PHILIPS SAB9082H

INTEGRATED CIRCUITS
DATA SHEET
SAB9082
NTSC Picture-In-Picture (PIP)
controller
Preliminary specification
Supersedes data of 1999 Feb 18
File under Integrated Circuits, IC02
1999 Nov 12
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
FEATURES
• Double window Picture-in-Picture (PIP) in interlaced or
non-interlaced mode at 8-bit resolution
• Internal 1-Mbit DRAM
• Three 8-bit Analog-to-Digital Converters (ADCs) (7-bit
performance) with clamp circuit for each acquisition
channel
The conversion to the digital environment is done on chip
with ADCs. Processing and storage of the video data is
done entirely in the digital domain. The conversion back to
the analog domain is done by means of DACs.
• One PLL which generates the line-locked clocks for the
subchannel
• One PLL which generates the line-locked clocks for the
main and display channels
Internal clocks are generated by PLLs which lock on to the
applied horizontal and vertical syncs.
• Three 8-bit Digital-to-Analog Converters (DACs)
• Linear zoom in both horizontal and vertical directions for
the subchannel
The main input channel is compressed horizontally by a
factor of two and directly fed to the output. After
compression, a horizontal expansion of two is possible for
the main channel.
• Linear zoom in horizontal direction for the main channel
• Three multistandard PIP modes are available.
The subchannel is also compressed horizontally by a
factor of two but stored in memory before it is fed to the
outputs.
GENERAL DESCRIPTION
The SAB9082 is an NTSC PIP controller which can be
used in double window applications. The SAB9082 inserts
one or two live video signals with reduced size into another
live video signal. The incoming video signals are expected
to be analog baseband signals.
The SAB9082 can also create three multistandard PIP
modes, one with three PIPs placed in a column (MP3) and
two with two columns of three PIPs (MP6, MP6S).
The reduction factors of these PIPs are horizontal 1⁄4 and
vertical 1⁄3. In the first two modes, the column(s) can be
placed on the left or right side of the screen.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VDDD
VDDA
IDDD
IDDA
digital supply voltage
analog supply voltage
digital supply current
analog supply current
3.0
3.0
−
140
3.3
3.3
50
165
3.6
3.6
−
210
V
V
mA
mA
28
4
−
0.7
−
−
4
−
MHz
kHz
ns
PLL
fclk(sys)
Bloop
tjitter
ζ
system clock frequency
loop bandwidth
short-term stability
damping factor
1792 × fHSYNC
−
−
peak-to-peak jitter for 64 µs −
−
ORDERING INFORMATION
TYPE
NUMBER
SAB9082H
1999 Nov 12
PACKAGE
NAME
QFP100
DESCRIPTION
plastic quad flat package; 100 leads (lead length 1.95 mm);
body 14 × 20 × 2.8 mm
2
VERSION
SOT317-2
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SU
SV
SY
Vbias(SA)
Vref(T)(SA)
Vref(B)(SA)
SHSYNC
SVSYNC
4
5
6
7
14
15
16
17
20
39
40
41
42
61
64
VDDD(D) VSSA(SA) VSSD(SA)
65
66
67
76
77
78
85
86
79
8
81
10
HORIZONTAL
AND
VERTICAL
FILTER
83
CLAMP AND ADC
84
82
12
DAC AND BUFFER
9
11
80
13
69
87
PLL AND CLOCK
GENERATOR
72
LINE MEMORY
DISPLAY
CONTROL
INTERNAL DRAM
68
18, 19
3
MU
MY
MV
Vbias(MA)
Vref(T)(MA)
Vref(B)(MA)
DHSYNC
DVSYNC
2
2
98
30
100
HORIZONTAL
FILTER
CLAMP AND ADC
97
SAB9082
1
70
90
91
92
95
96
6
75
74
73
88
93
44
43
45
PKOFF
FBL
VSSD(T1)
and
VSSD(T2)
VSSD(T3)
DCLK
TC
46
T5 to T0
47
MGL582
VDDA(SP)
VSSA(DP)
VDDA(DP)
VSSD(MA)
n.c.
SDA
POR
Fig.1 Block diagram.
