74AHC1GU04 Inverter Rev. 05 — 10 July 2007 Product data sheet 1. General description The 74AHC1GU04 is a high-speed Si-gate CMOS device. It provides an inverting single stage function. 2. Features n n n n n Symmetrical output impedance High noise immunity Low power dissipation Balanced propagation delays ESD protection: u HBM JESD22-A114E: exceeds 2000 V u MM JESD22-A115-A: exceeds 200 V u CDM JESD22-C101C: exceeds 1000 V n Specified from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AHC1GU04GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74AHC1GU04GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 4. Marking Table 2. Marking codes Type number Marking 74AHC1GU04GW AD 74AHC1GU04GV AU4 74AHC1GU04 NXP Semiconductors Inverter 5. Functional diagram 2 A Y 4 1 2 mna044 mna043 Fig 1. Logic symbol 4 A Y mna045 Fig 2. IEC logic symbol Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74AHC1GU04 n.c. 1 A 2 GND 3 5 VCC 4 Y 001aaf099 Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin Description n.c. 1 not connected A 2 data input GND 3 ground (0 V) Y 4 data output VCC 5 supply voltage 7. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Input Output A Y L H H L 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 2 of 12 74AHC1GU04 NXP Semiconductors Inverter 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current IO output current VI < −0.5 V Min Max Unit −0.5 +7.0 V −20 - mA −0.5 +7.0 V VO < −0.5 V or VO > VCC + 0.5 V - ±20 mA −0.5 V < VO < VCC + 0.5 V - ±25 mA [1] ICC supply current - 75 mA IGND ground current −75 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit 2.0 5.0 5.5 V VCC supply voltage VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate VCC = 3.3 V ± 0.3 V - - 100 ns/V VCC = 5.0 V ± 0.5 V - - 20 ns/V 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol VIH VIL Parameter HIGH-level input voltage LOW-level input voltage 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max VCC = 2.0 V 1.7 - - 1.7 - 1.7 - V VCC = 3.0 V 2.4 - - 2.4 - 2.4 - V VCC = 5.5 V 4.4 - - 4.4 - 4.4 - V VCC = 2.0V - - 0.3 - 0.3 - 0.3 V VCC = 3.0 V - - 0.6 - 0.6 - 0.6 V VCC = 5.5 V - - 1.1 - 1.1 - 1.1 V 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 3 of 12 74AHC1GU04 NXP Semiconductors Inverter Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol VOH VOL Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = −50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = −8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 µA CI input capacitance - 1.5 10 - 10 - 10 pF 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; tr = tf = ≤ 3.0 ns. For test circuit see Figure 6. Symbol Parameter propagation delay tpd 25 °C Conditions Min Typ Max Min Max Min Max - 3.4 7.1 1.0 8.5 1.0 10.0 ns - 4.9 10.6 1.0 12.0 1.0 13.5 ns CL = 15 pF - 2.6 5.5 1.0 6.0 1.0 7.0 ns CL = 50 pF - 3.6 7.0 1.0 8.0 1.0 9.0 ns - 14 - - - - - pF A to Y; see Figure 5 VCC = 3.0 V to 3.6 V [1] [2] CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V power dissipation capacitance CPD [1] −40 °C to +85 °C −40 °C to +125 °C Unit per buffer; VI = GND to VCC [3] [4] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 3.3 V. [3] Typical values are measured at VCC = 5.0 V. [4] CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 4 of 12 74AHC1GU04 NXP Semiconductors Inverter fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 12. Waveforms VM(1) A input VCC tPHL tPLH PULSE GENERATOR VI CL 50 pF RT VM(1) Y output VO DUT mna046 mna034 VM = 0.5 × VCC; VI = GND to VCC. Test data is given in Table 8. