PHILIPS 74AVC2T45GN

74AVC2T45
Dual-bit, dual-supply voltage level translator/transceiver;
3-state
Rev. 7 — 8 February 2013
Product data sheet
1. General description
The 74AVC2T45 is a dual-bit, dual-supply transceiver that enables bidirectional level
translation. It features two data input-output ports (nA and nB), a direction control input
(DIR) and dual-supply pins (VCC(A) and VCC(B)). Both VCC(A) and VCC(B) can be supplied at
any voltage between 0.8 V and 3.6 V making the device suitable for translating between
any of the low voltage nodes (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V). Pins nA and DIR
are referenced to VCC(A) and pins nB are referenced to VCC(B). A HIGH on DIR allows
transmission from nA to nB and a LOW on DIR allows transmission from nB to nA.
The device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing any damaging backflow current through the
device when it is powered down. In Suspend mode when either VCC(A) or VCC(B) are at
GND level, both A and B are in the high-impedance OFF-state.
2. Features and benefits
 Wide supply voltage range:
 VCC(A): 0.8 V to 3.6 V
 VCC(B): 0.8 V to 3.6 V
 High noise immunity
 Complies with JEDEC standards:
 JESD8-12 (0.8 V to 1.3 V)
 JESD8-11 (0.9 V to 1.65 V)
 JESD8-7 (1.2 V to 1.95 V)
 JESD8-5 (1.8 V to 2.7 V)
 JESD8-B (2.7 V to 3.6 V)
 ESD protection:
 HBM JESD22-A114F Class 3B exceeds 8000 V
 MM JESD22-A115-A exceeds 200 V
 CDM JESD22-C101C exceeds 1000 V
 Maximum data rates:
 500 Mbit/s (1.8 V to 3.3 V translation)
 320 Mbit/s (<1.8 V to 3.3 V translation)
 320 Mbit/s (translate to 2.5 V or 1.8 V)
 280 Mbit/s (translate to 1.5 V)
 240 Mbit/s (translate to 1.2 V)
 Suspend mode
 Latch-up performance exceeds 100 mA per JESD 78 Class II
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state





Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74AVC2T45DP
40 C to +125 C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74AVC2T45DC
40 C to +125 C
VSSOP8
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
74AVC2T45GT
40 C to +125 C
XSON8
plastic extremely thin small outline package; no leads; SOT833-1
8 terminals; body 1  1.95  0.5 mm
74AVC2T45GF
40 C to +125 C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.35  1  0.5 mm
74AVC2T45GD
40 C to +125 C
XSON8
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; body 3  2  0.5 mm
74AVC2T45GN
40 C to +125 C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.2  1.0  0.35 mm
SOT1116
74AVC2T45GS
40 C to +125 C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.35  1.0  0.35 mm
SOT1203
SOT1089
4. Marking
Table 2.
Marking
Type number
Marking code[1]
74AVC2T45DP
B45
74AVC2T45DC
B45
74AVC2T45GT
B45
74AVC2T45GF
B5
74AVC2T45GD
B45
74AVC2T45GN
B5
74AVC2T45GS
B5
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
2 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
5. Functional diagram
DIR
5
DIR
1A
2
1A
7
1B
1B
2A
3
2A
6
2B
2B
VCC(A)
VCC(B)
VCC(A)
VCC(B)
001aag577
Fig 1.
001aag578
Logic symbol
Fig 2.
Logic diagram
6. Pinning information
6.1 Pinning
74AVC2T45
VCC(A)
1
8
VCC(B)
1A
2
7
1B
2A
3
6
2B
GND
4
5
DIR
001aag579
Fig 3.
Pin configuration SOT505-2 and SOT765-1
74AVC2T45
VCC(A)
1
8
VCC(B)
1A
2
7
1B
2A
3
6
2B
GND
4
5
74AVC2T45
DIR
VCC(A)
1
8
VCC(B)
1A
2
7
1B
2A
3
6
2B
GND
4
5
DIR
001aag580
001aai261
Transparent top view
Transparent top view
Fig 4.
Pin configuration SOT833-1, SOT1089,
SOT1116 and SOT1203
74AVC2T45
Product data sheet
Fig 5.
Pin configuration SOT996-2
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Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
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74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
VCC(A)
1
supply voltage A (referenced to pins 1A, 2A and DIR)
1A
2
data input or output
2A
3
data input or output
GND
4
ground (0 V)
DIR
5
direction control
2B
6
data input or output
1B
7
data input or output
VCC(B)
8
supply voltage B (referenced to pins 1B and 2B)
7. Functional description
Table 4.
