PHILIPS 74HC4052D652

74HC4052; 74HCT4052
Dual 4-channel analog multiplexer/demultiplexer
Rev. 10 — 19 July 2012
Product data sheet
1. General description
The 74HC4052; 74HCT4052 is a high-speed Si-gate CMOS device and is pin compatible
with the HEF4052B. The device is specified in compliance with JEDEC standard no. 7A.
The 74HC4052; 74HCT4052 is a dual 4-channel analog multiplexer/demultiplexer with
common select logic. Each multiplexer has four independent inputs/outputs (pins nY0 to
nY3) and a common input/output (pin nZ). The common channel select logics include two
digital select inputs (pins S0 and S1) and an active LOW enable input (pin E). When
pin E = LOW, one of the four switches is selected (low-impedance ON-state) with pins S0
and S1. When pin E = HIGH, all switches are in the high-impedance OFF-state,
independent of pins S0 and S1.
VCC and GND are the supply voltage pins for the digital control inputs (pins S0, S1 and E).
The VCC to GND ranges are 2.0 V to 10.0 V for the 74HC4052 and 4.5 V to 5.5 V for the
74HCT4052. The analog inputs/outputs (pins nY0 to nY3 and nZ) can swing between VCC
as a positive limit and VEE as a negative limit. VCC  VEE may not exceed 10.0 V.
For operation as a digital multiplexer/demultiplexer, VEE is connected to GND (typically
ground).
2. Features and benefits
 Wide analog input voltage range from 5 V to +5 V
 Low ON resistance:
 80  (typical) at VCC  VEE = 4.5 V
 70  (typical) at VCC  VEE = 6.0 V
 60  (typical) at VCC  VEE = 9.0 V
 Logic level translation: to enable 5 V logic to communicate with 5 V analog signals
 Typical ‘break before make’ built-in
 Complies with JEDEC standard no. 7A
 ESD protection:
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V
 CDM JESD22-C101E exceeds 1000 V
 Specified from 40 C to +85 C and 40 C to +125 C
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
3. Applications
 Analog multiplexing and demultiplexing
 Digital multiplexing and demultiplexing
 Signal gating
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74HC4052N
40 C to +125 C
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
74HC4052D
40 C to +125 C
SO16
plastic small outline package; 16 leads; body
width 3.9 mm
SOT109-1
74HC4052DB
40 C to +125 C
SSOP16
plastic shrink small outline package; 16 leads; body
width 5.3 mm
SOT338-1
74HC4052PW
40 C to +125 C
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
74HC4052BQ
40 C to +125 C
DHVQFN16
plastic dual-in line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5  3.5  0.85 mm
SOT763-1
74HCT4052N
40 C to +125 C
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
74HCT4052D
40 C to +125 C
SO16
plastic small outline package; 16 leads; body
width 3.9 mm
SOT109-1
74HCT4052DB
40 C to +125 C
SSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
SOT338-1
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
DHVQFN16
plastic dual-in line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5  3.5  0.85 mm
SOT763-1
74HC4052
74HCT4052
74HCT4052PW 40 C to +125 C
74HCT4052BQ
74HC_HCT4052
Product data sheet
40 C to +125 C
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
2 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
5. Functional diagram
10
13
1Z
1Y0
12
10
S0
1Y1
14
9
S1
1Y2
15
6
E
1Y3
11
2Y0
1
2Y1
5
2Y2
2
2Y3
4
0
4×
9
1
6
G4
0
3
MDX
3
0
1
1
5
2
2
3
4
12
14
13
15
2Z
11
001aah824
3
Fig 1.
001aah825
Logic symbol
Fig 2.
IEC logic symbol
nYn
VCC
VEE
VCC
VCC
VCC
VEE
from
logic
VEE
nZ
mnb043
Fig 3.
Schematic diagram (one switch)
74HC_HCT4052
Product data sheet
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Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
3 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
VDD
16
13
12
14
15
S0
10
11
S1
E
9
LOGIC
LEVEL
CONVERSION
1Y0
1Y1
1Y2
1Y3
1-OF-4
DECODER
1
2Y0
6
5
2
4
3
Fig 4.
1Z
8
7
VSS
VEE
2Y1
2Y2
2Y3
2Z
001aah872
Functional diagram
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
4 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
6. Pinning information
6.1 Pinning
74HC4052
74HCT4052
16 VCC
2Y2
2
15 1Y2
2Z
3
14 1Y1
2Y3
4
2Y1
5
terminal 1
index area
16 VCC
1
1
2Y0
2Y0
74HC4052
74HCT4052
2Y2
2
15 1Y2
2Z
3
