INTEGRATED CIRCUITS DATA SHEET SAA7214 Transport MPEG2 source decoder Preliminary specification Supersedes data of 1999 Mar 16 File under Integrated Circuits, IC02 2001 Mar 28 Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 FEATURES General features • Conditional access descrambling DVB-compliant • Stream demultiplexing (TS, PES, program and proprietary streams) • Internal PR3001 32-bit RISC processor running at 40.5 MHz CPU related features • Low-power sleep modes supported across the chip The SAA7214 contains an embedded RISC CPU, which incorporates the following features: • Comprehensive driver software and development tool support • A 32-bit PR3001 core • Package: SQFP208. • 1 kbyte data, and 4 kbytes Instruction caches (write-through style) The following sections specify the features in more detail, in the form of a feature matrix. • A programmable low-power mode, including wake-up on interrupt • A memory management unit External interfaces The SAA7214 supports the following external interfaces: • Two fully independent 24-bit timers and one 24-bit timer including watchdog facilities • Versatile compressed stream input at 108 Mbits/s • A real-time clock unit (active in sleep mode) • A 16-bit microcontroller extension bus supporting DRAM, Flash, (E)PROM and external memory mapped • Built-in software debug support • An on-chip 4 kbytes SRAM for storing code which needs fast execution. • I/O devices. It also supports a synchronous interface to communicate with the integrated MPEG AVGD decoder SAA7215 at 40.5 Mbytes. MPEG2 systems features • an IEEE 1284 interface (Centronics) supporting master and slave modes. Usable as a general purpose port MPEG2 systems features of the SAA7214 include the following • A dedicated interface to IEEE 1394 devices (such as Philips’ PDI 1394 chip set) • Parsing of TS, PS (HW) and proprietary (SW) data streams. Maximum input rate is 108 Mbits/s • Two UART (RS232) data ports with DMA capabilities (≤187.5 kbits/s) including hardware flow control RxD, TxD, RTS and CTS for modem support • A real-time, DVB compliant descrambler core, incorporating storage for up to 6 control word pairs • Two dedicated smart-card reader interfaces (ISO 7816 compatible) with DMA capabilities • HW section filtering based on 32 different PIDs with a flexible number of filter conditions (8 or 4 byte condition + 8 or 4 byte mask) per PID and a total filter capacity of 40 (8 byte condition checks) or up to 80 (4 byte condition checks) filter conditions. • Two I2C-bus master/slave transceivers supporting the standard (100 kbit/s) and fast (400 kbits/s) I2C-bus modes • 4 TS/PES filters for retrieval for data at TS or PES level for applications such as subtitling, TXT or retrieval of private • 32 general purpose, bidirectional I/O interface pins, the first 8 bits may also be used as interrupt inputs • Data • An elementary UART with DMA capabilities,(e.g. dedicated to front panel devices for instance) • Flexible DMA based storage of the 32 section sub streams and 4 TS/PES data substreams in the external memory • One PWM output (8-bit resolution) • A GP/HS interface supporting stream recording through IEEE 1394 IC • A JTAG interface for board test support. 2001 Mar 28 2 Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 • System time base management with a double counter mechanism for clock control and discontinuity handling The SAA7214 receives transport streams through a versatile stream input interface capable of handling both byte-parallel and bit-serial streams, in various formats, supporting data streams up to and including 13.5 Mbytes/s (108 Mbits/s). The stream data is first applied to an on-chip descrambler incorporating DVB descrambling algorithm, on the basis of 6 control word pairs stored in on-chip RAM. Demultiplexing is subsequently applied to the stream, to separate up to 32 individual data streams. • 2 PTS/DTS timers • A GP/HS filter which can serve as alternate input from for example EEE1394 devices. It can also output either scrambled or descrambled TS to IEEE 1394 devices. APPLICATIONS • Digital television decoder environment. The demultiplexer section includes clock recovery and timebase management. Program Specific Information (PSI), Service Information (SI), Conditional Access (CA) messages and private data are selected and stored in external memory, for subsequent off-line processing by the internal PR3001 CPU core. GENERAL DESCRIPTION SAA7214 system overview The device is part of a comprehensive source decoding kit which contains all the hardware and software required to receive and decode MPEG2 transport streams, including descrambling, demultiplexing. In addition, it includes a MIPS PR3001 RISC CPU core and several peripheral interfaces such as UARTs, I2C-bus units, and an IEEE 1284 (Centronics) interface. The SAA7214 is therefore capable of performing all controller tasks in digital television applications such as set-top boxes. The SAA7214 is compliant to DVB specification. 2001 Mar 28 To support advanced board testing facilities, the SAA7214 includes boundary scan test hardware, in accordance with the JTAG standard. The device features a low-power sleep mode, which is capable of sustaining set-top box standby functionality, thus eliminating the need for a separate front-panel controller. The SAA7214 requires a supply voltage of 3.3 V and some devices input and output interfaces are 5 V tolerant. The device is mounted in a SQFP208 package. 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... MIPS PR3001 CORE INPUT INTERFACE Demultiplexer Descrambler section PID FILTER DESCRAMBLER MPEG system-bus AV LTER AUDIO AND VIDEO INTERFACE DATA CACHE GP/HS INTERFACE 1394 GATEWAY INST. CACHE PCR PROCESSING TS/PES LTERS TIMER 1 SECTION LTERS Philips Semiconductors PWM Transport MPEG2 source decoder BLOCK DIAGRAM handbook, full pagewidth 2001 Mar 28 CPU section 4 LTER DMA CONTROLLER MPEG SYSTEM GATEWAY TIMER 2 M MPEG SYSTEM INT.HANDLER TIMER-WD 3 Reset Clock PI-bus S PI-BUS CTRL S EXTENSION BUS CONTROLLER M M CARDREADER 0 1 UART 0 1 2 S PIO INTERFACE S I2C 0 1 S 1284 RTC 32KHz S INTERRUPT CONTROLLER S 4 KBYTE S-RAM Peripheral section FCE105 SAA7214 Fig.1 Block diagram. Preliminary specification JTAG M Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 APPLICATION INFORMATION handbook, full pagewidth TDA8060 TDA5056 TUNER SAA8044 (SDD) I2C MPEG TS FRONT PANEL CONTROL Telco i/f VXX MODEM Smart cards TDA8004 BUFFERS SAA7214 1394 L+PHY IEE1384 RS232 IEEE1394 FLASH AV PES DRAM (OPTIONAL) 16 MBIT SDRAM SAA7215 (AVGD) 16 MBIT SDRAM (OPTIONAL) AUDIO DAC SWITCHING SCART1 SCART2 SCART3 Fig.2 Set-top box example. 2001 Mar 28 5 FCE106 Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 PACKAGE OUTLINE SQFP208: plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height SOT316-1 c y X A 156 157 105 104 ZE e E HE A A2 A1 (A 3) wM θ Lp bp L pin 1 index 208 detail X 53 52 1 ZD wM bp e v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 4.10 0.50 0.25 3.6 3.2 0.25 0.27 0.17 0.20 0.09 28.1 27.9 28.1 27.9 0.5 30.9 30.3 30.9 30.3 1.3 0.75 0.45 0.2 0.08 0.08 Z D (1) Z E (1) θ 1.39 1.11 8 0o 1.39 1.11 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT316-1 2001 Mar 28 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-12-27 00-01-25 MS-029 6 Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 2001 Mar 28 7 Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable(2) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Mar 28 8 Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. ICs with MPEG-2 functionality Use of this product in any manner that complies with the MPEG-2 Standard is expressly prohibited without a license under applicable patents in the MPEG-2 patent portfolio, which license is available from MPEG LA, L.L.C., 250 Steele Street, Suite 300, Denver, Colorado 80206. 2001 Mar 28 9 Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 2001 Mar 28 10 Philips Semiconductors Preliminary specification Transport MPEG2 source decoder SAA7214 NOTES 2001 Mar 28 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753504/03/pp12 Date of release: 2001 Mar 28 Document order number: 9397 750 08174