LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 3 — 6 December 2011 Preliminary data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded applications. The ARM Cortex-M3 is a next generation core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. The LPC1850/30/20/10 operate at CPU frequencies of up to 180 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching. The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM, a quad SPI Flash Interface (SPIFI), a State Configurable Timer (SCT) subsystem, two High-speed USB controllers, Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals. Remark: This data sheet describes the Rev ‘-’ and the Rev ‘A’ versions of parts LPC1850/30/20/10. 2. Features and benefits Processor core ARM Cortex-M3 processor, running at frequencies of up to 180 MHz. ARM Cortex-M3 built-in Memory Protection Unit (MPU) supporting eight regions. ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC). Non-maskable Interrupt (NMI) input. JTAG and Serial Wire Debug, serial trace, eight breakpoints, and four watch points. Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support. System tick timer. On-chip memory 200 kB SRAM for code and data use. Multiple SRAM blocks with separate bus access. 64 kB ROM containing boot code and on-chip software drivers. 128 bit One-Time Programmable (OTP) memory for general-purpose use. Clock generation unit Crystal oscillator with an operating range of 1 MHz to 25 MHz. 12 MHz internal RC oscillator trimmed to 1 % accuracy over temperature and voltage. LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Ultra-low power RTC crystal oscillator. Three PLLs allow CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the third PLL can be used as audio PLL. Clock output. Configurable digital peripherals: State Configurable Timer (SCT) subsystem on AHB. Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and outputs to event driven peripherals like timers, SCT, and ADC0/1. Serial interfaces: Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to 40 MB per second. 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time stamping (IEEE 1588-2008 v2). One High-speed USB 2.0 Host/Device/OTG interface with DMA support and on-chip PHY. One High-speed USB 2.0 Host/Device interface with DMA support, on-chip full-speed PHY and ULPI interface to external high-speed PHY. USB interface electrical test software included in ROM USB stack. Four 550 UARTs with DMA support: one UART with full modem interface; one UART with IrDA interface; three USARTs support synchronous mode and a smart card interface conforming to ISO7816 specification. Two C_CAN 2.0B controllers with one channel each. Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA support. One Fast-mode Plus I2C-bus interface with monitor mode and with open-drain I/O pins conforming to the full I2C-bus specification. Supports data rates of up to 1 Mbit/s. One standard I2C-bus interface with monitor mode and standard I/O pins. Two I2S interfaces with DMA support, each with one input and one output. Digital peripherals: External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash, and SDRAM devices. LCD controller with DMA support and a programmable display resolution of up to 1024 H 768 V. Supports monochrome and color STN panels and TFT color panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel mapping. SD/MMC card interface. Eight-channel General-Purpose DMA (GPDMA) controller can access all memories on the AHB and all DMA-capable AHB slaves. Up to 164 General-Purpose Input/Output (GPIO) pins with configurable pull-up/pull-down resistors and open-drain modes. GPIO registers are located on the AHB for fast access. GPIO ports have DMA support. Up to 8 GPIO pins can be selected from all GPIO pins as edge and level sensitive interrupt sources. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 2 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Two GPIO group interrupt modules enable an interrupt based on a programmable pattern of input states of a group of GPIO pins. Four general-purpose timer/counters with capture and match capabilities. One motor control PWM for three-phase motor control. One Quadrature Encoder Interface (QEI). Repetitive Interrupt timer (RI timer). Windowed watchdog timer. Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes of battery powered backup registers. Alarm timer; can be battery powered. Analog peripherals: One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s. Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s. Security: Hardware-based AES security engine programmable through an on-chip API. Two 128-bit secure OTP memories for AES key storage and customer use. Unique ID for each device. Power: Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip internal voltage regulator for the core supply and the RTC power domain. RTC power domain can be powered separately by a 3 V battery supply. Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down. Processor wake-up from Sleep mode via wake-up interrupts from various peripherals. Wake-up from Deep-sleep, Power-down, and Deep power-down modes via external interrupts and interrupts generated by battery powered blocks in the RTC power domain. Brownout detect with four separate thresholds for interrupt and forced reset. Power-On Reset (POR). Available as 208-pin, 144-pin, and 100-pin LQFP packages and as 256-pin, 180-pin, and 100-pin BGA packages. 3. Applications Industrial Consumer White goods LPC1850_30_20_10 Preliminary data sheet RFID readers e-Metering All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 3 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 4. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC1850FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm SOT740-2 LPC1850FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3 LPC1850FBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1830FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm SOT740-2 LPC1830FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls LPC1830FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm LPC1830FBD144 LQFP144 LPC1820FET100 SOT570-3 SOT486-1 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1 LPC1820FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1 LPC1820FBD100 LQFP100 Plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm SOT407-1 LPC1810FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm LPC1810FBD144 LQFP144 SOT486-1 4.1 Ordering options Table 2. Ordering options Type number Total SRAM LCD Ethernet USB0 (Host, Device, OTG) USB1 ADC PWM (Host, channels Device)/ ULPI interface QEI GPIO Package LPC1850FET256 200 kB yes yes yes yes/yes 8 yes yes 164 LBGA256 LPC1850FET180 200 kB yes yes yes yes/yes 8 yes yes 118 TFBGA180 LPC1850FBD208 200 kB yes yes yes yes/yes 8 yes yes 142 LQFP208 LPC1830FET256 200 kB no yes yes yes/yes 8 yes yes 164 LBGA256 LPC1830FET180 200 kB no yes yes yes/yes 8 yes yes 118 TFBGA180 LPC1830FET100 200 kB no yes yes yes/no 4 no no 49 TFBGA100 LPC1830FBD144 200 kB no yes yes yes/no 8 yes no 83 LQFP144 LPC1820FET100 168 kB no no yes no 4 no no 49 TFBGA100 LPC1820FBD144 168 kB no no yes no 8 yes no 83 LQFP144 LPC1820FBD100 168 kB no no yes no 5 no no 49 LQFP100 LPC1810FET100 136 kB no no no no 4 no no 49 TFBGA100 LPC1810FBD144 136 kB no no no no 8 yes no 83 LQFP144 LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 4 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 5. Block diagram SWD/TRACE PORT/JTAG LPC1850/30/20/10 HIGH-SPEED PHY TEST/DEBUG INTERFACE ETHERNET(1) 10/100 MAC IEEE 1588 GPDMA ARM CORTEX-M3 HIGHSPEED USB0(1) HOST/ DEVICE/ OTG USB1(1) HOST/ DEVICE LCD(1) SD/ MMC system bus D-code bus I-code bus masters slaves AHB MULTILAYER MATRIX slaves SPIFI BRIDGE 0 BRIDGE 1 BRIDGE 2 BRIDGE 3 BRIDGE BRIDGE WWDT RI TIMER I2C1 CGU ALARM TIMER 64/96 kB LOCAL SRAM USART0 MOTOR CONTROL PWM(1) USART2 10-bit DAC CCU1 BACKUP REGISTERS 40 kB LOCAL SRAM UART1 I2C0 USART3 C_CAN0 CCU2 POWER MODE CONTROL 16/32 kB AHB SRAM SSP0 I2S0 TIMER2 10-bit ADC0 RGU 16 kB + 16 kB AHB SRAM(1) TIMER0 I2S1 CONFIGURATION REGISTERS TIMER3 10-bit ADC1 EVENT ROUTER AES TIMER1 C_CAN1 SSP1 OTP MEMORY HS GPIO EMC 64 kB ROM QEI(1) SCU RTC RTC OSC SCT GIMA GPIO interrupts 12 MHz IRC GPIO GROUP0 interrupt RTC POWER DOMAIN GPIO GROUP1 interrupt = connected to GPDMA 002aaf218 (1) Not available on all parts (see Table 2). Fig 1. LPC1850/30/20/10 block diagram LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 5 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 6. Pinning information 6.1 Pinning LPC1850/30FET256 ball A1 index area 2 1 4 3 6 5 8 7 10 9 12 11 14 13 LPC1850/30FET180 ball A1 index area 16 2 1 15 A 4 3 6 5 8 7 10 9 12 11 A B B C C D D E E F G F J H L K G H K J M L N M P N R P T 002aag365 002aaf230 Transparent top view Transparent top view Fig 2. 14 13 Pin configuration LBGA256 package Fig 3. ball A1 index area Pin configuration TFBGA180 package LPC1830/20/10FET100 1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K 002aag366 Transparent top view Fig 4. LPC1850_30_20_10 Preliminary data sheet Pin configuration TFBGA100 package All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 6 of 157 LPC1850/30/20/10 NXP Semiconductors 156 LPC1850FBD208 73 002aag367 Fig 6. 002aag368 Pin configuration LQFP144 package 100 Pin configuration LQFP208 package 72 36 37 53 Fig 5. 108 LPC1830/20/10FBD144 105 104 52 109 1 76 1 144 157 208 32-bit ARM Cortex-M3 microcontroller 1 75 LPC1820FBD100 Fig 7. 50 51 26 25 002aag369 Pin configuration LQFP100 package 6.2 Pin description On the LPC1850/30/20/10, digital pins are grouped into 16 ports, named P0 to P9 and PA to PF, with up to 20 pins used per port. Each digital pin can support up to eight different digital functions, including General Purpose I/O (GPIO), selectable through the SCU registers. The pin name is not indicative of the GPIO port assigned to it. Not all functions listed in Table 3 are available on all packages. See Table 2 for availability of USB0, USB1, Ethernet, and LCD functions. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 7 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP100[1] 32 22 Type LQFP144 47 Description [2] LQFP208[1] G2 Reset state TFBGA100 LBGA256 Symbol TFBGA180[1] Table 3. Pin description LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Multiplexed digital pins P0_0 P0_1 L3 M2 x x G1 50 34 23 [3] [3] I; PU I/O GPIO0[0] — General purpose digital input/output pin. I/O SSP1_MISO — Master In Slave Out for SSP1. I ENET_RXD1 — Ethernet receive data 1 (RMII/MII interface). - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I/O I2S1_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I; PU I/O GPIO0[1] — General purpose digital input/output pin. I/O SSP1_MOSI — Master Out Slave in for SSP1. I ENET_COL — Ethernet Collision detect (MII interface). - R — Function reserved. - R — Function reserved. - R — Function reserved. ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). P1_0 P2 LPC1850_30_20_10 Preliminary data sheet x H1 54 38 25 [3] I/O I2S1_TX_SDA — I2S1 transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. I; PU I/O GPIO0[4] — General purpose digital input/output pin. I CTIN_3 — SCT input 3. Capture input 1 of timer 1. I/O EMC_A5 — External memory address line 5. - R — Function reserved. - R — Function reserved. I/O SSP0_SSEL — Slave Select for SSP0. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 8 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P1_2 P1_3 LQFP208[1] LQFP144 LQFP100[1] x K2 58 42 28 R3 P5 LPC1850_30_20_10 Preliminary data sheet x x K1 J1 60 61 43 44 29 30 [3] [3] [3] Type TFBGA100 R2 Description [2] TFBGA180[1] P1_1 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO0[8] — General purpose digital input/output pin. Boot pin (see Table 5). O CTOUT_7 — SCT output 7. Match output 3 of timer 1. I/O EMC_A6 — External memory address line 6. - R — Function reserved. - R — Function reserved. I/O SSP0_MISO — Master In Slave Out for SSP0. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO0[9] — General purpose digital input/output pin. Boot pin (see Table 5). O CTOUT_6 — SCT output 6. Match output 2 of timer 1. I/O EMC_A7 — External memory address line 7. - R — Function reserved. - R — Function reserved. I/O SSP0_MOSI — Master Out Slave in for SSP0. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO0[10] — General purpose digital input/output pin. O CTOUT_8 — SCT output 8. Match output 0 of timer 2. - R — Function reserved. O EMC_OE — LOW active Output Enable signal. O USB0_IND1 — USB0 port indicator LED control output 1. I/O SSP1_MISO — Master In Slave Out for SSP1. - R — Function reserved. O SD_RST — SD/MMC reset signal for MMC4.4 card. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 9 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P1_5 P1_6 LQFP208[1] LQFP144 LQFP100[1] x J2 64 47 32 R5 T4 LPC1850_30_20_10 Preliminary data sheet x x J4 K4 65 67 48 49 33 34 [3] [3] [3] Type TFBGA100 T3 Description [2] TFBGA180[1] P1_4 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO0[11] — General purpose digital input/output pin. O CTOUT_9 — SCT output 9. Match output 1 of timer 2. - R — Function reserved. O EMC_BLS0 — LOW active Byte Lane select signal 0. O USB0_IND0 — USB0 port indicator LED control output 0. I/O SSP1_MOSI — Master Out Slave in for SSP1. - R — Function reserved. O SD_VOLT1 — SD/MMC bus voltage select output 1. I; PU I/O GPIO1[8] — General purpose digital input/output pin. O CTOUT_10 — SCT output 10. Match output 2 of timer 2. - R — Function reserved. O EMC_CS0 — LOW active Chip Select 0 signal. O USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). I/O SSP1_SSEL — Slave Select for SSP1. - R — Function reserved. O SD_POW — SD/MMC card power monitor output. I; PU I/O GPIO1[9] — General purpose digital input/output pin. I CTIN_5 — SCT input 5. Capture input 2 of timer 2. - R — Function reserved. O EMC_WE — LOW active Write Enable signal. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SD_CMD — SD/MMC command signal. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 10 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] x G4 69 50 35 [3] Type TFBGA100 T5 Description [2] TFBGA180[1] P1_7 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO1[0] — General purpose digital input/output pin. I U1_DSR — Data Set Ready input for UART1. O CTOUT_13 — SCT output 13. Match output 1 of timer 3. I/O EMC_D0 — External memory data line 0. O USB0_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that VBUS must be driven (active HIGH). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. P1_8 P1_9 R7 T7 LPC1850_30_20_10 Preliminary data sheet x x H5 J5 71 73 51 52 36 37 [3] [3] - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO1[1] — General purpose digital input/output pin. O U1_DTR — Data Terminal Ready output for UART1. O CTOUT_12 — SCT output 12. Match output 0 of timer 3. I/O EMC_D1 — External memory data line 1. - R — Function reserved. - R — Function reserved. - R — Function reserved. O SD_VOLT0 — SD/MMC bus voltage select output 0. I; PU I/O GPIO1[2] — General purpose digital input/output pin. O U1_RTS — Request to Send output for UART1. O CTOUT_11 — SCT output 11. Match output 3 of timer 2. I/O EMC_D2 — External memory data line 2. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SD_DAT0 — SD/MMC data bus line 0. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 11 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] x H6 75 53 38 [3] Type TFBGA100 R8 Description [2] TFBGA180[1] P1_10 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O U1_RI — Ring Indicator input for UART1. O CTOUT_14 — SCT output 14. Match output 2 of timer 3. I/O EMC_D3 — External memory data line 3. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O P1_11 P1_12 P1_13 T9 R9 R10 LPC1850_30_20_10 Preliminary data sheet x x x J7 K7 H8 77 78 83 55 56 60 39 40 41 [3] [3] [3] GPIO1[3] — General purpose digital input/output pin. I I; PU I/O SD_DAT1 — SD/MMC data bus line 1. GPIO1[4] — General purpose digital input/output pin. I U1_CTS — Clear to Send input for UART1. O CTOUT_15 — SCT output 15. Match output 3 of timer 3. I/O EMC_D4 — External memory data line 4. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SD_DAT2 — SD/MMC data bus line 2. I; PU I/O GPIO1[5] — General purpose digital input/output pin. I U1_DCD — Data Carrier Detect input for UART1. - R — Function reserved. I/O EMC_D5 — External memory data line 5. I T0_CAP1 — Capture input 1 of timer 0. - R — Function reserved. - R — Function reserved. I/O SD_DAT3 — SD/MMC data bus line 3. I; PU I/O GPIO1[6] — General purpose digital input/output pin. O U1_TXD — Transmitter output for UART1. - R — Function reserved. I/O EMC_D6 — External memory data line 6. I T0_CAP0 — Capture input 0 of timer 0. - R — Function reserved. - R — Function reserved. I SD_CD — SD/MMC card detect input. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 12 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P1_15 LQFP208[1] LQFP144 LQFP100[1] x J8 85 61 42 T12 x K8 87 62 43 [3] [3] Type TFBGA100 R11 Description [2] TFBGA180[1] P1_14 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O U1_RXD — Receiver input for UART1. - R — Function reserved. I/O EMC_D7 — External memory data line 7. O T0_MAT2 — Match output 2 of timer 0. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O P1_17 M7 M8 LPC1850_30_20_10 Preliminary data sheet x x H9 90 H10 93 64 66 44 45 [3] [4] GPIO0[2] — General purpose digital input/output pin. O U2_TXD — Transmitter output for USART2. - R — Function reserved. I ENET_RXD0 — Ethernet receive data 0 (RMII/MII interface). O T0_MAT1 — Match output 1 of timer 0. - R — Function reserved. - R — Function reserved. P1_16 GPIO1[7] — General purpose digital input/output pin. I I; PU I/O R — Function reserved. GPIO0[3] — General purpose digital input/output pin. I U2_RXD — Receiver input for USART2. - R — Function reserved. I ENET_CRS — Ethernet Carrier Sense (MII interface). O T0_MAT0 — Match output 0 of timer 0. - R — Function reserved. - R — Function reserved. I ENET_RX_DV — Ethernet Receive Data Valid (RMII/MII interface). I; PU I/O GPIO0[12] — General purpose digital input/output pin. I/O U2_UCLK — Serial clock input/output for USART2 in synchronous mode. - R — Function reserved. I/O ENET_MDIO — Ethernet MIIM data input and output. I T0_CAP3 — Capture input 3 of timer 0. O CAN1_TD — CAN1 transmitter output. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 13 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P1_19 P1_20 LQFP208[1] LQFP144 LQFP100[1] x J10 95 67 46 M11 M10 LPC1850_30_20_10 Preliminary data sheet x x K9 96 68 K10 100 70 47 48 [3] [3] [3] Type TFBGA100 N12 Description [2] TFBGA180[1] P1_18 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO0[13] — General purpose digital input/output pin. I/O U2_DIR — RS-485/EIA-485 output enable/direction control for USART2. - R — Function reserved. O ENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface). O T0_MAT3 — Match output 3 of timer 0. I CAN1_RD — CAN1 receiver input. - R — Function reserved. - R — Function reserved. I; PU I ENET_TX_CLK (ENET_REF_CLK) — Ethernet Transmit Clock (MII interface) or Ethernet Reference Clock (RMII interface). I/O SSP1_SCK — Serial clock for SSP1. - R — Function reserved. - R — Function reserved. O CLKOUT — Clock output pin. - R — Function reserved. O I2S0_RX_MCLK — I2S receive master clock. I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. I; PU I/O GPIO0[15] — General purpose digital input/output pin. I/O SSP1_SSEL — Slave Select for SSP1. - R — Function reserved. O ENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface). I T0_CAP2 — Capture input 2 of timer 0. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 14 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP100[1] G10 108 75 50 [3] Type LQFP144 x Description [2] TFBGA100 T16 LQFP208[1] TFBGA180[1] P2_0 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. O U0_TXD — Transmitter output for USART0. I/O EMC_A13 — External memory address line 13. O USB0_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that VBUS must be driven (active high). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. P2_1 N15 x G7 116 81 54 [3] I/O GPIO5[0] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP0 — Capture input 0 of timer 3. O ENET_MDC — Ethernet MIIM clock. I; PU I P2_2 M15 LPC1850_30_20_10 Preliminary data sheet x F5 121 84 56 [3] R — Function reserved. U0_RXD — Receiver input for USART0. I/O EMC_A12 — External memory address line 12. O USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). I/O GPIO5[1] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP1 — Capture input 1 of timer 3. - R — Function reserved. I; PU - R — Function reserved. I/O U0_UCLK — Serial clock input/output for USART0 in synchronous mode. I/O EMC_A11 — External memory address line 11. O USB0_IND1 — USB0 port indicator LED control output 1. I/O GPIO5[2] — General purpose digital input/output pin. I CTIN_6 — SCT input 6. Capture input 1 of timer 3. I T3_CAP2 — Capture input 2 of timer 3. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 15 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] x D8 127 87 57 [4] Type TFBGA100 J12 Description [2] TFBGA180[1] P2_3 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I/O I2C1_SDA — I2C1 data input/output (this pin does not use a specialized I2C pad). O U3_TXD — Transmitter output for USART3. I CTIN_1 — SCT input 1. Capture input 1 of timer 0. Capture input 1 of timer 2. I/O GPIO5[3] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT0 — Match output 0 of timer 3. O USB0_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that VBUS must be driven (active HIGH). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. P2_4 P2_5 K11 K14 x x D9 128 88 D10 131 91 58 61 [4] [4] I; PU - R — Function reserved. I/O I2C1_SCL — I2C1 clock input/output (this pin does not use a specialized I2C pad). I U3_RXD — Receiver input for USART3. I CTIN_0 — SCT input 0. Capture input 0 of timer 0, 1, 2, 3. I/O GPIO5[4] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT1 — Match output 1 of timer 3. O USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). I; PU - R — Function reserved. I CTIN_2 — SCT input 2. Capture input 2 of timer 0. I USB1_VBUS — Monitors the presence of USB1 bus power. Note: This signal must be HIGH for USB reset to occur. LPC1850_30_20_10 Preliminary data sheet I ADCTRIG1 — ADC trigger input 1. I/O GPIO5[5] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT2 — Match output 2 of timer 3. O USB0_IND0 — USB0 port indicator LED control output 0. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 16 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P2_7 P2_8 LQFP208[1] LQFP144 LQFP100[1] x G9 137 95 64 H14 J16 LPC1850_30_20_10 Preliminary data sheet x x C10 138 96 C6 140 98 65 67 [3] [3] [3] Type TFBGA100 K16 Description [2] TFBGA180[1] P2_6 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I/O U0_DIR — RS-485/EIA-485 output enable/direction control for USART0. I/O EMC_A10 — External memory address line 10. O USB0_IND0 — USB0 port indicator LED control output 0. I/O GPIO5[6] — General purpose digital input/output pin. I CTIN_7 — SCT input 7. I T3_CAP3 — Capture input 3 of timer 3. - R — Function reserved. I; PU I/O GPIO0[7] — General purpose digital input/output pin. ISP entry pin. If this pin is pulled LOW at reset, the part enters ISP mode using USART0. O CTOUT_1 — SCT output 1. Match output 1 of timer 0. I/O U3_UCLK — Serial clock input/output for USART3 in synchronous mode. I/O EMC_A9 — External memory address line 9. - R — Function reserved. - R — Function reserved. O T3_MAT3 — Match output 3 of timer 3. - R — Function reserved. I; PU - R — Function reserved. Boot pin (see Table 5) O CTOUT_0 — SCT output 0. Match output 0 of timer 0. I/O U3_DIR — RS-485/EIA-485 output enable/direction control for USART3. I/O EMC_A8 — External memory address line 8. I/O GPIO5[7] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 17 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P2_10 P2_11 G16 F16 LPC1850_30_20_10 Preliminary data sheet x x E8 A9 146 104 71 148 105 72 [3] [3] [3] Type Description [2] B10 144 102 70 LQFP100[1] x LQFP144 TFBGA100 H16 LQFP208[1] TFBGA180[1] P2_9 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO1[10] — General purpose digital input/output pin. Boot pin (see Table 5). O CTOUT_3 — SCT output 3. Match output 3 of timer 0. I/O U3_BAUD — Baud pin for USART3. I/O EMC_A0 — External memory address line 0. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO0[14] — General purpose digital input/output pin. O CTOUT_2 — SCT output 2. Match output 2 of timer 0. O U2_TXD — Transmitter output for USART2. I/O EMC_A1 — External memory address line 1. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO1[11] — General purpose digital input/output pin. O CTOUT_5 — SCT output 5. Match output 1 of timer 1. I U2_RXD — Receiver input for USART2. I/O EMC_A2 — External memory address line 2. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 18 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P2_13 P3_0 153 106 73 C16 F13 LPC1850_30_20_10 Preliminary data sheet x x A10 156 108 75 A8 161 112 78 [3] [3] [3] Type B9 Description [2] LQFP208[1] x LQFP100[1] TFBGA100 E15 LQFP144 TFBGA180[1] P2_12 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO1[12] — General purpose digital input/output pin. O CTOUT_4 — SCT output 4. Match output 0 of timer 1. - R — Function reserved. I/O EMC_A3 — External memory address line 3. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O U2_UCLK — Serial clock input/output for USART2 in synchronous mode. I; PU I/O GPIO1[13] — General purpose digital input/output pin. I CTIN_4 — SCT input 4. Capture input 2 of timer 1. - R — Function reserved. I/O EMC_A4 — External memory address line 4. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O U2_DIR — RS-485/EIA-485 output enable/direction control for USART2. I; PU I/O I2S0_RX_SCK — I2S receive clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. O I2S0_RX_MCLK — I2S receive master clock. I/O I2S0_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. O I2S0_TX_MCLK — I2S transmit master clock. I/O SSP0_SCK — Serial clock for SSP0. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 19 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 163 114 79 [3] Type F7 Description [2] LQFP208[1] x LQFP100[1] TFBGA100 G11 LQFP144 TFBGA180[1] P3_1 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I/O I2S0_RX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I CAN0_RD — CAN receiver input. O USB1_IND1 — USB1 Port indicator LED control output 1. I/O GPIO5[8] — General purpose digital input/output pin. - R — Function reserved. O LCD_VD15 — LCD data. P3_2 P3_3 F11 B14 LPC1850_30_20_10 Preliminary data sheet x x G6 A7 166 116 169 118 80 81 [3] [5] R — Function reserved. I; PU I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. I/O I2S0_RX_SDA — I2S receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. O CAN0_TD — CAN transmitter output. O USB1_IND0 — USB1 Port indicator LED control output 0. I/O GPIO5[9] — General purpose digital input/output pin. - R — Function reserved. O LCD_VD14 — LCD data. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. I/O SSP0_SCK — Serial clock for SSP0. O SPIFI_SCK — Serial clock for SPIFI. O CGU_OUT1 — CGU spare clock output 1. - R — Function reserved. O I2S0_TX_MCLK — I2S transmit master clock. I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 20 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P3_5 P3_6 171 119 C12 B13 LPC1850_30_20_10 Preliminary data sheet x x B7 C7 82 173 121 84 174 122 85 [3] [3] [3] Type B8 Description [2] LQFP208[1] x LQFP100[1] TFBGA100 A15 LQFP144 TFBGA180[1] P3_4 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO1[14] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SPIFI_SIO3 — I/O lane 3 for SPIFI. O U1_TXD — Transmitter output for UART1. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I/O I2S1_RX_SDA — I2S1 receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. O LCD_VD13 — LCD data. I; PU I/O GPIO1[15] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SPIFI_SIO2 — I/O lane 2 for SPIFI. I U1_RXD — Receiver input for UART1. I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. I/O I2S1_RX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. O LCD_VD12 — LCD data. I; PU I/O GPIO0[6] — General purpose digital input/output pin. - R — Function reserved. I/O SSP0_SSEL — Slave Select for SSP0. I/O SPIFI_MISO — Input 1 in SPIFI quad mode; SPIFI output IO1. - R — Function reserved. I/O SSP0_MISO — Master In Slave Out for SSP0. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 21 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P3_8 P4_0 P4_1 176 123 86 C10 D5 A1 LPC1850_30_20_10 Preliminary data sheet x x x E7 - - 179 124 87 1 3 1 3 - - [3] [3] [3] [6] Type D7 Description [2] LQFP208[1] x LQFP100[1] TFBGA100 C11 LQFP144 TFBGA180[1] P3_7 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. - R — Function reserved. I/O SSP0_MISO — Master In Slave Out for SSP0. I/O SPIFI_MOSI — Input 0 in SPIFI quad mode; SPIFI output IO0. I/O GPIO5[10] — General purpose digital input/output pin. I/O SSP0_MOSI — Master Out Slave in for SSP0. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. I/O SSP0_MOSI — Master Out Slave in for SSP0. I/O SPIFI_CS — SPIFI serial flash chip select. I/O GPIO5[11] — General purpose digital input/output pin. I/O SSP0_SSEL — Slave Select for SSP0. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO2[0] — General purpose digital input/output pin. O MCOA0 — Motor control PWM channel 0, output A. I NMI — External interrupt input to NMI. - R — Function reserved. - R — Function reserved. O LCD_VD13 — LCD data. I/O U3_UCLK — Serial clock input/output for USART3 in synchronous mode. - R — Function reserved. I; PU I/O GPIO2[1] — General purpose digital input/output pin. O CTOUT_1 — SCT output 1. Match output 1 of timer 0. O LCD_VD0 — LCD data. - R — Function reserved. - R — Function reserved. O LCD_VD19 — LCD data. O U3_TXD — Transmitter output for USART3. I ENET_COL — Ethernet Collision detect (MII interface). I ADC0_1 — ADC0, input channel 1. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 22 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] x - 12 8 - [3] Type TFBGA100 D3 Description [2] TFBGA180[1] P4_2 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O CTOUT_0 — SCT output 0. Match output 0 of timer 0. O LCD_VD3 — LCD data. - R — Function reserved. - R — Function reserved. O LCD_VD12 — LCD data. I U3_RXD — Receiver input for USART3. P4_3 P4_4 C2 B1 LPC1850_30_20_10 Preliminary data sheet x x - - 10 14 7 9 - - [6] [6] GPIO2[2] — General purpose digital input/output pin. O I; PU I/O R — Function reserved. GPIO2[3] — General purpose digital input/output pin. O CTOUT_3 — SCT output 3. Match output 3 of timer 0. O LCD_VD2 — LCD data. - R — Function reserved. - R — Function reserved. O LCD_VD21 — LCD data. I/O U3_BAUD — Baud pin USART3. - R — Function reserved. I ADC0_0 — ADC0, input channel 0. I; PU I/O GPIO2[4] — General purpose digital input/output pin. O CTOUT_2 — SCT output 2. Match output 2 of timer 0. O LCD_VD1 — LCD data. - R — Function reserved. - R — Function reserved. O LCD_VD20 — LCD data. I/O U3_DIR — RS-485/EIA-485 output enable/direction control for USART3. - R — Function reserved. O DAC — DAC output. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 23 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P4_6 P4_7 LQFP208[1] LQFP144 LQFP100[1] x - 15 10 - C1 H4 LPC1850_30_20_10 Preliminary data sheet x x - - 17 21 11 14 - - [3] [3] [3] Type TFBGA100 D2 Description [2] TFBGA180[1] P4_5 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O CTOUT_5 — SCT output 5. Match output 1 of timer 1. O LCD_FP — Frame pulse (STN). Vertical synchronization pulse (TFT). - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O O; PU GPIO2[5] — General purpose digital input/output pin. O GPIO2[6] — General purpose digital input/output pin. O CTOUT_4 — SCT output 4. Match output 0 of timer 1. O LCD_ENAB/LCDM — STN AC bias drive or TFT data enable input. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_DCLK — LCD panel clock. I GP_CLKIN — General purpose clock input to the CGU. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. I/O I2S0_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 24 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P4_9 P4_10 P5_0 LQFP208[1] LQFP144 LQFP100[1] x - 23 15 - L2 M3 N3 LPC1850_30_20_10 Preliminary data sheet x x x - - - 48 51 53 33 35 37 - - - [3] [3] [3] [3] Type TFBGA100 E2 Description [2] TFBGA180[1] P4_8 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I CTIN_5 — SCT input 5. Capture input 2 of timer 2. O LCD_VD9 — LCD data. - R — Function reserved. I/O GPIO5[12] — General purpose digital input/output pin. O LCD_VD22 — LCD data. O CAN1_TD — CAN1 transmitter output. - R — Function reserved. I; PU - R — Function reserved. I CTIN_6 — SCT input 6. Capture input 1 of timer 3. O LCD_VD11 — LCD data. - R — Function reserved. I/O GPIO5[13] — General purpose digital input/output pin. O LCD_VD15 — LCD data. I CAN1_RD — CAN1 receiver input. - R — Function reserved. I; PU - R — Function reserved. I CTIN_2 — SCT input 2. Capture input 2 of timer 0. O LCD_VD10 — LCD data. - R — Function reserved. I/O GPIO5[14] — General purpose digital input/output pin. O LCD_VD14 — LCD data. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO2[9] — General purpose digital input/output pin. O MCOB2 — Motor control PWM channel 2, output B. I/O EMC_D12 — External memory data line 12. - R — Function reserved. I U1_DSR — Data Set Ready input for UART1. I T1_CAP0 — Capture input 0 of timer 1. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 25 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P5_2 P5_3 LQFP208[1] LQFP144 LQFP100[1] x - 55 39 - R4 T8 LPC1850_30_20_10 Preliminary data sheet x x - - 63 76 46 54 - - [3] [3] [3] Type TFBGA100 P3 Description [2] TFBGA180[1] P5_1 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO2[10] — General purpose digital input/output pin. I MCI2 — Motor control PWM channel 2, input. I/O EMC_D13 — External memory data line 13. - R — Function reserved. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I T1_CAP1 — Capture input 1 of timer 1. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO2[11] — General purpose digital input/output pin. I MCI1 — Motor control PWM channel 1, input. I/O EMC_D14 — External memory data line 14. - R — Function reserved. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I T1_CAP2 — Capture input 2 of timer 1. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO2[12] — General purpose digital input/output pin. I MCI0 — Motor control PWM channel 0, input. I/O EMC_D15 — External memory data line 15. - R — Function reserved. I U1_RI — Ring Indicator input for UART1. I T1_CAP3 — Capture input 3 of timer 1. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 26 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P5_5 P5_6 P5_7 LQFP208[1] LQFP144 LQFP100[1] x - 80 57 - P10 T13 R12 LPC1850_30_20_10 Preliminary data sheet x x x - - - 81 89 91 58 63 65 - - - [3] [3] [3] [3] Type TFBGA100 P9 Description [2] TFBGA180[1] P5_4 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO2[13] — General purpose digital input/output pin. O MCOB0 — Motor control PWM channel 0, output B. I/O EMC_D8 — External memory data line 8. - R — Function reserved. I U1_CTS — Clear to Send input for UART1. O T1_MAT0 — Match output 0 of timer 1. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO2[14] — General purpose digital input/output pin. O MCOA1 — Motor control PWM channel 1, output A. I/O EMC_D9 — External memory data line 9. - R — Function reserved. I U1_DCD — Data Carrier Detect input for UART1. O T1_MAT1 — Match output 1 of timer 1. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO2[15] — General purpose digital input/output pin. O MCOB1 — Motor control PWM channel 1, output B. I/O EMC_D10 — External memory data line 10. - R — Function reserved. O U1_TXD — Transmitter output for UART1. O T1_MAT2 — Match output 2 of timer 1. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO2[7] — General purpose digital input/output pin. O MCOA2 — Motor control PWM channel 2, output A. I/O EMC_D11 — External memory data line 11. - R — Function reserved. I U1_RXD — Receiver input for UART1. O T1_MAT3 — Match output 3 of timer 1. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 27 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P6_1 P6_2 105 73 R15 L13 LPC1850_30_20_10 Preliminary data sheet x x G5 J9 107 74 111 78 - - - [3] [3] [3] Type H7 Description [2] LQFP208[1] x LQFP100[1] TFBGA100 M12 LQFP144 TFBGA180[1] P6_0 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. O I2S0_RX_MCLK — I2S receive master clock. - R — Function reserved. - R — Function reserved. I/O I2S0_RX_SCK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO3[0] — General purpose digital input/output pin. O EMC_DYCS1 — SDRAM chip select 1. I/O U0_UCLK — Serial clock input/output for USART0 in synchronous mode. I/O I2S0_RX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. - R — Function reserved. I T2_CAP0 — Capture input 2 of timer 2. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO3[1] — General purpose digital input/output pin. O EMC_CKEOUT1 — SDRAM clock enable 1. I/O U0_DIR — RS-485/EIA-485 output enable/direction control for USART0. I/O I2S0_RX_SDA — I2S Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. - R — Function reserved. I T2_CAP1 — Capture input 1 of timer 2. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 28 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] x - 113 79 - [3] Type TFBGA100 P15 Description [2] TFBGA180[1] P6_3 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O O GPIO3[2] — General purpose digital input/output pin. USB0_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that the VBUS signal must be driven (active HIGH). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. P6_4 P6_5 R16 P16 LPC1850_30_20_10 Preliminary data sheet x x F6 F9 114 117 80 82 53 55 [3] [3] - R — Function reserved. O EMC_CS1 — LOW active Chip Select 1 signal. - R — Function reserved. I T2_CAP2 — Capture input 2 of timer 2. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO3[3] — General purpose digital input/output pin. I CTIN_6 — SCT input 6. Capture input 1 of timer 3. O U0_TXD — Transmitter output for USART0. O EMC_CAS — LOW active SDRAM Column Address Strobe. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO3[4] — General purpose digital input/output pin. O CTOUT_6 — SCT output 6. Match output 2 of timer 1. I U0_RXD — Receiver input for USART0. O EMC_RAS — LOW active SDRAM Row Address Strobe. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 29 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P6_7 P6_8 LQFP208[1] LQFP144 LQFP100[1] x - 119 83 - J13 H13 LPC1850_30_20_10 Preliminary data sheet x x - - 123 85 125 86 - - [3] [3] [3] Type TFBGA100 L14 Description [2] TFBGA180[1] P6_6 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO0[5] — General purpose digital input/output pin. O EMC_BLS1 — LOW active Byte Lane select signal 1. - R — Function reserved. O USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). - R — Function reserved. I T2_CAP3 — Capture input 3 of timer 2. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I/O EMC_A15 — External memory address line 15. - R — Function reserved. O USB0_IND1 — USB0 port indicator LED control output 1. I/O GPIO5[15] — General purpose digital input/output pin. O T2_MAT0 — Match output 0 of timer 2. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I/O EMC_A14 — External memory address line 14. - R — Function reserved. O USB0_IND0 — USB0 port indicator LED control output 0. I/O GPIO5[16] — General purpose digital input/output pin. O T2_MAT1 — Match output 1 of timer 2. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 30 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P6_10 P6_11 P6_12 LQFP208[1] LQFP144 LQFP100[1] x F8 139 97 66 H15 H12 G15 LPC1850_30_20_10 Preliminary data sheet x x x - C9 - [3] 142 100 - 143 101 69 145 103 - [3] [3] [3] Type TFBGA100 J15 Description [2] TFBGA180[1] P6_9 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO3[5] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O EMC_DYCS0 — SDRAM chip select 0. - R — Function reserved. O T2_MAT2 — Match output 2 of timer 2. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO3[6] — General purpose digital input/output pin. O MCABORT — Motor control PWM, LOW-active fast abort. - R — Function reserved. O EMC_DQMOUT1 — Data mask 1 used with SDRAM and static devices. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO3[7] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O EMC_CKEOUT0 — SDRAM clock enable 0. - R — Function reserved. O T2_MAT3 — Match output 3 of timer 2. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO2[8] — General purpose digital input/output pin. O CTOUT_7 — SCT output 7. Match output 3 of timer 1. - R — Function reserved. O EMC_DQMOUT0 — Data mask 0 used with SDRAM and static devices. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 31 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 158 110 - [3] Type - Description [2] LQFP208[1] x LQFP100[1] TFBGA100 B16 LQFP144 TFBGA180[1] P7_0 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O CTOUT_14 — SCT output 14. Match output 2 of timer 3. - R — Function reserved. O LCD_LE — Line end signal. - R — Function reserved. - R — Function reserved. - R — Function reserved. P7_1 P7_2 C14 A16 LPC1850_30_20_10 Preliminary data sheet x x - - 162 113 165 115 - - [3] [3] GPIO3[8] — General purpose digital input/output pin. O I; PU I/O R — Function reserved. GPIO3[9] — General purpose digital input/output pin. O CTOUT_15 — SCT output 15. Match output 3 of timer 3. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. O LCD_VD19 — LCD data. O LCD_VD7 — LCD data. - R — Function reserved. O U2_TXD — Transmitter output for USART2. - R — Function reserved. I; PU I/O GPIO3[10] — General purpose digital input/output pin. I CTIN_4 — SCT input 4. Capture input 2 of timer 1. I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. O LCD_VD18 — LCD data. O LCD_VD6 — LCD data. - R — Function reserved. I U2_RXD — Receiver input for USART2. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 32 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P7_4 P7_5 167 117 C8 A7 LPC1850_30_20_10 Preliminary data sheet x x - - - 189 132 - 191 133 - [3] [6] [6] Type - Description [2] LQFP208[1] x LQFP100[1] TFBGA100 C13 LQFP144 TFBGA180[1] P7_3 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO3[11] — General purpose digital input/output pin. I CTIN_3 — SCT input 3. Capture input 1 of timer 1. - R — Function reserved. O LCD_VD17 — LCD data. O LCD_VD5 — LCD data. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO3[12] — General purpose digital input/output pin. O CTOUT_13 — SCT output 13. Match output 1 of timer 3. - R — Function reserved. O LCD_VD16 — LCD data. O LCD_VD4 — LCD data. O TRACEDATA[0] — Trace data, bit 0. - R — Function reserved. - R — Function reserved. I ADC0_4 — ADC0, input channel 4. I; PU I/O GPIO3[13] — General purpose digital input/output pin. O CTOUT_12 — SCT output 12. Match output 0 of timer 3. - R — Function reserved. O LCD_VD8 — LCD data. O LCD_VD23 — LCD data. O TRACEDATA[1] — Trace data, bit 1. - R — Function reserved. - R — Function reserved. I ADC0_3 — ADC0, input channel 3. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 33 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P7_7 P8_0 194 134 - B6 E5 LPC1850_30_20_10 Preliminary data sheet x x - - 201 140 - 2 - - [3] [6] [4] Type - Description [2] LQFP208[1] x LQFP100[1] TFBGA100 C7 LQFP144 TFBGA180[1] P7_6 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO3[14] — General purpose digital input/output pin. O CTOUT_11 — SCT output 1. Match output 3 of timer 2. - R — Function reserved. O LCD_LP — Line synchronization pulse (STN). Horizontal synchronization pulse (TFT). - R — Function reserved. O TRACEDATA[2] — Trace data, bit 2. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO3[15] — General purpose digital input/output pin. O CTOUT_8 — SCT output 8. Match output 0 of timer 2. - R — Function reserved. O LCD_PWR — LCD panel power enable. - R — Function reserved. O TRACEDATA[3] — Trace data, bit 3. O ENET_MDC — Ethernet MIIM clock. - R — Function reserved. I ADC1_6 — ADC1, input channel 6. I; PU I/O GPIO4[0] — General purpose digital input/output pin. O USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). - R — Function reserved. I MCI2 — Motor control PWM channel 2, input. - R — Function reserved. - R — Function reserved. - R — Function reserved. O T0_MAT0 — Match output 0 of timer 0. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 34 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] x - 34 - - [4] Type TFBGA100 H5 Description [2] TFBGA180[1] P8_1 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O USB0_IND1 — USB0 port indicator LED control output 1. - R — Function reserved. I MCI1 — Motor control PWM channel 1, input. - R — Function reserved. - R — Function reserved. - R — Function reserved. O P8_2 P8_3 P8_4 K4 J3 J2 LPC1850_30_20_10 Preliminary data sheet x x x - - - 36 37 39 - - - - - - [4] [3] [3] GPIO4[1] — General purpose digital input/output pin. O I; PU I/O T0_MAT1 — Match output 1 of timer 0. GPIO4[2] — General purpose digital input/output pin. O USB0_IND0 — USB0 port indicator LED control output 0. - R — Function reserved. I MCI0 — Motor control PWM channel 0, input. - R — Function reserved. - R — Function reserved. - R — Function reserved. O T0_MAT2 — Match output 2 of timer 0. I; PU I/O GPIO4[3] — General purpose digital input/output pin. I/O USB1_ULPI_D2 — ULPI link bidirectional data line 2. - R — Function reserved. O LCD_VD12 — LCD data. O LCD_VD19 — LCD data. - R — Function reserved. - R — Function reserved. O T0_MAT3 — Match output 3 of timer 0. I; PU I/O GPIO4[4] — General purpose digital input/output pin. I/O USB1_ULPI_D1 — ULPI link bidirectional data line 1. - R — Function reserved. O LCD_VD7 — LCD data. O LCD_VD16 — LCD data. - R — Function reserved. - R — Function reserved. I T0_CAP0 — Capture input 0 of timer 0. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 35 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] x - 40 - - [3] Type TFBGA100 J1 Description [2] TFBGA180[1] P8_5 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0. - R — Function reserved. O LCD_VD6 — LCD data. O LCD_VD8 — LCD data. - R — Function reserved. - R — Function reserved. I P8_6 P8_7 P8_8 K3 K1 L1 LPC1850_30_20_10 Preliminary data sheet x x x - - - 43 45 49 - - - - - - [3] [3] [3] GPIO4[5] — General purpose digital input/output pin. I/O I; PU I/O T0_CAP1 — Capture input 1 of timer 0. GPIO4[6] — General purpose digital input/output pin. I USB1_ULPI_NXT — ULPI link NXT signal. Data flow control signal from the PHY. - R — Function reserved. O LCD_VD5 — LCD data. O LCD_LP — Line synchronization pulse (STN). Horizontal synchronization pulse (TFT). - R — Function reserved. - R — Function reserved. I T0_CAP2 — Capture input 2 of timer 0. I; PU I/O GPIO4[7] — General purpose digital input/output pin. O USB1_ULPI_STP — ULPI link STP signal. Asserted to end or interrupt transfers to the PHY. - R — Function reserved. O LCD_VD4 — LCD data. O LCD_PWR — LCD panel power enable. - R — Function reserved. - R — Function reserved. I T0_CAP3 — Capture input 3 of timer 0. I; PU - R — Function reserved. I USB1_ULPI_CLK — ULPI link CLK signal. 60 MHz clock generated by the PHY. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O CGU_OUT0 — CGU spare clock output 0. O I2S1_TX_MCLK — I2S1 transmit master clock. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 36 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P9_1 P9_2 LQFP208[1] LQFP144 LQFP100[1] x - 59 - - N6 N8 LPC1850_30_20_10 Preliminary data sheet x x - - 66 70 - - - - [3] [3] [3] Type TFBGA100 T1 Description [2] TFBGA180[1] P9_0 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO4[12] — General purpose digital input/output pin. O MCABORT — Motor control PWM, LOW-active fast abort. - R — Function reserved. - R — Function reserved. - R — Function reserved. I ENET_CRS — Ethernet Carrier Sense (MII interface). - R — Function reserved. I/O SSP0_SSEL — Slave Select for SSP0. I; PU I/O GPIO4[13] — General purpose digital input/output pin. O MCOA2 — Motor control PWM channel 2, output A. - R — Function reserved. - R — Function reserved. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I ENET_RX_ER — Ethernet receive error (MII interface). - R — Function reserved. I/O SSP0_MISO — Master In Slave Out for SSP0. I; PU I/O GPIO4[14] — General purpose digital input/output pin. O MCOB2 — Motor control PWM channel 2, output B. - R — Function reserved. - R — Function reserved. I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. I ENET_RXD3 — Ethernet receive data 3 (MII interface). - R — Function reserved. I/O SSP0_MOSI — Master Out Slave in for SSP0. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 37 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller P9_4 P9_5 LQFP208[1] LQFP144 LQFP100[1] x - 79 - - N10 M9 x x - - 92 98 - 69 - - [3] [3] [3] Type TFBGA100 M6 Description [2] TFBGA180[1] P9_3 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO4[15] — General purpose digital input/output pin. O MCOA0 — Motor control PWM channel 0, output A. O USB1_IND1 — USB1 Port indicator LED control output 1. - R — Function reserved. - R — Function reserved. I ENET_RXD2 — Ethernet receive data 2 (MII interface). - R — Function reserved. O U3_TXD — Transmitter output for USART3. I; PU - R — Function reserved. O MCOB0 — Motor control PWM channel 0, output B. O USB1_IND0 — USB1 Port indicator LED control output 0. - R — Function reserved. I/O GPIO5[17] — General purpose digital input/output pin. O ENET_TXD2 — Ethernet transmit data 2 (MII interface). - R — Function reserved. I U3_RXD — Receiver input for USART3. I; PU - R — Function reserved. O MCOA1 — Motor control PWM channel 1, output A. O USB1_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that VBUS must be driven (active HIGH). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. LPC1850_30_20_10 Preliminary data sheet - R — Function reserved. I/O GPIO5[18] — General purpose digital input/output pin. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). - R — Function reserved. O U0_TXD — Transmitter output for USART0. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 38 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PA_0 103 72 L12 x - 126 - - - [3] [3] Type - Description [2] LQFP208[1] x LQFP100[1] TFBGA100 L11 LQFP144 TFBGA180[1] P9_6 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O O MCOB1 — Motor control PWM channel 1, output B. O USB1_PWR_FAULT — USB1 Port power fault signal indicating over-current condition; this signal monitors over-current on the USB1 bus (external circuitry required to detect over-current condition). - R — Function reserved. - R — Function reserved. I ENET_COL — Ethernet Collision detect (MII interface). - R — Function reserved. I U0_RXD — Receiver input for USART0. I; PU - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O I2S1_RX_MCLK — I2S1 receive master clock. O CGU_OUT1 — CGU spare clock output 1. PA_1 PA_2 J14 K15 LPC1850_30_20_10 Preliminary data sheet x x - - 134 - 136 - - - [4] [4] GPIO4[11] — General purpose digital input/output pin. I; PU I/O R — Function reserved. GPIO4[8] — General purpose digital input/output pin. I QEI_IDX — Quadrature Encoder Interface INDEX input. - R — Function reserved. O U2_TXD — Transmitter output for USART2. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU I/O GPIO4[9] — General purpose digital input/output pin. I QEI_PHB — Quadrature Encoder Interface PHB input. - R — Function reserved. I U2_RXD — Receiver input for USART2. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 39 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PA_4 PB_0 147 - G13 B15 LPC1850_30_20_10 Preliminary data sheet x x - - 151 - 164 - - - - [4] [3] [3] Type - Description [2] LQFP208[1] x LQFP100[1] TFBGA100 H11 LQFP144 TFBGA180[1] PA_3 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O GPIO4[10] — General purpose digital input/output pin. I QEI_PHA — Quadrature Encoder Interface PHA input. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_9 — SCT output 9. Match output 1 of timer 2. - R — Function reserved. I/O EMC_A23 — External memory address line 23. I/O GPIO5[19] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_10 — SCT output 10. Match output 2 of timer 2. O LCD_VD23 — LCD data. - R — Function reserved. I/O GPIO5[20] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 40 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PB_2 PB_3 175 - B12 A13 LPC1850_30_20_10 Preliminary data sheet x x - - 177 - 178 - - - - [3] [3] [3] Type - Description [2] LQFP208[1] x LQFP100[1] TFBGA100 A14 LQFP144 TFBGA180[1] PB_1 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I USB1_ULPI_DIR — ULPI link DIR signal. Controls the ULP data line direction. O LCD_VD22 — LCD data. - R — Function reserved. I/O GPIO5[21] — General purpose digital input/output pin. O CTOUT_6 — SCT output 6. Match output 2 of timer 1. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I/O USB1_ULPI_D7 — ULPI link bidirectional data line 7. O LCD_VD21 — LCD data. - R — Function reserved. I/O GPIO5[22] — General purpose digital input/output pin. O CTOUT_7 — SCT output 7. Match output 3 of timer 1. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I/O USB1_ULPI_D6 — ULPI link bidirectional data line 6. O LCD_VD20 — LCD data. - R — Function reserved. I/O GPIO5[23] — General purpose digital input/output pin. O CTOUT_8 — SCT output 8. Match output 0 of timer 2. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 41 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PB_5 PB_6 180 - A12 A6 LPC1850_30_20_10 Preliminary data sheet x x - - 181 - - - - - - [3] [3] [6] Type - Description [2] LQFP208[1] x LQFP100[1] TFBGA100 B11 LQFP144 TFBGA180[1] PB_4 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I/O USB1_ULPI_D5 — ULPI link bidirectional data line 5. O LCD_VD15 — LCD data. - R — Function reserved. I/O GPIO5[24] — General purpose digital input/output pin. I CTIN_5 — SCT input 5. Capture input 2 of timer 2. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I/O USB1_ULPI_D4 — ULPI link bidirectional data line 4. O LCD_VD14 — LCD data. - R — Function reserved. I/O GPIO5[25] — General purpose digital input/output pin. I CTIN_7 — SCT input 7. O LCD_PWR — LCD panel power enable. - R — Function reserved. I; PU - R — Function reserved. I/O USB1_ULPI_D3 — ULPI link bidirectional data line 3. O LCD_VD13 — LCD data. - R — Function reserved. I/O GPIO5[26] — General purpose digital input/output pin. I CTIN_6 — SCT input 6. Capture input 1 of timer 3. O LCD_VD19 — LCD data. - R — Function reserved. I ADC0_6 — ADC0, input channel 6. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 42 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PC_1 PC_2 LQFP208[1] LQFP144 LQFP100[1] x - 7 - - E4 F6 LPC1850_30_20_10 Preliminary data sheet - - - - 9 13 - - - - [6] [3] [3] Type TFBGA100 D4 Description [2] TFBGA180[1] PC_0 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I USB1_ULPI_CLK — ULPI link CLK signal. 60 MHz clock generated by the PHY. - R — Function reserved. I/O ENET_RX_CLK — Ethernet Receive Clock (MII interface). O LCD_DCLK — LCD panel clock. - R — Function reserved. - R — Function reserved. I/O SD_CLK — SD/MMC card clock. I ADC1_1 — ADC1, input channel 1. I; PU I/O USB1_ULPI_D7 — ULPI link bidirectional data line 7. - R — Function reserved. I U1_RI — Ring Indicator input for UART1. O ENET_MDC — Ethernet MIIM clock. I/O GPIO6[0] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP0 — Capture input 0 of timer 3. O SD_VOLT0 — SD/MMC bus voltage select output 0. I; PU I/O USB1_ULPI_D6 — ULPI link bidirectional data line 6. - R — Function reserved. I U1_CTS — Clear to Send input for UART1. O ENET_TXD2 — Ethernet transmit data 2 (MII interface). I/O GPIO6[1] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O SD_RST — SD/MMC reset signal for MMC4.4 card. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 43 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] - - 11 - - [6] Type TFBGA100 F5 Description [2] TFBGA180[1] PC_3 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU I/O - R — Function reserved. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). I/O GPIO6[2] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O SD_VOLT1 — SD/MMC bus voltage select output 1. I PC_4 F4 - - 16 - - [3] USB1_ULPI_D5 — ULPI link bidirectional data line 5. I; PU - ADC1_0 — ADC1, input channel 0. R — Function reserved. I/O USB1_ULPI_D4 — ULPI link bidirectional data line 4. - R — Function reserved. ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). PC_5 G4 LPC1850_30_20_10 Preliminary data sheet - - 20 - - [3] I/O GPIO6[3] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP1 — Capture input 1 of timer 3. I/O SD_DAT0 — SD/MMC data bus line 0. I; PU - R — Function reserved. I/O USB1_ULPI_D3 — ULPI link bidirectional data line 3. - R — Function reserved. O ENET_TX_ER — Ethernet Transmit Error (MII interface). I/O GPIO6[4] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP2 — Capture input 2 of timer 3. I/O SD_DAT1 — SD/MMC data bus line 1. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 44 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PC_7 PC_8 LQFP208[1] LQFP144 LQFP100[1] - - 22 - - G5 N4 LPC1850_30_20_10 Preliminary data sheet - - - - - - - - - - [3] [3] [3] Type TFBGA100 H6 Description [2] TFBGA180[1] PC_6 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I/O USB1_ULPI_D2 — ULPI link bidirectional data line 2. - R — Function reserved. I ENET_RXD2 — Ethernet receive data 2 (MII interface). I/O GPIO6[5] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP3 — Capture input 3 of timer 3. I/O SD_DAT2 — SD/MMC data bus line 2. I; PU - R — Function reserved. I/O USB1_ULPI_D1 — ULPI link bidirectional data line 1. - R — Function reserved. I ENET_RXD3 — Ethernet receive data 3 (MII interface). I/O GPIO6[6] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT0 — Match output 0 of timer 3. I/O SD_DAT3 — SD/MMC data bus line 3. I; PU - R — Function reserved. I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0. - R — Function reserved. I ENET_RX_DV — Ethernet Receive Data Valid (RMII/MII interface). I/O GPIO6[7] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT1 — Match output 1 of timer 3. I SD_CD — SD/MMC card detect input. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 45 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PC_10 PC_11 LQFP208[1] LQFP144 LQFP100[1] - - - - - M5 L5 LPC1850_30_20_10 Preliminary data sheet - - - - - - - - - - [3] [3] [3] Type TFBGA100 K2 Description [2] TFBGA180[1] PC_9 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I USB1_ULPI_NXT — ULPI link NXT signal. Data flow control signal from the PHY. - R — Function reserved. I ENET_RX_ER — Ethernet receive error (MII interface). I/O GPIO6[8] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT2 — Match output 2 of timer 3. O SD_POW — SD/MMC power monitor output. I; PU - R — Function reserved. O USB1_ULPI_STP — ULPI link STP signal. Asserted to end or interrupt transfers to the PHY. I U1_DSR — Data Set Ready input for UART1. - R — Function reserved. I/O GPIO6[9] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT3 — Match output 3 of timer 3. I/O SD_CMD — SD/MMC command signal. I; PU - R — Function reserved. I USB1_ULPI_DIR — ULPI link DIR signal. Controls the ULP data line direction. I U1_DCD — Data Carrier Detect input for UART1. - R — Function reserved. I/O GPIO6[10] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SD_DAT4 — SD/MMC data bus line 4. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 46 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208[1] LQFP144 LQFP100[1] - - - - - [3] Type TFBGA100 L6 Description [2] TFBGA180[1] PC_12 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. - R — Function reserved. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. - R — Function reserved. I/O GPIO6[11] — General purpose digital input/output pin. - R — Function reserved. I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. I/O PC_13 PC_14 M1 N1 LPC1850_30_20_10 Preliminary data sheet - - - - - - - - - - [3] [3] SD_DAT5 — SD/MMC data bus line 5. I; PU - R — Function reserved. - R — Function reserved. O U1_TXD — Transmitter output for UART1. - R — Function reserved. I/O GPIO6[12] — General purpose digital input/output pin. - R — Function reserved. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I/O SD_DAT6 — SD/MMC data bus line 6. I; PU - R — Function reserved. - R — Function reserved. I U1_RXD — Receiver input for UART1. - R — Function reserved. I/O GPIO6[13] — General purpose digital input/output pin. - R — Function reserved. O ENET_TX_ER — Ethernet Transmit Error (MII interface). I/O SD_DAT7 — SD/MMC data bus line 7. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 47 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PD_1 PD_2 LQFP208[1] LQFP144 LQFP100[1] - - - - - P1 R1 LPC1850_30_20_10 Preliminary data sheet - - - - - - - - - - [3] [3] [3] Type TFBGA100 N2 Description [2] TFBGA180[1] PD_0 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. O CTOUT_15 — SCT output 15. Match output 3 of timer 3. O EMC_DQMOUT2 — Data mask 2 used with SDRAM and static devices. - R — Function reserved. I/O GPIO6[14] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. O EMC_CKEOUT2 — SDRAM clock enable 2. - R — Function reserved. I/O GPIO6[15] — General purpose digital input/output pin. O SD_POW — SD/MMC power monitor output. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_7 — SCT output 7. Match output 3 of timer 1. I/O EMC_D16 — External memory data line 16. - R — Function reserved. I/O GPIO6[16] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 48 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PD_4 PD_5 LQFP208[1] LQFP144 LQFP100[1] - - - - - T2 P6 LPC1850_30_20_10 Preliminary data sheet - - - - - - - - - - [3] [3] [3] Type TFBGA100 P4 Description [2] TFBGA180[1] PD_3 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. O CTOUT_6 — SCT output 7. Match output 2 of timer 1. I/O EMC_D17 — External memory data line 17. - R — Function reserved. I/O GPIO6[17] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_8 — SCT output 8. Match output 0 of timer 2. I/O EMC_D18 — External memory data line 18. - R — Function reserved. I/O GPIO6[18] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_9 — SCT output 9. Match output 1 of timer 2. I/O EMC_D19 — External memory data line 19. - R — Function reserved. I/O GPIO6[19] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 49 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PD_7 LQFP208[1] LQFP144 LQFP100[1] - - 68 - - T6 - - 72 - - [3] [3] Type TFBGA100 R6 Description [2] TFBGA180[1] PD_6 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - CTOUT_10 — SCT output 10. Match output 2 of timer 2. I/O EMC_D20 — External memory data line 20. - R — Function reserved. I/O GPIO6[20] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I PD_8 PD_9 P8 T11 LPC1850_30_20_10 Preliminary data sheet - - - - 74 84 - - - - [3] [3] R — Function reserved. O CTIN_5 — SCT input 5. Capture input 2 of timer 2. I/O EMC_D21 — External memory data line 21. - R — Function reserved. I/O GPIO6[21] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I CTIN_6 — SCT input 6. Capture input 1 of timer 3. I/O EMC_D22 — External memory data line 22. - R — Function reserved. I/O GPIO6[22] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_13 — SCT output 13. Match output 1 of timer 3. I/O EMC_D23 — External memory data line 23. - R — Function reserved. I/O GPIO6[23] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 50 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PD_11 PD_12 LQFP208[1] LQFP144 LQFP100[1] - - 86 - - N9 N11 LPC1850_30_20_10 Preliminary data sheet x x - - 88 94 - - - - [3] [3] [3] Type TFBGA100 P11 Description [2] TFBGA180[1] PD_10 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I CTIN_1 — SCT input 1. Capture input 1 of timer 0. Capture input 1 of timer 2. O EMC_BLS3 — LOW active Byte Lane select signal 3. - R — Function reserved. I/O GPIO6[24] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. O EMC_CS3 — LOW active Chip Select 3 signal. - R — Function reserved. I/O GPIO6[25] — General purpose digital input/output pin. I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0. O CTOUT_14 — SCT output 14. Match output 2 of timer 3. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. O EMC_CS2 — LOW active Chip Select 2 signal. - R — Function reserved. I/O GPIO6[26] — General purpose digital input/output pin. - R — Function reserved. O CTOUT_10 — SCT output 10. Match output 2 of timer 2. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 51 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PD_14 PD_15 LQFP208[1] LQFP144 LQFP100[1] x - 97 - - R13 T15 LPC1850_30_20_10 Preliminary data sheet x x - - 99 - 101 - - - [3] [3] [3] Type TFBGA100 T14 Description [2] TFBGA180[1] PD_13 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I CTIN_0 — SCT input 0. Capture input 0 of timer 0, 1, 2, 3. O EMC_BLS2 — LOW active Byte Lane select signal 2. - R — Function reserved. I/O GPIO6[27] — General purpose digital input/output pin. - R — Function reserved. O CTOUT_13 — SCT output 13. Match output 1 of timer 3. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. O EMC_DYCS2 — SDRAM chip select 2. - R — Function reserved. I/O GPIO6[28] — General purpose digital input/output pin. - R — Function reserved. O CTOUT_11 — SCT output 11. Match output 3 of timer 2. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. I/O EMC_A17 — External memory address line 17. - R — Function reserved. I/O GPIO6[29] — General purpose digital input/output pin. I SD_WP — SD/MMC card write protect input. O CTOUT_8 — SCT output 8. Match output 0 of timer 2. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 52 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PE_0 PE_1 PE_2 104 - P14 N14 M14 LPC1850_30_20_10 Preliminary data sheet x x x - - - 106 - 112 115 - - - - - - [3] [3] [3] [3] Type - Description [2] LQFP208[1] x LQFP100[1] TFBGA100 R14 LQFP144 TFBGA180[1] PD_16 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. - R — Function reserved. I/O EMC_A16 — External memory address line 16. - R — Function reserved. I/O GPIO6[30] — General purpose digital input/output pin. O SD_VOLT2 — SD/MMC bus voltage select output 2. O CTOUT_12 — SCT output 12. Match output 0 of timer 3. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O EMC_A18 — External memory address line 18. I/O GPIO7[0] — General purpose digital input/output pin. O CAN1_TD — CAN1 transmitter output. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O EMC_A19 — External memory address line 19. I/O GPIO7[1] — General purpose digital input/output pin. I CAN1_RD — CAN1 receiver input. - R — Function reserved. - R — Function reserved. I; PU I ADCTRIG0 — ADC trigger input 0. I CAN0_RD — CAN receiver input. - R — Function reserved. I/O EMC_A20 — External memory address line 20. I/O GPIO7[2] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 53 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PE_4 PE_5 PE_6 LQFP208[1] LQFP144 LQFP100[1] x - 118 - - K13 N16 M16 LPC1850_30_20_10 Preliminary data sheet x - - - - - 120 - 122 - 124 - - - - [3] [3] [3] [3] Type TFBGA100 K12 Description [2] TFBGA180[1] PE_3 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. O CAN0_TD — CAN transmitter output. I ADCTRIG1 — ADC trigger input 1. I/O EMC_A21 — External memory address line 21. I/O GPIO7[3] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I NMI — External interrupt input to NMI. - R — Function reserved. I/O EMC_A22 — External memory address line 22. I/O GPIO7[4] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_3 — SCT output 3. Match output 3 of timer 0. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I/O EMC_D24 — External memory data line 24. I/O GPIO7[5] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_2 — SCT output 2. Match output 2 of timer 0. I U1_RI — Ring Indicator input for UART1. I/O EMC_D25 — External memory data line 25. I/O GPIO7[6] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 54 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PE_8 PE_9 PE_10 149 - F14 E16 E14 LPC1850_30_20_10 Preliminary data sheet - - - - - - 150 - 152 - 154 - - - - - [3] [3] [3] [3] Type - Description [2] LQFP208[1] - LQFP100[1] TFBGA100 F15 LQFP144 TFBGA180[1] PE_7 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. O CTOUT_5 — SCT output 5. Match output 1 of timer 1. I U1_CTS — Clear to Send input for UART1. I/O EMC_D26 — External memory data line 26. I/O GPIO7[7] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_4 — SCT output 4. Match output 0 of timer 0. I U1_DSR — Data Set Ready input for UART1. I/O EMC_D27 — External memory data line 27. I/O GPIO7[8] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I CTIN_4 — SCT input 4. Capture input 2 of timer 1. I U1_DCD — Data Carrier Detect input for UART1. I/O EMC_D28 — External memory data line 28. I/O GPIO7[9] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. I CTIN_3 — SCT input 3. Capture input 1 of timer 1. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I/O EMC_D29 — External memory data line 29. I/O GPIO7[10] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 55 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PE_12 PE_13 LQFP208[1] LQFP144 LQFP100[1] - - - - - D15 G14 LPC1850_30_20_10 Preliminary data sheet - - - - - - - - - - [3] [3] [3] Type TFBGA100 D16 Description [2] TFBGA180[1] PE_11 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. O CTOUT_12 — SCT output 12. Match output 0 of timer 3. O U1_TXD — Transmitter output for UART1. I/O EMC_D30 — External memory data line 30. I/O GPIO7[11] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_11 — SCT output 11. Match output 3 of timer 2. I U1_RXD — Receiver input for UART1. I/O EMC_D31 — External memory data line 31. I/O GPIO7[12] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O CTOUT_14 — SCT output 14. Match output 2 of timer 3. I/O I2C1_SDA — I2C1 data input/output (this pin does not use a specialized I2C pad). O EMC_DQMOUT3 — Data mask 3 used with SDRAM and static devices. I/O GPIO7[13] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 56 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PE_15 PF_0 PF_1 LQFP208[1] LQFP144 LQFP100[1] - - - - - E13 D12 E11 LPC1850_30_20_10 Preliminary data sheet - - - - - - - - 159 - - - - - - [3] [3] [3] [3] Type TFBGA100 C15 Description [2] TFBGA180[1] PE_14 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. - R — Function reserved. - R — Function reserved. O EMC_DYCS3 — SDRAM chip select 3. I/O GPIO7[14] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O; PU O CTOUT_0 — SCT output 0. Match output 0 of timer 0. I/O I2C1_SCL — I2C1 clock input/output (this pin does not use a specialized I2C pad). O EMC_CKEOUT3 — SDRAM clock enable 3. I/O GPIO7[15] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SSP0_SCK — Serial clock for SSP0. I GP_CLKIN — General purpose clock input to the CGU. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O I2S1_TX_MCLK — I2S1 transmit master clock. I; PU - R — Function reserved. - R — Function reserved. I/O SSP0_SSEL — Slave Select for SSP0. - R — Function reserved. I/O GPIO7[16] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 57 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PF_3 PF_4 168 - E10 D10 LPC1850_30_20_10 Preliminary data sheet - x - H4 170 - [3] - [3] - 172 120 83 [3] Type - Description [2] LQFP208[1] - LQFP100[1] TFBGA100 D11 LQFP144 TFBGA180[1] PF_2 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. O U3_TXD — Transmitter output for USART3. I/O SSP0_MISO — Master In Slave Out for SSP0. - R — Function reserved. I/O GPIO7[17] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I; PU - R — Function reserved. O; PU I U3_RXD — Receiver input for USART3. I/O SSP0_MOSI — Master Out Slave in for SSP0. - R — Function reserved. I/O GPIO7[18] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SSP1_SCK — Serial clock for SSP1. I GP_CLKIN — General purpose clock input to the CGU. O TRACECLK — Trace clock. - R — Function reserved. - R — Function reserved. - R — Function reserved. O I2S0_TX_MCLK — I2S transmit master clock. I/O I2S0_RX_SCK — I2S receive clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 58 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PF_6 PF_7 190 - E7 B7 LPC1850_30_20_10 Preliminary data sheet - - - - 192 - 193 - - - - [6] [6] [6] Type - Description [2] LQFP208[1] - LQFP100[1] TFBGA100 E9 LQFP144 TFBGA180[1] PF_5 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I/O U3_UCLK — Serial clock input/output for USART3 in synchronous mode. I/O SSP1_SSEL — Slave Select for SSP1. O TRACEDATA[0] — Trace data, bit 0. I/O GPIO7[19] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I ADC1_4 — ADC1, input channel 4. I; PU - R — Function reserved. I/O U3_DIR — RS-485/EIA-485 output enable/direction control for USART3. I/O SSP1_MISO — Master In Slave Out for SSP1. O TRACEDATA[1] — Trace data, bit 1. I/O GPIO7[20] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O I2S1_TX_SDA — I2S1 transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. I ADC1_3 — ADC1, input channel 3. I; PU - R — Function reserved. I/O U3_BAUD — Baud pin USART3. I/O SSP1_MOSI — Master Out Slave in for SSP1. O TRACEDATA[2] — Trace data, bit 2. I/O GPIO7[21] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O I2S1_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I/O ADC1_7 — ADC1, input channel 7 or band gap output. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 59 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller PF_9 PF_10 LQFP208[1] LQFP144 LQFP100[1] - - - - - D6 A3 LPC1850_30_20_10 Preliminary data sheet - - - - 203 - 205 - [6] [6] - 98 [6] Type TFBGA100 E6 Description [2] TFBGA180[1] PF_8 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I/O U0_UCLK — Serial clock input/output for USART0 in synchronous mode. I CTIN_2 — SCT input 2. Capture input 2 of timer 0. O TRACEDATA[3] — Trace data, bit 3. I/O GPIO7[22] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I ADC0_2 — ADC0, input channel 2. I; PU - R — Function reserved. I/O U0_DIR — RS-485/EIA-485 output enable/direction control for USART0. O CTOUT_1 — SCT output 1. Match output 1 of timer 0. - R — Function reserved. I/O GPIO7[23] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I ADC1_2 — ADC1, input channel 2. I; PU - R — Function reserved. O U0_TXD — Transmitter output for USART0. - R — Function reserved. - R — Function reserved. I/O GPIO7[24] — General purpose digital input/output pin. - R — Function reserved. I SD_WP — SD/MMC card write protect input. - R — Function reserved. I ADC0_5 — ADC0, input channel 5. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 60 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 207 - 100 [6] Type - Description [2] LQFP208[1] - LQFP100[1] TFBGA100 A2 LQFP144 TFBGA180[1] PF_11 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. I; PU - R — Function reserved. I U0_RXD — Receiver input for USART0. - R — Function reserved. - R — Function reserved. I/O GPIO7[25] — General purpose digital input/output pin. - R — Function reserved. O SD_VOLT2 — SD/MMC bus voltage select output 2. - R — Function reserved. I ADC1_5 — ADC1, input channel 5. O EMC_CLK0 — SDRAM clock 0. O CLKOUT — Clock output pin. - R — Function reserved. - R — Function reserved. I/O SD_CLK — SD/MMC card clock. O EMC_CLK01 — SDRAM clock 0 and clock 1 combined. I/O SSP1_SCK — Serial clock for SSP1. I ENET_TX_CLK (ENET_REF_CLK) — Ethernet Transmit Clock (MII interface) or Ethernet Reference Clock (RMII interface). O EMC_CLK1 — SDRAM clock 1. O CLKOUT — Clock output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. O CGU_OUT0 — CGU spare clock output 0. - R — Function reserved. O I2S1_TX_MCLK — I2S1 transmit master clock. Clock pins CLK0 CLK1 N5 T10 LPC1850_30_20_10 Preliminary data sheet x x K3 - 62 - 45 - 31 - [5] [5] O; PU O; PU All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 61 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller CLK3 LQFP208[1] LQFP144 LQFP100[1] x K6 141 99 68 P12 x - - - [5] [5] - O; PU O; PU Type TFBGA100 D14 Description [2] TFBGA180[1] CLK2 LBGA256 Symbol Reset state Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. O EMC_CLK3 — SDRAM clock 3. O CLKOUT — Clock output pin. - R — Function reserved. - R — Function reserved. I/O SD_CLK — SD/MMC card clock. O EMC_CLK23 — SDRAM clock 2 and clock 3 combined. O I2S0_TX_MCLK — I2S transmit master clock. I/O I2S1_RX_SCK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. O EMC_CLK2 — SDRAM clock 2. O CLKOUT — Clock output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. O CGU_OUT1 — CGU spare clock output 1. - R — Function reserved. I/O I2S1_RX_SCK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. Debug pins DBGEN L4 x A6 41 28 18 [3] I I JTAG interface control signal. Also used for boundary scan. TCK/SWDCLK J5 x H2 38 27 17 [3] I; F I Test Clock for JTAG interface (default) or Serial Wire (SW) clock. TRST M4 x B4 42 29 19 [3] I; PU I Test Reset for JTAG interface. I; PU I Test Mode Select for JTAG interface (default) or SW debug data input/output. Test Data Out for JTAG interface (default) or SW trace output. TMS/SWDIO K6 x C4 44 30 20 [3] TDO/SWO K5 x H3 46 31 21 [3] O TDI J4 x G3 35 26 16 [3] I; PU I Test Data In for JTAG interface. F2 x E1 26 18 9 [7] - I/O USB0 bidirectional D+ line. 11 [7] - I/O USB0 bidirectional D line. 12 [7] - I/O VBUS pin (power on USB cable). This pin includes an internal pull-down resistor of 64 k (typical) 16 k. O USB0 pins USB0_DP USB0_DM USB0_VBUS G2 F1 x x E2 E3 28 29 20 21 [8] LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 62 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. LQFP144 LQFP100[1] x F1 30 22 13 [9] - USB0_RREF H1 x F3 32 24 15 [9] - F12 x E9 129 89 59 [10] - I/O USB1 bidirectional D+ line. - I/O USB1 bidirectional D line. Type LQFP208[1] H2 [2] TFBGA100 USB0_ID Reset state TFBGA180[1] Description LBGA256 Symbol I Indicates to the transceiver whether connected as an A-device (USB0_ID LOW) or B-device (USB0_ID HIGH). For OTG, this pin has an internal pull-up resistor. 12.0 k (accuracy 1 %) on-board resistor to ground for current reference. USB1 pins USB1_DP G12 x E10 130 90 60 [10] I2C0_SCL L15 x D6 132 92 62 [11] I; F I/O I2C clock input/output. Open-drain output (for I2C-bus compliance). I2C0_SDA L16 x E6 133 93 63 [11] I; F I/O I2C data input/output. Open-drain output (for I2C-bus compliance). USB1_DM I2C-bus pins Reset and wake-up pins RESET D9 x B6 185 128 91 [12] I; IA I External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. WAKEUP0 A9 x A4 187 130 93 [12] I; IA I External wake-up input; can raise an interrupt and can cause wake-up from any of the low power modes. WAKEUP1 A10 x - - - - [12] I; IA I External wake-up input; can raise an interrupt and can cause wake-up from any of the low power modes. WAKEUP2 C9 x - - - - [12] I; IA I External wake-up input; can raise an interrupt and can cause wake-up from any of the low power modes. WAKEUP3 D8 x - - - - [12] I; IA I External wake-up input; can raise an interrupt and can cause wake-up from any of the low power modes. ADC0_0/ ADC1_0/DAC E3 x A2 8 6 4 [9] I; IA I ADC input channel 0. Shared between 10-bit ADC0/1 and DAC. ADC0_1/ ADC1_1 C3 x A1 4 2 1 [9] I; IA I ADC input channel 1. Shared between 10-bit ADC0/1. ADC0_2/ ADC1_2 A4 x B3 206 143 99 [9] I; IA I ADC input channel 2. Shared between 10-bit ADC0/1. ADC0_3/ ADC1_3 B5 x A3 200 139 96 [9] I; IA I ADC input channel 3. Shared between 10-bit ADC0/1. ADC0_4/ ADC1_4 C6 x - 199 138 - [9] I; IA I ADC input channel 4. Shared between 10-bit ADC0/1. ADC pins LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 63 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. - 208 144 - [9] I; IA I ADC input channel 5. Shared between 10-bit ADC0/1. ADC0_6/ ADC1_6 A5 x - 204 142 - [9] I; IA I ADC input channel 6. Shared between 10-bit ADC0/1. ADC0_7/ ADC1_7 C5 x - 197 136 - [9] I; IA I ADC input channel 7. Shared between 10-bit ADC0/1. A11 x C3 186 129 92 [12] - O RTC controlled output. - I Input to the RTC 32 kHz ultra-low power oscillator circuit. LQFP100[1] Type x [2] LQFP208[1] B3 Reset state TFBGA100 ADC0_5/ ADC1_5 LQFP144 TFBGA180[1] Description LBGA256 Symbol RTC RTC_ALARM RTCX1 A8 x A5 182 125 88 [9] RTCX2 B8 x B5 183 126 89 [9] - O Output from the RTC 32 kHz ultra-low power oscillator circuit. Crystal oscillator pins XTAL1 D1 x B1 18 12 5 [9] - I Input to the oscillator circuit and internal clock generator circuits. XTAL2 E1 x C1 19 13 6 [9] - O Output from the oscillator amplifier. Power and ground pins USB0_VDDA 3V3_DRIVER F3 x D1 24 16 7 - - Separate analog 3.3 V power supply for driver. USB0 _VDDA3V3 G3 x D2 25 17 8 - - USB 3.3 V separate power supply voltage. USB0_VSSA _TERM H3 x D3 27 19 10 - - Dedicated analog ground for clean reference for termination resistors. USB0_VSSA _REF G1 x F2 31 23 14 - - Dedicated clean analog ground for generation of reference currents and voltages. VDDA B4 x B2 198 137 95 - - Analog power supply and ADC reference voltage. VBAT B10 x C5 184 127 90 - - RTC power supply: 3.3 V on this pin supplies power to the RTC. VDDREG F10, F9, L8, L7 x E4, E5, F4 135, 188, 195, 82, 33 94, 131, 59, 25 - Main regulator power supply. Tie the VDDREG and VDDIO pins to a common power supply to ensure the same ramp-up time for both supply voltages. VPP E8 x - x x - OTP programming voltage. LPC1850_30_20_10 Preliminary data sheet - [13] - All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 64 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller [13] Type VDDIO D7, x E12, F7, F8, G10, H10, J6, J7, K7, L9, L10, N7, N13 F10, 6, K5 52, 57, 102, 110, 155, 160, 202 5, 36, 41, 71, 77, 107, 111, 141 VDD - - - - - 3, 24, 27, 49, 52, 74, 77, 97 VSS G9, H7, J10, J11, K8 x C8, D4, D5, G8, J3, J6 - - 2, 26, 51, 76 C4, x D13, G6, G7, G8, H8, H9, J8, J9, K9, K10, M13, P7, P13 - 5, 56, 109, 157 B2 x C2 - B9 - - [1] x = available; - = not pinned out. [2] I = input, O = output, IA = inactive; PU = pull-up enabled (weak pull-up resistor pulls up pin to VDD(IO)); F = floating. Reset state reflects the pin state at reset without boot code operation. VSSIO VSSA - Description [2] Reset state LQFP100[1] LQFP144 LQFP208[1] TFBGA100 LBGA256 Symbol TFBGA180[1] Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. - I/O power supply. Tie the VDDREG and VDDIO pins to a common power supply to ensure the same ramp-up time for both supply voltages. Power supply for main regulator, I/O, and OTP. [14] - - Ground. - - Ground. 196 135 94 - - Analog ground. - - - n.c. [15] [14] 4, 40, 76, 109 [15] Not connected LPC1850_30_20_10 Preliminary data sheet - - All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 65 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller [3] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDD(IO) present; if VDD(IO) not present, do not exceed 3.3 V); provides digital I/O functions with TTL levels and hysteresis; normal drive strength (see Figure 39). [4] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDD(IO) present; if VDD(IO) not present, do not exceed 3.3 V); provides digital I/O functions with TTL levels, and hysteresis; high drive strength (see Figure 39). [5] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDD(IO) present; if VDD(IO) not present, do not exceed 3.3 V); provides high-speed digital I/O functions with TTL levels and hysteresis (see Figure 39). [6] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input or output (5 V tolerant if VDD(IO) present; if VDD(IO) not present, do not exceed 3.3 V). When configured as a ADC input or DAC output, the pin is not 5 V tolerant and the digital section of the pad must be disabled by setting the pin to an input function and disabling the pull-up resistor through the pin’s SFSP register. [7] 5 V tolerant transparent analog pad. [8] For maximum load CL = 6.5 F and maximum pull-down resistance Rpd = 80 k, the VBUS signal takes about 2 s to fall from VBUS = 5 V to VBUS = 0.2 V when it is no longer driven. [9] Transparent analog pad. Not 5 V tolerant. [10] Pad provides USB functions. 5 V tolerant if VDD(IO) present; if VDD(IO) not present do not exceed 3.3 V. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). [11] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus Fast Mode Plus specification. This pad requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. [12] 5 V tolerant pad with 20 ns glitch filter; provides digital I/O functions with open-drain output with weak pull-up resistor and hysteresis (see Figure 40). [13] On the TFBGA100 and LQFP208 packages, VPP is internally connected to VDDIO. [14] On the LQFP144/208 packages, VSSIO and VSS are connected to a common ground plane. [15] On the TFBGA100 and LQFP100/208 packages, VSS is internally connected to VSSIO. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 66 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7. Functional description 7.1 Architectural overview The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-CODE bus, and the D-code bus. The I-CODE and D-code core buses allow for concurrent code and data accesses from different slave ports. The LPC1850/30/20/10 use a multi-layer AHB matrix to connect the ARM Cortex-M3 buses and other bus masters to peripherals in a flexible manner that optimizes performance by allowing peripherals that are on different slave ports of the matrix to be accessed simultaneously by different bus masters. 7.2 ARM Cortex-M3 processor The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high performance and very low power consumption. The ARM Cortex-M3 offers many new features, including a Thumb-2 instruction set, low interrupt latency, hardware multiply and divide, interruptable/continuable multiple load and store instructions, automatic state save and restore for interrupts, tightly integrated interrupt controller with wake-up interrupt controller, and multiple core buses capable of simultaneous accesses. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical Reference Manual. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 67 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.3 AHB multilayer matrix TEST/DEBUG INTERFACE ARM CORTEX-M3 System bus I-code bus ETHERNET(1) GPDMA D-code bus 0 USB0(1) USB1(1) LCD(1) SD/ MMC masters 1 slaves 64 kB ROM 64/96 kB LOCAL SRAM 40 kB LOCAL SRAM 32 kB AHB SRAM 16 kB AHB SRAM(1) 16 kB AHB SRAM SPIFI EXTERNAL MEMORY CONTROLLER AHB REGISTER INTERFACES, APB, RTC DOMAIN PERIPHERALS AHB MULTILAYER MATRIX = master-slave connection 002aag550 (1) Not available on all parts (see Table 2). Fig 8. AHB multilayer matrix master and slave connections 7.4 Nested Vectored Interrupt Controller (NVIC) The NVIC is an integral part of the Cortex-M3. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 7.4.1 Features • • • • • • LPC1850_30_20_10 Preliminary data sheet Controls system exceptions and peripheral interrupts. In the LPC1850/30/20/10, the NVIC supports 32 vectored interrupts. 8 programmable interrupt priority levels, with hardware priority level masking. Relocatable vector table. Non-Maskable Interrupt (NMI). Software interrupt generation. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 68 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.4.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. 7.5 Event router The event router combines various internal signals, interrupts, and the external interrupt pins (WAKEUP[3:0]) to create an interrupt in the NVIC if enabled and to create a wake-up signal to the ARM core and the CCU for waking up from Sleep, Deep-sleep, Power-down, and Deep power-down modes. Individual events can be configured as edge or level sensitive and can be enabled or disabled in the event router. The event router can be battery powered. The following events if enabled in the event router can create a wake-up signal and/or an interrupt: • • • • • External pins WAKEUP0/1/2/3 and RESET Alarm timer, RTC, WWDT, BOD interrupts C_CAN and QEI interrupts Ethernet, USB0, USB1 signals Selected outputs of combined timers (SCT and timer0/1/3) 7.6 Global Input Multiplexer Array (GIMA) The GIMA allows to route signals to event-driven peripheral targets like the SCT, timers, event router, or the ADCs. 7.6.1 Features • • • • • Single selection of a source. Signal inversion. Can capture a pulse if the input event source is faster than the target clock. Synchronization of input event and target clock. Single-cycle pulse generation for target. 7.7 System Tick timer (SysTick) The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate a dedicated SYSTICK exception at a 10 ms interval. 7.8 On-chip static RAM The LPC1850/30/20/10 support up to 200 kB SRAM with separate bus master access for higher throughput and individual power control for low power operation. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 69 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.8.1 ISP (In-System Programming) mode In-System Programming (ISP) is programming or reprogramming the on-chip SRAM memory, using the boot loader software and the USART0 serial port. ISP can be used when the part resides in the end-user board. ISP allows to load data into on-chip SRAM and execute code from on-chip SRAM. 7.9 Boot ROM The internal ROM memory is used to store the boot code of the LPC1850/30/20/10. After a reset, the ARM processor will start its code execution from this memory. The boot ROM memory includes the following features: • ROM memory size is 64 kB. • Supports booting from USART interfaces and external static memory such as NOR flash, and SPI flash. • Includes API for OTP programming. • Includes a flexible USB device stack that supports Human Interface Device (HID), Mass Storage Class (MSC), and Device Firmware Upgrade (DFU) drivers. AES capable parts also support: • CMAC authentication on the boot image. • Secure booting from an encrypted image. In development mode booting from a plain text image is possible. Development mode is terminated by programming the AES key. • API for AES programming. Several boot modes are available depending on the values of the OTP bits BOOT_SRC. If the OTP memory is not programmed or the BOOT_SRC bits are all zero, the boot mode is determined by the states of the boot pins P2_9, P2_8, P1_2, and P1_1. Table 4. Boot mode when OTP BOOT_SRC bits are programmed Boot mode BOOT_SRC BOOT_SRC BOOT_SRC bit 3 bit 2 bit 1 BOOT_SRC Description bit 0 Pin state 0 0 0 0 Boot source is defined by the reset state of P1_1, P1_2, P2_8, and P2_9 pins. See Table 5. USART0 0 0 0 1 Boot from device connected to USART0 using pins P2_0 and P2_1. EMC 8-bit 0 0 1 1 Boot from external static memory (such as NOR flash) using CS0 and an 8-bit data bus. EMC 16-bit 0 1 0 0 Boot from external static memory (such as NOR flash) using CS0 and a 16-bit data bus. EMC 32-bit 0 1 0 1 Boot from external static memory (such as NOR flash) using CS0 and a 32-bit data bus. USB0 0 1 1 0 Boot from USB0. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 70 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 4. Boot mode when OTP BOOT_SRC bits are programmed Boot mode BOOT_SRC BOOT_SRC BOOT_SRC bit 3 bit 2 bit 1 BOOT_SRC Description bit 0 USB1 0 1 1 1 Boot from USB1. SPI (SSP) 1 0 0 0 Boot from SPI flash connected to the SSP0 interface on P3_3 (function SSP0_SCK), P3_6 (function SSP0_MISO), P3_7 (function SSP0_MOSI), and P3_8 (function SSP0_SSEL)[1]. USART3 1 0 0 1 Boot from device connected to USART3 using pins P2_3 and P2_4. [1] The boot loader programs the appropriate pin function at reset to boot using either SSP0 or SPIFI. Table 5. Boot mode when OPT BOOT_SRC bits are zero Boot mode Preliminary data sheet Description P2_9 P2_8 P1_2 P1_1 USART0 LOW LOW LOW LOW Boot from device connected to USART0 using pins P2_0 and P2_1. EMC 8-bit LOW LOW HIGH LOW Boot from external static memory (such as NOR flash) using CS0 and an 8-bit data bus. EMC 16-bit LOW LOW HIGH HIGH Boot from external static memory (such as NOR flash) using CS0 and a 16-bit data bus. EMC 32-bit LOW HIGH LOW LOW Boot from external static memory (such as NOR flash) using CS0 and a 32-bit data bus. USB0 LOW HIGH LOW HIGH Boot from USB0 USB1 LOW HIGH HIGH LOW Boot from USB1. SPI (SSP) LOW HIGH HIGH HIGH Boot from SPI flash connected to the SSP0 interface on P3_3 (function SSP0_SCK), P3_6 (function SSP0_MISO), P3_7 (function SSP0_MOSI), and P3_8 (function SSP0_SSEL)[1]. USART3 HIGH LOW LOW LOW Boot from device connected to USART3 using pins P2_3 and P2_4. [1] LPC1850_30_20_10 Pins The boot loader programs the appropriate pin function at reset to boot using the SSP0. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 71 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.10 Memory mapping LPC1850/30/20/10 4 GB 0xFFFF FFFF reserved 0xE010 0000 ARM private bus reserved SPIFI data 256 MB dynamic external memory DYCS3 256 MB dynamic external memory DYCS2 reserved peripheral bit band alias region reserved 0xE000 0000 0x8800 0000 0x8000 0000 0x7000 0000 0x6000 0000 0x4400 0000 0x4200 0000 0x4010 2000 reserved reserved reserved high-speed GPIO reserved reserved reserved APB peripherals #3 reserved APB peripherals #2 reserved 0x2000 0000 0x1F00 0000 0x1E00 0000 0x1D00 0000 0x1C00 0000 16 MB static external memory CS3 APB peripherals #1 16 MB static external memory CS2 reserved 16 MB static external memory CS1 APB peripherals #0 16 MB static external memory CS0 reserved 0x4010 0000 0x400F 8000 0x400F 4000 0x400F 2000 0x400F 1000 0x400F 0000 0x400E 0000 0x400D 0000 0x400C 0000 0x400B 0000 0x400A 0000 0x4009 0000 0x4008 0000 0x4006 0000 clocking/reset peripherals reserved RTC domain peripherals 0x1800 0000 256 MB dynamic external memory DYCS1 reserved 128 MB dynamic external memory DYCS0 0x1041 0000 0x2800 0000 32 MB AHB SRAM bit banding 0x2200 0000 32 kB + 8 kB local SRAM (LPC1850/30/20/10) reserved reserved 16 kB AHB SRAM (LPC1850/30/20/10) 32 kB local SRAM (LPC1850/30/20) 16 kB AHB SRAM (LPC1850/30) 0x1001 8000 0x3000 0000 0x2400 0000 reserved 0x1008 0000 0x4000 0000 reserved 64 kB ROM 0x1040 0000 0x4004 0000 0x4001 2000 AHB peripherals 1 GB 0x1008 A000 0x4005 0000 reserved 64 MB SPIFI data 0x1400 0000 0x1001 0000 0x4010 1000 0x2001 0000 16 kB AHB SRAM (LPC1850/30) 64 kB local SRAM (LPC1850/30/20/10) 16 kB AHB SRAM (LPC1850/30/20/10) 0x1000 0000 local SRAM/ external static memory banks 0 GB 256 MB shadow area 0x2000 C000 0x2000 8000 0x2000 4000 0x2000 0000 0x1000 0000 0x0000 0000 002aaf228 Fig 9. LPC1850/30/20/10 Memory mapping (overview) LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 72 of 157 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 0x400E 5000 reserved 0x400E 4000 ADC1 0x400E 3000 ADC0 0x400E 2000 C_CAN0 0x400E 1000 DAC 0x400E 0000 0x400C 8000 I2C1 0x400C 7000 0x400C 6000 0xFFFF FFFF APB3 peripherals external memories and ARM private bus 0x6000 0000 reserved peripheral bit band alias region reserved GIMA reserved QEI reserved APB2 peripherals Rev. 3 — 6 December 2011 timer3 0x400C 3000 timer2 0x400C 2000 USART3 0x400C 1000 USART2 0x400C 0000 0x400B 0000 RI timer APB3 peripherals reserved reserved C_CAN1 APB2 peripherals 0x400A 1000 0x400A 0000 reserved reserved reserved reserved APB1 peripherals reserved motor control PWM APB0 peripherals GPIO GROUP1 interrupt reserved GPIO GROUP0 interrupt GPIO interrupts clocking/reset peripherals 0x4008 6000 SCU 0x4008 5000 timer1 0x4008 4000 timer0 0x4008 3000 SSP0 0x4008 2000 UART1 w/ modem 0x4008 1000 USART0 0x4008 0000 WWDT RTC domain peripherals APB0 peripherals 0x4010 1000 RGU 0x4005 3000 CCU2 0x4005 2000 CCU1 0x4005 1000 CGU 0x4005 0000 0x4010 0000 0x400F 8000 high-speed GPIO APB1 peripherals 0x4010 2000 clocking reset control peripherals reserved 0x400F 4000 0x4004 7000 RTC 0x4004 6000 0x400F 2000 OTP controller 0x4004 5000 event router 0x4004 4000 CREG 0x4004 3000 0x400F 1000 0x400F 0000 RTC domain peripherals 0x400E 0000 power mode control 0x4004 2000 backup registers 0x4004 1000 alarm timer 0x4004 0000 0x400A 0000 ethernet 0x4001 2000 0x4001 0000 0x4009 0000 reserved 0x4000 9000 0x4008 0000 LCD 0x4000 8000 USB1 0x4000 7000 USB0 0x4000 6000 EMC 0x4000 5000 SD/MMC 0x4000 4000 SPIFI 0x4000 3000 0x400D 0000 0x400C 0000 0x400B 0000 0x4006 0000 0x4005 0000 0x4004 0000 reserved 0x4001 2000 AHB peripherals 0x4000 0000 SRAM memories external memory banks AHB peripherals DMA 0x4000 2000 reserved 0x4000 1000 SCT 0x4000 0000 0x0000 0000 73 of 157 © NXP B.V. 2011. All rights reserved. 002aaf229 Fig 10. LPC1850/30/20/10 Memory mapping (peripherals) LPC1850/30/20/10 0x4008 A000 0x4008 9000 0x4008 8000 0x4008 7000 I2S1 I2S0 I2C0 0x4200 0000 0x4006 0000 0x4005 4000 32-bit ARM Cortex-M3 microcontroller All information provided in this document is subject to legal disclaimers. SSP1 0x400C 4000 0x400A 4000 0x400A 3000 0x400A 2000 0x4400 0000 reserved reserved 0x400C 5000 0x400A 5000 NXP Semiconductors LPC1850_30_20_10 Preliminary data sheet LPC1850/30/20/10 0x400F 0000 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.11 Security features 7.11.1 AES security engine The hardware AES security engine can decode data using the AES algorithm in conjunction with a 128-bit key. 7.11.1.1 Features • • • • Decoding of external flash data connected to the quad SPI Flash Interface (SPIFI). Secure storage of keys. Support for CMAC hash calculation to authenticate encrypted data. Data is processed in little endian mode. This means that the first byte read from flash is integrated into the AES codeword as least significant byte. The 16th byte read from flash is the most significant byte of the first AES codeword. • AES engine performance of 1 byte/clock cycle. • DMA transfers supported through the GPDMA. 7.11.2 One-Time Programmable (OTP) memory The OTP provides 128 bit of memory for general purpose use and two 128-bit non-volatile memory blocks to store AES keys or other customer data. 7.12 General Purpose I/O (GPIO) The LPC1850/30/20/10 provides 8 GPIO ports with up to 31 GPIO pins each. Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. All GPIO pins default to inputs with pull-up resistors enabled on reset. 7.12.1 Features • Accelerated GPIO functions: – GPIO registers are located on the AHB so that the fastest possible I/O timing can be achieved. – Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. – All GPIO registers are byte and half-word addressable. – Entire port value can be written in one instruction. • Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port. • Direction control of individual bits. • All I/O default to inputs after reset. • Up to eight GPIO pins can be selected from all GPIO pins to create an edge- or level-sensitive GPIO interrupt request. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 74 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller • Two GPIO group interrupts can be triggered by any pin or pins in each port. 7.13 AHB peripherals 7.13.1 State Configurable Timer (SCT) subsystem The SCT allows a wide variety of timing, counting, output modulation, and input capture operations. The inputs and outputs of the SCT are shared with the capture and match inputs/outputs of the 32-bit general purpose counter/timers. The SCT can be configured as two 16-bit counters or a unified 32-bit counter. In the two-counter case, in addition to the counter value the following operational elements are independent for each half: • State variable • Limit, halt, stop, and start conditions • Values of Match/Capture registers, plus reload or capture control values In the two-counter case, the following operational elements are global to the SCT, but the last three can use match conditions from either counter: • • • • • 7.13.1.1 Clock selection Inputs Events Outputs Interrupts Features • • • • • • • • Two 16-bit counters or one 32-bit counter. Counter(s) clocked by bus clock or selected input. Up counter(s) or up-down counter(s). State variable allows sequencing across multiple counter cycles. Event combines input or output condition and/or counter match in a specified state. Events control outputs and interrupts. Selected event(s) can limit, halt, start, or stop a counter. Supports: – up to 8 inputs (one input connected internally) – up to 16 outputs – 16 match/capture registers – 16 events – 32 states 7.13.2 General Purpose DMA (GPDMA) The DMA controller allows peripheral-to memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional serial DMA transfers for a single source and destination. For LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 75 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller example, a bidirectional port requires one stream for transmit and one for receives. The source and destination areas can each be either a memory region or a peripheral for master 1, but only memory for master 0. 