Function table[1]
Supply voltage
Input
Input/output[2]
VCC(A), VCC(B)
DIR[3]
nA
nB
0.8 V to 3.6 V
L
nA = nB
input
0.8 V to 3.6 V
H
input
nB = nA
GND[4]
X
Z
Z
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
[2]
The input circuit of the data I/O is always active.
[3]
The DIR input circuit is referenced to VCC(A).
[4]
If at least one of VCC(A) or VCC(B) is at GND level, the device goes into Suspend mode.
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
4 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC(A)
supply voltage A
VCC(B)
supply voltage B
IIK
input clamping current
VI
input voltage
IOK
output clamping current
output voltage
VO
Conditions
VI < 0 V
[1]
Max
Unit
0.5
+4.6
V
0.5
+4.6
V
50
-
mA
0.5
+4.6
V
mA
50
-
[1][2][3]
0.5
VCCO + 0.5
V
[1]
0.5
+4.6
V
VO < 0 V
Active mode
Min
Suspend or 3-state mode
IO
output current
VO = 0 V to VCCO
-
50
mA
ICC
supply current
ICC(A) or ICC(B)
-
100
mA
IGND
ground current
100
-
mA
Tstg
storage temperature
65
+150
C
-
250
mW
total power dissipation
Ptot
[1]
Tamb = 40 C to +125 C
The minimum input voltage rating and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
VCCO is the supply voltage associated with the output port.
[3]
VCCO + 0.5 V should not exceed 4.6 V.
[4]
[4]
For TSSOP8 package: above 55 C the value of Ptot derates linearly at 2.5 mW/K.
For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K.
For XSON8 packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Symbol
Parameter
Min
Max
Unit
VCC(A)
supply voltage A
Conditions
0.8
3.6
V
VCC(B)
supply voltage B
0.8
3.6
V
VI
input voltage
0
3.6
V
output voltage
VO
Active mode
[1]
Suspend or 3-state mode
Tamb
t/V
ambient temperature
input transition rise and fall rate
VCCI = 0.8 V to 3.6 V
[1]
VCCO is the supply voltage associated with the output port.
[2]
VCCI is the supply voltage associated with the input port.
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
[2]
0
VCCO
V
0
3.6
V
40
+125
C
-
5
ns/V
© NXP B.V. 2013. All rights reserved.
5 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
10. Static characteristics
Table 7.
Typical static characteristics at Tamb = 25 C[1][2]
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
VOH
HIGH-level output voltage
VI = VIH or VIL
VOL
LOW-level output voltage
VI = VIH or VIL
IO = 1.5 mA; VCC(A) = VCC(B) = 0.8 V
IO = 1.5 mA; VCC(A) = VCC(B) = 0.8 V
Min
Typ
Max
Unit
-
0.69
-
V
-
0.07
-
V
-
0.025 0.25 A
-
0.5
2.5
A
II
input leakage current
DIR input; VI = 0 V or 3.6 V;
VCC(A) = VCC(B) = 0.8 V to 3.6 V
IOZ
OFF-state output current
A or B port; VO = 0 V or VCCO;
VCC(A) = VCC(B) = 0.8 V to 3.6 V
IOFF
power-off leakage current
A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0.8 V to 3.6 V
-
0.1
1
A
B port; VI or VO = 0 V to 3.6 V;
VCC(B) = 0 V; VCC(A) = 0.8 V to 3.6 V
-
0.1
1
A
[3]
CI
input capacitance
DIR input; VI = 0 V or 3.3 V;
VCC(A) = VCC(B) = 3.3 V
-
1.0
-
pF
CI/O
input/output capacitance
A and B port; Suspend mode;
VO = VCCO or GND; VCC(A) = VCC(B) = 3.3 V
-
4.0
-
pF
[1]
VCCO is the supply voltage associated with the output port.
[2]
VCCI is the supply voltage associated with the data input port.
[3]
For I/O ports, the parameter IOZ includes the input leakage current.
Table 8.
Static characteristics [1][2]
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIH
HIGH-level
input voltage
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Max
Min
Max
VCCI = 0.8 V
0.70VCCI
-
0.70VCCI
-
V
VCCI = 1.1 V to 1.95 V
0.65VCCI
-
0.65VCCI
-
V
VCCI = 2.3 V to 2.7 V
1.6
-
1.6
-
V
VCCI = 3.0 V to 3.6 V
2
-
2
-
V
VCC(A) = 0.8 V
0.70VCC(A)
-
0.70VCC(A)
-
V
VCC(A) = 1.1 V to 1.95 V
0.65VCC(A)
-
0.65VCC(A)
-
V
VCC(A) = 2.3 V to 2.7 V
1.6
-
1.6
-
V
VCC(A) = 3.0 V to 3.6 V
2
-
2
-
V
data input
DIR input
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
6 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
Table 8.