14 1Y1
13 1Z
2Y3
4
13 1Z
12 1Y0
2Y1
5
E
6
VEE
7
7
10 S0
GND
8
9
S1
11 1Y3
10 S0
9
VEE
VCC
S1
11 1Y3
8
6
GND
E
12 1Y0
(1)
001aah823
Transparent top view
001aah822
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
supply pin or input.
Fig 5.
Pin configuration for DIP16, SO16 and
(T)SSOP16
Fig 6.
Pin configuration for DHVQFN16
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
2Y0
1
independent input or output 2Y0
2Y2
2
independent input or output 2Y2
2Z
3
common input or output 2
2Y3
4
independent input or output 2Y3
2Y1
5
independent input or output 2Y1
E
6
enable input (active LOW)
VEE
7
negative supply voltage
GND
8
ground (0 V)
S1
9
select logic input 1
S0
10
select logic input 0
1Y3
11
independent input or output 1Y3
1Y0
12
independent input or output 1Y0
1Z
13
common input or output 1
1Y1
14
independent input or output 1Y1
1Y2
15
independent input or output 1Y2
VCC
16
positive supply voltage
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
5 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
7. Functional description
7.1 Function table
Table 3.
Function table[1]
Input
Channel on
E
S1
S0
L
L
L
nY0 and nZ
L
L
H
nY1 and nZ
L
H
L
nY2 and nZ
L
H
H
nY3 and nZ
H
X
X
none
[1]
H = HIGH voltage level;
L = LOW voltage level;
X = don’t care.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to VEE = GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
[1]
Min
Max
Unit
0.5
+11.0
V
IIK
input clamping current
VI < 0.5 V or VI > VCC + 0.5 V
-
20
mA
ISK
switch clamping current
VSW < 0.5 V or VSW > VCC + 0.5 V
-
20
mA
ISW
switch current
0.5 V < VSW < VCC + 0.5 V
-
25
mA
IEE
supply current
-
20
mA
ICC
supply current
-
50
mA
IGND
ground current
-
50
mA
Tstg
storage temperature
total power dissipation
Ptot
P
[1]
power dissipation
65
+150
C
DIP16 package
[2]
-
750
mW
SO16, (T)SSOP16, and DHVQFN16
package
[3]
-
500
mW
-
100
mW
per switch
To avoid drawing VCC current out of pins nZ, when switch current flows in pins nYn, the voltage drop across the bidirectional switch must
not exceed 0.4 V. If the switch current flows into pins nZ, no VCC current will flow out of pins nYn. In this case there is no limit for the
voltage drop across the switch, but the voltages at pins nYn and nZ may not exceed VCC or VEE.
[2]
For DIP16 packages: above 70 C the value of Ptot derates linearly with 12 mW/K.
[3]
For SO16 packages: above 70 C the value of Ptot derates linearly with 8 mW/K.
For SSOP16 and TSSOP16 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K.
For DHVQFN16 packages: above 60 C the value of Ptot derates linearly with 4.5 mW/K.
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
6 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
Conditions
supply voltage
VCC
74HC4052
74HCT4052
Unit
Min
Typ
Max
Min
Typ
Max
VCC  GND
2.0
5.0
10.0
4.5
5.0
5.5
V
VCC  VEE
2.0
5.0
10.0
2.0
5.0
10.0
V
-
VCC
GND
-
VCC
V
see Figure 7
and Figure 8
VI
input voltage
GND
VSW
switch voltage
VEE
-
VCC
VEE
-
VCC
V
Tamb
ambient temperature
40
+25
+125
40
+25
+125
C
t/V
input transition rise and fall
rate
VCC = 2.0 V
-
-
625
-
-
-
ns/V
VCC = 4.5 V
-
1.67
139
-
1.67
139
ns/V
VCC = 6.0 V
-
-
83
-
-
-
ns/V
VCC = 10.0 V
-
-
31
-
-
-
ns/V
mnb044
12
mnb045
12
VCC − GND
(V)
10
VCC − GND
(V)
8
8
operating area
6
operating area
4
4
2
0
0
4
8
0
12
0
VCC − VEE (V)
Fig 7.
Guaranteed operating area as a function of the
supply voltages for 74HC4052
74HC_HCT4052
Product data sheet
Fig 8.
4
8
VCC − VEE (V)
12
Guaranteed operating area as a function of the
supply voltages for 74HCT4052
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
7 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
10. Static characteristics
Table 6.
RON resistance per switch for 74HC4052 and 74HCT4052
VI = VIH or VIL; for test circuit see Figure 9.
Vis is the input voltage at a nYn or nZ terminal, whichever is assigned as an input.
Vos is the output voltage at a nYn or nZ terminal, whichever is assigned as an output.
For 74HC4052: VCC  GND or VCC  VEE = 2.0 V, 4.5 V, 6.0 V and 9.0 V.
For 74HCT4052: VCC  GND = 4.5 V and 5.5 V, VCC  VEE = 2.0 V, 4.5 V, 6.0 V and 9.0 V.
Symbol
Parameter
Tamb = 40 C to +85
Conditions
Min
Typ
Max
Unit
-
-
-