7.13.2.1 Features • Eight DMA channels. Each channel can support an unidirectional transfer. • 16 DMA request lines. • Single DMA and burst DMA request signals. Each peripheral connected to the DMA Controller can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the DMA Controller. • Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral transfers are supported. • Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory. • Hardware DMA channel priority. • AHB slave DMA programming interface. The DMA Controller is programmed by writing to the DMA control registers over the AHB slave interface. • Two AHB bus masters for transferring data. These interfaces transfer data when a DMA request goes active. Master 1 can access memories and peripherals, master 0 can access memories only. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. • Internal four-word FIFO per channel. • Supports 8, 16, and 32-bit wide transactions. • Big-endian and little-endian support. The DMA Controller defaults to little-endian mode on reset. • An interrupt to the processor can be generated on a DMA completion or when a DMA error has occurred. • Raw interrupt status. The DMA error and DMA count raw interrupt status can be read prior to masking. 7.13.3 SPI Flash Interface (SPIFI) The SPI Flash Interface (allows low-cost serial flash memories to be connected to the ARM Cortex-M3 processor with little performance penalty compared to parallel flash devices with higher pin count. After a few commands configure the interface at startup, the entire flash content is accessible as normal memory using byte, halfword, and word accesses by the processor and/or DMA channels. Erasure and programming are handled by simple sequences of commands. Many serial flash devices use a half-duplex command-driven SPI protocol for device setup and initialization and then move to a half-duplex, command-driven 4-bit protocol for normal operation. Different serial flash vendors and devices accept or require different LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 76 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller commands and command formats. SPIFI provides sufficient flexibility to be compatible with common flash devices and includes extensions to help insure compatibility with future devices. 7.13.3.1 Features • • • • Interfaces to serial flash memory in the main memory map. Supports classic and 4-bit bidirectional serial protocols. Half-duplex protocol compatible with various vendors and devices. Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to 40 MB per second. • Supports DMA access. 7.13.4 SD/MMC card interface The SD/MMC card interface supports the following modes: • • • • Secure Digital memory (SD version 3.0) Secure Digital I/O (SDIO version 2.0) Consumer Electronics Advanced Transport Architecture (CE-ATA version 1.1) Multimedia Cards (MMC version 4.4) 7.13.5 External Memory Controller (EMC) The LPC1850/30/20/10 EMC is a Memory Controller peripheral offering support for asynchronous static memory devices such as RAM, ROM, and NOR flash. In addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. 7.13.5.1 Features • Dynamic memory interface support including single data rate SDRAM. • Asynchronous static memory device support including RAM, ROM, and NOR flash, with or without asynchronous page mode. • Low transaction latency. • Read and write buffers to reduce latency and to improve performance. • 8/16/32 data and 24 address lines wide static memory support. On parts LPC1820/10 only 8/16 data lines are available. • 16 bit and 32 bit wide chip select SDRAM memory support. • Static memory features include: – Asynchronous page mode read – Programmable Wait States – Bus turnaround delay – Output enable and write enable delays – Extended wait • Four chip selects for synchronous memory and four chip selects for static memory devices. • Power-saving modes dynamically control CKE and CLKOUT to SDRAMs. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 77 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller • Dynamic memory self-refresh mode controlled by software. • Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row address synchronous memory parts. That is typical 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per device. • Separate reset domains allow the for auto-refresh through a chip reset if desired. Note: Synchronous static memory devices (synchronous burst mode) are not supported. 7.13.6 High-speed USB Host/Device/OTG interface (USB0) Remark: USB0 is available on parts LPC1850/30/20 (see Table 2). The USB OTG module allows the part to connect directly to a USB host such as a PC (in device mode) or to a USB device in host mode. 7.13.6.1 Features • • • • • • • • Contains UTMI+ compliant transceiver (PHY). Complies with Universal Serial Bus specification 2.0. Complies with USB On-The-Go supplement. Complies with Enhanced Host Controller Interface Specification. Supports auto USB 2.0 mode discovery. Supports all high-speed USB-compliant peripherals. Supports all full-speed USB-compliant peripherals. Supports software Host Negotiation Protocol (HNP) and Session Request Protocol (SRP) for OTG peripherals. • Supports interrupts. • This module has its own, integrated DMA engine. 7.13.7 High-speed USB Host/Device interface with ULPI (USB1) Remark: USB1 is available on parts LPC1850/30 (see Table 2). The USB1 interface can operate as a full-speed USB host/device interface or can connect to an external ULPI PHY for High-speed operation. 7.13.7.1 Features • • • • Complies with Universal Serial Bus specification 2.0. Complies with Enhanced Host Controller Interface Specification. Supports auto USB 2.0 mode discovery. Supports all high-speed USB-compliant peripherals if connected to external ULPI PHY. • Supports all full-speed USB-compliant peripherals. • Supports interrupts. • This module has its own, integrated DMA engine. 7.13.8 LCD controller Remark: The LCD controller is available on the part LPC1850 only. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 78 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller The LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024 768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode. An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the displayed data) while still supporting a large number of colors. The LCD interface includes its own DMA controller to allow it to operate independently of the CPU and other system functions. A built-in FIFO acts as a buffer for display data, providing flexibility for system timing. Hardware cursor support can further reduce the amount of CPU time needed to operate the display. 7.13.8.1 Features • • • • AHB master interface to access frame buffer. Setup and control via a separate AHB slave interface. Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data. Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces. • Supports single and dual-panel color STN displays. • Supports Thin Film Transistor (TFT) color displays. • Programmable display resolution including, but not limited to: 320 200, 320 240, 640 200, 640 240, 640 480, 800 600, and 1024 768. • • • • • • • • • • • • Hardware cursor support for single-panel displays. 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support. 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN. 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT. 16 bpp true-color non-palettized for color STN and TFT. 24 bpp true-color non-palettized for color TFT. Programmable timing for different display panels. 256 entry, 16-bit palette RAM, arranged as a 128 32-bit RAM. Frame, line, and pixel clock signals. AC bias signal for STN, data enable signal for TFT panels. Supports little and big-endian, and Windows CE data formats. LCD panel clock may be generated from the peripheral clock, or from a clock input pin. 7.13.9 Ethernet Remark: Ethernet is available on parts LPC1850/30 (see Table 2). 7.13.9.1 Features • • • • LPC1850_30_20_10 Preliminary data sheet 10/100 Mbit/s TCP/IP hardware checksum IP checksum DMA support All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 79 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller • Power management remote wake-up frame and magic packet detection • Supports both full-duplex and half-duplex operation – Supports CSMA/CD Protocol for half-duplex operation. – Supports IEEE 802.3x flow control for full-duplex operation. – Optional forwarding of received pause control frames to the user application in full-duplex operation. – Back-pressure support for half-duplex operation. – Automatic transmission of zero-quanta pause frame on deassertion of flow control input in full-duplex operation. • Support for IEEE 1588 time stamping and IEEE 1588 advanced time stamping (IEEE 1588-2008 v2). 7.14 Digital serial peripherals 7.14.1 UART Remark: The LPC1850/30/20/10 contain one UART with standard transmit and receive data lines. UART1 also provides a full modem control handshake interface and support for RS-485/9-bit mode allowing both software address detection and automatic address detection using 9-bit mode. UART1 includes a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. 7.14.1.1 Features • • • • • Maximum UART data bit rate of 8 MBit/s. 16 B Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • Equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). • Support for RS-485/9-bit/EIA-485 mode (UART1). • DMA support. 7.14.2 USART Remark: The LPC1850/30/20/10 contain three USARTs. In addition to standard transmit and receive data lines, the USARTs support a synchronous mode and a smart card mode. The USARTs include a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 80 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.14.2.1 Features • • • • • Maximum UART data bit rate of 8 MBit/s. 16 B Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • • • • • Support for RS-485/9-bit/EIA-485 mode. USART3 includes an IrDA mode to support infrared communication. All USARTs have DMA support. Support for synchronous mode at a data bit rate of up to 8 Mbit/s. Smart card mode conforming to ISO7816 specification 7.14.3 SSP serial I/O controller Remark: The LPC1850/30/20/10 contain two SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.14.3.1 Features • Maximum SSP speed of <tbd> Mbit/s (master) or <tbd> Mbit/s (slave) • Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National Semiconductor Microwire buses • • • • • Synchronous serial communication Master or slave operation 8-frame FIFOs for both transmit and receive 4-bit to 16-bit frame DMA transfers supported by GPDMA 7.14.4 I2C-bus interface Remark: The LPC1850/30/20/10 each contain two I2C-bus controllers. The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock line (SCL) and a Serial Data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 81 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.14.4.1 Features • I2C0 is a standard I2C compliant bus interface with open-drain pins. I2C0 also supports Fast mode plus with bit rates up to 1 Mbit/s. • • • • • • I2C1 uses standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus). Easy to configure as master, slave, or master/slave. Programmable clocks allow versatile rate control. Bidirectional data transfer between masters and slaves. Multi-master bus (no central master). Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. • All I2C-bus controllers support multiple address recognition and a bus monitor mode. 7.14.5 I2S interface Remark: The LPC1850/30/20/10 contain two I2S interfaces. The I2S-bus provides a standard communication interface for digital audio applications. The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S-bus connection has one master, which is always the master, and one slave. The I2S-bus interface provides a separate transmit and receive channel, each of which can operate as either a master or a slave. 7.14.5.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 192 kHz (16, 22.05, 32, 44.1, 48, 96, 192) kHz. • Support for an audio master clock. • Configurable word select period in master mode (separately for I2S-bus input and output). • Two 8-word FIFO data buffers are provided, one for transmit and one for receive. • Generates interrupt requests when buffer levels cross a programmable boundary. • Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block. • Controls include reset, stop and mute options separately for I2S-bus input and I2S-bus output. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 82 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.14.6 C_CAN Remark: The LPC1850/30/20/10 contain two C_CAN controllers. Controller Area Network (CAN) is the definition of a high performance communication protocol for serial data communication. The C_CAN controller is designed to provide a full implementation of the CAN protocol according to the CAN Specification Version 2.0B. The C_CAN controller allows to build powerful local networks with low-cost multiplex wiring by supporting distributed real-time control with a very high level of reliability. 7.14.6.1 Features • • • • • • • Conforms to protocol version 2.0 parts A and B. Supports bit rate of up to 1 Mbit/s. Supports 32 Message Objects. Each Message Object has its own identifier mask. Provides programmable FIFO mode (concatenation of Message Objects). Provides maskable interrupts. Supports Disabled Automatic Retransmission (DAR) mode for time-triggered CAN applications. • Provides programmable loop-back mode for self-test operation. 7.15 Counter/timers and motor control 7.15.1 General purpose 32-bit timers/external event counter Remark: The LPC1850/30/20/10 include four 32-bit timer/counters. The timer/counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts, generate timed DMA requests, or perform other actions at specified timer values, based on four match registers. Each timer/counter also includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.15.1.1 Features • A 32-bit timer/counter with a programmable 32-bit prescaler. • Counter or timer operation. • Two 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 83 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller – Toggle on match. – Do nothing on match. • Up to two match registers can be used to generate timed DMA requests. 7.15.2 Motor control PWM The motor control PWM is a specialized PWM supporting 3-phase motors and other combinations. Feedback inputs are provided to automatically sense rotor position and use that information to ramp speed up or down. An abort input is also provided that causes the PWM to immediately release all motor drive outputs. At the same time, the motor control PWM is highly configurable for other generalized timing, counting, capture, and compare applications. 7.15.3 Quadrature Encoder Interface (QEI) A quadrature encoder, also known as a 2-channel incremental encoder, converts angular displacement into two pulse signals. By monitoring both the number of pulses and the relative phase of the two signals, the user can track the position, direction of rotation, and velocity. In addition, a third channel, or index signal, can be used to reset the position counter. The quadrature encoder interface decodes the digital pulses from a quadrature encoder wheel to integrate position over time and determine direction of rotation. In addition, the QEI can capture the velocity of the encoder wheel. 7.15.3.1 Features • • • • • • • • • • Tracks encoder position. Increments/decrements depending on direction. Programmable for 2 or 4 position counting. Velocity capture using built-in timer. Velocity compare function with “less than” interrupt. Uses 32-bit registers for position and velocity. Three position compare registers with interrupts. Index counter for revolution counting. Index compare register with interrupts. Can combine index and position interrupts to produce an interrupt for whole and partial revolution displacement. • Digital filter with programmable delays for encoder input signals. • Can accept decoded signal inputs (clk and direction). 7.15.4 Repetitive Interrupt (RI) timer The repetitive interrupt timer provides a free-running 32-bit counter which is compared to a selectable value, generating an interrupt when a match occurs. Any bits of the timer/compare can be masked such that they do not contribute to the match detection. The repetitive interrupt timer can be used to create an interrupt that repeats at predetermined intervals. 7.15.4.1 Features • 32-bit counter. Counter can be free-running or be reset by a generated interrupt. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 84 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller • 32-bit compare value. • 32-bit compare mask. An interrupt is generated when the counter value equals the compare value, after masking. This allows for combinations not possible with a simple compare. 7.15.5 Windowed WatchDog Timer (WWDT) The purpose of the watchdog is to reset the controller if software fails to periodically service it within a programmable time window. 7.15.5.1 Features • Internally resets chip if not periodically reloaded during the programmable time-out period. • Optional windowed operation requires reload to occur between a minimum and maximum time period, both programmable. • Optional warning interrupt can be generated at a programmable time prior to watchdog time-out. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • • • • Incorrect feed sequence causes reset or interrupt if enabled. Flag to indicate watchdog reset. Programmable 24-bit timer with internal prescaler. Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in multiples of Tcy(WDCLK) 4. • The Watchdog Clock (WDCLK) uses the IRC as the clock source. 7.16 Analog peripherals 7.16.1 Analog-to-Digital Converter Remark: The LPC1850/30/20/10 contain two 10-bit ADCs. 7.16.1.1 Features • • • • • • • 10-bit successive approximation analog to digital converter. Input multiplexing among 8 pins. Power-down mode. Measurement range 0 to VDDA. Sampling frequency up to 400 kSamples/s. Burst conversion mode for single or multiple inputs. Optional conversion on transition on ADCTRIG0 or ADCTRIG1 pins, combined timer outputs 8 or 15, or the PWM output MCOA2. • Individual result registers for each A/D channel to reduce interrupt overhead. • DMA support. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 85 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.16.2 Digital-to-Analog Converter (DAC) 7.16.2.1 Features • • • • 10-bit resolution Monotonic by design (resistor string architecture) Controllable conversion speed Low power consumption 7.17 Peripherals in the RTC power domain 7.17.1 RTC The Real Time Clock (RTC) is a set of counters for measuring time when system power is on, and optionally when it is off. It uses very little power when its registers are not being accessed by the CPU, especially reduced power modes. The RTC is clocked by a separate 32 kHz oscillator that produces a 1 Hz internal time reference and is powered by its own power supply pin, VBAT. 7.17.1.1 Features • Measures the passage of time to maintain a calendar and clock. Provides seconds, minutes, hours, day of month, month, year, day of week, and day of year. • Ultra-low power design to support battery powered systems. Uses power from the CPU power supply when it is present. • • • • • Dedicated battery power supply pin. RTC power supply is isolated from the rest of the chip. Calibration counter allows adjustment to better than 1 sec/day with 1 sec resolution. Periodic interrupts can be generated from increments of any field of the time registers. Alarm interrupt can be generated for a specific date/time. 7.17.2 Alarm timer The alarm timer is a 16-bit timer and counts down at 1 kHz from a preset value generating alarms in intervals of up to 1 min. The counter triggers a status bit when it reaches 0x00 and asserts an interrupt if enabled. The alarm timer is part of the RTC power domain and can be battery powered. 7.18 System control 7.18.1 Configuration registers (CREG) The following settings are controlled in the configuration register block: • • • • • LPC1850_30_20_10 Preliminary data sheet BOD trip settings Oscillator output DMA-to-peripheral muxing Ethernet mode Memory mapping All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 86 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller • Timer/USART inputs • Enabling the USB controllers In addition, the CREG block contains the part identification and part configuration information. 7.18.2 System Control Unit (SCU) The system control unit determines the function and electrical mode of the digital pins. By default function 0 is selected for all pins with pull-up enabled. Analog I/Os for the ADCs and the DAC as well as most USB pins are on separate pads and are not controlled through the SCU. 7.18.3 Clock Generation Unit (CGU) The Clock Generator Unit (CGU) generates several base clocks. The base clocks can be unrelated in frequency and phase and can have different clock sources within the CGU. One CGU base clock is routed to the CLKOUT pins. The base clock that generates the CPU clock is referred to as CCLK. Multiple branch clocks are derived from each base clock. The branch clocks offer very flexible control for power-management purposes. All branch clocks are outputs of one of two Clock Control Units (CCUs) and can be controlled independently. Branch clocks derived from the same base clock are synchronous in frequency and phase. 7.18.4 Internal RC oscillator (IRC) The IRC is used as the clock source for the WWDT and/or as the clock that drives the PLLs and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1 % accuracy over the entire voltage and temperature range. Upon power-up or any chip reset, the LPC1850/30/20/10 use the IRC as the clock source. Software may later switch to one of the other available clock sources. 7.18.5 PLL0USB (for USB0) PLL0 is a dedicated PLL for the USB0 High-speed controller. PLL0 accepts an input clock frequency from an external oscillator in the range of 14 kHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The CCO operates in the range of 4.3 MHz to 550 MHz. 7.18.6 PLL0AUDIO (for audio) The audio PLL PLL0AUDIO is a general purpose PLL with a very small step size. This PLL accepts an input clock frequency derived from an external oscillator or internal IRC. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). A sigma-delta converter modulates the PLL divider ratios to obtain the desired output frequency. The output frequency can be set as a multiple of the sampling frequency fs to 32fs, 64fs, 128 fs, 256 fs, 384 fs, 512 fs and the sampling frequency fs can range from 16 kHz to 192 kHz (16, 22.05, 32, 44.1, 48, 96,192) kHz. Many other frequencies are possible as well. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 87 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 7.18.7 System PLL1 The PLL1 accepts an input clock frequency from an external oscillator in the range of 10 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32. The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL as a clock source. The PLL settling time is 100 s. 7.18.8 Reset Generation Unit (RGU) The RGU allows generation of independent reset signals for individual blocks and peripherals. 7.18.9 Power control The LPC1850/30/20/10 feature several independent power domains to control power to the core and the peripherals (see Figure 11). The RTC and its associated peripherals (the alarm timer, the CREG block, the OTP controller, the back-up registers, and the event router) are located in the RTC power-domain which can be powered by a battery supply or the main regulator. A power selector switch ensures that the RTC block is always powered on. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 88 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LPC18xx to I/O pads VDDIO to core VSS REGULATOR to memories, peripherals, oscillators, PLLs VDDREG MAIN POWER DOMAIN VBAT POWER SELECTOR ULTRA LOW-POWER REGULATOR to RTC domain peripherals RESET WAKEUP0/1/2/3 RESET/WAKE-UP CONTROL to RTC I/O pads (Vps) BACKUP REGISTERS RTCX1 RTCX2 32 kHz OSCILLATOR ALARM REAL-TIME CLOCK ALWAYS-ON/RTC POWER DOMAIN DAC VDDA VSSA ADC ADC POWER DOMAIN OTP VPP OTP POWER DOMAIN USB0_VDDA3V3_DRIVER USB0_VDDA3V3 USB0 USB0 POWER DOMAIN 002aag305 Fig 11. LPC1850/30/20/10 Power domains The LPC1850/30/20/10 support four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down. The LPC1850/30/20/10 can wake up from Deep-sleep, Power-down, and Deep power-down modes via the WAKEUP[3:0] pins and interrupts generated by battery powered blocks in the RTC power domain. 7.19 Emulation and debugging Debug and trace functions are integrated into the ARM Cortex-M3. Serial wire debug and trace functions are supported in addition to a standard JTAG debug and parallel trace functions. The ARM Cortex-M3 is configured to support up to eight breakpoints and four watch points. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 89 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD(REG)(3V3) regulator supply voltage (3.3 V) on pin VDDREG 2.2 3.6 V VDD(IO) input/output supply voltage on pin VDDIO 2.2 3.6 V VDDA(3V3) analog supply voltage (3.3 V) on pin VDDA 2.2 3.6 V VBAT battery supply voltage on pin VBAT 2.2 3.6 V VDD(3V3) supply voltage (3.3 V) on pin VDD; LQFP100 package only 2.2 3.6 V Vprog(pf) polyfuse programming voltage on pin VPP 2.7 3.6 V VI input voltage only valid when the VDD(IO) supply voltage is present 0.5 5.5 V ADC/DAC pins and digital I/O pins configured for an analog function (see Table 3) 0.5 VDDA(3V3) V USB0 pins (see Table 3) 0 5.2 V USB1 pins USB1_DP and USB1_DM (see Table 3) 0 5.2 V [2] 5 V tolerant I/O pins (see Table 3) supply current IDD per supply pin [3] - 100 mA [3] - 100 mA - 100 mA 65 +150 C - 1.5 W 2000 +2000 V ISS ground current per ground pin Ilatch I/O latch-up current (0.5VDD(IO)) < VI < (1.5VDD(IO)); Tj < 125 C [4] Tstg storage temperature Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption VESD electrostatic discharge voltage human body model; all pins [1] [5] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode; at 2.0 V the speed will be reduced. [3] The peak current is limited to 25 times the corresponding maximum current. [4] Dependent on package type. [5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 90 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: T j = T amb + P D R th j – a (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. Table 7. Thermal characteristics VDD = 2.2 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; Symbol Parameter Tj(max) maximum junction temperature LPC1850_30_20_10 Preliminary data sheet Conditions Min Typ Max Unit - - 125 C All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 91 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 10. Static characteristics Table 8. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only. Symbol Parameter Conditions Min Typ[1] Max Unit Supply pins VDD(IO) input/output supply voltage 2.2 - 3.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.2 - 3.6 V VDDA(3V3) analog supply voltage (3.3 V) 2.2 - 3.6 V VBAT battery supply voltage 2.2 - 3.6 V VDD(3V3) supply voltage (3.3 V) 2.2 - 3.6 V IDD(REG)(3V3) regulator supply current Regulator supply active (3.3 V) mode; code 6.5 - mA 7.5 - mA on pin VDDA on pin VDD; LQFP100 package only while(1){} executed from RAM; all peripherals disabled IDD(REG)(3V3) CCLK = 12 MHz; PLL1 disabled [2][3] - CCLK = 12 MHz; PLL1 enabled [2][4] - CCLK = 120 MHz [2][4] - 25 - mA CCLK = 156 MHz [2][4] - 30 - mA [2][3] - 5.5 - mA deep-sleep mode [2] - 75 - A power-down mode [2] - 16 - A deep power-down mode [2] - 0.02 - A deep-sleep mode [2][5] - 15 power-down mode [2][5] - 15 deep power-down mode [2][5] regulator supply current Regulator supply low (3.3 V) power mode; after WFE/WFI instruction executed from RAM; all peripherals disabled sleep mode IBAT IDD(IO) battery supply current I/O supply current ADC supply current LPC1850_30_20_10 Preliminary data sheet - A - 3 - A deep sleep mode - 1 - A power-down mode - 1 - A - 0.03 - A deep sleep mode [7] - 0.4 - A power-down mode [7] - 0.4 - A deep power-down mode [7] - 0.007 - A deep power-down mode IDD(ADC) A All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 92 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only. Symbol Parameter Conditions Min Typ[1] Max Unit V RESET pin VIH HIGH-level input voltage [6] 0.8 (Vps 0.35) 5.5 VIL LOW-level input voltage [6] 0.5 0.3 (Vps V 0.1) Vhys hysteresis voltage [6] 0.05 (Vps 0.35) - V - Standard I/O pins - normal drive strength CI input capacitance - - 2 pF IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 3 - nA IIH HIGH-level input current VI = VDD(IO); on-chip pull-down resistor disabled - 3 - nA IOZ OFF-state output current VO = 0 V to VDD(IO); on-chip pull-up/down resistors disabled; absolute value - 3 - nA VI input voltage pin configured to provide a digital function; 0 - 5.5 V [8] VDD(IO) 2.2 V VDD(IO) = 0 V 0 - 3.6 V 0 - VDD(IO) V HIGH-level input voltage 0.7 VDD(IO) - 5.5 V VIL LOW-level input voltage 0.5 - 0.3 VDD(IO) V Vhys hysteresis voltage 0.1 VDD(IO) - - V VOH HIGH-level output voltage IOH = 6 mA VDD(IO) 0.4 - - V VOL LOW-level output voltage IOL = 6 mA - - 0.4 V IOH HIGH-level output current VOH = VDD(IO) 0.4 V 6 - - mA IOL LOW-level output current VOL = 0.4 V 6 - - mA IOHS HIGH-level short-circuit drive HIGH; connected to output current ground [9] - - 86.5 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [9] - - 76.5 mA Ipd pull-down current VI = 5 V [11] - 93 - A VO output voltage VIH output active [12] [13] LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 93 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only. Symbol Ipu Parameter pull-up current Conditions VI = 0 V [11] Min Typ[1] Max Unit - 62 - A - 10 - A [12] [13] VDD(IO) < VI 5 V Rs series resistance on I/O pins with analog function; analog function enabled 200 I/O pins - high drive strength CI input capacitance - - 2 pF IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 3 - nA IIH HIGH-level input current VI = VDD(IO); on-chip pull-down resistor disabled - 3 - nA IOZ OFF-state output current VO = 0 V to VDD(IO); on-chip pull-up/down resistors disabled; absolute value - 3 - nA VI input voltage pin configured to provide a digital function; 0 - 5.5 V [8] VDD(IO) 2.2 V VDD(IO) = 0 V 0 - 3.6 V 0 - VDD(IO) V HIGH-level input voltage 0.7 VDD(IO) - 5.5 V VIL LOW-level input voltage 0.5 - 0.3 VDD(IO) V Vhys hysteresis voltage 0.1 VDD(IO) - - V Ipd pull-down current - 62 - A - 62 - A - 10 - A VO output voltage VIH output active VI = VDD(IO) [11] [12] [13] Ipu pull-up current VI = 0 V [11] [12] [13] VDD(IO) < VI 5 V I/O pins - high drive strength: standard drive mode IOH HIGH-level output current VOH = VDD(IO) 0.4 V 4 - - mA IOL LOW-level output current VOL = 0.4 V 4 - - mA IOHS HIGH-level short-circuit drive HIGH; connected to output current ground - - 32 mA [12] LOW-level short-circuit output current - - 32 mA [12] IOLS drive LOW; connected to VDD(IO) [9] [9] I/O pins - high drive strength: medium drive mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 94 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only. Symbol Parameter Conditions Min Typ[1] Max Unit IOH HIGH-level output current VOH = VDD(IO) 0.4 V 8 - - mA IOL LOW-level output current VOL = 0.4 V 8 - - mA IOHS HIGH-level short-circuit drive HIGH; connected to output current ground - - 65 mA [12] LOW-level short-circuit output current - - 63 mA [12] IOLS drive LOW; connected to VDD(IO) [9] [9] I/O pins - high drive strength: high drive mode IOH HIGH-level output current VOH = VDD(IO) 0.4 V 14 - - mA IOL LOW-level output current VOL = 0.4 V 14 - - mA IOHS HIGH-level short-circuit drive HIGH; connected to output current ground - - 113 mA [12] LOW-level short-circuit output current - - 110 mA [12] IOLS drive LOW; connected to VDD(IO) [9] [9] I/O pins - high drive strength: ultra-high drive mode IOH HIGH-level output current VOH = VDD(IO) 0.4 V 20 - - mA IOL LOW-level output current VOL = 0.4 V 20 - - mA IOHS HIGH-level short-circuit drive HIGH; connected to output current ground - - 165 mA [12] LOW-level short-circuit output current - - 156 mA [12] IOLS drive LOW; connected to VDD(IO) [9] [9] I/O pins - high-speed CI input capacitance - - 2 pF IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 3 - nA IIH HIGH-level input current VI = VDD(IO); on-chip pull-down resistor disabled - 3 - nA IOZ OFF-state output current VO = 0 V to VDD(IO); on-chip pull-up/down resistors disabled; absolute value - 3 - nA VI input voltage pin configured to provide a digital function; VDD(IO) 2.2 V 0 - 5.5 V VDD(IO) = 0 V 0 - 3.6 V VO output voltage 0 - VDD(IO) V VIH HIGH-level input voltage 0.7 VDD(IO) - 5.5 V VIL LOW-level input voltage 0.5 - 0.3 VDD(IO) V LPC1850_30_20_10 Preliminary data sheet output active [8] All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 95 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only. Min Typ[1] Max Unit 0.1 VDD(IO) - - V IOH = 8 mA VDD(IO) 0.4 - - V LOW-level output voltage IOL = 8 mA - - 0.4 V IOH HIGH-level output current VOH = VDD(IO) 0.4 V 8 - - mA IOL LOW-level output current VOL = 0.4 V 8 - - mA IOHS HIGH-level short-circuit drive HIGH; connected to output current ground [9] - - 86 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [9] - - 76 mA Ipd pull-down current VI = VDD(IO) [11] - 62 - A - 62 - A - 0 - A Symbol Parameter Vhys hysteresis voltage VOH HIGH-level output voltage VOL Conditions [12] [13] Ipu pull-up current VI = 0 V [11] [12] [13] VDD(IO) < VI 5 V Open-drain I2C0-bus pins VIH HIGH-level input voltage 0.7 VDD(IO) - - V VIL LOW-level input voltage 0.5 0.14 0.3 VDD(IO) V Vhys hysteresis voltage 0.1 VDD(IO) - - V VOL LOW-level output voltage IOLS = 3 mA - - 0.4 V ILI input leakage current VI = VDD(IO) [10] VI = 5 V - 4.5 - A - - 10 A Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 - 1.2 V Vo(XTAL2) output voltage on pin XTAL2 0.5 - 1.2 V Cio input/output capacitance - - 0.8 pF [14] USB0 pins[15] Rpd pull-down resistance on pin USB0_VBUS 48 64 80 k VIC common-mode input voltage high-speed mode 50 200 500 mV full-speed/low-speed mode 800 - 2500 mV chirp mode 50 - 600 mV LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 96 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only. Symbol Parameter Vi(dif) differential input voltage USB1 pins Conditions Min Typ[1] Max Unit 100 400 1100 mV - - 10 A - - 5.25 V (USB1_DP/USB1_DM)[15] 0 V < VI < 3.3 V [15] IOZ OFF-state output current VBUS bus supply voltage VDI differential input sensitivity voltage (D+) (D) 0.2 - - V VCM differential common mode voltage range includes VDI range 0.8 - 2.5 V Vth(rs)se single-ended receiver switching threshold voltage 0.8 - 2.0 V VOL LOW-level output voltage for low-/full-speed RL of 1.5 k to 3.6 V - - 0.18 V VOH HIGH-level output voltage (driven) for low-/full-speed RL of 15 k to GND 2.8 - 3.5 V Ctrans transceiver capacitance pin to GND ZDRV driver output with 33 series resistor; impedance for driver steady state drive which is not high-speed capable [16] - - 20 pF 36 - 44.1 [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] VDD(REG)(3V3) = VDD(IO)= VDDA(3V3) = 3.3 V; Tamb = 25 C for all power consumption measurements. [3] PLL1 disabled. Normal power mode. [4] PLL1 enabled. Normal power mode. [5] On pin VBAT; Tamb = 25 C. VDD(REG)(3V3) not present. [6] Vps corresponds to the output of the power switch (see Figure 11) which is determined by the greater of VBAT and VDD(Reg)(3V3). [7] VDDA(3V3) = 3.3 V; Tamb = 25 C. [8] VDD(IO) supply voltage must be present. [9] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [10] To VSS. [11] The values specified are simulated and absolute values. [12] The weak pull-up resistor is connected to the VDD(IO) rail and pulls up the I/O pin to the VDD(IO) level. [13] The input cell disables the weak pull-up resistor when the applied input voltage exceeds VDD(IO). [14] The parameter value specified is a simulated value excluding bond capacitance. [15] For USB operation 3.0 V VDD((IO) 3.6 V. Guaranteed by design. [16] Includes external resistors of 33 1 % on D+ and D. 10.1 Power consumption Remark: All power consumption data in this section apply to Rev ‘A’ of the LPC1850/30/20/10 parts only. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 97 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 001aac984 X X (X) X X <tbd> X X X X X X X X X (X) Conditions: Tamb = 25 C; normal mode entered executing code while(1){} from SRAM; internal pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all peripherals disabled; all peripheral clocks disabled. Fig 12. Typical supply current versus regulator supply voltage VDD(REEG)(3V3) in active mode 001aac984 X X (X) X X <tbd> X X X X X X X X X (X) Conditions: VDD(REG)(3V3) = 3.0 V, normal mode entered executing code while(1){} from SRAM; internal pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all peripherals disabled; all peripheral clocks disabled. Fig 13. Typical supply current versus temperature in active mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 98 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 001aac984 X X (X) X X <tbd> X X X X X X X X X (X) Conditions: VDD(REG)(3V3) = 3.0 V; internal pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all peripherals disabled; all peripheral clocks disabled. Fig 14. Typical supply current versus temperature in sleep mode 001aac984 X X (X) X X <tbd> X X X X X X X X X (X) Conditions: VBAT = 0 V; VDD(IO) = 0 V. Fig 15. Typical supply current versus temperature in Deep-sleep mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 99 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 001aac984 X X (X) X X <tbd> X X X X X X X X X (X) Conditions: VBAT = 0 V; VDD(IO) = 0 V. Fig 16. Typical supply current versus temperature in Power-down mode 001aac984 X X (X) X X <tbd> X X X X X X X X X (X) Conditions: VBAT = 0 V; VDD(IO) = 0 V. Fig 17. Typical supply current versus temperature in Deep power-down mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 100 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 10.2 Electrical pin characteristics 001aab173 X 001aab173 X X (X) X (X) X X X X <tbd> X <tbd> X X X X X X X X X X X X X X X X X (X) X X (X) Conditions: VDD(REG)(3V3) = VDD(IO) = 3.3 V; standard port pins. Fig 18. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH Conditions: VDD(REG)(3V3) = VDD(IO) = 3.3 V; standard port pins. Fig 19. Typical LOW-level output current IOL versus LOW-level output voltage VOL 002aag625 +20 Ipu (μA) 0 -20 T = 25 °C -40 °C -40 -60 -80 0 1 2 3 4 5 VI (V) Conditions: VDD(IO)) = 3.3 V. Simulated values. Values at T = 25 C are typical values. Values at T = 40 C correspond to minimum values. Fig 20. Typical pull-up current Ipu versus input voltage VI LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 101 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 002aag626 120 Ipd (μA) 90 60 T =25 °C -40 °C 30 0 0 1 2 3 4 5 VI (V) Conditions: VDD(IO)) = 3.3 V. Simulated values. Values at T = 25 C are typical values. Values at T = 40 C correspond to maximum values. Fig 21. Typical pull-down current Ipd versus input voltage VI LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 102 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 11. Dynamic characteristics 11.1 Wake-up times Table 9. Dynamic characteristic: Wake-up from Deep-sleep, Power-down, and Deep power-down modes Tamb = 40 C to +85 C Symbol Parameter twake Min Typ[1] 3 Tcy(clk) 5 Tcy(clk) - ns from Deep-sleep and Power-down mode 12 51 - s from Deep power-down mode - 250 - s after reset - 250 - s Conditions [2] wake-up time from Sleep mode Max Unit [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] Tcy(clk) = 1/CCLK with CCLK = CPU clock frequency. 11.2 External clock Table 10. Dynamic characteristic: external clock Tamb = 40 C to +85 C; VDD(IO) over specified ranges.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk) 0.4 - Tcy(clk) 0.6 ns tCLCX clock LOW time Tcy(clk) 0.4 - Tcy(clk) 0.6 ns [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. tCHCX tCLCX Tcy(clk) 002aag698 Fig 22. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 103 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 11.3 Crystal oscillator Table 11. Dynamic characteristic: oscillator Tamb = 40 C to +85 C; VDD(IO), VDD(REG)(3V3) over specified ranges.[1] Symbol Parameter Conditions Low-frequency mode (1 MHz - 20 tjit(per) period jitter time period jitter time 5 MHz crystal [3][4] Preliminary data sheet Max Unit - 13.2 - ps 10 MHz crystal - 6.6 - ps 15 MHz crystal - 4.8 - ps - 4.3 - ps - 3.7 - ps MHz)[6] 20 MHz crystal [3][4] 25 MHz crystal LPC1850_30_20_10 Typ[2] MHz)[5] High-frequency mode (20 MHZ - 25 tjit(per) Min [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [3] Indicates RMS period jitter. [4] PLL-induced jitter is not included. [5] Select HF = 0 in the XTAL_OSC_CTRL register. [6] Select HF = 1 in the XTAL_OSC_CTRL register. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 104 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 11.4 IRC and RTC oscillators Table 12. Dynamic characteristic: IRC and RTC oscillators Tamb = 40 C to +85 C; 2.2 V VDD(REG)(3V3) 3.6 V.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 11.88 12 12.12 MHz fi(RTC) RTC input frequency - - 32.768 - kHz [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. 001aab173 X X (X) X X <tbd> X X X X X X X X X X (X) Conditions: Frequency values are typical values. Fig 23. Internal RC oscillator frequency versus temperature 11.5 I2C-bus Table 13. Dynamic characteristic: I2C-bus pins Tamb = 40 C to +85 C; 2.2 V VDD(REG)(3V3) 3.6 V.[1] Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency Standard-mode 0 100 kHz Fast-mode 0 400 kHz Fast-mode Plus 0 1 MHz of both SDA and SCL signals - 300 ns Fast-mode 20 + 0.1 Cb 300 ns Fast-mode Plus - 120 ns Standard-mode 4.7 - s Fast-mode 1.3 - s Fast-mode Plus 0.5 - s tf [3][4][5][6] fall time Standard-mode tLOW LOW period of the SCL clock LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 105 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 13. Dynamic characteristic: I2C-bus pins Tamb = 40 C to +85 C; 2.2 V VDD(REG)(3V3) 3.6 V.[1] Symbol Parameter Conditions Min Max Unit tHIGH HIGH period of the SCL clock Standard-mode 4.0 - s Fast-mode 0.6 - s [8][9] data set-up time tSU;DAT [1] [2][3][7] data hold time tHD;DAT Fast-mode Plus 0.26 - s Standard-mode 0 - s Fast-mode 0 - s Fast-mode Plus 0 - s Standard-mode 250 - ns Fast-mode 100 - ns Fast-mode Plus 50 - ns Parameters are valid over operating temperature range unless otherwise specified. [2] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge. [3] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. [4] Cb = total capacitance of one bus line in pF. If mixed with Hs-mode devices, faster fall times are allowed. [5] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. [6] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should allow for this when considering bus timing. [7] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or tVD;ACK by a transition time. This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock. [8] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the acknowledge. [9] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time. tf SDA tSU;DAT 70 % 30 % 70 % 30 % tHD;DAT tf 70 % 30 % SCL tVD;DAT tHIGH 70 % 30 % 70 % 30 % 70 % 30 % tLOW S 1 / fSCL 002aaf425 Fig 24. I2C-bus pins clock timing LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 106 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 11.6 I2S-bus interface Table 14. Dynamic characteristics: I2S-bus interface pins Tamb = 25 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; CL = 20 pF. Conditions and data refer to I2S0 and I2S1 pins. Simulated values. Symbol Parameter Conditions Min Typ Max Unit common to input and output tr rise time - 4 - ns tf fall time - 4 - ns tWH pulse width HIGH on pins I2Sx_TX_SCK and I2Sx_RX_SCK <tbd> - - - tWL pulse width LOW on pins I2Sx_TX_SCK and I2Sx_RX_SCK - - <tbd> ns - 4.4 - ns - 4.3 - ns 0 - output tv(Q) data output valid time on pin I2Sx_TX_SDA [1] on pin I2Sx_TX_WS input tsu(D) data input set-up time on pin I2Sx_RX_SDA [1] - on pin I2Sx_RX_WS th(D) data input hold time on pin I2Sx_RX_SDA on pin I2Sx_RX_WS [1] ns 0.20 [1] ns - 3.7 - ns - 3.9 - ns Clock to the I2S-bus interface BASE_APB1_CLK = 150 MHz; peripheral clock to the I2S-bus interface PCLK = BASE_APB1_CLK / 12. I2S clock cycle time Tcy(clk) = 79.2 ns; corresponds to the SCK signal in the I2S-bus specification. Tcy(clk) tf tr I2Sx_TX_SCK tWH tWL I2Sx_TX_SDA tv(Q) I2Sx_TX_WS tv(Q) 002aag497 Fig 25. I2S-bus timing (transmit) LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 107 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Tcy(clk) tf tr I2Sx_RX_SCK tWH tWL I2Sx_RX_SDA tsu(D) th(D) I2Sx_RX_WS tsu(D) 002aag498 tsu(D) Fig 26. I2S-bus timing (receive) 11.7 USART interface Table 15. Dynamic characteristics: USART interface Tamb = 25 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; CL = 20 pF. Simulated values. Symbol Parameter Conditions Min Typ Max Unit Tcy(clk) clock cycle time on pins Ux_UCLK - 0.1 - s data output valid time on pin Ux_TXD - 6.5 - ns output tv(Q) LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 108 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 11.8 SSP interface Table 16. Dynamic characteristics: SSP pins in SPI mode Tamb = 25 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. Simulated values. Symbol Tcy(clk) Parameter clock cycle time Conditions Min Typ Max Unit - 40 - ns when only transmitting - 20 - ns 8.8 - ns full-duplex mode [1] SSP master tDS data set-up time in SPI mode - tDH data hold time in SPI mode - 5.0 - ns tv(Q) data output valid time in SPI mode - 3.9 - ns th(Q) data output hold time in SPI mode - 0.4 - ns 120 - - ns SSP slave Tcy(PCLK) PCLK cycle time Tcy(clk) clock cycle time 10 tDS data set-up time in SPI mode - 10.5 - ns tDH data hold time in SPI mode - 1 - ns tv(Q) data output valid time in SPI mode - 4.0 - ns th(Q) data output hold time in SPI mode - 0.2 - ns [2] ns [1] Tcy(clk) = (SSPCLKDIV (1 + SCR) CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the main clock frequency fmain, the SSP peripheral clock divider (SSPCLKDIV), the SSP SCR parameter (specified in the SSP0CR0 register), and the SSP CPSDVSR parameter (specified in the SSP clock prescale register). [2] Tcy(clk) = 12 Tcy(PCLK). LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 109 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Tcy(clk) tclk(H) tclk(L) SCK (CPOL = 0) SCK (CPOL = 1) tv(Q) th(Q) DATA VALID MOSI DATA VALID tDS DATA VALID MISO tDH DATA VALID tv(Q) MOSI th(Q) DATA VALID DATA VALID tDH tDS MISO CPHA = 1 DATA VALID CPHA = 0 DATA VALID 002aae829 Fig 27. SSP master timing in SPI mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 110 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Tcy(clk) tclk(H) tclk(L) tDS tDH SCK (CPOL = 0) SCK (CPOL = 1) MOSI DATA VALID DATA VALID tv(Q) MISO th(Q) DATA VALID tDS MOSI DATA VALID tDH DATA VALID tv(Q) MISO DATA VALID CPHA = 1 DATA VALID th(Q) CPHA = 0 DATA VALID 002aae830 Fig 28. SSP slave timing in SPI mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 111 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 11.9 External memory interface Table 17. Dynamic characteristics: Static external memory interface CL = 22 pF for EMC_Dn CL = 20 pF for all others; Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; values guaranteed by design. Symbol Parameter[1] Conditions Min Typ Max Unit 3.1 - 1.6 ns 0.6 + Tcy(clk) WAITOEN - 1.3 + Tcy(clk) WAITOEN ns 0.7 - 1.8 ns Read cycle parameters tCSLAV CS LOW to address valid time tCSLOEL CS LOW to OE LOW time tCSLBLSL CS LOW to BLS LOW time [2] PB = 1 0.6 + (WAITRD WAITOEN + 1) Tcy(clk) 0.4 + ns (WAITRD WAITOEN + 1) Tcy(clk) memory access time - - 16 + (WAITRD WAITOEN +1) Tcy(clk) ns th(D) data input hold time 16 - - ns tCSHBLSH CS HIGH to BLS HIGH time PB = 1 0.4 - 1.9 ns tOELOEH OE LOW to OE HIGH time tam [2] tCSHOEH CS HIGH to OE HIGH time 0.4 - 1.4 ns tOEHANV OE HIGH to address invalid PB = 1 2.0 - 2.6 ns tCSHEOR CS HIGH to end of read time [3] 2.0 - 0 ns tCSLSOR CS LOW to start of read time [4] 0 - 1.8 ns Write cycle parameters tCSLAV CS LOW to address valid time 3.1 - 1.6 ns tCSLDV CS LOW to data valid time 3.1 - 1.5 ns tCSLWEL CS LOW to WE LOW time PB = 1 1.5 - 0.2 ns tCSLBLSL CS LOW to BLS LOW time PB = 1 0.7 - 1.8 ns 0.6 + (WAITWR WAITWEN + 1) Tcy(clk) 0.4 + ns (WAITWR WAITWEN + 1) Tcy(clk) tWELWEH WE LOW to WE HIGH time PB = 1 [2] tWEHDNV WE HIGH to data invalid time PB = 1 [2] 0.9 + Tcy(clk) - 2.3 + Tcy(clk) ns tWEHEOW WE HIGH to end of write time PB = 1 [2] 0.4 + Tcy(clk) - 0.3 + Tcy(clk) ns PB = 0 0.7 - 1.8 ns [5] tCSLBLSL CS LOW to BLS LOW tBLSLBLSH BLS LOW to BLS HIGH time PB = 0 [2] 0.9 + (WAITWR WAITWEN + 1) Tcy(clk) 0.1 + ns (WAITWR WAITWEN + 1) Tcy(clk) tBLSHEOW BLS HIGH to end of write time [2] 1.9 + Tcy(clk) 0.5 + Tcy(clk) LPC1850_30_20_10 Preliminary data sheet PB = 0 - ns [5] All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 112 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 17. Dynamic characteristics: Static external memory interface …continued CL = 22 pF for EMC_Dn CL = 20 pF for all others; Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; values guaranteed by design. Symbol Parameter[1] Conditions tBLSHDNV BLS HIGH to data invalid time PB = 0 tCSHEOW CS HIGH to end of write time tBLSHDNV BLS HIGH to data invalid time tWEHANV WE HIGH to address invalid PB = 1 time PB = 1 Min Typ Max Unit [2] 2.5 + Tcy(clk) - 1.4 + Tcy(clk) ns [5] 2.0 - 0 ns 2.5 - 1.4 ns 0.9 + Tcy(clk) - 2.4 + Tcy(clk) ns [1] Parameters specified for 40 % of VDD(IO) for rising edges and 60 % of VDD(IO) for falling edges. [2] Tcy(clk) = 1/CCLK (see LPC18xx User manual). [3] End Of Read (EOR): longest of tCSHOEH, tOEHANV, tCSHBLSH. [4] Start Of Read (SOR): longest of tCSLAV, tCSLOEL, tCSLBLSL. [5] End Of Write (EOW): earliest of address not valid or EMC_BLSn HIGH. EMC_An tCSLAV tCSLAV tOEHANV tCSHEOW EMC_CSn tCSLOEL tOELOEH EMC_OE tCSHOEH tBLSHEOW tCSLBLSL tBLSLBLSH EMC_BLSn EMC_WE tCSLDV tam tCSHEOR tCSLSOR tBLSHDNV th(D) EMC_Dn SOR EOR EOW 002aag699 Fig 29. External static memory read/write access (PB = 0) LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 113 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller EMC_An tCSLAV tCSLAV tOEHANV tCSHEOW EMC_CSn tCSLOEL tOELOEH EMC_OE tCSLBLSL tCSHOEH tCSLBLSL EMC_BLSn tCSHBLSH tCSLWEL tWELWEH tWEHEOW EMC_WE tBLSHDNV tam tCSHEOR th(D) tCSLSOR tCSLDV tWEHDNV EMC_Dn SOR EOR EOW 002aag700 Fig 30. External static memory read/write access (PB = 1) LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 114 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 18. Dynamic characteristics: Dynamic external memory interface Simulated data over temperature and process range; CL = 10 pF for EMC_DYCSn, EMC_RAS, EMC_CAS, EMC_WE, EMC_An; CL = 9 pF for EMC_Dn; CL = 5 pF for EMC_DQMOUTn, EMC_CLKn, EMC_CKEOUTn; Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; VDD(IO) =3.3 V 10 %; RD = 1 (see LPC18xx User manual); EMC_CLKn delays CLK0_DELAY = CLK1_DELAY = CLK2_DELAY = CLK3_DELAY = 0. Symbol Parameter Min Typ Max Unit Tcy(clk) clock cycle time 8.4 - - ns 3.1 + 0.5 Tcy(clk) 5.1 + 0.5 Tcy(clk) ns - ns 4.9 + 0.5 Tcy(clk) ns - ns 4.6 + 0.5 Tcy(clk) ns - ns 5.9 + 0.5 Tcy(clk) ns - ns 5.0 + 0.5 Tcy(clk) ns - ns 6.3 + 0.5 Tcy(clk) ns Common to read and write cycles td(DYCSV) dynamic chip select valid delay time - th(DYCS) dynamic chip select hold time 0.3 + 0.5 Tcy(clk) 0.9 + 0.5 Tcy(clk) td(RASV) row address strobe valid delay time - th(RAS) row address strobe hold time 0.5 + 0.5 Tcy(clk) 1.1 + 0.5 Tcy(clk) td(CASV) column address strobe valid delay time - th(CAS) column address strobe hold time 0.3 + 0.5 Tcy(clk) 0.9 + 0.5 Tcy(clk) td(WEV) write enable valid delay time - th(WE) write enable hold time 1.3 + 0.5 Tcy(clk) 1.4 + 0.5 Tcy(clk) td(DQMOUTV) DQMOUT valid delay time - th(DQMOUT) DQMOUT hold time 0.2 + 0.5 Tcy(clk) 0.8 + 0.5 Tcy(clk) td(AV) address valid delay time - th(A) address hold time 0.3 + 0.5 Tcy(clk) 0.9 + 0.5 Tcy(clk) - ns td(CKEOUTV) CKEOUT valid delay time - 3.1 + 0.5 Tcy(clk) 5.1 + 0.5 Tcy(clk) ns th(CKEOUT) CKEOUT hold time 0.5 Tcy(clk) 0.7 + 0.5 Tcy(clk) - ns 3.1 + 0.5 Tcy(clk) 2.9 + 0.5 Tcy(clk) 3.2 + 0.5 Tcy(clk) 3.1 + 0.5 Tcy(clk) 3.8 + 0.5 Tcy(clk) Read cycle parameters tsu(D) data input set-up time 1.5 0.5 - ns th(D) data input hold time - 0.8 2.2 ns Write cycle parameters td(QV) data output valid delay time - 3.8 + 0.5 Tcy(clk) 6.2 + 0.5 Tcy(clk) ns th(Q) data output hold time 0.5 Tcy(clk) 0.7 + 0.5 Tcy(clk) - ns Table 19. Dynamic characteristics: Dynamic external memory interface; EMC_CLK[3:0] delay values Tamb = 40 C to 85 C; VDD(IO) =3.3 V 10 %; 2.2 V VDD(REG)(3V3) 3.6 V. Symbol Parameter Conditions td delay time delay value CLKn_DELAY = 0 [1] LPC1850_30_20_10 Preliminary data sheet Min Typ Max Unit [1] 0.0 0.0 0.0 ns CLKn_DELAY = 1 [1] 0.4 0.5 0.8 ns CLKn_DELAY = 2 [1] 0.7 1.0 1.7 ns CLKn_DELAY = 3 [1] 1.1 1.6 2.5 ns CLKn_DELAY = 4 [1] 1.4 2.0 3.3 ns CLKn_DELAY = 5 [1] 1.7 2.6 4.1 ns CLKn_DELAY = 6 [1] 2.1 3.1 4.9 ns CLKn_DELAY = 7 [1] 2.5 3.6 5.8 ns Program the EMC_CLKn delay values in the EMCDELAYCLK register (see the LPC18xx User manual). The delay values must be the same for all SDRAM clocks EMC_CLKn: CLK0_DELAY = CLK1_DELAY = CLK2_DELAY = CLK3_DELAY. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 115 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller EMC_CLKn delay > 0 EMC_CLKn delay td; programmable CLKn_DELAY Tcy(clk) EMC_CLKn delay = 0 td(xV) - td EMC_DYCSn, EMC_RAS, EMC_CAS, EMC_WE, EMC_CKEOUTn, EMC_A[22:0], EMC_DQMOUTn td(xV) th(x) - td th(x) td(QV) - td td(QV) th(Q) - td th(Q) EMC_D[31:0] write tsu(D) th(D) EMC_D[31:0] read; delay > 0 tsu(D) th(D) EMC_D[31:0] read; delay = 0 002aag703 For the programmable EMC_CLK[3:0] clock delays CLKn_DELAY, see Table 19 . Remark: For SDRAM operation, set CLK0_DELAY = CLK1_DELAY = CLK2_DELAY = CLK3_DELAY in the EMCDELAYCLK register. Fig 31. SDRAM timing LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 116 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 11.10 USB interface Table 20. Dynamic characteristics: USB0 and USB1 pins (full-speed) CL = 50 pF; Rpu = 1.5 k on D+ to VDD(IO); 3.0 V VDD(IO) 3.6 V. Symbol Parameter Conditions Min Typ Max Unit tr rise time 10 % to 90 % 8.5 - 13.8 ns tf fall time 10 % to 90 % 7.7 - 13.7 ns tFRFM differential rise and fall time matching tr / tf - - 109 % VCRS output signal crossover voltage 1.3 - 2.0 V tFEOPT source SE0 interval of EOP see Figure 32 160 - 175 ns tFDEOP source jitter for differential transition to SE0 transition see Figure 32 2 - +5 ns tJR1 receiver jitter to next transition 18.5 - +18.5 ns tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns tEOPR1 EOP width at receiver must reject as EOP; see Figure 32 [1] 40 - - ns tEOPR2 EOP width at receiver must accept as EOP; see Figure 32 [1] 82 - - ns [1] Characterized but not implemented as production test. Guaranteed by design. TPERIOD crossover point extended crossover point differential data lines source EOP width: tFEOPT differential data to SE0/EOP skew n × TPERIOD + tFDEOP receiver EOP width: tEOPR1, tEOPR2 002aab561 Fig 32. Differential data-to-EOP transition skew and EOP width LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 117 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 21. Symbol Static characteristics: USB0 PHY pins[1] Parameter Conditions Min Typ Max Unit - 68 - mW - 18 - mA High-speed mode Pcons [2] power consumption IDDA(3V3) analog supply current (3.3 V) on pin USB0_VDDA3V3_DRIVER; [3] total supply current IDDD during transmit - 31 - mA during receive - 14 - mA with driver tri-stated - 14 - mA - 7 - mA - 15 - mW digital supply current Full-speed/low-speed mode Pcons [2] power consumption IDDA(3V3) analog supply current (3.3 V) IDDD on pin USB0_VDDA3V3_DRIVER; total supply current - 3.5 - mA during transmit - 5 - mA during receive - 3 - mA with driver tri-stated - 3 - mA - 3 - mA - 24 - A with driver tri-stated - 24 - A with OTG functionality enabled - 3 - mA - 30 - A 4.4 - - V digital supply current Suspend mode IDDA(3V3) analog supply current (3.3 V) IDDD digital supply current VBUS detector outputs threshold voltage Vth Vhys [1] for VBUS valid hysteresis voltage for session end 0.2 - 0.8 V for A valid 0.8 - 2 V for B valid 2 - 4 V for session end - 150 10 mV A valid - 200 10 mV B valid - 200 10 mV Characterized but not implemented as production test. [2] Total average power consumption. [3] The driver is active only 20 % of the time. 11.11 Ethernet Table 22. Dynamic characteristics: Ethernet Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. Values guaranteed by design. Symbol Parameter Conditions Min Max Unit [1] - 50 MHz [1] 50 50 % RMII mode fclk clk LPC1850_30_20_10 Preliminary data sheet clock frequency for ENET_RX_CLK clock duty cycle All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 118 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 22. Dynamic characteristics: Ethernet Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. Values guaranteed by design. Symbol Parameter Conditions Min Max Unit 4 - ns tsu set-up time for ENET_TXDn, ENET_TX_EN, ENET_RXDn, ENET_RX_ER, ENET_RX_DV [1][2] th hold time for ENET_TXDn, ENET_TX_EN, ENET_RXDn, ENET_RX_ER, ENET_RX_DV [1][2] 2 - ns clock frequency for ENET_TX_CLK [1] - 25 MHz clock duty cycle [1] 50 50 % tsu set-up time for ENET_TXDn, ENET_TX_EN, ENET_TX_ER [1][2] 4 - ns th hold time for ENET_TXDn, ENET_TX_EN, ENET_TX_ER [1][2] 2 - ns fclk clock frequency for ENET_RX_CLK [1] - 25 MHz clk clock duty cycle [1] 50 50 % tsu set-up time for ENET_RXDn, ENET_RX_ER, ENET_RX_DV [1][2] 4 - ns th hold time for ENET_RXDn, ENET_RX_ER, ENET_RX_DV [1][2] 2 - ns MII mode fclk clk [1] Output drivers can drive a load 25 pF accommodating over 12 inch of PCB trace and the input capacitance of the receiving device. [2] Timing values are given from the point at which the clock signal waveform crosses 1.4 V to the valid input or output level. ENET_RX_CLK ENET_TX_CLK ENET_RXD[n] ENET_RX_DV ENET_RX_ER ENET_TXD[n] ENET_TX_EN ENET_TX_ER tsu th 002aag210 Fig 33. Ethernet timing LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 119 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 11.12 SD/MMC Table 23. Dynamic characteristics: SD/MMC Tamb = 25 C, 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V, CL = 20 pF. Simulated values. Symbol Parameter fclk clock frequency Conditions Min Typ Max Unit on pin SD_CLK; data transfer mode - 40 <tbd> MHz on pin SD_CLK; identification mode <tbd> MHz tsu(D) data input set-up time on pins SD_CMD, SD_DATn <tbd> 9.9 as inputs - ns th(D) data input hold time on pins SD_CMD, SD_DATn <tbd> 0.3 as inputs - ns td(QV) data output valid delay time on pins SD_CMD, SD_DATn as outputs <tbd> ns th(Q) data output hold time on pins SD_CMD, SD_DATn <tbd> 0.3 as outputs 6.9 - ns Tcy(clk) SD_CLK td(QV) th(Q) SD_CMD (O) SD_DATn (O) tsu(D) th(D) SD_CMD (I) SD_DATn (I) 002aag204 Fig 34. SD/MMC timing 11.13 LCD Table 24. Dynamic characteristics: LCD Tamb = 25 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; CL = 20 pF. Simulated values. Symbol Parameter LPC1850_30_20_10 Preliminary data sheet Conditions Min Typ Max on pin LCD_DCLK - 50 <tbd> MHz fclk clock frequency tsu(D) data input set-up time th(D) data input hold time td(QV) data output valid delay time th(Q) data output hold time <tbd> <tbd> All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 <tbd> Unit - ns <tbd> <tbd> - ns - <tbd> ns 14.1 - ns © NXP B.V. 2011. All rights reserved. 120 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 12. ADC/DAC electrical characteristics Table 25. ADC characteristics VDDA(3V3) over specified ranges; Tamb = 40 C to +85 C; ADC frequency 4.5 MHz; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VIA analog input voltage 0 - VDDA(3V3) V Cia analog input capacitance - - 2 pF ED differential linearity error - 0.8 - LSB - 1.0 - LSB 2.7 V VDDA(3V3) 3.6 V [1][2] 2.2 V VDDA(3V3) < 2.7 V EL(adj) integral non-linearity 2.7 V VDDA(3V3) 3.6 V [3] 2.2 V VDDA(3V3) < 2.7 V offset error EO 2.7 V VDDA(3V3) 3.6 V [4] 2.2 V VDDA(3V3) < 2.7 V gain error EG 2.7 V VDDA(3V3) 3.6 V absolute error 0.8 - LSB - 1.5 - LSB - 0.15 - LSB - 0.15 - LSB - 0.3 - % - 0.35 - % - 3 - LSB 2.2 V VDDA(3V3) < 2.7 V - 4 - LSB see Figure 36 - - 1/(7 fclk(ADC) Cia) k - - 1.2 M [5] 2.2 V VDDA(3V3) < 2.7 V ET - 2.7 V VDDA(3V3) 3.6 V [6] Rvsi voltage source interface resistance Ri input resistance fclk(ADC) ADC clock frequency - - 4.5 MHz fc(ADC) ADC conversion frequency 10-bit resolution; 11 clock cycles - - 400 kSamples/s 1.5 MSamples/s [7][8] 2-bit resolution; 3 clock cycles [1] The ADC is monotonic, there are no missing codes. [2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 35. [3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 35. [4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 35. [5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 35. [6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 35. [7] Tamb = 25 C; maximum sampling frequency fs = 4.5 MHz and analog input capacitance Cia = 2 pF. [8] Input resistance Ri depends on the sampling frequency fs: Ri = 2 k + 1 / (fs Cia). LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 121 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller offset error EO gain error EG 1023 1022 1021 1020 1019 1018 (2) 7 code out (1) 6 5 (5) 4 (4) 3 (3) 2 1 LSB (ideal) 1 0 1 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024 VIA (LSBideal) offset error EO 1 LSB = VDDA(3V3) − VSSA 1024 002aaf959 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 35. 10-bit ADC characteristics LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 122 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Rvsi LPC18xx 2 kΩ (analog pin) 2.2 kΩ (multiplexed pin) ADC0_n/ADC1_n Rs ADC COMPARATOR Cia = 2 pF VEXT VSS 002aag697 Rs < 1/((7 fclk(ADC) Cia) 2 k Fig 36. ADC interface to pins Table 26. DAC characteristics VDDA(3V3) over specified ranges; Tamb = 40 C to +85 C; unless otherwise specified Symbol ED Parameter Conditions differential linearity error 2.7 V VDDA(3V3) 3.6 V [1] 2.2 V VDDA(3V3) < 2.7 V EL(adj) integral non-linearity 2.7 V VDDA(3V3) 3.6 V [1] 2.2 V VDDA(3V3) < 2.7 V EO offset error 2.7 V VDDA(3V3) 3.6 V [1] 2.2 V VDDA(3V3) < 2.7 V EG gain error 2.7 V VDDA(3V3) 3.6 V [1] 2.2 V VDDA(3V3) < 2.7 V Min Typ Max Unit - 0.8 - LSB - 1.0 - LSB - 1.0 - LSB - 1.5 - LSB - 0.8 - LSB - 1.0 - LSB - 0.3 - % - 1.0 - % CL load capacitance - - 200 pF RL load resistance 1 - - k ts [1] settling time [1] In the DAC CR register, bit BIAS = 0 (see the LPC18xx user manual). [2] Settling time is calculated within 1/2 LSB of the final value. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 0.4 s © NXP B.V. 2011. All rights reserved. 123 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 13. Application information 13.1 LCD panel signal usage Table 27. LCD panel connections for STN single panel mode External pin 4-bit mono STN single panel 8-bit mono STN single panel Color STN single panel LPC18xx pin used LCD function LPC18xx pin used LCD function LPC18xx pin used LCD function LCD_VD[23:8] - - - - - - LCD_VD7 - - P8_4 UD[7] P8_4 UD[7] LCD_VD6 - - P8_5 UD[6] P8_5 UD[6] LCD_VD5 - - P8_6 UD[5] P8_6 UD[5] LCD_VD4 - - P8_7 UD[4] P8_7 UD[4] LCD_VD3 P4_2 UD[3] P4_2 UD[3] P4_2 UD[3] LCD_VD2 P4_3 UD[2] P4_3 UD[2] P4_3 UD[2] LCD_VD1 P4_4 UD[1] P4_4 UD[1] P4_4 UD[1] LCD_VD0 P4_1 UD[0] P4_1 UD[0] P4_1 UD[0] LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP LCD_ENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM LCD_FP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE LCD_PWR P7_7 CDPWR P7_7 LCDPWR P7_7 LCDPWR GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN Table 28. LCD panel connections for STN dual panel mode External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel LPC18xx pin used LCD function LPC18xx pin used LCD function LPC18xx pin used LCD function LCD_VD[23:16] - - - - - - LCD_VD15 - - PB_4 LD[7] PB_4 LD[7] LCD_VD14 - - PB_5 LD[6] PB_5 LD[6] LCD_VD13 - - PB_6 LD[5] PB_6 LD[5] LCD_VD12 - - P8_3 LD[4] P8_3 LD[4] LCD_VD11 P4_9 LD[3] P4_9 LD[3] P4_9 LD[3] LCD_VD10 P4_10 LD[2] P4_10 LD[2] P4_10 LD[2] LCD_VD9 P4_8 LD[1] P4_8 LD[1] P4_8 LD[1] LCD_VD8 P7_5 LD[0] P7_5 LD[0] P7_5 LD[0] LCD_VD7 - - UD[7] P8_4 UD[7] LCD_VD6 - - P8_5 UD[6] P8_5 UD[6] LCD_VD5 - - P8_6 UD[5] P8_6 UD[5] LCD_VD4 - - P8_7 UD[4] P8_7 UD[4] LCD_VD3 P4_2 UD[3] P4_2 UD[3] P4_2 UD[3] LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 124 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 28. LCD panel connections for STN dual panel mode External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel LPC18xx pin used LCD function LPC18xx pin used LCD function LPC18xx pin used LCD function LCD_VD2 P4_3 UD[2] P4_3 UD[2] P4_3 UD[2] LCD_VD1 P4_4 UD[1] P4_4 UD[1] P4_4 UD[1] LCD_VD0 P4_1 UD[0] P4_1 UD[0] P4_1 UD[0] LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP LCD_ENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM LCD_FP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE LCD_PWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN Table 29. External pin LCD panel connections for TFT panels TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit LPC18xx pin used LCD function LPC18xx pin used LCD function LPC18xx pin LCD used function LCD_VD23 PB_0 BLUE3 PB_0 BLUE4 PB_0 BLUE4 BLUE7 LCD_VD22 PB_1 BLUE2 PB_1 BLUE3 PB_1 BLUE3 BLUE6 LCD_VD21 PB_2 BLUE1 PB_2 BLUE2 PB_2 BLUE2 BLUE5 LCD_VD20 PB_3 BLUE0 PB_3 BLUE1 PB_3 BLUE1 BLUE4 LCD_VD19 - - P7_1 BLUE0 P7_1 BLUE0 BLUE3 LPC18xx pin used LCD function LCD_VD18 - - - - P7_2 intensity LCD_VD17 - - - - - - P7_3 BLUE1 LCD_VD16 - - - - - - P7_4 BLUE0 LCD_VD15 PB_4 GREEN3 PB_4 GREEN5 PB_4 GREEN4 PB_4 GREEN7 LCD_VD14 PB_5 GREEN2 PB_5 GREEN4 PB_5 GREEN3 PB_5 GREEN6 LCD_VD13 PB_6 GREEN1 PB_6 GREEN3 PB_6 GREEN2 PB_6 GREEN5 LCD_VD12 P8_3 GREEN0 P8_3 GREEN2 P8_3 GREEN1 P8_3 GREEN4 LCD_VD11 - P4_9 GREEN1 P4_9 GREEN0 P4_9 GREEN3 - BLUE2 LCD_VD10 - - P4_10 GREEN0 P4_10 intensity P4_10 GREEN2 LCD_VD9 - - - - - - P4_8 GREEN1 LCD_VD8 - - - - - - P7_5 GREEN0 LCD_VD7 P8_4 RED3 P8_4 RED4 P8_4 RED4 P8_4 RED7 LCD_VD6 P8_5 RED2 P8_5 RED3 P8_5 RED3 P8_5 RED6 LCD_VD5 P8_6 RED1 P8_6 RED2 P8_6 RED2 P8_6 RED5 LCD_VD4 P8_7 RED0 P8_7 RED1 P8_7 RED1 P8_7 RED4 LCD_VD3 - - P4_2 RED0 P4_2 RED0 P4_2 RED3 LCD_VD2 - - - - P4_3 intensity P4_3 RED2 LCD_VD1 - - - - - - P4_4 RED1 LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 125 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 29. External pin LCD panel connections for TFT panels TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit LPC18xx pin used LPC18xx pin used LPC18xx pin LCD used function LCD function LCD function LPC18xx pin used LCD function LCD_VD0 - - - - - - P4_1 RED0 LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP LCDENAB/ LCDM P4_6 LCDENAB/ P4_6 LCDM LCD_ENAB P4_6 /LCDM LCDENAB/ P4_6 LCDM LCD_FP P4_5 LCDENAB/ LCDM LCDFP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE LCD_PWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN 13.2 Crystal oscillator The crystal oscillator is controlled by the XTAL_OSC_CTRL register in the CGU (see LPC18xx user manual). The crystal oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the PLL. The oscillator can operate in one of two modes: slave mode and oscillation mode. • In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (CC in Figure 37), with an amplitude of at least 200 mV (RMS). The XTAL2 pin in this configuration can be left unconnected. • External components and models used in oscillation mode are shown in Figure 38, and in Table 30 and Table 31. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation (the fundamental frequency is represented by L, CL and RS). Capacitance CP in Figure 38 represents the parallel package capacitance and should not be larger than 7 pF. Parameters FC, CL, RS and CP are supplied by the crystal manufacturer. Table 30. Fundamental oscillation frequency Maximum crystal series resistance RS External load capacitors CX1, CX2 2 MHz < 200 33 pF, 33 pF < 200 39 pF, 39 pF < 200 56 pF, 56 pF < 200 18 pF, 18 pF < 200 39 pF, 39 pF < 200 56 pF, 56 pF < 200 18 pF, 18 pF < 200 39 pF, 39 pF 4 MHz 8 MHz LPC1850_30_20_10 Preliminary data sheet Recommended values for CX1/X2 in oscillation mode (crystal and external components parameters) low frequency mode All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 126 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 30. Recommended values for CX1/X2 in oscillation mode (crystal and external components parameters) low frequency mode Fundamental oscillation frequency Maximum crystal series resistance RS External load capacitors CX1, CX2 12 MHz < 160 18 pF, 18 pF < 160 39 pF, 39 pF 16 MHz < 120 18 pF, 18 pF < 80 33 pF, 33 pF < 100 18 pF, 18 pF < 80 33 pF, 33 pF 20 MHz Table 31. Recommended values for CX1/X2 in oscillation mode (crystal and external components parameters) high frequency mode Fundamental oscillation frequency Maximum crystal series resistance RS External load capacitors CX1, Cx2 15 MHz < 80 18 pF, 18 pF 20 MHz < 80 39 pF, 39 pF < 100 47 pF, 47 pF LPC1xxx XTAL1 Ci 100 pF Cg 002aae835 Fig 37. Slave mode operation of the on-chip oscillator LPC18xx L XTAL1 XTAL2 = CL CP XTAL RS CX1 CX2 002aag031 Fig 38. Oscillator modes with external crystal model used for CX1/CX2 evaluation LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 127 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines Connect the crystal on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. Also connect the external components to the ground plain. To keep the noise coupled in via the PCB as small as possible, make loops and parasitics as small as possible. Choose smaller values of Cx1 and Cx2 if parasitics increase in the PCB layout. 13.4 Standard I/O pin configuration Figure 39 shows the possible pin modes for standard I/O pins with analog input function: • • • • • Digital output driver: Open-drain mode enabled/disabled Digital input: Pull-up enabled/disabled Digital input: Pull-down enabled/disabled Digital input: Repeater mode enabled/disabled Analog input The default configuration for standard I/O pins is input with pull-up enabled. The weak MOS devices provide a drive capability equivalent to pull-up and pull-down resistors. VDD(IO) VDD(IO) open-drain enable pin configured as digital output driver strong pull-up output enable ESD data output PIN strong pull-down ESD VSS VDD(IO) weak pull-up pull-up enable pin configured as digital input weak pull-down repeater mode enable pull-down enable data input select analog input pin configured as analog input analog input 002aag701 Fig 39. Standard I/O pin configuration with analog input LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 128 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 13.5 Reset pin configuration VDD(IO) VDD(IO) VDD(IO) Rpu reset ESD 20 ns RC GLITCH FILTER PIN ESD VSS 002aag702 Fig 40. Reset pin configuration LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 129 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 14. Package outline LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm A B D SOT740-2 ball A1 index area A2 A E A1 detail X C e1 e y y1 C ∅v M C A B b 1/2 e ∅w M C T R e P N M L K J e2 H G 1/2 e F E D C B A ball A1 index area 1 3 2 5 4 7 6 9 8 11 10 13 12 15 14 16 X 5 0 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 A2 b D E e e1 e2 v w y y1 mm 1.55 0.45 0.35 1.1 0.9 0.55 0.45 17.2 16.8 17.2 16.8 1 15 15 0.25 0.1 0.12 0.35 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT740-2 --- MO-192 --- EUROPEAN PROJECTION ISSUE DATE 05-06-16 05-08-04 Fig 41. Package outline of the LBGA256 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 130 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller TFBGA180: thin fine-pitch ball grid array package; 180 balls SOT570-3 A B D ball A1 index area E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b M M C C A B C y y1 C P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 12 13 X 14 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm max nom min A A1 A2 b D E e e1 e2 v w y y1 1.20 1.06 0.95 0.40 0.35 0.30 0.80 0.71 0.65 0.50 0.45 0.40 12.1 12.0 11.9 12.1 12.0 11.9 0.8 10.4 10.4 0.15 0.05 0.12 0.1 OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 08-07-09 10-04-15 SOT570-3 Fig 42. Package outline of the TFBGA180 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 131 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 c y X A 105 156 157 104 ZE e E HE (A 3) A A2 A1 wM θ Lp bp L detail X pin 1 index 208 53 1 52 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 28.1 27.9 28.1 27.9 0.5 HD HE 30.15 30.15 29.85 29.85 L Lp v w y ZD ZE θ 1 0.75 0.45 0.12 0.08 0.08 1.43 1.08 1.43 1.08 7o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT459-1 136E30 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-02-06 03-02-20 Fig 43. Package outline of the LQFP208 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 132 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm B D SOT926-1 A ball A1 index area A2 E A A1 detail X e1 e ∅v ∅w b 1/2 e C M M C A B C y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 A2 b D E e e1 e2 v w y y1 mm 1.2 0.4 0.3 0.8 0.65 0.5 0.4 9.1 8.9 9.1 8.9 0.8 7.2 7.2 0.15 0.05 0.08 0.1 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT926-1 --- --- --- EUROPEAN PROJECTION ISSUE DATE 05-12-09 05-12-22 Fig 44. Package outline of the TFBGA100 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 133 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 (A 3) A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 20.1 19.9 0.5 HD HE 22.15 22.15 21.85 21.85 L Lp v w y 1 0.75 0.45 0.2 0.08 0.08 Z D(1) Z E(1) 1.4 1.1 1.4 1.1 θ 7o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT486-1 136E23 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-03-14 03-02-20 Fig 45. Package outline for the LQFP144 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 134 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X A 51 75 50 76 ZE e E HE A A2 (A 3) A1 w M θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 14.1 13.9 0.5 HD HE 16.25 16.25 15.75 15.75 L Lp v w y 1 0.75 0.45 0.2 0.08 0.08 Z D (1) Z E (1) 1.15 0.85 1.15 0.85 θ 7o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT407-1 136E20 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-02-01 03-02-20 Fig 46. Package outline for the LQFP100 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 135 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 15. Soldering Footprint information for reflow soldering of LBGA256 package SOT740-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 1.00 0.450 0.450 0.600 Hx Hy 17.500 17.500 sot740-2_fr Fig 47. Reflow soldering of the LBGA256 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 136 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Footprint information for reflow soldering of TFBGA180 package SOT570-3 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 0.80 0.400 0.400 0.550 Hx Hy 12.575 12.575 sot570-3_fr Fig 48. Reflow soldering of the TFBGA180 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 137 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Footprint information for reflow soldering of LQFP208 package SOT459-1 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 Ax Ay Bx By 0.560 31.300 31.300 28.300 28.300 C D1 D2 1.500 0.280 0.400 Gx Gy Hx Hy 28.500 28.500 31.550 31.550 sot459-1_fr Fig 49. Reflow soldering of the LQFP208 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 138 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Footprint information for reflow soldering of LQFP144 package SOT486-1 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 Ax Ay Bx By 0.560 23.300 23.300 20.300 20.300 C D1 D2 1.500 0.280 0.400 Gx Gy Hx Hy 20.500 20.500 23.550 23.550 sot486-1_fr Fig 50. Reflow soldering of the LQFP144 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 139 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Footprint information for reflow soldering of TFBGA100 package SOT926-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR Hx Hy 0.80 0.330 0.400 0.480 9.400 9.400 sot926-1_fr Fig 51. Reflow soldering of the TFBGA100 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 140 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Footprint information for reflow soldering of LQFP100 package SOT407-1 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 Ax Ay Bx By 0.560 17.300 17.300 14.300 14.300 C D1 D2 1.500 0.280 0.400 Gx Gy Hx Hy 14.500 14.500 17.550 17.550 sot407-1 Fig 52. Reflow soldering of the LQFP100 package LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 141 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 16. Appendix 16.1 Static characteristics for LPC1850/30/20/10 Rev’-’ parts Table 32. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Applies to LPC1850/30/20/10 Rev ‘-’ only. Symbol Parameter Conditions Min Typ[1] Max Unit Supply pins VDD(IO) input/output supply voltage 2.2 - 3.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.2 - 3.6 V VDDA(3V3) analog supply voltage (3.3 V) 2.0 - 3.6 V VBAT battery supply voltage 2.2 - 3.6 V VDD(3V3) supply voltage (3.3 V) 2.2 - 3.6 V IDD(REG)(3V3) regulator supply current active mode; code (3.3 V) while(1){} [2] on pin VDD; LQFP100 package only executed from <tbd>; all peripherals disabled CCLK = 12 MHz; PLL disabled [3] - 10 - mA CCLK = 100 MHz; PLL enabled [3] - 40 - mA CCLK = 150 MHz; PLL enabled [3] - 55 - mA [3] - <tbd> - mA deep sleep mode [3][4] - 60 - A power-down mode [3][4] - 30 - A [3] - 4 - A VDD(REG)(3V3) present [5] - <tbd> - nA VDD(REG)(3V3) not present [6] <tbd> - nA sleep mode deep power-down mode; RTC <tbd> IBAT IDD(IO) IDD(ADC) battery supply current I/O supply current ADC supply current LPC1850_30_20_10 Preliminary data sheet deep power-down mode; RTC running deep sleep mode [7] - <tbd> - nA power-down mode [7] - <tbd> - nA deep power-down mode [7] - <tbd> - nA deep sleep mode [9] - <tbd> - nA power-down mode [9] - <tbd> - nA deep power-down mode [9] - <tbd> - nA All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 142 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 32. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Applies to LPC1850/30/20/10 Rev ‘-’ only. Symbol Parameter Conditions Min Typ[1] Max Unit V Digital pins - RESET pin VIH HIGH-level input voltage [8] 0.8 (Vps 0.35) 5.5 VIL LOW-level input voltage [8] 0.5 0.3 (Vps V 0.1) Vhys hysteresis voltage [8] 0.05 (Vps 0.35) - V - Digital pins IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - - <tbd> A IIH HIGH-level input current VI = VDD(IO); on-chip pull-down resistor disabled - - <tbd> A IOZ OFF-state output current VO = 0 V; VO = VDD(IO); on-chip pull-up/down resistors disabled - - <tbd> A VI input voltage pin configured to provide a digital function 0.5 - <tbd> V output active [10] VO output voltage <tbd> - VDD(IO) V VIH HIGH-level input voltage 2.0 - 5.5 V VIL LOW-level input voltage 0.5 - 0.8 V Vhys hysteresis voltage 0.1VDD(IO) - - V VOH HIGH-level output voltage IOH = 6 mA VDD(IO) 0.4 - - V VOL LOW-level output voltage IOL = 6 mA - - 0.4 V IOH HIGH-level output current VOH = VDD(IO) 0.4 V 6 - - mA IOL LOW-level output current VOL = 0.4 V 6 - - mA IOHS HIGH-level short-circuit drive HIGH; connected to output current ground [11] - - 35 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [11] - - 30 mA Ipd pull-down current VI = VDD(IO) <tbd> <tbd> <tbd> A Ipu pull-up current VI = 0 V <tbd> <tbd> <tbd> A VDD(IO) < VI < 3.6 V <tbd> <tbd> <tbd> A Rpu(weak) weak pull-up resistance VI = 0 V 45 50 65 k Rpd(weak) weak pull-down resistance 45 50 65 k VI = VDD(IO) Open-drain I2C0-bus pins VIH HIGH-level input voltage <tbd> - - V VIL LOW-level input voltage - - <tbd> V LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 143 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 32. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Applies to LPC1850/30/20/10 Rev ‘-’ only. Symbol Parameter Conditions Vhys hysteresis voltage VOL LOW-level output voltage IOLS = <tbd> mA ILI input leakage current VI = VDD(IO) VI = 5 V [12] Min Typ[1] Max Unit - <tbd> - V - - <tbd> V - <tbd> <tbd> A - <tbd> <tbd> A Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 - 1.2 V Vo(XTAL2) output voltage on pin XTAL2 0.5 - 1.2 V high-speed mode <tbd> <tbd> <tbd> mV full-speed/low-speed mode <tbd> - <tbd> mV chirp mode <tbd> - <tbd> mV <tbd> <tbd> <tbd> mV USB pins VIC common-mode input voltage Vi(dif) [1] differential input voltage Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] The RTC typically fails when VBAT drops below 2.2 V and VDD(REG)(3V3) is less than 2.2 V. [3] VDD(REG)(3V3) = 3.3 V; Tamb = 25 C for all power consumption measurements. Applies to parts LPC1850/30/20/10 Rev ‘-’ only. [4] Conditions <tbd>. [5] On pin VBAT; IDD(REG)(3V3) = <tbd> nA; VDD(REG)(3V3) = 3.3 V; VBAT < VDD(REG)(3V3); Tamb = 25 C. [6] On pin VBAT; VBAT = 3.3 V; Tamb = 25 C. [7] All internal pull-ups disabled. All pins configured as output and driven LOW. VDD(3V3) = 3.3 V; Tamb = 25 C. [8] Vps corresponds to the output of the power switch (see Figure 11) which is determined by the greater of VBAT and VDD(Reg)(3V3). [9] VDDA(3V3) = 3.3 V; Tamb = 25 C. [10] VDD(IO) supply voltage must be present. [11] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [12] To VSS. 16.2 Power consumption Remark: All power consumption data in this section apply to Rev ‘-’ of the LPC1850/30/20/10 parts only. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 144 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 002aag121 60 144 MHz IDD(REG)(3V3) (mA) 132 MHz 40 108 MHz 84 MHz 60 MHz 20 36 MHz 12 MHz 0 2.0 2.4 2.8 3.2 VDD(REG)(3V3) (V) 3.6 Conditions: Tamb = 25 C; normal mode entered executing code while(1){} from ROM; internal pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all peripherals disabled; all peripheral clocks disabled. Fig 53. Typical supply current versus regulator supply voltage VDD(REG)(3V3) in active mode 002aag122 60 144 MHz IDD(REG)(3V3) 132 MHz (mA) 40 108 MHz 84 MHz 60 MHz 20 36 MHz 12 MHz 0 -40 -15 10 35 60 85 temperature (°C) Conditions: VDD(REG)(3V3) = 3.0 V, normal mode entered executing code while(1){} from ROM; internal pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all peripherals disabled; all peripheral clocks disabled. Fig 54. Typical supply current versus temperature in active mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 145 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 001aac984 X X (X) X X <tbd> X X X X X X X X X (X) Conditions: VDD(REG)(3V3) = 3.0 V; internal pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all peripherals disabled; all peripheral clocks disabled. Fig 55. Typical supply current versus temperature in sleep mode 002aag123 400 VDD(REG)(3V3) = 3.6 V IDD(REG)(3V3) (μA) 3.4 V 3.0 V 2.6 V 2.2 V 300 200 100 0 -40 -15 10 35 60 85 temperature (°C) Conditions: VBAT = 0 V; VDD(IO) = 0 V; PD0_SLEEP0_MODE = 0x003F 00AA. Fig 56. Typical supply current versus temperature in Deep-sleep mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 146 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 002aag124 60 IDD(REG)(3V3) (μA) VDD(REG)(3V3) = 3.6 V 3.0 V 2.6 V 2.2 V 40 20 0 -40 -15 10 35 60 85 temperature (°C) Conditions: VBAT = 0 V; VDD(IO) = 0 V; PD0_SLEEP0_MODE = 0x003F FCBA. Fig 57. Typical supply current versus temperature in Power-down mode 002aag125 10.0 IDD(REG)(3V3) (μA) 8.0 VDD(REG)(3V3) = 3.6 V 2.2 V 6.0 4.0 2.0 0 -40 -15 10 35 60 85 temperature (°C) Conditions: VBAT = 0 V; VDD(IO) = 0 V; PD0_SLEEP0_MODE = 0x003F FF7F. Fig 58. Typical supply current versus temperature in Deep power-down mode LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 147 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 33. Power consumption for individual peripherals Tamb = 25 C; VDD(REG)(3V3) = 3.3 V. Peripheral Conditions Typical IDD(REG)(3V3)[1] IRC <tbd> <tbd> ADC <tbd> <tbd> DAC <tbd> <tbd> I2C0 <tbd> <tbd> I2C1 <tbd> <tbd> I2S <tbd> <tbd> SSP0 <tbd> <tbd> SSP1 <tbd> <tbd> USART0 <tbd> <tbd> UART1 <tbd> <tbd> USART2 <tbd> <tbd> USART3 <tbd> <tbd> USB0 <tbd> <tbd> USB1 <tbd> <tbd> Ethernet <tbd> <tbd> [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. 17. Abbreviations Table 34. Acronym LPC1850_30_20_10 Preliminary data sheet Abbreviations Description ADC Analog-to-Digital Converter AES Advanced Encryption Standard AHB Advanced High-performance Bus APB Advanced Peripheral Bus API Application Programming Interface BOD BrownOut Detection BGA Ball Grid Array CAN Controller Area Network CMAC Cipher-based Message Authentication Code CSMA/CD Carrier Sense Multiple Access with Collision Detection DAC Digital-to-Analog Converter DMA Direct Memory Access EOP End Of Packet ETB Embedded Trace Buffer ETM Embedded Trace Macrocell GPIO General Purpose Input/Output IRC Internal RC IrDA Infrared Data Association All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 148 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller LPC1850_30_20_10 Preliminary data sheet Table 34. Abbreviations …continued Acronym Description JTAG Joint Test Action Group LCD Liquid Crystal Display LSB Least Significant Bit LQFP Low Quad Flat Package MAC Media Access Control MCU MicroController Unit MIIM Media Independent Interface Management n.c. not connected OTG On-The-Go PHY PHYsical layer PLL Phase-Locked Loop PWM Pulse Width Modulator RMII Reduced Media Independent Interface SDRAM Synchronous Dynamic Random Access Memory SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port TCP/IP Transmission Control Protocol/Internet Protocol TTL Transistor-Transistor Logic UART Universal Asynchronous Receiver/Transmitter ULPI UTMI+ Low Pin Interface USART Universal Synchronous Asynchronous Receiver/Transmitter USB Universal Serial Bus UTMI USB 2.0 Transceiver Macrocell Interface All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 149 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 18. Revision history Table 35. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC1850_30_20_10 v.3 20111206 - Modifications: Preliminary data sheet LPC1850_30_20_10 v.2.2 • • • • • • • • • • • • • • • • • • • • • • • • • VDDA(3V3) minimum value changed to 2.2 V. • Pin function USB1_VBUS_EN changed to USB1_PPWR and description updated in Table 3. • Updates related to the Rev ‘A’ version of parts LPC1850/30/20/10: VDD(IO) and VDD(REG)(3V3) ranges added to static and dynamic characteristics tables. Figure 29 and Figure 30 updated. UART and USART maximum bit rates specified in Section 11.7. Defined 5 V tolerant pins for VDD(IO) present only in Table 3. Added pin characteristics for USB1 pins in Table 8. Added explanation of parameter Rvsi (Figure 36). SPIFI driver removed from ROM (Table 4 and Table 5). Multiple <tbd> replaced in Section 8, Section 9, Section 10, Section 11. Parameter Cia = 2 pF updated in Table 25. ESD parameter added in Table 6. AES removed from memory maps. SD/MMC timing parameters added in Table 23. LCD timing parameters added in Table 24. EMC SDRAM timing parameters updated in Table 19. SSP timing parameters added in Table 16. USART timing parameters added in Table 15. DAC characterization data added in Table 26. DBGEN pin reset state: PD removed (Table 3). TDO pin reset state: PU removed (Table 3). USB0_ID pin: pin description updated (Table 3). USB0_VBUS pin: pin description updated (Table 3). Static characteristics for LPC1850/30/20/10 Rev ‘-’ moved to Section 16. Dynamic characteristics added for the crystal oscillator (Section 11.3). Pin function USB0_PWR_EN changed to USB0_PPWR and description updated in Table 3. – LQFP208 pin configuration added. – SRAM connections in Figure 8 updated and SPIFI added. – EMC static and dynamic SRAM characterization data added. – Number of GPIOs corrected in the LQFP208 package (Table 2). – Table 8 updated for parts LPC1850/30/20/10 Rev ‘A’. – ADC characteristics added (Table 25. – DAC characteristics added (Table 26). – Reset state updated for pin PF_0 and PF_4 in Table 3. – Power consumption data added in Table 8. – Pin electrical characteristics added in Table 8, Figure 20 and Figure 21. LPC1850_30_20_10 v.2.2 Modifications: LPC1850_30_20_10 Preliminary data sheet 20110909 • Preliminary data sheet - LPC1850_30_20_10 v.2.1 Pin P7_2, column LQFP144: replaced 113 by 115 in Table 3. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 150 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 35. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC1850_30_20_10 v.2.1 20110822 - Modifications: • • • • • Preliminary data sheet LPC1850_30_20_10 v.2 LQFP100 pin package added in Table 3. Number of ADC channels, QEI, and Motor control PWM added in Table 2. Pin P2_7 designated as ISP entry pin. Description of ISP mode added (see Section 7.8.1). Updates related to the Rev ‘A’ version of parts LPC1850/30/20/10: – VI updated for I/O pins in Table 6. – Boot pins corrected in Table 3 and Table 5: Pin P2_7 replaced by pin P2_9 as boot pin. Pin level corrected for 4th boot pin (P2_9) in Table 5. – USART3 boot mode added in Table 5. – Memory map updated: SPIFI data added at address 0x1400 000 in Figure 9. – Boot ROM size increased to 64 kB in Section 2 and Figure 9. • LPC1850_30_20_10 Preliminary data sheet Updated pin P2_2, CTOUT_6 changed to CTIN_6 in Table 3. All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 151 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 35. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC1850_30_20_10 v.2 20110713 - Modifications: Objective data sheet LPC1850_30_20_10 v.1.2 • • Power consumption data added (Figure 12 to Figure 17). • • • • • • • • • • • • • • Pin PC_8 in Table 3: ENET_RX_DV applies to RMII/MII interfaces. Pin PC_0 in Table 3: function ENET_RX_CLK changed to n.c. and function SDIO_CLK changed to function ENET_RX_CLK. Rename pins CAN1_RD and CAN1_TD to CAN0_RD and CAN0_TD in Table 3. Rename all I2S pins to I2S0 pins. Condition for RTC operation updated in Table 8, Table note 2. Figure 11 “LPC1850/30/20/10 Power domains” added. “n.c.” changed to “Reserved” in Table 3. Section 11.6: characterization parameters and timing diagrams updated. Prefix for all SD/MMC pins changed to “SD” in Table 3. Prefix for all EMC pins changed to “EMC” in Table 3. Section 11.4 added. Section 11.8 added. Section 11.9 added. LQFP144 pinout added in Table 3. Updates related to the Rev ‘A’ version of parts LPC1850/30/20/10: – Pin P6_0 in Table 3: function I2S_RX_SCK moved to function level 5. – Pin PF_0 in Table 3: function GP_CLKIN added. – Pin PA_1 in Table 3: function U2_TXD added. – Pin PA_2 in Table 3: function U2_RXD added. – Pin PC_0 in Table 3: reset state changed to I; PU. – Pin P1_16 in Table 3: ENET_CRS_DV moved to function level 7. – Pad descriptions updated in Table 3, Table note 3 to Table note 11. – Added function levels four to seven/eight for each pin in Table 3. – Second C_CAN interface (C_CAN1) added. – Second I2S interface (I2S1) added. – Audio PLL added (Section 2 and Section 7.18.6). – All SDIO functions moved to the function levels four to seven in Table 3. – High-speed GPIO block moved to address 0x400F 4000 in Figure 9 and Figure 10. – GPIO interrupts and GPIO group0 and group1 interrupt added in Figure 1, Figure 9, Figure 10, Section 2, and Section 7.12. – Number of GPIO ports increased to eight. – Total number of GPIO pins increased to 164. – GIMA block added (Section 7.6). – Band gap output added to pin PF_7. – Package outline and soldering information added for all packages. LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 152 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Table 35. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC1850_30_20_10 v.1.2 20110217 - Modifications: LPC1850_30_20_10 v.1 LPC1850_30_20_10 Preliminary data sheet Objective data sheet LPC1850_30_20_10 v.1 • RMII removed from description of pin functions ENET_RXD2, ENET_RXD3, ENET_ER. ENET_REF_CLK removed from pin function ENET_RX_CLK (Table 3). • Support for IEEE 1588 time stamping/advanced time stamping (IEEE 1588-2008 v2) added (Section 2 and Section 7.12.9). • • • • • • • All pins with default state n.c. are inputs with pull-ups enabled on reset (Table 3). SPIFI functions removed from pins PA_0, PA_3, PC_4, PC_5, PC_8, PE_2 in Table 3. Reset states added for multiple pins in Table 3. Editorial updates. Section 13.2 “Crystal oscillator” added. Pin P2_7 designated as boot pin 3 in Table 3. USB0 and USB1 added to boot sources in Table 4 and Table 5. 20110103 Objective data sheet - All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 - © NXP B.V. 2011. All rights reserved. 153 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. 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Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 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All rights reserved. 154 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 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Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 155 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 6 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 Functional description . . . . . . . . . . . . . . . . . . 67 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 67 7.2 ARM Cortex-M3 processor . . . . . . . . . . . . . . . 67 7.3 AHB multilayer matrix . . . . . . . . . . . . . . . . . . . 68 7.4 Nested Vectored Interrupt Controller (NVIC) . 68 7.4.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 7.4.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 69 7.5 Event router . . . . . . . . . . . . . . . . . . . . . . . . . . 69 7.6 Global Input Multiplexer Array (GIMA) . . . . . . 69 7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 7.7 System Tick timer (SysTick) . . . . . . . . . . . . . . 69 7.8 On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 69 7.8.1 ISP (In-System Programming) mode . . . . . . . 70 7.9 Boot ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 7.10 Memory mapping . . . . . . . . . . . . . . . . . . . . . . 72 7.11 Security features. . . . . . . . . . . . . . . . . . . . . . . 74 7.11.1 AES security engine . . . . . . . . . . . . . . . . . . . . 74 7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.11.2 One-Time Programmable (OTP) memory . . . 74 7.12 General Purpose I/O (GPIO) . . . . . . . . . . . . . 74 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.13 AHB peripherals . . . . . . . . . . . . . . . . . . . . . . . 75 7.13.1 State Configurable Timer (SCT) subsystem . . 75 7.13.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 7.13.2 General Purpose DMA (GPDMA) . . . . . . . . . . 75 7.13.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 7.13.3 SPI Flash Interface (SPIFI). . . . . . . . . . . . . . . 76 7.13.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 7.13.4 SD/MMC card interface . . . . . . . . . . . . . . . . . 77 7.13.5 External Memory Controller (EMC). . . . . . . . . 77 7.13.5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 7.13.6 High-speed USB Host/Device/OTG interface (USB0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.13.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.13.7 High-speed USB Host/Device interface with ULPI (USB1) . . . . . . . . . . . . . . . . . . . . . . 78 7.13.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.13.8 LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 78 7.13.8.1 7.13.9 7.13.9.1 7.14 7.14.1 7.14.1.1 7.14.2 7.14.2.1 7.14.3 7.14.3.1 7.14.4 7.14.4.1 7.14.5 7.14.5.1 7.14.6 7.14.6.1 7.15 7.15.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital serial peripherals. . . . . . . . . . . . . . . . . UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSP serial I/O controller. . . . . . . . . . . . . . . . . Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2S interface . . . . . . . . . . . . . . . . . . . . . . . . . . Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . C_CAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Counter/timers and motor control . . . . . . . . . General purpose 32-bit timers/external event counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.15.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.15.2 Motor control PWM . . . . . . . . . . . . . . . . . . . . 7.15.3 Quadrature Encoder Interface (QEI) . . . . . . . 7.15.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.15.4 Repetitive Interrupt (RI) timer. . . . . . . . . . . . . 7.15.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.15.5 Windowed WatchDog Timer (WWDT) . . . . . . 7.15.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.16 Analog peripherals . . . . . . . . . . . . . . . . . . . . . 7.16.1 Analog-to-Digital Converter . . . . . . . . . . . . . . 7.16.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.16.2 Digital-to-Analog Converter (DAC). . . . . . . . . 7.16.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.17 Peripherals in the RTC power domain . . . . . . 7.17.1 RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.17.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.17.2 Alarm timer. . . . . . . . . . . . . . . . . . . . . . . . . . . 7.18 System control . . . . . . . . . . . . . . . . . . . . . . . . 7.18.1 Configuration registers (CREG) . . . . . . . . . . . 7.18.2 System Control Unit (SCU) . . . . . . . . . . . . . . 7.18.3 Clock Generation Unit (CGU) . . . . . . . . . . . . 7.18.4 Internal RC oscillator (IRC) . . . . . . . . . . . . . . 7.18.5 PLL0USB (for USB0) . . . . . . . . . . . . . . . . . . . 7.18.6 PLL0AUDIO (for audio) . . . . . . . . . . . . . . . . . 7.18.7 System PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . 7.18.8 Reset Generation Unit (RGU) . . . . . . . . . . . . 7.18.9 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 7.19 Emulation and debugging . . . . . . . . . . . . . . . 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 79 79 79 80 80 80 80 81 81 81 81 82 82 82 83 83 83 83 83 84 84 84 84 84 85 85 85 85 85 86 86 86 86 86 86 86 86 87 87 87 87 87 88 88 88 89 90 continued >> LPC1850_30_20_10 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 156 of 157 LPC1850/30/20/10 NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller 9 10 10.1 10.2 11 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 11.11 11.12 11.13 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 16.1 16.2 17 18 19 19.1 19.2 19.3 19.4 20 21 Thermal characteristics . . . . . . . . . . . . . . . . . 91 Static characteristics. . . . . . . . . . . . . . . . . . . . 92 Power consumption . . . . . . . . . . . . . . . . . . . . 97 Electrical pin characteristics . . . . . . . . . . . . . 101 Dynamic characteristics . . . . . . . . . . . . . . . . 103 Wake-up times . . . . . . . . . . . . . . . . . . . . . . . 103 External clock . . . . . . . . . . . . . . . . . . . . . . . . 103 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 104 IRC and RTC oscillators . . . . . . . . . . . . . . . . 105 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 I2S-bus interface . . . . . . . . . . . . . . . . . . . . . . 107 USART interface. . . . . . . . . . . . . . . . . . . . . . 108 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . 109 External memory interface . . . . . . . . . . . . . . 112 USB interface . . . . . . . . . . . . . . . . . . . . . . . 117 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 SD/MMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 ADC/DAC electrical characteristics . . . . . . . 121 Application information. . . . . . . . . . . . . . . . . 124 LCD panel signal usage . . . . . . . . . . . . . . . . 124 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 126 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . 128 Standard I/O pin configuration . . . . . . . . . . . 128 Reset pin configuration . . . . . . . . . . . . . . . . . 129 Package outline . . . . . . . . . . . . . . . . . . . . . . . 130 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 Static characteristics for LPC1850/30/20/10 Rev’-’ parts. . . . . . . . . . . 142 Power consumption . . . . . . . . . . . . . . . . . . . 144 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 148 Revision history . . . . . . . . . . . . . . . . . . . . . . . 150 Legal information. . . . . . . . . . . . . . . . . . . . . . 154 Data sheet status . . . . . . . . . . . . . . . . . . . . . 154 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . 155 Contact information. . . . . . . . . . . . . . . . . . . . 155 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 6 December 2011 Document identifier: LPC1850_30_20_10