TRF370x User's Guide

TRF370x Quadrature Modulator Evaluation
Module
User's Guide
Literature Number: SLWU062
March 2010
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1
2
3
4
5
............................................................................................................................ 5
1.1
Purpose ................................................................................................................... 5
1.2
EVM Circuit Overview ................................................................................................... 5
1.3
Power Requirements .................................................................................................... 5
1.4
TRF370x EVM Operating Procedure ................................................................................. 6
Physical Description .......................................................................................................... 11
2.1
PCB Layout ............................................................................................................. 11
2.2
Parts List ................................................................................................................ 16
Circuit Description ............................................................................................................. 16
3.1
Circuit Function ......................................................................................................... 16
Circuit Board .................................................................................................................... 17
Schematic ......................................................................................................................... 18
Overview
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Table of Contents
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List of Figures
1
Unadjusted Sideband Suppression ....................................................................................... 7
2
Optimized Sideband Suppression ........................................................................................ 8
3
GSM EDGE EVM at 1800 MHz ........................................................................................... 9
4
1.5-V Interface Network for 19.2 mA Full Scale ....................................................................... 10
5
3.3-V Interface Network for 19.2 mA Full Scale ....................................................................... 10
6
Top Layer 1
11
7
Top Layer 2
12
8
9
10
11
12
13
14
................................................................................................................
................................................................................................................
Ground Plane 1 ............................................................................................................
Ground Plane 2 ............................................................................................................
Bottom Layer 1.............................................................................................................
Bottom Layer 2.............................................................................................................
Drill Pattern .................................................................................................................
Silkscreen Top Layer .....................................................................................................
TRF370x EVM Schematic ................................................................................................
12
13
13
14
15
17
18
List of Tables
4
1
Bill of Materials for TRF370x EVM ...................................................................................... 16
2
Power Supply Connection ................................................................................................ 17
List of Figures
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User's Guide
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TRF370x Quadrature Modulator Evaluation Module
1
Overview
This document relates to the TRF370x direct quadrature modulator for applications in the transmit path of
base stations and communications equipment. The quadrature modulator is used for upconversion of
signals from the transmit chain DAC to the RF power amplifier device. Evaluating modulator complex
performance involves careful bias-voltage setup, an LO signal, and two differential (I/Q) signals at the
input of the modulator. This document describes the wide range of test options available and the factors
that must be considered in using this EVM.
1.1
Purpose
The TRF370x evaluation module (EVM) is intended for the evaluation of the TRF370333, TRF370317,
TRF370315, and TRF370417 direct-launch quadrature modulators. Unless otherwise stated, the
functionality described in this manual applies to all the TRF370x devices.
1.2
EVM Circuit Overview
The EVM comes configured for differential I/Q input signals via four SMA connectors as shown in the
schematic, Figure 14, and in Table 1.
For the upper sideband, the I signals are connected to J4 (I+) and J3 (I–). The Q signals are connected to
J5 (Q–) and J6 (Q+). The LO signal is fed to SMA connector J1, whereas J2 must be terminated with 50 Ω
to ground. SMA connector J7 is used to monitor the RF output signal from the quadrature modulator (U1).
The quadrature modulator requires a supply voltage of 4.5 V–5.5V from a regulated power supply through
headers TP2 and TP4.
The TRF370x quadrature modulators require a dc common-mode bias voltage (3.3 VDC, 1.7 VDC, or 1.5
VDC, corresponding to the last two digits of the part number) on all four input pins.
1.3
Power Requirements
The TRF370x EVM requires two 5-V VCC dc power-supply connectors through headers TP2 and TP4.
Header TP4 supplies 5 V to the LO circuitry, and TP2 supplies 5 V to the modulator circuitry.
CAUTION
Voltage Limits
Exceeding 5.6 V may damage the TRF370x.
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Overview
1.4
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TRF370x EVM Operating Procedure
Set up the EVM as follows:
1. Power-supply connection:
(a) Switch on the VCC (5-V) supply and set the current limit to 235 mA.
