snosaw2q_pm

PACKAGE MATERIALS INFORMATION
www.ti.com
14-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM5100AMRX/NOPB
Package Package Pins
Type Drawing
SO
Power
PAD
DDA
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5100AMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5100ASD
WSON
DPR
10
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM5100ASD/NOPB
WSON
DPR
10
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM5100BMAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5100BSD/NOPB
WSON
DPR
10
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM5100CMAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5100CMY/NOPB
MSOPPower
PAD
DGN
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5100CMYE/NOPB
MSOPPower
PAD
DGN
8
250
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5100CMYX/NOPB
MSOPPower
PAD
DGN
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5100CSD/NOPB
WSON
DPR
10
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM5101AMRX/NOPB
SO
Power
DDA
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
PAD
LM5101AMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5101ASD
WSON
DPR
10
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM5101ASD-1/NOPB
WSON
NGT
8
1000
180.0
12.4
4.3
4.3
1.1
8.0
12.0
Q1
LM5101ASD/NOPB
WSON
DPR
10
1000
180.0
12.4
4.3
4.3
1.1
8.0
12.0
Q1
LM5101ASDX
WSON
DPR
10
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM5101ASDX-1/NOPB
WSON
NGT
8
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM5101ASDX/NOPB
WSON
DPR
10
4500
330.0
12.4
4.3
4.3
1.1
8.0
12.0
Q1
LM5101BMAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5101BSD/NOPB
WSON
DPR
10
1000
180.0
12.4
4.3
4.3
1.1
8.0
12.0
Q1
LM5101BSDX/NOPB
WSON
DPR
10
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM5101CMAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5101CMY/NOPB
MSOPPower
PAD
DGN
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5101CMYE/NOPB
MSOPPower
PAD
DGN
8
250
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5101CMYX/NOPB
MSOPPower
PAD
DGN
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5101CSD/NOPB
WSON
DPR
10
1000
180.0
12.4
4.3
4.3
1.1
8.0
12.0
Q1
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Sep-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM5100AMRX/NOPB
SO PowerPAD
DDA
8
2500
367.0
367.0
35.0
LM5100AMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM5100ASD
WSON
DPR
10
1000
210.0
185.0
35.0
LM5100ASD/NOPB
WSON
DPR
10
1000
210.0
185.0
35.0
LM5100BMAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM5100BSD/NOPB
WSON
DPR
10
1000
210.0
185.0
35.0
LM5100CMAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM5100CMY/NOPB
MSOP-PowerPAD
DGN
8
1000
210.0
185.0
35.0
LM5100CMYE/NOPB
MSOP-PowerPAD
DGN
8
250
210.0
185.0
35.0
LM5100CMYX/NOPB
MSOP-PowerPAD
DGN
8
3500
367.0
367.0
35.0
LM5100CSD/NOPB
WSON
DPR
10
1000
210.0
185.0
35.0
LM5101AMRX/NOPB
SO PowerPAD
DDA
8
2500
367.0
367.0
35.0
LM5101AMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM5101ASD
WSON
DPR
10
1000
210.0
185.0
35.0
LM5101ASD-1/NOPB
WSON
NGT
8
1000
203.0
203.0
35.0
LM5101ASD/NOPB
WSON
DPR
10
1000
203.0
203.0
35.0
LM5101ASDX
WSON
DPR
10
4500
367.0
367.0
35.0
LM5101ASDX-1/NOPB
WSON
NGT
8
4500
367.0
367.0
35.0
LM5101ASDX/NOPB
WSON
DPR
10
4500
346.0
346.0
35.0
LM5101BMAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM5101BSD/NOPB
WSON
DPR
10
1000
203.0
203.0
35.0
LM5101BSDX/NOPB
WSON
DPR
10
4500
367.0
367.0
35.0
LM5101CMAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM5101CMY/NOPB
MSOP-PowerPAD
DGN
8
1000
210.0
185.0
35.0
LM5101CMYE/NOPB
MSOP-PowerPAD
DGN
8
250
210.0
185.0
35.0
LM5101CMYX/NOPB
MSOP-PowerPAD
DGN
8
3500
367.0
367.0
35.0
LM5101CSD/NOPB
WSON
DPR
10
1000
203.0
203.0
35.0
Pack Materials-Page 4