T6
SCL
T7
TM
TCBD
TCLK
TCBR
TCBC
SAB9082
VSSA(SP)
VDDD(MA)
Preliminary specification
89
Vref(B)(DA)
32 to 37
19
21 to 29, 31,
52 to 60
Vref(T)(DA)
VSSD(T8)
and
VSSD(T9)
38
TEST
CONTROL
Vbias(DA)
62, 63
71
I2C-BUS
CONTROL
DU
VSSD(T4)
to
VSSD(T7)
94
PLL AND CLOCK
GENERATOR
DV
48 to 51
4
99
DY
Philips Semiconductors
VSSD(D) VDDA(SA) VDDA(SF) VDDD(SA)
NTSC Picture-In-Picture (PIP) controller
3
BLOCK DIAGRAM
handbook, full pagewidth
1999 Nov 12
VSSA(MA) VDDA(DA) VDDD(DA) VSSD(P1) VDDD(RP) VSSD(RL) VDDD(RM) VDDD(P2)
VDDA(MF) VDDA(MA) VSSA(DA) VSSD(DA) VDDD(P1) VDDD(RL) VSSD(RM) VSSD(RP) VSSD(P2)
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
PINNING
SYMBOL
PIN
TYPE
DESCRIPTION
Vref(B)(MA)
1
I/O
MU
2
I
analog U input for main channel
VDDA(MF)
3
S
analog supply voltage for main channel front-end buffers
VSSA(MA)
4
S
analog ground for main channel ADCs
VDDA(MA)
5
S
analog supply voltage for main channel ADCs
VDDA(DA)
6
S
analog supply voltage for DACs
VSSA(DA)
7
S
analog ground for DACs
DY
8
O
analog Y output of DAC
Vbias(DA)
9
I/O
input/output analog bias reference voltage for DACs
analog bottom reference voltage for main channel ADCs
DV
10
O
analog V output of DAC
Vref(T)(DA)
11
I/O
input/output analog top reference voltage for DACs
DU
12
O
analog U output of DAC
Vref(B)(DA)
13
I/O
analog bottom reference voltage for DACs
VDDD(DA)
14
S
digital supply voltage for DACs
VSSD(DA)
15
S
digital ground for DACs
VSSD(P1)
16
S
digital ground for periphery
VDDD(P1)
17
S
digital supply voltage for periphery
VSSD(T1)
18
S
digital ground for test
VSSD(T2)
19
S
digital ground for test
20
S
digital supply voltage for memory periphery
21 to 29
−
not connected
VSSD(T3)
30
S
digital ground for test
not connected
VDDD(RP)
n.c.
n.c.
31
−
T5
32
I/O
test data input/output bit 5 (CMOS levels)
T4
33
I/O
test data input/output bit 4 (CMOS levels)
T3
34
I/O
test data input/output bit 3 (CMOS levels)
T2
35
I/O
test data input/output bit 2 (CMOS levels)
T1
36
I/O
test data input/output bit 1 (CMOS levels)
T0
37
I/O
test data input/output bit 0 (CMOS levels)
TC
38
I
test control input (CMOS levels)
VDDD(RL)
39
S
digital supply voltage for memory logic
VSSD(RL)
40
S
digital ground for memory logic
VSSD(RM)
41
S
digital ground for memory core
VDDD(RM)
42
S
digital supply voltage for memory core
TCLK
43
I
test clock input (CMOS levels)
TM
44
I
test mode input (CMOS levels)
TCBD
45
I
test control block data input (CMOS levels)
TCBC
46
I
test control block clock input (CMOS levels)
47
I
test control block reset input (CMOS levels)
48 to 51
S
digital ground for test
TCBR
VSSD(T4) to VSSD(T7)
1999 Nov 12
4
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SYMBOL
n.c.
VSSD(RP)
PIN
TYPE
52 to 60
−
SAB9082
DESCRIPTION
not connected
61
S
digital ground for memory periphery
62 and 63
S
digital ground for test
VDDD(P2)
64
S
digital supply voltage for periphery
VSSD(P2)
65
S
digital ground for periphery
VSSD(D)
66
S
digital ground for digital core
VDDD(D)
67
S
digital supply voltage for digital core
FBL
68
O
fast blanking control signal output (CMOS levels; +5 V tolerant)
PKOFF
69
O
peak off control signal output (CMOS levels; +5 V tolerant)
DVSYNC
70
I
vertical sync display channel input (CMOS levels; +5 V tolerant)
DCLK
71
I
test clock input (28 MHz; CMOS levels)
VSSD(T8) and VSSD(T9)
SVSYNC
72
I
vertical sync for subchannel input (CMOS levels; +5 V tolerant)
SCL
73
I/O
input/output serial clock (I2C-bus; CMOS levels; +5 V tolerant)
SDA
74
I/O
input/output serial data/acknowledge output (I2C-bus; +5 V tolerant)
POR
75
I
power-on reset input (CMOS levels; pull-up resistor connected to VDD)
VDDA(SA)
76
S
analog supply voltage for subchannel ADCs
VSSA(SA)
77
S
