IP3047CX6 Integrated dual channel passive LC-filter network with ESD protection to IEC 61000-4-2 level 4 Rev. 2 — 23 November 2010 Product data sheet 1. Product profile 1.1 General description The IP3047CX6 is a low-ohmic, dual channel LC low-pass filter array which is designed to provide filtering of undesired RF signals. In addition, IP3047CX6 incorporates diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as ±15 kV contact discharge according the IEC 61000-4-2 model, far exceeding standard level 4. The device is fabricated using monolithic silicon technology and integrates two inductors and four pairs of back-to-back diodes in a 0.5 mm pitch Wafer-Level Chip-Scale Package (WLCSP). These features make the IP3047CX6 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and other portable electronic devices. 1.2 Features and benefits Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) Integrated dual channel π-type LC-filter network 0.25 Ω series resistance per channel; 190 pF channel capacitance Integrated ESD protection withstanding ±15 kV contact discharge, far exceeding IEC 61000-4-2 level 4 WLCSP with 0.5 mm pitch 1.3 Applications Audio line ElectroMagnetic Interference (EMI) filtering and ESD protection in e.g. Cellular and Personal Communication System (PCS) mobile handsets DECT Portable media player IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection 2. Pinning information 2.1 Pinning bump A1 index area 1 2 3 A B 008aaa253 transparent top view, solder balls facing down Fig 1. Pin configuration for WLCSP6 2.2 Pin description Table 1. Pinning Pin Description A1 channel 1 A2 ground A3 channel 1 B1 channel 2 B2 ground B3 channel 2 3. Ordering information Table 2. Ordering information Type number IP3047CX6 IP3047CX6 Product data sheet Package Name Description Version WLCSP6 wafer level chip-size package; 6 bumps (3 × 2) IP3047CX6 All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 2 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection 4. Functional diagram Ls(ch) A1 A3 C C A2 Ls(ch) B1 B3 C C B2 008aaa251 Fig 2. Schematic diagram of IP3047CX6 5. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit VRWM reverse standoff voltage Conditions - 10 V Ich channel current (DC) - 625 mA VESD electrostatic discharge voltage all pins to ground −15 +15 kV −15 +15 kV contact discharge −8 +8 kV air discharge contact discharge air discharge [1][2] IEC 61000-4-2 level 4; all pins to ground −15 +15 kV Pch channel power dissipation continuous; Tamb = 85 °C - 135 mW Ptot total power dissipation continuous; Tamb = 85 °C - 270 mW PPP peak pulse power Tamb = 85 °C; maximum peak power dissipation < 120 s; δ < 50 % - 270 mW Tstg storage temperature −65 +150 °C Treflow(peak) peak reflow temperature - 260 °C Tamb ambient temperature −40 +85 °C 10 s maximum [1] Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). [2] A special robust test is performed stressing the devices with ≥ 1000 contact discharges according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). IP3047CX6 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 3 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection 6. Characteristics Table 4. Channel characteristics Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Rs(ch) channel series resistance Ls(ch) channel series inductance Cch channel capacitance Vbias(DC) = 2.5 V; f = 100 kHz VBR breakdown voltage ILR [1] reverse leakage current Min Typ Max Unit - 0.25 0.35 Ω - 3 - nH 150 190 225 pF positive clamp; Itest = 1 mA 14 - 24 V negative clamp; Itest = −1 mA −24 - −14 V per channel; VI = 3 V - - 1 μA per channel; VI = −3 V −1 - - μA Min Typ Max Unit RL = 50 Ω - 35 - dB RL = 4 Ω - 40 - dB [1] Guaranteed by design. Table 5. Frequency characteristics Tamb = 25 °C; unless otherwise specified. IP3047CX6 Product data sheet Symbol Parameter Conditions αil Rgen = 50 Ω; 800 MHz < fi < 2 GHz insertion loss All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 4 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection 7. Application information The setup for measuring insertion loss in a 50 Ω system is shown in Figure 3. IN DUT OUT 50 Ω 50 Ω TEST BOARD Vgen 001aai755 Fig 3. Frequency response measurement configuration The insertion loss in a 50 Ω system for the two channels of the IP3047CX6 is shown in Figure 4. The insertion loss is measured directly on the wafer with coplanar probes. Unused pins are connected to ground with 50 Ω. 001aam535 0 s21 (dB) s21 (dB) −10 −10 −20 −20 −30 −30 −40 −40 −50 001aam536 0 1 10 102 103 104 −50 1 10 102 f (MHz) a. Channel 1 (pins A1 and A3). Fig 4. 