PHILIPS 74LVC1GU04

INTEGRATED CIRCUITS
DATA SHEET
74LVC1GU04
Inverter
Product specification
Supersedes data of 2000 Dec 12
File under Integrated Circuits, IC24
2001 Apr 06
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
FEATURES
DESCRIPTION
• Wide supply voltage range from 1.65 to 5.5 V
The 74LVC1GU04 is a high-performance, low-power,
low-voltage, Si-gate CMOS device, superior to most
advanced CMOS compatible TTL families.
• High noise immunity
• Complies with JEDEC standard:
The input can be driven from either 3.3 or 5 V devices.
This feature allows the use of this device in a mixed
3.3 and 5 V environment.
– JESD8-7 (1.65 to 1.95 V)
– JESD8-5 (2.3 to 2.7 V)
– JESD8B/JESD36 (2.7 to 3.6 V).
The 74LVC1GU04 provides the inverting single state
unbuffered function.
• ±24 mA output drive (VCC = 3.0 V)
• CMOS low power consumption
• Latch-up performance exceeds 250 mA
• Input accepts voltages up to 5 V
• SOT353 package.
QUICK REFERENCE DATA
Ground = 0 V; Tamb = 25 °C; tr = tf ≤ 2.5 ns.
SYMBOL
tPHL/tPLH
PARAMETER
propagation delay A to Y
CONDITIONS
TYPICAL
UNIT
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ
1.7
ns
VCC = 2.5 V; CL = 30 pF; RL = 500 Ω
1.3
ns
VCC = 3.3 V; CL = 50 pF; RL = 500 Ω
1.6
ns
VCC = 5.0 V; CL = 50 pF; RL = 500 Ω
1.3
ns
CI
input capacitance
6
pF
CPD
power dissipation capacitance per buffer notes 1 and 2
14.9
pF
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
2. The condition is VI = GND to VCC.
FUNCTION TABLE
See note 1.
INPUT
OUTPUT
A
Y
L
H
H
L
Note
1. H = HIGH voltage level;
L = LOW voltage level.
2001 Apr 06
2
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TEMPERATURE
RANGE
PINS
PACKAGE
MATERIAL
CODE
MARKING
−40 to +85 °C
5
SC-88A
plastic
SOT353
VD
74LVC1GU04GW
PINNING
PIN
SYMBOL
DESCRIPTION
1
n.c.
not connected
2
A
data input A
3
GND
ground (0 V)
4
Y
data output Y
5
VCC
supply voltage
handbook, halfpage
n.c. 1
A 2
GND
5 VCC
handbook, halfpage
2
U04
3
4
A
Y
Y
4
MNA108
MNA042
Fig.1 Pin configuration.
Fig.2 Logic symbol.
VCC
handbook, halfpage
handbook, halfpage
2
1
VCC
100 Ω
4
Y
A
MNA109
MNA636
Fig.3 IEE/IEC logic symbol.
2001 Apr 06
Fig.4 Logic diagram.
3
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
1.65
5.5
V
VI
input voltage
0
5.5
V
VO
output voltage
0
VCC
V
Tamb
operating ambient temperature
tr, tf
input rise and fall times
−40
+85
°C
VCC = 1.65 to 2.7 V
0
20
ns/V
VCC = 2.7 to 5.5 V
0
10
ns/V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
CONDITIONS
VCC
supply voltage
IIK
input diode current
VI < 0
MIN.
MAX.
UNIT
−0.5
+6.5
V
−
−50
mA
VI
input voltage
note 1
−0.5
+6.5
V
IOK
output diode current
VO > VCC or VO < 0
−
±50
mA
VO
output voltage
note 1
−0.5
VCC + 0.5
V
IO
output source or sink current
VO = 0 to VCC
−
±50
mA
ICC, IGND
VCC or GND current
−
±100
mA
Tstg
storage temperature
−65
+150
°C
PD
power dissipation per package
−
200
mW
for temperature range from
−40 to +85 °C; note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 55 °C the value of PD derates linearly with 2.5 mW/K.
2001 Apr 06
4
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
DC CHARACTERISTICS
At recommended operating conditions; voltage are referenced to GND (ground = 0 V).
Tamb (°C)
TEST CONDITIONS
SYMBOL
−40 to +85
PARAMETER
VCC (V)
OTHER
MIN.
TYP.(1)
UNIT
MAX.
VIH
HIGH-level input
voltage
1.65 to 5.5
0.75 × VCC −
−
V
VIL
LOW-level input
voltage
1.65 to 5.5
−
−
0.25 × VCC
V
VOL
LOW-level
output voltage
VI = VIH or VIL; IO = 100 µA
1.65 to 5.5
−
−
0.1
V
VI = VIH or VIL; IO = 4 mA
1.65
−
−
0.45
V
VI = VIH or VIL; IO = 8 mA
2.3
−
−
0.3
V
VI = VIH or VIL; IO = 12 mA
2.7
−
−
0.4
V
VI = VIH or VIL; IO = 24 mA
3.0
−
−
0.55
V
VI = VIH or VIL; IO = 32 mA
4.5
−
−
0.55
V
VOH
HIGH-level
output voltage
VI = VIH or VIL; IO = −100 µA 1.65 to 5.5
VCC − 0.1
−
−
V
VI = VIH or VIL; IO = −4 mA
1.65
1.2
−
−
V
VI = VIH or VIL; IO = −8 mA
2.3
1.9
−
−
V
VI = VIH or VIL; IO = −12 mA
2.7
2.2
−
−
V
VI = VIH or VIL; IO = −24 mA
3.0
2.3
−
−
V
VI = VIH or VIL; IO = −32 mA
4.5
3.8
−
−
V
VI = 5.5 V or GND
3.6
−
±0.1
±5
µA
5.5
−
0.1
10
µA
ILI
input leakage
current
ICC
quiescent supply VI = VCC or GND; IO = 0
current
Note
1. All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
2001 Apr 06
5
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
AC CHARACTERISTICS
GND = 0 V; tr = tf ≤ 2.0 ns.
