HT2 MOA3 S20 TM HITAG 2 Chip Module Preliminary Specification Revision 1.1 August 1997 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 Table of Contents 1 Definitions .............................................................................................................................. 3 1.1 Objective of the Specifications ..................................................................................................................... 3 1.2 Definition of the Chip Module ..................................................................................................................... 3 1.3 Use of the Modules ...................................................................................................................................... 3 2 Specifications ......................................................................................................................... 4 2.1 Mechanical Properties ................................................................................................................................. 4 2.2 Materials ..................................................................................................................................................... 4 2.3 Temperature Range ..................................................................................................................................... 4 2.4 Storage Conditions ...................................................................................................................................... 5 2.5 Delivery Conditions..................................................................................................................................... 5 2.6 Electrical Specifications............................................................................................................................... 6 3 Drawing of the Chip Module HT2 MOA3 S20..................................................................... 7 3.1 Drawing of the Reel..................................................................................................................................... 7 3.2 Module outline suggestion ........................................................................................................................... 8 3.3 Splicing Specification .................................................................................................................................. 9 4 Coil Specifications................................................................................................................ 10 5 Functional Description of HITAG 2 ................................................................................... 12 5.1 Memory Organization................................................................................................................................ 12 5.2 Operation Modes and Configuration .......................................................................................................... 13 5.2.1 Modes of Operation............................................................................................................................ 13 5.2.2 Status Flow ........................................................................................................................................ 14 5.2.3 Configuration..................................................................................................................................... 15 5.3 Configuration of Delivered HITAG 2 Transponders................................................................................... 16 5.4 Definition of Passwords and Keys .............................................................................................................. 17 6 Quality Inspection ............................................................................................................... 18 7 Characterisation and Test of the Final Transponder......................................................... 19 7.1 Characterisation of the Transponder .......................................................................................................... 19 7.2 Final Test of the Transponder .................................................................................................................... 19 8 Ordering Information.......................................................................................................... 20 HITAGTM is a trademark of Philips Electronics N.V. Ht2moa3.doc/HS Page 2 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 1 Definitions 1.1 Objective of the Specifications This specification lists the parameters to be fulfilled by the HITAG 2 chip module HT2 MOA3 S20 for contactless smart cards or similar transponders (as e.g. discs). 1.2 Definition of the Chip Module A chip module is an electronically packaged chip covered with a globe top cap. The HT2 MOA3 S20 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1. So the HITAG 2 chip module HT2 MOA3 S20 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 2 chip module. 