(b) Connect the 5-V supply to headers TP2 and TP4. Connect ground to TP1 and TP3.
(c) Verify that the current draw is ≤ 205 mA for the TRF370x1x and ≤ 235 mA for the TRF370333.
2. Use a suitable 50-Ω output signal generator or the TRF3761 to supply the LO signal at the desired
frequency to J1, and terminate J2 with 50 Ω to ground.
3. Use a DAC or an arbitrary waveform generator to provide the I/Q input signals. A typical setup is as
follows: a 1-Vp-p sine wave, a frequency of 50 kHz, a dc offset of 0 V, and an output impedance of
50 Ω (typically an ESG vector signal generator or similar).
4. Set the common mode on the ESG to either 1.65 V, 0.75 V, or 0.85 V, depending on device type (set
to 1.65 V for the TRF370333, to 0.75 V for the TRF370315, or to 0.85 V for the TRF370x17).
5. Use an arbitrary waveform generator to suppress the sideband. Adjust the I/Q amplitude and phase of
the CW signal coming from the arbitrary waveform generator.
6. Connect a spectrum analyzer to the SMA connector marked RFOUT (J7) and monitor the TRF370x
output.
1.4.1
Typical Test Results
1.4.1.1
Unadjusted Sideband Suppression
Unadjusted sideband suppression measures the amount of the unwanted sideband of the input signal,
relative to the wanted sideband. This assumes that the baseband inputs delivered to the modulator input
pins are perfectly matched in amplitude and are exactly 90° out of phase. Unadjusted sideband
suppression is measured in dBc. An iterative test is required in order to match perfectly the inputs to the
modulator. This ensures that any equipment, board, or signal conditioning component imbalances are
corrected before the signals are applied to the device under test. Once the baseband inputs to the
modulator are balanced, the amount of suppression attained is a measure of the internal mismatches of
the modulator, inherent to any modulator design. This suppression is the one specified in the TRF370x
data sheet. See Figure 1.
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C003
Figure 1. Unadjusted Sideband Suppression
1.4.1.2
Optimized Sideband Suppression
The sideband suppression of the TRF370x can be optimized by adjusting the amplitude and phase
balance between the quadrature inputs. The ideal condition is when all four inputs (I, I, Q, and Q) have
exactly the same amplitude and the phase relationship is: I = 0°, I = 180°, Q = 90°, and Q = 270°. Using
an iterative procedure, the gain and phase balance can be adjusted to achieve suppression levels that
exceed 60 dBc. The level of suppression observed depends on the amount of resolution available from
the source driving the modulator. By using TI’s DAC568x, the user can take advantage of built-in features
to optimize the sideband suppression by changing the amplitude and phase relationship of the signals. If
another DAC is used, then the user must provide this level of adjustment by controlling the regular digital
inputs to the DAC. See Figure 2.
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C002
Figure 2. Optimized Sideband Suppression
1.4.1.3
Carrier Feedthrough
Carrier feedthrough is the amount of the LO that leaks onto the output spectrum of the modulator. Ideally
for the TRF370x, inputs (I, I, Q, and Q) must be at approximately 3.3 V for TRF370333, 1.5 V for
TRF370315, and 1.7 V for TRF370317 and TFR370417. The DAC dc settings are also useful to correct
the dc mismatch between I and I and between Q and Q to minimize the LO feedthrough. If using TI's
DAC568x, then the internal controls for the I/Q offsets provide excellent carrier suppression (very low LO
leakage). Alternatively, if an ESG is being used, adjust the I and Q voltage offsets in mV steps until you
obtain the minimum carrier feedthrough. A typical carrier feedthrough value exceeds –50 dBm. See
Figure 2.
1.4.1.4
GSM (EDGE EVM Measurements)
1. Provide a GSM edge signal of the desired frequency into the differential baseband inputs (example
sample rate = 4.33 MHz).
