74LVC1G3157 2-channel analog multiplexer/demultiplexer Rev. 4 — 6 December 2011 Product data sheet 1. General description The 74LVC1G3157 provides one analog multiplexer/demultiplexer with one digital select input (S), two independent inputs/outputs (Y0, Y1) and a common input/output (Z). Schmitt trigger action at the select input makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 1.65 V to 5.5 V. 2. Features and benefits Wide supply voltage range from 1.65 V to 5.5 V Very low ON resistance: 7.5 (typical) at VCC = 2.7 V 6.5 (typical) at VCC = 3.3 V 6 (typical) at VCC = 5 V Switch current capability of 32 mA Break-before-make switching High noise immunity CMOS low power consumption TTL interface compatibility at 3.3 V Latch-up performance meets requirements of JESD 78 Class I ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Control input accepts voltages up to 5.5 V Multiple package options Specified from 40 C to +85 C and from 40 C to +125 C 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G3157GW 40 C to +125 C SC-88 plastic surface-mounted package; 6 leads SOT363 74LVC1G3157GV 40 C to +125 C SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457 74LVC1G3157GM 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1.45 0.5 mm SOT886 74LVC1G3157GF 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1 0.5 mm SOT891 74LVC1G3157GN 40 C to +125 C XSON6 extremely thin small outline package; no leads; 6 terminals; body 0.9 1.0 0.35 mm SOT1115 74LVC1G3157GS 40 C to +125 C XSON6 extremely thin small outline package; no leads; 6 terminals; body 1.0 1.0 0.35 mm SOT1202 4. Marking Table 2. Marking Type number Marking code[1] 74LVC1G3157GW YJ 74LVC1G3157GV YJ 74LVC1G3157GM YJ 74LVC1G3157GF YJ 74LVC1G3157GN YJ 74LVC1G3157GS YJ [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram Y1 S Z S 6 1 Y1 Z 4 Y0 3 Y0 001aac355 001aac354 Fig 1. Logic symbol 74LVC1G3157 Product data sheet Fig 2. Logic diagram All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 2 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 6. Pinning information 6.1 Pinning 74LVC1G3157 74LVC1G3157 Y1 1 6 S GND 2 5 VCC Y0 3 4 Z Y1 1 6 S GND 2 5 VCC Y0 3 4 Z Pin configuration SOT363 and SOT457 Pin configuration SOT886 1 6 S GND 2 5 VCC Y0 3 4 Z Transparent top view 001aac357 Fig 4. Y1 001aaf546 Transparent top view 001aac356 Fig 3. 74LVC1G3157 Fig 5. Pin configuration SOT891, SOT1115 and SOT1202 6.2 Pin description Table 3. Pin description Symbol Pin Description Y1 1 independent input or output GND 2 ground (0 V) Y0 3 independent input or output Z 4 common output or input VCC 5 supply voltage S 6 select input 7. Functional description Table 4. Function table[1] Input S Channel on L Y0 H Y1 [1] H = HIGH voltage level; L = LOW voltage level. 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 3 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions [1] VI input voltage IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V ISK switch clamping current VI < 0.5 V or VI > VCC + 0.5 V [2] Min Max Unit 0.5 +6.5 V 0.5 +6.5 V 50 - mA - 50 mA 0.5 VCC + 0.5 V VSW switch voltage enable and disable mode ISW switch current VSW > 0.5 V or VSW < VCC + 0.5 V - 50 mA ICC supply current - 100 mA IGND ground current 100 - mA Tstg storage temperature 65 +150 C - 250 mW total power dissipation Ptot Tamb = 40 C to +125 C [3] [1] The minimum input voltage rating may be exceeded if the input current rating is observed. [2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed. [3] For SC-88 and SC-74 packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter VCC supply voltage VI input voltage VSW Conditions switch voltage Tamb ambient temperature t/V input transition rise and fall rate Min Typ Max Unit 1.65 - 5.5 V 0 - 5.5 V 0 - VCC V enable and disable mode [1] 40 - +125 C VCC = 1.65 V to 2.7 V [2] - - 20 ns/V VCC = 2.7 V to 5.5 V [2] - - 10 ns/V [1] To avoid sinking GND current from terminal Z when switch current flows in terminal Yn, the voltage drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminal Z, no GND current will flow from terminal Yn. In this case, there is no limit for the voltage drop across the switch. [2] Applies to control signal levels. 