VCC = 4.5 V; VEE = 0 V; ISW = 1000 A
-
100
225

VCC = 6.0 V; VEE = 0 V; ISW = 1000 A
-
90
200

VCC = 4.5 V; VEE = 4.5 V; ISW = 1000 A
-
70
165

-
150
-

-
80
175

C[1]
RON(peak) ON resistance (peak)
Vis = VCC to VEE
VCC = 2.0 V; VEE = 0 V; ISW = 100 A
RON(rail)
ON resistance (rail)
[2]
Vis = VEE
VCC = 2.0 V; VEE = 0 V; ISW = 100 A
[2]
VCC = 4.5 V; VEE = 0 V; ISW = 1000 A
VCC = 6.0 V; VEE = 0 V; ISW = 1000 A
-
70
150

VCC = 4.5 V; VEE = 4.5 V; ISW = 1000 A
-
60
130

-
150
-

VCC = 4.5 V; VEE = 0 V; ISW = 1000 A
-
90
200

VCC = 6.0 V; VEE = 0 V; ISW = 1000 A
-
80
175

VCC = 4.5 V; VEE = 4.5 V; ISW = 1000 A
-
65
150

Vis = VCC
VCC = 2.0 V; VEE = 0 V; ISW = 100 A
RON
ON resistance mismatch
between channels
[2]
Vis = VCC to VEE
-
-
-

VCC = 4.5 V; VEE = 0 V
-
9
-

VCC = 6.0 V; VEE = 0 V
-
8
-

VCC = 4.5 V; VEE = 4.5 V
-
6
-

-
-
-

VCC = 4.5 V; VEE = 0 V; ISW = 1000 A
-
-
270

VCC = 6.0 V; VEE = 0 V; ISW = 1000 A
-
-
240

VCC = 4.5 V; VEE = 4.5 V; ISW = 1000 A
-
-
195

VCC = 2.0 V; VEE = 0 V
[2]
Tamb = 40 C to +125 C
RON(peak) ON resistance (peak)
Vis = VCC to VEE
VCC = 2.0 V; VEE = 0 V; ISW = 100 A
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
[2]
© NXP B.V. 2012. All rights reserved.
8 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
Table 6.
RON resistance per switch for 74HC4052 and 74HCT4052 …continued
VI = VIH or VIL; for test circuit see Figure 9.
Vis is the input voltage at a nYn or nZ terminal, whichever is assigned as an input.
Vos is the output voltage at a nYn or nZ terminal, whichever is assigned as an output.
For 74HC4052: VCC  GND or VCC  VEE = 2.0 V, 4.5 V, 6.0 V and 9.0 V.
For 74HCT4052: VCC  GND = 4.5 V and 5.5 V, VCC  VEE = 2.0 V, 4.5 V, 6.0 V and 9.0 V.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RON(rail)
ON resistance (rail)
Vis = VEE
-
-
-