Static characteristics …continued[1][2]
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIL
LOW-level
input voltage
40 C to +85 C
Conditions
40 C to +125 C
Min
Max
Min
Max
Unit
data input
VCCI = 0.8 V
-
0.30VCCI
-
0.30VCCI
V
VCCI = 1.1 V to 1.95 V
-
0.35VCCI
-
0.35VCCI
V
VCCI = 2.3 V to 2.7 V
-
0.7
-
0.7
V
VCCI = 3.0 V to 3.6 V
-
0.9
-
0.9
V
VCC(A) = 0.8 V
-
0.30VCC(A)
-
0.30VCC(A) V
VCC(A) = 1.1 V to 1.95 V
-
0.35VCC(A)
-
0.35VCC(A) V
VCC(A) = 2.3 V to 2.7 V
-
0.7
-
0.7
V
VCC(A) = 3.0 V to 3.6 V
-
0.9
-
0.9
V
VCCO  0.1
-
VCCO  0.1
-
V
IO = 3 mA;
VCC(A) = VCC(B) = 1.1 V
0.85
-
0.85
-
V
IO = 6 mA;
VCC(A) = VCC(B) = 1.4 V
1.05
-
1.05
-
V
IO = 8 mA;
VCC(A) = VCC(B) = 1.65 V
1.2
-
1.2
-
V
IO = 9 mA;
VCC(A) = VCC(B) = 2.3 V
1.75
-
1.75
-
V
IO = 12 mA;
VCC(A) = VCC(B) = 3.0 V
2.3
-
2.3
-
V
-
0.1
-
0.1
V
IO = 3 mA; VCC(A) = VCC(B) = 1.1 V
-
0.25
-
0.25
V
IO = 6 mA; VCC(A) = VCC(B) = 1.4 V
-
0.35
-
0.35
V
IO = 8 mA;
VCC(A) = VCC(B) = 1.65 V
-
0.45
-
0.45
V
IO = 9 mA; VCC(A) = VCC(B) = 2.3 V
-
0.55
-
0.55
V
IO = 12 mA;
VCC(A) = VCC(B) = 3.0 V
-
0.7
-
0.7
V
-
1
-
1.5
A
-
5
-
7.5
A
DIR input
VOH
VOL
HIGH-level
VI = VIH or VIL
output voltage
IO = 100 A;
VCC(A) = VCC(B) = 0.8 V to 3.6 V
LOW-level
VI = VIH or VIL
output voltage
IO = 100 A;
VCC(A) = VCC(B) = 0.8 V to 3.6 V
II
input leakage
current
DIR input; VI = 0 V or 3.6 V;
VCC(A) = VCC(B) = 0.8 V to 3.6 V
IOZ
OFF-state
output current
A or B port; VO = 0 V or VCCO;
VCC(A) = VCC(B) = 3.6 V
IOFF
power-off
leakage
current
A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0.8 V to 3.6 V
-
5
-
35
A
B port; VI or VO = 0 V to 3.6 V;
VCC(B) = 0 V; VCC(A) = 0.8 V to 3.6 V
-
5
-
35
A
74AVC2T45
Product data sheet
[3]
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
7 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
Table 8.
Static characteristics …continued[1][2]
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
ICC
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Max
Min
Max
VCC(A) = 0.8 V to 3.6 V;
VCC(B) = 0.8 V to 3.6 V
-
8
-
11.5
A
VCC(A) = 3.6 V; VCC(B) = 0 V
-
8
-
11.5
A
VCC(A) = 0 V; VCC(B) = 3.6 V
2
-
8
-
A
-
8
-
11.5
A
VCC(A) = 3.6 V; VCC(B) = 0 V
2
-
8
-
A
VCC(A) = 0 V; VCC(B) = 3.6 V
-
8
-
11.5
A
-
16
-
23
A
supply current A port; VI = 0 V or VCCI; IO = 0 A
B port; VI = 0 V or VCCI; IO = 0 A
VCC(A) = 0.8 V to 3.6 V;
VCC(B) = 0.8 V to 3.6 V
A plus B port (ICC(A) + ICC(B));
IO = 0 A; VI = 0 V or VCCI;
VCC(A) = 0.8 V to 3.6 V;
VCC(B) = 0.8 V to 3.6 V
[1]
VCCO is the supply voltage associated with the output port.
[2]
VCCI is the supply voltage associated with the data input port.
[3]
For I/O ports, the parameter IOZ includes the input leakage current.
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
8 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
11. Dynamic characteristics
Table 9.