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 5. The input (A) to output (Y) propagation delay times Fig 6. Load circuitry for switching times 13. Typical transfer characteristics mna397 2.0 VO (V) 1.6 mna398 1.0 VO ICC (mA) 0.8 1.2 0.6 0.8 0.4 3.0 10 VO ICC (mA) VO (V) 8 6 1.5 4 ID (drain current) 0.4 ID (drain current) 0.2 0 0 0 0.4 0.8 1.2 1.6 2.0 2 0 0 0 1 VI (V) Fig 7. VCC = 2.0 V; IO = 0 A VI (V) 3 Fig 8. VCC = 3.0 V; IO = 0 A 74AHC1GU04_5 Product data sheet 2 © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 5 of 12 74AHC1GU04 NXP Semiconductors Inverter mna399 6 50 VO (V) ICC (mA) 40 VO Rbias = 560 kΩ VCC 30 3 0.47 µF 20 input output 100 µF VI (f = 1 kHz) ID (drain current) 10 A IO GND mna050 0 0 0 2 4 VI (V) 6 Fig 9. VCC = 5.5 V; IO = 0 A Fig 10. Test set-up for measuring forward transconductance gfs = ∆IO/∆VI at VO is constant mna400 40 gfs (mA/V) 30 20 10 0 0 2 4 VCC (V) 6 Fig 11. Typical forward transconductance gfs as a function of the supply voltage at Tamb = 25 °C 14. Application information Some applications are: • Linear amplifier (see Figure 12) • In crystal oscillator design (see Figure 13) Remark: All values given are typical unless otherwise specified. 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 6 of 12 74AHC1GU04 NXP Semiconductors Inverter R2 R1 VCC 1 µF R2 R1 U04 U04 C1 ZL C2 out mna052 mna053 Maximum Vo(p-p) = VCC − 1.5 V centered at 0.5 × VCC. C1 = 47 pF (typ.) G ol G v = – --------------------------------------R1 1 + ------- ( 1 + G ol ) R2 R1 = 1 MΩ to 10 MΩ (typ.) C2 = 22 pF (typ.) R2 optimum value depends on the frequency and required stability against changes in VCC or average minimum ICC (ICC is typically 2 mA at VCC = 3 V and f = 1 MHz). Gol = open loop gain Gv = voltage gain R1 ≥ 3 kΩ, R2 ≤ 1 MΩ ZL > 10 kΩ; Gol = 20 (typ.) Typical unity gain bandwidth product is 5 MHz. Fig 12. Used as a linear amplifier Fig 13. Crystal oscillator configuration Table 9. External components for resonator (f < 1 MHz) All values given are typical and must be used as an initial set-up. Frequency R1 R2 C1 C2 10 kHz to 15.9 kHz 22 MΩ 220 kΩ 56 pF 20 pF 16 kHz to 24.9 kHz 22 MΩ 220 kΩ 56 pF 10 pF 25 kHz to 54.9 kHz 22 MΩ 100 kΩ 56 pF 10 pF 55 kHz to 129.9 kHz 22 MΩ 100 kΩ 47 pF 5 pF 130 kHz to 199.9 kHz 22 MΩ 47 kΩ 47 pF 5 pF 200 kHz to 349.9 kHz 22 MΩ 47 kΩ 47 pF 5 pF 350 kHz to 600 kHz 22 MΩ 47 kΩ 47 pF 5 pF Table 10. Optimum value for R2 Frequency R2 Optimum for 3 kHz 2.0 kΩ minimum required ICC 8.0 kΩ minimum influence due to change in VCC 1.0 kΩ minimum required ICC 6 kHz 10 kHz 14 kHz >14 kHz 4.7 kΩ minimum influence by VCC 0.5 kΩ minimum required ICC 2.0 kΩ minimum influence by VCC 0.5 kΩ minimum required ICC 1.0 kΩ minimum influence by VCC - replace R2 by C3 with a typical value of 35 pF 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 7 of 12 74AHC1GU04 NXP Semiconductors Inverter 15. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 14. Package outline SOT353-1 (TSSOP5) 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 8 of 12 74AHC1GU04 NXP Semiconductors Inverter Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 15. Package outline SOT753 (SC-74A) 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 9 of 12 74AHC1GU04 NXP Semiconductors Inverter 16. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 17. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC1GU04_5 20070710 Product data sheet - 74AHC1GU04_4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • Legal texts have been adapted to the new company name where appropriate. Package SOT353 changed to SOT353-1 in Section 3 and Section 15. Quick reference data and Soldering sections removed. 74AHC1GU04_4 20020528 Product specification - 74AHC1GU04_3 74AHC1GU04_3 20020215 Product specification - 74AHC1GU04_2 74AHC1GU04_2 20010427 Product specification - 74AHC1GU04_1 74AHC1GU04_1 19990519 Product specification - - 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 10 of 12 74AHC1GU04 NXP Semiconductors Inverter 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 74AHC1GU04_5 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 05 — 10 July 2007 11 of 12 74AHC1GU04 NXP Semiconductors Inverter 20. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 3 Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical transfer characteristics . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 10 July 2007 Document identifier: 74AHC1GU04_5