VCC = 4.5 V; VEE = 0 V; ISW = 1000 A
-
-
210

VCC = 6.0 V; VEE = 0 V; ISW = 1000 A
-
-
180

VCC = 4.5 V; VEE = 4.5 V; ISW = 1000 A
-
-
160

VCC = 2.0 V; VEE = 0 V; ISW = 100 A
[2]
Vis = VCC
VCC = 2.0 V; VEE = 0 V; ISW = 100 A
-
-
-

VCC = 4.5 V; VEE = 0 V; ISW = 1000 A
-
-
240

VCC = 6.0 V; VEE = 0 V; ISW = 1000 A
-
-
210

VCC = 4.5 V; VEE = 4.5 V; ISW = 1000 A
-
-
180

[2]
[1]
All typical values are measured at Tamb = 25 C.
[2]
When supply voltages (VCC  VEE) near 2.0 V the analog switch ON resistance becomes extremely non-linear. When using a supply of
2 V, it is recommended to use these devices only for transmitting digital signals.
001aai068
100
(1)
RON
(Ω)
80
60
(2)
Vsw
V
(3)
40
VCC
from select
input
Sn
Vis
20
nZ
nYn
GND
VEE
Isw
0
0
1.8
3.6
Vis = 0 V to (VCC  VEE).
5.4
7.2
9.0
Vis (V)
001aah826
Vis = 0 V to (VCC  VEE).
(1) VCC = 4.5 V
V sw
R ON = -------I sw
(2) VCC = 6 V
(3) VCC = 9 V
Fig 9.
Test circuit for measuring RON
74HC_HCT4052
Product data sheet
Fig 10. Typical RON as a function of input voltage Vis
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
9 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
Table 7.
Static characteristics for 74HC4052
Voltages are referenced to GND (ground = 0 V).
Vis is the input voltage at pins nYn or nZ, whichever is assigned as an input.
Vos is the output voltage at pins nZ or nYn, whichever is assigned as an output.
Symbol
Parameter
Tamb = 40 C to +85
VIH
VIL
II
IS(OFF)
Conditions
Min
Typ
Max
Unit
VCC = 2.0 V
1.5
1.2
-
V
VCC = 4.5 V
3.15
2.4
-
V
VCC = 6.0 V
4.2
3.2
-
V
VCC = 9.0 V
6.3
4.7
-
V
VCC = 2.0 V
-
0.8
0.5
V
VCC = 4.5 V
-
2.1
1.35
V
VCC = 6.0 V
-
2.8
1.8
V
VCC = 9.0 V
-
4.3
2.7
V
C[1]
HIGH-level input
voltage
LOW-level input
voltage
input leakage current
OFF-state leakage
current
VEE = 0 V; VI = VCC or GND
VCC = 6.0 V
-
-
1.0
A
VCC = 10.0 V
-
-
2.0
A
VCC = 10.0 V; VEE = 0 V; VI = VIH or VIL;
VSW = VCC  VEE; see Figure 11
per channel
-
-
1.0
A
all channels
-
-
2.0
A
-
-
2.0
A
VCC = 6.0 V
-
-
80.0
A
VCC = 10.0 V
-
-
160.0
A
IS(ON)
ON-state leakage
current
VI = VIH or VIL; VSW = VCC  VEE;
VCC = 10.0 V; VEE = 0 V; see Figure 12
ICC
supply current
VEE = 0 V; VI = VCC or GND; Vis = VEE or VCC;
Vos = VCC or VEE
CI
input capacitance
Csw
switch capacitance
-
3.5
-
pF
independent pins nYn
-
5
-
pF
common pins nZ
-
12
-
pF
VCC = 2.0 V
1.5
-
-
V
VCC = 4.5 V
3.15
-
-
V
VCC = 6.0 V
4.2
-
-
V
VCC = 9.0 V
6.3
-
-
V
Tamb = 40 C to +125 C
VIH
VIL
II
HIGH-level input
voltage
LOW-level input
voltage
input leakage current
74HC_HCT4052
Product data sheet
VCC = 2.0 V
-
-
0.5
V
VCC = 4.5 V
-
-
1.35
V
VCC = 6.0 V
-
-
1.8
V
VCC = 9.0 V
-
-
2.7
V
VCC = 6.0 V
-
-
1.0
A
VCC = 10.0 V
-
-
2.0
A
VEE = 0 V; VI = VCC or GND
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
10 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
Table 7.
Static characteristics for 74HC4052 …continued
Voltages are referenced to GND (ground = 0 V).
Vis is the input voltage at pins nYn or nZ, whichever is assigned as an input.
Vos is the output voltage at pins nZ or nYn, whichever is assigned as an output.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IS(OFF)
OFF-state leakage
current
VCC = 10.0 V; VEE = 0 V; VI = VIH or VIL;
VSW = VCC  VEE; see Figure 11
per channel
-
-
1.0
A
all channels
-
-
2.0
A
-
-
2.0
A
IS(ON)
ON-state leakage
current
VI = VIH or VIL; VSW = VCC  VEE;
VCC = 10.0 V; VEE = 0 V; see Figure 12
ICC
supply current
VEE = 0 V; VI = VCC or GND; Vis = VEE or VCC;
Vos = VCC or VEE
[1]
VCC = 6.0 V
-
-
160.0
A
VCC = 10.0 V
-
-
320.0
A
Conditions
Min
Typ
Max
Unit
All typical values are measured at Tamb = 25 C.
Table 8.
Static characteristics for 74HCT4052
Voltages are referenced to GND (ground = 0 V).
Vis is the input voltage at pins nYn or nZ, whichever is assigned as an input.
Vos is the output voltage at pins nZ or nYn, whichever is assigned as an output.
