PHILIPS 74AUP2G07GF

74AUP2G07
Low-power dual buffer with open-drain output
Rev. 04 — 11 June 2009
Product data sheet
1. General description
The 74AUP2G07 provides two non-inverting buffers with open-drain output. The output of
the device is an open drain and can be connected to other open-drain outputs to
implement active-LOW wired-OR or active-HIGH wired-AND functions.
Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features
n Wide supply voltage range from 0.8 V to 3.6 V
n High noise immunity
n Complies with JEDEC standards:
u JESD8-12 (0.8 V to 1.3 V)
u JESD8-11 (0.9 V to 1.65 V)
u JESD8-7 (1.2 V to 1.95 V)
u JESD8-5 (1.8 V to 2.7 V)
u JESD8-B (2.7 V to 3.6 V)
n ESD protection:
u HBM JESD22-A114E Class 3A exceeds 5000 V
u MM JESD22-A115-A exceeds 200 V
u CDM JESD22-C101C exceeds 1000 V
n Low static-power consumption; ICC = 0.9 µA (maximum)
n Latch-up performance exceeds 100 mA per JESD 78 Class II
n Inputs accept voltages up to 3.6 V
n Low noise overshoot and undershoot < 10 % of VCC
n IOFF circuitry provides partial Power-down mode operation
n Multiple package options
n Specified from −40 °C to +85 °C and −40 °C to +125 °C
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74AUP2G07GW
−40 °C to +125 °C
SC-88
plastic surface-mounted package; 6 leads
SOT363
74AUP2G07GM
−40 °C to +125 °C
XSON6
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1 × 1.45 × 0.5 mm
74AUP2G07GF
−40 °C to +125 °C
XSON6
plastic extremely thin small outline package; no leads; SOT891
6 terminals; body 1 × 1 × 0.5 mm
4. Marking
Table 2.
Marking
Type number
Marking code[1]
74AUP2G07GW
p7
74AUP2G07GM
p7
74AUP2G07GF
p7
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
1
1A
1Y
6
3
2A
2Y
4
1A
1
6
1Y
Y
2A
3
4
2Y
A
GND
mnb092
Fig 1. Logic symbol
mnb093
Fig 2. IEC logic symbol
74AUP2G07_4
Product data sheet
mna625
Fig 3. Logic diagram (one gate)
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
2 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
6. Pinning information
6.1 Pinning
74AUP2G07
74AUP2G07
1A
1
6
1A
1
6
1Y
GND
2
5
VCC
1Y
GND
2
5
VCC
2A
3
4
2Y
2A
3
4
2Y
001aad707
Transparent top view
001aad706
Fig 4. Pin configuration SOT363-1
(SC-88)
Fig 5. Pin configuration SOT886
(XSON6)
74AUP2G07
1A
1
6
1Y
GND
2
5
VCC
2A
3
4
2Y
001aad665
Transparent top view
Fig 6. Pin configuration SOT891
(XSON6)
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
1A
1
data input
GND
2
ground (0 V)
2A
3
data input
2Y
4
data output
VCC
5
supply voltage
1Y
6
data output
7. Functional description
Table 4.
Function table[1]
Input
Output
nA
nY
L
L
H
Z
[1]
H = HIGH voltage level;
L = LOW voltage level;
Z = high-impedance OFF state.