analog ground for subchannel ADCs
VDDA(SF)
78
S
analog supply voltage for subchannel front-end buffers and clamps
SU
79
I
analog U input for subchannel
Vref(B)(SA)
80
I/O
SV
81
I
Vref(T)(SA)
82
I/O
SY
83
I
Vbias(SA)
84
I/O
VSSD(SA)
85
S
digital ground for subchannel ADCs
VDDD(SA)
86
S
digital supply voltage for subchannel ADCs
SHSYNC
87
I
horizontal sync input for subchannel (Vi < VSHSYNC)
T6
88
I/O
test data input/output bit 7 (CMOS levels)
VDDA(SP)
89
S
analog supply voltage for subchannel PLL
VSSA(SP)
90
S
analog ground for subchannel PLL
VSSA(DP)
91
S
analog ground for display channel PLL
VDDA(DP)
92
S
analog supply voltage for display channel PLL
T7
93
I/O
input/output analog bottom reference voltage for subchannel ADCs
analog V input for subchannel
input/output analog top reference voltage for subchannel ADCs
analog Y input for subchannel
analog bias reference voltage for subchannel ADCs
test data input/output bit 6 (CMOS levels)
DHSYNC
94
I
horizontal sync input for display channel (Vi < VDHSYNC)
VDDD(MA)
95
S
digital supply voltage for main channel ADCs
VSSD(MA)
96
S
digital ground for main channel ADCs
Vbias(MA)
97
I/O
MY
98
I
Vref(T)(MA)
99
I/O
MV
100
I
1999 Nov 12
analog bias reference voltage for main channel ADCs
analog Y input for main channel
analog top reference voltage for main channel ADCs
analog V input for main channel
5
Philips Semiconductors
Preliminary specification
81 SV
82 Vref(T)(SA)
83 SY
84 Vbias(SA)
86 VDDD(SA)
85 VSSD(SA)
87 SHSYNC
SAB9082
88 T6
90 VSSA(SP)
89 VDDA(SP)
92 VDDA(DP)
91 VSSA(DP)
93 T7
94 DHSYNC
95 VDDD(MA)
97 Vbias(MA)
96 VSSD(MA)
98 MY
100 MV
handbook, full pagewidth
99 Vref(T)(MA)
NTSC Picture-In-Picture (PIP) controller
Vref(B)(MA)
1
80 Vref(B)(SA)
MU
2
79 SU
VDDA(MF)
3
78 VDDA(SF)
VSSA(MA)
4
77 VSSA(SA)
VDDA(MA)
5
76 VDDA(SA)
VDDA(DA)
6
75 POR
VSSA(DA)
7
74 SDA
DY
8
73 SCL
Vbias(DA)
9
72 SVSYNC
DV 10
71 DCLK
Vref(T)(DA) 11
70 DVSYNC
DU 12
69 PKOFF
Vref(B)(DA) 13
VDDD(DA) 14
68 FBL
VSSD(DA) 15
VSSD(P1) 16
67 VDDD(D)
66 VSSD(D)
SAB9082
VDDD(P1) 17
65 VSSD(P2)
64 VDDD(P2)
VSSD(T1) 18
63 VSSD(T9)
VSSD(T2) 19
62 VSSD(T8)
61 VSSD(RP)
VDDD(RP) 20
n.c. 21
60 n.c.
n.c. 22
59 n.c.
n.c. 23
58 n.c.
n.c. 24
57 n.c.
n.c. 25
56 n.c.
n.c. 26
55 n.c.
n.c. 27
54 n.c.
n.c. 28
53 n.c.
n.c. 29
52 n.c.
51 VSSD(T7)
Fig.2 Pin configuration.
1999 Nov 12
6
VSSD(T6) 50
VSSD(T5) 49
TCBR 47
VSSD(T4) 48
TCBC 46
TCBD 45
TM 44
TCLK 43
VSSD(RM) 41
VDDD(RM) 42
VSSD(RL) 40
VDDD(RL) 39
T0 37
TC 38
T1 36
T2 35
T3 34
T4 33
T5 32
n.c. 31
VSSD(T3) 30
MGL583
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
FUNCTIONAL DESCRIPTION
SAB9082
The starting-point of the acquisition can be controlled with
the acquisition fine positioning added to a system
constant. With a nominal input fHSYNC and standard NTSC
signals, 1408 samples (active video) are acquired and
processed by the SAB9082. Here, the nominal input
fHSYNC results in a nominal system clock frequency of
1792 × fHSYNC (approximately 28 MHz).
Acquisition
The internal pixel rate is 28 MHz for the Y, U and V
channels. It is expected that the bandwidth of the input
signals will be limited to 4.5 MHz for the Y input and
1.125 MHz for the U and V inputs. Inset synchronization is
achieved via the acquisition HSYNC and VSYNC pins of
the main channel. The display is driven by the main
channel clock.
PIP modes
handbook, full pagewidth
SUB
MAIN
SUB
SUB
MAIN
MGM810
MAIN
REPLAY
Fig.3 PIP modes.
1999 Nov 12
7
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
handbook, full pagewidth
S0
S0
S1
S1
S2
S2
S0
S1
S2
S3
S4
S5
S4
S1
S2
S3
S4
S5
S0
S0
S1
MAIN
MAIN
S1
MAIN
S2
S0
S2
MAIN
S0
MAIN
S2
S1
S0
S1
S0
S1
S3
S2
S3
S2
S3
S5
S4
S5
S4
S5
MGL587
S0
S1
S2
S3
S4
S5
Fig.4 Multistandard PIP modes.