Symbol
Parameter
Tamb = 40 C to +85 C[1]
VIH
HIGH-level input
voltage
VCC = 4.5 V to 5.5 V
2.0
1.6
-
V
VIL
LOW-level input
voltage
VCC = 4.5 V to 5.5 V
-
1.2
0.8
V
II
input leakage current
VI = VCC or GND; VCC = 5.5 V; VEE = 0 V
-
-
1.0
A
IS(OFF)
OFF-state leakage
current
VCC = 10.0 V; VEE = 0 V; VI = VIH or VIL;
VSW = VCC  VEE; see Figure 11
per channel
-
-
1.0
A
all channels
-
-
2.0
A
-
-
2.0
A
VCC = 5.5 V; VEE = 0 V
-
-
80.0
A
VCC = 5.0 V; VEE = 5.0 V
-
-
160.0
A
-
45
202.5
A
-
3.5
-
pF
independent pins nYn
-
5
-
pF
common pins nZ
-
12
-
pF
VCC = 4.5 V to 5.5 V
2.0
-
-
V
IS(ON)
ON-state leakage
current
VCC = 10.0 V; VEE = 0 V; VI = VIH or VIL;
VSW = VCC  VEE; see Figure 12
ICC
supply current
VI = VCC or GND; Vis = VEE or VCC;
Vos = VCC or VEE
ICC
additional supply
current
CI
input capacitance
Csw
switch capacitance
per input; VI = VCC  2.1 V; other inputs at VCC
or GND; VCC = 4.5 V to 5.5 V; VEE = 0 V
Tamb = 40 C to +125 C
VIH
HIGH-level input
voltage
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
11 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
Table 8.
Static characteristics for 74HCT4052 …continued
Voltages are referenced to GND (ground = 0 V).
Vis is the input voltage at pins nYn or nZ, whichever is assigned as an input.
Vos is the output voltage at pins nZ or nYn, whichever is assigned as an output.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIL
LOW-level input
voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
V
II
input leakage current
VI = VCC or GND; VCC = 5.5 V; VEE = 0 V
-
-
1.0
A
IS(OFF)
OFF-state leakage
current
VCC = 10.0 V; VEE = 0 V; VI = VIH or VIL;
VSW = VCC  VEE; see Figure 11
per channel
-
-
1.0
A
all channels
-
-
2.0
A
-
-
2.0
A
VCC = 5.5 V; VEE = 0 V
-
-
160.0
A
VCC = 5.0 V; VEE = 5.0 V
-
-
320.0
A
-
-
220.5
A
IS(ON)
ON-state leakage
current
VCC = 10.0 V; VEE = 0 V; VI = VIH or VIL;
VSW = VCC  VEE; see Figure 12
ICC
supply current
VI = VCC or GND; Vis = VEE or VCC;
Vos = VCC or VEE
ICC
[1]
additional supply
current
per input; VI = VCC  2.1 V; other inputs at VCC
or GND; VCC = 4.5 V to 5.5 V; VEE = 0 V
All typical values are measured at Tamb = 25 C.
VCC
from select
input
Sn
Isw
Isw
Z
Yn
A
GND
Vis
A
VEE
Vos
001aan383
Vis = VCC and Vos = VEE.
Vis = VEE and Vos = VCC.
Fig 11. Test circuit for measuring OFF-state current
VCC
HIGH
from select
input
Sn
Isw
A
Vis
Z
Yn
GND
Vos
VEE
001aan384
Vis = VCC and Vos = open-circuit.
Vis = VEE and Vos = open-circuit.
Fig 12. Test circuit for measuring ON-state current
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
12 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
11. Dynamic characteristics
Table 9.
Dynamic characteristics for 74HC4052
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; for test circuit see Figure 15.
Vis is the input voltage at a nYn or nZ terminal, whichever is assigned as an input.
Vos is the output voltage at a nYn or nZ terminal, whichever is assigned as an output.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC = 2.0 V; VEE = 0 V
-
14
75
ns
VCC = 4.5 V; VEE = 0 V
-
5
15
ns
VCC = 6.0 V; VEE = 0 V
-
4
13
ns
-
4
10
ns
Tamb = 40 C to +85 C[1]
tpd
propagation delay Vis to Vos; RL =  ; see Figure 13
[2]
VCC = 4.5 V; VEE = 4.5 V
ton
turn-on time
E, Sn to Vos; RL =  ; see Figure 14
[3]
VCC = 2.0 V; VEE = 0 V
-
105
405
ns
VCC = 4.5 V; VEE = 0 V
-
38
81
ns
VCC = 5.0 V; VEE = 0 V; CL = 15 pF
-
28
-
ns
VCC = 6.0 V; VEE = 0 V
-
30
69
ns
-
26
58
ns
VCC = 2.0 V; VEE = 0 V
-
74
315
ns
VCC = 4.5 V; VEE = 0 V
-
27
63
ns
VCC = 4.5 V; VEE = 4.5 V
toff
turn-off time
E, Sn to Vos; RL = 1 k; see Figure 14
[4]
VCC = 5.0 V; VEE = 0 V; CL = 15 pF
-
21
-
ns
VCC = 6.0 V; VEE = 0 V
-
22
54
ns
-
22
48
ns
-
57
-
pF
VCC = 2.0 V; VEE = 0 V
-
-
90
ns
VCC = 4.5 V; VEE = 0 V
-
-
18
ns
VCC = 6.0 V; VEE = 0 V
-
-
15
