TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 0.4-GHz TO 4-GHz QUADRATURE MODULATOR FEATURES APPLICATIONS • • VCC GND BBIN BBIP GND GND 24 23 22 21 20 19 3 16 RF_OUT LON 4 15 NC GND 5 14 GND NC 6 13 NC 12 LOP GND GND 11 17 GND 2 10 GND BBQP VCC 9 18 BBQN 1 8 NC GND • RGE PACKAGE (TOP VIEW) 7 • • • • • • • Cellular Base Transceiver Station Transmit Channel CDMA: IS95, UMTS, CDMA2000, TD-SCDMA TDMA: GSM, IS-136, EDGE/UWC-136 Wireless Local Loop Wireless MAN Wideband Transceivers NC • • • • • 75-dBc Single-Carrier WCDMA ACPR at –11-dBm Channel Power Very Low Noise Floor: –163 dBm/Hz OPI3 of 23 dBm P1dB of 9 dBm Unadjusted Carrier Feedthrough of –40 dBm Unadjusted Side-Band Suppression of –40 dBc Single Supply: 4.5 V–5.5 V Operation Silicon Germanium Technology TRF370333 With 3.3-V CM at I, Q Baseband Inputs TRF370315 With 1.5-V CM at I, Q Baseband Inputs P0024-04 DESCRIPTION The TRF3703 is a very low-noise direct quadrature modulator, capable of converting complex modulated signals from baseband or IF directly up to RF. The TRF3703 is ideal for high-performance direct RF modulation from 400 MHz up to 4 GHz. The modulator is implemented as a double-balanced mixer. The RF output block consists of a differential to single-ended converter and an RF amplifier capable of driving a single-ended 50-Ω load without any need of external components. The TRF3703 comes in two types, TRF370333 and TRF370315. The TRF370333 and TRF370315 devices have different common-mode voltage ratings at the I, Q baseband inputs. The TRF370333 requires a 3.3-V common-mode voltage, and the TRF370315 requires a 1.5-V common-mode voltage. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2007, Texas Instruments Incorporated TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 VCC GND BBIN BBIP GND GND 24 23 22 21 20 19 Functional Block Diagram NC 1 18 VCC GND 2 17 GND LOP 3 16 RF_OUT S 0/90 12 NC GND 13 11 6 GND NC 10 GND BBQP 14 9 5 BBQN GND 8 NC GND 15 7 4 NC LON B0175-01 NOTE: NC = No connection 2 Submit Documentation Feedback TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DEVICE INFORMATION TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION BBIN 22 I In-phase input BBIP 21 I In-phase input BBQN 9 I In-quadrature input BBQP 10 I In-quadrature input GND 2, 5, 8,11, 12, 14, 17, 19, 20, 23 – Ground LON 4 I Local oscillator input LOP 3 I Local oscillator input NC 1, 6, 7, 13, 15 – No connect 16 O RF output 18, 24 – Power supply RF_OUT VCC ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) Supply voltage range Digital I/O voltage range VALUE (2) UNIT –0.3 V to 6 V –0.3 V to VI + 0.3 V TJ Operating virtual junction temperature range –40 to 150 °C TA Operating ambient temperature range –40 to 85 °C Tstg Storage temperature range –65 to 150 °C (1) (2) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) VCC Power-supply voltage MIN NOM MAX 4.5 5 5.5 UNIT V THERMAL CHARACTERISTICS PARAMETER TEST CONDITIONS RθJA Thermal resistance, junction-to-ambient RθJC Thermal resistance, junction-to-case High-K board, still air Submit Documentation Feedback VALUE UNIT 64.33 °C/W 49.3 °C/W 3 TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC Parameters ICC Total supply current (1.5 V CM) TA = 25°C 195 205 Total supply current (3.3 V CM) TA = 25°C 210 235 mA LO Input (50-Ω, Single-Ended) fLO LO frequency range 0.4 LO input power –5 LO port return loss 0 4 GHz 12 dBm 15 dB Baseband Inputs VCM I and Q input dc common voltage BW 1-dB input frequency bandwidth TRF370333 3.3 TRF370315 1.5 350 Input impedance, resistance ZI(single ended) Input impedance, parallel capacitance TRF370333 Input impedance, resistance Input impedance, parallel capacitance V TRF370315 MHz 10 kΩ 3 pF 5 kΩ 3 pF ELECTRICAL CHARACTERISTICS over recommended operating conditions, power supply = 5 V, TA = 25°C, fLO = 400 MHz at 0 dBm (unless otherwise noted) RF Output Parameters PARAMETER 4 TEST CONDITIONS G Voltage gain P1dB Output compression point IP3 Output IP3 IP2 Output IP2 Measured at fLO + 2 × fBB Carrier feedthrough Sideband suppression MIN Output rms voltage over input I (or Q) rms voltage TYP MAX UNIT –2.3 dB 9.4 dBm 23 dBm 62 dBm Unadjusted –37 dBm Unadjusted –39 dBc 20 Submit Documentation Feedback TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 ELECTRICAL CHARACTERISTICS over recommended operating conditions, power supply = 5 V, TA = 25°C, fLO = 900 MHz at 0 dBm (unless otherwise noted) RF Output Parameters PARAMETER TEST CONDITIONS G Voltage gain P1dB Output compression point IP3 Output IP3 IP2 Output IP2 Measured at fLO + 2 × fBB Carrier feedthrough Sideband suppression MIN Output rms voltage over input I (or Q) rms voltage EVM Error vector magnitude (rms) UNIT dB 9 dBm 23 dBm 63 dBm Unadjusted –37 dBm Unadjusted –42 dBc 9 dB 20 DC only to BB inputs, 13 MHz offset from fLO –160.4 1.8-MHz offset from fLO; 1 CW tone; Pout = 0 dBm –156.6 6-MHz offset from fLO; 1 CW tone; Pout = 0 dBm –158.5 1 EDGE signal, Pout = –5 dBm 0.59% 1 EDGE signal, Pout = 0 dBm 0.63% 1 EDGE signal, Pout = 0 dBm, 2nd harmonic of LO = –15 dBm, 3rd harmonic of LO = –33 dBm (1) (1) MAX –4.1 Output return loss Output noise floor TYP dBm/Hz 1% The second- and third-harmonic tests were made independently at each frequency. ELECTRICAL CHARACTERISTICS over recommended operating conditions, power supply = 5 V, TA = 25°C, fLO = 1800 MHz at 0 dBm (unless otherwise noted) RF Output Parameters PARAMETER TEST CONDITIONS G Voltage gain P1dB Output compression point IP3 Output IP3 IP2 Output IP2 Measured at fLO + 2 × fBB Carrier feedthrough Sideband suppression Error vector magnitude (rms) UNIT dB dBm 23 dBm 55 dBm Unadjusted –40 dBm Unadjusted –47 dBc 8 dB 20 1.8-MHz offset from fLO; 1 CW tone; Pout = 0 dBm –162.6 –160 6-MHz offset from fLO; 1 CW tone; Pout = 0 dBm –159.4 1 EDGE signal, Pout = –5 dBm 0.66% 1 EDGE signal, Pout = 0 dBm 0.74% 1 EDGE signal, Pout = 0 dBm, 2nd harmonic of LO = –15.5 dBm, 3rd harmonic of LO = –30 dBm (1) (1) MAX 9.5 DC only to BB inputs, 13 MHz offset from fLO EVM TYP –4.4 Output return loss Output noise floor MIN Output rms voltage over input I (or Q) rms voltage dBm/Hz 1% The second- and third-harmonic tests were made independently at each frequency. Submit Documentation Feedback 