1.3 Use of the Modules The HITAG 2 modules are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification. For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body. Ht2moa3.doc/HS Page 3 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 2 Specifications 2.1 Mechanical Properties Width 7.55 mm (Proposed Punching Outline) Length 11.75 mm (Proposed Punching Outline) Overall Thickness 0.45 mm ± 0.03 mm Film Thickness 0.16 mm ± 0.005 mm Bondpad Size for Transponder Coil / Module Interconnection 1.9 x 3.5 mm see also drawing in chapter 3 Suitable for Welding/Soldering/ Conductive Gluing 2.2 Materials Tape 110 µm Glass epoxy Copper Plating 35 µm ED copper Bond Plating Ni / Au Suitable for Al and Au wire bonding Backside Plating Ni / Au Glob Top Filled Epoxy Thermal curing 2.3 Temperature Range Operating -25°C to +85°C For packed transponder, depending on type of package Processing 150°C for 30 minutes at a standard lamination pressure for contactless smart card plastic materials (e.g. PVC, PET, ...) Welding Parameters max. 25 ms @ 500 °C on bond pads Soldering Parameters max. 3 s @ 390 °C on bond pads Ht2moa3.doc/HS Page 4 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 2.4 Storage Conditions Temperature 15 - 30 °C Relative Humidity 40 - 70 % Duration 1 year 2.5 Delivery Conditions Delivery Identification Date of ready for shipment, reel numbers, total quantity of good modules with the detail of good modules per reel, order number, product type, no supplier identification on reels, bags and boxes. Types of Delivery Chip modules on reel approx. 15.000 to 20.000 pcs. per reel, tape width super 35 mm, pitch 9,5 mm, 2 rows single chip modules (bulk goods) 500 pcs . per bag According to documentation "Packing Method Modules (reel)" Order-No. 3322 845 04881 Packing and Transport "Packing Method Modules (singulated)" Bad Module Marking All bad modules (mechanical and electrical faults) must be punched by reject hole for customer see drawings chapter 3 Bad positions (reel): <20% Splicing Specifications Tape material: adhes. tape 15,5 +/- 0,7 mm, thermal resistance at <190°C by < 100 cN tractive power and < 30 sec. duration. Labeling Identification label on the reel and on carton bag: - Product type - Number of the reel - Total number of positions - Number of good positions - Date of sealing (to be checked) - Two batches per reel only - Batch number indication (only coded, to be checked) Ht2moa3.doc/HS Page 5 of 22 see drawings chapter 3 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 2.6 Electrical Specifications Symbol min Junction Temperature TJ -55°C Input Peak Current IINpeak typ max Comment / Conditions Absolute Maximum Ratings 140°C 30 mA Latch up Current 100 mA MIL-STD 883D, Method 3023 ESD 2 kV MIL-STD 883D, Method 3015.7, Human Body Operating Range Temperature TA Input Read Only Threshold 1) Voltage 3) VIN,RO 1) 3) 85°C RThJunctionAmbient ≤ 30 K/W @ IINpeak = 30 mA 2,8 Vp 3,9 Vp start modulation in read only modes -40°C VIN,TH 3,1 Vp 4,2 Vp start modulation after SETCC Input Read Voltage 1) 3) VIN,RD 3,5 Vp 4,5 Vp read E²PROM Input Write Voltage 1) 3) VIN,WR 3,7 Vp 4,7 Vp write E²PROM 4,0 Vp VINHigh - VINLow @ VINHigh = 5,0 Vp 2) T0=8 µs, TMOD=6*T0 RMODL 4,5 kΩ VINLow ≤ 2,0 Vp RMODNL 3,6 kΩ VINLow ≥ 2,0 Vp 231 pF VIN = 4,0 Vp Input Threshold Voltage Demodulator Range 3) VDEM_R 2,0 Vp Modulator R_MOD linear 3) R_MOD nonlinear 3) Resonance Capacitor 3) CResInit 189 pF 210 pF EEPROM Write Current Read Current 4) IW 25 µA VDD = 2,8 V 4) IR 9 µA VDD = 2,8 V Data Retention Years 10 Write Endurance Cycles 100.000 1) VIN = VIN1 − VIN2 ... voltage between connection pads 2) VINHigh VINLow TMOD 3) @ Ri = 10 kΩ resistance of measurement equipment 4) tested on silicon level Ht2moa3.doc/HS input voltage before modulation input voltage during modulation duration of the modulation Page 6 of 22 @ 55°C Specifications of the HT2 MOA3 S20 Rev. 1.1 3 Drawing of the Chip Module HT2 MOA3 S20 3.1 Drawing of the Reel Ht2moa3.doc/HS Page 7 of 22 1997-08-19 Specifications of the HT2 MOA3 S20 Rev. 1.1 3.2 Module outline suggestion Ht2moa3.doc/HS Page 8 of 22 1997-08-19 Specifications of the HT2 MOA3 S20 Rev. 1.1 3.3 Splicing Specification Ht2moa3.doc/HS Page 9 of 22 1997-08-19 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 4 Coil Specifications The HITAG 2 chip module has to be connected to a coil whose parameters are briefly described in the following. Equivalent circuit of the transponder Xpc Rpc Cp Cchip Uc Rchip Uc ... voltage at the connection pads fres ... resonant frequency of the transponder Xpc ... parallel reactance of the coil (f = 125 kHz) Rpc ... parallel resistance of the coil (f = 125 kHz) Cp ... parasitic capacitance of the package Cchip ... capacitance of the chip (Uc > 4 Vpp) Rchip ... resistance of the chip fresc ... self resonant frequency of the coil Lpc = Xpc/2πf (f = 125 kHz) Lpc = 7.72 mH ± x % (Cp = 0, x depends on the coil production process) Cchip = 210 pF ± 10 % Rpc > 45 k fresc > 750 kHz Note: The parasitic capacitance of the package (Cp) must be considered. fres = 1 1 = 125 kHz ⇒ L pc = 2 2π (Cchip + Cp).Lpc (2πfres ) Cchip + C p Typical values for Cp hot laminated cards: moulded tags: Ht2moa3.doc/HS ( Cp = 1.5 pF Cp = 6.0 pF Page 10 of 22 ) Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 For a rough estimation ( ± 10 %) of the number of coil windings following formula can be used. It is assumed that the winding is done in circular form. N = N L U d u L 1 ,8 5 2 U ln ( u ) d ... number of windings ... inductance [nH] ... average coil circumference [cm] ... copper diameter [mm] ... average coil circumference [mm] For fine tuning a measurement of the inductance and an according adjustment of the number of windings is necessary. This process always needs some iterations. Ht2moa3.doc/HS Page 11 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5 Functional Description of HITAG 2 5.1 Memory Organization