TEST CONDITIONS
SYMBOL
Tamb (°C)
−40 to +85
PARAMETER
WAVEFORMS
tPHL/tPLH
propagation delay A to Y
see Figs 5 and 8
VCC (V)
MIN.
1.65 to 1.95
0.3
1.7
5.0
ns
0.3
1.3
4.0
ns
2.7
0.5
1.7
5.0
ns
3.0 to 3.6
0.5
1.6
3.7
ns
4.5 to 5.5
0.5
1.3
3.0
ns
VI
VM
A input
GND
t PHL
t PLH
VOH
VM
Y output
VOL
MNA637
INPUT
VCC
VM
VI
tr = t f
1.65 to 1.95 V
0.5 × VCC
VCC
≤ 2.0 ns
2.3 to 2.7 V
0.5 × VCC
VCC
≤ 2.0 ns
2.7 V
1.5 V
2.7 V
≤ 2.5 ns
3.0 to 3.6 V
1.5 V
2.7 V
≤ 2.5 ns
4.5 to 5.5 V
0.5 × VCC
VCC
≤ 2.5 ns
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.5 Input A to output Y propagation delay times.
2001 Apr 06
6
MAX.
2.3 to 2.7
AC WAVEFORMS
handbook, halfpage
TYP.
UNIT
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
MNA639
120
fs
(mA/V)
100
handbook,
halfpage
G
handbook, halfpage
Rbias = 560 kΩ
80
VCC
0.47 µF
input
output
Vi
60
100 µF
40
A Io
MNA638
20
∆I
G fs = --------o∆V i
0
0
2
fi = 1 kHz.
VO is constant.
Tamb = 25 °C.
Fig.6
Fig.7
Test set-up for measuring forward
transconductance.
VEXT
VCC
VI
RL
VO
D.U.T.
CL
RT
RL
MNA616
VCC
VEXT
VI
CL
VCC
30 pF
1 kΩ
2.3 to 2.7 V
VCC
30 pF
500 Ω
open
GND
2 × VCC
2.7 V
2.7 V
50 pF
500 Ω
open
GND
6V
3.0 to 3.6 V
2.7 V
50 pF
500 Ω
open
GND
6V
4.5 to 5.5 V
VCC
50 pF
500 Ω
open
GND
2 × VCC
1.65 to 1.95 V
RL
tPLH/tPHL
open
tPZH/tPHZ
GND
tPZL/tPLZ
2 × VCC
Definitions for test circuit:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance (see Chapter “AC characteristics”).
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.8 Load circuitry for switching times.
2001 Apr 06
7
VCC (V)
Typical forward transconductance as
a function of supply voltage.
handbook, full pagewidth
PULSE
GENERATOR
4
6
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
APPLICATION INFORMATION
Some applications for the 74LVC1GU04 are:
• Linear amplifier (see Fig.9)
• Crystal oscillator (see Fig.10).
Remark to the application information.
All values given are typical values unless otherwise
specified.
R2
handbook, halfpage
VCC
1 µF
handbook, halfpage
R1
U04
R1
ZL
R2
U04
MNA052
C1
C2
out
MNA053
ZL > 10 kΩ, R1 ≥ 3 kΩ and R2 ≤ 1 MΩ.
Open loop amplification: AOL = 20 (typical value).
A OL
Voltage amplification: A u = – ------------------------------------------R1
1 + -------- ( 1 + A OL )
R2
C1 = 47 pF (typical).
C2 = 22 pF (typical).
R1 = 1 to 10 MΩ (typical).
Maximum output voltage: V o(p-p) ≈ V CC – 1.5 V centered at 0.5V CC
R2 optimum value depends on the frequency and required stability
against changes in VCC or average minimum ICC (ICC = 2 mA (typical)
at VCC = 3.3 V and f = 10 MHz).
Unity gain bandwidth product: B = 5 MHz (typical value).
Fig.9 Used as a linear amplifier.
2001 Apr 06
Fig.10 Crystal oscillator configuration.
8
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
PACKAGE OUTLINE
Plastic surface mounted package; 5 leads
SOT353
D
E
B
y
X
A
HE
5
v M A
4
Q
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E (2)
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT353
2001 Apr 06
REFERENCES
IEC
JEDEC
EIAJ
SC-88A
9
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Apr 06
10
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Apr 06
11
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Apr 06
12
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
NOTES
2001 Apr 06
13
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
NOTES
2001 Apr 06
14
Philips Semiconductors
Product specification
Inverter
74LVC1GU04
NOTES
2001 Apr 06
15
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 7 - 9 Rue du Mont Valérien, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4728 6600, Fax. +33 1 4728 6638
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,
Tel: +36 1 382 1700, Fax: +36 1 382 1800
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 72
© Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/02/pp16
Date of release: 2001
Apr 06
Document order number:
9397 750 07991