PACKAGE MATERIALS INFORMATION www.ti.com 17-Feb-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device 5962-9555201NXDR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC2272ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC2272ACPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC2272AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC2272AMDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC2272AMDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC2272CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC2272CPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC2272IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC2272IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC2272MDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC2274ACDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC2274ACPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLC2274AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC2274AIPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLC2274AQDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC2274CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC2274CNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Feb-2016 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLC2274CPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLC2274IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC2274IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLC2274MDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC2274MDRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC2274QDRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 5962-9555201NXDR SOIC D 8 2500 367.0 367.0 38.0 TLC2272ACDR SOIC D 8 2500 340.5 338.1 20.6 TLC2272ACPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC2272AIDR SOIC D 8 2500 340.5 338.1 20.6 TLC2272AMDR SOIC D 8 2500 367.0 367.0 38.0 TLC2272AMDRG4 SOIC D 8 2500 367.0 367.0 38.0 TLC2272CDR SOIC D 8 2500 340.5 338.1 20.6 TLC2272CPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC2272IDR SOIC D 8 2500 340.5 338.1 20.6 TLC2272IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC2272MDR SOIC D 8 2500 367.0 367.0 38.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-Feb-2016 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC2274ACDR SOIC D 14 2500 333.2 345.9 28.6 TLC2274ACPWR TSSOP PW 14 2000 367.0 367.0 35.0 TLC2274AIDR SOIC D 14 2500 333.2 345.9 28.6 TLC2274AIPWR TSSOP PW 14 2000 367.0 367.0 35.0 TLC2274AQDR SOIC D 14 2500 367.0 367.0 38.0 TLC2274CDR SOIC D 14 2500 333.2 345.9 28.6 TLC2274CNSR SO NS 14 2000 367.0 367.0 38.0 TLC2274CPWR TSSOP PW 14 2000 367.0 367.0 35.0 TLC2274IDR SOIC D 14 2500 333.2 345.9 28.6 TLC2274IPWR TSSOP PW 14 2000 367.0 367.0 35.0 TLC2274MDR SOIC D 14 2500 367.0 367.0 38.0 TLC2274MDRG4 SOIC D 14 2500 367.0 367.0 38.0 TLC2274QDRG4 SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 3