Typical dynamic characteristics at VCC(A) = 0.8 V and Tamb = 25 C [1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7
Symbol Parameter
Conditions
VCC(B)
0.8 V
tpd
[1]
1.8 V
2.5 V
3.3 V
15.5
8.1
7.6
7.7
8.4
9.2
ns
B to A
15.5
12.7
12.3
12.2
12.0
11.8
ns
DIR to A
12.2
12.2
12.2
12.2
12.2
12.2
ns
DIR to B
11.7
7.9
7.6
8.2
8.7
10.2
ns
enable time
ten
1.5 V
propagation delay A to B
disable time
tdis
1.2 V
Unit
DIR to A
27.2
20.6
19.9
20.4
20.7
22.0
ns
DIR to B
27.7
20.3
19.8
19.9
20.6
21.4
ns
tpd is the same as tPLH and tPHL; tdis is the same as tPLZ and tPHZ; ten is the same as tPZL and tPZH.
ten is a calculated value using the formula shown in Section 13.4 “Enable times”
Table 10. Typical dynamic characteristics at VCC(B) = 0.8 V and Tamb = 25 C [1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7
Symbol Parameter
tpd
[1]
Unit
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
propagation delay A to B
15.5
12.7
12.3
12.2
12.0
11.8
ns
B to A
15.5
8.1
7.6
7.7
8.4
9.2
ns
enable time
ten
VCC(A)
0.8 V
disable time
tdis
Conditions
DIR to A
12.2
4.9
3.8
3.7
2.8
3.4
ns
DIR to B
11.7
9.2
9.0
8.8
8.7
8.6
ns
DIR to A
27.2
17.3
16.6
16.5
17.1
17.8
ns
DIR to B
27.7
17.6
16.1
15.9
14.8
15.2
ns
tpd is the same as tPLH and tPHL; tdis is the same as tPLZ and tPHZ; ten is the same as tPZL and tPZH.
ten is a calculated value using the formula shown in Section 13.4 “Enable times”
Table 11. Typical power dissipation capacitance at VCC(A) = VCC(B) and Tamb = 25 C [1][2]
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
power dissipation
capacitance
CPD
[1]
Conditions
VCC(A) and VCC(B)
Unit
0.8 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
A port: (direction A to B);
B port: (direction B to A)
1
2
2
2
2
2
pF
A port: (direction B to A);
B port: (direction A to B)
9
11
11
12
14
17
pF
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC2  fo) = sum of the outputs.
[2]
fi = 10 MHz; VI = GND to VCC; tr = tf = 1 ns; CL = 0 pF; RL =  .
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
9 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
Table 12. Dynamic characteristics for temperature range 40 C to +85 C [1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
1.2 V  0.1 V
1.5 V  0.1 V 1.8 V  0.15 V 2.5 V  0.2 V
3.3 V  0.3 V
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0.5
5.7
0.5
6.1
ns
VCC(A) = 1.1 V to 1.3 V
tpd
propagation
delay
A to B
1.0
9.0
0.7
6.8
0.6
6.1
B to A
1.0
9.0
0.8
8.0
0.7
7.7
0.6
7.2
0.5
7.1
ns
tdis
disable time
DIR to A
2.2
8.8
2.2
8.8
2.2
8.8
2.2
8.8
2.2
8.8
ns
DIR to B
2.2
8.4
1.8
6.7
2.0
6.9
1.7
6.2
2.4
7.2
ns
DIR to A
-
17.4
-
14.7
-
14.6
-
13.4
-
14.3
ns
DIR to B
-
17.8
-
15.6
-
14.9
-
14.5
-
14.9
ns
A to B
1.0
8.0
0.7
5.4
0.6
4.6
0.5
3.7
0.5
3.5
ns
B to A
1.0
6.8
0.8
5.4
0.7
5.1
0.6
4.7
0.5
4.5
ns
enable time
ten
VCC(A) = 1.4 V to 1.6 V
propagation
delay
tpd
disable time
tdis
enable time
ten
DIR to A
1.6
6.3
1.6
6.3
1.6
6.3
1.6
6.3
1.6
6.3
ns
DIR to B
2.0
7.6
1.8
5.9
1.6
6.0
1.2
4.8
1.7
5.5
ns
DIR to A
-
14.4
-
11.3
-
11.1
-
9.5
-
10.0
ns
DIR to B
-
14.3
-
11.7
-
10.9
-
10.0
-
9.8
ns
VCC(A) = 1.65 V to 1.95 V