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
3 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
Conditions
VI < 0 V
[1]
VO < 0 V
VO
output voltage
Active mode and Power-down mode
VO = 0 V to VCC
[1]
Min
Max
Unit
−0.5
+4.6
V
−50
-
mA
−0.5
+4.6
V
−50
-
mA
−0.5
+4.6
V
IO
output current
-
20
mA
ICC
supply current
-
50
mA
IGND
ground current
−50
-
mA
Tstg
storage temperature
−65
+150
°C
-
250
mW
total power dissipation
Ptot
Tamb = −40 °C to +125 °C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For SC-88 package: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Symbol
Parameter
Conditions
VCC
supply voltage
VI
input voltage
VO
output voltage
Tamb
ambient temperature
∆t/∆V
input transition rise and fall rate
Active mode and Power-down mode
VCC = 0.8 V to 3.6 V
Min
Max
Unit
0.8
3.6
V
0
3.6
V
0
3.6
V
−40
+125
°C
0
200
ns/V
Typ
Max
Unit
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
VCC = 0.8 V
0.70 × VCC -
-
V
VCC = 0.9 V to 1.95 V
0.65 × VCC -
-
V
Tamb = 25 °C
VIH
VIL
HIGH-level input voltage
LOW-level input voltage
VCC = 2.3 V to 2.7 V
1.6
-
-
V
VCC = 3.0 V to 3.6 V
2.0
-
-
V
VCC = 0.8 V
-
-
0.30 × VCC V
VCC = 0.9 V to 1.95 V
-
-
0.35 × VCC V
VCC = 2.3 V to 2.7 V
-
-
0.7
V
VCC = 3.0 V to 3.6 V
-
-
0.9
V
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
4 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
VOL
VI = VIH or VIL
LOW-level output voltage
Min
Typ
Max
Unit
IO = 20 µA; VCC = 0.8 V to 3.6 V
-
-
0.1
V
IO = 1.1 mA; VCC = 1.1 V
-
-
0.3 × VCC
V
IO = 1.7 mA; VCC = 1.4 V
-
-
0.31
V
IO = 1.9 mA; VCC = 1.65 V
-
-
0.31
V
IO = 2.3 mA; VCC = 2.3 V
-
-
0.31
V
IO = 3.1 mA; VCC = 2.3 V
-
-
0.44
V
IO = 2.7 mA; VCC = 3.0 V
-
-
0.31
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.44
V
II
input leakage current
VI = GND to 3.6 V; VCC = 0 V to 3.6 V
-
-
±0.1
µA
IOZ
OFF-state output current
VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V
to 3.6 V
-
-
±0.1
µA
IOFF
power-off leakage current
VI or VO = 0 V to 3.6 V; VCC = 0 V
-
-
±0.2
µA
∆IOFF
additional power-off
leakage current
VI or VO = 0 V to 3.6 V;
VCC = 0 V to 0.2 V
-
-
±0.2
µA
ICC
supply current
VI = GND or VCC; IO = 0 A;
VCC = 0.8 V to 3.6 V
-
-
0.5
µA
∆ICC
additional supply current
VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V
-
-
40
µA
CI
input capacitance
VCC = 0 V to 3.6 V; VI = GND or VCC
-
0.7
-
pF
CO
output capacitance
VO = GND; VCC = 0 V
-
0.9
-
pF
VCC = 0.8 V
0.70 × VCC -
-
V
VCC = 0.9 V to 1.95 V
0.65 × VCC -
-
V
VCC = 2.3 V to 2.7 V
1.6
-
-
V
VCC = 3.0 V to 3.6 V
2.0
-
-
V
VCC = 0.8 V
-
-
0.30 × VCC V
VCC = 0.9 V to 1.95 V
-
-
0.35 × VCC V
VCC = 2.3 V to 2.7 V
-
-
0.7
V
VCC = 3.0 V to 3.6 V
-
-
0.9
V
Tamb = −40 °C to +85 °C
VIH
VIL
VOL
HIGH-level input voltage
LOW-level input voltage
LOW-level output voltage
VI = VIH or VIL
IO = 20 µA; VCC = 0.8 V to 3.6 V
-
-
0.1
V
IO = 1.1 mA; VCC = 1.1 V
-
-
0.3 × VCC
V
IO = 1.7 mA; VCC = 1.4 V
-
-
0.37
V
IO = 1.9 mA; VCC = 1.65 V
-
-
0.35
V
IO = 2.3 mA; VCC = 2.3 V
-
-
0.33
V
IO = 3.1 mA; VCC = 2.3 V
-
-
0.45
V
IO = 2.7 mA; VCC = 3.0 V
-
-
0.33
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.45
V
II
input leakage current
VI = GND to 3.6 V; VCC = 0 V to 3.6 V
-
-
±0.5
µA
IOZ
OFF-state output current
VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V
to 3.6 V
-
-
±0.5
µA
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