103 104 f (MHz) b. Channel 2 (pins B1 and B3). Measured insertion loss magnitudes IP3047CX6 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 5 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection 8. Package outline WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) D bump A1 index area A2 E A A1 detail X e1 e b B e A 1 2 3 European projection X wlcsp6_3x2_po Fig 5. Table 6. Package outline IP3047CX6 (WLCSP6) Dimensions for Figure 5 Symbol Min Typ Max Unit A 0.61 0.65 0.69 mm A1 0.22 0.24 0.26 mm A2 0.39 0.41 0.43 mm b 0.27 0.32 0.37 mm D 1.55 1.60 1.65 mm E 1.10 1.15 1.20 mm e - 0.5 - mm e1 - 1.0 - mm IP3047CX6 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 6 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection 9. Design and assembly recommendations 9.1 PCB design guidelines It is recommended, for optimum performance, to use a Non-Solder Mask Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. Refer to Table 7 for the recommended PCB design parameters. Table 7. Recommended PCB design parameters Parameter Value or specification PCB pad diameter 275 μm Micro-via diameter 100 μm (0.004 inch) Solder mask aperture diameter 375 μm Copper thickness 20 μm to 40 μm Copper finish AuNi PCB material FR4 9.2 PCB assembly guidelines for Pb-free soldering Table 8. Assembly recommendations Parameter Value or specification Solder screen aperture diameter 330 μm Solder screen thickness 100 μm (0.004 inch) Solder paste: Pb-free SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %) Solder to flux ratio 50 : 50 Solder reflow profile see Figure 6 T (°C) Treflow(peak) 250 230 cooling rate 217 preheat t1 t2 t3 t4 t (s) t5 001aai943 The device is capable of withstanding at least three reflows of this profile. Fig 6. IP3047CX6 Product data sheet Pb-free solder reflow profile All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 7 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection Table 9. Characteristics Symbol Parameter Treflow(peak) peak reflow temperature t1 time 1 t2 time 2 t3 t4 Min Typ Max Unit 230 - 260 °C soak time 60 - 180 s time during T ≥ 250 °C - - 30 s time 3 time during T ≥ 230 °C 10 - 50 s time 4 time during T > 217 °C 30 - 150 s t5 time 5 dT/dt rate of change of temperature Conditions - - 540 s cooling rate - - −6 °C/s preheat 2.5 - 4.0 °C/s 10. Abbreviations Table 10. Acronym Abbreviations Description DUT Device Under Test EMI ElectroMagnetic Interference ESD ElectroStatic Discharge FR4 Flame Retard 4 NSMD Non-Solder Mask Defined PCB Printed-Circuit Board PCS Personal Communication System RoHS Restriction of Hazardous Substances WLCSP Wafer-Level Chip-Scale Package 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes IP3047CX6 v.2 20101123 - IP3047CX6 v.1 - - Modifications: IP3047CX6 v.1 IP3047CX6 Product data sheet • Product data sheet Table 6: tolerances of A and A2 changed 20101011 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 8 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. IP3047CX6 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 9 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP3047CX6 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 23 November 2010 © NXP B.V. 2010. All rights reserved. 10 of 11 IP3047CX6 NXP Semiconductors Integrated dual channel passive LC-filter network with ESD protection 14. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 8 9 9.1 9.2 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Design and assembly recommendations . . . . 7 PCB design guidelines . . . . . . . . . . . . . . . . . . . 7 PCB assembly guidelines for Pb-free soldering . . . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 23 November 2010 Document identifier: IP3047CX6