2. Use a spectrum analyzer with edge personality to measure the transmit power to either 0 or –5 dBm.
3. PSA: Mode → GSM (with EDGE) → measure → Transmit Pwr (usually 0 or –5 dBm) → more →
EDGE EVM.
4. ESG: Mode setup → select waveform → highlight EDGE → select waveform → ARB setup → type
4.33333 MHz → I/Q → I/Q output control → Common mode I/Q offset → (set to 1.65 V, 0.75 V, or
0.85 V, depending on device) → I/Q → I/Q output control → I/Q output atten (adjust to get desired
transmit power to either 0 or –5 dBm).
See Figure 3.
8
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C001
Figure 3. GSM EDGE EVM at 1800 MHz
1.4.2
Interface to TI's DAC
All the TRF370x devices work well with TI's DACs. Figure 4 shows an example of the interface network
between a DAC56x2 and a TRF370315. Figure 5 shows an example of interfacing the DAC568x to the
TRF370333 with options for selecting the desired amount of attenuation between the two. Additional
interfacing networks for each modulator can be found in their respective data sheets or by using the DAC
interface calculator (SLWC083).
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Overview
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5V
R3
R3
R2
I
I
I
I
R2
R1
5V
R1
DAC56x2
TRF370315
R3
R3
R2
Q
Q
Q
Q
R2
R1
R1
S0225-02
TYPICAL VALUES
R1
R2
R3
53 Ω
210 Ω
931 Ω
NOTE: A DAC interface calculator is available (SLWC083).
Figure 4. 1.5-V Interface Network for 19.2 mA Full Scale
5V
R1
I
I
R5
R3
5V
DAC568x
TRF370333
R6
R1
R5
I
I
R3
S0226-02
LOSS
1 dB
2 dB
3 dB
4 dB
5 dB
Pullup
R1
115
115
115
115
115
Pulldown
R3
634
634
634
634
634
Series
R5
11
21
30
37.4
45.3
Shunt
R6
187
165
147
130
118
Figure 5. 3.3-V Interface Network for 19.2 mA Full Scale
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Physical Description
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2
Physical Description
This chapter discusses the four-layer PCB layout, component placement, and list of components used on
the evaluation module.
2.1
PCB Layout
The EVM is constructed on a four-layer, 38,1-mm × 38,1-mm × 1,579-mm thick PCB using FR-4 material.
Figure 6 through Figure 12 show the individual layers.
K001
Figure 6. Top Layer 1
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Physical Description
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K002
Figure 7. Top Layer 2
K003
Figure 8. Ground Plane 1
12
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K004
Figure 9. Ground Plane 2
K005
Figure 10. Bottom Layer 1
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Physical Description
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K006
Figure 11. Bottom Layer 2
14
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Physical Description
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D001
Figure 12. Drill Pattern
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Circuit Description
2.2
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Parts List
Table 1. Bill of Materials for TRF370x EVM
Item
Number
Quantity
1
3
C1, C2, C3
100 pF
0402
PANASONIC
ECJ-0EC1H101J
2
2
C4, C5
1000 pF
0402
PANASONIC
ECJ-0VC1H102J
3
2
C6, C7
4.7 mF
TANT_A
KERMET
T491A475K016AS
4
0
C8, C9
1 mF
0402
PANASONIC
ECJ0EC1H010C_DNI
DNI
5
0
C10, C11,
C12, C13
0.1 mF
0402
PANASONIC
ECJ0EB1A104K_DNI
DNI
6
2
C14, C15
10 pF
0402
MURATA
GRM1555C1H100J
Z01D
7
7
J1, J2, J3,
J4, J5, J6,
J7
LOP
SMA_SMEL_250x215
JOHNSON
COMPONENTS
142-0711-821
8
2
R1
0
0402
PANASONIC
ERJ-2GE0R00
OR
EQUIVALENT
9
4
R2, R3, R4,
R5
0
0402
PANASONIC
ERJ-2GE0R00
OR
EQUIVALENT
TRF370333
QFN_24_163x163_
0p50mm
TI
TRF370333
For TRF370333
EVM, TI
supplied
TRF370317
QFN_24_163x163_
0p50mm
TI
TRF370317
For TRF370317
EVM, TI
supplied
TRF370315
QFN_24_163x163_
0p50mm
TI
TRF370315
For TRF370315
EVM, TI
supplied
TRF370417
QFN_24_163x163_
0p50mm
TI
TRF370417
For TRF370417
EVM, TI
supplied
10
3
1
Reference
Designator
Value
PCB Footprint
Mfr. Name
Mfr. Part Number
U1
11
2
TP1, TP3
BLK
TP_THVT_100_RND
KEYSTONE
5001K
12
2
TP2, TP4
RED
TP_THVT_100_RND
KEYSTONE
5000K
Note
Circuit Description
This chapter discusses the various functions of the EVM.