I2C-bus control is according to the I2C-bus protocol: first, a
START sequence must be put on the I2C-bus. Then, the
I2C-bus address of the circuit must be sent, followed by a
subaddress. After this sequence, the data of the
subaddresses must be sent. An auto-increment function
gives the option of sending data of the incremented
subaddresses until a STOP sequence is sent. Table gives
an overview of the I2C-bus addresses. The data bits that
are not used should be set to zero.
I2C-bus description
The I2C-bus provides bidirectional 2-line communication
between different ICs. The SDA line is the serial data line
and the SCL the serial clock line. Both lines must be
connected to a positive supply via a pull-up resistor when
connected to the output stages of a device.
Data transfer may be initiated only when the bus is not
busy. The SAB9082 has the I2C-bus address 2CH. Valid
subaddresses are 00H to 18H, registers 15H to 18H are
reserved for future extensions.
1999 Nov 12
8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
9
00H
MPIPON
SPIPON
S1FLD
SFreeze
DNonint
PipMode2
PipMode1
PipMode0
01H
SHBlow1
SHBlow0
SHRed5
SHRed4
SHRed3
SHRed2
SHRed1
SHRed0
02H
SVBlow
SVRed6
SVRed5
SVRed4
SVRed3
SVRed2
SVRed1
SVRed0
03H
BGVfp3
BGVfp2
BGVfp1
BGVfp0
BGHfp3
BGHfp2
BGHfp1
BGHfp0
04H
SDHfp7
SDHfp6
SDHfp5
SDHfp4
SDHfp3
SDHfp2
SDHfp1
SDHfp0
05H
SDVfp7
SDVfp6
SDVfp5
SDVfp4
SDVfp3
SDVfp2
SDVfp1
SDVfp0
06H
SHPic7
SHPic6
SHPic5
SHPic4
SHPic3
SHPic2
SHPic1
SHPic0
07H
SVPic7
SVPic6
SVPic5
SVPic4
SVPic3
SVPic2
SVPic1
SVPic0
08H
MAHfp3
MAHfp2
MAHfp1
MAHfp0
SAHfp3
SAHfp2
SAHfp1
SAHfp0
09H
SAVfp7
SAVfp6
SAVfp5
SAVfp4
SAVfp3
SAVfp2
SAVfp1
SAVfp0
0AH
DUVPol
DVSPol
DFPol
DHsync
SUVPol
SVSPol
SFPol
SHsync
0BH
MainFidPos7
MainFidPos6
MainFidPos5
MainFidPos4
MainFidPos3
MainFidPos2
MainFidPos1
MainFidPos0
0CH
SubFidPos7
SubFidPos6
SubFidPos5
SubFidPos4
SubFidPos3
SubFidPos2
SubFidPos1
SubFidPos0
0DH
BGOn
BOn
MFidPOn
SFidPOn
Prio
AlgOff
SFBlkPkOff1
SFBlkPkOff0
0EH
BSel1
BSel0
SBBrt1
SBBrt0
−
SBCol2
SBCol1
SBCol0
0FH
−
−
SLSel5
SLSel4
SLSel3
SLSel2
SLSel1
SLSel0
10H
I2CHold
SV1
SDSel5
SDSel4
SDSel3
SDSel2
SDSel1
SDSel0
11H
MDHfp7
MDHfp6
MDHfp5
MDHfp4
MDHfp3
MDHfp2
MDHfp1
MDHfp0
12H
MDVfp7
MDVfp6
MDVfp5
MDVfp4
MDVfp3
MDVfp2
MDVfp1
MDVfp0
13H
MHBlow
SV2
MHRed5
MHRed4
MHRed3
MHRed2
MHRed1
MHRed0
14H
−
VBWidth2
VBWidth1
VBWidth0
−
HBWidth2
HBWidth1
HBWidth0
15H to 18H
Philips Semiconductors
DATA BYTES
SUB
ADDRESS
NTSC Picture-In-Picture (PIP) controller
1999 Nov 12
Table 1 Overview of I2C-bus addresses
For a description of the various data bits, see the following pages
all bits are reserved
Preliminary specification
SAB9082
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
Table 2
MPIPON (DOUBLE WINDOW)
Bit MPIPON is used to switch the main channel PIP on
(logic 1) or off (logic 0).
SPIPON
Bit SPIPON is used to switch the subchannel PIPs on
(logic 1) or off (logic 0).
PRIO
The priority bit decides whether the main channel PIP (Prio
set to logic 0) or the subchannel PIP (Prio set to logic 1)
will be on top when both PIPs overlap.
PIP modes
PipMode<2:0>
MODE
000
double window mode
001
replay PIP
010
multistandard PIP 3
011
multistandard PIP 6
100
reserved
111
multistandard PIP 6 split
SHRED AND SVRED (DOUBLE WINDOW)
Bits SHRed<5:0> and SVRed<6:0> determine the
reduction factors in the double window mode.