ns
-
-
12
ns
VCC = 4.5 V; VEE = 4.5 V
CPD
power dissipation per switch; VI = GND to VCC
capacitance
[5]
Tamb = 40 C to +125 C
tpd
propagation delay Vis to Vos; RL =  ; see Figure 13
[2]
VCC = 4.5 V; VEE = 4.5 V
ton
turn-on time
74HC_HCT4052
Product data sheet
E, Sn to Vos; RL =  ; see Figure 14
[3]
VCC = 2.0 V; VEE = 0 V
-
-
490
ns
VCC = 4.5 V; VEE = 0 V
-
-
98
ns
VCC = 6.0 V; VEE = 0 V
-
-
83
ns
VCC = 4.5 V; VEE = 4.5 V
-
-
69
ns
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
13 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
Table 9.
Dynamic characteristics for 74HC4052 …continued
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; for test circuit see Figure 15.
Vis is the input voltage at a nYn or nZ terminal, whichever is assigned as an input.
Vos is the output voltage at a nYn or nZ terminal, whichever is assigned as an output.
Symbol
toff
Parameter
turn-off time
Conditions
Min
Typ
Max
Unit
VCC = 2.0 V; VEE = 0 V
-
-
375
ns
VCC = 4.5 V; VEE = 0 V
-
-
75
ns
VCC = 6.0 V; VEE = 0 V
-
-
64
ns
VCC = 4.5 V; VEE = 4.5 V
-
-
57
ns
Min
Typ
Max
Unit
-
5
15
ns
-
4
10
ns
VCC = 4.5 V; VEE = 0 V
-
41
88
ns
VCC = 5.0 V; VEE = 0 V; CL = 15 pF
-
18
-
ns
-
28
60
ns
VCC = 4.5 V; VEE = 0 V
-
26
63
ns
VCC = 5.0 V; VEE = 0 V; CL = 15 pF
-
13
-
ns
-
21
48
ns
-
57
-
pF
E, Sn to Vos; RL = 1 k; see Figure 14
[1]
All typical values are measured at Tamb = 25 C.
[2]
tpd is the same as tPHL and tPLH.
[3]
ton is the same as tPZH and tPZL.
[4]
toff is the same as tPHZ and tPLZ.
[5]
[4]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + {(CL + Csw)  VCC2  fo} where:
fi = input frequency in MHz;
fo = output frequency in MHz;
N = number of inputs switching;
{(CL + Csw)  VCC2  fo} = sum of outputs;
CL = output load capacitance in pF;
Csw = switch capacitance in pF;
VCC = supply voltage in V.
Table 10. Dynamic characteristics for 74HCT4052
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; for test circuit see Figure 15.
Vis is the input voltage at a nYn or nZ terminal, whichever is assigned as an input.
Vos is the output voltage at a nYn or nZ terminal, whichever is assigned as an output.
Symbol
Parameter
Tamb = 40 C to +85
tpd
Conditions
C[1]
propagation delay Vis to Vos; RL =  ; see Figure 13
[2]
VCC = 4.5 V; VEE = 0 V
VCC = 4.5 V; VEE = 4.5 V
ton
turn-on time
E, Sn to Vos; RL = 1 k; see Figure 14
[3]
VCC = 4.5 V; VEE = 4.5 V
toff
turn-off time
E, Sn to Vos; RL = 1 k; see Figure 14
[4]
VCC = 4.5 V; VEE = 4.5 V
CPD
power dissipation per switch; VI = GND to VCC  1.5 V
capacitance
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
[5]
© NXP B.V. 2012. All rights reserved.
14 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
Table 10. Dynamic characteristics for 74HCT4052 …continued
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; for test circuit see Figure 15.
Vis is the input voltage at a nYn or nZ terminal, whichever is assigned as an input.
Vos is the output voltage at a nYn or nZ terminal, whichever is assigned as an output.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
18
ns
-
-
12
ns
-
-
105
ns
-
-
72
ns
Tamb = 40 C to +125 C
propagation delay Vis to Vos; RL =  ; see Figure 13
tpd
[2]
VCC = 4.5 V; VEE = 0 V
VCC = 4.5 V; VEE = 4.5 V
turn-on time
ton
[3]
E, Sn to Vos; RL = 1 k; see Figure 14
VCC = 4.5 V; VEE = 0 V
VCC = 4.5 V; VEE = 4.5 V
turn-off time
toff
[1]
[4]
E, Sn to Vos; RL = 1 k; see Figure 14
VCC = 4.5 V; VEE = 0 V
-
-
75
ns
VCC = 4.5 V; VEE = 4.5 V
-
-
57
ns
All typical values are measured at Tamb = 25 C.
[2]
tpd is the same as tPHL and tPLH.
[3]
ton is the same as tPZH and tPZL.
[4]
toff is the same as tPHZ and tPLZ.
[5]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + {(CL + Csw)  VCC2  fo} where:
fi = input frequency in MHz;
fo = output frequency in MHz;
N = number of inputs switching;
{(CL + Csw)  VCC2  fo} = sum of outputs;