propagation
delay
A to B
1.0
7.7
0.6
5.1
0.5
4.3
0.5
3.4
0.5
3.1
ns
B to A
1.0
6.1
0.7
4.6
0.5
4.4
0.5
3.9
0.5
3.7
ns
tdis
disable time
DIR to A
1.6
5.5
1.6
5.5
1.6
5.5
1.6
5.5
1.6
5.5
ns
DIR to B
1.8
7.7
1.8
5.7
1.4
5.8
1.0
4.5
1.5
5.2
ns
ten
enable time
DIR to A
-
13.8
-
10.3
-
10.2
-
8.4
-
8.9
ns
DIR to B
-
13.2
-
10.6
-
9.8
-
8.9
-
8.6
ns
tpd
VCC(A) = 2.3 V to 2.7 V
tpd
tdis
propagation
delay
A to B
1.0
7.2
0.5
4.7
0.5
3.9
0.5
3.0
0.5
2.6
ns
B to A
1.0
5.7
0.6
3.8
0.5
3.4
0.5
3.0
0.5
2.8
ns
disable time
DIR to A
1.5
4.2
1.5
4.2
1.5
4.2
1.5
4.2
1.5
4.2
ns
DIR to B
1.7
7.3
2.0
5.2
1.5
5.1
0.6
4.2
1.1
4.8
ns
DIR to A
-
13.0
-
9.0
-
8.5
-
7.2
-
7.6
ns
DIR to B
-
11.4
-
8.9
-
8.1
-
7.2
-
6.8
ns
0.5
2.8
0.5
2.4
ns
enable time
ten
VCC(A) = 3.0 V to 3.6 V
tpd
propagation
delay
A to B
1.0
7.1
0.5
4.5
0.5
3.7
B to A
1.0
6.1
0.6
3.6
0.5
3.1
0.5
2.6
0.5
2.4
ns
tdis
disable time
DIR to A
1.5
4.7
1.5
4.7
1.5
4.7
1.5
4.7
1.5
4.7
ns
DIR to B
1.7
7.2
0.7
5.5
0.6
5.5
0.7
4.1
1.7
4.7
ns
DIR to A
-
13.3
-
9.1
-
8.6
-
6.7
-
7.1
ns
DIR to B
-
11.8
-
9.2
-
8.4
-
7.5
-
7.1
ns
enable time
ten
[1]
tpd is the same as tPLH and tPHL; tdis is the same as tPLZ and tPHZ; ten is the same as tPZL and tPZH.
ten is a calculated value using the formula shown in Section 13.4 “Enable times”
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
10 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
Table 13. Dynamic characteristics for temperature range 40 C to +125 C [1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7
Symbol Parameter
Conditions
VCC(B)
Unit
1.2 V  0.1 V
1.5 V  0.1 V 1.8 V  0.15 V 2.5 V  0.2 V
3.3 V  0.3 V
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
VCC(A) = 1.1 V to 1.3 V
tpd
propagation
delay
A to B
1.0
9.9
0.7
7.5
0.6
6.8
0.5
6.3
0.5
6.8
ns
B to A
1.0
9.9
0.8
8.8
0.7
8.5
0.6
8.0
0.5
7.9
ns
tdis
disable time
DIR to A
2.2
9.7
2.2
9.7
2.2
9.7
2.2
9.7
2.2
9.7
ns
DIR to B
2.2
9.2
1.8
7.4
2.0
7.6
1.7
6.9
2.4
8.0
ns
DIR to A
-
19.1
-
16.2
-
16.1
-
14.9
-
15.9
ns
DIR to B
-
19.6
-
17.2
-
16.5
-
16.0
-
16.5
ns
A to B
1.0
8.8
0.7
6.0
0.6
5.1
0.5
4.1
0.5
3.9
ns
B to A
1.0
7.5
0.8
6.0
0.7
5.7
0.6
5.2
0.5
5.0
ns
enable time
ten
VCC(A) = 1.4 V to 1.6 V
propagation
delay
tpd
disable time
tdis
enable time
ten
DIR to A
1.6
7.0
1.6
7.0
1.6
7.0
1.6
7.0
1.6
7.0
ns
DIR to B
2.0
8.3
1.8
6.5
1.6
6.6
1.2
5.3
1.7
6.1
ns
DIR to A
-
15.8
-
12.5
-
12.3
-
10.5
-
11.1
ns
DIR to B
-
15.8
-
13.0
-
12.1
-
11.1
-
10.9
ns
VCC(A) = 1.65 V to 1.95 V
propagation
delay
A to B
1.0
8.5
0.6
5.7
0.5
4.8
0.5
3.8
0.5
3.5
ns
B to A
1.0
6.8
0.7
5.1
0.5
4.9
0.5
4.3
0.5
4.1
ns
tdis
disable time
DIR to A
1.6
6.1
1.6
6.1
1.6
6.1
1.6
6.1
1.6
6.1
ns
DIR to B
1.8
8.5
1.8
6.3
1.4
6.4
1.0
5.0
1.5
5.8
ns
ten
enable time
DIR to A
-
15.3
-
11.4
-
11.3
-
9.3
-
9.9
ns
DIR to B
-
14.6
-
11.8
-
10.9
-
9.9
-
9.6
ns
tpd
VCC(A) = 2.3 V to 2.7 V
tpd
tdis
propagation
delay
A to B
1.0
8.0
0.5
5.2
0.5
4.3
0.5
3.3
0.5
2.9
ns
B to A
1.0
6.3
0.6
4.2
0.5
3.8
0.5
3.3
0.5
3.1
ns
disable time
DIR to A
1.5
4.7
1.5
4.7
1.5
4.7
1.5
4.7
1.5
4.7
ns
DIR to B
1.7
8.0
2.0
5.8
1.5
5.7
0.6
4.7
1.1
5.3
ns
DIR to A
-
14.3
-