The memory of the transponder consists of 256 bits EEPROM memory and is organized in 8 pages with 32 bits each. Depending on the operation mode the EEPROM is organized as described in the following. Crypto Mode: Page 0 1 2 3 4 5 6 7 Content Serial Number 32 bit "KEY LOW" 16 bit " KEY HIGH", 16 bit reserved 8 bit Configuration, 24 Bit Password TAG read/write page read/write page read/write page read/write page Password Mode: Page 0 1 2 3 4 5 6 7 Ht2moa3.doc/HS Content Serial Number Password RWD reserved 8 bit Configuration, 24 bit Password TAG read/write page read/write page read/write page read/write page Page 12 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5.2 Operation Modes and Configuration With the Configuration Byte the operation mode and the access rights to the memory can be selected. During Power-Up of the transponder the Configuration Byte is read from the transponder’s EEPROM. If you change the configuration, keys or passwords, you have to place the transponder directly on the antenna or hold it directly to it (0-distance)! In order to avoid any errors do not move the transponder during this write process and be sure that you are in a safe environment without electrical noise. 5.2.1 Modes of Operation The HITAG 2 can be operated in several modes. Crypto Mode: Mode for writing or reading the transponder with encrypted data transmission. Password Mode: Mode for writing or reading the transponder with plain data transmission. A password check is performed. Public Mode A (Manchester): Read only mode emulating Philips Semiconductors´ MIRO transponders resp. µEM H400x transponders. The 64 bits of the user Pages 4 and 5 are cyclically transmitted to the read/write device. Public Mode B (Biphase): Read only mode according to ISO standards 11784 and 11785 for animal identification. The 128 bits of the user Pages 4 to 7 are cyclically transmitted to the read/write device. Public Mode C (Biphase): Read only mode emulating the read operation of the PCF793X (with a slightly different Program Mode Check). In the Public Mode C the 128 bits of the user Pages 4 to 7 are cyclically transmitted to the read/write device. Ht2moa3.doc/HS Page 13 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5.2.2 Status Flow After entering the RF-field the transponder waits for a command to start the authentication. After issuing this command the mutual authentication takes place, followed by read- and write commands. In password mode the data transfer occurs plain, in crypto mode data are encrypted. The halt mode can be entered for muting a transponder. If the transponder is configured in one of the public modes, these modes are entered automatically after a certain waiting time and data pages are sent cyclically to the read/write device. By issuing the command to start the authentication during the waiting time also public mode transponders can be brought into the authorized state. Ht2moa3.doc/HS Page 14 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5.2.3 Configuration The Configuration Byte is represented by the first 8 bits of Page 3 of the transponder memory. Configuration Byte: 7 6 5 4 3 2 1 0 0: Manchester Code 1: Biphase Code Bit 2 Bit 1 Version 0 Coding 0 Coding in HITAG 2-Operation depending on bit 0 Public Mode biphase B 0 1 Public Mode manchester depending on bit 0 A 1 0 Public Mode C biphase depending on bit 0 1 1 HITAG 2 depending on bit 0 depending on bit 0 0: password mode 1: crypto mode 0: PAGE 6 and 7 read/write 1: PAGE 6 and 7 read only 0: PAGE 4 and 5 read/write 1: PAGE 4 and 5 read only THE SETTING OF THIS BIT IS OTP ! 0: PAGE 3 read/write 1: PAGE 3 read only; Configuration Byte and Password TAG fixed THE SETTING OF THIS BIT IS OTP ! 0: PAGE 1 and 2 read/write 1: PAGE 1 no read/no write PAGE 2 read only (when transponder is in password mode) PAGE 2 no read/no write (when transponder is in crypto mode) Configuration Byte / Bit 6: Bit 6 = ‘0’: Page 3 is read/write. Bit 6 = ‘1’: Page 3 can only be read. This process is irreversible ! ATTENTION: Do not set Bit 6 of the Configuration Byte to ‘1’ before having written the final data into Page 3 (including the Configuration Byte and Password TAG) of the transponder. Configuration Byte / Bit 7: Bit 7 = ‘0’: Pages 1 and 2 are read/write. Bit 7 = ‘1’: Pages 1 and 2 are locked against writing. This process is irreversible ! ATTENTION: Do not set Bit 7 of the Configuration Byte to ‘1’ before having written the final data into Pages 1 and 2 of the transponder. Ht2moa3.doc/HS Page 15 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 Standard values for the Configuration Byte: Password Mode: Crypto Mode: Public Mode A: Public Mode B: Public Mode C: 0x06 0x0E 0x02 0x00 0x04 5.3 Configuration of Delivered HITAG 2 Transponders HITAG 2 transponders are delivered with the following configuration by Philips Semiconductors: Unique Serial Number: Serial Number: Read Only Configuration Byte: 0x06: Password Mode (Manchester Code) Page 6 and 7 read/write Page 4 and 5 read/write Page 3 read/write Page 1 and 2 read/write - fixed - can be changed can be changed can be changed can be changed can be changed Values for Transport Passwords, Transport Keys: Password RWD: 0x4D494B52 (= ″MIKR″) Password TAG: 0xAA4854 Key Low: 0x4D494B52 (= ″MIKR″) Key High: 0x4F4E (= ″ON″) RECOMMENDATION: Before delivering transponders to end users, Pages 1 to 3 should be locked (set Configuration Byte / Bit 6 to ‘1’ for Page 3 and set Configuration Byte / Bit 7 to ‘1’ for Pages 1 and 2). Ht2moa3.doc/HS