5 TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 ELECTRICAL CHARACTERISTICS over recommended operating conditions, power supply = 5 V, TA = 25°C, fLO = 2140 MHz at 0 dBm (unless otherwise noted) RF Output Parameters PARAMETER TEST CONDITIONS G Voltage gain P1dB Output compression point IP3 Output IP3 IP2 Output IP2 Measured at fLO + 2 × fBB Carrier feedthrough Sideband suppression MIN Output rms voltage over input I (or Q) rms voltage ACPR Adjacent-channel power ratio Alternate-channel power ratio MAX UNIT –4.5 dB 9.5 dBm 21 dBm 58 dBm Unadjusted –40 dBm Unadjusted –47 dBc 8.5 dB 18 Output return loss Output noise floor TYP 20-MHz offset from fLO; dc only to BB inputs –163 20-MHz offset from fLO; 1 WCDMA signal; Pin = –20.5 dBVrms (I and Q input) –162 1 WCDMA signal; Pout = –13 dBm –75.8 1 WCDMA signal; Pout = –9 dBm –72 4 WCDMA signals; Pout = –23 dBm per carrier –68 1 WCDMA signal; Pout = –13 dBm –79 1 WCDMA signal; Pout = –9 dBm dBm/Hz dBc –80.5 4 WCDMA signals; Pout = –23 dBm per carrier dBc –69 ELECTRICAL CHARACTERISTICS over recommended operating conditions, power supply = 5 V, TA = 25°C, fLO = 2500 MHz at 0 dBm (unless otherwise noted) RF Output Parameters PARAMETER TEST CONDITIONS G Voltage gain P1dB Output compression point IP3 Output IP3 IP2 Output IP2 Measured at fLO + 2 × fBB Carrier feedthrough Sideband suppression MIN Output rms voltage over input I (or Q) rms voltage TYP MAX UNIT –4.4 dB 9.5 dBm 21 dBm 63 dBm Unadjusted –38 dBm Unadjusted –47 dBc 18 ELECTRICAL CHARACTERISTICS over recommended operating conditions, power supply = 5 V, TA = 25°C, fLO = 3600 MHz at 0 dBm (unless otherwise noted) RF Output Parameters PARAMETER 6 TEST CONDITIONS G Voltage gain P1dB Output compression point IP3 Output IP3 IP2 Output IP2 Measured at fLO + 2 × fBB Carrier feedthrough Sideband suppression MIN Output rms voltage over input I (or Q) rms voltage TYP MAX UNIT –3.5 dB 9.5 dBm 23 dBm 63 dBm Unadjusted –41 dBm Unadjusted –45 dBc 20 Submit Documentation Feedback TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 ELECTRICAL CHARACTERISTICS over recommended operating conditions, power supply = 5 V, TA = 25°C, fLO = 4000 MHz at 0 dBm (unless otherwise noted) RF Output Parameters PARAMETER TEST CONDITIONS G Voltage gain P1dB Output compression point IP3 Output IP3 IP2 Output IP2 Measured at fLO + 2 × fBB Carrier feedthrough Sideband suppression MIN Output rms voltage over input I (or Q) rms voltage TYP –4.5 MAX UNIT dB 9 dBm 22 dBm 50 dBm Unadjusted –37 dBm Unadjusted –40 dBc 19 Submit Documentation Feedback 7 TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 TYPICAL CHARACTERISTICS POUT vs BASEBAND VOLTAGE POUT vs FREQUENCY AND TEMPERATURE 0 −1 10 –40°C POUT − Output Power − dBm POUT − Output Power at 1.8 GHz − dBm 15 5 0 −5 −10 −2 −3 −4 85°C 25°C −5 −6 −7 −8 −15 LO = 0 dB VCC = 5 V −9 −10 −20 0.01 0.1 0 1 VBB − Baseband Voltage Single-Ended RMS − V 500 1000 1500 2000 2500 3000 3500 4000 4500 f − Frequency − MHz G010 G023 Figure 1. Figure 2. POUT vs FREQUENCY AND SUPPLY VOLTAGE POUT vs FREQUENCY AND LO POWER 0 0 5.5 V −1 POUT − Output Power − dBm POUT − Output Power − dBm −1 −2 −3 −4 4.5 V 5V −5 −6 −7 0 dBm −2 5 dBm −3 −4 –5 dBm −5 −8 −6 LO = 0 dB TA = 25°C −9 −10 VCC = 5 V TA = 25°C −7 0 500 1000 1500 2000 2500 3000 3500 4000 4500 0 500 1000 1500 2000 2500 3000 3500 4000 4500 f − Frequency − MHz f − Frequency − MHz G011 Figure 3. 