10.0
-
9.5
-
8.0
-
8.4
ns
DIR to B
-
12.7
-
9.9
-
9.0
-
8.0
-
7.6
ns
enable time
ten
VCC(A) = 3.0 V to 3.6 V
tpd
propagation
delay
A to B
1.0
7.9
0.5
5.0
0.5
4.1
0.5
3.1
0.5
2.7
ns
B to A
1.0
6.8
0.6
4.0
0.5
3.5
0.5
2.9
0.5
2.7
ns
tdis
disable time
DIR to A
1.5
5.2
1.5
5.2
1.5
5.2
1.5
5.2
1.5
5.2
ns
DIR to B
1.7
7.9
0.7
6.1
0.6
6.1
0.7
4.6
1.7
5.2
ns
DIR to A
-
14.7
-
10.1
-
9.6
-
7.5
-
7.9
ns
DIR to B
-
13.1
-
10.2
-
9.3
-
8.3
-
7.9
ns
enable time
ten
[1]
tpd is the same as tPLH and tPHL; tdis is the same as tPLZ and tPHZ; ten is the same as tPZL and tPZH.
ten is a calculated value using the formula shown in Section 13.4 “Enable times”
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
11 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
12. Waveforms
VI
VM
nA, nB input
GND
tPLH
tPHL
VOH
VM
nB, nA output
001aak114
VOL
Measurement points are given in Table 14.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6.
The data input (nA, nB) to output (nB, nA) propagation delay times
VI
DIR input
VM
GND
t PLZ
output
LOW-to-OFF
OFF-to-LOW
t PZL
VCCO
VM
VX
VOL
t PHZ
VOH
t PZH
VY
output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aae968
Measurement points are given in Table 14.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7.
Table 14.
Enable and disable times
Measurement points
Supply voltage
Input[1]
Output[2]
VCC(A), VCC(B)
VM
VM
VX
VY
1.1 V to 1.6 V
0.5VCCI
0.5VCCO
VOL + 0.1 V
VOH  0.1 V
1.65 V to 2.7 V
0.5VCCI
0.5VCCO
VOL + 0.15 V
VOH  0.15 V
3.0 V to 3.6 V
0.5VCCI
0.5VCCO
VOL + 0.3 V
VOH  0.3 V
[1]
VCCI is the supply voltage associated with the data input port.
[2]
VCCO is the supply voltage associated with the output port.
74AVC2T45
Product data sheet
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Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
12 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
tW
VI
90 %
negative
pulse
VM
VM
10 %
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
VM
VM
10 %
0V
tW
VEXT
VCC
VI
RL
VO
G
DUT
RT
RL
CL
001aae331
Test data is given in Table 15.
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance.
VEXT = External voltage for measuring switching times.
Fig 8.
Table 15.
Test circuit for measuring switching times
Test data
Supply voltage
Input
VCC(A), VCC(B)
VI[1]
t/V[2]
CL
RL
tPLH, tPHL
tPZH, tPHZ
tPZL, tPLZ[3]
1.1 V to 1.6 V
VCCI
 1.0 ns/V
15 pF
2 k
open
GND
2VCCO
1.65 V to 2.7 V
VCCI
 1.0 ns/V
15 pF
2 k
open
GND
2VCCO
3.0 V to 3.6 V
VCCI
 1.0 ns/V
15 pF
2 k
open
GND
2VCCO
[1]
Load
VEXT
VCCI is the supply voltage associated with the data input port.
[2]
dV/dt  1.0 V/ns
[3]
VCCO is the supply voltage associated with the output port.
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
13 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
13. Application information
13.1 Unidirectional logic level-shifting application
The circuit given in Figure 9 is an example of the 74AVC2T45 being used in an
unidirectional logic level-shifting application.
VCC1
VCC(A)
VCC1
VCC2
74AVC2T45
1A
2A
GND
VCC1
1
8
2
7
3
6
4
5
system-1
VCC(B)
VCC2
1B
2B
DIR
VCC2
system-2
001aag581
Fig 9.
