PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-9318201M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629318201M2A TLC2274 MFKB 5962-9318201MCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9318201MC A TLC2274MJB 5962-9318201QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9318201QD A TLC2274MWB 5962-9318202Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629318202Q2A TLC2274 AMFKB 5962-9318202QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9318202QC A TLC2274AMJB 5962-9318202QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9318202QD A TLC2274AMWB 5962-9555201NXD ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 Q2272M 5962-9555201NXDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 Q2272M 5962-9555201Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629555201Q2A TLC2272 MFKB 5962-9555201QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9555201QHA TLC2272M 5962-9555201QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9555201QPA TLC2272M 5962-9555202Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629555202Q2A TLC2272 AMFKB Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-9555202QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9555202QHA TLC2272AM 5962-9555202QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9555202QPA TLC2272AM TLC2272ACD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272AC TLC2272ACDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272AC TLC2272ACDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272AC TLC2272ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272AC TLC2272ACP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC2272AC TLC2272ACPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC2272AC TLC2272ACPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM P2272A TLC2272ACPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM P2272A TLC2272ACPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI TLC2272ACPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM P2272A TLC2272ACPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM P2272A TLC2272AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272AI TLC2272AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272AI TLC2272AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272AI TLC2272AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272AI TLC2272AIP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Addendum-Page 2 TLC2272AI Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLC2272AIPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC2272AI TLC2272AMD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272AMDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272AMDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272AMDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629555202Q2A TLC2272 AMFKB TLC2272AMJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9555202QPA TLC2272AM -55 to 125 2272AM 2272AM -55 to 125 2272AM 2272AM TLC2272AMP OBSOLETE PDIP P 8 TBD Call TI Call TI -55 to 125 TLC2272AMUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9555202QHA TLC2272AM TLC2272AQD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C2272A TLC2272AQDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272AQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272AQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2272C TLC2272CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2272C TLC2272CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2272C TLC2272CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2272C Addendum-Page 3 C2272A -40 to 125 C2272A C2272A Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLC2272CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLC2272CP TLC2272CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLC2272CP TLC2272CPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2272 TLC2272CPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2272 TLC2272CPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2272 TLC2272CPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70 TLC2272CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2272 TLC2272CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2272 TLC2272ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272I TLC2272IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272I TLC2272IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272I TLC2272IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2272I TLC2272IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC2272IP TLC2272IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC2272IP TLC2272IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y2272 TLC2272IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y2272 TLC2272IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI TLC2272IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y2272 TLC2272IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y2272 Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLC2272MD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 2272M TLC2272MDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272MDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272MDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629555201Q2A TLC2272 MFKB TLC2272MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 TLC2272MJG TLC2272MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9555201QPA TLC2272M 2272M -55 to 125 2272M 2272M TLC2272MP OBSOLETE PDIP P 8 TBD Call TI Call TI -55 to 125 TLC2272MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 TLC2272QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2272QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274ACD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2274AC TLC2274ACDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2274AC TLC2274ACDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2274AC TLC2274ACDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2274AC TLC2274ACN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLC2274ACN TLC2274ACNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLC2274ACN Addendum-Page 5 9555201QHA TLC2272M C2272Q -40 to 125 C2272Q T2272Q Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLC2274ACPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2274A TLC2274ACPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2274A TLC2274ACPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2274A TLC2274ACPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 P2274A TLC2274AID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2274AI TLC2274AIDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2274AI TLC2274AIDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2274AI TLC2274AIDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2274AI TLC2274AIN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLC2274AIN TLC2274AINE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLC2274AIN TLC2274AIPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 Y2274A TLC2274AIPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 Y2274A TLC2274AIPWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 TLC2274AIPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 Y2274A TLC2274AIPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 Y2274A TLC2274AMD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 2274AM TLC2274AMDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274AMDR OBSOLETE SOIC D 14 TBD Call TI Call TI TLC2274AMDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 6 2274AM -55 to 125 2274AM Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLC2274AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629318202Q2A TLC2274 AMFKB TLC2274AMJB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9318202QC A TLC2274AMJB TLC2274AMWB ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9318202QD A TLC2274AMWB TLC2274AQD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLC2274A TLC2274AQDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274AQDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274AQDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PJ2274A TLC2274CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274C TLC2274CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274C TLC2274CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274C TLC2274CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274C TLC2274CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC2274CN TLC2274CNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC2274CN TLC2274CNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274 TLC2274CPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM P2274 TLC2274CPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM P2274 TLC2274CPWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI Addendum-Page 7 PJ2274A -40 to 125 TLC2274A Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLC2274CPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274CPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274I TLC2274IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274I TLC2274IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274I TLC2274IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274I TLC2274IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC2274IPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y2274 TLC2274IPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y2274 TLC2274IPWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI TLC2274IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y2274 TLC2274IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Y2274 TLC2274MD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274MDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274MDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274MDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC2274MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629318201M2A TLC2274 MFKB TLC2274MJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 TLC2274MJ Addendum-Page 8 P2274 0 to 70 P2274 TLC2274IN -55 to 125 TLC2274M PJ2274M -55 to 125 TLC2274M PJ2274M Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLC2274MJB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9318201MC A TLC2274MJB TLC2274MN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 TLC2274MN TLC2274MWB ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9318201QD A TLC2274MWB TLC2274QD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLC2274 TLC2274QDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Call TI Call TI 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Call TI Call TI TLC2274QDR OBSOLETE SOIC D 14 TLC2274QDRG4 ACTIVE SOIC D 14 TLC2274Y PREVIEW DIESALE Y 0 TLC2274 -40 to 125 TLC2274 TLC2274 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 9 Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2015 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLC2272, TLC2272A, TLC2272AM, TLC2272M, TLC2274, TLC2274A, TLC2274AM, TLC2274M : • Catalog: TLC2272A, TLC2272, TLC2274A, TLC2274 • Automotive: TLC2272-Q1, TLC2272A-Q1, TLC2272A-Q1, TLC2272-Q1, TLC2274-Q1, TLC2274A-Q1, TLC2274A-Q1, TLC2274-Q1 • Enhanced Product: TLC2272A-EP, TLC2272A-EP, TLC2274-EP, TLC2274A-EP, TLC2274A-EP, TLC2274-EP • Military: TLC2272M, TLC2272AM, TLC2274M, TLC2274AM NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications Addendum-Page 10