8 G012 Figure 4. Submit Documentation Feedback TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 TYPICAL CHARACTERISTICS (continued) P1dB vs FREQUENCY AND TEMPERATURE P1dB vs FREQUENCY AND SUPPLY VOLTAGE 14 12 LO = 0 dB VCC = 5 V 12 5.5 V 10 10 5V P1dB − dBm P1dB − dBm 8 8 25°C 85°C –40°C 6 4.5 V 6 4 4 2 2 LO = 0 dB TA = 25°C 0 0 0 500 1000 1500 2000 2500 3000 3500 4000 4500 0 500 1000 1500 2000 2500 3000 3500 4000 4500 f − Frequency − MHz f − Frequency − MHz G001 G002 Figure 5. Figure 6. P1dB vs FREQUENCY AND LO POWER OIP3 vs FREQUENCY AND TEMPERATURE 30 12 28 –5 dBm 10 26 5 dBm 24 8 0 dBm OIP3 − dBm P1dB − dBm 25°C 85°C 6 4 22 20 18 –40°C 16 14 2 VCC = 5 V TA = 25°C LO = 0 dBm VCC = 5 V 12 10 0 0 500 1000 1500 2000 2500 3000 3500 4000 4500 0 500 1000 1500 2000 2500 3000 3500 4000 4500 f − Frequency − MHz f − Frequency − MHz G014 G003 Figure 7. Figure 8. Submit Documentation Feedback 9 TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 TYPICAL CHARACTERISTICS (continued) OIP3 vs FREQUENCY AND SUPPLY VOLTAGE OIP3 vs FREQUENCY AND LO POWER 30 30 28 +5 dBm 28 5V 26 26 24 24 22 22 OIP3 − dBm OIP3 − dBm 4.5 V 20 5.5 V 18 20 16 14 14 LO = 0 dBm TA = 25°C 0 dBm 18 16 12 –5 dBm VCC = 5 V TA = 25°C 12 10 10 0 0 500 1000 1500 2000 2500 3000 3500 4000 4500 500 1000 1500 2000 2500 3000 3500 4000 4500 f − Frequency − MHz f − Frequency − MHz G015 G013 Figure 9. Figure 10. UNADJUSTED SIDEBAND SUPPRESSION vs FREQUENCY AND TEMPERATURE UNADJUSTED SIDEBAND SUPPRESSION vs FREQUENCY AND SUPPLY VOLTAGE 0 LO = 0 dB POUT = –3 dBm VCC = 5 V −10 SS − Unadjusted Sideband Suppression − dBc SS − Unadjusted Sideband Suppression − dBc 0 −20 −30 85°C −40 25°C −50 –40°C −60 LO = 0 dB POUT = –3 dBm TA = 25°C −10 −20 −30 5V −40 5.5 V −50 4.5 V −60 0 500 1000 1500 2000 2500 3000 3500 4000 4500 0 500 1000 1500 2000 2500 3000 3500 4000 4500 f − Frequency − MHz f − Frequency − MHz G007 Figure 11. 10 G008 Figure 12. Submit Documentation Feedback TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 TYPICAL CHARACTERISTICS (continued) UNADJUSTED SIDEBAND SUPPRESSION vs FREQUENCY AND LO POWER ADJUSTED SIDEBAND SUPPRESSION vs FREQUENCY AND TEMPERATURE −20 VCC = 5 V POUT = –3 dBm TA = 25°C −10 SS − Adjusted Sideband Suppression − dBc SS − Unadjusted Sideband Suppression − dBc 0 −20 −30 –5 dBm 0 dBm −40 −50 5 dBm −40 −50 –40°C 25°C −60 −70 85°C −60 0 −30 Adj at 942.6 MHz VCC = 5 V −80 900 500 1000 1500 2000 2500 3000 3500 4000 4500 920 f − Frequency − MHz 940 960 980 G009 G016 Figure 13. Figure 14. ADJUSTED SIDEBAND SUPPRESSION vs FREQUENCY AND TEMPERATURE ADJUSTED SIDEBAND SUPPRESSION vs FREQUENCY AND TEMPERATURE −20 SS − Adjusted Sideband Suppression − dBc SS − Adjusted Sideband Suppression − dBc −20 −30 1000 f − Frequency − MHz Adj at 1900 MHz VCC = 5 V −40 −50 85°C −60 –40°C 25°C −70 −30 Adj at 2140 MHz VCC = 5 V −40 85°C −50 –40°C −60 −70 25°C −80 1850 1870 1890 1910 1930 1950 −80 2100 f − Frequency − MHz 2120 2140 2160 2180 2200 f − Frequency − MHz G017 Figure 15. G018 Figure 16. Submit Documentation Feedback 11 TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 TYPICAL CHARACTERISTICS (continued) NOISE AT 13-MHz OFFSET (dBm/Hz) vs FREQUENCY AND SUPPLY VOLTAGE NOISE AT 13-MHz OFFSET (dBm/Hz) vs FREQUENCY AND TEMPERATURE −156 −154 POUT = –5 dBm LO = +5 dBm Temp = 25°C 5.5 V −158 −160 5V −162 −164 4.5 V −166 −168 0.0 −158 25°C/0 dBm −160 −162 −164 –40°C/0 dBm −166 0.5 1.0 85°C/0 dBm −156 Noise at 13-MHz Offset − dBm/Hz Room Temperature Noise − dBm/Hz −154 1.5 2.0 2.5 3.0 3.5 POUT = 0 dBm LO = +5 dBm VCC = 5 V −168 0.0 4.0 0.5 1.0 f − Frequency − GHz 1.5 2.0 2.5 3.0 3.5 G019 G020 Figure 17. Figure 18. NOISE AT 13-MHz OFFSET (dBm/Hz) vs FREQUENCY AND TEMPERATURE NOISE AT 13-MHz OFFSET (dBm/Hz) vs FREQUENCY AND TEMPERATURE −154 −154 −156 Noise at 13-MHz Offset − dBm/Hz Noise at 13-MHz Offset − dBm/Hz −156 85°C/–5 dBm −158 25°C/–5 dBm −160 −162 −164 −166 −168 0.0 –40°C/–5 dBm POUT = –5 dBm LO = +5 dBm VCC = 5 V 0.5 1.0 POUT = –10 dBm LO = +5 dBm VCC = 5 V −158 85°C/–10 dBm −160 25°C/–10 dBm −162 −164 −166 –40°C/–10 dBm 1.5 2.0 2.5 3.0 3.5 4.0 −168 0.0 f − Frequency − GHz 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 f − Frequency − GHz G021 Figure 19. 12 4.0 f − Frequency − GHz G022 Figure 20. Submit Documentation Feedback TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 TYPICAL CHARACTERISTICS (continued) UNADJUSTED CARRIER FEEDTHROUGH vs SUPPLY VOLTAGE UNADJUSTED CARRIER FEEDTHROUGH vs FREQUENCY AND TEMPERATURE 0 LO = 0 dB TA = 25°C −10 CS − Unadjusted Carrier Feedthrough − dBm CS − Unadjusted Carrier Feedthrough − dBm 0 −20 5V −30 5.5 V −40 −50 4.5 V −60 −70 −80 LO = 0 dB VCC = 5 V −10 −20 −30 85°C −40 −50 25°C −60 –40°C −70 −80 0 500 1000 1500 2000 2500 3000 3500 4000 4500 0 500 1000 1500 2000 2500 3000 3500 4000 4500 f − Frequency − MHz f − Frequency − MHz G025 Figure 21. G026 Figure 22. Submit Documentation Feedback 13 TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 APPLICATION INFORMATION AND EVALUATION BOARD Basic Connections • • • • • • • • • 14 See Figure 23 for proper connection of the TRF3703 modulator. Connect a single power supply (4.5 V–5.5 V) to pins 18 and 24. These pins should be decoupled as shown on pins 4, 5, 6, and 7. Connect pins 2, 5, 8, 11, 12, 14, 17, 19, 20, and 23 to GND. Connect a single-ended LO source of desired frequency to LOP (amplitude between –5 dBm and 12 dBm). This should be ac-coupled through a 100-pF capacitor. Terminate the ac-coupled LON with 50 Ω to GND. Connect a baseband signal to pins 21 = I, 22 = I, 10 = Q, and 9 = Q. The differential baseband inputs should be set to the proper level, 3.3 V for the TRF370333 or 1.5 V for the TRF370315. RF_OUT, pin 16, can be fed to a spectrum analyzer set to the desired frequency, LO ± baseband signal. This pin should also be ac-coupled through a 100-pF capacitor. All NC pins can be left floating. Submit Documentation Feedback TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 