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 4 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground 0 V). Symbol Parameter HIGH-level input voltage VIH 40 C to +85 C Conditions VCC = 1.65 V to 1.95 V LOW-level input voltage Min Max Min Unit Max 0.65VCC - - 0.65VCC - V VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - V VCC = 3 V to 3.6 V 2.0 - - 2.0 - V 0.7VCC - - 0.7VCC - V VCC = 4.5 V to 5.5 V VIL 40 C to +125 C Typ[1] VCC = 1.65 V to 1.95 V - - 0.35VCC - VCC = 2.3 V to 2.7 V - - 0.7 - 0.7 V VCC = 3 V to 3.6 V - - 0.8 - 0.8 V 0.3VCC V VCC = 4.5 V to 5.5 V 0.35VCC V - - 0.3VCC [2] - 0.1 2 - 10 A [2] - 0.1 5 - 20 A [2] - 0.1 5 - 20 A II input leakage current pin S; VI = 5.5 V or GND; VCC = 0 V to 5.5 V IS(OFF) OFF-state leakage current VCC = 5.5 V; see Figure 6 IS(ON) ON-state leakage current VCC = 5.5 V; see Figure 7 ICC supply current VI = 5.5 V or GND; VSW = GND or VCC; VCC = 1.65 V to 5.5 V [2] - 0.1 10 - 40 A ICC additional pin S; VI = VCC 0.6 V; supply current VCC = 5.5 V; VSW = GND or VCC [2] - 5 500 - 5000 A CI input capacitance - 2.5 - - - pF CS(OFF) OFF-state capacitance - 6.0 - - - pF CS(ON) ON-state capacitance - 18 - - - pF [1] Typical values are measured at Tamb = 25 C. [2] These typical values are measured at VCC = 3.3 V 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 5 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 10.1 Test circuits VCC VIL or VIH S Y0 1 Z Y1 2 switch switch S 1 VIH 2 VIL IS VI VO GND 001aac358 VI = VCC or GND and VO = GND or VCC. Fig 6. Test circuit for measuring OFF-state leakage current VCC VIL or VIH IS S Y0 1 Z Y1 2 switch S 1 VIH 2 VIL switch VI VO GND 001aac359 VI = VCC or GND and VO = open circuit. Fig 7. Test circuit for measuring ON-state leakage current 10.2 ON resistance Table 8. ON resistance At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Figure 9 to Figure 14. Symbol RON(peak) Parameter ON resistance (peak) 74LVC1G3157 Product data sheet 40 C to +85 C Conditions 40 C to +125 C Unit Min Typ[1] Max Min Max ISW = 4 mA; VCC = 1.65 V to 1.95 V - 34.0 130 - 195 ISW = 8 mA; VCC = 2.3 V to 2.7 V - 12.0 30 - 45 ISW = 12 mA; VCC = 2.7 V - 10.4 25 - 38 ISW = 24 mA; VCC = 3 V to 3.6 V - 7.8 20 - 30 ISW = 32 mA; VCC = 4.5 V to 5.5 V - 6.2 15 - 23 VI = GND to VCC; see Figure 8 All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 6 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer Table 8. ON resistance …continued At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Figure 9 to Figure 14. Symbol RON(rail) Parameter ON resistance (rail) 40 C to +85 C Conditions 40 C to +125 C Unit Min Typ[1] Max Min Max ISW = 4 mA; VCC = 1.65 V to 1.95 V - 8.2 18 - 27 ISW = 8 mA; VCC = 2.3 V to 2.7 V - 7.1 16 - 24 ISW = 12 mA; VCC = 2.7 V - 6.9 14 - 21 ISW = 24 mA; VCC = 3 V to 3.6 V - 6.5 12 - 18 ISW = 32 mA; VCC = 4.5 V to 5.5 V - 5.8 10 - 15 ISW = 4 mA; VCC = 1.65 V to 1.95 V - 10.4 30 - 45 ISW = 8 mA; VCC = 2.3 V to 2.7 V - 7.6 20 - 30 ISW = 12 mA; VCC = 2.7 V - 7.0 18 - 27 ISW = 24 mA; VCC = 3 V to 3.6 V - 6.1 15 - 23 - 4.9 10 - 15 - 26.0 - - - VI = GND; see Figure 8 VI = VCC; see Figure 8 ISW = 32 mA; VCC = 4.5 V to 5.5 V RON(flat) ON resistance (flatness) VI = GND to VCC [2] ISW = 4 mA; VCC = 1.65 V to 1.95 V ISW = 8 mA; VCC = 2.3 V to 2.7 V - 5.0 - - - ISW = 12 mA; VCC = 2.7 V - 3.5 - - - ISW = 24 mA; VCC = 3 V to 3.6 V - 2.0 - - - ISW = 32 mA; VCC = 4.5 V to 5.5 V - 1.5 - - - [1] Typical values are measured at Tamb = 25 C and nominal VCC. [2] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and temperature. 