Unidirectional logic level-shifting application
Table 16.
74AVC2T45
Product data sheet
Unidirectional logic level-shifting application
Pin
Name
Function
Description
1
VCC(A)
VCC1
supply voltage of system-1 (0.8 V to 3.6 V)
2
1A
OUT1
output level depends on VCC1 voltage
3
2A
OUT2
output level depends on VCC1 voltage
4
GND
GND
device GND
5
DIR
DIR
the GND (LOW level) determines B port to A port direction
6
2B
IN2
input threshold value depends on VCC2 voltage
7
1B
IN1
input threshold value depends on VCC2 voltage
8
VCC(B)
VCC2
supply voltage of system-2 (0.8 V to 3.6 V)
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
14 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
13.2 Bidirectional logic level-shifting application
Figure 10 shows the 74AVC2T45 being used in a bidirectional logic level-shifting
application. Since the device does not have an output enable (OE) pin, the system
designer should take precautions to avoid bus contention between system-1 and
system-2 when changing directions.
VCC1
VCC2
VCC1
VCC2
74AVC2T45
I/O-1
PULL-UP/DOWN
VCC(A)
8
1
1A
2A
GND
2
7
3
6
4
5
VCC(B)
PULL-UP/DOWN
I/O-2
1B
2B
DIR
DIR CTRL
DIR CTRL
system-2
system-1
001aag582
System-1 and system-2 must use the same conditions, i.e., both pull-up or both pull-down.
Fig 10. Bidirectional logic level-shifting application
Table 17 gives a sequence that will illustrate data transmission from system-1 to system-2
and then from system-2 to system-1.
Table 17.
Bidirectional logic level-shifting application[1][2]
State DIR CTRL I/O-1
I/O-2
Description
1
H
output
input
system-1 data to system-2
2
H
Z
Z
system-2 is getting ready to send data to system-1.
I/O-1 and I/O-2 are disabled. The bus-line state
depends on the pull-up or pull-down.
3
L
Z
Z
DIR bit is set LOW. I/O-1 and I/O-2 still are disabled.
The bus-line state depends on the pull-up or pull-down.
4
L
input
output
system-2 data to system-1
[1]
[2]
System-1 and system-2 must use the same conditions, i.e., both pull-up or both pull-down.
H = HIGH voltage level;
L = LOW voltage level;
Z = high-impedance OFF-state.
74AVC2T45
Product data sheet
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Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
15 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
13.3 Power-up considerations
The device is designed such that no special power-up sequence is required other than
GND being applied first.
Table 18.
Typical total supply current (ICC(A) + ICC(B))
VCC(A)
VCC(B)
Unit
0V
0.8 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0V
0
0.1
0.1
0.1
0.1
0.1
0.1
A
0.8 V
0.1
0.1
0.1
0.1
0.1
0.7
2.3
A
1.2 V
0.1
0.1
0.1
0.1
0.1
0.3
1.4
A
1.5 V
0.1
0.1
0.1
0.1
0.1
0.1
0.9
A
1.8 V
0.1
0.1
0.1
0.1
0.1
0.1
0.5
A
2.5 V
0.1
0.7
0.3
0.1
0.1
0.1
0.1
A
3.3 V
0.1
2.3
1.4
0.9
0.5
0.1
0.1
A
13.4 Enable times
The enable times for the 74AVC2T45 are calculated from the following formulas:
• ten (DIR to nA) = tdis (DIR to nB) + tpd (nB to nA)
• ten (DIR to nB) = tdis (DIR to nA) + tpd (nA to nB)
In a bidirectional application, these enable times provide the maximum delay from the
time the DIR bit is switched until an output is expected. For example, if the 74AVC2T45
initially is transmitting from A to B, then the DIR bit is switched, the B port of the device
must be disabled before presenting it with an input. After the B port has been disabled, an
input signal applied to it appears on the corresponding A port after the specified
propagation delay.