APPLICATION INFORMATION AND EVALUATION BOARD (continued) J3 IN J4 IP 1 1 SMA_END 2 3 4 5 5 4 3 2 SMA_END W1 2POS_JUMPER W2 2POS_JUMPER C6 + R2 R3 0 0 C5 1000 pF C7 + 4.7uF 19 NC GND GND NC 8 5 4 3 2 7 100 pF J5 QN 1 R5 0 0 16 R1 15 0 C3 1 SMA_END 100 pF C8 C9 0.1 mF (Note 1) 0.1 mF (Note 1) 14 13 J6 QP 1 SMA_END 2 3 4 5 5 4 3 2 SMA_END R4 J7 RF_OUT 17 GND NC 18 2 3 4 5 GND GND 21 20 IP U1 TRF3703 NC 1 SMA_END RF_OUT GND 6 LOP LON 1000 pF 12 C2 GND QP 5 J2 LON GND 11 4 VCCMOD 10 3 NC QN 5 4 3 2 2 GND 1 100 pF 9 SMA_END IN 1 GND VCCLO C1 23 24 J1 LOP 22 4.7 mF C4 S0214-01 (1) Do not install. Figure 23. TRF3703 EVM Schematic Submit Documentation Feedback 15 TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 APPLICATION INFORMATION AND EVALUATION BOARD (continued) Figure 24 shows the top view of the TRF3703 EVM board. GND +5 V +5 V BBIN GND BBIP LOP RF_OUT LON 50 W BBQP BBQN K001 Figure 24. TRF3703 EVM Board Layout Table 1. Bill of Materials for TRF3703 EVM Value Footprint QTY Part Number Vendor Digi-Key Number REF DES Tantalum 4.7-μF, 10-V, 10% capacitor 3216 2 T491A475K010AS KEMET 399-1561-1-ND C6, C7 1000-pF, 50-V, 5% capacitor 603 2 ECJ-1VC1H102J Panasonic PCC2151CT-ND C4, C5 100-pF, 50-V, 5% capacitor 603 3 ECJ-1VC1H101J Panasonic PCC101ACVCT-ND C1, C2, C3 Capacitor 603 0 16 Not Installed C8, C9 Submit Documentation Feedback TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 APPLICATION INFORMATION AND EVALUATION BOARD (continued) Table 1. Bill of Materials for TRF3703 EVM (continued) Value Footprint QTY Part Number ERJ-3GEY0R00V Vendor Panasonic Digi-Key Number P0.0GCT-ND REF DES 0-Ω resistor, 1/10-W, 5% 603 5 TRF3703 24-QFN-PP4X4MM 1 SMA connectors SMA_END_ SMALL 6 16F3627 Newark 142-0711-821 J1, J2, J3, J4, J5, J6, J7 2POS_HEADER 2POS_JUMP 2 HTSW-150-07-L-S SAMTEC N/A W1, W2 TI Not Installed R1, R2, R3, R4, R5 U1 GSM Applications The TRF3703 is suited for GSM applications because of its high linearity and low noise level over the entire recommended operating range. It also has excellent EVM performance, which makes it ideal for the stringent GSM/EDGE applications. WCDMA Applications The TRF3703 is also optimized for WCDMA applications where both adjacent-channel power ratio (ACPR) and noise density are critically important. Using Texas instruments’ DAC568X series of high-performance digital-to-analog converters as depicted in Figure 25, excellent ACPR levels were measured with one-, two-, and four-WCDMA carriers. See Electrical Characteristics, fLO = 2140 MHz for exact ACPR values. 16 TRF3703 I/Q Modulator DAC5687 RF_OUT 16 CLK1 CLK2 VCXO TRF3761 PLL LO Generator CDCM7005 Clock Gen Ref Osc B0176-01 Figure 25. Typical Transmit Setup Block Diagram Submit Documentation Feedback 17 TRF3703 www.ti.com SLWS184D – MARCH 2006 – REVISED JUNE 2007 DEFINITION OF SPECIFICATIONS Unadjusted Carrier Feedthrough This specification measures the amount by which the local oscillator component is attenuated in the output spectrum of the modulator relative to the carrier. This further assumes that the baseband inputs delivered to the pins of the TRF3703 are perfectly matched to