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 7 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 10.3 ON resistance test circuit and graphs mna673 40 RON (Ω) 30 VSW V switch VCC VIL or VIH S Y0 1 Z Y1 2 (1) S 1 VIL 2 VIH 20 switch (2) (3) 10 (4) (5) VI ISW GND 0 0 1 2 3 4 5 VI (V) 001aac360 RON = VSW / ISW. (1) VCC = 1.8 V. (2) VCC = 2.5 V. (3) VCC = 2.7 V. (4) VCC = 3.3 V. (5) VCC = 5.0 V. Fig 8. Test circuit for measuring ON resistance 001aaa712 55 RON (Ω) Fig 9. Typical ON resistance as a function of input voltage; Tamb = 25 C 001aaa708 15 RON (Ω) 45 13 35 11 (4) (3) (2) (1) (1) (2) 25 9 (3) (4) 15 7 5 5 0 0.4 0.8 1.2 1.6 2.0 0 0.5 VI (V) (1) Tamb = 125 C. (2) Tamb = 85 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (3) Tamb = 25 C. (4) Tamb = 40 C. (4) Tamb = 40 C. Fig 10. ON resistance as a function of input voltage; VCC = 1.8 V Product data sheet 1.5 2.0 2.5 VI (V) (1) Tamb = 125 C. 74LVC1G3157 1.0 Fig 11. ON resistance as a function of input voltage; VCC = 2.5 V All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 8 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 001aaa709 13 001aaa710 10 RON (Ω) RON (Ω) 11 8 (1) (1) 9 (2) (2) 6 (3) (3) 7 (4) (4) 5 4 0 0.5 1.0 1.5 2.0 2.5 3.0 VI (V) 0 1 2 3 4 VI (V) (1) Tamb = 125 C. (1) Tamb = 125 C. (2) Tamb = 85 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (3) Tamb = 25 C. (4) Tamb = 40 C. (4) Tamb = 40 C. Fig 12. ON resistance as a function of input voltage; VCC = 2.7 V Fig 13. ON resistance as a function of input voltage; VCC = 3.3 V 001aaa711 7 RON (Ω) 6 5 (1) (2) (3) 4 (4) 3 0 1 2 3 4 5 VI (V) (1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (4) Tamb = 40 C. Fig 14. ON resistance as a function of input voltage; VCC = 5.0 V 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 9 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 11. Dynamic characteristics Table 9. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 18. Symbol Parameter propagation delay tpd enable time ten 40 C to +85 C Conditions Min Max Min Max VCC = 1.65 V to 1.95 V - - 2 - 3.0 ns VCC = 2.3 V to 2.7 V - - 1.2 - 2.0 ns VCC = 2.7 V - - 1.0 - 1.5 ns VCC = 3 V to 3.6 V - - 0.8 - 1.5 ns VCC = 4.5 V to 5.5 V - - 0.6 - 1.0 ns 1.0 8.7 14 1.0 14.0 ns Z to Yn or Yn to Z; see Figure 15 S to Yn; see Figure 16 [2][3] [4] VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V 1.0 5.3 7.5 1.0 7.5 ns VCC = 2.7 V 1.0 4.9 6.0 1.0 6.0 ns VCC = 3 V to 3.6 V 0.5 4.0 5.5 0.5 5.5 ns 0.5 3.0 4.0 0.5 4.0 ns VCC = 1.65 V to 1.95 V 2.5 6.0 8.5 2.5 8.5 ns VCC = 2.3 V to 2.7 V 2.0 4.4 6.0 2.0 6.0 ns VCC = 2.7 V 1.5 4.2 5.0 1.5 5.0 ns VCC = 3 V to 3.6 V 1.5 3.6 4.5 1.5 4.5 ns VCC = 4.5 V to 5.5 V 0.8 2.9 3.5 0.8 3.5 ns 0.5 - - 0.5 - ns VCC = 4.5 V to 5.5 V disable time tdis break-before-make time tb-m 40 C to +125 C Unit Typ[1] S to Yn; see Figure 16 [5] [6] see Figure 17 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V 0.5 - - 0.5 - ns VCC = 2.7 V 0.5 - - 0.5 - ns VCC = 3 V to 3.6 V 0.5 - - 0.5 - ns VCC = 4.5 V to 5.5 V 0.5 - - 0.5 - ns [1] Typical values are measured at Tamb = 25 C and nominal VCC. [2] tpd is the same as tPLH and tPHL. [3] Propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified capacitance when driven by an ideal voltage source (zero output impedance). [4] ten is the same as tPZH and tPZL. [5] tdis is the same as tPLZ and tPHZ. [6] Break-before-make specified by design. 