5 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
IOFF
power-off leakage current
VI or VO = 0 V to 3.6 V; VCC = 0 V
-
-
±0.5
µA
∆IOFF
additional power-off
leakage current
VI or VO = 0 V to 3.6 V;
VCC = 0 V to 0.2 V
-
-
±0.6
µA
ICC
supply current
VI = GND or VCC; IO = 0 A;
VCC = 0.8 V to 3.6 V
-
-
0.9
µA
∆ICC
additional supply current
VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V
-
-
50
µA
VCC = 0.8 V
0.75 × VCC -
-
V
VCC = 0.9 V to 1.95 V
0.70 × VCC -
-
V
VCC = 2.3 V to 2.7 V
1.6
-
V
V
Tamb = −40 °C to +125 °C
VIH
VIL
VOL
HIGH-level input voltage
LOW-level input voltage
LOW-level output voltage
-
VCC = 3.0 V to 3.6 V
2.0
-
-
VCC = 0.8 V
-
-
0.25 × VCC V
VCC = 0.9 V to 1.95 V
-
-
0.30 × VCC V
VCC = 2.3 V to 2.7 V
-
-
0.7
V
VCC = 3.0 V to 3.6 V
-
-
0.9
V
IO = 20 µA; VCC = 0.8 V to 3.6 V
-
-
0.11
V
IO = 1.1 mA; VCC = 1.1 V
-
-
0.33 × VCC V
VI = VIH or VIL
IO = 1.7 mA; VCC = 1.4 V
-
-
0.41
V
IO = 1.9 mA; VCC = 1.65 V
-
-
0.39
V
IO = 2.3 mA; VCC = 2.3 V
-
-
0.36
V
IO = 3.1 mA; VCC = 2.3 V
-
-
0.50
V
IO = 2.7 mA; VCC = 3.0 V
-
-
0.36
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.50
V
II
input leakage current
VI = GND to 3.6 V; VCC = 0 V to 3.6 V
-
-
±0.75
µA
IOZ
OFF-state output current
VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V
to 3.6 V
-
-
±0.75
µA
IOFF
power-off leakage current
VI or VO = 0 V to 3.6 V; VCC = 0 V
-
-
±0.75
µA
∆IOFF
additional power-off
leakage current
VI or VO = 0 V to 3.6 V;
VCC = 0 V to 0.2 V
-
-
±0.75
µA
ICC
supply current
VI = GND or VCC; IO = 0 A;
VCC = 0.8 V to 3.6 V
-
-
1.4
µA
∆ICC
additional supply current
VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V
-
-
75
µA
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
6 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8.
Symbol Parameter
25 °C
Conditions
−40 °C to +125 °C
Unit
Min
Typ[1]
Max
Min
Max
(85 °C)
Max
(125 °C)
-
11.6
-
-
-
-
VCC = 1.1 V to 1.3 V
2.1
4.1
7.5
1.7
9.1
10.0
ns
VCC = 1.4 V to 1.6 V
1.6
3.0
5.1
1.3
6.1
6.7
ns
VCC = 1.65 V to 1.95 V
1.6
2.7
4.0
1.2
5.0
5.5
ns
VCC = 2.3 V to 2.7 V
1.1
2.1
3.2
0.9
4.0
4.4
ns
VCC = 3.0 V to 3.6 V
1.4
2.2
2.8
1.1
3.3
3.6
ns
-
14.7
-
-
-
-
ns
VCC = 1.1 V to 1.3 V
3.0
5.1
9.0
2.4
11.2
12.3
ns
VCC = 1.4 V to 1.6 V
2.3
3.8
6.1
2.0
7.4
8.1
ns
VCC = 1.65 V to 1.95 V
2.4
3.6
4.8
1.8
6.1
6.7
ns
VCC = 2.3 V to 2.7 V
1.7
2.8
3.8
1.3
4.8
5.3
ns
VCC = 3.0 V to 3.6 V
2.2
3.1
4.2
1.6
4.5
5.0
ns
-
17.7
-
-
-
-
ns
VCC = 1.1 V to 1.3 V
3.5
6.1
10.4
3.2
13.1
14.5
ns
VCC = 1.4 V to 1.6 V
3.0
4.5
6.8
2.6
8.6
9.4
ns
VCC = 1.65 V to 1.95 V
2.8
4.4
6.7
2.2
7.8
8.6
ns
VCC = 2.3 V to 2.7 V
2.4
3.4
4.5
1.9
5.3
5.8
ns
VCC = 3.0 V to 3.6 V
2.2
4.0
5.7
1.9
6.1
6.7
ns
-
26.7
-
-
-
-
ns
VCC = 1.1 V to 1.3 V
4.8
9.0
15.6
4.3
18.8
20.7
ns
VCC = 1.4 V to 1.6 V
4.1
6.7
9.4
3.7
11.8
13.0
ns
VCC = 1.65 V to 1.95 V
3.8
6.8
9.7
3.2
11.0
12.1
ns
VCC = 2.3 V to 2.7 V
3.7
5.2
6.7
3.0
7.1
7.8
ns
VCC = 3.0 V to 3.6 V
3.6
6.4
9.7
2.8
10.4
11.4
ns
CL = 5 pF
tpd
propagation delay nA to nY; see Figure 7
[2]
VCC = 0.8 V
ns
CL = 10 pF
tpd
propagation delay nA to nY; see Figure 7
[2]
VCC = 0.8 V
CL = 15 pF
tpd
propagation delay nA to nY; see Figure 7
[2]
VCC = 0.8 V
CL = 30 pF
tpd
propagation delay nA to nY; see Figure 7
VCC = 0.8 V
[2]
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
7 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
Table 8.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8.