S1FLD
The horizontal reduction is equal to SHRed/96; the vertical
reduction is equal to SVRed/96. SHRed should lie in the
range from 0 to 48; if set to logic 0, the PIP is off. SVRed
should lie in the range from 0 to 96; if set to logic 0, the PIP
is off.
If S1FLD is set to logic 0, two fields are used for the live
PIP. When a 50/60 Hz or a 60/50 Hz mode is detected, the
SAB9082 automatically switches to the 1-Field mode
(1-Field resolution vertically).
If S1FLD is set to logic 1, only one field is used. This
causes joint line errors but saves memory. This bit should
not be set in normal modes.
With SFreeze set to logic 1, the current live subchannel
PIP will be frozen. If set to logic 0, it is unfrozen.
When the horizontal reduction factor is 48/96,
704 samples are processed. The horizontal reduction
factor is linear; therefore, when it is 24/96, 352 samples
are processed. The same holds for the vertical reduction
factor but then with the number of lines. For NTSC, the
number of processed lines can be calculated from
SVRed/96 × 228 lines.
ALGOFF
SHRED AND SVRED (REPLAY)
In double window mode, precautions are taken to prevent
a joint line error. Under some conditions, this feature
should be switched off. This can be realized by setting this
bit to logic 1. Normally, bit AlgOff should be set to logic 0.
In the replay mode, the range of SHRed and SVRed is
limited as follows: SHRed = 12; SVRed = 24, 16 or 12.
This leads to a fixed horizontal reduction factor of 1⁄8; and
to a variable vertical reduction factor of 1⁄4, 1⁄6 or 1⁄8. Note
that the resulting replay PIP can be expanded by using
SHBlow and/or SVBlow.
SFREEZE
DNONINT
In normal mode (this bit is logic 0), the SAB9082 calculates
whether a signal is non-interlaced and reacts accordingly.
With bit DNonint set to logic 1, the display channel is
forced into the non-interlaced mode. In the non-interlaced
mode, only one field is used during the processing of the
PIPs.
SHPIC AND SVPIC (MULTISTANDARD PIP MODES)
Bytes SHPic and SVPic control the picture size in the
multistandard PIP modes. The horizontal range is
256 steps of four 28 MHz clock periods. The vertical range
is 256 steps of one line/field.
In the double window and replay modes, the picture size is
determined by the reduction factors (SHRed and SVRed)
and bits HBlow and VBlow.
PIPMODE
Byte PipMode determines the PIP modes for the SAB9082
are shown in Table 2.
1999 Nov 12
10
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
BGHFP AND BGVFP
MFIDPON AND SFIDPON
These bits control the horizontal and vertical positioning of
the PIP configuration on the screen. The horizontal range
is adjustable in 16 steps of four 28 MHz clock periods.
The vertical range is 16 steps of 1 line/field.
The background colour can be adjusted with bits BSel,
SBBrt and SBCol.
Bits MFidPOn (main field identification position on) and
SFidPOn (subfield identification position on) enable the
field identification position fine tuning. The default value is
off (logic 0), no fine positioning. When on (logic 1), the field
identification position is determined by the value of
MainFidPos and SubFidPos.
SDHFP AND SDVFP
BGON
These bytes control the horizontal and vertical positioning
of the subchannel PIPs on the screen. The horizontal
range is 256 steps of eight 28 MHz clock periods.
The vertical range is 256 steps of 1 line/field.
Bit BGOn determines whether the background is visible.
The background has a size of 720 pixels and 240 lines for
NTSC. The background colour can be adjusted with
bits BSel, SBBrt and SBCol.
MAHFP, SAHFP AND SAVFP
BON, SBBRT, SBCOL AND BSEL
Bits MAHfp<3:0>, bits SAHfp<3:0> and byte SAVfp
control the horizontal and vertical inset starting-points of
the acquired data. The horizontal range is 16 steps of eight
28 MHz clock periods when SV2 is set to logic 1. When
SV2 is set to logic 0, the horizontal range is restricted to
eight steps. The vertical range is 256 steps of 1 line/field.
Bit BOn can switch the sub-borders on (logic 1) or off
(logic 0). Bits SBBrt<1:0> and SBCol<2:0> set the
brightness and colour type of the selected border.
The brightness is set in four levels of 30%, 50%, 70% and
100% IRE. The colour type is one of black (grey), blue, red,
magenta, green, cyan, yellow or white (grey).For black and
white, a finer scale is available Bits BSel<1:0> select
which colour is set, background or border, see Table 3.
DUVPOL, DVSPOL, DFPOL AND DHSYNC
These bits control the PLL/deflection settings. With
DUVPol, the polarity of the border UV signals can be
inverted when the deflection circuit after the SAB9082
expects inverted signals. With DVSPol set to logic 0, the
SAB9082 triggers on positive edges of the DVSYNC.
If DVSPol is set to logic 1, it triggers on negative edges.
Bit DFPol can invert the field ID of the incoming fields.
Bit DHsync determines the timing of the DHSYNC pulse.