CL = output load capacitance in pF;
Csw = switch capacitance in pF;
VCC = supply voltage in V.
Vis input
50 %
tPLH
Vos output
tPHL
50 %
001aad555
Fig 13. Input (Vis) to output (Vos) propagation delays
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
15 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
VI
VM
E, Sn inputs
0V
tPZL
tPLZ
50 %
Vos output
10 %
tPHZ
tPZH
90 %
50 %
Vos output
switch ON
switch ON
switch OFF
001aae330
For 74HC4052: VM = 0.5  VCC.
For 74HCT4052: VM = 1.3 V.
Fig 14. Turn-on and turn-off times
VI
tW
90 %
negative
pulse
VM
0V
VI
tf
tr
tr
tf
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC Vis
PULSE
GENERATOR
VI
VCC
Vos
RL
S1
open
DUT
RT
CL
GND
VEE
001aae382
Definitions for test circuit; see Table 11:
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
RL = load resistance.
S1 = Test selection switch.
Fig 15. Test circuit for measuring AC performance
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
16 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
Table 11.
Test data
Test
Input
VI
Load
Vis
tr, tf
S1 position
CL
RL
at fmax
other[1]
tPHL, tPLH
[2]
pulse
< 2 ns
6 ns
50 pF
1 k
open
tPZH, tPHZ
[2]
VCC
< 2 ns
6 ns
50 pF
1 k
VEE
tPZL, tPLZ
[2]
VEE
< 2 ns
6 ns
50 pF
1 k
VCC
[1]
[2]
tr = tf = 6 ns; when measuring fmax, there is no constraint to tr and tf with 50 % duty factor.
VI values:
a) For 74HC4052: VI = VCC
b) For 74HCT4052: VI = 3 V
12. Additional dynamic characteristics
Table 12. Additional dynamic characteristics
Recommended conditions and typical values; GND = 0 V; Tamb = 25 C; CL = 50 pF.
Vis is the input voltage at pins nYn or nZ, whichever is assigned as an input.
Vos is the output voltage at pins nYn or nZ, whichever is assigned as an output.
Symbol
Parameter
Conditions
dsin
sine-wave distortion
fi = 1 kHz; RL = 10 k; see Figure 16
Min
Typ
Max
Unit
Vis = 4.0 V (p-p); VCC = 2.25 V; VEE = 2.25 V
-
0.04
-
%
Vis = 8.0 V (p-p); VCC = 4.5 V; VEE = 4.5 V
-
0.02
-
%
Vis = 4.0 V (p-p); VCC = 2.25 V; VEE = 2.25 V
-
0.12
-
%
Vis = 8.0 V (p-p); VCC = 4.5 V; VEE = 4.5 V
-
0.06
-
%
fi = 10 kHz; RL = 10 k; see Figure 16
iso
isolation (OFF-state)
Xtalk
crosstalk
crosstalk voltage
Vct
f(3dB)
3 dB frequency response
RL = 600 ; fi = 1 MHz; see Figure 17
VCC = 2.25 V; VEE = 2.25 V
[1]
-
50
-
dB
VCC = 4.5 V; VEE = 4.5 V
[1]
-
50
-
dB
VCC = 2.25 V; VEE = 2.25 V
[1]
-
60
-
dB
VCC = 4.5 V; VEE = 4.5 V
[1]
-
60
-
dB
VCC = 4.5 V; VEE = 0 V
-
110
-
mV
VCC = 4.5 V; VEE = 4.5 V
-
220
-
mV
between two switches/multiplexers;
RL = 600 ; fi = 1 MHz; see Figure 18
peak-to-peak value; between control and any
switch; RL = 600 ; fi = 1 MHz; E or Sn square
wave between VCC and GND; tr = tf = 6 ns;
see Figure 19
RL = 50 ; see Figure 20
VCC = 2.25 V; VEE = 2.25 V
[2]
-
170
-
MHz
VCC = 4.5 V; VEE = 4.5 V
[2]
-
180
-
MHz
[1]
Adjust input voltage Vis to 0 dBm level (0 dBm = 1 mW into 600 ).
[2]
Adjust input voltage Vis to 0 dBm level at Vos for 1 MHz (0 dBm = 1 mW into 50 ).
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
17 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
VCC
Sn
10 μF
Vis
nYn/nZ
nZ/nYn
VEE
GND
RL
Vos
CL
dB
001aah829
Fig 16. Test circuit for measuring sine-wave distortion
VCC
Sn
0.1 μF
Vis
nYn/nZ
nZ/nYn
VEE
GND
RL
Vos
CL
dB
001aah871
VCC = 4.5 V; GND = 0 V; VEE = 4.5 V; RL = 600 ; RS = 1 k.
a. Test circuit
001aae332
0
αiso
(dB)
−20
−40
−60
−80
−100
10
102
103
104
105
106
fi (kHz)
b. Isolation (OFF-state) as a function of frequency
Fig 17. Test circuit for measuring isolation (OFF-state)
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
18 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
VCC
Sn
0.1 μF
Vis
RL
nYn/nZ
nZ/nYn
VEE
GND
RL
CL
VCC
Sn
nYn/nZ
nZ/nYn
VEE
RL
GND
RL
Vos
CL
dB
001aah873
Fig 18. Test circuits for measuring crosstalk between any two switches/multiplexers
2RL
2RL
VCC
