Leiterplatten-Layout Vorschlag für SMT PCB-Layout Proposal for SMT 1,2 1,6 -0,03 0,8 2 ±0,05 a25 Verpackt im Gurt nach DIN IEC 60286-3 0,3 Tape on Reel Packaging according to DIN IEC 60286-3 Verpackungseinheit: 560 Stück a1 Packaging unit: 560 pcs Anforderungsstufe 1 7,6 2,2 Performance Level 1 Kontaktbereich vergoldet 1,27 Mating Area gold plating 1,27 Anschlussbereich verzinnt 4-6 µm Terminal Area 4-6 µm tin plating 2,21 ±0,03 24 x 1,27 = 30,48 Koplanarität der Anschlüsse ≤ 0,1 mm Coplanarity Area of Termination ≤ 0,1 mm 34,9 ±0,03 330 1,5 -0,03 7,2 b1 7,2 9,6 5,2 Abspulrichtung - Reel off Direction b25 b1 3,85 56 0,75 -0,05 34,9 ±0,03 1,55 3,05 1,27 32,5 16 1,27 24 x 1,27 = 30,48 33,5 BA7-03 - Standard Bauhöhe 36,83 1 Copyright by ERNI GmbH Proprietary notice pursuant to ISO 16016 to be observed. 2 3,27 1,5 type7-03 - Standard Assembly Height Tolerances Information: Scale 3:1 All Dimensions in mm All rights reserved. Only for Information. To ensure that this is the latest version of this drawing, please contact one of the ERNI companies before using. Designation Subject to modification without prior notice. Drawing will not be updated. Federl. SMC-Q 50-SMD-BA7-03 Female SMC-Q 50-SMD-type7-03 154742 www.ERNI.com g 22.04.2014 Index Date Class SMCQ I A3