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 10 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 11.1 Waveforms and test circuits VI Yn or Z input VM VM GND tPLH tPHL VOH Z or Yn output VM VM VOL 001aac361 Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 15. Input (Yn or Z) to output (Z or Yn) propagation delays VI S input VM GND tPLZ tPZL VCC Yn output LOW to OFF OFF to LOW VM VX VOL tPZH tPHZ VOH Yn VY output HIGH to OFF OFF to HIGH VM GND switch enabled switch disabled switch enabled 001aac362 Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 16. Enable and disable times Table 10. Measurement points Supply voltage Input Output VCC VM VM VX VY 1.65 V to 5.5 V 0.5VCC 0.5VCC VOL + 0.3 V VOH 0.3 V 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 11 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 0.5VCC VCC VI G VO RL S Y0 Z Y1 CL GND 001aac367 a. Test circuit VI 0.5VI 0.9VO 0.9VO VO tb-m 001aag572 b. Input and output measurement points Fig 17. Test circuit for measuring break-before-make timing VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 11. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. VEXT = External voltage for measuring switching times. Fig 18. Test circuit for measuring switching times 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 12 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer Table 11. Test data Supply voltage Input Load VEXT VCC VI tr, tf CL RL tPLH, tPHL tPZH, tPHZ tPZL, tPLZ 1.65 V to 1.95 V VCC 2.0 ns 50 pF 500 open GND 2VCC 2.3 V to 2.7 V VCC 2.0 ns 50 pF 500 open GND 2VCC 2.7 V VCC 2.5 ns 50 pF 500 open GND 2VCC 3 V to 3.6 V VCC 2.5 ns 50 pF 500 open GND 2VCC 4.5 V to 5.5 V VCC 2.5 ns 50 pF 500 open GND 2VCC 11.2 Additional dynamic characteristics Table 12. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C. Symbol Parameter Conditions THD total harmonic distortion fi = 600 Hz to 20 kHz; RL = 600 ; CL = 50 pF; VI = 0.5 V (p-p); see Figure 19 f(-3dB) iso Qinj 3 dB frequency response isolation (OFF-state) charge injection 74LVC1G3157 Product data sheet Min Typ Max Unit VCC = 1.65 V - 0.260 - % VCC = 2.3 V - 0.078 - % VCC = 3.0 V - 0.078 - % VCC = 4.5 V - 0.078 - % VCC = 1.65 V - 200 - MHz VCC = 2.3 V - 300 - MHz VCC = 3.0 V - 300 - MHz VCC = 4.5 V - 300 - MHz VCC = 1.65 V - 42 - dB VCC = 2.3 V - 42 - dB VCC = 3.0 V - 40 - dB VCC = 4.5 V - 40 - dB VCC = 1.8 V - 3.3 - pC VCC = 2.5 V - 4.1 - pC VCC = 3.3 V - 5.0 - pC VCC = 4.5 V - 6.4 - pC VCC = 5.5 V - 7.5 - pC RL = 50 ; CL = 5 pF; see Figure 20 RL = 50 ; CL = 5 pF; fi = 10 MHz; see Figure 21 CL = 0.1 nF; Vgen = 0 V; Rgen = 0 ; fi = 1 MHz; RL = 1 M; see Figure 22 All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 13 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 11.3 Test circuits 0.5VCC VCC VIL or VIH 0.1 μF S Y0 1 Z Y1 2 S 1 VIL 2 VIH RL 10 μF switch D CL 600 Ω fi switch GND 001aac363 Fig 19. Test circuit for measuring total harmonic distortion 0.5VCC VCC VIL or VIH fi 0.1 μF S Y0 1 Z Y1 2 RL switch S 1 VIL 2 VIH switch dB CL 50 Ω GND 001aac364 Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads 3 dB. Fig 20. Test circuit for measuring the frequency response when switch is in ON-state 0.5VCC 0.5VCC VCC RL VIL or VIH fi 0.1 μF RL S Y0 1 Z Y1 2 switch S 1 VIH 2 VIL switch CL 50 Ω dB GND 001aac365 Adjust fi voltage to obtain 0 dBm level at input. Fig 21. Test circuit for measuring isolation (OFF-state) 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 14 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer VCC S Y0 1 Z Y1 2 switch Rgen VI G VO RL CL Vgen GND 001aac366 a. Test circuit logic (S) off input on VO off ΔVO 001aac478 b. Input and output pulse definitions Qinj = VO CL. VO = output voltage variation. Rgen = generator resistance. Vgen = generator voltage. Fig 22. Test circuit for measuring charge injection 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 15 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 12. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT363 JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 23. Package outline SOT363 (SC-88) 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 16 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer Plastic surface-mounted package (TSOP6); 6 leads D SOT457 E B y A HE 6 5 X v M A 4 Q pin 1 index A A1 c 1 2 3 Lp bp e w M B detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A1 bp c D E e HE Lp Q v w y 1.1 0.9 0.1 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT457 JEITA SC-74 EUROPEAN PROJECTION ISSUE DATE 05-11-07 06-03-16 Fig 24. Package outline SOT457 (SC-74) 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 17 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× (2) L L1 e 6 5 4 e1 e1 6× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 1.5 1.4 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 MO-252 Fig 25. Package outline SOT886 (XSON6) 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 18 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm 1 SOT891 b 3 2 4× (1) L L1 e 6 5 4 e1 e1 6× A (1) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 max b D E e e1 L L1 mm 0.5 0.04 0.20 0.12 1.05 0.95 1.05 0.95 0.55 0.35 0.35 0.27 0.40 0.32 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 SOT891 Fig 26. Package outline SOT891 (XSON6) 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 19 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm 1 SOT1115 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit A(1) A1 b D E e e1 max 0.35 0.04 0.20 0.95 1.05 nom 0.15 0.90 1.00 0.55 min 0.12 0.85 0.95 mm 1 mm 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1115_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-07 SOT1115 Fig 27. Package outline SOT1115 (XSON6) 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 20 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm 1 SOT1202 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.05 1.05 0.35 0.40 nom 0.15 1.00 1.00 0.55 0.35 0.30 0.35 min 0.12 0.95 0.95 0.27 0.32 mm Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1202_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-06 SOT1202 Fig 28. Package outline SOT1202 (XSON6) 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 21 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 13. Abbreviations Table 13. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor TTL Transistor-Transistor Logic HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model DUT Device Under Test 14. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC1G3157 v.4 20111206 Product data sheet - 74LVC1G3157 v.3 Modifications: • • Legal pages updated. Figure 17: Graphic b replaced. 74LVC1G3157 v.3 20100916 Product data sheet - 74LVC1G3157 v.2 74LVC1G3157 v.2 20070918 Product data sheet - 74LVC1G3157 v.1 74LVC1G3157 v.1 20050207 Product data sheet - - 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 22 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 23 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVC1G3157 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 24 of 25 74LVC1G3157 NXP Semiconductors 2-channel analog multiplexer/demultiplexer 17. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 10.1 10.2 10.3 11 11.1 11.2 11.3 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ON resistance test circuit and graphs. . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms and test circuits . . . . . . . . . . . . . . 11 Additional dynamic characteristics . . . . . . . . . 13 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Legal information. . . . . . . . . . . . . . . . . . . . . . . 23 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Contact information. . . . . . . . . . . . . . . . . . . . . 24 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 6 December 2011 Document identifier: 74LVC1G3157