If it is set to logic 0, a burstkey is expected and if it is set to
logic 1, a horizontal sync is expected at pin DHSYNC.
Table 3
BSel<1:0>
BORDER COLOUR SET
00
main
01
sub
10
background
11
sub-border select
MDHFP AND MDVFP
These bytes control the horizontal and vertical positioning
of the main PIP on the screen. The horizontal range is
256 steps of eight 28 MHz clock periods. The vertical
range is 256 steps of 1 line/field.
SUVPOL, SVSPOL, SFPOL AND SHSYNC
These bits control the PLL/decoder settings. With SUVPol,
the polarity of the video UV signals can be inverted when
the decoder circuit before the SAB9082 emits inverted
signals. With SVSPol set to logic 0, the SAB9082 triggers
on positive edges of the SVSYNC. If it is set to logic 1, it
triggers on the negative edges. Bit SFPol can invert the
field ID of the incoming fields. Bit SHsync determines the
timing of the SHSYNC pulse. If it is set to logic 0, a
burstkey is expected and if it is set to logic 1, a horizontal
sync is expected at pin SHSYNC.
1999 Nov 12
BSel modes
MHRED
Bits MHRed<5:0>, in a range from 0 to 48, determine the
horizontal reduction factor MHRed/96. If they are set to
logic 0, the PIP is off. If they are set to the maximum value
of 48, the horizontal reduction factor is 0.5.
11
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SHBLOW AND SVBLOW (REPLAY MODE)
The bits and bytes that are on hold when bit I2CHold is set
to logic 1 are:
Bits SHBlow<1:0> and bit SVBlow are used in the replay
mode. These bits can expand a pixel on the display side
by a factor two (01) or four (11) in the horizontal direction
(SHBlow) and a factor of two (1) in the vertical direction
(SVBlow). Zero values indicate no expansion.
• MPIPON, SPIPON, DNonint and PipMode
• SHBlow and SVBlow
• SHRed and SVRed
• BGHfp and BGVfp
• SDHfp and SDVfp
MHBLOW
• SHPic and SVPic
Bit MHBlow can expand the main picture by a factor of two
in the horizontal direction.
• BGOn, BOn and Prio
• BSel, SBBrt and SBCol
SLSEL (REPLAY MODE)
• SDSel
In the replay PIP mode, bits SLSel<5:0> determine at
which memory location the PIP data is written, the range
depends on the memory usage for each PIP.
The maximum number of PIPs that can be stored in NTSC
mode is 42.
• MDHfp and MDVfp
• HBWidth and VBWidth.
SV1
Bit SV1 controls the internal horizontal offset of the
background. When set to logic 0, the offset is 0.86 µs;
when set to logic 1, the offset is 4.56 µs.
SLSEL (MULTISTANDARD PIP MODES)
Bits SLSel<5:0> select which of the PIPs in a
multistandard PIP mode is live. In MP3 modes, SLSel must
be in the range from 0 to 2. In all MP6 modes, SLSel must
be in the range from 0 to 5.
SV2
When set to logic 0, bit SV2 limits the range of the MAHfp
and SAHfp parameters. Otherwise (bit SV2 set to logic 1),
the parameters have their maximum range (which is
recommended).
SDSEL (REPLAY MODE)
Bits SDSel<5:0> select which PIP is read from memory.
Valid numbers are dependent on the maximum value of
SLSel.
HBWIDTH AND VBWIDTH
Bits HBWidth<2:0> and VBWidth<2:0> control the
horizontal and vertical border sizes in steps of two pixels
and one line. The default horizontal border size is four
pixels and the vertical border size is two lines per field.
Default means after power-up and no I2C-bus data sent to
the PIP controller.
SFBLKPKOFF
Bits SFBlkPkOff<1:0> shift signals FBL and PKOFF with
respect to the YUV output, by half pixels, see Table 4.
Table 4
SAB9082
Shifts of FBLK and PKOff
SFBlkPkOff<1:0>
SHIFT OF FBL AND PKOFF
00
no shift
01
+0.5 pixel
10
−0.5 pixel
11
−1 pixel
In MP6 mode, the minimum value of HBWidth is two.
NOTES
1. When the input signals for the main and/or subchannel
are non-interlaced, joint line errors can occur. When
non-interlaced signals are input, the SAB9082
switches automatically to the non-interlaced mode.
I2CHOLD
2. When the prevent joint line error algorithm is switched
off (AlgOff is set to logic 1), joint line errors can still
occur in the 2-Field mode.
Bit I2CHold controls the updating of the I2C-bus controlled
function towards the PIP. If set to logic 1, some updates
are on hold until the bit is set to logic 0. At the next main
Vsync, all settings are passed to the PIP functions.
1999 Nov 12
12
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
Acquisition channel ADCs and clamping
PLL
The analog input signals are converted to digital signals by
three ADCs per channel. The resolution of the ADCs is
8 bits (DNL is 7 bits and INL is 6 bits) and the sampling is
performed at the system clock frequency of 28 MHz for the
Y input. A bias voltage (Vbias) is used to decouple the AC
components on internal references.