Page 16 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5.4 Definition of Passwords and Keys Keys are cryptographic codes, which determine data encryption during data transfer between read/write device and transponder. They are used to select a HITAG 2 transponder in Crypto Mode. The 16 bit KEY HIGH and 32 bit KEY LOW form one 48 bit key which has to be identical on both the transponder and the read/write device. Passwords are needed to select a HITAG 2 transponder in Password Mode. There is one pair of passwords (Password TAG, Password RWD) which has to be identical both on the transponder and the read/write device. Password TAG: Password that the transponder sends to the read/write device and which may be verified by the latter (depending on the configuration of the read/write device). Password RWD: Password that the read/write device sends to the transponder and which is checked for identity by the latter. It is important that the following values are in accordance with each other, i.e. the respective data on the read/write device and on the transponder have to be identical pairs. HITAG 2 in Password mode: on the on the read/write transponder device Password RWD ⇔ Password RWD as an option (depending on the configuration of the read/write device): Password TAG ⇔ Password TAG HITAG 2 in Crypto mode: on the read/write device KEY LOW KEY HIGH on the transponder ⇔ ⇔ KEY LOW KEY HIGH as an option (depending on the configuration of the read/write device): Password TAG ⇔ Password TAG The passwords and keys are predefined by Philips Semiconductors by means of defined Transport Passwords and a Transport Key. They can be written to, which means that they can be changed (see also Chapter “Configuration of Delivered HITAG 2 Transponders“). ATTENTION: Passwords and Keys only can be changed if their current values are known! Ht2moa3.doc/HS Page 17 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 6 Quality Inspection Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with AQL1.0. Optical Properties scratches, according to the reference sample encapsulation failures, catalogue gold discolouration, delamination Geometrical Properies width Electrical Properties measured with gauge length measured with gauge overall thickness measured with micrometer at the center of the transfer mould cap operation basic read/write operations Shipment Quantity Packing and Labeling Ht2moa3.doc/HS Page 18 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 7 Characterisation and Test of the Final Transponder 7.1 Characterisation of the Transponder The parameters recommended to be characterised for the transponder are: Parameter Comment Resonant frequency fres Transponder does not modulate Resonant frequency @ Tamb = 22°C, @ BTH Threshold value BTH Start of modulation Threshold value for READ BRD Command READ_PAGE OK Threshold value for WRITE BWR Command WRITE_PAGE OK For the measurement of these parameters we recommend to use the test equipment available from SCEMTEC, Marienheide-Rodt, Germany (Transponder Measurement System STM-1). This device also supports functional testing (besides parameter testing). Therefore it can also be used as production test equipment for the final transponder test. For further information please contact Scemtec GmbH. 7.2 Final Test of the Transponder In addition to the equipment described in the previous chapter Philips Semiconductors offers a device for a final functional test of transponders, the HITAGTM Test System HT OT490. Parameter tests are not supportet by this device. Basic flow for production and test: 1. Assembly of transponders 2. Functional test and final test of the EEPROM Since the Keys and Logdata are changed during final test the Configuration and personalization must take place after the final test. The final test is disabled (not reversible) by setting the Tag-test mode bit to 0. For the final test of transponders we recommend to use the HITAGTM Test System HT OT490 of Philips Semiconductors or the Transponder Measurement System STM-1 of Scemtec. Ht2moa3.doc/HS Page 19 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 8 Ordering Information Type Name Description Ordering Number HT2 MOA3 S20/E/3 HITAG 2 S20 Chip Module, reel 9352 600 62118 HT2 MOA3 S20/E/1 HITAG 2 S20 Chip Module, bulk 9352 602 19122 Ht2moa3.doc/HS Page 20 of 22 Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 Definitions Data sheet status Objective specification This data sheet conta ins ta rget o r goal spec ifications for product deve lopment. Preliminary specification This data sheet conta ins p reliminary data; supp lementary data may be pub lished later. Product spec ification This data sheet conta ins final product spec ifications. Limiting values Limiting va lues g iven are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134). Stress above one o r more of the limiting va lues may cause pe rmanent da mage to the dev ice. These are stress ratings on ly and ope ration of the dev ice at these o r at any othe r cond itions above those g iven in the Characteristics sect ion of the spec ification is not implied. Exposu re to limiting va lues for extended pe riods may aff ect dev ice reliab ility. Application information Where application information is given, it is adv isory and does not form part of the spec ification. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors´ customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such improper use or sale. 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