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
16 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
14. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
D
E
A
SOT505-2
X
c
HE
y
v M A
Z
5
8
A
A2
(A3)
A1
pin 1 index
θ
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.00
0.95
0.75
0.25
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.5
0.47
0.33
0.2
0.13
0.1
0.70
0.35
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-2
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-01-16
---
Fig 11. Package outline SOT505-2 (TSSOP8)
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
17 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
D
E
SOT765-1
A
X
c
y
HE
v M A
Z
5
8
Q
A
A2
A1
pin 1 index
(A3)
θ
Lp
1
4
e
L
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
Q
v
w
y
Z(1)
θ
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.40
0.15
0.21
0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT765-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
MO-187
Fig 12. Package outline SOT765-1 (VSSOP8)
74AVC2T45
Product data sheet
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Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
18 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
1
2
SOT833-1
b
4
3
4×
(2)
L
L1
e
8
7
6
e1
5
e1
e1
8×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
2.0
1.9
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT833-1
---
MO-252
---
EUROPEAN
PROJECTION
ISSUE DATE
07-11-14
07-12-07
Fig 13. Package outline SOT833-1 (XSON8)
74AVC2T45
Product data sheet
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Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
19 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1 x 0.5 mm
SOT1089
E
terminal 1
index area
D
A
A1
detail X
(4×)(2)
e
L
(8×)(2)
b 4
5
e1
1
terminal 1
index area
8
L1
X
0
0.5
scale
Dimensions
Unit
mm
max
nom
min
1 mm
A(1)
0.5
A1
b
D
E
e
e1
L
L1
0.35 0.40
0.04 0.20 1.40 1.05
0.15 1.35 1.00 0.55 0.35 0.30 0.35
0.27 0.32
0.12 1.30 0.95
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
SOT1089
sot1089_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-09
10-04-12
MO-252
Fig 14. Package outline SOT1089 (XSON8)
74AVC2T45
Product data sheet
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Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
20 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
XSON8: plastic extremely thin small outline package; no leads;
8 terminals; body 3 x 2 x 0.5 mm
B
D
SOT996-2
A
E
A
A1
detail X
terminal 1
index area
e1
1
4
8
5
C
C A B
C
v
w
b
e
L1
y
y1 C
L2
L
X
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit(1)
mm
max
nom
min
A
A1
b
0.05 0.35
D
E
2.1
3.1
0.5
0.00 0.15
1.9
e
e1
0.5
1.5
2.9
L
L1
L2
0.5
0.15
0.6
0.3
0.05
0.4
v
0.1
w
y
0.05 0.05
y1
0.1
sot996-2_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
07-12-21
12-11-20
SOT996-2
Fig 15. Package outline SOT996-2 (XSON8)
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
21 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.2 x 1.0 x 0.35 mm
1
2
SOT1116
b
4
3
(4×)(2)
L
L1
e
8
7
e1
6
e1
5
e1
(8×)(2)
A1
A
D
E
terminal 1
index area
0
0.5
scale
Dimensions
Unit
mm
1 mm
A(1)
A1
b
D
E
e
e1
max 0.35 0.04 0.20 1.25 1.05
nom
0.15 1.20 1.00 0.55
min
0.12 1.15 0.95
0.3
L
L1
0.35 0.40
0.30 0.35
0.27 0.32
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
sot1116_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-02
10-04-07
SOT1116
Fig 16. Package outline SOT1116 (XSON8)
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
22 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1.0 x 0.35 mm
SOT1203
b
2
1
3
(4×)(2)
4
L
L1
e
8
7
6
e1
e1
5
e1
(8×)(2)
A1
A
D
E
terminal 1
index area
0
0.5
scale
Dimensions
Unit
mm
1 mm
A(1)
A1
b
D
E
e
e1
L
L1
max 0.35 0.04 0.20 1.40 1.05
0.35 0.40
nom
0.15 1.35 1.00 0.55 0.35 0.30 0.35
min
0.12 1.30 0.95
0.27 0.32
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
sot1203_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-02
10-04-06
SOT1203
Fig 17. Package outline SOT1203 (XSON8)
74AVC2T45
Product data sheet
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Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
23 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
15. Abbreviations
Table 19.
Abbreviations
Acronym
Description
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
16. Revision history
Table 20.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74AVC2T45 v.7
20130208
Product data sheet
-
74AVC2T45 v.6
Modifications:
•
For type number 74AVC2T45GD XSON8U has changed to XSON8.
74AVC2T45 v.6
20111208
Product data sheet
-
74AVC2T45 v.5
74AVC2T45 v.5
20101130
Product data sheet
-
74AVC2T45 v.4
74AVC2T45 v.4
20090505
Product data sheet
-
74AVC2T45 v.3
74AVC2T45 v.3
20090129
Product data sheet
-
74AVC2T45 v.2
74AVC2T45 v.2
20080620
Product data sheet
-
74AVC2T45 v.1
74AVC2T45 v.1
20070703
Product data sheet
-
-
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
24 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
25 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74AVC2T45
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 February 2013
© NXP B.V. 2013. All rights reserved.
26 of 27
74AVC2T45
NXP Semiconductors
Dual-bit, dual-supply voltage level translator/transceiver; 3-state
19. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 14
Unidirectional logic level-shifting application . 14
Bidirectional logic level-shifting application. . . 15
Power-up considerations . . . . . . . . . . . . . . . . 16
Enable times . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information. . . . . . . . . . . . . . . . . . . . . 26
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 February 2013
Document identifier: 74AVC2T45