The PLL generates an internal system clock of
1792 × fHSYNC, from the fHSYNC, which is approximately
28 MHz.
DACs and video buffers
The 28 MHz digital video signals are fed to the 8-bit DACs
that produce the required analog video signals. The video
buffers amplify these signals prior to being fed to the
output to drive another device.
The inputs should be AC coupled and an internal clamp
circuit (using external clamp capacitors) will clamp the
input to a level derived internally from Vref(B)(MA/SA) for the
luminance channels and, for the chrominance channels, to
(Vref(T)(MA/SA) + Vref(B)(MA/SA))/2 + LSB/2. The clamping
starts at the active edge of the burst key. Internal video
buffers amplify the standard Y, U and V input signals to
the correct ADC levels.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDD
supply voltage range
−0.5
5.0
V
Tstg
storage temperature
−25
+150
°C
Tamb
ambient temperature
0
70
°C
Vesd
electrostatic discharge handling
−
2
kV
Rth(j-a)
thermal resistance
−
45
K/W
Pmax
maximum power dissipation
−
1.0
W
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611, Part E”, dated 14 December 1992.
ESD LEVELS
The standard ESD specification is JEDEC Class II (2 kV Human Body Model, 200 V Machine Model) unless indicated
otherwise.
Table 5
ESD performance
PIN
SYMBOL
HUMAN BODY MODEL (V)
68
FBL
1000
69
PKOFF
1000
70
DVSYNC
1000
72
SVSYNC
1000
73
SCL
1000
74
SDA
1000
all other pins
standard specification
rest in range 1 to 17
rest in range 64 to 100
1999 Nov 12
13
MACHINE MODEL (V)
standard specification
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
ANALOG CHARACTERISTICS
VDDA = 3.3 V; VDDD = 3.3 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDDA
positive supply voltage
3.0
3.3
3.6
V
VSSA
ground voltage
−
0
−
V
∆VDDA(max)
maximum DC difference
between supply voltages
−
0
100
mV
∆VSSA(max)
maximum DC difference
between ground voltages
−
0
100
mV
IDDD(q)
quiescent current of digital
supply voltages
−
0
50
µA
IDDA(DP)
display PLL supply current
−
0.4
−
mA
IDDA(SP)
sub PLL supply current
−
0.4
−
mA
note 1
IDDA(MA)
main ADCs supply current
note 2
60
70
90
mA
IDDA(SA)
sub ADCs supply current
note 2
60
70
90
mA
IDDA(DA)
DACs supply current
8
10
12
mA
IDDA(MF)
main buffers supply current
4
6
9
mA
IDDA(SF)
sub buffers supply current
4
6
9
mA
IDDA(tot)
total analog supply current
140
165
210
mA
IDDD(tot)
total digital supply current
−
50
−
mA
2.70
2.82
2.95
V
note 2
Analog-to-digital converter and clamping
Vref(T)
top reference voltage
note 3
Vref(B)
bottom reference voltage
note 3
0.95
1.07
1.20
V
ViY(p-p)
Y input signal amplitude
(peak-to-peak value)
note 4
−
1.00
1.04
V
Vi(V)(p-p)
V input signal amplitude
(peak-to-peak value)
note 4
−
1.05
1.10
V
Vi(U)(p-p)
U input signal amplitude
(peak-to-peak value)
note 4
−
1.33
1.38
V
Ii
input current
clamping off
−
0.1
−
µA
clamping on
−
55
−
µA
−
5
−
pF
−
1792 × fHSYNC
−
kHz
8
8
8
bit
Ci
input capacitance
fsample
sample frequency
RES
resolution
note 5
DNL
differential non-linearity
−1.4
−
+1.4
LSB
INL
integral non-linearity
−2.0
−
+2.0
LSB
αcs
channel separation
−
48
−
dB
Vclamp(Y)
Y clamping voltage level
note 6
1.25
1.34
1.45
V
Vclamp(U,V)
U/V clamping voltage level
note 7
1.80
1.93
2.15
V
1999 Nov 12
14
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SYMBOL
PARAMETER
SAB9082
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Digital-to-analog converter and output stage
Vref(T)
top reference voltage
1.10
1.20
1.30
V
Vref(B)
bottom reference voltage
0.15
0.23
0.30
V
RL
load resistance
1
−
1000
kΩ
CL
load capacitance
0
−
5
pF
fsample
sample frequency
−
1792 × fHSYNC
−
kHz
RES
resolution
8
8
8
bit
note 8
DNL
differential non-linearity
−1.0
−
+1.0
LSB
INL
integral non-linearity
−1.0
−
+1.0
LSB
αcs
channel separation
−
48
−
dB
NTSC
14
15.75
17
kHz
NTSC
14
15.75
17
kHz
Display PLL and clock generation
fi(PLL)
input frequency
Sub PLL and clock generation
fi(subPLL)
input frequency
Notes
1. Digital clocks are silent, input pins POR and TM are connected to VDDA.
2. This value is measured with an external bias resistor of 39 kΩ resulting in a bias current of 55 µA.
3. Voltages Vref(T) and Vref(B) are made by a resistor division of VDDA. They can be calculated with the formulas:
2.82
1.07
V ref(T) = V DDA × ------------------------- V and V ref(B) = V DDA × ------------------------- V .
