PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) LM5100AM/NOPB ACTIVE Package Type Package Pins Package Drawing Qty SOIC Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM Op Temp (°C) Device Marking (4/5) -40 to 125 L5100 AM LM5100AMR/NOPB ACTIVE SO PowerPAD DDA 8 95 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR L5100 AMR LM5100AMRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR L5100 AMR Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5100 AM LM5100AMX/NOPB ACTIVE SOIC D 8 2500 LM5100ASD NRND WSON DPR 10 1000 TBD Call TI Call TI -40 to 125 5100ASD LM5100ASD/NOPB ACTIVE WSON DPR 10 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 5100ASD LM5100BMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5100 BMA LM5100BMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5100 BMA LM5100BSD/NOPB ACTIVE WSON DPR 10 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 5100BSD LM5100CMA/NOPB LIFEBUY SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5100 CMA LM5100CMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5100 CMA LM5100CMY/NOPB LIFEBUY MSOPPowerPAD DGN 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SXCB LM5100CMYE/NOPB LIFEBUY MSOPPowerPAD DGN 8 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SXCB LM5100CMYX/NOPB LIFEBUY MSOPPowerPAD DGN 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SXCB LM5100CSD/NOPB LIFEBUY WSON DPR 10 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 5100CSD LM5101AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5101 AM DDA 8 95 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR LM5101AMR/NOPB ACTIVE SO PowerPAD Addendum-Page 1 L5101 AMR Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 Orderable Device Status (1) LM5101AMRX/NOPB (1) Package Type Package Pins Package Drawing Qty ACTIVE SO PowerPAD Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) DDA 8 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR Op Temp (°C) Device Marking (4/5) L5101 AMR LM5101AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5101 AM LM5101ASD NRND WSON DPR 10 1000 TBD Call TI Call TI -40 to 125 5101ASD LM5101ASD-1/NOPB ACTIVE WSON NGT 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM LM5101ASD/NOPB ACTIVE WSON DPR 10 1000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 5101ASD -40 to 125 5101ASD 5101A-1 LM5101ASDX NRND WSON DPR 10 4500 TBD Call TI Call TI LM5101ASDX-1/NOPB ACTIVE WSON NGT 8 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LM5101ASDX/NOPB ACTIVE WSON DPR 10 4500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 5101ASD LM5101BMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5101 BMA LM5101BMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5101 BMA LM5101BSD/NOPB ACTIVE WSON DPR 10 1000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (5101ASD ~ 5101BSD) LM5101BSDX/NOPB ACTIVE WSON DPR 10 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 5101BSD LM5101CMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5101 CMA LM5101CMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5101 CMA LM5101CMY/NOPB ACTIVE MSOPPowerPAD DGN 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SXDB LM5101CMYE/NOPB ACTIVE MSOPPowerPAD DGN 8 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SXDB LM5101CMYX/NOPB ACTIVE MSOPPowerPAD DGN 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SXDB LM5101CSD/NOPB ACTIVE WSON DPR 10 1000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM The marketing status values are defined as follows: Addendum-Page 2 5101A-1 -40 to 125 5101CSD Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3