Symbol Parameter
25 °C
Conditions
−40 °C to +125 °C
Unit
Min
Typ[1]
Max
Min
Max
(85 °C)
Max
(125 °C)
VCC = 0.8 V
-
0.5
-
-
-
-
pF
VCC = 1.1 V to 1.3 V
-
0.6
-
-
-
-
pF
CL = 5 pF, 10 pF, 15 pF and 30 pF
power dissipation
capacitance
CPD
fi = 1 MHz; VI = GND to VCC
[3][4]
VCC = 1.4 V to 1.6 V
-
0.6
-
-
-
-
pF
VCC = 1.65 V to 1.95 V
-
0.7
-
-
-
-
pF
VCC = 2.3 V to 2.7 V
-
0.9
-
-
-
-
pF
VCC = 3.0 V to 3.6 V
-
1.2
-
-
-
-
pF
[1]
All typical values are measured at nominal VCC.
[2]
tpd is the same as tPZL and tPLZ.
[3]
All specified values are the average typical values over all stated loads.
[4]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N where:
fi = input frequency in MHz;
VCC = supply voltage in V;
N = number of inputs switching.
12. Waveforms
VI
VM
nA input
VM
GND
t PLZ
t PZL
VCC
nY output
VM
VOL
VX
mna528
Measurement points are given in Table 9.
Logic level: VOL is the typical output voltage drops that occur with the output load.
Fig 7. The data input (nA) to output (nY) propagation delays
Table 9.
Measurement points
Supply voltage
Input
Output
VCC
VM
VM
VX
0.8 V to 1.6 V
0.5 × VCC
0.5 × VCC
VOL + 0.1 V
1.65 V to 2.7 V
0.5 × VCC
0.5 × VCC
VOL + 0.15 V
3.0 V to 3.6 V
0.5 × VCC
0.5 × VCC
VOL + 0.3 V
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
8 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
VCC
VEXT
5 kΩ
G
VI
VO
DUT
RT
CL
RL
001aac521
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 8. Load circuitry for switching times
Table 10.
Test data
Supply voltage Input
Load
VEXT
VCC
VI
tr, tf
CL
0.8 V to 3.6 V
VCC
≤ 3 ns
5 pF, 10 pF,
5 kΩ or 1 MΩ
15 pF and 30 pF
[1]
RL
[1]
tPLH, tPHL
tPZH, tPHZ
tPZL, tPLZ
open
GND
2 × VCC
For measuring enable and disable times RL = 5 kΩ, for measuring propagation delays, set-up and hold times and pulse width
RL = 1 MΩ.
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
9 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
13. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
SOT363
JEDEC
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Fig 9. Package outline SOT363 (SC-88)
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
10 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4×
(2)
L
L1
e
6
5
e1
4
e1
6×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
1.5
1.4
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
OUTLINE
VERSION
SOT886
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-07-15
04-07-22
MO-252
Fig 10. Package outline SOT886 (XSON6)
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
11 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm
1
SOT891
b
3
2
4×
(1)
L
L1
e
6
5
e1
4
e1
6×
A
(1)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.20
0.12
1.05
0.95
1.05
0.95
0.55
0.35
0.35
0.27
0.40
0.32
Note
1. Can be visible in some manufacturing processes.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-04-06
07-05-15
SOT891
Fig 11. Package outline SOT891 (XSON6)
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
12 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74AUP2G07_4
20090611
Product data sheet
-
74AUP2G07_3
Modifications:
•
•
Table 5: Derating factor XSON6 has been changed.
Table 8: CPD formula has been changed.
74AUP2G07_3
20071016
Product data sheet
-
74AUP2G07_2
74AUP2G07_2
20070612
Product data sheet
-
74AUP2G07_1
74AUP2G07_1
20061121
Product data sheet
-
-
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
13 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74AUP2G07_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 June 2009
14 of 15
74AUP2G07
NXP Semiconductors
Low-power dual buffer with open-drain output
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 June 2009
Document identifier: 74AUP2G07_4