet 10 I C (mA) I C (mA) © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 5 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 8. Package outline 3.0 2.8 1.1 0.9 2.2 1.8 1.1 0.8 0.45 0.15 3 3 0.45 0.15 2.5 1.4 2.1 1.2 2.2 1.35 2.0 1.15 1 1 2 0.48 0.38 1.9 Dimensions in mm Fig 5. 04-11-04 Package outline SOT23 (TO-236AB) 2 0.4 0.3 0.15 0.09 0.25 0.10 1.3 Dimensions in mm Fig 6. 04-11-04 Package outline SOT323 (SC-70) 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description 3000 10000 BC848B SOT23 4 mm pitch, 8 mm tape and reel -215 -235 BC848W SOT323 4 mm pitch, 8 mm tape and reel -115 -135 [1] For further information and the availability of packing methods, see Section 14. BC848_SER_7 Product data sheet Packing quantity © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 6 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 10. Soldering 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BC848_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 7 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.60 2.35 0.85 (3×) 0.50 (3×) 1.90 3 solder resist occupied area 1 Dimensions in mm 0.55 (3×) Fig 9. 2.40 msa429 Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3.65 2.10 3 2.70 solder lands 1 0.90 (2×) solder resist occupied area Dimensions in mm preferred transport direction during soldering msa419 Fig 10. Wave soldering footprint SOT323 (SC-70) BC848_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 8 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 11. Mounting 43.4 43.4 0.6 0.7 0.6 40 0.6 0.55 40 0.7 0.5 Dimensions in mm 006aaa527 PCB thickness: FR4 PCB = 1.6 mm Fig 11. FR4 PCB, standard footprint SOT23 (TO-236AB) BC848_SER_7 Product data sheet 0.5 Dimensions in mm 006aaa672 PCB thickness: FR4 PCB = 1.6 mm Fig 12. FR4 PCB, standard footprint SOT323 (SC-70) © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 9 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BC848_SER_7 20091117 Product data sheet - BC848_SER_6 Modifications: BC848_SER_6 • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • • Figure 9 “Reflow soldering footprint SOT323 (SC-70)”: updated Figure 10 “Wave soldering footprint SOT323 (SC-70)”: updated 20060203 Product data sheet - BC846_BC847_ BC848_5 BC846W_BC847W_ BC848W_4 BC846_BC847_BC848_5 20040206 Product specification - BC846_BC847_ BC848_4 BC846W_BC847W_ BC848W_4 Product specification - BC846W_847W_3 20020204 BC848_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 10 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BC848_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 11 of 12 BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 November 2009 Document identifier: BC848_SER_7