3.1
Circuit Function
•
•
•
•
16
Headers TP2 and TP4 supply 5-V VCC dc power to the modulator. Header TP4 supplies 5 V to the LO
circuitry, and TP2 supplies 5 V to the modulator circuitry.
Four SMA connectors are provided on the EVM for inputting differential I/Q signals directly to the input
pins of the TRF370x. Connectors J3, J4, J5, and J6 are used to connect the signal source I/Q signals
directly to the TRF370x.
Two SMA connectors are provided for LO input: J1 = LOP and J2 = LON. Terminate whichever LO
port is not being used through 50 Ω to ground.
One SMA connector is for RF_OUT: J7.
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3.1.1
Power
Table 2. Power Supply Connection
4
Power Supply Connection
Description
TP4
5-V (VCC), U1 analog supply
TP2
5-V (VCC), U1 analog supply
TP3, TP1
Analog ground
Circuit Board
This chapter shows the circuit board test points.
GND
+5 V
+5 V
BBIN
GND
BBIP
LOP
RF_OUT
LON
50 W
BBQP
BBQN
K007
Figure 13. Silkscreen Top Layer
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Schematic
5
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Schematic
This chapter shows the EVM schematic.
DNI C10
DNI C11
.1uF
.1uF
J3
BBIN
J4
BBIP
2
3
4
5
1
TP3
GND
BLK
TP4
VCC2
R2
R3
0
0
SMA_END
5
4
3
2
1
SMA_END
TP2
VCC1
RED
RED
C5
C4
1000pF
1000pF
+ C6
TP1
GND
BLK
+ C7
4.7uF
4.7uF
C15
C14
10pF
10pF
J1
LOP
100pF
25
24
23
22
21
20
19
GND
VCC2
GND10
BBIN
BBIP
GND9
GND8
2
3
4
5
NC1
GND1
LOP
LON
GND2
NC2
VCC1
GND7
RF_OUT
U1
NC5
TRF370x
GND6
NC4
J7
RF_OUT
18
17
16
15
14
13
C3
C2
1
0
SMA_END
1
C8
C9
1uF
DNI
1uF
DNI
7
8
9
10
11
12
J2
LON
R1
100pF
NC3
GND3
BBQN
BBQP
GND4
GND5
1
2
3
4
5
6
5
4
3
2
C1
1
SMA_END
100pF
2
3
4
5
SMA_END
TRF370333
0
DNI
TRF370317
0
TRF370315
0
J5
QN
R4
R5
0
0
J6
QP
DNI
0
1
SMA_END
2
3
4
5
DNI
1
DNI
DNI
C12
C13
.1uF
.1uF
SMA_END
5
4
3
2
TRF370417
S0214-03
DNI = Do not install.
Figure 14. TRF370x EVM Schematic
18
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EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 4.5 V to 5.5 V and the output voltage range of 4.5 V to 5.5 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions
concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.
Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 59°C. The EVM is designed to operate
properly with certain components above –40°C as long as the input and output ranges are maintained. These components include but are
not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified
using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,
please be aware that these devices may be very warm to the touch.
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