V DDA(nom)
V DDA(nom)
4. The input signals are amplified to meet an internal peak-to-peak voltage level of 0.8 × (Vref(T) − Vref(B)), which equals
the internal ADC input range.
5. The internal system clock frequency is 1792 × fHSYNC of the input channel.
6. The clamp level is not equal to the Vref(B) of the ADCs.
V ref ( B ) + V ref ( T ) + V LSB
7. The UV channels are clamped to: ------------------------------------------------------------ .
2
8. The internal system clock frequency is 1792 × fHSYNC of the main channel.
1999 Nov 12
15
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
DIGITAL CHARACTERISTICS
VDDA = 3.3 V; VDDD = 3.0 to 3.6 V; Tamb = 0 to 70 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DC characteristics
VIH
HIGH-level input voltage
default
0.8VDDD
−
VDDD + 0.5
V
pin 74
0.8VDDD
−
5.5(1)
V
0.8VDDD
V
5.5(1)
V
−0.5
−
0.2VDDD
V
0.8
−
−
V
5 V tolerant pins 68, 69,
70, 72, 73
VIL
LOW-level input voltage
Vhys
hysteresis voltage
default
VOH
HIGH-level output voltage
IOH = −X mA;
VDDD = 3.0 V; note 2
0.85VDDD
−
−
V
VOL
LOW-level output voltage
IOL = X mA;
VDDD = 3.0 V; note 2
−
−
0.4
V
IOL = 2 mA;
VDDD = 3.0 V
−
−
0.4
V
|ILI|
input leakage current
VI = 0 V
−
−
1
µA
VI = VDDD
−
−
1
µA
|IOZ|
3-state output leakage
current
VO = 0 V or
VO = VDDD
−
−
1
µA
Ilu(I/O)
I/O latch-up current
V < 0 V; V > VDDD
200
−
−
mA
Rpu
internal pull-up resistor
16
33
78
kΩ
−
1792 × fHSYNC
−
kHz
AC characteristics
fclk(sys)
system clock frequency
note 3
tr
rise time
−
6
25
ns
tf
fall time
−
6
25
ns
Notes
1. The absolute maximum input voltage is 6.0 V.
2. X is the source/sink current under worst case conditions. X is reflected in the name of the I/O cell according to the
drive capability. The minimum value of X is 1 mA.
3. The internal system clock frequency is 1792 × fHSYNC of the main channel and subchannel.
1999 Nov 12
16
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
TEST AND APPLICATION INFORMATION
Figure 5 gives the application diagram in a standard configuration. Input signals main channel CVBS and subchannel
CVBS from different video sources are processed by the SAB9082 and inserted by the YUV to RGB switch.
HS/VS
handbook, full pagewidth
FBL
subchannel CVBS
SUB
DECODER
YUV
TDA8310
YUV
SAB9082
PIP
CONTROLLER
YUV
to
RGB
SWITCH
TDA4780
HS/VS
HS/VS
RGB
YUV/RGB
PROCESSING
AND
DEFLECTION
CIRCUIT
HS/VS
RGB
main channel CVBS
MAIN
DECODER
YUV
YUV
TDA8310
MGL581
Fig.5 Application diagram.
1999 Nov 12
17
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
PACKAGE OUTLINE
QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SOT317-2
c
y
X
80
A
51
81
50
ZE
e
E HE
A
A2
(A 3)
A1
θ
wM
pin 1 index
Lp
bp
L
31
100
detail X
30
1
wM
bp
e
ZD
v M A
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
3.20
0.25
0.05
2.90
2.65
0.25
0.40
0.25
0.25
0.14
20.1
19.9
14.1
13.9
0.65
24.2
23.6
18.2
17.6
1.95
1.0
0.6
0.2
0.15
0.1
Z D (1) Z E(1)
0.8
0.4
1.0
0.6
θ
o
7
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
95-02-04
97-08-01
SOT317-2
1999 Nov 12
EUROPEAN
PROJECTION
18
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Nov 12
SAB9082
19
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, SQFP
not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable(2)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Nov 12
20
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
SAB9082
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Nov 12
21
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
NOTES
1999 Nov 12
22
SAB9082
Philips Semiconductors
Preliminary specification
NTSC Picture-In-Picture (PIP) controller
NOTES
1999 Nov 12
23
SAB9082
Philips Semiconductors – a worldwide company
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Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 68
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/25/02/pp24
Date of release: 1999
Nov 12
Document order number:
9397 750 06155