have the same dc offset (VCM). This includes all four baseband inputs: I, I, Q, and Q. This is measured in dBm. Adjusted (Optimized) Carrier Feedthrough This differs from the unadjusted suppression number in that the baseband input dc offsets are iteratively adjusted around their theoretical value of VCM to yield the maximum suppression of the LO component in the output spectrum. This is measured in dBm. Unadjusted Sideband Suppression This specification measures the amount by which the unwanted sideband of the input signal is attenuated in the output of the modulator, relative to the wanted sideband. This further assumes that the baseband inputs delivered to the modulator input pins are perfectly matched in amplitude and are exactly 90° out of phase. This is measured in dBc. Adjusted (Optimized) Sideband Suppression This differs from the unadjusted sideband suppression in that the baseband inputs are iteratively adjusted around their theoretical values to maximize the amount of sideband suppression. This is measured in dBc. Suppressions Over Temperature This specification assumes that the user has gone though the optimization process for the suppression in question, and set the optimal settings for the I, Q inputs. This specification then measures the suppression when temperature conditions change after the initial calibration is done. Figure 26 shows a simulated output and illustrates the respective definitions of various terms used in this data sheet. The graph assumes a baseband input of 50 kHz. 10 POUT 0 P − Power − dBm −10 −20 3RD LSB (dBc) SBS (dBc) 3RD LSB LSB (Undesired) 2ND USB (dBc) C (dBm) −30 −40 −50 −60 −70 2ND LSB −80 −200 −150 −100 −50 USB (Desired) 2ND USB Carrier 0 3RD USB 50 100 150 200 f − Frequency Offset − kHz (Relative to Carrier) G024 Figure 26. Graphical Illustration of Common Terms 18 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 22-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TRF370315IRGER ACTIVE QFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TRF370315IRGET ACTIVE QFN RGE 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TRF370333IRGER ACTIVE QFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TRF370333IRGERG4 ACTIVE QFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TRF370333IRGET ACTIVE QFN RGE 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TRF370333IRGETG4 ACTIVE QFN RGE 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Jan-2008 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TRF370315IRGER RGE 24 SITE 60 330 12 4.3 4.3 1.5 8 12 Q1 TRF370315IRGET RGE 24 SITE 60 330 12 4.3 4.3 1.5 8 12 Q1 TRF370333IRGER RGE 24 SITE 60 330 12 4.3 4.3 1.5 8 12 Q2 TRF370333IRGET RGE 24 SITE 60 330 12 4.3 4.3 1.5 8 12 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Jan-2008 Device Package Pins Site Length (mm) Width (mm) Height (mm) TRF370315IRGER RGE 24 SITE 60 342.9 345.9 20.64 TRF370315IRGET RGE 24 SITE 60 342.9 345.9 20.64 TRF370333IRGER RGE 24 SITE 60 342.9 345.9 20.64 TRF370333IRGET RGE 24 SITE 60 342.9 345.9 20.64 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2008, Texas Instruments Incorporated