Sn, E
Vct
nYn
G
2RL
nZ
VEE
GND
2RL
oscilloscope
001aah913
Fig 19. Test circuit for measuring crosstalk between control input and any switch
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
19 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
VCC
Sn
10 μF
Vis
nYn/nZ
nZ/nYn
VEE
GND
RL
Vos
CL
dB
001aah829
VCC = 4.5 V; GND = 0 V; VEE = 4.5 V; RL = 50 ; RS = 1 k.
a. Test circuit
001aad551
5
Vos
(dB)
3
1
−1
−3
−5
10
102
103
104
105
106
f (kHz)
b. Typical frequency response
Fig 20. Test circuit for frequency response
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
20 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 21. Package outline SOT109-1 (SO16)
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
21 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
D
SOT338-1
E
A
X
c
y
HE
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
8
1
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.00
0.55
8o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT338-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-150
Fig 22. Package outline SOT338-1 (SSOP16)
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
22 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches
0.17
0.02
0.13
0.068
0.051
0.021
0.015
0.049
0.033
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
SOT38-4
Fig 23. Package outline SOT38-4 (DIP16)
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
23 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
D
A
X
c
y
HE
v M A
Z
9
16
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 24. Package outline SOT403-1 (TSSOP16)
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
24 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT763-1
16 terminals; body 2.5 x 3.5 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
7
y
y1 C
v M C A B
w M C
b
L
1
8
Eh
e
16
9
15
10
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
c
D (1)
Dh
E (1)
Eh
0.2
3.6
3.4
2.15
1.85
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT763-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 25. Package outline SOT763-1 (DHVQFN16)
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
25 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
14. Abbreviations
Table 13.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
15. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74HC_HCT4052 v.10
20120719
Product data sheet
-
74HC_HCT4052 v.9
-
74HC_HCT4052 v.8
Modifications:
74HC_HCT4052 v.9
Modifications:
•
CDM added to features.
20111213
•
Product data sheet
Legal pages updated.
74HC_HCT4052 v.8
20110511
Product data sheet
-
74HC_HCT4052 v.7
74HC_HCT4052 v.7
20110112
Product data sheet
-
74HC_HCT4052 v.6
74HC_HCT4052 v.6
20100111
Product data sheet
-
74HC_HCT4052 v.5
74HC_HCT4052 v.5
20080505
Product data sheet
-
74HC_HCT4052 v.4
74HC_HCT4052 v.4
20041111
Product specification
-
74HC_HCT4052 v.3
74HC_HCT4052 v.3
20030516
Product specification
-
74HC_HCT4052_CNV v.2
-
-
-
74HC_HCT4052_CNV v.2 19901201
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
26 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74HC_HCT4052
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
27 of 29
74HC4052; 74HCT4052
NXP Semiconductors
Dual 4-channel analog multiplexer/demultiplexer
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74HC_HCT4052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 19 July 2012
© NXP B.V. 2012. All rights reserved.
28 of 29
NXP Semiconductors
74HC4052; 74HCT4052
Dual 4-channel analog multiplexer/demultiplexer
18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . 13
Additional dynamic characteristics . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Contact information. . . . . . . . . . . . . . . . . . . . . 28
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 19 July 2012
Document identifier: 74HC_HCT4052